Nitto Denko Corporation

Japan

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[Owner] Nitto Denko Corporation 1,954
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Date
New (last 4 weeks) 18
2024 April (MTD) 7
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2024 February 9
2024 January 20
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IPC Class
C09J 7/38 - Pressure-sensitive adhesives [PSA] 206
G02B 5/30 - Polarising elements 186
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors 143
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties 135
H05K 1/02 - Printed circuits - Details 107
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Pending 575
Registered / In Force 1,379
Found results for  patents
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1.

ADHESIVE AGENT LAYER AND OPTICAL LAYERED BODY HAVING ADHESIVE AGENT LAYER

      
Application Number 18277410
Status Pending
Filing Date 2022-02-04
First Publication Date 2024-04-18
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ogawa, Taishi
  • Tanaka, Akiko
  • Mizuno, Mizuho
  • Nakamura, Kozo

Abstract

An adhesive layer is formed by cross-linking an adhesive composition containing: a polyester resin that is a copolymer of a polycarboxylic acid and a polyalcohol; a cross-linking agent; and at least one cross-linking catalyst selected from the group consisting of an organic zirconium compound, an organic iron compound, and an organic aluminum compound, the adhesive layer having a gel fraction of 40% or more after being retained at a temperature of 85° C. and a relative humidity of 85% for 300 hours, and having a 180° peel adhesive strength of 100 mN/20 mm or more with respect to a PMMA film.

IPC Classes  ?

2.

ELECTROMAGNETIC SHIELD AND ASSEMBLY

      
Application Number 18274536
Status Pending
Filing Date 2022-08-03
First Publication Date 2024-04-11
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Matsuzaki, Yuya
  • Fuke, Kazuhiro
  • Ui, Takehiro
  • Akiyama, Kyohei

Abstract

An electromagnetic shield is disposed in front of a radar. The radar has different angles of view in different directions. The radar has a first angle of view in a first direction and a second angle of view in a second direction. The second angle of view is smaller than the first angle of view. The second direction is orthogonal to the first direction. The electromagnetic shield has a pair of first sides and a pair of second sides. The pair of first sides face each other in the first direction. The pair of second sides face each other in the second direction. The electromagnetic shield includes a dielectric. At least one of the pair of first sides includes a structure having at least one selected from the group consisting of a projecting portion and a recessed portion.

IPC Classes  ?

  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
  • G01S 7/02 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group

3.

OPTO-ELECTRIC COMPOSITE TRANSMISSION MODULE

      
Application Number 17768415
Status Pending
Filing Date 2020-10-14
First Publication Date 2024-04-11
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Konegawa, Naoto
  • Teraji, Seiki

Abstract

An opto-electric composite transmission module includes a motherboard and an opto-electric hybrid board. The opto-electric hybrid board includes an optical waveguide and an electric circuit board sequentially in the thickness direction. The optical waveguide includes a core layer, an under-cladding layer, and an over-cladding layer. The core layer includes a mirror. The electric circuit board includes a first terminal and a second terminal. The optical waveguide is disposed so that an opto-electric conversion element, which is electrically connected to the first terminal, can optically be connected to the mirror. The second terminal is electrically connected to the motherboard.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements
  • G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

4.

METHOD FOR DESIGNING RADIO SCATTERING BODIES, RADIO SCATTERING BODY DESIGN APPARATUS, AND PROGRAM FOR DESIGNING RADIO SCATTERING BODIES

      
Application Number 18277234
Status Pending
Filing Date 2022-09-29
First Publication Date 2024-04-11
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Matsuzaki, Yuya
  • Fuke, Kazuhiro
  • Suzuki, Takuya

Abstract

A method for designing radio scattering bodies includes making a determination of a value of an objective function. The objective function represents a radio scattering property of a design target for a case where a radio wave is incident on the design target under a given condition. The determination of the value is made by computation using an analysis model including the design target, the analysis model being created on the basis of a set value of a parameter describing a shape of the design target.

IPC Classes  ?

  • G06F 30/20 - Design optimisation, verification or simulation

5.

METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD

      
Application Number 17768758
Status Pending
Filing Date 2020-09-15
First Publication Date 2024-04-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Takakura, Hayato
  • Shibata, Naoki
  • Oyabu, Yasunari

Abstract

A method for manufacturing a wiring circuit board includes steps: 1) preparing a metal supporting layer, a different-reflectance layer, an insulating base layer, and a wiring layer sequentially toward one side in a thickness direction, and 2) irradiating the circuit board with reflected light including light containing one wavelength in light between wavelengths 650 nm and 950 nm from one side in the thickness direction of the circuit board to inspect the wiring layer based on the reflected light at the circuit board. In 2), the outer shape of the wiring layer is inspected based on the contrast between first reflected light at one surface in the thickness direction of the wiring layer and second reflected light at one surface in the thickness direction of the different-reflectance layer. The difference between a reflectance R1 of the wiring layer and a reflectance R2 of the different-reflectance layer is 40% or more.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H05K 1/05 - Insulated metal substrate
  • H05K 1/09 - Use of materials for the metallic pattern
  • H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering

6.

Method and Device for Collecting Physiological Data of a Wearer

      
Application Number 18257750
Status Pending
Filing Date 2021-12-20
First Publication Date 2024-04-04
Owner Nitto Denko Corporation (Japan)
Inventor
  • Srisukh, Pannawit
  • Jiravanichkul, Maneerat
  • Pornpanvattana, Anyamanee
  • Apijuntarangoon, Usanee
  • Thaveeprungsriporn, Visit
  • Khitwongwattana, Amornsri

Abstract

A method of tuning a wearable device for collecting physiological data of a wearer, a wearable device for collecting physiological data of a wearer, a method of controlling a wearable device for collecting physiological data of a wearer, a wearable device for collecting physiological data of a wearer the method, and a computer-readable medium. The method of tuning a wearable device for collecting physiological data of a wearer comprises the steps of collecting a PPG signal using the device; determining whether or not the collected PPG signal is attributable to the wearer being human or animal; and discontinuing the tuning if the collected PPG signal is not attributable to the wearer being human or animal; wherein determining whether or not the collected PPG signal is attributable to the wearer being human or animal comprises determining information about at least one cardiac cycle based on at least one pulse in PPG signal.

IPC Classes  ?

  • A61B 5/024 - Measuring pulse rate or heart rate
  • A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons

7.

METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD

      
Application Number 18471046
Status Pending
Filing Date 2023-09-20
First Publication Date 2024-04-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Fukushima, Kenta
  • Takakura, Hayato
  • Shibata, Naoki
  • Sasaoka, Ryosuke

Abstract

A method for producing a wiring circuit board includes a preparation step of preparing a substrate; a first patterning step of forming a first insulating layer on one side of the substrate in a thickness direction; a second patterning step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; and a deposition step of depositing a metal on the other side of the substrate in the thickness direction and forming a first metal support layer. The conductive pattern has two terminals, and two wirings. The first metal support layer has a terminal support portion supporting the terminals, a wiring support portion supporting one of the wirings, and a second wiring support portion supporting the other wiring and disposed spaced from the wiring support portion.

IPC Classes  ?

  • H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K 1/02 - Printed circuits - Details
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits
  • H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

8.

ELECTROMAGNETIC SHIELD

      
Application Number 18274454
Status Pending
Filing Date 2022-07-20
First Publication Date 2024-03-28
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ui, Takehiro
  • Fuke, Kazuhiro
  • Matsuzaki, Yuya
  • Akiyama, Kyohei

Abstract

An electromagnetic shield includes a plate-shaped base, a plurality of first projecting portions, and a contact portion. The base has a first surface and a second surface. The first surface is a surface configured to allow an electromagnetic wave to be incident on the first surface. The second surface is distant from the first surface. The plurality of first projecting portions project from the first surface in a direction away from the second surface. The electromagnetic shield is capable of being attached to a component such that the component is in contact with the contact portion and the first surface faces the component. A distance from the contact portion to the particular portion in a direction parallel to the first surface is equal to or shorter than a first distance d1 between the first projecting portion closest to the contact portion and the contact portion.

IPC Classes  ?

  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
  • G01S 7/02 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group
  • H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

9.

PEEKING PREVENTION SYSTEM, METHOD OF USING PEEKING PREVENTION SYSTEM, AND METHOD OF PEEKING PREVENTION

      
Application Number 18358260
Status Pending
Filing Date 2023-07-25
First Publication Date 2024-03-28
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Toyota, Yuji
  • Yaegashi, Masahiro
  • Otsuka, Masanori

Abstract

A peeking prevention system includes: a display device having a display plane from which to emit linearly polarized light; a partition to delimit from the surroundings a space in which displaying is to be provided by the display device, the partition having a light-transmitting portion through which the inside of the space is viewable; and an optical stack placeable in opposing relationship with the display plane of the display device. The light-transmitting portion includes a transparent substrate and a first polarizing layer, the first polarizing layer having a first absorption axis that is parallel to a first direction. The optical stack includes a second polarizing layer having a second absorption axis that is parallel to a second direction, the second direction being orthogonal to the first direction, and a ½ wave plate at a side of the second polarizing layer facing the display plane.

IPC Classes  ?

  • G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
  • G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors

10.

ASSEMBLY SHEET

      
Application Number 18466533
Status Pending
Filing Date 2023-09-13
First Publication Date 2024-03-28
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Takimoto, Kenya
  • Machitani, Hiroaki

Abstract

An assembly sheet includes a plurality of wiring circuit boards, a support portion, a connecting portion, and an opening portion. The wiring circuit board includes a first and a second wiring circuit board. The connecting portion includes a first and a second connecting portion connected to the first and the second wiring circuit board, respectively. The support portion and the connecting portion are not disposed between the first and the second wiring circuit board. The first wiring circuit board includes a first main body portion and a first protrusion portion. The second wiring circuit board includes a second main body portion. A first line passing a center of the first main body portion and a second line passing the center of the second main body portion are deviated so that a protrusion amount of the first protrusion portion with respect to the second main body portion is small.

IPC Classes  ?

  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits

11.

WIRING CIRCUIT BOARD

      
Application Number 18471033
Status Pending
Filing Date 2023-09-20
First Publication Date 2024-03-28
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Fukushima, Kenta
  • Takakura, Hayato
  • Shibata, Naoki
  • Sasaoka, Ryosuke

Abstract

A wiring circuit board includes a first insulating layer; a conductive pattern disposed on one side of the first insulating layer in a thickness direction; and a metal support layer disposed on the other side of the first insulating layer in the thickness direction. The metal support layer has a terminal support portion supporting three terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern. A thickness of each of the wiring support portions is thinner than a thickness of the terminal support portion.

IPC Classes  ?

  • H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
  • H05K 1/02 - Printed circuits - Details
  • H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

12.

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

      
Application Number 18471063
Status Pending
Filing Date 2023-09-20
First Publication Date 2024-03-28
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Fukushima, Kenta
  • Takakura, Hayato
  • Shibata, Naoki
  • Sasaoka, Ryosuke

Abstract

A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a metal layer on one side of the substrate in a thickness direction; a step of forming a first insulating layer on one side of the metal layer in the thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of removing the substrate and exposing the metal layer; and a step of depositing a metal on the other side of the metal layer in the thickness direction and forming a first metal support layer. The first metal support layer has a terminal support portion supporting two terminals of a conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.

IPC Classes  ?

  • H05K 1/05 - Insulated metal substrate
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits

13.

MOISTURE BARRIER MATERIAL

      
Application Number 18521674
Status Pending
Filing Date 2023-11-28
First Publication Date 2024-03-28
Owner
  • NITTO, INC. (USA)
  • NITTO DENKO CORPORATION (Japan)
Inventor
  • Jorgensen, Derek
  • Joldersma, Chad

Abstract

A moisture barrier material including a carrier, an adhesive layer formed on at least one surface of the carrier, and a release treated liner, wherein the moisture barrier material has a nonplanar shape, and a method for manufacturing the same.

IPC Classes  ?

  • C09J 7/25 - Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
  • C08L 75/06 - Polyurethanes from polyesters
  • C09J 9/00 - Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
  • C09J 107/00 - Adhesives based on natural rubber
  • C09J 109/06 - Copolymers with styrene
  • C08K 5/00 - Use of organic ingredients
  • C08K 5/521 - Esters of phosphoric acids, e.g. of H3PO4

14.

VOID-CONTAINING LAYER, LAMINATE, METHOD FOR PRODUCING VOID-CONTAINING LAYER, OPTICAL MEMBER, AND OPTICAL APPARATUS

      
Application Number 18274070
Status Pending
Filing Date 2022-01-25
First Publication Date 2024-03-28
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Hattori, Daisuke
  • Morishima, Ryota
  • Kishi, Atsushi

Abstract

The present invention provides a void-containing layer in which a pressure-sensitive adhesive or an adhesive is less liable to penetrate into voids. A void-containing layer of the present invention, includes: particles chemically bonding to each other, wherein the void-containing layer has a void fraction of 35 vol % or more, the particle is an inorganic-organic composite particle in which an organic group is bonded to an inorganic compound, the organic group includes a R1 group which is a linear or branched alkyl group and a R2 group which is a group containing a carbon-carbon unsaturated bond, and a molar ratio of the R2 group relative to a sum of the R1 group and the R2 group is from 1 to 30 mol %.

IPC Classes  ?

  • C09J 7/26 - Porous or cellular plastics
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 133/10 - Homopolymers or copolymers of methacrylic acid esters

15.

METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD

      
Application Number 18471070
Status Pending
Filing Date 2023-09-20
First Publication Date 2024-03-28
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Fukushima, Kenta
  • Takakura, Hayato
  • Shibata, Naoki
  • Sasaoka, Ryosuke

Abstract

A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a first insulating layer on one side of the substrate in a thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of etching the substrate to form a first metal support layer on the other side of the first insulating layer in the thickness direction; and a step of depositing a metal on the other side of the first metal support layer in the thickness direction to form a second metal support layer. The second metal support layer has a terminal support portion supporting two terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits
  • H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

16.

POLARIZED PARTITION, POLARIZED PARTITION SET, AND SPACE PARTITIONED USING SAME

      
Application Number 18274235
Status Pending
Filing Date 2021-12-21
First Publication Date 2024-03-21
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Toyota, Yuji
  • Weng, Yufeng

Abstract

According to the present invention, a technology by which the design property of a section can be improved while a desired portion in the section is shielded can be achieved. The present invention provides a polarized partition set, including: a first polarized partition, which includes a polarizer A1 and a retardation layer having an in-plane retardation Re(550) of 100 nm or more, and in which an angle formed by an absorption axis direction of the polarizer A1 and a slow axis direction of the retardation layer is more than 10° and less than 80°, or more than 100° and less than 170° clockwise or counterclockwise with respect to the absorption axis direction of the polarizer A1; and a second polarized partition, which includes a polarizer B and is arranged at a predetermined interval from the first polarized partition.

IPC Classes  ?

17.

ELECTROMAGNETIC SHIELD

      
Application Number 18274550
Status Pending
Filing Date 2022-07-20
First Publication Date 2024-03-21
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ui, Takehiro
  • Fuke, Kazuhiro
  • Matsuzaki, Yuya
  • Akiyama, Kyohei

Abstract

An electromagnetic shield includes a plate-shaped base, a plurality of first projecting portions, and a plurality of second projecting portions. The plate-shaped base has a first surface and a second surface. The first surface is a surface configured to allow an electromagnetic wave Ei to be incident on the first surface. The second surface is a surface being distant from the first surface and extending along the first surface. The plurality of first projecting portions project from the first surface in a direction away from the second surface. The plurality of second projecting portions project from the second surface in a direction away from the first surface. The electromagnetic shield includes a dielectric.

IPC Classes  ?

  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

18.

HOT-MELT PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET

      
Application Number 18275053
Status Pending
Filing Date 2022-01-26
First Publication Date 2024-03-21
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tamura, Akinori
  • Hatanaka, Itsuhiro
  • Negishi, Nobukazu

Abstract

Provided is a hot-melt PSA composition having a low viscosity when melted with heat and capable of suitably forming a PSA layer. A hot-melt PSA composition comprising a base polymer is provided. The base polymer comprises acrylic polymers A and B. The acrylic polymer A is a polymer of monomers comprising, as the primary component, a (meth)acrylic monomer A having an alkyl group with 4 to 8 carbon atoms. The acrylic polymer B is a polymer of monomers comprising, as a primary component, a (meth)acrylic monomer B having an alkyl group with 9 to 12 carbon atoms. In the base polymer, with the total amount of the acrylic polymers A and B being 100% by weight, the acrylic polymer B content is 10% by weight or more and 90% by weight or less.

IPC Classes  ?

  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 7/35 - Heat-activated
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]

19.

SYSTEMS AND METHODS FOR FOLDABLE MULTI-MODE BEND SENSORS

      
Application Number 18389381
Status Pending
Filing Date 2023-11-14
First Publication Date 2024-03-14
Owner
  • Nitto Bend Technologies, Inc. (USA)
  • Nitto Denko Corporation (Japan)
Inventor
  • Ottley, Colton A.
  • Jonas, Jared K.
  • Eichinger, Colin D.
  • Grimes, Nathan
  • Briggs, Nathan C.

Abstract

Disclosed embodiments include systems and methods for additively manufacturing (e.g., by “printing” or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions configurable into a 3D or stacked structure. A differential strain in a sensing region is linearly proportional to the displacement as measured from the endpoints of the sensing region. The differential strain is measurable as a differential change in the capacitance of the sensing regions.

IPC Classes  ?

  • G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators

20.

WIRING CIRCUIT BOARD

      
Application Number 18261231
Status Pending
Filing Date 2021-12-03
First Publication Date 2024-03-14
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tamaki, Yusaku
  • Shibata, Shusaku
  • Niino, Teppei

Abstract

A wiring circuit board includes a metal supporting substrate, an insulating layer, and a conductive layer in this order in a thickness direction. The conductive layer includes at least one terminal portion and a wiring portion extending from the terminal portion. The metal supporting substrate has an opening portion. The opening portion penetrates the metal supporting substrate in the thickness direction and faces the terminal portion through the insulating layer. The opening portion has a first opening peripheral edge on one side in the thickness direction and a second opening peripheral edge on the other side in the thickness direction. In a projected view in the thickness direction, the second opening peripheral edge is disposed outside the first opening peripheral edge and extends along the first opening peripheral edge.

IPC Classes  ?

21.

INDUCTOR, SINGULATED INDUCTOR, AND METHOD FOR PRODUCING SINGULATED INDUCTOR

      
Application Number 18264208
Status Pending
Filing Date 2022-02-03
First Publication Date 2024-03-14
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Furukawa, Yoshihiro
  • Okumura, Keisuke

Abstract

An inductor including a magnetic layer, and a plurality of wires embedded in the magnetic layer and extending in a longitudinal direction. The plurality of wires are spaced in parallel at predetermined intervals in a direction perpendicular to the longitudinal direction. The magnetic layer includes a plurality of wire disposed portions in which the wires are regularly disposed in parallel to each other, and a margin portion that is disposed between the wire disposed portions adjacent to each other in a parallel direction of the wires and in which the wires are omitted.

IPC Classes  ?

  • H01F 27/28 - Coils; Windings; Conductive connections
  • H01F 17/04 - Fixed inductances of the signal type with magnetic core
  • H01F 41/00 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties

22.

FILM AND PRESSURE-SENSITIVE ADHESIVE TAPE

      
Application Number 18273088
Status Pending
Filing Date 2022-02-28
First Publication Date 2024-03-07
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ogino, Yoshiko
  • Kumada, Tatsuya
  • Hara, Yusuke
  • Naito, Tomonari

Abstract

A film contains a β-1,3-glucan derivative obtained by introducing an acyl group into a β-1,3-glucan and at least one resin selected from the group consisting of a rosin-based resin, a terpene-based resin, and a petroleum-based resin. The acyl group is represented by RCO—, and the R is a hydrocarbon group having 1 or more and 5 or less carbon atoms. Parts by weight of the resin with respect to 100 parts by weight of the β-1,3-glucan derivative are 90 parts by weight or less. A pressure-sensitive adhesive tape includes the film and a pressure-sensitive adhesive layer.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C08L 5/00 - Compositions of polysaccharides or of their derivatives not provided for in group or
  • C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups

23.

FLUORORESIN, FLUORORESIN PARTICLES, AND METHODS FOR PRODUCING THESE

      
Application Number 18471794
Status Pending
Filing Date 2023-09-21
First Publication Date 2024-03-07
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yumino, Shohei
  • Shimono, Tomoya
  • Sakaguchi, Kota
  • Nagai, Tomonari
  • Iwanaga, Kazunari
  • Tanabiki, Masao
  • Doi, Toru

Abstract

The present invention relates to resin particles including a residue unit represented by the following general formula (1) and having a volume average particle diameter equal to or more than 5 μm and equal to or less than 2008 μm, and a method for producing thereof. Fruthermore the present invention relates to a fluororesin comprising a residue unit represented by a general formula (1) and having a weight average molecular weight Mw in a range of 5×104 to 3×105, and a yellow index of a heat-melted molded product (thickness 3 mm) after 24 h at 280° C. of equal to or less than 6, and a method for producing thereof. The present invention relates to resin particles including a residue unit represented by the following general formula (1) and having a volume average particle diameter equal to or more than 5 μm and equal to or less than 2008 μm, and a method for producing thereof. Fruthermore the present invention relates to a fluororesin comprising a residue unit represented by a general formula (1) and having a weight average molecular weight Mw in a range of 5×104 to 3×105, and a yellow index of a heat-melted molded product (thickness 3 mm) after 24 h at 280° C. of equal to or less than 6, and a method for producing thereof. The present invention relates to resin particles including a residue unit represented by the following general formula (1) and having a volume average particle diameter equal to or more than 5 μm and equal to or less than 2008 μm, and a method for producing thereof. Fruthermore the present invention relates to a fluororesin comprising a residue unit represented by a general formula (1) and having a weight average molecular weight Mw in a range of 5×104 to 3×105, and a yellow index of a heat-melted molded product (thickness 3 mm) after 24 h at 280° C. of equal to or less than 6, and a method for producing thereof. In the formula (1), Rf1, Rf2, Rf3, and Rf4 are each independently one of the groups consisting of a fluorine atom, a linear perfluoroalkyl group having 1 to 7 carbon atoms, a branched perfluoroalkyl group having 3 to 7 carbon atoms, or a cyclic perfluoroalkyl group having 3 to 7 carbon atoms. The perfluoroalkyl group may have an ethereal oxygen atom. Further, Rf1, Rf2, Rf3, and Rf4 may be linked to one another to form a ring having 4 or more and 8 or less carbon atoms, and the ring may include an ethereal oxygen atom.

IPC Classes  ?

  • C08F 24/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen

24.

DISINFECTING-WIPES PACKAGE

      
Application Number 18238672
Status Pending
Filing Date 2023-08-28
First Publication Date 2024-03-07
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Trinkaus, Jan Michael
  • Berndt, Christian

Abstract

A package has a container formed with a dispensing opening and a supply of nonwoven disinfecting wipes in the container. The wipes are made of fibers containing lignin and impregnated with a disinfectant solution having at least two liquid components. A lignin content of the nonwoven wipes is between 0.02 g/m2 and 1 g/m2 and/or the disinfectant solution contains a dye. Thus if at least a part of one of the wipes is overexposed to air, it will change color as oxidized lignin and/or dye collects in it.

IPC Classes  ?

  • C11D 17/04 - Detergent materials or soaps characterised by their shape or physical properties combined with or containing other objects
  • A01N 31/02 - Acyclic compounds
  • A01P 1/00 - Disinfectants; Antimicrobial compounds or mixtures thereof
  • A47K 10/42 - Dispensers for paper towels or toilet-paper dispensing from a store of single sheets, e.g. stacked
  • B65D 75/58 - Opening or contents-removing devices added or incorporated during package manufacture
  • B65D 83/08 - Containers or packages with special means for dispensing contents for dispensing thin flat articles in succession
  • B65D 85/62 - Containers, packaging elements or packages, specially adapted for particular articles or materials for special arrangements of groups of articles
  • B65D 85/671 - Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form
  • C11D 3/20 - Organic compounds containing oxygen
  • C11D 3/40 - Dyes
  • C11D 3/48 - Medicinal or disinfecting agents
  • D04H 1/26 - Wood pulp
  • D04H 1/4258 - Regenerated cellulose series
  • D04H 1/4266 - Natural fibres not provided for in group  
  • D04H 1/4374 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece using different kinds of webs, e.g. by layering webs
  • D04H 1/492 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres by fluid jet
  • D06M 13/144 - Alcohols; Metal alcoholates
  • D06M 13/207 - Substituted carboxylic acids, e.g. by hydroxy or keto groups; Anhydrides, halides or salts thereof
  • D06M 16/00 - Biochemical treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, e.g. enzymatic

25.

Method, Computing Device And Wearable Device For Sleep Stage Detection

      
Application Number 18385181
Status Pending
Filing Date 2023-10-30
First Publication Date 2024-03-07
Owner Nitto Denko Corporation (Japan)
Inventor
  • Jiravanichkul, Maneerat
  • Jirajaras, Thada
  • Thaveeprungsriporn, Visit
  • Srisukh, Pannawit
  • Thiamtawan, Pongsarun

Abstract

A method of sleep stage detection using vital sign features derived from PPG signals. The method includes performing a logistic regression operation based on a machine learning classifier model to calculate an indication value for an intermediate epoch. The indication value is calculated based on the vital sign features for the intermediate epoch as well as those of the preceding and succeeding epochs. The method then detects the sleep stage of the corresponding intermediate epoch based on the indication value for the corresponding intermediate epoch.

IPC Classes  ?

  • A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons
  • A61B 5/024 - Measuring pulse rate or heart rate
  • G16H 20/10 - ICT specially adapted for therapies or health-improving plans, e.g. for handling prescriptions, for steering therapy or for monitoring patient compliance relating to drugs or medications, e.g. for ensuring correct administration to patients
  • G16H 40/67 - ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices for the operation of medical equipment or devices for remote operation
  • G16H 50/20 - ICT specially adapted for medical diagnosis, medical simulation or medical data mining; ICT specially adapted for detecting, monitoring or modelling epidemics or pandemics for computer-aided diagnosis, e.g. based on medical expert systems
  • G16H 50/30 - ICT specially adapted for medical diagnosis, medical simulation or medical data mining; ICT specially adapted for detecting, monitoring or modelling epidemics or pandemics for individual health risk assessment

26.

RADIO WAVE SCATTERING BODY, AND MEMBER FOR ATTENUATING RADIO WAVES COMPRISING RADIO WAVE SCATTERING BODY

      
Application Number 18269424
Status Pending
Filing Date 2021-12-24
First Publication Date 2024-02-29
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Fuke, Kazuhiro
  • Ui, Takehiro
  • Matsuzaki, Yuya
  • Akiyama, Kyohei

Abstract

The present invention provides a member which, with a novel configuration, can transmit and attenuate incident radio waves, without the need for mixing a radio wave absorption material for example a dielectric loss material such as carbon particles or a magnetic loss material such as an iron oxide powder, or incorporating a scattering body. Provided is a radio wave scattering body that is characterized by being configured to transmit at least a portion of incident radio waves and to emit the transmitted radio waves in a scattering state, and comprising a resin composition in which a resin is a main component.

IPC Classes  ?

  • G01S 7/03 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group - Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
  • H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome
  • H01Q 17/00 - Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems

27.

OPTICAL LAMINATE AND OPTICAL DEVICE

      
Application Number 18270045
Status Pending
Filing Date 2022-02-04
First Publication Date 2024-02-22
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tanaka, Akiko
  • Mizuno, Mizuho
  • Nakamura, Kozo
  • Weng, Yufeng

Abstract

An optical stack includes: a first optical sheet having a first principal face with a concavo-convex structure and a second principal face at an opposite side from the first principal face; and an adhesive layer that is disposed on the first principal face of the first optical sheet. The concavo-convex structure includes a plurality of dents and flat portions between adjacent ones of the plurality of dents. A surface of the adhesive layer and the first principal face of the first optical sheet together define an internal space within each of the plurality of dents. Each of the plurality of dents satisfies 0.10≤(C−A)/C 1.00 and 0.75≤(C−A)/(C−B), where A is a maximum height value of the adhesive layer existing in that dent; B is a minimum height value of the adhesive layer existing in that dent; and C is a depth of that dent.

IPC Classes  ?

  • G02B 5/02 - Diffusing elements; Afocal elements
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
  • C09J 133/08 - Homopolymers or copolymers of acrylic acid esters
  • C09J 167/00 - Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers

28.

ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE TAPE

      
Application Number 18271750
Status Pending
Filing Date 2022-01-20
First Publication Date 2024-02-22
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kumada, Tatsuya
  • Ogino, Yoshiko
  • Hara, Yusuke
  • Naito, Tomonari

Abstract

An adhesive composition contains a β-1,3-glucan derivative having a degree of substitution of the acyl group of 2.6 or more and less than 3.0, and an isocyanate-based crosslinking agent. A pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer formed from the adhesive composition.

IPC Classes  ?

  • C09J 105/00 - Adhesives based on polysaccharides or on their derivatives, not provided for in groups or
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 11/06 - Non-macromolecular additives organic

29.

FLUORORESIN, FLUORORESIN PARTICLES, AND METHODS FOR PRODUCING THESE

      
Application Number 18471482
Status Pending
Filing Date 2023-09-21
First Publication Date 2024-02-22
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yumino, Shohei
  • Shimono, Tomoya
  • Sakaguchi, Kota
  • Nagai, Tomonari
  • Iwanaga, Kazunari
  • Tanabiki, Masao
  • Doi, Toru

Abstract

The present invention relates to resin particles including a residue unit represented by the following general formula (1) and having a volume average particle diameter equal to or more than 5 μm and equal to or less than 2000 μm, and a method for producing thereof. Furthermore the present invention relates to a fluororesin comprising a residue unit represented by a general formula (1) and having a weight average molecular weight Mw in a range of 5×104 to 3×105, and a yellow index of a heat-melted molded product (thickness 3 mm) after 24 h at 280° C. of equal to or less than 6, and a method for producing thereof. The present invention relates to resin particles including a residue unit represented by the following general formula (1) and having a volume average particle diameter equal to or more than 5 μm and equal to or less than 2000 μm, and a method for producing thereof. Furthermore the present invention relates to a fluororesin comprising a residue unit represented by a general formula (1) and having a weight average molecular weight Mw in a range of 5×104 to 3×105, and a yellow index of a heat-melted molded product (thickness 3 mm) after 24 h at 280° C. of equal to or less than 6, and a method for producing thereof. The present invention relates to resin particles including a residue unit represented by the following general formula (1) and having a volume average particle diameter equal to or more than 5 μm and equal to or less than 2000 μm, and a method for producing thereof. Furthermore the present invention relates to a fluororesin comprising a residue unit represented by a general formula (1) and having a weight average molecular weight Mw in a range of 5×104 to 3×105, and a yellow index of a heat-melted molded product (thickness 3 mm) after 24 h at 280° C. of equal to or less than 6, and a method for producing thereof. In the formula (1), Rf1, Rf2, Rf3, and Rf4 are each independently one of the groups consisting of a fluorine atom, a linear perfluoroalkyl group having 1 to 7 carbon atoms, a branched perfluoroalkyl group having 3 to 7 carbon atoms, or a cyclic perfluoroalkyl group having 3 to 7 carbon atoms. The perfluoroalkyl group may have an ethereal oxygen atom. Further, Rf1, Rf2, Rf3, and Rf4 may be linked to one another to form a ring having 4 or more and 8 or less carbon atoms, and the ring may include an ethereal oxygen atom.

IPC Classes  ?

  • C08F 24/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen

30.

Photon up-conversion film and method of producing the film

      
Application Number 18018177
Grant Number 11959000
Status In Force
Filing Date 2022-06-15
First Publication Date 2024-02-22
Grant Date 2024-04-16
Owner
  • WAKAYAMA PREFECTURE (Japan)
  • NITTO DENKO CORPORATION (Japan)
Inventor
  • Mori, Takeshi
  • Mori, Tomohiro
  • Saito, Akane
  • Masuda, Tsuyoshi
  • Saomoto, Hitoshi
  • Kawaguchi, Mami
  • Miyatake, Minoru
  • Matsuda, Shoichi
  • Katsuda, Masato

Abstract

Provided are a photon up-conversion film, which is capable, of high-efficiency up-conversion even in air and even when low-intensity light is used, and a simple method of producing the film. The photon up-conversion film according to one embodiment of the present invention includes: a matrix including a resin; and a pore portion, wherein the photon up-conversion film includes at least a sensitizing component capable of absorbing light in a first wavelength region λ1, and a light-emitting component capable of radiating light in a second wavelength region λ2 including wavelengths shorter than those of the first wavelength region λ1, and wherein the sensitizing component and the light-emitting component are present at an interface between the matrix and the pore portion.

IPC Classes  ?

  • C09K 11/06 - Luminescent, e.g. electroluminescent, chemiluminescent, materials containing organic luminescent materials
  • C08J 5/18 - Manufacture of films or sheets
  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
  • C08J 9/28 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum
  • C08K 5/00 - Use of organic ingredients
  • C08K 5/01 - Hydrocarbons
  • C08K 5/06 - Ethers; Acetals; Ketals; Ortho-esters
  • C08K 5/092 - Polycarboxylic acids
  • C08K 5/45 - Heterocyclic compounds having sulfur in the ring
  • C09K 11/02 - Use of particular materials as binders, particle coatings or suspension media therefor

31.

OPTICAL LAMINATE, OPTICAL DEVICE, AND METHOD FOR PRODUCING OPTICAL LAMINATE

      
Application Number 18274097
Status Pending
Filing Date 2022-02-04
First Publication Date 2024-02-15
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Wakayama, Shunya
  • Kiribe, Shigeyoshi
  • Matsuo, Naoyuki

Abstract

An optical stack includes: a first optical sheet having a first principal face with a concavo-convex structure and a second principal face at an opposite side from the first principal face; and an adhesive layer that is disposed on the first principal face of the first optical sheet. The concavo-convex structure includes a plurality of dents and flat portions between adjacent ones of the plurality of dents. The adhesive layer is in contact with the flat portions. A surface of the adhesive layer and the first principal face of the first optical sheet together define an internal space within each of the plurality of dents. In a plan view from a normal direction of the first principal face of the first optical sheet, an area ratio of air voids existing at interfaces between the flat portions and the adhesive layer to an area of the first optical sheet is 3% or less.

IPC Classes  ?

  • C09J 7/35 - Heat-activated
  • C09J 5/06 - Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives

32.

PRESSURE-SENSITIVE ADHESIVE SHEET FOR SEMICONDUCTOR PROCESSING

      
Application Number 18358853
Status Pending
Filing Date 2023-07-25
First Publication Date 2024-02-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kato, Yuji
  • Akiyama, Jun
  • Ueno, Taiki

Abstract

Provided is a pressure-sensitive adhesive sheet for semiconductor processing having excellent followability to unevenness of an adherend, and an excellent anchoring property. The pressure-sensitive adhesive sheet for semiconductor processing includes a pressure-sensitive adhesive layer formed of an ultra-violet (UV)-curable pressure-sensitive adhesive, and a base material. The UV-curable pressure-sensitive adhesive contains a base polymer, a photopolymerization initiator, and a phosphoric acid ester-based surfactant.

IPC Classes  ?

  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 133/08 - Homopolymers or copolymers of acrylic acid esters
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

33.

METHOD FOR PRODUCING ALKALINE EARTH METAL FORMATE

      
Application Number 18043928
Status Pending
Filing Date 2021-08-30
First Publication Date 2024-02-08
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Hirano, Makoto
  • Matsuda, Hirokazu
  • Pidko, Evgeny Alexandrovich
  • Filonenko, Georgy Alexandrovich
  • Rebreyend, Christophe

Abstract

Provided is a method for producing an alkaline earth metal formate, the method including a first step of reacting hydrogen and carbon dioxide with a carbonate or hydrogen carbonate of an alkaline earth metal using a homogeneous catalyst in the presence of a solvent in a two-phase system in which an organic phase and an aqueous phase are present in a separated state in the solvent to produce an alkaline earth metal formate.

IPC Classes  ?

  • C07C 51/41 - Preparation of salts of carboxylic acids by conversion of the acids or their salts into salts with the same carboxylic acid part
  • B01J 31/24 - Phosphines
  • B01J 31/18 - Catalysts comprising hydrides, coordination complexes or organic compounds containing coordination complexes containing nitrogen, phosphorus, arsenic or antimony
  • B01J 31/16 - Catalysts comprising hydrides, coordination complexes or organic compounds containing coordination complexes

34.

PRESSURE-SENSITIVE ADHESIVE SHEET FOR SEMICONDUCTOR PROCESSING

      
Application Number 18358791
Status Pending
Filing Date 2023-07-25
First Publication Date 2024-02-01
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Akiyama, Jun
  • Kato, Yuji
  • Ueno, Taiki

Abstract

Provided is a pressure-sensitive adhesive sheet for semiconductor processing having excellent solvent resistance. The pressure-sensitive adhesive sheet for semiconductor processing includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition containing a base polymer, and a base material. The pressure-sensitive adhesive composition has a swelling degree SA of 2.1 times or less when immersed in an N,N-dimethylpropionamide solution at 23° C. for 1 hour.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 7/25 - Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
  • C09J 7/24 - Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
  • H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

35.

WIRING CIRCUIT BOARD ASSEMBLY SHEET

      
Application Number 18256170
Status Pending
Filing Date 2021-11-01
First Publication Date 2024-02-01
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Fukushima, Rihito
  • Ikeda, Takahiro
  • Shiga, Shun

Abstract

A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.

IPC Classes  ?

  • H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K 1/02 - Printed circuits - Details
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits
  • H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

36.

LIPID NANOPARTICLE

      
Application Number 18247612
Status Pending
Filing Date 2021-10-01
First Publication Date 2024-01-25
Owner
  • National University Corporation Hokkaido University (Japan)
  • Nitto Denko Corporation (Japan)
Inventor
  • Sato, Yusuke
  • Harashima, Hideyoshi
  • Hashiba, Kazuki
  • Taguchi, Masamitsu
  • Sakamoto, Sachiko
  • Shishido, Takuya
  • Otsu, Ayaka
  • Maeda, Yoshiki

Abstract

The present invention addresses the problem of providing lipid nanoparticles which function as gene transfer carriers capable of selective transfer to the liver or spleen. Lipid nanoparticles which contain a pH-sensitive cationic lipid represented by formula (I) [a represents an integer of 3-5; b represents 0 or 1; R1 and R2 each independently represent a group represented by general formula (A) (R11 and R12 each independently represent a linear or branched C2-15 alkyl group; c represents 0 or 1; v represents an integer of 4-12); and X represents a group represented by general formula (B)(d represents an integer of 0-3; and R3 and R4 each independently represent a C1-4 alkyl group or C2-4 alkenyl group, while R3 and R4 may form a 5- to 7-membered non-aromatic heterocycle) or represents a 5- to 7-membered non-aromatic heterocyclic group]. (I) (R1)(R2)C(OH)—(CH2)a—(O—CO)b—X. (A): (R11)(R12)—CH—(CO—O)c—(CH2)v-. (B):—(CH2)d-N(R3)(R4). The present invention addresses the problem of providing lipid nanoparticles which function as gene transfer carriers capable of selective transfer to the liver or spleen. Lipid nanoparticles which contain a pH-sensitive cationic lipid represented by formula (I) [a represents an integer of 3-5; b represents 0 or 1; R1 and R2 each independently represent a group represented by general formula (A) (R11 and R12 each independently represent a linear or branched C2-15 alkyl group; c represents 0 or 1; v represents an integer of 4-12); and X represents a group represented by general formula (B)(d represents an integer of 0-3; and R3 and R4 each independently represent a C1-4 alkyl group or C2-4 alkenyl group, while R3 and R4 may form a 5- to 7-membered non-aromatic heterocycle) or represents a 5- to 7-membered non-aromatic heterocyclic group]. (I) (R1)(R2)C(OH)—(CH2)a—(O—CO)b—X. (A): (R11)(R12)—CH—(CO—O)c—(CH2)v-. (B):—(CH2)d-N(R3)(R4). (R1)(R2)C(OH)—(CH2)a—(O—CO)b—X  (I) The present invention addresses the problem of providing lipid nanoparticles which function as gene transfer carriers capable of selective transfer to the liver or spleen. Lipid nanoparticles which contain a pH-sensitive cationic lipid represented by formula (I) [a represents an integer of 3-5; b represents 0 or 1; R1 and R2 each independently represent a group represented by general formula (A) (R11 and R12 each independently represent a linear or branched C2-15 alkyl group; c represents 0 or 1; v represents an integer of 4-12); and X represents a group represented by general formula (B)(d represents an integer of 0-3; and R3 and R4 each independently represent a C1-4 alkyl group or C2-4 alkenyl group, while R3 and R4 may form a 5- to 7-membered non-aromatic heterocycle) or represents a 5- to 7-membered non-aromatic heterocyclic group]. (I) (R1)(R2)C(OH)—(CH2)a—(O—CO)b—X. (A): (R11)(R12)—CH—(CO—O)c—(CH2)v-. (B):—(CH2)d-N(R3)(R4). (R1)(R2)C(OH)—(CH2)a—(O—CO)b—X  (I) (R11)(R12)—CH—(CO—O)c—(CH2)v-  (A) The present invention addresses the problem of providing lipid nanoparticles which function as gene transfer carriers capable of selective transfer to the liver or spleen. Lipid nanoparticles which contain a pH-sensitive cationic lipid represented by formula (I) [a represents an integer of 3-5; b represents 0 or 1; R1 and R2 each independently represent a group represented by general formula (A) (R11 and R12 each independently represent a linear or branched C2-15 alkyl group; c represents 0 or 1; v represents an integer of 4-12); and X represents a group represented by general formula (B)(d represents an integer of 0-3; and R3 and R4 each independently represent a C1-4 alkyl group or C2-4 alkenyl group, while R3 and R4 may form a 5- to 7-membered non-aromatic heterocycle) or represents a 5- to 7-membered non-aromatic heterocyclic group]. (I) (R1)(R2)C(OH)—(CH2)a—(O—CO)b—X. (A): (R11)(R12)—CH—(CO—O)c—(CH2)v-. (B):—(CH2)d-N(R3)(R4). (R1)(R2)C(OH)—(CH2)a—(O—CO)b—X  (I) (R11)(R12)—CH—(CO—O)c—(CH2)v-  (A) —(CH2)d—N(R3)(R4)  (B)

IPC Classes  ?

  • A61K 9/51 - Nanocapsules
  • C12N 15/113 - Non-coding nucleic acids modulating the expression of genes, e.g. antisense oligonucleotides
  • A61K 48/00 - Medicinal preparations containing genetic material which is inserted into cells of the living body to treat genetic diseases; Gene therapy
  • C12N 15/88 - Introduction of foreign genetic material using processes not otherwise provided for, e.g. co-transformation using microencapsulation, e.g. using liposome vesicle

37.

RADIO WAVE ABSORBER AND LAMINATE FOR RADIO WAVE ABSORBER

      
Application Number 18255131
Status Pending
Filing Date 2021-11-24
First Publication Date 2024-01-25
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Nakanishi, Yosuke
  • Ueda, Eri
  • Machinaga, Hironobu

Abstract

A radio wave absorber 1a includes a resistive layer 10, a reflector 30, and a dielectric layer 20. The resistive layer 10 includes multilayer carbon nanotubes 11. Moreover, the resistive layer 10 has a specific resistance of 1.5 Ω·cm or less. The reflector 30 reflects a radio wave. The dielectric layer 20 is disposed between the resistive layer and the reflector in a thickness direction of the resistive layer 10.

IPC Classes  ?

  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

38.

SURFACE-MODIFYING SHEET, LAMINATE, SURFACE-MODIFIED MEMBER, COATED ARTICLE, METHOD FOR PRODUCING SURFACE-MODIFIED MEMBER, AND METHOD FOR PRODUCING COATED ARTICLE

      
Application Number 18274936
Status Pending
Filing Date 2022-01-21
First Publication Date 2024-01-25
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Oban, Ryohei
  • Shimokawa, Kayo
  • Endo, Asuka
  • Ishiguro, Shigeki

Abstract

A surface-modifying sheet contains a release sheet and a surface-modifying layer, the surface-modifying layer has a 160° C. storage modulus of 5.0×103 to 1.0×107 Pa, and the surface-modifying layer has a surface tension of 38 mN/m or higher.

IPC Classes  ?

39.

ELECTRODE

      
Application Number 18247116
Status Pending
Filing Date 2021-09-24
First Publication Date 2024-01-18
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yamada, Kyotaro
  • Haishi, Motoki
  • Sasahara, Kazuki

Abstract

An electrode (1) includes a resin film (2), a metal underlayer (3), and a conductive carbon layer (4) in sequence in a thickness direction. A surface of the conductive carbon layer (4) has an arithmetic average roughness Ra of 1.50 nm or less and a skewness Rsk of 0.00 or more.

IPC Classes  ?

  • G01N 27/30 - Electrodes, e.g. test electrodes; Half-cells

40.

WIRING CIRCUIT BOARD

      
Application Number 18253894
Status Pending
Filing Date 2021-10-26
First Publication Date 2024-01-18
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Fukushima, Rihito
  • Shibata, Shusaku
  • Niino, Teppei

Abstract

A wiring circuit board includes a first insulating layer and a conductive pattern. The conductive pattern has a first terminal, and a wiring connected to the first terminal. The wiring has a first portion disposed away from the first terminal, and a second portion disposed between the first terminal and the first portion. The first portion of the wiring and the first terminal include a portion consisting of the first conductive layer and the second conductive layer. The second portion of the wiring consists of the first conductive layer.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H05K 1/18 - Printed circuits structurally associated with non-printed electric components

41.

MULTI-LAYERED STRUCTURE AND METHOD FOR PRODUCING SAME

      
Application Number 18036053
Status Pending
Filing Date 2021-11-02
First Publication Date 2024-01-18
Owner Nitto Denko Corporation (Japan)
Inventor
  • Sato, Keisuke
  • Murashige, Takeshi
  • Inagaki, Junichi

Abstract

The present multi-layered structure includes: a resin layer; and a glass layer stacked via an adhesive layer on the resin layer. A thickness of the glass layer is 10 μm or more and 300 μm or less. A thickness of an outer peripheral portion of the resin layer is 5 μm or more.

IPC Classes  ?

  • B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
  • B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
  • B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties

42.

DETERMINING APPARATUS, DETERMINING METHOD AND DETERMINING PROGRAM

      
Application Number 18036446
Status Pending
Filing Date 2021-11-05
First Publication Date 2024-01-18
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Okada, Kazumasa
  • Kozonoi, Nobuyuki
  • Kaseda, Yugo
  • Omasa, Takamitsu

Abstract

A determining apparatus includes a skeleton estimating unit configured to estimate a skeleton position of a processing-target ruminant from a photographed image; an extracting unit configured to extract a region of the processing-target ruminant from the photographed image; a cutting unit configured to cut a determining area for performing action determining of the processing-target ruminant based on the estimated skeleton position and the extracted region; and a determining unit configured to perform the action determining of the processing-target ruminant based on the cut determining area.

IPC Classes  ?

  • G06V 40/10 - Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
  • G06V 40/20 - Movements or behaviour, e.g. gesture recognition
  • G06V 10/774 - Generating sets of training patterns; Bootstrap methods, e.g. bagging or boosting
  • G06V 10/26 - Segmentation of patterns in the image field; Cutting or merging of image elements to establish the pattern region, e.g. clustering-based techniques; Detection of occlusion
  • G06T 7/70 - Determining position or orientation of objects or cameras
  • A01K 29/00 - Other apparatus for animal husbandry

43.

WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD

      
Application Number 18252308
Status Pending
Filing Date 2021-10-28
First Publication Date 2024-01-11
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Shibata, Shusaku
  • Ikeda, Takahiro
  • Niino, Teppei

Abstract

Provided is a wiring circuit board that includes a metal supporting board; a first metal thin film; an insulating layer; a second metal thin film; and a conductive layer in order toward one side in a thickness direction. The metal supporting board includes a metal supporting layer and a surface metal layer. The surface metal layer is disposed on one surface in the thickness direction of the metal supporting layer and has higher conductivity than the metal supporting layer. The insulating layer has a through hole. The conductive layer has a via portion. The via portion is disposed in the through hole and is electrically connected to the metal supporting board.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H05K 3/42 - Plated through-holes
  • H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
  • H05K 1/09 - Use of materials for the metallic pattern

44.

COATING FILM FORMING COMPOSITION AND COATING FILM

      
Application Number 17913797
Status Pending
Filing Date 2021-03-12
First Publication Date 2024-01-11
Owner NITTO DENKO CORPORATION (USA)
Inventor
  • Takenouchi, Yuta
  • Ikenaga, Akie
  • Xie, Yijun

Abstract

The present invention relates to a coating film forming composition, in which a coating film formed by the coating film forming composition has a water contact angle, after a surface was washed with water, of 25° or less, and a water content, after impregnation with water at 25° C. for 2 hours, of 110% or less.

IPC Classes  ?

  • C09D 5/16 - Anti-fouling paints; Underwater paints
  • C09D 5/20 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
  • C09D 7/45 - Anti-settling agents
  • C09D 7/65 - Additives macromolecular
  • C09D 7/63 - Additives non-macromolecular organic
  • C09D 175/04 - Polyurethanes

45.

ADHESIVE COMPOSITION AND ADHESIVE TAPE

      
Application Number 18039562
Status Pending
Filing Date 2021-11-19
First Publication Date 2024-01-11
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kumada, Tatsuya
  • Ogino, Yoshiko
  • Hara, Yusuke
  • Naito, Tomonari

Abstract

An adhesive composition contains a β-1,3-glucan derivative obtained by introducing an acyl group into β-1,3-glucan; and a terpene-based resin. An adhesive tape includes an adhesive layer formed from the adhesive composition.

IPC Classes  ?

  • C09J 11/08 - Macromolecular additives
  • C09J 105/00 - Adhesives based on polysaccharides or on their derivatives, not provided for in groups or
  • C08B 37/00 - Preparation of polysaccharides not provided for in groups ; Derivatives thereof

46.

BONDING METHOD

      
Application Number 18037764
Status Pending
Filing Date 2021-11-18
First Publication Date 2024-01-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tanaka, Akiko
  • Suzuki, Yuto
  • Hamada, Chie

Abstract

A bonding method for providing an adhesive layer and a curing agent layer between a first adherend and a second adherend to bond the first adherend and the second adherend in which: the adhesive layer contains an epoxy resin as a main component and is cured by an effect of the curing agent layer; a curing agent contained in the curing agent layer is a polymerization catalyst type curing agent; and a thickness A (m) of the adhesive layer before curing and the application amount B (kg/m2) of the curing agent contained in the curing agent layer satisfy 5

IPC Classes  ?

  • C09J 163/04 - Epoxynovolacs
  • C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used

47.

MULTI-LAYER STRUCTURE

      
Application Number 18038070
Status Pending
Filing Date 2021-10-29
First Publication Date 2024-01-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Inagaki, Junichi
  • Sato, Keisuke
  • Murashige, Takeshi

Abstract

A multi-layer structure includes a support, a resin layer laminated on the support via a tackifier layer, and a glass layer laminated over the resin layer. The thickness of the glass layer is 10 μm or greater and 300 μm or less. When the coefficient of linear expansion of the support is defined as CTE [ppm/° C.], the thickness of the tackifier layer is defined as d [μm], and the elastic modulus of the tackifier layer is defined as E [GPa], a value a, which is defined as a=CTE/(d/E), is 3 or less.

IPC Classes  ?

  • B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • B32B 17/06 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
  • B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins

48.

ADHESIVE COMPOSITION AND ADHESIVE TAPE

      
Application Number 18039531
Status Pending
Filing Date 2021-11-19
First Publication Date 2024-01-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kumada, Tatsuya
  • Ogino, Yoshiko
  • Hara, Yusuke
  • Naito, Tomonari

Abstract

An adhesive composition contains a β-1,3-glucan derivative obtained by introducing an acyl group into β-1,3-glucan; and a petroleum-based resin. An adhesive tape includes an adhesive layer formed from the adhesive composition.

IPC Classes  ?

  • C09J 11/06 - Non-macromolecular additives organic
  • C09J 191/00 - Adhesives based on oils, fats or waxes; Adhesives based on derivatives thereof

49.

PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, AND PRESSURE-SENSITIVE ADHESIVE SHEET

      
Application Number 17796266
Status Pending
Filing Date 2021-01-27
First Publication Date 2024-01-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tani, Kensuke
  • Tsumura, Daisuke

Abstract

The present invention relates to a pressure-sensitive adhesive composition containing a base polymer, in which the base polymer is a copolymer containing structures derived from a water-insoluble hydrophilic monomer (a) and a nitrogen-containing hydrophilic monomer (b), and a content ratio of the structure derived from the water-insoluble hydrophilic monomer (a) in the base polymer is 40 mass % or more.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 133/24 - Homopolymers or copolymers of amides or imides

50.

ACID GAS ADSORPTION AND DESORPTION MATERIAL

      
Application Number 18007686
Status Pending
Filing Date 2021-06-01
First Publication Date 2024-01-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Matsuda, Koso
  • Suzuki, Satoru

Abstract

Provided is an acid gas adsorption and desorption material which is capable of satisfying both excellent durability and high adsorption and desorption amounts, and is also good in terms of desorption energy. The acid gas adsorption and desorption material has acid gas adsorption and desorption capabilities and is capable of adsorbing 0.35 mmol/g or more of acid gas within 15 hours under one or more acid gas adsorption conditions, in an atmosphere whose acid gas concentration is 400 ppm±10 ppm, and then desorbing 50% or more of the adsorbed acid gas within 1.5 hours under one or more acid gas desorption conditions.

IPC Classes  ?

  • B01J 20/26 - Synthetic macromolecular compounds
  • B01J 20/34 - Regenerating or reactivating
  • B01D 53/04 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents

51.

STRAIN SENSOR, FUNCTIONAL FILM, AND METHOD FOR MANUFACTURING SAME

      
Application Number 18034510
Status Pending
Filing Date 2021-10-25
First Publication Date 2024-01-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yasui, Satoshi
  • Shibuya, Katsunori
  • Nakajima, Kazuhiro

Abstract

A functional film includes a strain resistance film provided on one principal surface of a flexible insulating base. The strain resistance film is a chromium nitride thin-film having a thickness of 150 nm or less. In an X-ray diffraction chart with a CuKα ray as an X-ray source, the strain resistance film has an intensity ratio I2/I1 of 0.001 or more, where the intensity ratio I2/I1 is a ratio of the intensity I2 of the second peak in a range in which 2θ is 60° to 65° to the intensity I1 of the first peak in a range in which 2θ is 43° to 45°. The strain resistance film is less liable to crack due to bending, and has a high gauge factor. The functional film is suitably used for a strain sensor.

IPC Classes  ?

  • G01L 1/22 - Measuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
  • C23C 14/00 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C 14/06 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
  • C23C 14/34 - Sputtering

52.

MULTI-LAYERED STRUCTURE AND METHOD FOR PRODUCING SAME

      
Application Number 18036049
Status Pending
Filing Date 2021-10-26
First Publication Date 2024-01-04
Owner Nitto Denko Corporation (Japan)
Inventor
  • Sato, Keisuke
  • Murashige, Takeshi
  • Inagaki, Junichi

Abstract

The present multi-layered structure includes: a resin layer; a glass layer stacked via an adhesive layer on the resin layer; and a fusion layer that is formed in an outer peripheral portion of the glass layer on the glass layer side that faces the adhesive layer. A thickness of the glass layer is 10 μm or more and 300 μm or less. A thickness of the fusion layer is less than 3 μm.

IPC Classes  ?

  • B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
  • B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
  • B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor

53.

ADHESIVE COMPOSITION AND ADHESIVE TAPE

      
Application Number 18039179
Status Pending
Filing Date 2021-11-19
First Publication Date 2024-01-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kumada, Tatsuya
  • Ogino, Yoshiko
  • Hara, Yusuke
  • Naito, Tomonari

Abstract

An adhesive composition contains a β-1,3-glucan derivative obtained by introducing an acyl group into β-1,3-glucan; and a rosin-based resin. An adhesive tape (1) includes an adhesive layer (3) formed from the adhesive composition.

IPC Classes  ?

  • C09J 105/00 - Adhesives based on polysaccharides or on their derivatives, not provided for in groups or
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]

54.

WIRING CIRCUIT BOARD

      
Application Number 18253892
Status Pending
Filing Date 2021-10-29
First Publication Date 2024-01-04
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Shibata, Shusaku
  • Ikeda, Takahiro
  • Niino, Teppei

Abstract

A wiring circuit board includes a metal supporting board; an insulating layer; and a conductive layer in this order in a thickness direction. The conductive layer includes a terminal portion, and a tail line portion extending from the terminal portion. The terminal portion has a via portion that penetrates the insulating layer in the thickness direction and is connected to the metal supporting board. The tail line portion has a base end portion that has a width different from a width of the terminal portion in a direction orthogonal to the extending direction of the tail line portion and that is connected with the terminal portion; and a second via portion that penetrates the insulating layer in the thickness direction and that is connected to the metal supporting board.

IPC Classes  ?

  • H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
  • H05K 3/44 - Manufacturing insulated metal core circuits

55.

COMPOSITIONS AND METHODS FOR NANOPARTICLE LYOPHILE FORMS

      
Application Number 18346115
Status Pending
Filing Date 2023-06-30
First Publication Date 2024-01-04
Owner Nitto Denko Corporation (Japan)
Inventor
  • Adami, Roger
  • Wang, Yuwei
  • Yin, Haiqing
  • Wang, Liping
  • Liu, Dong
  • Ying, Wenbin

Abstract

Compositions for making a solid lyophile of one or more nucleic acid active agents, which can be reconstituted as a drug product. The composition can include an aqueous suspension of lipid nanoparticles in a pharmaceutically acceptable solution, wherein the lipid nanoparticles encapsulate one or more nucleic acid active agents, a dextrin compound, and a saccharide compound. The nucleic acid active agents can be RNAi molecules capable of mediating RNA interference, as well as other RNAs and oligonucleotides.

IPC Classes  ?

  • A61K 9/19 - Particulate form, e.g. powders lyophilised
  • C12N 15/11 - DNA or RNA fragments; Modified forms thereof
  • A61K 47/26 - Carbohydrates, e.g. sugar alcohols, amino sugars, nucleic acids, mono-, di- or oligo-saccharides; Derivatives thereof, e.g. polysorbates, sorbitan fatty acid esters or glycyrrhizin
  • A61K 47/36 - Polysaccharides; Derivatives thereof, e.g. gums, starch, alginate, dextrin, hyaluronic acid, chitosan, inulin, agar or pectin
  • A61K 47/40 - Cyclodextrins; Derivatives thereof
  • A61K 9/127 - Liposomes
  • A61K 9/51 - Nanocapsules
  • A61K 31/713 - Double-stranded nucleic acids or oligonucleotides
  • A61K 9/14 - Particulate form, e.g. powders
  • C12N 15/113 - Non-coding nucleic acids modulating the expression of genes, e.g. antisense oligonucleotides

56.

RESIN FOR PRESSURE-SENSITIVE ADHESIVE SHEETS AND PRESSURE-SENSITIVE ADHESIVE SHEET

      
Application Number 18034486
Status Pending
Filing Date 2021-10-26
First Publication Date 2023-12-28
Owner NITTO DENKO CORPORATION (Japan)
Inventor Hirano, Keisuke

Abstract

Provided is a resin for PSA sheet that has adhesive reliability such that it does not peel off or shift out of place even when applied to a flexible adherend, an adherend with brittle surface or an adherend with low strength; and that can be peeled off without adherend damage during removal. The PSA sheet resin provided has a storage modulus at 25° C. in the range of 10 MPa to 500 MPa, a storage modulus at 37° C. in the range of 0.5 MPa to 20 MPa, and a surface hardness at 37° C. in the range of 0.1 MPa to 2 MPa.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]

57.

FLUORINE RESIN FILM, MOLDED RUBBER BODY, AND METHOD FOR MANUFACTURING MOLDED RUBBER BODY

      
Application Number 18034977
Status Pending
Filing Date 2021-08-05
First Publication Date 2023-12-28
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kuroki, Yuta
  • Ueda, Narumi
  • Akiba, Kurato
  • Fujiwara, Keiko

Abstract

A fluorine resin film to be provided includes a fluorine resin, wherein the fluorine resin film has an average value of 1200% or more of a tensile elongation at break in a first direction and a tensile elongation at break in a second direction under a 180° C. atmosphere, the first direction and the second direction being in-plane directions and orthogonal to each other. This fluorine resin film can be used as a coating film for coating the surface of a rubber-containing substrate included in a molded rubber body and is suitable for manufacturing a molded rubber body having a surface coated with the film.

IPC Classes  ?

58.

LIVING BODY SENSOR

      
Application Number 18037394
Status Pending
Filing Date 2021-11-15
First Publication Date 2023-12-28
Owner NITTO DENKO CORPORATION (Japan)
Inventor Minakata, Masayuki

Abstract

A living body sensor according to the present invention is a living body sensor configured to be attached to a living body and obtain a biological signal. The living body sensor includes a housing; a base provided on a living body side of the housing; and an electrode provided at a surface of the base on the living body side. A breaking elongation percentage of the base is 30% to 500%, and a coefficient of static friction of the electrode is 3.0 to 7.0.

IPC Classes  ?

  • A61B 5/257 - Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes
  • A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons

59.

IMPROVED TRANSPARENCY OF POLYMER WALLED DEVICES AND METHODS OF MAKING THE SAME

      
Application Number 18037910
Status Pending
Filing Date 2021-11-17
First Publication Date 2023-12-28
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Popov, Piotr
  • Cramer, Neil

Abstract

A liquid crystal based switchable light modulating device comprising polymer wall structure with improved transparency is disclosed.

IPC Classes  ?

  • G02F 1/1333 - Constructional arrangements
  • G02F 1/137 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering
  • G02F 1/1334 - Constructional arrangements based on polymer-dispersed liquid crystals, e.g. microencapsulated liquid crystals

60.

WIRING CIRCUIT BOARD

      
Application Number 18339005
Status Pending
Filing Date 2023-06-21
First Publication Date 2023-12-28
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ikeda, Takahiro
  • Ishikawa, Taketo
  • Takeda, Yuki
  • Kuwayama, Hironori
  • Yamada, Kyotaro

Abstract

A wiring circuit board includes a metal supporting board, first and second metal thin films, an insulating layer, and a conductive layer, where the resistance between the conductive layer and metal supporting board are lowered. The first metal thin film is disposed on one surface of the metal supporting board in the thickness direction, with the insulating layer having a through hole. The second metal thin film is disposed on one surface of the insulating layer in the thickness direction with the conductive layer disposed thereon. In the through hole, the first and second metal thin films, whose surfaces contact, are disposed between the metal supporting board and the conductive layer, and the other surface of the first metal thin film is in contact with the one surface of the metal supporting board. The other surface of the second metal thin film is in contact with the conductive layer.

IPC Classes  ?

  • H05K 1/03 - Use of materials for the substrate
  • H05K 3/46 - Manufacturing multi-layer circuits

61.

LAMINATED FILM, METHOD FOR PRODUCING SECOND LAMINATED FILM, AND METHOD FOR PRODUCING STRAIN SENSOR

      
Application Number 18251270
Status Pending
Filing Date 2021-10-28
First Publication Date 2023-12-21
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Nishimori, Toshimasa
  • Nakajima, Kazuhiro
  • Nashiki, Tomotake
  • Niwa, Eiji

Abstract

A laminated film includes an insulating substrate resin film and a resistance layer in order in a thickness direction. The resistance layer includes chromium nitride. A temperature coefficient of resistance of the resistance layer is −400 ppm/° C. or more and −200 ppm/° C. or less.

IPC Classes  ?

  • G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
  • C23C 14/06 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
  • C23C 14/34 - Sputtering
  • C23C 14/58 - After-treatment

62.

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD

      
Application Number 18330058
Status Pending
Filing Date 2023-06-06
First Publication Date 2023-12-21
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ikeda, Takahiro
  • Yamada, Kyotaro
  • Ishikawa, Taketo
  • Kuwayama, Hironori
  • Takeda, Yuki

Abstract

A wiring circuit board includes a metal supporting layer, a first metal thin film, an insulating layer including a through hole, a second metal thin film disposed on the first metal thin film in the through hole, and a conductive pattern electrically connected to the metal supporting layer through the first metal thin film and the second metal thin film in the through hole. The first metal thin film includes an oxide coating at least on a contact surface in contact with the insulating layer. In the central part of the through hole, the oxide coating has a thickness of 0 or a thickness smaller than a thickness of the oxide coating on the contact surface.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H05K 1/05 - Insulated metal substrate
  • H05K 1/09 - Use of materials for the metallic pattern
  • H05K 3/46 - Manufacturing multi-layer circuits
  • H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

63.

ELECTROMAGNETIC SHIELD

      
Application Number 18209771
Status Pending
Filing Date 2023-06-14
First Publication Date 2023-12-21
Owner NITTO DENKO CORPORATION (Japan)
Inventor Matsuzaki, Yuya

Abstract

An electromagnetic shield 1a has a first surface 11 and a second surface 12. The electromagnetic shield 1a includes a dielectric. The first surface 11 is a surface configured to allow an electromagnetic wave to be incident on the first surface 11. The second surface 12 is a surface configured to allow at least a portion of the electromagnetic wave incident on the first surface to emerge from the second surface 12. When an electromagnetic wave WEM is transmitted to be incident on the first surface at incident angles of 45°, 60°, and 75°, the electromagnetic shield 1a satisfies at least one requirement selected from the group consisting of (I-1), (I-2), and (I-3) below. An electromagnetic shield 1a has a first surface 11 and a second surface 12. The electromagnetic shield 1a includes a dielectric. The first surface 11 is a surface configured to allow an electromagnetic wave to be incident on the first surface 11. The second surface 12 is a surface configured to allow at least a portion of the electromagnetic wave incident on the first surface to emerge from the second surface 12. When an electromagnetic wave WEM is transmitted to be incident on the first surface at incident angles of 45°, 60°, and 75°, the electromagnetic shield 1a satisfies at least one requirement selected from the group consisting of (I-1), (I-2), and (I-3) below. 10 Log|PR45/PT45|≥5.0[dB]  (I-1) An electromagnetic shield 1a has a first surface 11 and a second surface 12. The electromagnetic shield 1a includes a dielectric. The first surface 11 is a surface configured to allow an electromagnetic wave to be incident on the first surface 11. The second surface 12 is a surface configured to allow at least a portion of the electromagnetic wave incident on the first surface to emerge from the second surface 12. When an electromagnetic wave WEM is transmitted to be incident on the first surface at incident angles of 45°, 60°, and 75°, the electromagnetic shield 1a satisfies at least one requirement selected from the group consisting of (I-1), (I-2), and (I-3) below. 10 Log|PR45/PT45|≥5.0[dB]  (I-1) 10 Log|PR60/PT60|≥5.0[dB]  (I-2) An electromagnetic shield 1a has a first surface 11 and a second surface 12. The electromagnetic shield 1a includes a dielectric. The first surface 11 is a surface configured to allow an electromagnetic wave to be incident on the first surface 11. The second surface 12 is a surface configured to allow at least a portion of the electromagnetic wave incident on the first surface to emerge from the second surface 12. When an electromagnetic wave WEM is transmitted to be incident on the first surface at incident angles of 45°, 60°, and 75°, the electromagnetic shield 1a satisfies at least one requirement selected from the group consisting of (I-1), (I-2), and (I-3) below. 10 Log|PR45/PT45|≥5.0[dB]  (I-1) 10 Log|PR60/PT60|≥5.0[dB]  (I-2) 10 Log|PR75/PT75|≥5.0[dB]  (I-3)

IPC Classes  ?

  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

64.

GLASS FILM-RESIN COMPOSITE

      
Application Number 18239071
Status Pending
Filing Date 2023-08-28
First Publication Date 2023-12-21
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Murashige, Takeshi
  • Inagaki, Junichi
  • Hosokawa, Kazuhito
  • Nakai, Kota
  • Kanno, Toshihiro

Abstract

Provided is a glass film-resin composite which makes it possible to obtain a long-length (e.g., 500 m or more-long) glass roll. The glass film-resin composite comprises a glass film, and a resin tape laminated to at least one surface of the glass film through an adhesive, wherein the width 1 (mm) of the resin tape satisfies the following formula (1). Provided is a glass film-resin composite which makes it possible to obtain a long-length (e.g., 500 m or more-long) glass roll. The glass film-resin composite comprises a glass film, and a resin tape laminated to at least one surface of the glass film through an adhesive, wherein the width 1 (mm) of the resin tape satisfies the following formula (1). l ≡ a ⁢ E g ⁢ t g E p ⁢ t p ( 1 ) Provided is a glass film-resin composite which makes it possible to obtain a long-length (e.g., 500 m or more-long) glass roll. The glass film-resin composite comprises a glass film, and a resin tape laminated to at least one surface of the glass film through an adhesive, wherein the width 1 (mm) of the resin tape satisfies the following formula (1). l ≡ a ⁢ E g ⁢ t g E p ⁢ t p ( 1 ) (where: a represents a reinforcement coefficient (mm*(μm)1/2) which is 1.10 or more; Eg represents the Young's modulus (GPa) of the glass film; Ep represents the Young's modulus (GPa) of the resin tape; tg represents the thickness (μm) of the glass film; and tp represents the thickness (μm) of the resin tape.)

IPC Classes  ?

  • B32B 3/14 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a face layer formed of separate pieces of material
  • B32B 7/14 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
  • B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • C03B 40/033 - Means for preventing adhesion between glass and glass
  • C03C 17/32 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
  • C09J 201/00 - Adhesives based on unspecified macromolecular compounds

65.

LAMINATED SHEET

      
Application Number 18455359
Status Pending
Filing Date 2023-08-24
First Publication Date 2023-12-21
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Furukawa, Yoshihiro
  • Okumura, Keisuke

Abstract

A laminated sheet includes a sheet-shaped inductor including a plurality of wirings and a magnetic layer embedding the plurality of wirings, and a processing stability layer disposed on at least one surface in a thickness direction of the inductor. The magnetic layer includes a binder and a magnetic particle having a generally flat shape and whose material is a metal. The processing stability layer includes a cured product of a thermosetting resin composition. The thermosetting resin composition includes a thermosetting resin as an essential component. The thermosetting resin composition includes at least one kind of particle, as an optical component, selected from the group consisting of a first particle having a generally spherical shape and a second particle having a generally flat shape and whose material is an inorganic compound.

IPC Classes  ?

  • H01F 17/04 - Fixed inductances of the signal type with magnetic core
  • H01F 1/26 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
  • H01F 27/255 - Magnetic cores made from particles
  • B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
  • B32B 7/025 - Electric or magnetic properties

66.

THREADLIKE ADHESIVE BODY AND METHOD FOR PRODUCING THREADLIKE ADHESIVE BODY

      
Application Number 18246999
Status Pending
Filing Date 2021-09-27
First Publication Date 2023-12-14
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Morishita, Hiromitsu
  • Takashima, Atsushi

Abstract

An object of the present invention is to provide a threadlike adhesive body having high impact resistance. The present invention relates to a threadlike adhesive body including a core material having a plurality of filaments and an adhesive, in which the adhesive covers the core material, the core material is impregnated with the adhesive, and the threadlike adhesive body contains 1 vol % to 55 vol % of voids.

IPC Classes  ?

  • C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]

67.

METHOD FOR CONSTRUCTING LIGHT TRANSMISSION SYSTEM, AND ON-SITE CONSTRUCTION SET

      
Application Number 18251375
Status Pending
Filing Date 2021-11-01
First Publication Date 2023-12-14
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tsuda, Koichi
  • Shimizu, Yusuke

Abstract

A method for constructing a plastic optical fiber includes a first step of cutting the plastic optical fiber at a construction site to form end faces of the plastic optical fiber; and a second step of connecting the end faces to wavelength multiplexing optical extenders without polishing the end faces at the same construction site.

IPC Classes  ?

  • G02B 6/25 - Preparing the ends of light guides for coupling, e.g. cutting

68.

MAGNETIC SHEET AND INDUCTOR

      
Application Number 18252145
Status Pending
Filing Date 2021-11-11
First Publication Date 2023-12-14
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Senda, Hiroki
  • Okumura, Keisuke
  • Furukawa, Yoshihiro

Abstract

A magnetic sheet has a first principal surface and a second principal surface facing each other in the thickness direction. The magnetic sheet contains magnetic particles and resin. The ratio of the total amount of carbon and oxygen on one of the first principal surface and second principal surface is 10 mass % or more and 60 mass % or less.

IPC Classes  ?

  • H01F 1/26 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
  • H01F 17/04 - Fixed inductances of the signal type with magnetic core

69.

CONSTRUCTION KIT, HYBRID CABLE CONSTRUCTION STRUCTURE, AND HYBRID CABLE CONSTRUCTION METHOD

      
Application Number 18250712
Status Pending
Filing Date 2021-10-27
First Publication Date 2023-12-07
Owner NITTO DENKO CORPORATION (Japan)
Inventor Tsuda, Koichi

Abstract

A construction kit is used for constructing a hybrid cable including an optical fiber, and a plurality of wires disposed in the circumferential direction around the optical fiber. Each of the wires includes a lead wire and a coating layer that coats the lead wire. The construction kit includes a first round hole into which the optical fiber can be inserted; a first member including receiving portions capable of receiving the wires, and a second member capable of being disposed outside the first member. A plurality of receiving portions is disposed in the circumferential direction around the first round hole. The second member is capable of pressurizing the wires toward the first round hole while the receiving portions receive the wires. The second member includes a plurality of pressure terminals having conductivity.

IPC Classes  ?

  • H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
  • H01B 11/22 - Cables including at least one electrical conductor together with optical fibres

70.

PEELING METHOD

      
Application Number 18032446
Status Pending
Filing Date 2021-10-13
First Publication Date 2023-12-07
Owner NITTO DENKO CORPORATION (Japan)
Inventor Shimizu, Yosuke

Abstract

The present invention is a method for peeling an adherend from a pressure-sensitive adhesive layer by irradiating a laminate in which the pressure-sensitive adhesive layer and the adherend are laminated with light, the peeling method includes a step of irradiating the pressure-sensitive adhesive layer with the light having a pulse width of 1 second or less and a light irradiation amount of 1,000 mJ/cm2 or more, and the pressure-sensitive adhesive layer satisfies predetermined conditions in terms of a minimum transmittance in a near-infrared region of a wavelength of 800 nm to 2,500 nm and a maximum transmittance in a visible light region of a wavelength of 380 nm to 780 nm.

IPC Classes  ?

  • C09J 5/00 - Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 11/06 - Non-macromolecular additives organic
  • B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor

71.

FILTER PLEAT PACK AND AIR FILTER UNIT

      
Application Number 18033113
Status Pending
Filing Date 2021-10-27
First Publication Date 2023-12-07
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Masaki, Shunsuke
  • Ikemura, Yusuke
  • Mori, Masaaki

Abstract

A filter pleat pack includes an air filter medium including: a first porous fluorine resin membrane; and a first air-permeable supporting layer. The first air-permeable supporting layer is placed on a downstream side in a direction of an air flow that passes through the filter medium with respect to the first porous fluorine resin membrane, and includes a ventilation inhibiting portion in at least one end portion in a width direction, the ventilation inhibiting portion extending along the at least one end portion, the ventilation inhibiting portion inhibiting ventilation in the width direction through the first air-permeable supporting layer. The ventilation inhibiting portion is in contact with the first porous fluorine resin membrane. This filter pleat pack is suitable for reducing a decrease in the collection efficiency of an air filter unit even when a gap between a lateral surface of the pleat pack and a frame is sealed.

IPC Classes  ?

  • B01D 46/52 - Particle separators, e.g. dust precipitators, using filters embodying folded material
  • B01D 46/54 - Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms
  • B01D 39/16 - Other self-supporting filtering material of organic material, e.g. synthetic fibres
  • B01D 46/00 - Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
  • B01D 71/36 - Polytetrafluoroethene

72.

LAMINATE

      
Application Number 18035325
Status Pending
Filing Date 2022-08-04
First Publication Date 2023-12-07
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Fujino, Nozomi
  • Karasuda, Taisuke

Abstract

A laminate (1) includes an underlayer (3) and a crystalline transparent electrically conductive layer (4) adjacent to a one surface (31) in a thickness direction of the underlayer (3). The underlayer (3) includes a resin. A one surface (41) in the thickness direction of the transparent electrically conductive layer (4) includes a first ridge (42) having a height of 3 nm or more. The one surface (31) of the underlayer (3) may include a second ridge (32) having a height of 3 nm or more, and the second ridge (32) is not overlapped with the first ridge (42) when projected in the thickness direction.

IPC Classes  ?

73.

DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET

      
Application Number 18314191
Status Pending
Filing Date 2023-05-09
First Publication Date 2023-11-30
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yamamoto, Shuhei
  • Sawamura, Amane

Abstract

The double-sided pressure-sensitive adhesive sheet of the present invention includes a substrate film, a first pressure-sensitive adhesive layer, a second pressure-sensitive adhesive layer, and a release liner. The substrate film has a first surface and a second surface opposite the first surface. The first pressure-sensitive adhesive layer is disposed on the first surface, and has a first adhesive surface opposite the substrate film. The second pressure-sensitive adhesive layer is formed from a coating film of the pressure-sensitive adhesive composition applied on the second surface, and has a second adhesive surface opposite the substrate film. The release liner is in releasable contact with the first adhesive surface. The emission amount of toluene and ethyl acetate from the first pressure-sensitive adhesive layer on heating at 80° C. for 30 minutes is 10 μg/g or less.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 7/40 - Adhesives in the form of films or foils characterised by release liners
  • C09J 7/29 - Laminated material

74.

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

      
Application Number 18323131
Status Pending
Filing Date 2023-05-24
First Publication Date 2023-11-30
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kinoshita, Kazutoshi
  • Takakura, Hayato
  • Sasaoka, Ryosuke

Abstract

Provided is a method for producing a wiring circuit board having excellent transportability. The method for producing a wiring circuit board includes a first step to a third step. In the first step, an assembly sheet is overlapped with a supporting sheet in a thickness direction. The assembly sheet includes a plurality of wiring circuit boards and a supporting portion supporting the plurality of wiring circuit boards. The supporting portion supports the assembly sheet. In the second step, the plurality of wiring circuit boards are separated from the supporting portion by cutting. In the third step, the assembly sheet including the plurality of wiring circuit boards separated from the supporting portion is conveyed, while being supported by the supporting sheet.

IPC Classes  ?

  • H05K 1/14 - Structural association of two or more printed circuits
  • H05K 1/03 - Use of materials for the substrate
  • H05K 1/05 - Insulated metal substrate
  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits

75.

METHOD OF PRODUCING DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET AND DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET

      
Application Number 18314201
Status Pending
Filing Date 2023-05-09
First Publication Date 2023-11-30
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yamamoto, Shuhei
  • Sawamura, Amane

Abstract

A method of producing a double-sided pressure-sensitive adhesive sheet includes a step of applying a water-dispersed pressure-sensitive adhesive composition onto a release liner to form a coating film, a step of drying the coating film by heating to form a pressure-sensitive adhesive layer, a step of bonding a first surface of a substrate film to an exposed surface of the pressure-sensitive adhesive layer, a step of applying a water-dispersed pressure-sensitive adhesive composition onto a second surface of the substrate film to form a coating film, and a step of drying the coating film by heating to form a pressure-sensitive adhesive layer. A double-sided pressure-sensitive adhesive sheet includes the substrate film with a thickness of 12 μm or less, the first pressure-sensitive adhesive layer on the first surface formed from the water-dispersed pressure-sensitive adhesive composition, the second pressure-sensitive adhesive layer on the second surface formed from the water-dispersed pressure-sensitive adhesive composition, and the release liner in releasable contact with an adhesive surface of the pressure-sensitive adhesive layer.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]

76.

AIR FILTER MEDIUM, FILTER PLEAT PACK, AND AIR FILTER UNIT

      
Application Number 18027699
Status Pending
Filing Date 2021-09-28
First Publication Date 2023-11-23
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Ikemura, Yusuke
  • Mori, Masaaki
  • Masaki, Shunsuke
  • Sato, Go

Abstract

An air filter medium includes a collection layer, an air-permeable adhesive layer, and a porous fluorine resin membrane in this order from upstream to downstream of the filter medium. An initial pressure drop of the filter medium at a permeate flow rate of 5.3 cm/sec is 250 Pa or less. When a test is performed in which polydisperse polyalphaolefin particles having a peak in number in a particle size range of 0.1 to 0.2 μm are allowed to pass through the filter medium at a concentration of 0.2 to 0.5 g/m3 and a linear velocity of 5.3 cm/sec, the holding amount is 43.0 g/m2 or more from a moment when the holding amount reaches 20 g/m2 to when a moment the pressure drop reaches PD1+120 Pa, where PD1 is the pressure drop of the filter medium at the moment when the holding amount reaches 20 g/m2.

IPC Classes  ?

  • B01D 46/62 - Filters or filtering processes specially modified for separating dispersed particles from gases or vapours with multiple filtering elements, characterised by their mutual disposition connected in series
  • B01D 71/36 - Polytetrafluoroethene
  • B01D 39/16 - Other self-supporting filtering material of organic material, e.g. synthetic fibres
  • B01D 46/10 - Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
  • B01D 46/52 - Particle separators, e.g. dust precipitators, using filters embodying folded material
  • B01D 39/20 - Other self-supporting filtering material of inorganic material, e.g. asbestos paper or metallic filtering material of non-woven wires
  • B01D 46/54 - Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms

77.

WIRING CIRCUIT BOARD

      
Application Number 18315878
Status Pending
Filing Date 2023-05-11
First Publication Date 2023-11-23
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Matsui, Hideki
  • Shibata, Naoki
  • Sasaoka, Ryosuke

Abstract

Provided is a wiring circuit board capable of suppressing peeling of a terminal from an insulating layer. The wiring circuit board includes a base insulating layer, and a conductive pattern disposed on one surface of the base insulating layer in a thickness direction. The conductive pattern includes a wiring and a terminal. The terminal protrudes from one end edge of the wiring. The terminal includes a first terminal layer and a second terminal layer. A ratio (Y/X) of the volume Y of the wiring in a folded region with respect to the volume X of the terminal is 0.1 or more. The folded region is a region when a region of the terminal when viewed in the thickness direction is folded back toward the opposite side in a protruding direction of the terminal with the one end edge of the wiring as a starting point.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

78.

AIR FILTER MEDIUM, FILTER PLEAT PACK, AND AIR FILTER UNIT

      
Application Number 18027455
Status Pending
Filing Date 2021-09-28
First Publication Date 2023-11-16
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Sato, Go
  • Mori, Masaaki
  • Masaki, Shunsuke
  • Ikemura, Yusuke

Abstract

A provided air filter medium is an air filter medium including a porous fluorine resin membrane, the air filter medium further including: a glass filter medium layer. The glass filter medium layer and the porous fluorine resin membrane are placed in this order from upstream to downstream of the air filter medium configured to allow an air flow to pass through the air filter medium. At a surface of the glass filter medium layer on an upstream side in a direction of the air flow, a carbon-to-silicon ratio (C/Si) evaluated by X-ray fluorescent analysis is 0.020 or more. This air filter medium is suitable for reducing a pressure drop increase even in an environment including liquid particles such as oil mist.

IPC Classes  ?

  • B01D 46/54 - Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms
  • B01D 39/20 - Other self-supporting filtering material of inorganic material, e.g. asbestos paper or metallic filtering material of non-woven wires
  • B01D 39/16 - Other self-supporting filtering material of organic material, e.g. synthetic fibres
  • B01D 46/52 - Particle separators, e.g. dust precipitators, using filters embodying folded material
  • B01D 71/36 - Polytetrafluoroethene

79.

RESIN FIBER FORMATION NOZZLE, RESIN FIBER MANUFACTURING APPARATUS, AND RESIN FIBER MANUFACTURING METHOD

      
Application Number 18029146
Status Pending
Filing Date 2021-09-13
First Publication Date 2023-11-16
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Michihira, Hajime
  • Okumura, Teppei
  • Kumano, Takashi
  • Nagaya, Yuto

Abstract

A resin fiber formation nozzle 20 of the present invention is a nozzle configured to discharge a molten resin material into a fiber shape. The nozzle 20 includes: the internal flow path 21; an inlet 22 that allows the resin material to flow into the internal flow path 21; and an outlet 23 that allows the resin material to be discharged from the internal flow path 21 to an outside of the nozzle 20. The internal flow path 21 is shaped such that a diameter of the internal flow path 21 decreases continuously, in a section from a position A 5 mm upstream in the internal flow path 21 from the outlet 23 to a position B of the outlet 23, from the position A toward the position B.

IPC Classes  ?

  • B29C 48/05 - Filamentary, e.g. strands
  • B29C 48/30 - Extrusion nozzles or dies
  • B29C 48/21 - Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces
  • B29C 48/885 - External treatment, e.g. by using air rings for cooling tubular films
  • B29C 48/793 - Thermal treatment of the extrusion moulding material or of preformed parts or layers, e.g. by heating or cooling upstream of the plasticising zone, e.g. heating in the hopper

80.

COMPOSITE MATERIAL, PREFORM FOR COMPOSITE MATERIAL, AND METHOD FOR MANUFACTURING COMPOSITE MATERIAL

      
Application Number 18013653
Status Pending
Filing Date 2021-06-28
First Publication Date 2023-11-09
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Mimura, Takanobu
  • Otsuka, Tetsuya

Abstract

A composite material includes a matrix and a heat-conductive fiber. The matrix includes an organic polymer and forms a porous structure. The heat-conductive fiber is fixed in the porous structure by the matrix. A heat conductivity determined at ordinary temperature by a steady state heat flow method in a fiber axis direction of the heat-conductive fiber is 10 W/(m·K) or more. A density d [g/cm3] of the composite material and a heat conductivity λ [W/(m·K)] in a given direction of the composite material satisfy requirements d≤1.1, λ>1, and 4≤λ/d≤100.

IPC Classes  ?

  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
  • C08J 9/32 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
  • C08J 9/36 - After-treatment
  • C08K 7/02 - Fibres or whiskers
  • B29C 70/88 - Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced

81.

ELECTROMAGNETIC WAVE ABSORBER AND ELECTROMAGNETIC WAVE ABSORBER-ATTACHED MOLDED ARTICLE

      
Application Number 18224730
Status Pending
Filing Date 2023-07-21
First Publication Date 2023-11-09
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yamagata, Kazuto
  • Machinaga, Hironobu
  • Ueda, Eri
  • Ukei, Hiroichi
  • Ui, Takehiro

Abstract

An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrically conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrically conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) has a sheet resistance of 200 to 600 Ω/□. When the resistive layer (20) is subjected to an immersion treatment in which the resistive layer (20) is immersed in a 5 weight % aqueous solution of NaOH for 5 minutes, an absolute value of a difference between a sheet resistance of the resistive layer (20) before the immersion treatment and a sheet resistance of the resistive layer (20) after the immersion treatment is less than 100 Ω/□.

IPC Classes  ?

  • B32B 7/025 - Electric or magnetic properties
  • B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • C23C 14/08 - Oxides
  • C23C 14/35 - Sputtering by application of a magnetic field, e.g. magnetron sputtering
  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

82.

ACTIVE NOISE CONTROL SYSTEM

      
Application Number 18245287
Status Pending
Filing Date 2021-08-05
First Publication Date 2023-11-09
Owner
  • NITTO DENKO CORPORATION (Japan)
  • THE SCHOOL CORPORATION KANSAI UNIVERSITY (Japan)
Inventor
  • Oto, Kohei
  • Komoto, Yusuke
  • Kajikawa, Yoshinobu
  • Makiyama, Yusuke

Abstract

An active noise control system (500) includes a structure (80) and a plurality of piezoelectric speakers (10). The piezoelectric speakers (10) are disposed on a surface (80s) of the structure (80). The piezoelectric speakers (10) each have a radiation surface extending along a first direction (D1) and a second direction (D2). The first direction (D1) is a direction along which centers of the radiation surfaces of the piezoelectric speakers (10) are arranged so that the piezoelectric speakers (10) are adjacent to each other. The second direction (D2) is a direction orthogonal to the first direction (D1). The radiation surface of each of the piezoelectric speakers (10) is shorter in a dimension (L1) in the first direction (D1) than in a dimension (L2) in the second direction (D2).

IPC Classes  ?

  • G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
  • H04R 17/00 - Piezoelectric transducers; Electrostrictive transducers
  • H04R 1/02 - Casings; Cabinets; Mountings therein

83.

LIGHTING DEVICE

      
Application Number 18017494
Status Pending
Filing Date 2021-07-16
First Publication Date 2023-11-09
Owner Nitto Denko Corporation (Japan)
Inventor
  • Nakamura, Kozo
  • Weng, Yufeng
  • Yoshikawa, Takahiro

Abstract

A lighting device that can ensure task productivity while reducing the glare is provided herein. The lighting device has a light source; and a light guiding part including a light guiding panel and configured to guide light that is emitted from the light source. The light guiding panel includes: a light incident end surface that is situated facing the light source, the light incident end surface being a surface on which the light emitted from the light source is incident; a first light emitting part that is included in an opposite end from the light incident end surface, and that emits the light guided inside the light guiding panel; and a second light emitting part that is included in a predetermined main surface of the light guiding panel that intersects with the light incident end surface, and that emits the light guided inside the light guiding panel.

IPC Classes  ?

  • F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems

84.

AIR FILTER MEDIUM, FILTER PLEAT PACK, AND AIR FILTER UNIT

      
Application Number 18027453
Status Pending
Filing Date 2021-09-28
First Publication Date 2023-11-09
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Mori, Masaaki
  • Sato, Go
  • Masaki, Shunsuke
  • Ikemura, Yusuke

Abstract

An air filter medium includes a porous fluorine resin membrane, and further includes, a collection layer, an air-permeable adhesive layer, and an air-permeable supporting layer. The collection layer, the air-permeable adhesive layer, the air-permeable supporting layer, and the porous fluorine resin membrane are placed in this order from upstream to downstream of the air filter medium configured to allow an air flow to pass through the air filter medium. The collection layer is formed of a fibrous material having an average fiber diameter of 5 µm or less. The air-permeable adhesive layer has a grammage of 5.5 g/m2 or more. The air-permeable supporting layer is formed of a fibrous material having an average fiber diameter of more than 5 µm. This air filter medium is suitable for reducing a pressure drop increase even in an environment including liquid particles such as oil mist.

IPC Classes  ?

  • B01D 39/20 - Other self-supporting filtering material of inorganic material, e.g. asbestos paper or metallic filtering material of non-woven wires
  • B01D 71/36 - Polytetrafluoroethene
  • B01D 63/14 - Pleat-type membrane modules

85.

FORMATE PRODUCTION METHOD, FORMIC ACID PRODUCTION METHOD, CATALYST FOR PRODUCING FORMATE, AND RUTHENIUM COMPLEX

      
Application Number 18043960
Status Pending
Filing Date 2021-08-30
First Publication Date 2023-11-09
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Matsuda, Hirokazu
  • Fuoka, Daisuke
  • Hirano, Makoto
  • Pidko, Evgeny Alexandrovich
  • Filonenko, Georgy Alexandrovich
  • Rebreyend, Christophe

Abstract

The invention relates to a method for producing a formate, the method including reacting hydrogen with carbon dioxide, a hydrogen carbonate or a carbonate using a catalyst in the presence of a solvent, wherein the reaction is a two-phase system in which an organic solvent and an aqueous solvent are present in a separated state in the solvent, and the catalyst is at least one selected from a ruthenium complex represented by the formula (1) in the specification, a tautomer or stereoisomer thereof, and a salt compound of the complex, tautomer or stereoisomer.

IPC Classes  ?

  • C07C 51/15 - Preparation of carboxylic acids or their salts, halides, or anhydrides by reaction of organic compounds with carbon dioxide, e.g. Kolbe-Schmitt synthesis
  • B01J 31/24 - Phosphines

86.

SEPARATION MEMBRANE, SEPARATION MEMBRANE MANUFACTURING METHOD, AND COATING LIQUID FOR MANUFACTURING SEPARATION MEMBRANE

      
Application Number 18026503
Status Pending
Filing Date 2021-08-02
First Publication Date 2023-11-02
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yoshimura, Kazuya
  • Kimura, Naomichi
  • Nishiyama, Shinya

Abstract

The present invention provides a separation membrane having high separation performance in terms of a gas mixture containing an acid gas. A separation membrane 10 of the present invention includes a separation functional layer 1 including: graphene oxide; an ionic liquid; and a polymer. The ionic liquid is, for example, hydrophilic and contains an imidazolium ion and tetrafluoroborate. A method for manufacturing the separation membrane 10 of the present invention includes: applying a coating liquid containing the graphene oxide, the ionic liquid, and the polymer to a substrate to obtain a coating film; and drying the coating film.

IPC Classes  ?

  • B01D 53/22 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by diffusion
  • B01D 71/02 - Inorganic material
  • B01D 71/80 - Block polymers
  • B01D 67/00 - Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
  • B01D 63/10 - Spiral-wound membrane modules

87.

BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE

      
Application Number 17914436
Status Pending
Filing Date 2021-03-29
First Publication Date 2023-11-02
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yoshikawa, Takahiro
  • Hattori, Daisuke
  • Morishima, Ryota
  • Kishi, Atsushi

Abstract

A backlight unit includes: a light source; a light guide plate arranged to face the light source, having an end surface that light from the light source enters; and an emitting surface from which the entered light is emitted; a reflective plate bonded to a back surface side of the light guide plate via a double-sided pressure-sensitive adhesive film; and a casing having a front portion and a back portion, the casing configured to store the light source, the light guide plate, and the reflective plate. The backlight unit is configured so that light from the light source is free from entering a space between the low-refractive index layer and the reflective plate, or so that light that has entered the space between the low-refractive index layer and the reflective plate from a light source is free from being emitted from the emitting surface of the light guide plate.

IPC Classes  ?

  • F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems

88.

FIBER MANUFACTURING METHOD

      
Application Number 18025741
Status Pending
Filing Date 2021-06-04
First Publication Date 2023-11-02
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Michihira, Hajime
  • Kumano, Takashi
  • Takagi, Tetsuya
  • Nagaya, Yuto

Abstract

The present invention provides a fiber manufacturing method suitable for reducing the variation in outer diameter. The fiber manufacturing method of an embodiment of the present invention includes: discharging a softened linear body 1 through a nozzle 10; and winding the linear body 1 so that the linear body 1 passes through a cooling portion 20 supplied with a cooling fluid 50, thereby obtaining a fiber 5. The cooling portion 20 has a filter 40 configured to rectify the cooling fluid 50. The cooling fluid 50 in the cooling portion 20 has a temperature that is substantially constant in a moving direction of the linear body 1. According to the fiber manufacturing method of the embodiment, an index M determined by the following equation (I) is 1.52 or less. The present invention provides a fiber manufacturing method suitable for reducing the variation in outer diameter. The fiber manufacturing method of an embodiment of the present invention includes: discharging a softened linear body 1 through a nozzle 10; and winding the linear body 1 so that the linear body 1 passes through a cooling portion 20 supplied with a cooling fluid 50, thereby obtaining a fiber 5. The cooling portion 20 has a filter 40 configured to rectify the cooling fluid 50. The cooling fluid 50 in the cooling portion 20 has a temperature that is substantially constant in a moving direction of the linear body 1. According to the fiber manufacturing method of the embodiment, an index M determined by the following equation (I) is 1.52 or less. M − = K π Q a L 1 T w − T a D f D n 2 U ­­­(I)

IPC Classes  ?

  • B29D 11/00 - Producing optical elements, e.g. lenses or prisms
  • D01D 5/088 - Cooling filaments, threads or the like, leaving the spinnerettes

89.

HOT-MELT PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND HOT-MELT PRESSURE-SENSITIVE ADHESIVE SHEET

      
Application Number 17800624
Status Pending
Filing Date 2021-02-17
First Publication Date 2023-10-26
Owner NTTO DENKO CORPORATION (Japan)
Inventor
  • Negishi, Nobukazu
  • Hatanaka, Itsuhiro
  • Takahashi, Hiroaki

Abstract

Provided is a hot-melt pressure-sensitive adhesive composition which enables to form a pressure-sensitive adhesive layer without allowing the progression of rapid gelation at the time of heating and melting. The pressure-sensitive adhesive composition provided by the present invention is a solvent-free hot-melt pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition includes a base polymer, an isocyanate crosslinking agent, and a tackifier T which is a reaction product of a compound X and a compound Y. A content of the tackifier T with respect to 100 parts by weight of the base polymer is 20 parts by weight or more and 40 parts by weight or less.

IPC Classes  ?

90.

POLYMER-DISPERSED-TYPE LIQUID CRYSTAL FILM, EMULSION, AND METHOD FOR PRODUCING POLYMER-DISPERSED-TYPE LIQUID CRYSTAL FILM

      
Application Number 17916208
Status Pending
Filing Date 2021-03-29
First Publication Date 2023-10-26
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Takemoto, Hiroyuki
  • Yoshikawa, Jin
  • Otsuka, Masanori
  • Hirai, Mariko

Abstract

According to the present invention, provided is a PDLC film, which includes a PDLC layer excellent in thickness uniformity and is suppressed from causing liquid crystal leakage from the PDLC layer. A method of producing a polymer dispersed liquid crystal film of the present invention includes: applying, to a first transparent conductive film, an emulsion including a solvent, and polymer particles and liquid crystal particles dispersed in the solvent to form an applied layer; drying the applied layer to form a polymer dispersed liquid crystal layer containing a polymer matrix and the liquid crystal particles dispersed in the polymer matrix; and laminating a second transparent conductive film on the polymer dispersed liquid crystal layer, wherein the polymer particles include first polymer particles and second polymer particles, and wherein an average particle diameter of the second polymer particles is larger than an average particle diameter of the first polymer particles.

IPC Classes  ?

  • G02F 1/1334 - Constructional arrangements based on polymer-dispersed liquid crystals, e.g. microencapsulated liquid crystals
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 37/24 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate

91.

OPTO-ELECTRIC HYBRID BOARD

      
Application Number 17788955
Status Pending
Filing Date 2020-12-23
First Publication Date 2023-10-26
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tanaka, Naoyuki
  • Teraji, Seiki
  • Osuka, Koya

Abstract

An opto-electric hybrid board that sequentially includes an optical waveguide and an electric circuit boardtoward one side in a thickness direction. The electric circuit boardincludes a metal supporting layer, an insulating base layerdisposed on a one-side surface in the thickness direction of the metal supporting layer, a plurality of conductive layers sequentially disposed at one side in the thickness direction, and an intermediate insulating layerdisposed between the conductive layers . At least one layer selected from the group consisting of the metal supporting layer and the conductive layers is electrically insulated from the other layers.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements

92.

WIRING CIRCUIT BOARD ASSEMBLY SHEET

      
Application Number 17913055
Status Pending
Filing Date 2021-03-05
First Publication Date 2023-10-26
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Shibata, Shusaku
  • Shiga, Shun
  • Niino, Teppei

Abstract

An assembly sheet as a wiring circuit board assembly sheet includes a metal substrate, a wiring circuit structure portion, and a dummy structure portion. The metal substrate includes a product region and a frame region adjacent thereto. The wiring circuit structure portion is disposed on one surface in a thickness direction of the metal substrate in the product region, and includes a terminal portion. The dummy structure portion is disposed on one surface in the thickness direction of the metal substrate in the frame region, includes a plurality of conductive layers aligned in the thickness direction, and has a greater height above the metal substrate than the terminal portion.

IPC Classes  ?

  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits
  • H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
  • H05K 3/28 - Applying non-metallic protective coatings

93.

SEPARATION MEMBRANE

      
Application Number 18026556
Status Pending
Filing Date 2021-08-02
First Publication Date 2023-10-26
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Yoshimura, Kazuya
  • Shimizu, Hisae
  • Katagiri, Makoto

Abstract

The present invention provides a separation membrane suitable for separating water from a liquid mixture containing an alcohol and water, the separation membrane being capable of reducing a decrease in separation performance regardless of long-term use. A separation membrane 10 of the present invention includes a polyimide having a structural unit X represented by the following formula (1) and a structural unit Y represented by following formula (2). The present invention provides a separation membrane suitable for separating water from a liquid mixture containing an alcohol and water, the separation membrane being capable of reducing a decrease in separation performance regardless of long-term use. A separation membrane 10 of the present invention includes a polyimide having a structural unit X represented by the following formula (1) and a structural unit Y represented by following formula (2). The present invention provides a separation membrane suitable for separating water from a liquid mixture containing an alcohol and water, the separation membrane being capable of reducing a decrease in separation performance regardless of long-term use. A separation membrane 10 of the present invention includes a polyimide having a structural unit X represented by the following formula (1) and a structural unit Y represented by following formula (2). The present invention provides a separation membrane suitable for separating water from a liquid mixture containing an alcohol and water, the separation membrane being capable of reducing a decrease in separation performance regardless of long-term use. A separation membrane 10 of the present invention includes a polyimide having a structural unit X represented by the following formula (1) and a structural unit Y represented by following formula (2). A1 is a linking group including no arylene group in a main chain and having a solubility parameter, in accordance with a Fedors method, of more than 5.0 (cal/cm3)½. A2 is a tetravalent organic group including an arylene group.

IPC Classes  ?

  • B01D 71/64 - Polyimides; Polyamide-imides; Polyester-imides; Polyamide acids or similar polyimide precursors
  • B01D 61/36 - Pervaporation; Membrane distillation; Liquid permeation

94.

OPTO-ELECTRIC HYBRID BOARD, OPTICAL-ELEMENT-MOUNTED OPTO-ELECTRIC HYBRID BOARD, AND METHOD OF MANUFACTURING OPTICAL-ELEMENT-MOUNTED OPTO-ELECTRIC HYBRID BOARD

      
Application Number 18026671
Status Pending
Filing Date 2021-09-24
First Publication Date 2023-10-26
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Konegawa, Naoto
  • Ichinose, Koji
  • Teraji, Seiki
  • Osuka, Koya

Abstract

An opto-electric hybrid board capable of precisely mounting an optical element in a mirror position of an optical waveguide, there is provided an opto-electric hybrid board including: an electric circuit board having first and second surfaces and including terminals for mounting an optical element on the first surface; and an optical waveguide provided on the second surface of the electric circuit board and including a mirror for optical coupling to the optical element, wherein an alignment mark for identifying the position of an exit surface of light exiting via the mirror of the optical waveguide is formed on the first surface of the electric circuit board.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements

95.

OPTICAL MEMBER, MANUFACTURING METHOD THEREFOR, AND LIGHT DISTRIBUTION ELEMENT

      
Application Number 18028616
Status Pending
Filing Date 2021-09-24
First Publication Date 2023-10-26
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Matsuo, Naoyuki
  • Yoshikawa, Takahiro

Abstract

An optical member that functions as an optical coupling layer has a first layer having a porous structure, and a second layer contacting a first main surface of the first layer. The second layer includes a resin composition, and has a transmittance of 5% to 85% with regard to a first light that is within the wavelength range of greater than 800 nm and less than or equal to 2000 nm. The first layer includes a first region having the porous structure, and a second region in which pores of the porous structure are filled with a resin composition.

IPC Classes  ?

  • F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems

96.

OPTICAL FIBER CONNECTOR MEMBER AND METHOD OF PRODUCING THE OPTICAL FIBER CONNECTOR MEMBER

      
Application Number 18041661
Status Pending
Filing Date 2021-08-02
First Publication Date 2023-10-26
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Tsuda, Koichi
  • Fukuura, Nobuhiro
  • Shimizu, Yusuke

Abstract

An optical fiber connector member includes an optical fiber and a housing into which the optical fiber is inserted and that fixes the optical fiber. The housing includes a wedge portion that pressurizes the optical fiber only in a first direction included in diametric directions of the optical fiber.

IPC Classes  ?

  • G02B 6/38 - Mechanical coupling means having fibre to fibre mating means

97.

HIGH COLORATION SPEED SOLID-STATE ELECTROCHROMIC ELEMENT AND DEVICE

      
Application Number 18021624
Status Pending
Filing Date 2021-08-16
First Publication Date 2023-10-12
Owner NITTO DENKO CORPORATION (Japan)
Inventor Ma, Liping

Abstract

The present disclosure relates to electrochromic electrochromic elements and devices with high coloration/switching speeds. The high coloration speed electrochromic devices include an insulating layer (16), comprising an electrically insulating material with a dielectric constant of at least 10, and at least one electrochromic material (14, 18) having one or more optical properties that may be changed upon application of an electric potential. Upon provision of an electric potential above a threshold, electrons and holes may be injected into the electrochromic material and blocked by the insulating layer, resulting in an accumulation of the electrons and holes in their respective electrochromic material, which results in a change to the one or more optical properties of the electrochromic material in less than 10 seconds. An opposite electric potential may be provided to reverse the change in the one or more optical properties.

IPC Classes  ?

  • G02F 1/163 - Operation of electrochromic cells, e.g. electrodeposition cells; Circuit arrangements therefor
  • G02F 1/1524 - Transition metal compounds

98.

PRESSURE-SENSITIVE ADHESIVE SHEET, DISPLAY DEVICE AND LAMINATE

      
Application Number 18023610
Status Pending
Filing Date 2021-01-26
First Publication Date 2023-10-12
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Nishiwaki, Masataka
  • Ikami, Toshiki
  • Shimooka, Keigo

Abstract

To provide a PSA sheet capable of providing good concealment to an adherend whose surface to which the PSA sheet is applied has been processed. Provided is a PSA sheet having a PSA layer. The PSA layer has a light transmittance of 20% or lower and an L* value of 20 or higher and 70 or lower, defined in the L*a*b* color space.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • H10K 59/80 - Constructional details
  • C09J 7/10 - Adhesives in the form of films or foils without carriers
  • C09J 11/04 - Non-macromolecular additives inorganic
  • B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin

99.

PRESSURE-SENSITIVE ADHESIVE SHEET, DISPLAY DEVICE, STRUCTURE AND PRESSURE-SENSITIVE ADHESIVE SHEET WITH OPTICALLY TRANSPARENT MEMBER

      
Application Number 18023609
Status Pending
Filing Date 2021-01-26
First Publication Date 2023-10-05
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Nishiwaki, Masataka
  • Ikami, Toshiki
  • Shimooka, Keigo

Abstract

Provided is a pressure-sensitive adhesive sheet which has such light-transmitting properties that the pressure-sensitive adhesive sheet hides an adherend and the surface of the adherend can be inspected through the pressure-sensitive adhesive sheet. The pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer contains at least two colorants. The pressure-sensitive adhesive sheet has a total light transmittance of 5% or greater. The pressure-sensitive adhesive layer has a haze of 20 or greater.

IPC Classes  ?

  • C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, ; Adhesives based on derivatives of such polymers
  • B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
  • H10K 59/80 - Constructional details

100.

METHOD FOR SEPARATING JOINED OBJECT

      
Application Number 18040474
Status Pending
Filing Date 2021-07-13
First Publication Date 2023-10-05
Owner NITTO DENKO CORPORATION (Japan)
Inventor
  • Kosaka, Naofumi
  • Shimizu, Yosuke
  • Kumakura, Kenta

Abstract

To provide a separation method for a joined object for display device, by which PSA can be peeled off even when the PSA is tightly bonded to a member in the joined object. Provided is a method for separating a joined object for display device. In this method, the joined object comprises two members joined with a PSA comprising a hydrophilicity enhancer. The method comprises a step of peeling the PSA from the member by supplying steam towards the PSA.

IPC Classes  ?

  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
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