An integrated circuit (IC) package includes a partial leadframe including (a) a shunt resistor leadframe element including a pair of shunt resistor contacts and a shunt resistor conductively connected between the pair of shunt resistor contacts and (b) at least one external contact leadframe element separate from the shunt resistor leadframe element, the at least one external contact leadframe element allowing external contact to the IC package. The IC package also a mold encapsulation formed over the shunt resistor leadframe element, wherein the pair of shunt resistor contacts are externally contactable through the mold encapsulation.
G01R 1/20 - Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
G01R 1/04 - Housings; Supporting members; Arrangements of terminals
G01R 1/30 - Structural combination of electric measuring instruments with basic electronic circuits, e.g. with amplifier
A device comprising: a repository for an item, the repository having an item intake; a sensor that generates a signal corresponding to characteristics of an item in the repository; an artificial intelligence circuit that receives from the sensor the signal corresponding to characteristics of an item in the repository and that transmits an indicator signal indicative of the item in the repository; and an indicator that receives from the artificial intelligence circuit the indicator signal and that indicates the item in the repository based on the indicator signal.
An apparatus comprises a data width converter and a forward error correction (FEC) decoder. The data width converter includes an input to receive an input data stream having an input bit width, a first output to produce a first output data stream having a first output bit width, and a second output to produce a second output data stream having at least a second output bit width. The FEC decoder includes an input to receive the second output data stream having the at least second output bit width. The FEC decoder includes an error correction output to produce one or more error correction values at least partially based on one or more FEC code words in the second output data stream. The one or more error correction values are for correction of one or more symbols, one or more partial symbols, or both, in the first output data stream having the first output bit width. In one or more examples, the data width converter is in a receive data path, and at least a portion of the FEC decoder is in parallel with the receive data path.
H03M 13/11 - Error detection or forward error correction by redundancy in data representation, i.e. code words containing more digits than the source words using block codes, i.e. a predetermined number of check bits joined to a predetermined number of information bits using multiple parity bits
H03M 13/00 - Coding, decoding or code conversion, for error detection or error correction; Coding theory basic assumptions; Coding bounds; Error probability evaluation methods; Channel models; Simulation or testing of codes
5.
APPARATUS AND METHOD FOR PROCESSING TRANSMIT DATA IN A TRANSMIT DATA PATH INCLUDING PARALLEL FEC ENCODING
An apparatus comprises a data width converter and a forward error correction (FEC) encoder. The data width converter includes an input to receive an input data stream at an input bit width, a first output to produce a first output data stream at a first output bit width, and a second output to produce a second output data stream at a second output bit width. The FEC encoder includes an input to receive the second output data stream at the second output bit width. The FEC encoder includes an output to produce parity bits at least partially based on multiple received symbols of the second output data stream having the second output bit width. The parity7 bits for insertion in the first output data stream having the first output bit width. In one or more examples, the data width converter is in a transmit data path, and the FEC encoder is in parallel with the transmit data path.
An apparatus comprises a data width converter and a forward error correction (FEC) decoder. The data width converter includes an input to receive an input data stream having an input bit width, a first output to produce a first output data stream having a first output bit width, and a second output to produce a second output data stream having at least a second output bit width. The FEC decoder includes an input to receive the second output data stream having the at least second output bit width. The FEC decoder includes an error correction output to produce one or more error correction values at least partially based on one or more FEC code words in the second output data stream. The one or more error correction values are for correction of one or more symbols, one or more partial symbols, or both, in the first output data stream having the first output bit width. In one or more examples, the data width converter is in a receive data path, and at least a portion of the FEC decoder is in parallel with the receive data path.
A device comprising: a repository for an item, the repository having an item intake; a sensor that generates a signal corresponding to characteristics of an item in the repository; an artificial intelligence circuit that receives from the sensor the signal corresponding to characteristics of an item in the repository and that transmits an indicator signal indicative of the item in the repository; and an indicator that receives from the artificial intelligence circuit the indicator signal and that indicates the item in the repository based on the indicator signal.
An apparatus comprising: a pin to connect to a resistor and a power source; a measurement circuit to measure a voltage at the pin; a circuit to determine a mapped identification value of the apparatus based upon the voltage at the pin, the mapped identification value coding the apparatus as an instance of a product from a set of products; and an authentication circuit. The authentication circuit: calculates an authentication code using the mapped identification value; and provides the authentication code to an authentication host upon request from the authentication host.
H04L 9/32 - Arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system
9.
APPARATUS AND METHOD FOR PROCESSING TRANSMIT DATA IN A TRANSMIT DATA PATH INCLUDING PARALLEL FEC ENCODING
An apparatus comprises a data width converter and a forward error correction (FEC) encoder. The data width converter includes an input to receive an input data stream at an input bit width, a first output to produce a first output data stream at a first output bit width, and a second output to produce a second output data stream at a second output bit width. The FEC encoder includes an input to receive the second output data stream at the second output bit width. The FEC encoder includes an output to produce parity bits at least partially based on multiple received symbols of the second output data stream having the second output bit width. The parity bits for insertion in the first output data stream having the first output bit width. In one or more examples, the data width converter is in a transmit data path, and the FEC encoder is in parallel with the transmit data path.
H03M 13/29 - Coding, decoding or code conversion, for error detection or error correction; Coding theory basic assumptions; Coding bounds; Error probability evaluation methods; Channel models; Simulation or testing of codes combining two or more codes or code structures, e.g. product codes, generalised product codes, concatenated codes, inner and outer codes
H03M 13/00 - Coding, decoding or code conversion, for error detection or error correction; Coding theory basic assumptions; Coding bounds; Error probability evaluation methods; Channel models; Simulation or testing of codes
An apparatus comprising: a pin to connect to a resistor and a power source; a measurement circuit to measure a voltage at the pin; a circuit to determine a mapped identification value of the apparatus based upon the voltage at the pin, the mapped identification value coding the apparatus as an instance of a product from a set of products; and an authentication circuit. The authentication circuit: calculates an authentication code using the mapped identification value; and provides the authentication code to an authentication host upon request from the authentication host.
G06F 21/73 - Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information by creating or determining hardware identification, e.g. serial numbers
11.
SELECTIVELY ENCODING OR DECODING PIXELS OF AN IMAGE VIA RUN-LENGTH ENCODING OR DECODING OR GRADIENT ENCODING OR DECODING
One or more examples relate to selectively line-based encoding pixels of an image via run-length encoding or gradient encoding. A method includes, for at least a portion of an image, determining a highest number of: a number of pixels in a run compressible via run-length encoding, and a number of pixels in a run compressible via gradient encoding; and selectively encoding at least some pixels of an image via the one of run-length encoding or gradient encoding corresponding to the determined highest number.
H04N 19/146 - Data rate or code amount at the encoder output
H04N 19/182 - Methods or arrangements for coding, decoding, compressing or decompressing digital video signals using adaptive coding characterised by the coding unit, i.e. the structural portion or semantic portion of the video signal being the object or the subject of the adaptive coding the unit being a pixel
H04N 19/593 - Methods or arrangements for coding, decoding, compressing or decompressing digital video signals using predictive coding involving spatial prediction techniques
A method may include setting a data pattern status signal to indicate a data pattern status of a data pattern to be received by a data-dependent power consumer; and modulating power consumption from a power source that provides the data-dependent power consumer at least partially based on the set data pattern status signal.
H04L 7/04 - Speed or phase control by synchronisation signals
H04L 7/033 - Speed or phase control by the received code signals, the signals containing no special synchronisation information using the transitions of the received signal to control the phase of the synchronising-signal- generating means, e.g. using a phase-locked loop
H04L 25/49 - Transmitting circuits; Receiving circuits using three or more amplitude levels
13.
MODULATING POWER CONSUMPTION FROM A POWER SOURCE THAT SUPPLIES A DATA-DEPENDENT POWER CONSUMER
A method may include setting a data pattern status signal to indicate a data pattern status of a data pattern to be received by a data-dependent power consumer; and modulating power consumption from a power source that provides the data-dependent power consumer at least partially based on the set data pattern status signal.
Common view time transfer and related apparatuses and methods are disclosed. An apparatus includes a receiver oscillator to provide a local clock signal and one or more processors. The one or more processors are to perform, at least partially based on the local clock signal, event time tagging pre-processing at least partially responsive to satellite signals received from one or more satellites to generate a decimated precision correction state estimate; determine, per satellite signal pseudo range residuals; determine a navigation engine clock state; perform a precision clock state pre-processing operation at least partially responsive to the navigation engine clock state and the decimated precision correction state estimate to generate a precision navigation clock state; and generate a common view real time report at least partially responsive to the per satellite signal pseudo range residuals and the precision navigation clock state.
G01S 19/25 - Acquisition or tracking of signals transmitted by the system involving aiding data received from a cooperating element, e.g. assisted GPS
G01S 19/23 - Testing, monitoring, correcting or calibrating of a receiver element
G01S 19/39 - Determining a navigation solution using signals transmitted by a satellite radio beacon positioning system the satellite radio beacon positioning system transmitting time-stamped messages, e.g. GPS [Global Positioning System], GLONASS [Global Orbiting Navigation Satellite System] or GALILEO
An integrated resistor includes a resistor tub, a resistive element, and a dielectric liner. The resistor tub is formed from a conformal metal, and includes a laterally-extending tub base and vertically-extending tub sidewalls extending upwardly from the laterally-extending tub base, wherein the laterally-extending tub base and vertically-extending tub sidewalls define in a resistor tub interior opening. The dielectric liner is formed in the resistor tub interior opening. The resistive element is formed over the dielectric liner in the resistor tub interior opening, and includes a pair of resistor heads connected by a laterally-extending resistor body. The dielectric liner electrically insulates the resistive element from the resistor tub.
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
H10N 97/00 - Electric solid-state thin-film or thick-film devices, not otherwise provided for
16.
DETERMINING A LOCKED STATUS OF A CLOCK TRACKING CIRCUIT
An example apparatus includes a phase detector, a digital discriminator, and a logic circuit. A status signal of the phase detector is at least partially based on a phase relationship between a reference clock and a feedback clock, the feedback clock generated by a clock tracking circuit to track the reference clock. The digital discriminator may sample the status signal of the phase detector. The logic circuit may determine a locked status of the clock tracking circuit at least partially based on samples of the status signal of the phase detector.
H03L 7/087 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using at least two phase detectors or a frequency and phase detector in the loop
H03L 7/091 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal the phase or frequency detector using a sampling device
H03L 7/095 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using a lock detector
H03L 7/089 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal the phase or frequency detector generating up-down pulses
A method of forming a partially silicided element is provided. A silicided structure including a silicide layer on a base structure is formed. A dielectric region is formed over the silicided structure. The dielectric region is etched to form a contact opening exposing a first area of the silicide layer and a tub opening exposing a second area of the silicide layer. A conformal metal is deposited to (a) fill the contact opening to define a contact and (b) form a cup-shaped metal structure in the tub opening. Another etch is performed to remove the cup-shaped metal structure in the tub opening, to remove the underlying silicide layer second area and to expose an underlying area of the base structure, wherein the silicide layer first area remains intact. The base structure with the intact silicide layer first area and removed silicide layer second area defines the partially silicided element.
An example apparatus includes a phase detector and a phase error detector. The phase detector may set a status signal to indicate status of phase difference between a reference clock and a feedback clock, the feedback clock generated by a clock tracking circuit to track the reference clock. The phase error detector may set an error signal to be proportional to a phase difference between the reference clock and the feedback clock. At least partially responsive to the status signal, the phase error detector to change from triggered only by edges of the reference clock and feedback clock having a first polarity to triggered by edges of the reference clock and feedback clock having the first polarity and by edges of the reference clock and feedback clock having a second polarity, the second polarity different than the first polarity.
H03L 7/087 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using at least two phase detectors or a frequency and phase detector in the loop
H03L 7/091 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal the phase or frequency detector using a sampling device
H03L 7/095 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using a lock detector
H03L 7/089 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal the phase or frequency detector generating up-down pulses
A system for network data transactions, the system including an ingress port to receive data frames and timestamp received data frames, a frame analyzer to forward the data frames to a processor, the processor to extract timing information from the data frames and update the data frames based on updated timing calculations and output updated data frames via one or more egress ports. Data frames are timestamped at ingress and egress ports, and egress timestamps are saved in a timestamp memory. The system reduces overall network delays by using dedicated hardware and stored timestamp information.
A device for control of network traffic may include a plurality of edge interface circuit and internal interface circuits each coupled to one or more network components. The device may prepend frame identification information to received data frames and remove duplicate data frames when identification information is detected multiple times. The device may store frame identification information in a non-transitory memory device and perform a lookup operation to identify duplicate data frames and eliminate loops in the network.
A device includes a PWM circuit to generate a complementary PWM signal comprised of a positive polarity PWM signal and a negative polarity PWM signal. The positive polarity signal may drive a high-side switch. A trigger multiplexer may take as input the negative polarity PWM signal and may force an output based on a predetermined condition, the predetermined condition including but not limited to the maximum on-time of a low-side switch. The output of the trigger multiplexer may drive a low-side switch. The high-side switch and the low-side switch may drive a load.
H03K 17/693 - Switching arrangements with several input- or output-terminals, e.g. multiplexers, distributors
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
A device for control of network traffic may include a plurality of edge interface circuit and internal interface circuits each coupled to one or more network components. The device may prepend frame identification information to received data frames and remove duplicate data frames when identification information is detected multiple times. The device may store frame identification information in a non-transitory memory device and perform a lookup operation to identify duplicate data frames and eliminate loops in the network.
Teachings of the present disclosure include systems and/or methods for encoding digital data into a handwritten sample. An example method includes: accessing a predetermined vibration pattern stored in a memory corresponding to defined data; and vibrating a stylus based on the predetermined vibration pattern during creation of the handwritten sample to encode the defined data into the handwriting sample.
G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
G06F 3/0354 - Pointing devices displaced or positioned by the user; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
G06V 40/30 - Writer recognition; Reading and verifying signatures
H04L 9/32 - Arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system
A device includes a PWM circuit to generate a complementary PWM signal comprised of a positive polarity PWM signal and a negative polarity PWM signal. The positive polarity signal may drive a high-side switch. A trigger multiplexer may take as input the negative polarity PWM signal and may force an output based on a predetermined condition, the predetermined condition including but not limited to the maximum on-time of a low-side switch. The output of the trigger multiplexer may drive a low-side switch. The high-side switch and the low-side switch may drive a load.
H03K 17/0812 - Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the control circuit
H03K 17/082 - Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
A system for network data transactions, the system including an ingress port to receive data frames and timestamp received data frames, a frame analyzer to forward the data frames to a processor, the processor to extract timing information from the data frames and update the data frames based on updated timing calculations and output updated data frames via one or more egress ports. Data frames are timestamped at ingress and egress ports, and egress timestamps are saved in a timestamp memory. The system reduces overall network delays by using dedicated hardware and stored timestamp information.
An integrated resistor includes a resistor tub, a resistive element, and a dielectric liner. The resistor tub is formed from a conformal metal, and includes a laterally-extending tub base and vertically-extending tub sidewalls extending upwardly from the laterally-extending tub base, wherein the laterally-extending tub base and vertically-extending tub sidewalls define in a resistor tub interior opening. The dielectric liner is formed in the resistor tub interior opening. The resistive element is formed over the dielectric liner in the resistor tub interior opening, and includes a pair of resistor heads connected by a laterally-extending resistor body. The dielectric liner electrically insulates the resistive element from the resistor tub.
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/528 - Layout of the interconnection structure
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
A method of forming a partially silicided element is provided. A silicided structure including a silicide layer on a base structure is formed. A dielectric region is formed over the silicided structure. The dielectric region is etched to form a contact opening exposing a first area of the silicide layer and a tub opening exposing a second area of the silicide layer. A conformal metal is deposited to (a) fill the contact opening to define a contact and (b) form a cup-shaped metal structure in the tub opening. Another etch is performed to remove the cup-shaped metal structure in the tub opening, to remove the underlying silicide layer second area and to expose an underlying area of the base structure, wherein the silicide layer first area remains intact. The base structure with the intact silicide layer first area and removed silicide layer second area defines the partially silicided element.
Teachings of the present disclosure include systems and/or methods for encoding digital data into a handwritten sample. An example method includes: accessing a predetermined vibration pattern stored in a memory corresponding to defined data; and vibrating a stylus based on the predetermined vibration pattern during creation of the handwritten sample to encode the defined data into the handwriting sample.
G06V 30/224 - Character recognition characterised by the type of writing of printed characters having additional code marks or containing code marks
B43K 29/08 - Combinations of writing implements with other articles with measuring, computing or indicating devices
G06F 3/0346 - Pointing devices displaced or positioned by the user; Accessories therefor with detection of the device orientation or free movement in a 3D space, e.g. 3D mice, 6-DOF [six degrees of freedom] pointers using gyroscopes, accelerometers or tilt-sensors
G06F 3/0354 - Pointing devices displaced or positioned by the user; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
G06F 3/038 - Control and interface arrangements therefor, e.g. drivers or device-embedded control circuitry
29.
DETERMINING A LOCKED STATUS OF A CLOCK TRACKING CIRCUIT
An example apparatus includes a phase detector, a digital discriminator, and a logic circuit. A status signal of the phase detector is at least partially based on a phase relationship between a reference clock and a feedback clock, the feedback clock generated by a clock tracking circuit to track the reference clock. The digital discriminator may sample the status signal of the phase detector. The logic circuit may determine a locked status of the clock tracking circuit at least partially based on samples of the status signal of the phase detector.
H03L 7/091 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal the phase or frequency detector using a sampling device
H03L 7/093 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using special filtering or amplification characteristics in the loop
H03L 7/095 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using a lock detector
30.
SINGLE AND DUAL EDGE TRIGGERED PHASE ERROR DETECTION
An example apparatus includes a phase detector and a phase error detector. The phase detector may set a status signal to indicate status of phase difference between a reference clock and a feedback clock, the feedback clock generated by a clock tracking circuit to track the reference clock. The phase error detector may set an error signal to be proportional to a phase difference between the reference clock and the feedback clock. At least partially responsive to the status signal, the phase error detector to change from triggered only by edges of the reference clock and feedback clock having a first polarity to triggered by edges of the reference clock and feedback clock having the first polarity and by edges of the reference clock and feedback clock having a second polarity, the second polarity different than the first polarity.
H03L 7/087 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using at least two phase detectors or a frequency and phase detector in the loop
H03L 7/091 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal the phase or frequency detector using a sampling device
31.
DEVICE AND METHODS FOR DIGITAL SWITCHED CAPACITOR DC-DC CONVERTERS
A switched-capacitor DC-DC converter circuit may convert an input voltage into a desired output voltage level. A comparator may compare a desired voltage level to a divided version of the output voltage. A fully digital control circuit comprising a frequency divider circuit, a counter circuit, a digital control logic circuit and a gain selection circuit may generate a gain value, and a phase generator may convert the gain value into clock phase signals and control settings to control a switch array to select capacitors to produce a desired output voltage.
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
32.
DEVICE AND METHODS FOR DIGITAL SWITCHED CAPACITOR DC-DC CONVERTERS
A switched-capacitor DC-DC converter circuit may convert an input voltage into a desired output voltage level. A comparator may compare a desired voltage level to a divided version of the output voltage. A fully digital control circuit comprising a frequency divider circuit, a counter circuit, a digital control logic circuit and a gain selection circuit may generate a gain value, and a phase generator may convert the gain value into clock phase signals and control settings to control a switch array to select capacitors to produce a desired output voltage.
H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
H02M 3/157 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
33.
SETTING A PERFORMANCE MODE OF AN RF RECEIVER FRONTEND
Examples relate to setting a performance mode of an RF receiver front end. An example method includes determining a power state of an input signal to an RF receiver front end; and setting a performance mode of the RF receiver front end to one of at least three distinct performance modes offered by the RF receiver front end at least partially responsive to the determined power state of the input signal.
Annular knob-on-display (KoD) devices and related apparatuses. An apparatus includes a frame having substantially annular shape, a dome switch, a plurality of actuator members, and a plurality of pivot members. Respective pivot members of the plurality of pivot members secures an actuator member of the plurality of actuator members to the frame and transfers force applied to the actuator member to the dome switch.
An example relates to a method that includes capacitively determining a quantity of particulate present in an internal chamber of a housing structure while the housing structure receives a feed air stream to the internal chamber; and providing a value representing the measured quantity of particulate.
G01F 23/263 - Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields by measuring variations in capacitance of capacitors
G01F 1/74 - Devices for measuring flow of a fluid or flow of a fluent solid material in suspension in another fluid
G01F 22/00 - Methods or apparatus for measuring volume of fluids or fluent solid material, not otherwise provided for
G01N 15/06 - Investigating concentration of particle suspensions
A47L 9/28 - Installation of the electric equipment, e.g. adaptation or attachment to the suction cleaner; Controlling suction cleaners by electric means
36.
SYMBOL FILTERING AT A PHY-SIDE of PHY-MAC INTERFACE
Disclosed examples include a method. The method includes: conveying symbols from a PHY toward a MAC via a PHY-side of PHY-MAC interface; and filtering one or more symbols at an input of a PHY-side of an interface wrapper of the PHY-side of the PHY-MAC interface. Disclosed examples include an apparatus. The apparatus includes: a PHY-side of PHY-MAC interface; and a logic circuit provided at the PHY-side of PHY-MAC interface, the logic circuit comprising a symbol filter to filter one or more symbols conveyed via the PHY-side of PHY-MAC interface.
A method includes: observing that a digitally controlled oscillator (DCO) frequency is at a boundary of a DCO frequency overlap region; and bypassing at least a portion of the DCO frequency overlap region.
H03L 7/099 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the controlled oscillator of the loop
H03L 7/10 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop for assuring initial synchronisation or for broadening the capture range
38.
REDUCE DCO FREQUENCY OVERLAP-INDUCED LIMIT CYCLE IN HYBRID AND DIGITAL PLLS
A method includes: observing that a digitally controlled oscillator (DCO) frequency is at a boundary of a DCO frequency overlap region; and bypassing at least a portion of the DCO frequency overlap region.
H03L 7/093 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using special filtering or amplification characteristics in the loop
39.
SYSTEM FOR TRANSMITTING OBJECT RELATED DATA FROM A BASE UNIT TO A MOBILE UNIT THROUGH A PERSON'S BODY
A system includes a base unit associated with an object, and a mobile unit carriable by a person. The base unit includes a base unit capacitive coupling element providing a base unit-human capacitive coupling between the base unit and the person, and the mobile unit includes a mobile unit capacitive coupling element providing a mobile unit-human capacitive coupling between the mobile unit and the person. The base unit-human capacitive coupling and mobile unit-human capacitive coupling enable a data transmission connection between the base unit and mobile unit that passes through the person's body. Base unit transmitter circuitry of the base unit transmits object related data via the data transmission connection passing through the person's body, mobile unit receiver circuitry of the mobile unit receives the object related data, and an output device of the mobile unit outputs human-perceptible signals based on the received object related data.
G06F 3/0362 - Pointing devices displaced or positioned by the user; Accessories therefor with detection of 1D translations or rotations of an operating part of the device, e.g. scroll wheels, sliders, knobs, rollers or belts
Disclosed examples include a method. The method includes: conveying symbols from a PHY toward a MAC via a PHY-side of PHY-MAC interface; and filtering one or more symbols at an input of a PHY-side of an interface wrapper of the PHY-side of the PHY-MAC interface. Disclosed examples include an apparatus. The apparatus includes: a PHY-side of PHY-MAC interface; and a logic circuit provided at the PHY-side of PHY-MAC interface, the logic circuit comprising a symbol filter to filter one or more symbols conveyed via the PHY-side of PHY-MAC interface.
G06F 13/36 - Handling requests for interconnection or transfer for access to common bus or bus system
G06F 13/376 - Handling requests for interconnection or transfer for access to common bus or bus system with decentralised access control using a contention resolving method, e.g. collision detection, collision avoidance
A system includes a base unit associated with an object, and a mobile unit carriable by a person. The base unit includes a base unit capacitive coupling element providing a base unit-human capacitive coupling between the base unit and the person, and the mobile unit includes a mobile unit capacitive coupling element providing a mobile unit-human capacitive coupling between the mobile unit and the person. The base unit-human capacitive coupling and mobile unit-human capacitive coupling enable a data transmission connection between the base unit and mobile unit that passes through the person's body. Base unit transmitter circuitry of the base unit transmits object related data via the data transmission connection passing through the person's body, mobile unit receiver circuitry of the mobile unit receives the object related data, and an output device of the mobile unit outputs human-perceptible signals based on the received object related data.
A peripheral device for matrix multiplication including a weight memory, an input memory, a multiplier, an accumulator, an output memory and a sequencer to generate signals to drive the input memory and the output memory and to generate an interrupt signal. The weight memory may be loaded with weights and biases for a matrix multiplication operation, and the multiplier and accumulator may implement the multiply and accumulator operations for a matrix multiplication operation. Data may be swapped between the input memory and output memory to reduce the memory required for matrix multiplication operations.
G06F 13/28 - Handling requests for interconnection or transfer for access to input/output bus using burst mode transfer, e.g. direct memory access, cycle steal
A peripheral device for matrix multiplication including a weight memory, an input memory, a multiplier, an accumulator, an output memory and a sequencer to generate signals to drive the input memory and the output memory and to generate an interrupt signal. The weight memory may be loaded with weights and biases for a matrix multiplication operation, and the multiplier and accumulator may implement the multiply and accumulator operations for a matrix multiplication operation. Data may be swapped between the input memory and output memory to reduce the memory required for matrix multiplication operations.
G06F 7/544 - Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using unspecified devices for evaluating functions by calculation
An apparatus includes a power-over-Ethernet (POE) interface to be connected to a powered device (PD) over an Ethernet cable and a control circuit. The control circuit is to measure a voltage provided by the apparatus through the Ethernet cable, determine that the voltage has dropped by at least a given voltage change, based on a determination that the voltage has dropped by at least the given voltage change, determine whether or not a predetermined quantity of Maintain Power Signature (MPS) signals have been missed within a given time frame, and, based on a determination that the predetermined quantity of MPS signals has not been missed within the given time frame, determine that the PD is still connected to the apparatus.
An apparatus and method for determining electrical characteristics has an acquisition circuit and a control circuit. The control circuit causes a first modulation circuit to issue a first set of modulated signals to a first source of alternating current energy, wherein the first set of modulated signals has a first deadtime and wherein a high side switch and a low side switch of the first modulation circuit are turned off. The control circuit further causes the acquisition circuit to acquire a first electrical characteristic of the first source of alternating current energy from the first source of alternating current energy during the first deadtime.
H02P 6/182 - Circuit arrangements for detecting position without separate position detecting elements using back-emf in windings
H02P 6/10 - Arrangements for controlling torque ripple, e.g. providing reduced torque ripple
H02P 27/08 - Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using dc to ac converters or inverters with pulse width modulation
An apparatus includes a power-over-Ethernet (POE) interface to be connected to a powered device (PD) over an Ethernet cable and a control circuit. The control circuit is to measure a voltage provided by the apparatus through the Ethernet cable, determine that the voltage has dropped by at least a given voltage change, based on a determination that the voltage has dropped by at least the given voltage change, determine whether or not a predetermined quantity of Maintain Power Signature (MPS) signals have been missed within a given time frame, and, based on a determination that the predetermined quantity of MPS signals has not been missed within the given time frame, determine that the PD is still connected to the apparatus.
An apparatus and method for determining electrical characteristics has an acquisition circuit and a control circuit. The control circuit causes a first modulation circuit to issue a first set of modulated signals to a first source of alternating current energy, wherein the first set of modulated signals has a first deadtime and wherein a high side switch and a low side switch of the first modulation circuit are turned off. The control circuit further causes the acquisition circuit to acquire a first electrical characteristic of the first source of alternating current energy from the first source of alternating current energy during the first deadtime.
An apparatus may include a physical layer device, a detection circuitry and a power control circuitry. the physical layer device provides one or more functions of a physical layer to interface with a shared physical transmission medium. The detection circuitry detects an indication of power control signaling on the shared physical transmission medium, and detects an indication of Ethernet signaling on the shared physical transmission medium. The indication of power control signaling is different than the indication of Ethernet signaling. The power control circuitry manages a power state of the apparatus at least partially responsive to an output of the detection circuitry.
Motion detection apparatuses are disclosed. The motion detection may be performed using one or more of a sub-window of a predetermined time window, a predetermined threshold value that is settable responsive to changes in one or more environmental factors, or a detection trigger. An apparatus includes a processor and an analog-to-digital converter (ADC) circuitry to sample a reflected predetermined pattern signal to generate reflected predetermined pattern samples. The processor captures collections of the reflected predetermined pattern samples corresponding to a predetermined time window and determines a sum of the collections or sub-collections. The processor determines an average of magnitudes of the determined sum and determines that a moving object is detected responsive to a predetermined threshold value.
A device including an input to receive a clock signal, a ramp start program register, a ramp start active register, a ramp stop program register, a ramp stop active register, a ramp slope program register, a ramp slope active register, an update controller, the update controller to update, based on a programmable condition, respectively, the ramp start active register contents, the ramp stop active register contents and the ramp slope active register contents, and a ramp controller to generate a ramp signal, the ramp signal to begin at the value reflective of the ramp start active register contents, the ramp signal to change value at each cycle of the clock signal based on the value reflective of the ramp slope active register contents, and the ramp signal to stop at the value reflective of the ramp stop active register contents.
A device (104) including an input (210) to receive a clock signal (285), a ramp start program register (220), a ramp start active register (260), a ramp stop program register (221), a ramp stop active register (261), a ramp slope program register (222), a ramp slope active register (262), an update controller (240), the update controller to update, based on a programmable condition, respectively, the ramp start active register contents, the ramp stop active register contents and the ramp slope active register contents, and a ramp controller (280) to generate a ramp signal (290), the ramp signal to begin at the value reflective of the ramp start active register contents, the ramp signal to change value at each cycle of the clock signal based on the value reflective of the ramp slope active register contents, and the ramp signal to stop at the value reflective of the ramp stop active register contents.
One or more examples relate to a method. The method may include: comparing a first value and a second value, the first value representing a duty cycle of a reference clock and the second value representing a duty cycle of an output clock generated by a clock tracking circuit to track the reference clock; setting a duty cycle of a changed clock to reduce duty cycle mismatch between the reference clock and the output clock indicated by the comparing; and providing the changed clock having set duty cycle in lieu of the one of the reference clock or the output clock.
H03L 7/081 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop provided with an additional controlled phase shifter
H03K 5/156 - Arrangements in which a continuous pulse train is transformed into a train having a desired pattern
An inductor-inductor-capacitor (LLC) power converter includes a current input interface to receive a current input indication. The current input indication includes a voltage to represent a current passing through of a primary side of the LLC power converter. The LLC power converter includes voltage input interface to receive a voltage input. The voltage input is to include a representative voltage to be provided from a secondary side of the LLC power converter. The LLC power converter includes a control circuit to generate pulsed-width modulation (PWM) control signals for the LLC power converter. The control circuit is to match an on-time period of a first leg and a second leg of the LLC power converter and based upon the current input indication and the voltage input.
H02M 1/088 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the simultaneous control of series or parallel connected semiconductor devices
H02M 3/00 - Conversion of dc power input into dc power output
H02M 3/335 - Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
55.
TRIGGERING AN ERROR DETECTOR ON RISING AND FALLING EDGES OF CLOCK SIGNALS, AND GENERATING AN ERROR SIGNAL THEREFROM
One or more examples relate to triggering a single error detector on rising and falling edges of clock signals, and generating an error signal therefrom. A method may include receiving a first clock signal and a second clock signal. The method may include generating, via a single error detector being triggered at least partially responsive to like respective edges of the first clock signal and the second clock signal, an error signal that represents a phase difference between the first clock signal and the second clock signal.
A multi-capacitor module includes a nested metal-insulator-metal (MIM) structure including a cup-shaped first electrode, a cup-shaped first insulator formed over the cup-shaped first electrode, a cup-shaped second electrode formed over the cup-shaped first insulator, a cup-shaped second insulator formed over the cup-shaped second electrode, and a third electrode formed over the cup-shaped second insulator. The cup-shaped first electrode, the cup-shaped second electrode, and the cup-shaped first insulator define a first capacitor, and the cup-shaped second electrode, the third electrode, and the cup-shaped second insulator define a second capacitor physically nested in the first capacitor.
H10N 97/00 - Electric solid-state thin-film or thick-film devices, not otherwise provided for
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
57.
REDUCING DUTY CYCLE MISMATCH OF CLOCKS FOR CLOCK TRACKING CIRCUITS
One or more examples relate to a method. The method may include: comparing a first value and a second value, the first value representing a duty cycle of a reference clock and the second value representing a duty cycle of an output clock generated by a clock tracking circuit to track the reference clock; setting a duty cycle of a changed clock to reduce duty cycle mismatch between the reference clock and the output clock indicated by the comparing; and providing the changed clock having set duty cycle in lieu of the one of the reference clock or the output clock.
H03L 7/081 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop provided with an additional controlled phase shifter
H03K 5/156 - Arrangements in which a continuous pulse train is transformed into a train having a desired pattern
58.
TIMESTAMP AT A PARALLEL INTERFACE OF A SERDES COUPLING A PHY WITH A PHYSICAL TRANSMISSION MEDIUM
One or more examples relate, generally, to timestamp at a parallel interface of a SerDes for coupling a PHY with a physical transmission medium. In an example, an apparatus includes a SerDes to couple a PHY to a physical transmission medium; a hardware timestamp logic; a bit detector coupled to initiate the hardware timestamp logic at least partially responsive to observing an indicated bit at a parallel interface of the SerDes; and a logic circuit provided at a portion of the PHY, the logic circuit coupled to receive timestamps generated by hardware timestamp logic.
One or more examples relate to a method. The method includes: receiving up/down error signals indicative of duty cycle mismatch between a reference clock signal and a changed feedback clock signal that represents an output clock signal generated by a clock tracking circuit to track the reference clock signal; setting a duty cycle of a changed feedback clock signal to reduce duty cycle mismatch indicated by the up/down error signals; and providing the changed feedback clock having set duty cycle.
H03K 5/135 - Arrangements having a single output and transforming input signals into pulses delivered at desired time intervals by the use of time reference signals, e.g. clock signals
60.
TIMESTAMP AT A PARALLEL INTERFACE OF A SERDES COUPLING A PHY WITH A PHYSICAL TRANSMISSION MEDIUM
One or more examples relate, generally, to timestamp at a parallel interface of a SerDes for coupling a PHY with a physical transmission medium. In an example, an apparatus includes a SerDes to couple a PHY to a physical transmission medium; a hardware timestamp logic; a bit detector coupled to initiate the hardware timestamp logic at least partially responsive to observing an indicated bit at a parallel interface of the SerDes; and a logic circuit provided at a portion of the PHY, the logic circuit coupled to receive timestamps generated by hardware timestamp logic.
A multi-capacitor module includes a stacked metal-insulator-metal (MIM) structure including a cup-shaped first electrode, a cup-shaped first insulator formed over the cup-shaped first electrode, a cup-shaped second electrode formed over the cup-shaped first insulator, a cup-shaped second insulator formed over the cup-shaped second electrode, a third electrode formed over the cup-shaped second insulator. The stacked MIM structure also includes a first sidewall spacer located between the cup-shaped first electrode and the cup-shaped second electrode, and a second sidewall spacer located between the cup-shaped second electrode and the third electrode. The cup-shaped first electrode, the cup-shaped second electrode, and the cup-shaped first insulator define a first capacitor, and the cup-shaped second electrode, the third electrode, and the cup-shaped second insulator define a second capacitor.
A multi-capacitor module includes a stacked metal-insulator-metal (MIM) structure including a cup-shaped first electrode, a cup-shaped first insulator formed over the cup-shaped first electrode, a cup-shaped second electrode formed over the cup-shaped first insulator, a cup-shaped second insulator formed over the cup-shaped second electrode, a third electrode formed over the cup-shaped second insulator. The stacked MIM structure also includes a first sidewall spacer located between the cup-shaped first electrode and the cup-shaped second electrode, and a second sidewall spacer located between the cup-shaped second electrode and the third electrode. The cup-shaped first electrode, the cup-shaped second electrode, and the cup-shaped first insulator define a first capacitor, and the cup-shaped second electrode, the third electrode, and the cup-shaped second insulator define a second capacitor.
H10N 97/00 - Electric solid-state thin-film or thick-film devices, not otherwise provided for
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
An inductor-inductor-capacitor (LLC) power converter includes a current input interface to receive a current input indication. The current input indication includes a voltage to represent a current passing through of a primary side of the LLC power converter. The LLC power converter includes voltage input interface to receive a voltage input. The voltage input is to include a representative voltage to be provided from a secondary side of the LLC power converter. The LLC power converter includes a control circuit to generate pulsed-width modulation (PWM) control signals for the LLC power converter. The control circuit is to match an on-time period of a first leg and a second leg of the LLC power converter and based upon the current input indication and the voltage input.
H02M 3/335 - Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
64.
REDUCING DUTY CYCLE MISMATCH OF CLOCK SIGNALS FOR CLOCK TRACKING CIRCUITS
One or more examples relate to a method. The method includes: receiving up/down error signals indicative of duty cycle mismatch between a reference clock signal and a changed feedback clock signal that represents an output clock signal generated by a clock tracking circuit to track the reference clock signal; setting a duty cycle of a changed feedback clock signal to reduce duty cycle mismatch indicated by the up/down error signals; and providing the changed feedback clock having set duty cycle.
H03L 7/081 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop provided with an additional controlled phase shifter
H03K 5/156 - Arrangements in which a continuous pulse train is transformed into a train having a desired pattern
65.
TRIGGERING AN ERROR DETECTOR ON RISING AND FALLING EDGES OF CLOCK SIGNALS, AND GENERATING AN ERROR SIGNAL THEREFROM
One or more examples relate to triggering a single error detector on rising and falling edges of clock signals, and generating an error signal therefrom. A method may include receiving a first clock signal and a second clock signal. The method may include generating, via a single error detector being triggered at least partially responsive to like respective edges of the first clock signal and the second clock signal, an error signal that represents a phase difference between the first clock signal and the second clock signal.
H03L 7/089 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal the phase or frequency detector generating up-down pulses
H03L 7/081 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop provided with an additional controlled phase shifter
Examples relate to generating sync signals. An example apparatus includes an output, an input and a circuit. The output provides a data-valid signal to a video source operative to provide video data to a video-data-processing pipeline. The input receives a delayed data-valid signal from the video-data-processing pipeline. The circuit to generate a delayed horizontal-sync signal and a delayed vertical-sync signal at least partially responsive to the received delayed data-valid signal.
H04N 21/43 - Processing of content or additional data, e.g. demultiplexing additional data from a digital video stream; Elementary client operations, e.g. monitoring of home network or synchronizing decoder's clock; Client middleware
67.
IRREGULAR-SHAPED CAPACITIVE SENSORS AND LOCATIONS OF TOUCH EVENTS AT THE SAME
A method includes: changing a geometry of a capacitive sensor design from a first geometry to a second geometry, the second geometry different than the first geometry; and obtaining executable instructions to transform a location identifier of a touch event from a first location identifier associated with the first geometry to a second location identifier associated with the second geometry.
Vapor cells may include a body including a cavity within the body. A first substrate bonded to a second substrate at an interface within the body, at least one of the first substrate, the second substrate, or an interfacial material between the first and second substrates may define at least one recess or pore in a surface. A smallest dimension of the at least one recess or pore may be about 500 microns or less, as measured in a direction parallel to at least one surface of the first substrate partially defining the cavity.
H03L 7/26 - Automatic control of frequency or phase; Synchronisation using energy levels of molecules, atoms, or subatomic particles as a frequency reference
69.
MULTI-CAPACITOR MODULE INCLUDING A NESTED METAL-INSULATOR-METAL (MIM) STRUCTURE
A multi-capacitor module includes a nested metal-insulator-metal (MIM) structure including a cup-shaped first electrode, a cup-shaped first insulator formed over the cup-shaped first electrode, a cup-shaped second electrode formed over the cup-shaped first insulator, a cup-shaped second insulator formed over the cup-shaped second electrode, and a third electrode formed over the cup-shaped second insulator. The cup-shaped first electrode, the cup-shaped second electrode, and the cup-shaped first insulator define a first capacitor, and the cup-shaped second electrode, the third electrode, and the cup-shaped second insulator define a second capacitor physically nested in the first capacitor.
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
Examples relate to generating sync signals. An example apparatus includes an output, an input and a circuit. The output provides a data-valid signal to a video source operative to provide video data to a video-data-processing pipeline. The input receives a delayed data-valid signal from the video-data-processing pipeline. The circuit to generate a delayed horizontal-sync signal and a delayed vertical-sync signal at least partially responsive to the received delayed data-valid signal.
An article of manufacture includes a medium with instructions that when read and executed by a processor, cause the processor to identify a code stream to be executed by a system-on-a-chip (SoC). The SoC is to include an open standard processor and hardware accelerators implemented in reprogrammable hardware. The processor is to, from the code stream, identify a first portion of the code stream to be executed as software by the open standard processor and a second portion to be executed in the accelerators, compile the first portion into a binary for execution by the open standard processor, and generate a hardware description for the second portion to be implemented by the hardware accelerators. The hardware description and the binary are to exchange data during execution of the code stream.
An article of manufacture includes a medium with instructions that when read and executed by a processor, cause the processor to identify a code stream to be executed by a system-on-a-chip (SoC). The SoC is to include an open standard processor and hardware accelerators implemented in reprogrammable hardware. The processor is to, from the code stream, identify a first portion of the code stream to be executed as software by the open standard processor and a second portion to be executed in the accelerators, compile the first portion into a binary for execution by the open standard processor, and generate a hardware description for the second portion to be implemented by the hardware accelerators. The hardware description and the binary are to exchange data during execution of the code stream.
A system includes a metal tub structure formed in an integrated circuit (IC) structure, a first metal component, and a second metal component. The first metal component is formed from a first metal. The first metal component is formed in an opening defined by the metal tub structure, and includes a first metal first junction element, a first metal second junction element, and a first metal bridge electrically connected to the first metal first junction element and the first metal second junction element. The second metal component is formed from a second metal different than the first metal, and includes a second metal first junction element electrically connected to the first metal first junction element to define a first thermocouple junction, and a second metal second junction element electrically connected to the first metal second junction element to define a second thermocouple junction.
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
H10N 19/00 - Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups
H01L 23/34 - Arrangements for cooling, heating, ventilating or temperature compensation
A metal-insulator-metal (MIM) capacitor includes a bottom electrode, an insulator cup formed on the bottom electrode, a top electrode formed in an opening defined by the insulator cup, a top electrode connection element electrically connected to the top electrode, a vertically-extending bottom electrode contact electrically connected to the bottom electrode, and a bottom electrode connection element electrically connected to the vertically-extending bottom electrode contact. The bottom electrode is formed in a lower metal layer. The insulator cup is formed in a tub opening in a dielectric region and includes a laterally extending insulator cup base formed on the bottom electrode and a vertically-extending insulator cup sidewall extending upwardly from the laterally extending insulator cup base. The top electrode connection element and bottom electrode connection element are formed in an upper metal layer.
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H10N 97/00 - Electric solid-state thin-film or thick-film devices, not otherwise provided for
A metal-insulator-metal (MIM) capacitor includes a bottom electrode, an insulator cup formed on the bottom electrode, a top electrode formed in an opening defined by the insulator cup, a top electrode connection element electrically connected to the top electrode, a vertically-extending bottom electrode contact electrically connected to the bottom electrode, and a bottom electrode connection element electrically connected to the vertically-extending bottom electrode contact. The bottom electrode is formed in a lower metal layer. The insulator cup is formed in a tub opening in a dielectric region and includes a laterally extending insulator cup base formed on the bottom electrode and a vertically-extending insulator cup sidewall extending upwardly from the laterally extending insulator cup base. The top electrode connection element and bottom electrode connection element are formed in an upper metal layer.
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
A device for measuring phase noise, including a sampler to sample an input signal, an input filter to receive an input from the sampler, a noise generator to generate a noise signal, a combiner to receive input from, respectively, the input filter and the noise generator, the combiner to output an integrated noise output measurement. The input filter may operate in either the time domain or the frequency domain. The noise generate may generate a noise signal based on the sampler output, or may generate a noise estimate value based on the sampler output.
A fault event monitor and filter having a digital comparator receiving a digital input value, wherein the digital comparator generates a plurality of outputs based on programmable threshold input values, a first counter coupled to a first output of the plurality of outputs of the digital comparator, a second counter coupled to a second output of the plurality of outputs of the digital comparator, and an output controller with a first input coupled to an output of the first counter and with a second input coupled to an output of the second counter, wherein the output controller to generate a fault event signal based at least partially on signals received from the first and second counters.
A device for measuring phase noise, including a sampler to sample an input signal, an input filter to receive an input from the sampler, a noise generator to generate a noise signal, a combiner to receive input from, respectively, the input filter and the noise generator, the combiner to output an integrated noise output measurement. The input filter may operate in either the time domain or the frequency domain. The noise generate may generate a noise signal based on the sampler output, or may generate a noise estimate value based on the sampler output.
A fault event monitor and filter having a digital comparator receiving a digital input value, wherein the digital comparator generates a plurality of outputs based on programmable threshold input values, a first counter coupled to a first output of the plurality of outputs of the digital comparator, a second counter coupled to a second output of the plurality of outputs of the digital comparator, and an output controller with a first input coupled to an output of the first counter and with a second input coupled to an output of the second counter, wherein the output controller to generate a fault event signal based at least partially on signals received from the first and second counters.
A system includes a metal tub structure formed in an integrated circuit (IC) structure, a first metal component, and a second metal component. The first metal component is formed from a first metal. The first metal component is formed in an opening defined by the metal tub structure, and includes a first metal first junction element, a first metal second junction element, and a first metal bridge electrically connected to the first metal first junction element and the first metal second junction element. The second metal component is formed from a second metal different than the first metal, and includes a second metal first junction element electrically connected to the first metal first junction element to define a first thermocouple junction, and a second metal second junction element electrically connected to the first metal second junction element to define a second thermocouple junction.
G01K 7/06 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials the thermoelectric materials being arranged one within the other with the junction at one end exposed to the object, e.g. sheathed type
G01K 7/02 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using thermoelectric elements, e.g. thermocouples
Examples disclosed herein include a video-data encoder. The video data encoder may encode a 4×4 data block into a bit stream according to a context adaptive variable length coding. The 4×4 data block may be representative of video data. The video-data encoder may, while encoding the 4×4 data block, ignore at least some coefficients of the 4×4 data block. In some examples, the video-data encoder may ignore the at least some coefficients of the 4×4 data block by setting the at least some coefficients of the 4×4 data block to zero prior to encoding the 4×4 data block. Related devices, systems and methods are also disclosed.
H04N 19/13 - Adaptive entropy coding, e.g. adaptive variable length coding [AVLC] or context adaptive binary arithmetic coding [CABAC]
H04N 19/176 - Methods or arrangements for coding, decoding, compressing or decompressing digital video signals using adaptive coding characterised by the coding unit, i.e. the structural portion or semantic portion of the video signal being the object or the subject of the adaptive coding the unit being an image region, e.g. an object the region being a block, e.g. a macroblock
H04N 19/129 - Scanning of coding units, e.g. zig-zag scan of transform coefficients or flexible macroblock ordering [FMO]
H04N 19/60 - Methods or arrangements for coding, decoding, compressing or decompressing digital video signals using transform coding
Examples disclosed herein include a video-data encoder. The video data encoder may encode a 4x4 data block into a bit stream according to a context adaptive variable length coding. The 4x4 data block may be representative of video data. The video-data encoder may, while encoding the 4x4 data block, ignore at least some coefficients of the 4x4 data block. In some examples, the video-data encoder may ignore the at least some coefficients of the 4x4 data block by setting the at least some coefficients of the 4x4 data block to zero prior to encoding the 4x4 data block. Related devices, systems and methods are also disclosed.
H04N 19/132 - Sampling, masking or truncation of coding units, e.g. adaptive resampling, frame skipping, frame interpolation or high-frequency transform coefficient masking
H04N 19/18 - Methods or arrangements for coding, decoding, compressing or decompressing digital video signals using adaptive coding characterised by the coding unit, i.e. the structural portion or semantic portion of the video signal being the object or the subject of the adaptive coding the unit being a set of transform coefficients
H04N 19/91 - Entropy coding, e.g. variable length coding [VLC] or arithmetic coding
Methods of using vapor cells may involve providing a vapor cell including a body defining a cavity within the body. At least a portion of at least one surface of the vapor cell within the cavity may include at least one pore having an average dimension of about 500 microns or less, as measured in a direction parallel to the at least one surface. A vapor pressure of a subject material within the cavity may be controlled utilizing the at least one pore by inducing an exposed surface of a subject material in a liquid state within the at least one pore to have a shape different than a shape the exposed surface of the subject material in a liquid state would have on a flat, nonporous surface.
H03L 7/26 - Automatic control of frequency or phase; Synchronisation using energy levels of molecules, atoms, or subatomic particles as a frequency reference
G04F 5/14 - Apparatus for producing preselected time intervals for use as timing standards using atomic clocks
G05D 16/04 - Control of fluid pressure without auxiliary power
An device having an oscillator circuit modifiable between a first operating mode and a second operating mode, wherein the first operating mode has a first frequency accuracy and a first power consumption, wherein the second operating mode has a second frequency accuracy and a second power consumption, wherein the second frequency accuracy is more accurate than the first frequency accuracy and the second power consumption is higher than the first power consumption, and a control circuit in communication with the oscillator circuit to modify the operating mode of the oscillator circuit.
H03B 5/24 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising resistance and either capacitance or inductance, e.g. phase-shift oscillator active element in amplifier being semiconductor device
Delta-sigma modulation utilizing continuous-time input and discrete-time loop filter. An apparatus includes an input circuit, a switched-capacitor, an integrator, a quantizer and a feedback loop. The input circuit receives an analog signal and produce an analog input signal, the input circuit comprising a resistor-capacitor (RC) integrator. The switched-capacitor samples the analog input signal and produce a discrete-time, sampled input signal. The integrator processes the discrete-time, sampled input signal. The quantizer converts an output of the integrator to a digital signal. The feedback loop provides the digital signal to respective inputs of the RC integrator and the integrator.
An device having an oscillator circuit modifiable between a first operating mode and a second operating mode, wherein the first operating mode has a first frequency accuracy and a first power consumption, wherein the second operating mode has a second frequency accuracy and a second power consumption, wherein the second frequency accuracy is more accurate than the first frequency accuracy and the second power consumption is higher than the first power consumption, and a control circuit in communication with the oscillator circuit to modify the operating mode of the oscillator circuit.
H03B 5/20 - Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising resistance and either capacitance or inductance, e.g. phase-shift oscillator
88.
DELTA-SIGMA MODULATION UTILIZING CONTINUOUS-TIME INPUT AND DISCRETE-TIME LOOP FILTER
Delta-sigma modulation utilizing continuous-time input and discrete-time loop filter. An apparatus includes an input circuit, a switched-capacitor, an integrator, a quantizer and a feedback loop. The input circuit receives an analog signal and produce an analog input signal, the input circuit comprising a resistor-capacitor (RC) integrator. The switched-capacitor samples the analog input signal and produce a discrete-time, sampled input signal. The integrator processes the discrete-time, sampled input signal. The quantizer converts an output of the integrator to a digital signal. The feedback loop provides the digital signal to respective inputs of the RC integrator and the integrator.
Foreign object detection and related apparatuses, methods, and systems are disclosed. An apparatus includes one or more inductive coils to wirelessly couple with another inductive coil, a series capacitor electrically connected in series with the one or more inductive coils, and a controller to determine a coil current through the one or more inductive coils responsive to a capacitor voltage potential difference across the series capacitor and determine a coil power responsive to the determined coil current and a coil voltage potential difference across the one or more inductive coils.
H02J 50/60 - Circuit arrangements or systems for wireless supply or distribution of electric power responsive to the presence of foreign objects, e.g. detection of living beings
G01R 19/25 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques
H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
90.
FOREIGN OBJECT DETECTION AND RELATED APPARATUSES, METHODS, AND SYSTEMS
Foreign object detection and related apparatuses, methods, and systems are disclosed. An apparatus includes one or more inductive coils to wirelessly couple with another inductive coil, a series capacitor electrically connected in series with the one or more inductive coils, and a controller to determine a coil current through the one or more inductive coils responsive to a capacitor voltage potential difference across the series capacitor and determine a coil power responsive to the determined coil current and a coil voltage potential difference across the one or more inductive coils.
H02J 50/12 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
H02J 50/60 - Circuit arrangements or systems for wireless supply or distribution of electric power responsive to the presence of foreign objects, e.g. detection of living beings
A hermetically sealed semiconductor die package having a sidewall structure having a first opening and a second opening; a lid attached to the sidewall structure to hermetically seal the first opening; a substrate attached to the sidewall structure to hermetically seal the second opening, wherein the substrate comprises first, second, and third apertures; a first button attached to the substrate to hermetically seal the first aperture; a second button attached to the substrate to hermetically seal the second aperture; and a third button attached to the substrate to hermetically seal the third aperture.
A thin film resistor (TFR) module includes a metal cup structure, a dielectric liner region, a TFR element, and a pair of TFR heads electrically connected to the TFR element. The metal cup structure includes a laterally-extending metal cup base and multiple metal cup sidewalls extending upwardly from the laterally-extending metal cup base. The dielectric liner region is formed in an opening defined by the metal cup structure. The TFR element is formed in an opening defined by the dielectric liner region, wherein the TFR element is insulated from the metal cup structure by the dielectric liner region.
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01L 27/01 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01C 17/075 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin-film techniques
94.
THIN-FILM RESISTOR (TFR) MODULE INCLUDING A TFR ELEMENT FORMED IN A METAL CUP STRUCTURE
A thin film resistor (TFR) module includes a metal cup structure, a dielectric liner region, a TFR element, and a pair of TFR heads electrically connected to the TFR element. The metal cup structure includes a laterally-extending metal cup base and multiple metal cup sidewalls extending upwardly from the laterally-extending metal cup base. The dielectric liner region is formed in an opening defined by the metal cup structure. The TFR element is formed in an opening defined by the dielectric liner region, wherein the TFR element is insulated from the metal cup structure by the dielectric liner region.
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H10N 97/00 - Electric solid-state thin-film or thick-film devices, not otherwise provided for
A hermetically sealed semiconductor die package having a sidewall structure having a first opening and a second opening; a lid attached to the sidewall structure to hermetically seal the first opening; a substrate attached to the sidewall structure to hermetically seal the second opening, wherein the substrate comprises first, second, and third apertures; a first button attached to the substrate to hermetically seal the first aperture; a second button attached to the substrate to hermetically seal the second aperture; and a third button attached to the substrate to hermetically seal the third aperture.
H01L 23/055 - Containers; Seals characterised by the shape the container being a hollow construction and having an insulating base as a mounting for the semiconductor body the leads having a passage through the base
H01L 23/10 - Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
A device with boot code, first mutable code stored in non-volatile memory, a first owner information stored in the non-volatile memory, and an SRAM with an SRAM physically unclonable function (SRAM PUF) region. Boot code may generate a first unique private key based on both the first owner information and a portion of the SRAM PUF region, wherein the first unique private key may not be directly accessible by the first mutable code; generate a first unique private keycode corresponding to the first unique private key; and provide the first mutable code with the first unique private keycode corresponding to the first unique private key. First mutable code may use the first unique private keycode to cause data to be signed with the first unique private key and generate a first unique mutable code private key based on at least a portion of the SRAM PUF region.
G06F 21/72 - Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information in cryptographic circuits
A multi-phase power converter with current matching is provided. The apparatus may include a control circuit to control a first phase of a power converter having a plurality of phases, and a phase matching circuit. The phase matching circuit may remove a DC component from an output ripple voltage of the converter, detect when respective ones of the plurality of phases begins generating its respective phase current and output a phase detector signal, extract a signal proportional to the first phase current and a signal proportional to either the remaining or total phase currents, output first and second voltages respectively proportional to the average of the first phase current and the remaining or total phase current, and output a corrective signal based on the difference between the first and second voltage. The control circuit may control the first phase based on the corrective signal.
H02M 1/14 - Arrangements for reducing ripples from dc input or output
H02M 7/5387 - Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
H02M 7/48 - Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
98.
INVERTING CURRENT AMPLIFICATION AND RELATED TOUCH SYSTEMS
One or more examples relate to inverting current amplification and related touch systems. An apparatus includes a first transistor, a second transistor, and a feedback loop. The first transistor and the second transistor provide controlled current at the second transistor that is a copy of current at the first transistor when respective drain-source voltages of the first transistor and the second transistor are substantially equal. The feedback loop sets respective drain-source voltages of the first transistor and the second transistor to be substantially equal, wherein a responsiveness of the feedback loop is proportional to a set transconductance of the feedback loop.
A multi-phase power converter with current matching is provided. The apparatus may include a control circuit to control a first phase of a power converter having a plurality of phases, and a phase matching circuit. The phase matching circuit may remove a DC component from an output ripple voltage of the converter, detect when respective ones of the plurality of phases begins generating its respective phase current and output a phase detector signal, extract a signal proportional to the first phase current and a signal proportional to either the remaining or total phase currents, output first and second voltages respectively proportional to the average of the first phase current and the remaining or total phase current, and output a corrective signal based on the difference between the first and second voltage. The control circuit may control the first phase based on the corrective signal.
H02M 3/156 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
H02M 3/158 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
H02M 1/14 - Arrangements for reducing ripples from dc input or output
H03L 7/087 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using at least two phase detectors or a frequency and phase detector in the loop
H03L 7/093 - Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop - Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using special filtering or amplification characteristics in the loop
100.
Metal-Oxide-Metal (MOM) Capacitors for Integrated Circuit Monitoring
An array of metal-oxide-metal (MOM) capacitors formed in an integrated circuit (IC) structure may be used for evaluating misalignments between patterned layers of the IC structure. The array of MOM capacitors may be formed in a selected set of patterned layers, e.g., a via layer formed between a pair of metal interconnect layers. The MOM capacitors may be programmed with different patterned layer alignments (e.g., built in to photomasks or reticles used to form the patterned layers) to define an array of different alignments. When the MOM capacitors are formed on the wafer, the actual patterned layer alignments capacitors may differ from the programmed layer alignments due a process-related misalignment. The MOM capacitors may be subjected to electrical testing to identify this process-related misalignment, which may be used for initiating a correcting action, e.g., adjusting a manufacturing process or discarding misaligned IC structures or devices.
H01L 23/528 - Layout of the interconnection structure
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
