Abstract

A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.

IPC Classes  ?

• H01L 23/10 - Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
• H01L 23/043 - Containers; Seals characterised by the shape the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body

Abstract

An optical imaging system includes a first lens including a negative refractive power and a convex object-side surface, and a second lens including a convex object-side surface and a convex image-side surface. The optical imaging system also includes a third lens including a negative refractive power and a convex object-side surface, a fourth lens including a convex image-side surface, a fifth lens, and a sixth lens including an inflection point formed on an image-side surface thereof. The first to sixth lenses are sequentially disposed in an optical-axis direction.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only

Abstract

A printed circuit board: a first insulation layer; a first wiring layer embedded in the first insulation layer; a first via layer disposed in a first via of the first insulation layer; a second insulation layer disposed on the first insulation layer; a second wiring layer embedded in the second insulation layer; a second via layer disposed in a second via of the second insulation layer; and a cavity disposed in the first insulation layer and a portion of the second insulation layer. The cavity includes a first portion and a second portion disposed in the first insulation layer and having different widths, the first portion is disposed at a lateral side of the first wiring layer, the second portion is disposed at a lateral side of the first via layer, and a first width of the first portion is greater than a second width of the second portion.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/02 - Printed circuits - Details

Abstract

A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
• H01G 4/30 - Stacked capacitors

Abstract

An aperture module is provided. The aperture module includes a plurality of blades configured to interlock with each other to form a through-hole, a rotator on which the plurality of blades are disposed, a first base on which the rotator is disposed, a second base connected to the first base, and a driving unit disposed on the second base and configured to provide a driving force to move the rotator in a direction that intersects an optical axis direction. The first base is configured to move in an optical axis direction with respect to the second base.

IPC Classes  ?

• G03B 9/22 - More than two members each moving in one direction to open and then in opposite direction to close, e.g. iris type
• G03B 3/10 - Power-operated focusing
• G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
• G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets

Abstract

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• C01G 23/00 - Compounds of titanium
• C04B 35/468 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
• C04B 35/628 - Coating the powders
• H01G 4/10 - Metal-oxide dielectrics
• H01G 4/30 - Stacked capacitors
• H01G 4/33 - Thin- or thick-film capacitors
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps

Abstract

An imaging lens system includes a first lens having negative refractive power, a second lens having refractive power, a third lens having refractive power, a fourth lens having positive refractive power, a fifth lens having a concave object-side surface, a sixth lens having a convex object-side surface, a seventh lens having refractive power, and an eighth lens having refractive power, wherein the first to eighth lenses are sequentially disposed at intervals from the object-side surface, wherein the imaging lens system satisfies the following conditional expression: 0.170

IPC Classes  ?

• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 13/18 - Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration

Abstract

An image capturing lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially arranged from an object side toward an image side. One or more of the lenses is an aspherical lens made of a glass material, and the sixth lens has positive refractive power.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components

Abstract

A power amplifier includes a power transistor configured to amplify an input radio-frequency (RF) signal, and a bias circuit configured to provide a bias current to the power transistor, and in a first power mode, detect a first signal corresponding to a first level or more in the input RF signal and generate the bias current corresponding to the first signal, or detect a second signal corresponding to a second level or less in the input RF signal and generate the bias current corresponding to the second signal, and in a second power mode, detect a third signal corresponding to a third level or more in the input RF signal and generate the bias current corresponding to the third signal, or detect a fourth signal corresponding to a fourth level or less in the input RF signal and generate the bias current corresponding to the fourth signal.

IPC Classes  ?

• H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
• H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation

Abstract

A lens assembly includes a first D-cut lens and a lens barrel surrounding a portion of a side surface of the first D-cut lens. The side surface of the first D-cut lens includes a linear portion, and the lens barrel is configured to expose at least a portion of the linear portion of the first D-cut lens in a direction perpendicular to an optical axis.

IPC Classes  ?

• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
• G02B 3/04 - Simple or compound lenses with non-spherical faces with continuous faces that are rotationally symmetrical but deviate from a true sphere

Abstract

A printed circuit board includes a first insulating layer, a plurality of first and second pads disposed on the first insulating layer, and a solder resist layer disposed on the first insulating layer, the solder resist layer having a plurality of first and second openings respectively exposing at least portions of the plurality of first and second pads. The first pad has a closed region having a side surface covered by the solder resist layer, and an open region having a side surface exposed by the first opening. The second pad has only a closed region having a side surface covered by the solder resist layer.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens sequentially arranged at intervals from an object side. The first lens and the fifth lens have negative refractive power, the sixth lens has a concave object-side surface, and the imaging lens system satisfies the following conditional expression: −1.0

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components

Abstract

A camera module includes a housing, a reflective member positioned in the housing and changing a direction of light to a direction of an optical axis, a carrier carrying the reflective member and rotatable about a first axis with respect to the housing, and a first ball group disposed between the housing and the carrier, wherein the first ball group includes a main ball member providing the first axis of the carrier, and an auxiliary ball member disposed away from the first axis, and one or both of the housing and the carrier partially accommodates the auxiliary ball member, and includes an auxiliary guide groove extended in a circumferential direction of the first axis.

IPC Classes  ?

• H04N 23/51 - Housings
• H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• H04N 23/55 - Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

A multilayered capacitor according to an embodiment includes a capacitor body including a dielectric layer and a first internal electrode layer and a second internal electrode layer stacked with the dielectric layer interposed therebetween, a first external electrode and a second external electrode on both sides of the capacitor body in the longitudinal direction, and 2n or more terminal electrodes on both sides of the capacitor body in a width direction. The first internal electrode layer includes n+1 first internal electrode patterns, the second internal electrode layer includes n second internal electrode patterns, and n is an integer greater than or equal to 1.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/30 - Stacked capacitors

Abstract

A multilayered capacitor includes a capacitor body including dielectric layers, a pair of first internal electrode layers with a first one of the dielectric layers interposed therebetween and a pair of second internal electrode layers stacked with a second one of the dielectric layers interposed therebetween, and a first external electrode and a second external electrode on both sides of the capacitor body in a longitudinal direction of the capacitor body. The pair of first internal electrode layers are respectively connected to the first external electrode and the second external electrode and the pair of second internal electrode layers are respectively connected to the first external electrode and the second external electrode. In a width direction of the capacitor body, an average length of the pair of first internal electrode layers and an average length of the pair of second internal electrode layers are different.

IPC Classes  ?

• H01G 4/005 - Electrodes
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
• H01G 4/30 - Stacked capacitors

Abstract

A method of manufacturing a multilayer electronic component includes cutting a stack, in which internal electrode patterns and ceramic green sheets are alternately stacked in a stacking direction, to obtain unit chips and attaching a portion of a ceramic green sheet for a side margin portion to the unit chips in a direction, different from the stacking direction. The attaching includes attaching the portion of the ceramic green sheet to the unit chips by compression between a first elastic body on which the ceramic green sheet is disposed and the unit chips. The first elastic body includes a first elastic layer having and a second elastic layer having an elastic modulus different from the first elastic layer, and disposed between the unit chips and the first elastic layer. An elastic modulus of the first elastic body is greater than 50 MPa and less than or equal to 1000 MPa.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors

Abstract

A camera module, may include: a lens module including a forwardmost lens disposed closest to an object: a housing configured to accommodate the lens module; a heater formed on the forwardmost lens, and configured to heat the forwardmost lens by a first driving signal; and a dirt remover formed on the forwardmost lens, and configured to generate electrical vibrations or mechanical vibrations or a voltage difference to remove dirt attached to a surface of the forwardmost lens by a second driving signal.

IPC Classes  ?

• H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
• H04N 23/55 - Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

A camera module includes a housing having an internal space; a lens module, disposed in the internal space, including at least one lens arranged in a direction of an optical axis; an image sensor, disposed in the housing, configured to have an imaging surface oriented in a direction intersecting the direction of the optical axis; and a reflective module, tiltably disposed in the internal space, configured to reflect light passing through the lens module towards the image sensor, and rotatably tilt about an axis perpendicular to the optical axis.

IPC Classes  ?

• G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
• G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
• G02B 7/182 - Mountings, adjusting means, or light-tight connections, for optical elements for mirrors for mirrors
• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image

Abstract

A lens assembly includes a lens barrel, a plurality of lenses arranged inside the lens barrel along an optical axis, and a cover member fixed to an end of the lens barrel on a subject side and fixing a last lens of the plurality of lenses on the subject side, wherein outer diameters of the plurality of lenses decrease from the subject side to an image side, and an outer diameter of the lens barrel is constant or smaller from the subject side to the image side.

IPC Classes  ?

• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in ascending numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging surface of an image sensor, wherein a conditional expression f/f2+f/f3<−0.4 is satisfied, where f is a focal length of the optical imaging system, f2 is a focal length of the second lens, and f3 is a focal length of the third lens, and a conditional expression TTL/(2*IMG HT)<0.69 is satisfied, where TTL is a distance along the optical axis from an object-side surface of the first lens to the imaging surface of the image sensor, and IMG HT is one-half of a diagonal length of the imaging surface of the image sensor.

IPC Classes  ?

• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,

Abstract

A camera module driving apparatus includes: a camera module driving IC including a communication port and a driving port; an interface to receive a communication signal through the communication port; and a driver to output a driving current through the driving port and including driving semiconductor circuit elements coupled in a bridge structure. The interface includes an inverter including a high-voltage terminal, a low-voltage terminal, and an input terminal and operating based on a voltage difference between the high-voltage terminal and the low-voltage terminal, and inverting at least a portion of the communication signal; and an input semiconductor circuit element passing current from the input terminal to the high-voltage terminal and cutting-off the current from the high-voltage terminal to the input terminal. The high-voltage terminal and the low-voltage terminal of the inverter are electrically connected to both ends of a capacitor, respectively.

IPC Classes  ?

• H04N 23/60 - Control of cameras or camera modules
• H04N 25/709 - Circuitry for control of the power supply

Abstract

A camera module is provided. The camera module includes a housing; a focusing unit accommodated in the housing, and configured to move in an optical axis direction and having a lens barrel therein; a stop caliber unit which has an aperture through which light incident to the lens barrel passes; and a stop adjusting unit connected to the stop caliber unit and configured to change a size of the aperture, wherein the stop caliber unit is configured to move relative to the stop adjusting unit in the optical axis direction.

IPC Classes  ?

• H04N 23/55 - Optical parts specially adapted for electronic image sensors; Mounting thereof
• H04N 23/51 - Housings
• H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

Abstract

A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 2/02 - Mountings
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially arranged along an optical axis from an object side toward an image side. The fifth lens has a positive refractive power, a focal length of the fifth lens is smaller than an overall focal length of the optical imaging system, and −0.38≤R10/f≤−0.32, where R10 is a radius of curvature of an image-side surface of the fifth lens and f is the overall focal length of the optical imaging system.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens sequentially disposed on an optical axis from an object side toward an image side. A distance from an object-side surface of the first lens to an imaging plane of an image sensor is TTL, an overall focal length of an optical system including the first to sixth lenses is F, and TTL/F≤0.83. An optical axis distance between the second lens and the third lens is D23, an optical axis distance between the third lens and the fourth lens is D34, and 2.2

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only
• G02B 13/02 - Telephoto objectives, i.e. systems of the type + – in which the distance from the front vertex to the image plane is less than the equivalent focal length

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in ascending numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging surface of an image sensor, wherein a conditional expression f/f2+f/f3<−0.4 is satisfied, where f is a focal length of the optical imaging system, f2 is a focal length of the second lens, and f3 is a focal length of the third lens, and a conditional expression TTL/(2*IMG HT)<0.69 is satisfied, where TTL is a distance along the optical axis from an object-side surface of the first lens to the imaging surface of the image sensor, and IMG HT is one-half of a diagonal length of the imaging surface of the image sensor.

IPC Classes  ?

• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,

Abstract

A capacitor component includes a body having a first surface and a second surface opposing each other and including a multilayer structure in which a plurality of dielectric layers are stacked and first and second internal electrodes are alternately disposed with respective dielectric layers interposed therebetween and exposed to the first surface and the second surface, respectively, first and second metal layers covering the first surface and the second surface and connected to the first and second internal electrodes, respectively, first and second ceramic layers covering the first and second metal layers, and first and second external electrodes covering the first and second ceramic layers and connected to the first and second metal layers to be electrically connected to the first and second internal electrodes, respectively.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors
• H01G 13/00 - Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups

Abstract

An optical imaging system includes a first lens having positive refractive power, a convex object-side surface and a concave image-side surface; a second lens having negative refractive power, a convex object-side surface and a concave image-side surface; a third lens having positive refractive power; a fourth lens having negative refractive power; a fifth lens; a sixth lens having a convex object-side surface; and a seventh lens having negative refractive power, a convex object-side surface and a concave image-side surface, wherein the first to seventh lenses are disposed in order from an object side toward an imaging plane, wherein the optical imaging system has a total of seven lenses, and wherein 0

IPC Classes  ?

• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 13/18 - Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens sequentially disposed along an optical axis from an object-side surface of the first lens toward an imaging plane of an image sensor, wherein 3.5≤TTL/IMG HT, f1+f2|<2.0 mm, and 0.7≤L1S1es/L1S1el<1.0 are satisfied, where TTL is a distance along the optical axis from the object-side surface of the first lens to the imaging plane of the image sensor, IMG HT is one-half of a diagonal length of the imaging plane of the image sensor, f1 is a focal length of the first lens, f2 is a focal length of the second lens, L1S1el is a maximum effective radius of the object-side surface of the first lens, and L1S1es is a minimum effective radius of the object-side surface of the first lens.

IPC Classes  ?

• G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only
• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes having different sizes to each other, and having first and second surfaces of the first and second internal electrodes, opposing each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces, and opposing each other; and first and second external electrodes. When a margin of the first internal electrode in a longitudinal direction is b, and a margin of the first internal electrode in a width direction is d, a margin of the second internal electrode in a longitudinal direction is a, and a margin of the second internal electrode in a width direction is c, a ratio (a/b) of the margin (a) of the second internal electrode in the longitudinal direction to the margin (b) of the first internal electrode in the longitudinal direction is 0.33 or more (where, a>0 and b>0) or a ratio (c/d) of the margin (c) of the second internal electrode in the width direction to the margin (d) of the first internal electrode in the width direction is 0.33 or more (where, c>0 and d>0).

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 2/02 - Mountings
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

A camera module includes a housing, a movable body configured to move in a direction of an optical axis of the housing; a reinforcing member formed integrally on one surface of the movable body, and configured to increase a rigidity of the movable body; and a first buffer member formed in the reinforcing member, and configured to reduce an impactive force between the housing and the movable body.

IPC Classes  ?

• G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image

Abstract

A multilayer capacitor includes a capacitor body having an active region, upper and lower cover regions, and width margins on opposing sides of the active region. The width margin includes a first region on an internal side thereof adjacent the first and second internal electrodes and a second region on an external side between the first region and a respective external surface of the capacitor body, and he upper and lower cover regions each include a third region on an internal side thereof adjacent the internal electrodes and a fourth region on an external side between the third region and a respective external surface of the capacitor body. The active region, the second region, and the fourth region have a same dielectric constant A, and the first and third regions have a same dielectric constant B, and A and B are different from each other and satisfy 0.5≤B/A.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 2/02 - Mountings
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens, sequentially arranged from an object side, wherein the first lens has a positive refractive power, wherein the second lens has a negative refractive power, wherein the third lens has a refractive power, wherein the fourth lens has a refractive power, wherein the fifth lens has a refractive power, and wherein 2.0

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only

Abstract

An aperture module includes a reference plate, including a protruded pivot pin; a first-stage blade unit including a pair of first blades forming a first-diameter aperture having a diameter smaller than that of the central opening when pivoted about the pivot pin; a second-stage blade unit including a pair of second blades, wherein the second-stage blade unit is disposed on a second planar surface different from a first planar surface of the first-stage blade unit, and the pair of second blades forms a second-diameter aperture having a diameter smaller than the diameter of the first-diameter aperture when pivoted about the pivot pin; and an aperture driver including a driving pin configured to insert into the guide slot, the first blade slot, and the second blade slot, and move along the guide slot. A curvature of the first blade slot and a curvature of the second blade slot form different angles.

IPC Classes  ?

• G03B 9/06 - Two or more co-operating pivoted blades e.g. iris type

Abstract

A folded module includes a housing, a carrier provided in the housing, and a rotation holder provided on the carrier and including a reflective member. The carrier is rotatable, with respect to the housing, around a first axis formed by one rotating shaft ball, the rotation holder is rotatable with respect to the carrier around a second axis formed by two ball members, and the first axis and the second axis intersect each other, and the one rotating shaft ball and the two ball members are provided together on a plane on which both the first axis and the second axis are provided.

IPC Classes  ?

• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• G02B 7/18 - Mountings, adjusting means, or light-tight connections, for optical elements for mirrors
• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
• G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
• G03B 17/17 - Bodies with reflectors arranged in beam forming the photographic image, e.g. for reducing dimensions of camera
• H04M 1/02 - Constructional features of telephone sets

Abstract

An electronic component embedded substrate includes: a core layer having a first through portion; an electronic component module including at least one electronic component and a metal layer surrounding at least a portion of the electronic component and disposed in the first penetration portion; and a first encapsulant disposed on the core layer, disposed in at least a portion of the first through portion, and covering at least a portion of the electronic component module.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/02 - Printed circuits - Details
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens sequentially arranged from an object side to an imaging plane. An object-side surface of the fourth lens is convex, an object-side surface of the fifth lens is concave, and an angle of view of the optical imaging system is 100 degrees or more.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only

Abstract

A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

IPC Classes  ?

• H05K 1/02 - Printed circuits - Details

Abstract

An optical imaging system includes a first lens having positive refractive power, a second lens having negative refractive power, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens disposed in order from an object side. A refractive index of the second lens is greater than a refractive index of each of the first lens and the third lens. The optical imaging system satisfies TTL/(2×IMG HT)<0.6 and 0

IPC Classes  ?

• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens sequentially arranged from an object side. At least two of the first lens, the second lens, the third lens, the fourth lens, the fifth lens, and the sixth lens include at least one inflection point. An object-side surface of the sixth lens is concave.

IPC Classes  ?

• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only
• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

An optical imaging system includes five lenses in which a first lens includes a positive refractive power and a concave object-side surface, and a second lens includes a positive refractive power and a concave image-side surface. The first to fifth lenses are sequentially disposed from an object side to an image side.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

A camera module includes a carrier supported on a housing and movable in an optical axis direction, at least one frame supported on the carrier and movable, relative to the carrier, in at least one direction perpendicular to the optical axis direction, and a lens module supported on the frame. The frame is supported on the carrier such that attractive force acts in the at least one direction perpendicular to the optical axis direction.

IPC Classes  ?

• G03B 13/36 - Autofocus systems
• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
• G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• G03B 17/02 - Bodies
• H04N 23/55 - Optical parts specially adapted for electronic image sensors; Mounting thereof
• H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

An imaging lens system includes a first lens having a positive refractive power, a second lens having a negative refractive power, a third lens having a positive refractive power, a fourth lens having a positive refractive power, a fifth lens having a negative refractive power, and a sixth lens having a positive refractive power. The F number of the system is 2.0 or less. The following Conditional Expression is satisfied: OAL/(Img HT)<1.50. In the expression, OAL represents a distance from an object-side surface of the first lens to an imaging plane, and Img HT represents a half of a diagonal length of the imaging plane.

IPC Classes  ?

• G02B 13/18 - Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only
• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

An actuator includes a fixed frame, a movable frame accommodated in the fixed frame and moving linearly and rotationally on a plane perpendicular to an optical axis, a driving unit disposed in the fixed frame and the movable frame to provide driving force for moving the movable frame; a sensor substrate including a movable portion coupled to the movable frame to move together with the movable frame, and a fixed portion coupled to the fixed frame; and an image sensor disposed on the sensor substrate. The movable frame includes a reinforcing plate made of a material different from a material of the movable frame, and the reinforcing plate includes a bent portion bent toward the sensor substrate.

IPC Classes  ?

• H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
• G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
• H02K 41/035 - DC motors; Unipolar motors
• H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

Abstract

A micro electro-mechanical systems (MEMS) package includes a first substrate on which at least one connection pad is disposed; a second substrate disposed adjacent to the first substrate; an element unit disposed on one surface of the second substrate; a connecting member connected to the connection pad and a metal pad included in the element unit; a sealing layer which encloses the second substrate; an insulating layer which covers the sealing layer; a redistribution layer connected to the connection pad; and an external connection terminal connected to the redistribution layer and exposed externally from the insulating layer. The element unit is spaced apart from the first substrate, the external connection terminal is exposed externally from the insulating layer disposed on a surface of the package that is opposite to a surface thereof on which the first substrate is disposed.

IPC Classes  ?

• B81B 7/00 - Microstructural systems
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• H03H 9/10 - Mounting in enclosures

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens, disposed in order from an object side to an imaging plane. One or any combination of the first lens to the seventh lens are formed of glass. One or both surfaces of one or more of the first lens to the seventh lens are aspherical. A pair of lenses, among the first lens to the seventh lens, allows paraxial areas opposing each other to be bonded to each other.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 13/06 - Panoramic objectives; So-called "sky lenses"

Abstract

An optical imaging system includes a reflective member having a reflective surface for changing an optical path of light, a first lens having positive refractive power, a second lens having negative refractive power, a third lens, a fourth lens, and a fifth lens. The first lens to the fifth lens are sequentially disposed along an optical axis from an object side and are each disposed closer to an image sensor than the reflective member. The optical imaging system satisfies 0.2 mm

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only
• G02B 13/02 - Telephoto objectives, i.e. systems of the type + – in which the distance from the front vertex to the image plane is less than the equivalent focal length
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• H04N 23/55 - Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

A bulk-acoustic wave (BAW) resonator includes a central portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on a substrate, and an extension portion extending externally from the central portion, and an insertion layer and a loss prevention film are disposed in the extension portion between the substrate and the second electrode. The loss prevention film is formed to have a thickness of 50 Å to 500 Å. The insertion layer is stacked on the loss prevention film, and has a side surface opposing the central portion, the side surface is formed as a first inclined surface having a first inclination angle. The loss prevention film has a side surface opposing the central portion, the side surface is formed as a second inclined surface having a second inclination angle. The second inclination angle is formed to be greater than the first inclination angle.

IPC Classes  ?

• H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
• H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks

Abstract

A multilayer electronic component, in which an external electrode may include a base electrode layer disposed on a surface of a body of the multilayer electronic component and connected to internal electrodes of the body, an intermediate electrode layer disposed on a corner of the body and connected to the base electrode layer, a conductive resin layer disposed on the intermediate electrode layer, and a plating layer disposed on the conductive resin layer. The intermediate electrode layer may be in contact with the plating layer on the corner of the body to prevent an increase in ESR while preventing cracks due to mounting through the conductive resin layer.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer ceramic capacitor includes: a ceramic body in which dielectric layers and first and second internal electrodes are alternately stacked; and first and second external electrodes formed on an outer surface of the ceramic body and electrically connected to the first and second internal electrodes, respectively. In a microstructure of the dielectric layer, dielectric grains are divided by a dielectric grain size into sections each having an interval of 50 nm, respectively, a fraction of the dielectric grains in each of the sections within a range of 50 nm to 450 nm is within a range of 0.025 to 0.20, and a thickness of the dielectric layer is 0.8 μm or less.

IPC Classes  ?

• C04B 35/468 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
• B32B 18/00 - Layered products essentially comprising ceramics, e.g. refractory products
• C04B 35/49 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates containing also titanium oxide or titanates
• H01B 3/12 - Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A printed circuit board includes a first insulating layer; a through-hole penetrating a region between an upper surface and a lower surface of the first insulating layer; a first via disposed in at least a portion of the through-hole; a first pad connected to an upper side of the first via; and a second pad connected to a lower side of the first via. A width of the through-hole on an uppermost side is greater than a width of the first pad. At least a portion of an upper surface of the first via exposed from the first pad is recessed below the upper surface of the first insulating layer.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.

IPC Classes  ?

• H05K 3/22 - Secondary treatment of printed circuits
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 1/005 - Soldering by means of radiant energy
• B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered

Abstract

A printed circuit board includes: an insulating layer; first and second pads respectively disposed on an upper surface of the insulating layer; and a solder resist layer disposed on the upper surface of the insulating layer, and having first and second openings at least partially exposing the first and second pads, respectively, wherein the solder resist layer contacts a side surface of the first pad, and the solder resist layer is spaced apart from the second pad.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A printed circuit board according to an embodiment includes: an insulation layer including a recess portion; and a connection pad disposed on the recess portion of the insulation layer and protruded from the recess portion, wherein the connection pad may include a protrusion and a concave portion that is lower than the protrusion, and a surface height of the protrusion of the connection pad may be substantially the same as or less than a surface height of the insulation layer.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A lens includes a lens unit having a refractive power; and a first coating layer and a second coating layer formed on either one or both of an object-side surface and an image-side surface of the lens unit in an optical axis direction of the lens unit, wherein a first refractive index of the first coating layer is greater than a second refractive index of the second coating layer.

IPC Classes  ?

• G02B 1/14 - Protective coatings, e.g. hard coatings
• G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics

Abstract

A camera module includes a housing defining an internal space, a lens module including a plurality of lenses, a reflective module disposed in front of the lens module and including a reflective member to change an optical path of light, a first driving unit to rotate the reflective module and including a first coil and a first magnet, a second driving unit to rotate the reflective module and including a second coil and a second magnet, a main substrate attached to the housing and including a first side substrate, and a circuit element disposed on the main substrate to provide a driving signal. The first coil and the second coil are disposed on the first side substrate of the main substrate, and the circuit element is disposed on a surface of the main substrate that is perpendicular to the first side substrate and faces the internal space of the housing.

IPC Classes  ?

• G02B 7/182 - Mountings, adjusting means, or light-tight connections, for optical elements for mirrors for mirrors
• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles

Abstract

A camera module includes a housing having an interior space; an Auto Focusing (AF) carrier disposed in the interior space of the housing and housing a lens barrel; a lens holder to which the lens barrel is fixed and accommodated in the AF carrier; an Optical Image Stabilization (OIS) driver configured to drive the lens holder to move in a first direction or a second direction perpendicular to an optical-axis, wherein the first direction and the second direction are perpendicular to each other within the AF carrier; and an OIS stopper including an inward protrusion protruding from one inner surface of the housing in the first direction towards the lens holder, and an outward protrusion protruding from one outer surface of the lens holder towards the one inner surface of the housing and opposite the inward protrusion in the second direction.

IPC Classes  ?

• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• G03B 5/04 - Vertical adjustment of lens; Rising fronts
• G03B 13/36 - Autofocus systems

Abstract

A method of manufacturing a multilayer electronic component includes forming a stack by stacking a plurality of ceramic green sheets on which conductive patterns are disposed on a support film, cutting the stack in a second direction, perpendicular to a first direction which is a stacking direction of the plurality of ceramic green sheets, cutting the stack in a third direction, perpendicular to the first and second directions, to obtain a plurality of unit chips, separating the unit chip from the support film, arranging the unit chip such that one of side surfaces of the unit chip is in contact with an adhesive tape, and attaching another one of the side surfaces to a ceramic green sheet for a side margin portion, and forming a side margin portion on the another one of side surfaces.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• C04B 35/64 - Burning or sintering processes
• H01G 2/06 - Mountings specially adapted for mounting on a printed-circuit support
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

A lens includes a lens unit; an intermediate layer configured to cover a surface portion of the lens unit; and a water-repellent layer, configured to cover a surface portion of the intermediate layer, including a base layer and an ultraviolet (UV) absorber disposed in the base layer.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 1/18 - Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films

Abstract

A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, and an external electrode disposed on the body and connected to the internal electrodes. The body includes an active portion including the plurality of internal electrodes to form capacitance, and cover portions disposed on the active portion, and the cover portions include an outer cover portion including a carbon compound and an inner cover portion disposed between the active portion and the outer cover portion. An average carbon content (Cc2) of the outer cover portion compared to an average carbon content (Cc1) of the inner cover portion satisfies 100≤Cc2/Cc1≤10,000.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/224 - Housing; Encapsulation

Abstract

A camera module includes a lens barrel, a housing configured to accommodate the lens barrel, an image sensor disposed below the lens barrel and mounted on a substrate, along an optical axis direction of the lens barrel, and a sub-housing, disposed between the lens barrel and the substrate, including an opening in which the image sensor is accommodated and a protrusion having a convexly curved upper surface shape configured to extend toward the lens barrel.

IPC Classes  ?

• H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• H04N 23/51 - Housings

Abstract

A multilayer electronic component includes a body having a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween, and an external electrode disposed on the body in a second direction perpendicular to the first direction and connected to the internal electrodes. The body includes an active portion including the internal electrodes to form capacitance and cover portions disposed on both end surfaces of the active portion in the first direction, and the cover portion includes a ceramic wire. The ceramic wire includes at least one or more groups arranged in one direction.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

An aperture module including: a base defining a central opening; a rotation plate rotatably seated on the base about an optical axis; an aperture driver coupled with the rotation plate to rotate the rotation plate according to an input electrical signal; and a plurality of blades disposed inside the rotation plate and interlocking with the rotation of the rotation plate to form an incident hole of variable size. Each of the blades includes a blade tooth form at an outer end portion thereof, and the rotation plate includes a rotation plate tooth form disposed along an inner circumferential surface thereof to engage with a respective blade tooth form of each of the plurality of blades.

IPC Classes  ?

• G03B 9/06 - Two or more co-operating pivoted blades e.g. iris type

Abstract

An aperture module includes a rotating plate, seated on a base having a center opening, configured to rotate about an optical axis; an aperture driver including a moving member coupled to the rotating plate, wherein the moving member is configured to linearly reciprocate; and a plurality of blades stacked as at least two stages on the rotating plate, disposed non-overlapping to each other on the respective stages, and configured to form a variable light incident hole interlocked with rotation of the rotating plate. A cusp of adjacent ones of the blades has an extending corner portion generated when straight lateral sides of the adjacent ones of the blades meet each other.

IPC Classes  ?

• G03B 9/06 - Two or more co-operating pivoted blades e.g. iris type
• G03B 9/18 - More than two members
• H04N 23/55 - Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

A multilayer electronic component according to an embodiment of the present disclosure includes: a body including an active portion including a plurality of first dielectric layers and first and second internal electrodes alternately disposed between the first dielectric layers to form capacitance, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and first and second external electrodes disposed on the body and connected to the first and second internal electrodes, respectively, wherein the plurality of first dielectric layers includes stabilized zirconia.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

According to an embodiment of the present disclosure, since the outer electrode of the first unit device and the outer electrode of the second unit device may have different polarities, capacitance may be generated in each of the first unit device and the second unit device and capacitance may be generated between the first and second unit devices, thereby maximizing capacitance per unit volume.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

A coil component includes a body having one surface and the other surface, opposing each other in one direction, and one end surface connecting the one surface and the other surface to each other, a support substrate embedded in the body, a coil portion disposed on the support substrate and including a lead-out pattern exposed from the one end surface, a first insulating layer disposed on the one end surface and having one region and the other regions spaced apart from each other in the other direction crossing the one direction, an external electrode having a connection portion, disposed between the one region and the other region to be connected to the lead-out pattern, and an extension portion extending from the connection portion to the one surface, and a second insulating layer disposed on the one end surface to cover the first insulating layer and the connection portion.

IPC Classes  ?

• H01F 27/29 - Terminals; Tapping arrangements
• H01F 27/28 - Coils; Windings; Conductive connections
• H01F 41/12 - Insulating of windings
• H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
• H01F 27/32 - Insulating of coils, windings, or parts thereof

Abstract

A multilayer electronic component includes a body including a dielectric layer and internal electrodes having the dielectric layer interposed therebetween in a first direction and external electrodes disposed on the body and connected to the internal electrodes, wherein the internal electrodes include nickel (Ni) and dysprosium (Dy) and 0.02 at %≤C0≤5 at % in which C0 is an atomic percentage (at %) calculated by dividing a number of atoms of Dy by a sum of a number of atoms of Ni and Dy included in the internal electrode.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/30 - Stacked capacitors

Abstract

An imaging lens system includes a first lens, a second lens having negative refractive power, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens having a concave object-side surface in a paraxial region, disposed in order from an object side in a direction of an imaging plane. The imaging lens system satisfies TTL/2IMGHT<1.5, where TTL is a distance from an object-side surface of the first lens to the imaging plane and IMGHT is one-half of a diagonal length of the imaging plane.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components

Abstract

A multilayered capacitor according to an embodiment includes a capacitor body including a dielectric layer, and a first internal electrode and a second internal electrode with the dielectric layer interposed therebetween, and an external electrode on one surface of the capacitor body. The first internal electrode has a first through-portion penetrating the first internal electrode, a dielectric of the dielectric layer is disposed in at least a portion of the first through-portion, and the first through-portion is disposed in a region where the first internal electrode is not overlapped with the second internal electrode.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/12 - Ceramic dielectrics
• H01G 2/06 - Mountings specially adapted for mounting on a printed-circuit support

Abstract

A lens module and a camera module including the same are provided. The lens module includes a lens barrel, a plurality of lens, and a lens holder. The plurality of lens includes at least one internal lens accommodated inside the lens barrel and an external lens fixed to a first end of the lens barrel. The lens holder includes a holder body that surrounds and supports the first end of the lens barrel and a lens support that extends from an inner circumferential surface of the holder body in a direction that intersects an optical axis direction and supports an edge of the external lens.

IPC Classes  ?

• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
• G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
• H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
• H04N 23/55 - Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer disposed between the plurality of internal electrodes; and an external electrode disposed on the body and connected to the plurality of internal electrodes, wherein each of the plurality of internal electrodes includes a plurality of nickel layers, and a heterogeneous material layer provided between the plurality of nickel layers.

IPC Classes  ?

• H01G 4/008 - Selection of materials
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens, sequentially disposed from an object side, wherein the first to fifth lenses are spaced apart from each other by predetermined distances along an optical axis in a paraxial region, the first lens and the second lens each have a non-circular shape when viewed in an optical axis direction, and the optical imaging system satisfies 0.62398

IPC Classes  ?

• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
• H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• H04N 23/55 - Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

Disclosed is a printed circuit board and a manufacturing method for manufacturing the same, the printed circuit board including: a first insulating layer; a through-hole penetrating through the first insulating layer; a via conductor layer disposed in the through-hole, and having first and second groove portions recessed inwardly of the through-hole from an upper surface and a lower surface of the first insulating layer, respectively; a cavity penetrating through at least a portion of the first insulating layer; an electronic component disposed in the cavity; and a second insulating layer covering at least a portion of the first insulating layer, and disposed in at least a portion of each of the through-hole and the cavity.

IPC Classes  ?

• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A printed circuit board includes a substrate, a first pad and a second pad, respectively disposed on an upper side of the substrate, a first socket disposed in the substrate and including a first circuit, and a first trace disposed in the substrate and disposed between the first and second pads and the first socket with respect to a lamination direction. At least a portion of the first circuit is electrically connected to each of the first and second pads, and is electrically connected to the second pad through a path passing through the first trace.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second metal layer. The first metal layer and the second metal layer include different metals.

IPC Classes  ?

• H05K 1/02 - Printed circuits - Details

Abstract

A multilayer capacitor includes a body including a plurality of dielectric layers disposed in a first direction, a plurality of first internal electrodes disposed in the first direction, and a plurality of second internal electrodes disposed in the first direction. At least a portion of the plurality of first internal electrodes and the plurality of second internal electrodes are spaced apart from each other on a same dielectric layer among the plurality of dielectric layers to have a gap, and among at least three gaps adjacent in the first direction, a gap having a greater distance in the first direction from a reference of the body in the first direction has a greater distance in one direction from a reference of the body in the one direction.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

A lens driving apparatus includes a lens holder configured to accommodate a lens; a carrier configured to accommodate the lens holder; a first optical image stabilization (OIS) driver, disposed outside of the lens holder, configured to drive the lens holder in a first direction perpendicular to an optical axis; and a second OIS driver, disposed outside of the carrier to oppose the first OIS driver and having the lens holder interposed therebetween, configured to drive the carrier in a second direction perpendicular to the optical axis and the first direction.

IPC Classes  ?

• G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• G03B 5/04 - Vertical adjustment of lens; Rising fronts
• G03B 13/36 - Autofocus systems

Abstract

An antenna substrate and an antenna module including the same are provided. The antenna substrate includes an antenna unit including first and second pattern layers adjacent to each other and disposed on different levels and a first insulating layer providing a first insulating region between the first and second pattern layers, and a feed unit including third and fourth pattern layers adjacent to each other and disposed on different levels and a second insulating layer providing a second insulating region between the third and fourth pattern layers. Each of the first and second pattern layers includes an antenna pattern, and each of the third and fourth pattern layers includes a feed pattern. The antenna unit is disposed on the feed unit. The first insulating region is thicker than the second insulating region.

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• H01Q 1/24 - Supports; Mounting means by structural association with other equipment or articles with receiving set
• H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome

Abstract

A printed circuit board includes: a bridge including a first insulating material, a wiring pattern disposed in the first insulating layer, a metal post disposed on the first insulating material and connected to the wiring pattern, and a second insulating material disposed on the first insulating material and covering at least a portion of the metal post; a first build-up insulating material disposed around the bridge; and a first redistribution pattern disposed on the second insulating material and the first build-up insulating material and including a metal pad connected to the metal post.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/46 - Manufacturing multi-layer circuits
• H01L 23/498 - Leads on insulating substrates
• H05K 1/03 - Use of materials for the substrate
• H05K 1/05 - Insulated metal substrate

Abstract

A camera module includes a lens module including a plurality of lenses having refractive power, a first optical path folding unit disposed on the object side of the lens module and configured to refract or reflect incident light in an optical axis direction of the lens module. Among the lenses constituting the lens module, an effective radius of a lens closest to the first optical path folding unit may have substantially the same size as an effective radius of an exit surface of the first optical path folding unit.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
• G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only
• G03B 17/17 - Bodies with reflectors arranged in beam forming the photographic image, e.g. for reducing dimensions of camera

Abstract

A camera module is provided. The camera module includes an image sensor, a lens assembly disposed on the image sensor and including a plurality of lenses, and an optical path member disposed between the image sensor and the lens assembly, wherein the optical path member is configured to be at least partially in contact with a first surface of a first lens adjacent to the image sensor among the plurality of lenses of the lens assembly.

IPC Classes  ?

• H04N 23/55 - Optical parts specially adapted for electronic image sensors; Mounting thereof
• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses

Abstract

An optical imaging system includes a first lens group including at least one lens; a second lens group including at least one lens; and a third lens group including at least one lens, wherein the first lens group, the second lens group, and the third lens group are sequentially disposed in ascending numerical order along an optical axis from an object side toward an image side, each of the second lens group and the third lens group is configured to move along the optical axis relative to the first lens group, the at least one lens of the second lens group includes at least one glass lens and at least one plastic lens, an Abbe number of a glass lens of the second lens group is vg2_g, an Abbe number of a plastic lens of the second lens group is vg2_p, and |vg2_g−vg2_p| is greater than 25.

IPC Classes  ?

• G02B 9/12 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having three components only
• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens disposed sequentially from an object side. The optical imaging system satisfies −2.0

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
• G02B 5/04 - Prisms
• H04N 23/55 - Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

A coil component and a method for manufacturing the same are provided, and the coil component includes a body portion including a magnetic material, a support member disposed in the body portion, first and second conductor patterns disposed in both sides of the support member, opposing each other, a recess portion formed in a side surface of the support member, a via conductor disposed in the recess portion and connecting the first and second conductor patterns to each other, and a via pad disposed in an end portion of each of the first and second conductor patterns to connect the first and second conductor patterns to the via conductor, and having a line width greater than line widths of the first and second conductor patterns.

IPC Classes  ?

• H01F 27/28 - Coils; Windings; Conductive connections
• H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils

Abstract

A lens module includes lenses sequentially arranged from an object side toward an image plane sensor and having respective refractive powers. A second lens of the lenses has a convex object-side surface and a convex image-side surface. A first lens and a third lens of the lenses are symmetrical to each other in relation to the second lens.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens disposed in order from an object side, wherein the first lens has positive refractive power, wherein the fourth lens has a concave image-side surface, wherein the seventh lens has positive refractive power and has a convex object-side surface, and wherein the imaging lens system satisfies a conditional expression as follows: 0.12

IPC Classes  ?

• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components

Abstract

A printed circuit board includes a substrate including a plurality of wiring layers; a first metal post disposed on the substrate and connected to at least a portion of an uppermost wiring layer among the plurality of wiring layers; a second metal post disposed on the substrate and connected to at least another portion of the uppermost wiring layer among the plurality of wiring layers; a resist layer disposed on the substrate and embedding at least a portion of each of the first and second metal posts; and a metal via penetrating through the resist layer on the second metal post and connected to the second metal post.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

An apparatus for measuring characteristics of a capacitor component includes a measurement terminal connected to a capacitor component, an inductor connected to the measurement terminal, and a controller generating characteristic information of the capacitor component based on LC resonance of the capacitor component and the inductor. The controller generates capacitance information of the capacitor component based on inductance, based on at least one of a resonant frequency and an amplitude of the LC resonance and the resonant frequency.

IPC Classes  ?

• G01R 27/26 - Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants

Abstract

A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region in which an electrode layer and a conductive resin layer are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between a conductive resin layer and a plating layer of an external electrode, and thus, may improve bending strength and moisture resistance reliability.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/12 - Ceramic dielectrics
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/224 - Housing; Encapsulation
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 2/02 - Mountings

Abstract

A printed circuit board includes an insulating layer having first and second surfaces opposite to each other with respect to a first direction; a via hole penetrating a region between the first and second surfaces; a first conductor layer including a first contact portion in contact with the first surface and a first non-contact portion protruding from the first contact portion and disposed on the via hole with respect to a second direction perpendicular to the first direction; and a metal layer filling the via hole.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A printed circuit board (PCB) includes an insulating layer, a first solder resist layer disposed on an upper surface of the insulating layer, a first conductive pattern disposed on the insulating layer and providing a conductive post protruding from an upper surface of the first solder resist layer, and a second conductive pattern buried in the insulating layer and having an upper surface positioned to be lower than the upper surface of the insulating layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits - Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Abstract

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of first and second internal electrodes disposed on the dielectric layers to face each other with each of the dielectric layers interposed therebetween; and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein the dielectric layer includes a dielectric ceramic composition including a base material main component represented by z(Ba(1-x)Ca.)TiO3-(1-z)BaTi205 including a first main component represented by (Ba(1-x)Ca.)TiO3 and a second main component represented by BaTi2O5, 0.7z0.8 and 0≤x<0.1.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/008 - Selection of materials
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

A multi-layered ceramic electronic component includes a ceramic body including a dielectric layer, and a plurality of first and second internal electrodes opposing each other with the dielectric layer interposed therebetween; and first and second external electrodes arranged outside of the ceramic body and electrically connected to the first and second internal electrodes, wherein the dielectric layer comprises a dielectric ceramic composition containing: a base material represented by (Ba1-xCax)TiO3 (0

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
• H01G 4/30 - Stacked capacitors

Abstract

A dielectric ceramic composition includes a barium titanate (BaTiO3)-based base material main ingredient and an accessory ingredient, the accessory ingredient including dysprosium (Dy) and praseodymium (Pr) as first accessory ingredients. A content of the Pr satisfies 0.233 mol≤Pr≤0.699 mol, based on 100 mol of the barium titanate base material main ingredient.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• C04B 35/468 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates

Abstract

An image capturing lens system includes a first lens having negative refractive power, a second lens having positive refractive power, a third lens having negative refractive power, a fourth lens having positive refractive power, a fifth lens having refractive power, a sixth lens having refractive power, a seventh lens having positive refractive power, and an eighth lens having refractive power. The first to eighth lenses are sequentially disposed from an object side. The first lens and the fourth lens are formed of a glass material. The second lens, the third lens, the fifth lens, the sixth lens, the seventh lens, and the eighth lens are formed of a plastic material.

IPC Classes  ?

• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses

Abstract

A coil component includes: a body; a coil disposed within the body; and an insulating film covering at least a portion of the coil in the body, wherein the insulating film includes a copolymer including a repeating unit derived from a monomer containing an unsaturated bond and a repeating unit derived from a parylene monomer.

IPC Classes  ?

• H01F 27/32 - Insulating of coils, windings, or parts thereof
• H01F 17/00 - Fixed inductances of the signal type
• C09D 125/18 - Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
• C09D 133/08 - Homopolymers or copolymers of acrylic acid esters
• C09D 133/10 - Homopolymers or copolymers of methacrylic acid esters

Abstract

A coil component includes a body, a first coil disposed in the body and including a first winding portion having a turns number less than one turn, a second coil disposed in the body and including a second winding portion having a turns number less than one turn, a first external electrode and a second external electrode, respectively connected to one end and the other end of the first coil, and a third external electrode and a fourth external electrode, respectively connected to one end and the other end of the second coil. A portion of the first winding portion is disposed on an internal side of the second winding portion, and a portion of the second winding portion is disposed on an internal side of the first winding portion.

IPC Classes  ?

• H01F 27/28 - Coils; Windings; Conductive connections
• H01F 27/29 - Terminals; Tapping arrangements

Abstract

A photonic integrated circuit embedded substrate may include: an embedded insulating layer on which a photonic integrated circuit is disposed, and at least one first insulating layer stacked on one surface of the embedded insulating layer. The at least one first insulating layer may have an optical path extending in a stacking direction of the at least one first insulating layer.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
• H05K 1/02 - Printed circuits - Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A printed circuit board includes a first build-up insulating layer; an interconnect structure buried in an upper side of the first build-up insulating layer and including one or more insulating layers, one or more wiring layers, and one or more via layers; an adhesive disposed between an upper surface of the first build-up insulating layer and an upper surface of the interconnect structure, and having an upper surface exposed from the upper surface of the first build-up insulating layer; and a metal bump including a via portion penetrating the adhesive and a protrusion protruding to the upper surface of the adhesive.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/03 - Use of materials for the substrate
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material