Abstract

The invention relates to a method for providing a conductive surface on a non-conductive surface, in particular a polymeric surface. In particular the method relates to attaching silver ions to a polymeric surface to facilitate the adhesion of a metallic layer to the polymeric surface.

IPC Classes  ?

• C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, i.e. electroless plating
• C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
• C23C 18/28 - Sensitising or activating
• C23C 18/34 - Coating with one of iron, cobalt or nickel; Coating with mixtures of phosphorus or boron with one of these metals using reducing agents
• C23C 18/54 - Contact plating, i.e. electroless electrochemical plating

Abstract

There is disclosed a method of placing a substrate into a controlled conductivity plasma electrolytic oxidation (PEO) bath configured for the substrate; wherein the PEO bath includes a nitrogen containing organic compound, and applying a voltage for a period of time to produce a substantially continuous nitride or nitrogen compound containing PEO layer of between about 1 to about 100 microns thick on the substrate. The substrates are preferably magnesium, titanium, or aluminium. The PEO process is preferably carried out under alkaline conditions and at voltages of less than about 160 volts.

IPC Classes  ?

• C25D 11/30 - Anodisation of magnesium or alloys based thereon
• C25D 11/26 - Anodisation of refractory metals or alloys based thereon
• C25D 11/06 - Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
• C25D 11/02 - Anodisation

Abstract

In example implementations, a method for producing a coating is provided. The method includes placing a magnesium substrate into an anodizing bath, applying a voltage for a first amount of time to form a micro-porous anodizing layer having a thickness of between (1) to (50) microns on the magnesium substrate, placing the magnesium substrate with the micro-porous anodizing layer in plating bath, wherein the plating bath comprises a metal and a complexing agent with a pH between (8) and (14), applying a first current to the plating bath for a second amount of time to form an interlock layer on the micro-porous anodizing layer, and applying a second current to the plating bath for a third amount of time to form a coating on the interlock layer.

IPC Classes  ?

• C25D 11/30 - Anodisation of magnesium or alloys based thereon
• C25D 3/12 - Electroplating; Baths therefor from solutions of nickel or cobalt
• C25D 3/46 - Electroplating; Baths therefor from solutions of silver
• C25D 3/38 - Electroplating; Baths therefor from solutions of copper
• C25D 3/22 - Electroplating; Baths therefor from solutions of zinc
• C25D 9/12 - Electrolytic coating other than with metals with inorganic materials by cathodic processes on light metals
• C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
• C25D 5/16 - Electroplating with layers of varying thickness
• C25D 5/18 - Electroplating using modulated, pulsed or reversing current
• C25D 13/18 - Electrophoretic coating characterised by the process using modulated, pulsed or reversing current

Abstract

In example implementations, a method for coloring an alloy is provided. The method includes anodizing a substrate in an anodizing bath comprising phosphoric acid, at a constant temperature and a constant voltage for a first time period to develop an anodizing layer that includes a barrier layer, reducing the constant voltage applied to the anodizing bath for a second time period to change a thickness of the barrier layer and change a width of pores in the anodizing layer, plating the substrate in a plating bath at a first current that is increased over a third time period in accordance with a current profile of the plating bath, and plating the substrate in the plating bath at a second current for a fourth time period.

IPC Classes  ?

• C25D 11/04 - Anodisation of aluminium or alloys based thereon
• C25D 11/08 - Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
• C25D 9/04 - Electrolytic coating other than with metals with inorganic materials
• C25D 3/12 - Electroplating; Baths therefor from solutions of nickel or cobalt
• C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
• C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
• C25D 5/16 - Electroplating with layers of varying thickness
• C25D 5/18 - Electroplating using modulated, pulsed or reversing current
• C25D 13/18 - Electrophoretic coating characterised by the process using modulated, pulsed or reversing current
• C25D 21/12 - Process control or regulation
• C25D 11/18 - After-treatment, e.g. pore-sealing
• C25D 11/24 - Chemical after-treatment
• C25D 11/14 - Producing integrally coloured layers
• C25D 11/22 - Electrolytic after-treatment for colouring layers