Abstract

There is disclosed a method of placing a substrate into a controlled conductivity plasma electrolytic oxidation (PEO) bath configured for the substrate; wherein the PEO bath includes a nitrogen containing organic compound, and applying a voltage for a period of time to produce a substantially continuous nitride or nitrogen compound containing PEO layer of between about 1 to about 100 microns thick on the substrate. The substrates are preferably magnesium, titanium, or aluminium. The PEO process is preferably carried out under alkaline conditions and at voltages of less than about 160 volts.

IPC Classes  ?

• C25D 11/30 - Anodisation of magnesium or alloys based thereon
• C25D 11/06 - Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
• C25D 11/26 - Anodisation of refractory metals or alloys based thereon

Abstract

In example implementations, a method for producing a coating is provided. The method includes placing a magnesium substrate into an anodizing bath, applying a voltage for a first amount of time to form a micro-porous anodizing layer having a thickness of between (1) to (50) microns on the magnesium substrate, placing the magnesium substrate with the micro-porous anodizing layer in plating bath, wherein the plating bath comprises a metal and a complexing agent with a pH between (8) and (14), applying a first current to the plating bath for a second amount of time to form an interlock layer on the micro-porous anodizing layer, and applying a second current to the plating bath for a third amount of time to form a coating on the interlock layer.

IPC Classes  ?

• C25D 11/30 - Anodisation of magnesium or alloys based thereon
• C25D 3/22 - Electroplating; Baths therefor from solutions of zinc
• C25D 3/46 - Electroplating; Baths therefor from solutions of silver
• C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
• C25D 5/16 - Electroplating with layers of varying thickness
• C25D 5/18 - Electroplating using modulated, pulsed or reversing current
• C25D 9/12 - Electrolytic coating other than with metals with inorganic materials by cathodic processes on light metals
• C25D 13/18 - Electrophoretic coating characterised by the process using modulated, pulsed or reversing current

Abstract

In example implementations, a method for coloring an alloy is provided. The method includes anodizing a substrate in an anodizing bath comprising phosphoric acid, at a constant temperature and a constant voltage for a first time period to develop an anodizing layer that includes a barrier layer, reducing the constant voltage applied to the anodizing bath for a second time period to change a thickness of the barrier layer and change a width of pores in the anodizing layer, plating the substrate in a plating bath at a first current that is increased over a third time period in accordance with a current profile of the plating bath, and plating the substrate in the plating bath at a second current for a fourth time period.

IPC Classes  ?

• C25D 3/12 - Electroplating; Baths therefor from solutions of nickel or cobalt
• C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
• C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
• C25D 5/16 - Electroplating with layers of varying thickness
• C25D 5/18 - Electroplating using modulated, pulsed or reversing current
• C25D 9/04 - Electrolytic coating other than with metals with inorganic materials
• C25D 11/04 - Anodisation of aluminium or alloys based thereon
• C25D 11/08 - Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
• C25D 11/14 - Producing integrally coloured layers
• C25D 11/18 - After-treatment, e.g. pore-sealing
• C25D 11/22 - Electrolytic after-treatment for colouring layers
• C25D 11/24 - Chemical after-treatment
• C25D 13/18 - Electrophoretic coating characterised by the process using modulated, pulsed or reversing current
• C25D 21/12 - Process control or regulation

Abstract

In example implementations, a method for producing a thin film coating is provided. The method includes pre-treating a substrate, placing the substrate in a bath comprising at least phosphoric acid and sulphuric acid to produce a thin anodized layer, rinsing the thin anodized layer in a solution, plating a surface of the thin anodized layer in an electro deposition bath following a plating current profile for a predetermined period, and increasing the plating current to the recommended bath plating current to produce the thin film coating having a desired initial coating thickness.

IPC Classes  ?

• C25D 11/20 - Electrolytic after-treatment
• C25D 5/42 - Pretreatment of metallic surfaces to be electroplated of light metals