Olympus Corporation

Japan

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IPC Class
A61B 1/12 - Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with cooling or rinsing arrangements 1
B65D 81/32 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents for packaging two or more different materials which must be maintained separate prior to use in admixture 1
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates 1
H01L 27/14 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy 1
Found results for  patents

1.

FLUID CONTAINER UNIT AND METHOD FOR INJECTING DIFFERENT KINDS OF FLUIDS INTO FLUID USAGE EQUIPMENT

      
Document Number 02740768
Status In Force
Filing Date 2009-10-15
Open to Public Date 2010-04-22
Grant Date 2016-04-05
Owner
  • SARAYA CO., LTD. (Japan)
  • OLYMPUS CORPORATION (Japan)
Inventor
  • Nishio, Suguru
  • Kotani, Kojiro
  • Inoue, Ryo
  • Iwanami, Takayoshi
  • Sato, Yoshiyuki

Abstract

The present invention is directed to a fluid container unit comprising: a container coupling for coupling a supply/discharge port of a first container with a supply/discharge port of a second container; a single nozzle member having a nozzle tube; a connection cap having one end for holding a base portion of the nozzle member and another end for covering one side of the container coupling by fitting around an outer periphery thereof; an intermediate adaptor having a pair of pusher elements facing to the first and the second supply/discharge port respectively, and being held movably in a direction along a longitudinal axis of the nozzle tube in the connection cap, and a supply/discharge port opening mechanism for moving the intermediate adaptor toward the container coupling and opening the supply/discharge ports by the pusher elements. Thereby, in configuring a fluid container unit by integrally-assembling two containers for respectively accumulating different kinds of fluids in a parallel arrangement, the workability in fixing the fluid container unit to an injection site of a fluid usage equipment is improved, and the injection site can be configured to be more compact.

IPC Classes  ?

  • A61B 1/12 - Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with cooling or rinsing arrangements
  • B65D 81/32 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents for packaging two or more different materials which must be maintained separate prior to use in admixture

2.

IMAGING APPARATUS AND METHOD OF MANUFACTURING THE SAME

      
Document Number 02611916
Status In Force
Filing Date 2006-05-25
Open to Public Date 2007-02-01
Grant Date 2011-11-08
Owner OLYMPUS CORPORATION (Japan)
Inventor Fujimori, Noriyuki

Abstract

An object is to realize an imaging apparatus in which an optical system that focuses light from an object can be readily attached to a solid-state imaging sensor, and in which an unnecessary external light other than the light from the object can be blocked without fail. An imaging apparatus of the present invention includes a solid-state imaging sensor (2) that receives the light from the object and performs photoelectric conversion, an optical system (3) that focuses the light from the object, and a resin material (5). The solid-state imaging sensor (2) has a semiconductor chip which receives the light from the object through a light receiving surface and performs the photoelectric conversion. A translucent member is provided on an upper surface of the semiconductor chip and electrode terminals is provided on a lower surface of the semiconductor chip. The optical system (3) is provided on a light receiving region on a surface of the translucent member. The light receiving region faces the light receiving surface. The resin material (5) reinforces a bonding strength of a circuit board (4) on which the solid- state imaging sensor (2) is placed and the group of electrode terminals of the solid-state imaging sensor (2), and shields a region outside the light receiving region of the translucent member from light.

IPC Classes  ?

  • H01L 27/14 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy

3.

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

      
Document Number 02536799
Status In Force
Filing Date 2004-08-25
Open to Public Date 2005-03-10
Grant Date 2013-11-12
Owner OLYMPUS CORPORATION (Japan)
Inventor
  • Yamamoto, Satoshi
  • Suemasu, Tatsuo
  • Hirafune, Sayaka
  • Isokawa, Toshihiko
  • Shiotani, Koichi
  • Matsumoto, Kazuya

Abstract

A semiconductor package includes a semiconductor element having a circuit element arranged on a first surface of a semiconductor substrate; an external wiring region arranged on a second surface of the semiconductor substrate; a support substrate arranged on the first surface of the semiconductor substrate; an electrode pad arranged on the first surface of the semiconductor substrate; and a through electrode reaching from the electrode pad to the second surface of the semiconductor substrate.

IPC Classes  ?

  • H01L 23/12 - Mountings, e.g. non-detachable insulating substrates