A battery for high-rate discharging is provided that achieves a further increased battery capacity and is free from an internal short circuit. A negative electrode includes, on a negative electrode foil having a band shape, a negative electrode active material covered part covered with a negative electrode active material layer, a first negative electrode active material uncovered part extending in a longitudinal direction of the negative electrode foil, a second negative electrode active material uncovered part provided at an end part in the longitudinal direction on a beginning side of winding, and an insulating resin part provided between the negative electrode active material covered part and the first negative electrode active material uncovered part. A positive electrode active material uncovered part is coupled to a positive electrode current collector at one of end parts of an electrode wound body. The first negative electrode active material uncovered part is coupled to a negative electrode current collector at another of the end parts of the electrode wound body. The electrode wound body has one or more flat surfaces, in which the positive electrode active material uncovered part, the first negative electrode active material uncovered part, or both are bent toward a central axis of a wound structure to form the one or more flat surfaces, and a groove provided in each of the one or more flat surfaces.
H01M 50/538 - Connection of several leads or tabs of wound or folded electrode stacks
H01M 50/107 - Primary casings, jackets or wrappings of a single cell or a single battery characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
A radio-frequency module includes a module substrate that has a principal surface, an integrated circuit on the principal surface that includes a power amplifier circuit, and an SMD on the principal surface that includes a circuit device directly connected to the power amplifier circuit. The integrated circuit includes a first base that has at least a part formed of a first semiconductor material, and a second base that has at least a part formed of a second semiconductor material and that includes the power amplifier circuit. The first base has two sides that are opposite each other in plan view. The SMD is closer to one side than the other side in plan view. In plan view, the second base is smaller than the first base and is overlain by the first base at a position closer to the one side than to the other side.
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles
3.
POROUS LIQUID CRYSTAL POLYMER SHEET, METAL LAYER-ATTACHED POROUS LIQUID CRYSTAL POLYMER SHEET, AND ELECTRONIC CIRCUIT BOARD
A porous liquid crystal polymer sheet that includes a resin sheet containing a liquid crystal polymer and having pores. The porous liquid crystal polymer sheet has a melt viscosity of 20 Pa·s or more under the conditions of a shear rate of 1000 s−1 and a measurement temperature that is 20° C. higher than a melting point of the resin sheet.
A solid state battery that includes: a battery element including a positive electrode layer, a negative electrode layer, and a solid electrolyte layer interposed between the positive electrode layer and the negative electrode layer; an end-face electrode facing the end surface of the battery element; a covering layer covering the battery element with the end-face electrode; and an insulating buffer layer between the covering layer and the battery element and surrounding the battery element, wherein the insulating buffer layer is also sandwiched between the battery element and the end-face electrode and arranged intermittently on an end-face electrode facing region side of the end surface of the battery element.
H01M 50/103 - Primary casings, jackets or wrappings of a single cell or a single battery characterised by their shape or physical structure prismatic or rectangular
H01M 50/24 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries from their environment, e.g. from corrosion
A multilayer substrate includes layers stacked on each other in an up-down direction of a multilayer body. The layers include a first spacer, a first ground conductive layer above the first spacer, and a signal conductive layer that overlaps the first ground conductive layer and is located below the first spacer. First through-holes pass through the first spacer and are arranged along a first direction. A distance between centroids of first through-holes adjacent to each other in the first direction is uniform or substantially uniform. Sets of first through-holes are provided in the first spacer. Sets of first through-holes are arranged along a second direction. A distance between centroids of first through-holes adjacent to each other in the second direction is uniform or substantially uniform. At least one first through-hole is a first hollow through-hole overlapping the signal conductive layer.
A semiconductor device includes a detector mounted on a base substrate and including a pressure detector to detect pressure, a base portion on the base substrate where the detector is buried, a protruding portion protruding upward from the base portion and including an exposure hole which causes the pressure detector to be exposed upward, and a lid supported by an upper surface of the protruding portion to close the exposure hole. An outer circumferential portion of the lid extends outward from the protruding portion in plan view. The lid includes a slit that is open to an outer side surface and causes the exposure hole to communicate with outside sideward of the semiconductor device.
G01L 19/00 - MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
A possible benefit of the present disclosure is to further improve a heat dissipation property of an electronic component. A high-frequency module includes a mounting substrate, a filter (for example, a transmission filter), a resin layer, a shielding layer, and a metal member. The resin layer covers at least a portion of an outer peripheral surface (for example, an outer peripheral surface) of the filter. The shielding layer covers at least a portion of the resin layer. The metal member is disposed at a first principal surface of the mounting substrate. The metal member is connected to a surface of the filter on the opposite side from the mounting substrate, the shielding layer, and the first principal surface of the mounting substrate.
A first transmission line and a third transmission line are disposed at different positions in a thickness direction of a substrate. The third transmission line includes a first end portion connected to one end portion of the first transmission line, and a second end portion that is grounded. The first transmission line is electromagnetically coupled to the third transmission line. The first transmission line has a coil pattern and the third transmission line has a partially open loop pattern.
A mounting structure of an electronic component includes at least two electrode pads spaced apart from each other on a board, at least two external electrodes of the electronic component respectively connected to the at least two electrode pads, and a resist film located around each of the at least two electrode pads on a surface of the board. A predetermined separation distance in a surface direction of the board is set between the resist film and each of the at least two external electrodes provided respectively on the at least two electrode pads. At least a surface layer of each of the at least two external electrodes includes about 99 wt % or more of Sn.
A radio frequency module includes a module substrate having major surfaces that face each other, a first base part that is at least partially comprised of a first semiconductor material and in which an electronic circuit is formed, a second base part that is at least partially comprised of a second semiconductor material different from the first semiconductor material and in which a power amplifier is formed, and a switch connected to an output terminal of the power amplifier. The first base part is disposed on or over the major surface; the second base part is disposed between the module substrate and the first base part, is joined to the first base part, and is connected to the major surface via an electrode; and the switch is disposed on or over the major surface.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different subgroups of the same main group of groups , or in a single subclass of ,
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
In a transmission line, a multilayer body includes a hollow portion above a signal conductor layer and below a ground conductor layer and overlapping the ground conductor layer when viewed in an up-down direction, and a spacer facing the hollow portion. In a cross section orthogonal to a front-back direction, an overlapping region is a region in the hollow portion in which the hollow portion overlaps the spacer in the up-down direction. In a cross section orthogonal to the front-back direction, a non-overlapping region is a region in the hollow portion in which the hollow portion does not overlap the spacer in the up-down direction. A length of the hollow portion in the up-down direction in the overlapping region is shorter than a length of the hollow portion in the up-down direction in the non-overlapping region.
An electrode for a battery includes an electrode body and an electrode tab. The electrode body includes a current collector and an active material layer provided on the current collector. The electrode tab is coupled to the current collector and extends in a first direction. The electrode body includes a first curved end part, a first noncurved end part, a second curved end part, and a second noncurved end part. The first curved end part has a convex shape and is disposed on a back side relative to the electrode tab in a second direction intersecting with the first direction. The first noncurved end part is coupled to the first curved end part and forms a first corner part at a coupling portion to the first curved end part. The first corner part has a convex shape toward the back side. The second curved end part has a convex shape and is disposed on a front side relative to the electrode tab in the second direction. The second noncurved end part is coupled to the second curved end part and forms a second corner part at a coupling portion to the second curved end part. The second corner part has a convex shape toward the front side. A curvature radius of the first curved end part and a curvature radius of the second curved end part are different from each other. An angle of the first corner part and an angle of the second corner part are each an obtuse angle.
A porous liquid crystal polymer sheet that includes: a resin sheet having pores and containing a first component composed of a liquid crystal polymer and a second component accounting for a highest weight percentage of the resin sheet except for the first component, wherein, when a region containing the second component is defined as a first region, and a region having a smaller content of the second component than the first region is defined as a second region in the porous liquid crystal polymer sheet, the first region has higher compressive strength than the second region, the second component has an average particle size smaller than an average pore size of the pores, and the second component is not in contact with an inside of the pores.
A film capacitor that includes a wound body having a dielectric film and a metal layer, the dielectric film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, the metal layer being disposed at least on a first main surface of the dielectric film. The first main surface of the dielectric film includes a plurality of protrusions having the second organic material. In an area range of 100 µm by 140 µm of the first main surface of the dielectric film, the plurality of the protrusions have an average diameter of 0.58 µm to 5.98 µm and an average height of 0.11 µm to 2.54 µm, and a number of the plurality of the protrusions ranges from 50 to 450.
A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The electrolytic solution includes a diester compound and a sulfur-containing compound. The diester compound includes two or more of a compound represented by Formula (1), a compound represented by Formula (2), or a compound represented by Formula (3). The sulfur-containing compound includes at least one of propane sultone, 1,4-butane sultone, 2,4-butane sultone, propene sultone, glycol sulfate, propylene glycol sulfate, dimethyl sulfate, diethyl sulfate, ethyl methyl sulfate, or sulfolane.
A filter device includes resonators including at least one series arm resonator and at least one parallel arm resonator. The resonators include a parallel arm resonator defining and functioning as a first resonator with a largest fractional bandwidth among the resonators, and at least one second resonator. The filter device includes an inductor connected in series to the first resonator.
A semiconductor device includes first and second members. A second surface of the second member is opposite to a first surface of the first member. A radio-frequency amplifier circuit is included in the second member. The first and second members are bonded to each other by an electrically conductive bonding member between the first and second surfaces. The radio-frequency amplifier circuit includes at least one power stage transistor, an input wire that is connected to the power stage transistor and supplies an input signal to the power stage transistor, and an input-side circuit element that is connected to the input wire and that includes at least one of a passive element, an active element, and an external connection terminal. The bonding member includes a first conductor pattern covering the power stage transistor in plan view. The input-side circuit element is disposed outside the first conductor pattern in plan view.
Acoustic resonator devices, filters, and methods are disclosed. An acoustic resonator includes a substrate, a lithium niobate plate having front and back surfaces, wherein Euler angles of the lithium niobate plate are [0°, β, 0° ], where β is greater than or equal to 0° and less than or equal to 60°, and an acoustic Bragg reflector between the surface of the substrate and the back surface of the lithium niobate plate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. At least one finger of the IDT is disposed in a groove in the lithium niobate plate.
A high-frequency module includes a mounting substrate, a first filter, a second filter, and a third filter. The mounting substrate has a first main surface and a second main surface opposite to each other. Simultaneous communication is enabled for the first filter and the second filter, and the third filter is not used in the simultaneous communication using the first filter and the second filter. The first filter, the second filter, and the third filter are mounted on the first main surface of the mounting substrate. A first substrate of the first filter, a second substrate of the second filter, and a third substrate of the third filter are common to each other. The third filter is disposed between the first filter and the second filter in plan view from a thickness direction of the mounting substrate.
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
A multilayer ceramic capacitor includes, on a first end surface, first protruding portions opposed to each other and extending along at least two surfaces of a first main surface and a second main surface or a first lateral surface and a second lateral surface and, on a second end surface, second protruding portions opposed to each other and extending along at least two surfaces of a first main surface and a second main surface or a first lateral surface and a second lateral surface. The first and second protruding portions do not overlap the inner layer portion.
An electronic component is an electronic component including a first surface, wherein a marking formed by a collection of a plurality of dot-shaped recesses is formed in the first surface, an inner surface of each of the plurality of dot-shaped recesses is a curved surface, when viewed in a direction perpendicular to the first surface, an region internal to an outline of each of the plurality of dot-shaped recesses is entirely non-flat, the electric component comprises one or more second regions internal to an outline of the marking when viewed in the direction perpendicular to the first surface, each of the one or more second regions not belonging to any of the plurality of dot-shaped recesses, each of the one or more second regions being chamfered, each of the one or more second regions being non-flat, and each of the one or more second regions is convex.
A solid electrolyte ceramic that has a garnet-type crystal structure, and contains: at least Li, La, and O; and one or more transition metal elements selected from the group consisting of Co, Ni, Mn, and Fe, wherein, when a content of the Li and a total content of the one or more transition metal elements are denoted respectively by X (mol %) and Y (mol %), the solid electrolyte ceramic satisfies any one of the following relational expressions (1) to (3): (1) 0.01≤Y≤4.00 in the range of 221≤X<227; (2) 0.01≤Y≤6.00 in the range of 227≤X<237; and (3) 0.01≤Y≤8.00 in the range of 237≤X≤250.
A solid electrolyte ceramic having a garnet-type crystal structure, the solid electrolyte ceramic containing at least Li, La, and O; and one or more transition metal elements selected from the group consisting of Co, Ni, Mn, and Fe, in which a content X (mol %) of one or more elements D selected from the group consisting of a transition element capable of providing six-coordination with oxygen and an element belonging to Groups 12 to 15 and a total content Y (mol %) of the transition metal elements satisfy at least one of three specific relational expressions.
A radio frequency module includes a first power amplifier, a second power amplifier, a filter, a switch, and a matching circuit. The first power amplifier outputs a first amplified signal. The second power amplifier outputs a second amplified signal. The filter allows the first amplified signal and the second amplified signal to pass through. The switch has a first terminal and a second terminal. The first terminal is connected to an output portion of the first power amplifier. The second terminal is connected to the filter. The switch changes over connection and disconnection of the first terminal and the second terminal. The matching circuit is connected between an output portion of the second power amplifier and a signal path between the second terminal of the switch and the filter.
An antenna device is provided that includes an antenna circuit and a resistance circuit. The antenna circuit has a first inductor. The resistance circuit has a second inductor and is electrically connected to the antenna circuit. The first inductor has a first winding and a core arranged inside the first winding. The second inductor has a second winding that comprises an air-core coil.
A polymer solid electrolyte for an electrochemical device including a magnesium electrode as a negative electrode,
the polymer solid electrolyte including a Mg polymer salt containing Mg2+ and an anionic polymer having an anionic functional group and a coordinating functional group, and
the polymer solid electrolyte having Mg ion conductivity.
In the radio frequency module, a first electronic component and a second electronic component are mounted on a principal surface of a mounting board. A resin layer covers an outer perimeter surface of the first electronic component and an outer perimeter surface of the second electronic component. A conductive layer covers the resin layer and overlaps the first electronic component and the second electronic component in a plan view. The conductive layer includes a first conductive portion and a second conductive portion. The first conductive portion is positioned in between the first RF terminal of the first electronic component and the second RF terminal of the second electronic component in the plan view. The second conductive portion is adjacent to the first conductive portion in the plan view. The resistivity of the first conductive portion is higher than the resistivity of the second conductive portion.
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
In a transmission line, a signal conductor layer extends in a front-back direction orthogonal to an up-down direction. A ground conductor layer is above the signal conductor layer. When viewed in a first orthogonal direction, first hollow portions are arranged in the front-back direction in a first direction of the signal conductor layer, and second hollow portions are arranged in the front-back direction in a second direction of the signal conductor layer. Each of regions between adjacent first hollow portions in the front-back direction is a first region. Each of regions between adjacent second hollow portions in the front-back direction is a second region. Each of the first hollow portions overlaps with a corresponding one of the second regions when viewed in a second orthogonal direction. Each of the second hollow portions overlaps with a corresponding one of the first regions when viewed in the second orthogonal direction.
H01B 3/30 - Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
In a transmission line, a hollow portion overlaps a first ground conductor layer in an up-down direction. In a first orthogonal direction, the hollow portion includes a first portion extending in a second orthogonal direction of a signal conductor layer. In the first portion, a portion at which a width of the first portion in the second orthogonal direction has a first portion maximum width value is a first portion maximum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion minimum width value is a first portion minimum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion intermediate width value is a first portion intermediate width portion located between the first portion maximum width portion and the first portion minimum width portion in the front-back direction.
A circuit module includes a wiring board, first and second lines, a first inductor, and a sheet-like first conductor. The first line is on the wiring board, for transmitting a signal to a first circuit, outside the wiring board, and a power supply voltage for supplying power to the first circuit. The second line is on the wiring board side by side with the first line, for transmitting a signal to a second circuit and a power supply voltage for supplying power to the second circuit, which is outside the wiring board independently of the first circuit. The first inductor is on the wiring board, having one end connected to the first line, and another end connected to a power supply circuit for supplying the power. The sheet-like first conductor is on or near at least part of a side surface of a housing that holds the first inductor.
A method of manufacturing an interposer product that includes: forming on a same side of an interposer substrate, by a common process, first and second portions of a gold layer, wherein the first portion of the gold layer constitutes a wire-bonding pad; depositing a Au—Sn solder on the second portion of the gold layer, the Au—Sn solder comprising a gold-tin alloy having a first composition; merging the deposited Au—Sn solder with the second portion of the gold layer by performing a reflow process to form at least one bonding bump, wherein a majority of the bonding bump is made of a eutectic composition of the gold-tin alloy, and wherein the first composition has a smaller proportion of gold than is in the eutectic composition of the gold-tin alloy; and planarizing the bonding bump to form a flat bonding bump having a selected height.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
An integrated circuit includes a first base that has at least a part formed of a first semiconductor material and that includes an electric circuit, a second base that has at least a part formed of a second semiconductor material having a thermal conductivity lower than the first semiconductor material and that includes a power amplifier circuit, and a high thermal conductive member that has at least a part formed of a high thermal conductive material having a thermal conductivity higher than the first semiconductor material and that is disposed between the electric circuit and the power amplifier circuit. At least a part of the high thermal conductive member overlaps at least a part of the first base and at least a part of the second base in plan view. The high thermal conductive member is in contact with the first base and the second base.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
The total sum of wiring lengths between reception filters and low-noise amplifiers is reduced. A high frequency module includes a mounting board, a plurality of inductors, a plurality of reception filters, and an IC component. The plurality of inductors are mounted on a first main surface of the mounting board. The plurality of reception filters are mounted on the first main surface of the mounting board. The IC component is mounted on a second main surface of the mounting board and includes a low-noise amplifier. A rectangular region in which the plurality of inductors are positioned overlaps with the IC component when viewed in plan from a thickness direction of the mounting board. An electronic component that is closest to each of three or more sides out of four sides of the rectangular region is at least one of the plurality of reception filters.
A filter device is provided that includes a substrate, a piezoelectric plate attached to the substrate; interdigital transducers (IDTs) of a plurality of resonators, respectively, that each have interleaved fingers at respective diaphragms of the one piezoelectric plate disposed over one or more cavities; and a dielectric layer over at least one surface of the respective diaphragms. For at least two resonators, the dielectric layer has a thickness distribution that includes a first thickness layer and a second thickness layer over the first thickness layer, and the second thickness layer of a first resonator of the at least two resonators has a coverage distribution over the first thickness layer that is different than a coverage distribution of a second resonator of the at least two resonators.
An acoustic wave filter includes an input end, an output end, and a series arm connecting the input end and the output end. The series arm includes n (n=3) acoustic wave resonators connected in series in an order of first, second, and third acoustic wave resonators. The first, second, and third acoustic wave resonators include multiple electrode fingers. The first, second, and third acoustic wave resonators include an mth acoustic wave resonator (m is a natural number of 1
A multilayer substrate includes laminated insulating layers each including a main surface on which a conductor is provided. The multilayer substrate also includes a signal line defined by the conductors, and a shield conductor defined by the conductors. The shield conductor includes an opening and a portion overlapping the signal line in plan view. At least one of the insulating layers includes a void that communicates with the opening and that is larger than the opening in plan view.
A transmission line includes a laminated body, a first signal conductor layer in the laminated body and extending in a longitudinal direction, and a first ground conductor layer in the laminated body and provided above the first signal conductor layer to overlap the first signal conductor layer in a vertical direction. A first hollow portion is located above the first signal conductor layer and below or adjacent to the first ground conductor layer. The first hollow portion overlaps the first signal conductor layer and the first ground conductor layer in the vertical direction. An insulator layer in the laminated body is above the first hollow portion. A first upper cavity is provided in the first ground conductor layer. At least a portion of the first upper cavity overlaps the first hollow portion and the first signal conductor layer in the vertical direction.
An electronic card includes an electric storage device, a charging circuit, a wireless communication circuit, a processor, an electronic function circuit, a power management circuit, and a wakeup circuit configured to start the power management circuit upon receiving an external trigger. The power management circuit supplies, after being started by the wakeup circuit, power of the electric storage device to the processor and the electronic function circuit. The processor stores, before the start of wireless communication, an operation state or an output result of the electronic function circuit which is obtained by an operation with power of the electric storage device, and causes, after operation processing of the electronic function circuit, the wireless communication circuit to start the wireless communication.
Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a surface. A back surface of a single-crystal piezoelectric plate is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on a front surface of the piezoelectric plate with interleaved IDT fingers of the IDT disposed on the diaphragm. Back-side fingers are formed the back surface of the diaphragm.
A three-terminal multilayer ceramic capacitor includes a first internal electrode layer including a first counter electrode portion opposite to a second internal electrode layer, a first drawn electrode portion extending from the first counter electrode portion to a first end surface, and a second drawn electrode portion extending from the first counter electrode portion to a second end surface, the second internal electrode layer includes a second counter electrode portion opposite to the first internal electrode layer, a third drawn electrode portion extending from the second counter electrode portion to a first side surface, and a fourth drawn electrode portion extending from the second counter electrode portion to a second side surface. The first drawn electrode portion is bent and faces a first or second principal surface. The second drawn electrode portion is bent and faces the first or second principal surface.
A power supply circuit module includes a power supply circuit including a lower substrate, an upper substrate parallel or substantially parallel to the lower substrate, an inductor, and chip components mounted on the lower substrate, switching circuit components and chip components mounted on the upper substrate, and substrate connectors that connect the lower substrate with the upper substrate electrically and mechanically. A portion of the substrate connectors is an inductor configuring portion of the power supply circuit or a portion of an inductor configuring portion of the power supply circuit.
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
H02M 3/158 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
An oral pressure measurement device is provided that includes a handle and a sensor extending from the handle. The sensor includes a plate-like first pressure sensor for pressure measurement and a plate-like second pressure sensor for pressure measurement. The sensor portion further includes a first pressure dispersion plate arranged above a first principal surface of the first pressure sensor and a second pressure dispersion plate arranged above a second principal surface of the second pressure sensor. The first pressure dispersion plate and the second pressure dispersion plate are separately arranged.
A filter device includes first and second acoustic wave resonators each including a support, a piezoelectric layer that has an X-axis, a Y-axis, and a Z-axis that are crystal axes and is made of Y-cut lithium niobate, and an IDT electrode including first and second electrode fingers. When a thickness of the piezoelectric layer is d and a center-to-center distance of the first and second electrode fingers and the second electrode fingers adjacent to each other is p, d/p is less than or equal to 0.5. An absolute value of a first slant angle α1 differs from an absolute value of a second slant angle α2.
A tactile sense is provided that gives an impression closer to a psychological impression intended to be given by the tactile sense. In an aspect, a signal generation device acquires external parameters including parameters indicative of sensory characteristics, and generates a waveform signal based on the external parameters to cause an object to vibrate.
A coil component includes a core including a winding core portion, a first flange portion, and a second flange portion, and a plate member that is mounted on the first flange portion and the second flange portion. A distance in a height direction between the plate member and the first flange portion, or a distance in the height direction between the plate member and the second flange portion, or both vary in a length direction, or in a width direction, or both.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 41/064 - Winding non-flat conductive wires, e.g. rods, cables or cords
A resonator is provided that includes a vibrating portion including three or more vibrating arms with at least two vibrating arms that bend out of plane with different phases and a base. The resonator also includes a frame that holds the vibrating portion; and a support arm having one end connected to the frame and the other end connected to a rear end portion of the base. The other end of the support arm is connected to a position in a range from −0.1 WB to 0.1 WB, with respect to a base width WB of the base, relative to a position, on the rear end portion of the base where a center line passes in a plan view. A support arm length of the support arm is 0.2 or more times and 0.4 or less times a vibrating arm length of the vibrating arms.
An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H01B 3/12 - Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
C04B 35/00 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
A radio-frequency module includes a module substrate having main surfaces facing each other, a transmission filter that has a bottom surface and a top surface facing each other and passes a radio-frequency signal, and an external connection terminal disposed on the main surface. The bottom surface faces the main surface and is disposed closer to the main surface than the top surface. The radio-frequency module further includes a metal electrode joined to the top surface.
A solid electrolyte ceramic that has a garnet-type crystal structure, and contains: at least Li (lithium), La (lanthanum), and O (oxygen); and one or more transition metal elements selected from the group consisting of Co (cobalt), Ni (nickel), Mn (manganese), and Fe (iron), wherein, when a content of La and a total content of the one or more transition metal elements are denoted respectively by X (mol %) and Y (mol %), the solid electrolyte ceramic satisfies any one of the following relational expressions (1) to (3): (1) 0.01≤Y≤6.0 in the range of 147.5
An acoustic wave element includes an electrode-finger pitch of reflecting-electrode fingers greater than an electrode-finger pitch pi of comb-shaped electrode fingers, and a center-to-center distance between a reflecting-electrode finger and a comb-shaped electrode finger is equal to or less than about 0.9 times the electrode-finger pitch of the reflecting-electrode fingers. When a reflecting-electrode finger counted from a closest reflecting-electrode finger is designated as a k-th reflecting-electrode finger in order, a reflecting-electrode finger farthest from the IDT electrode is defined as an (n+1)-th reflecting-electrode finger, and an electrode-finger pitch between the k-th reflecting-electrode finger and a (k+1)-th reflecting-electrode finger is defined as a k-th electrode-finger pitch pk, a value of electrode-finger pitches from a first electrode-finger pitch p1 to the k-th electrode-finger pitch pk is less than a value of electrode-finger pitches from a (k+1)-th electrode-finger pitch pk+1 to an n-th electrode-finger pitch pn.
A filter device includes a first filter including a first input terminal, a first output terminal, a first series arm including first series arm resonators, and first parallel arms connected to the first series arm and each including a first parallel arm resonator, the first filter having a pass band in a predetermined frequency band, a second filter including a second input terminal, a second output terminal, a second series arm including second series arm resonators, and second parallel arms connected to the second series arm and each including a second parallel arm resonator, the second filter having a pass band in the predetermined frequency band, a substrate including the first and second filters, and an inductor connected between a ground terminal and a parallel arm resonator included in at least one parallel arm of the first and second parallel arms.
An acoustic wave device includes a support substrate having a thickness in a first direction, a piezoelectric layer on the support substrate, and an interdigital transducer electrode on the piezoelectric layer and including first and second electrode fingers extending in a second direction crossing the first direction. The second electrode fingers face the first electrode fingers in a third direction orthogonal or substantially orthogonal to the second direction. The support substrate and the piezoelectric layer include a hollow therebetween at a position at least partially overlapping the interdigital transducer electrode in the first direction. At least one through hole penetrates the piezoelectric layer at a position not overlapping the interdigital transducer electrode in the first direction, and the through hole communicates with the hollow. A reinforcing support extends inside the hollow in a region overlapping the hollow and not overlapping the first and second electrode fingers.
An acoustic wave device includes a support, a piezoelectric layer on the support, and an IDT electrode including first and second electrode fingers. When a thickness of the piezoelectric layer is d and a center-to-center distance of the first and second electrode fingers adjacent to each other is p, d/p is less than or equal to about 0.5. When an imaginary line connecting tips of the first electrode fingers is an envelope, a direction in which the envelope extends and the direction of the Y-axis intersect each other, and about 9°≤|α|≤about 14° is satisfied, where |α| is an absolute value of a slant angle α. The slant angle α is an angle of a corner defined by the direction in which the envelope extends and the direction of the Y-axis and is an angle other than 0°.
An inductor device includes a substrate, first and second coils in the substrate and connected in series, and first and second terminals. The first terminal is connected to the first coil, and the second terminal is connected to the second coil. Each of the first and second coils is a spiral or helical coil wound with more than one turn. At least a portion of the first coil overlaps at least a portion of the second coil when seen in a plan view from a direction perpendicular or substantially perpendicular of the substrate. A direction of a magnetic field generated by the first coil is opposite to a direction of a magnetic field generated by the second coil.
H01F 27/34 - Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
A coil component capable of holding a core in a stable posture by a chuck in a winding step of a wire. The core includes a winding core portion extending in an axial direction, and a first flange portion and a second flange portion provided at end portions of the winding core portion opposite to each other in the axial direction. Each of outer end surfaces of the first flange portion and the second flange portion has a first ridge extending along a ridgeline where the outer end surfaces intersect first side surfaces and a second ridge extending along a ridgeline where the outer end surfaces intersect second side surfaces.
A coil component includes a core. The core includes a winding core portion extending in an axial direction, and first and second flange portions respectively at end portions of the winding core portion opposite to each other in the axial direction. Each of the first and second flange portions includes raised portion raised at a central portion in a direction orthogonal to the axial direction and shoulder portions lower than the raised portion on both sides of the raised portion. A recess is on an inner end surface on which the end portion of the winding core portion in the axial direction in each of the first and second flange portion is positioned, and at least an end portion of the winding core portion in the axial direction is in the recess, is on the raised portion side, and bites into the inner end surface.
A surface electrode having a first surface and a plurality of electrode elements disposed on the first surface and spaced from each other in a manner so as to be configured to contact a measured surface of an object to be measured; a stretchable wire electrically connecting the plurality of electrode elements; and a stretchable insulator covering a side of the stretchable wire adjacent to the electrode elements.
H01B 1/04 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon, or silicon
H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
An acoustic wave device includes a piezoelectric layer including first and second main surfaces facing each other, an IDT electrode on the first main surface and including first and second busbars facing each other and electrode fingers, a first conductor on the second main surface and facing the first busbar with the piezoelectric layer therebetween, and a support on the second main surface and supporting the piezoelectric layer. A cavity that opens towards the piezoelectric layer is provided in the support, and the first conductor is positioned inside the cavity. An electric potential of the first conductor is different from an electric potential to which the first busbar is connected.
An acoustic wave device includes a support substrate having a thickness in a first direction, a piezoelectric layer on the support substrate, an interdigital transducer electrode on the piezoelectric layer and including first and second electrode fingers, the first electrode fingers extending in a second direction crossing the first direction, the second electrode fingers extending in the second direction and facing the first electrode fingers in a third direction orthogonal or substantially orthogonal to the second direction, and a reinforcing film on the piezoelectric layer. The support substrate and the piezoelectric layer include a hollow therebetween at a position overlapping the interdigital transducer electrode in the first direction. At least one through hole penetrates the piezoelectric layer at a position not overlapping the interdigital transducer electrode in the first direction, and the through hole communicates with the hollow. The reinforcing film overlaps the hollow in the first direction.
A wireless power reception circuit system includes a wireless power reception circuit, an electric storage device, a load unit, a digital control circuit, a voltage conversion circuit, a DC-DC converter, smoothing capacitors, a voltage OR circuit, and an external signal setting circuit for resetting the digital control circuit. An enable signal input terminal of the voltage conversion circuit is in a disabled state when the voltage conversion circuit is not controlled by the digital control circuit. The digital control circuit supplies an enable signal to the enable signal input terminal of the voltage conversion circuit when operating the voltage conversion circuit.
H02J 50/12 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02M 3/157 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
The radio frequency module includes a module substrate, an electronic component disposed on a main surface, a resin member covering at least part of the main surface and at least part of a side surface of the electronic component, and a metal shield layer that is formed on a surface of the resin member and is set to a ground potential. The electronic component has a top surface in contact with the metal shield layer, a bottom surface facing the main surface, a circuit portion formed at a position closer to the bottom surface than to the top surface, and a metal layer formed between the metal shield layer and the circuit portion. The metal layer is a barrier metal.
In simultaneous communication using multiple frequency bands, the degradation in the communication quality is suppressed. The radio-frequency front-end circuit (1) includes an antenna terminal (2), a transmit filter (3), a receive filter, a transport filter, a switch (6), and a phase adjusting circuit (7). The switch (6) is capable of connecting the antenna terminal (2) to the transmit filter (3) or the receive filter and the transport filter simultaneously. The transmit filter (3) is disposed on a transmission path (T1). The receive filter is disposed on a reception path. The transport filter is disposed on a transport path. The phase adjusting circuit (7) is disposed on at least one of paths, the transmission path (T1), the reception path, and a reception/transmission path.
A radio-frequency front-end circuit includes a first switch and a first transfer circuit that transfers a first radio-frequency signal. The first switch includes a first antenna terminal connected to a first antenna, a second antenna terminal connected to a second antenna, and first and second selection terminals. The first selection terminal is connected to the first transfer circuit, and the second selection terminal connected to a second transfer circuit. The second transfer circuit transfers the second radio-frequency signal. Selection between conduction of the first antenna terminal with the first selection terminal and conduction of the first antenna terminal with the second selection terminal is exclusively carried out in the first switch. Selection between conduction of the second antenna terminal with the first selection terminal and conduction of the second antenna terminal with the second selection terminal is exclusively carried out in the first switch.
A coil conductor of each of a U-phase, a V-phase, and a W-phase is provided with a configuration in which a terminal wiring conductor, a first tooth conductor wound around a first tooth, a bridging line conductor, a second tooth conductor wound around a second tooth, and a neutral-point connection conductor are connected in this order. The terminal wiring conductor is connected to the first tooth conductor at an upper side of an insulator. The bridging line conductor is disposed on an upper side of the insulator disposed on a stator core and along an outer side portion of a tooth of another phase. The neutral-point connection conductor is connected to the second tooth conductor at a lower side of the insulator.
H02K 5/22 - Auxiliary parts of casings not covered by groups , e.g. shaped to form connection boxes or terminal boxes
H02K 15/00 - Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
H02K 15/02 - Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of stator or rotor bodies
H02K 3/28 - Layout of windings or of connections between windings
A multilayer ceramic capacitor includes a multilayer body including first and second dielectric layers, two main surfaces, two lateral surfaces, two end surfaces, and an inner layer portion including first and second internal electrodes laminated alternately therein with one of the dielectric layers interposed therebetween, outer dielectric layer portions that sandwich the inner layer portion in a lamination direction, and side gap portions that sandwich the inner layer portion and the outer layer portions in a width direction. The multilayer body includes first and second external electrodes connected to the first and second internal electrodes, respectively. The first external electrode includes a main surface electrode portion on at least one of the two main surfaces, and a lateral surface electrode portion connected to at least one lateral surface side end portion of each of the first internal electrodes and is covered with one of the side gap portions.
A high-frequency signal processing apparatus and a wireless communication apparatus can achieve a decrease in power consumption. For example, when an indicated power level to a high-frequency power amplifier is equal to or greater than a second reference value, envelope tracking is performed by causing a source voltage control circuit to control a high-speed DCDC converter using a detection result of an envelope detecting circuit and causing a bias control circuit to indicate a fixed bias value. The source voltage control circuit and the bias control circuit indicate a source voltage and a bias value decreasing in proportion to a decrease in the indicated power level when the indicated power level is in a range of the second reference value to the first reference value, and indicate a fixed source voltage and a fixed bias value when the indicated power level is less than the first reference value.
An acoustic wave device includes a support including a support substrate, a piezoelectric layer on the support, and an IDT electrode on a first main surface of the piezoelectric layer, wherein the support includes an air gap portion opened on a piezoelectric layer side, the support includes an inner side wall facing the air gap portion, and a high thermal conductive film is directly or indirectly laminated on at least a portion of a second main surface of the piezoelectric layer and extends to the inner side wall of the support.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
An elastic wave device includes a piezoelectric substrate made of LiNbO3, an IDT electrode on the piezoelectric substrate, and a dielectric film on the piezoelectric substrate and covering the IDT electrode. The IDT electrode includes a first electrode layer on or above the piezoelectric substrate and including W or an alloy including W, and a second electrode layer on or above the first electrode layer. A thickness of the first electrode layer is not smaller than 0.062λ, λ being a wavelength determined by a pitch of electrode fingers of the IDT electrode. The piezoelectric substrate has Euler angles of (0°± about 5°, θ, 0°± about 10°), ↓ being not smaller than 8° and not larger than 32°.
An elastically deformable electrode that includes a plurality of electrode elements spaced from each other, and a liquid wire which is a liquid conductor configured to electrically connect the plurality of electrode elements. The electrode may also include a solid wire sealing the liquid wire, and an insulator between the solid wire and the plurality of electrode elements.
A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.
An acoustic wave device includes a support including a support substrate, a piezoelectric layer on the support, and an excitation electrode on the piezoelectric layer. A hollow portion is provided in the support and overlaps with at least a portion of the excitation electrode in plan view. The support includes a cavity opening on a side of the piezoelectric layer, and an inner wall surface connected to the cavity and facing the hollow portion. A functional film is provided on at least a portion of the inner wall surface and has an electromagnetic-wave absorption capacity in a wavelength range from about 0.2 µm to about 1.2 µm inclusive.
H03H 9/08 - Holders with means for regulating temperature
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
An acoustic wave device includes a substrate, first and second resonators above the substrate, and an energy confinement portion. The first resonator includes a first piezoelectric film including a first main surface facing a second main surface, both having anisotropy. First and second electrodes are provided on the first or second main surface. The second resonator includes a second piezoelectric film including a third main surface facing a fourth main surface, both having anisotropy. Third and fourth electrodes are provided on the third or fourth main surface. In the first resonator, a first excitation portion is where the first and second electrodes overlap or where the first electrode faces the second electrode. In the second resonator, a second excitation portion is where the third and fourth electrodes overlap or where the third electrode faces the fourth electrode. The first and second excitation portions have shapes including length directions that differ.
A multilayer circuit board having a signal and power isolation circuit, which can suppress the capacitive coupling between a chip inductor and a ground layer below the chip inductor and also suppress the characteristic impedance change occurring in a mounting pad on a microstrip line. Portions of the inner-layer ground below both the mounting pad on the microstrip line and the chip inductors connected to the mounting pad are separately removed respectively as the signal transmission characteristic compensation removal portion, which is formed by removing a portion having a predetermined area and situated immediately below the mounting pad, and the inductor characteristic compensation removal portion, which is formed by removing a mounting-surface-below portion having a predetermined area and situated immediately below the chip inductors. The signal transmission characteristic compensation removal portion and the inductor characteristic compensation removal portion are electrically isolated from each other with the predetermined distance therebetween.
A circuit module includes a circuit module substrate having an area smaller than a large-scale circuit board, an electronic circuit component mounted on the circuit module substrate, a connection pin provided to the circuit module substrate, and a circuit-module-substrate-side fitting structure part provided to the circuit module substrate. A pin receptacle and the connection pin are electrically connected to each other. A non-conductive thermal adhesive layer is formed between a surface of the circuit module substrate and a surface of a base material of the large-scale circuit board facing to each other, the non-conductive thermal adhesive layer electrically insulating and thermally joining the surfaces by a non-conductive thermally conductive material.
An acoustic wave filter includes a first ladder circuit including a first series arm resonator and a first parallel arm resonator, a second ladder circuit including a second series arm resonator and a second parallel arm resonator, and a third ladder circuit including a third series arm resonator and a third parallel arm resonator. The first, second and third ladder circuits are cascade-connected in order. A condition of fas1>fas2>fas3>frp1>frp2>frp3 is satisfied, where fas1 represents an anti-resonant frequency of the first series arm resonator, fas2 represents an anti-resonant frequency of the second series arm resonator, fas3 represents an anti-resonant frequency of the third series arm resonator, frp1 represents a resonant frequency of the first parallel arm resonator, frp2 represents a resonant frequency of the second parallel arm resonator, and frp3 represents a resonant frequency of the third parallel arm resonator.
A radio-frequency module includes a first base made of a first semiconductor material; a second base that is made of a second semiconductor material having a thermal conductivity lower than that of the first semiconductor material and which includes a power amplifier circuit; a third base including a transmission filter circuit; and a module substrate having a main surface on which the first base, the second base, and the third base are arranged. The first base is joined to the main surface via an electrode. The second base is arranged between the module substrate and the first base in a sectional view and is joined to the main surface via an electrode. At least part of the first base is overlapped with at least part of the second base and at least part of the third base in a plan view.
H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles
A radio frequency module includes a module substrate having a principal surface, one or more circuit components disposed on a principal surface side, a resin member disposed on the principal surface side and covering a side surface of the one or more circuit components, a metal shield layer in contact with a top surface of the resin member and a top surface of the one or more circuit components, and an engraved portion provided on the top surface of the one or more circuit components.
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
A wireless communication device manufacturing system includes: a mounting apparatus including a mounting head mounted with a suction nozzle that sucks and holds an RFIC module including an RFIC chip, a terminal electrode, and a hot melt adhesive layer; a conveyance apparatus configured to convey the antenna base material including an antenna pattern to a mounting position; and a heating apparatus configured to heat the hot melt adhesive layer of the RFIC module. The wireless communication device manufacturing system bonds the RFIC module in a state where the hot melt adhesive layer is softened by heating of the heating apparatus to the antenna base material disposed at the mounting position through the hot melt adhesive layer, and capacitively couples the antenna pattern and the terminal electrode through the hot melt adhesive layer.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
An electronic card of a wireless communication charging circuit system includes a power reception coil, a power reception circuit, a power storage device, a charging circuit, a voltage conversion circuit that is connected to the power storage device and generates a prescribed power supply voltage, a communication antenna , a communication circuit that performs communication using output power of the voltage conversion circuit, and a control circuit that controls the voltage conversion circuit and the charging circuit. The control circuit sets a power path in a communication period so that the communication circuit performs communication and power used by a microcontroller is supplied from the power storage device, and sets a power path in a charging period so that a reader-writer device, which was made to recognize the communication circuit, generates a magnetic field and power used by the microcontroller is supplied from the power reception circuit.
H02J 50/12 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
H02J 50/80 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
H04B 5/00 - Near-field transmission systems, e.g. inductive loop type
A radio-frequency module includes a module substrate having main surfaces facing each other, a first base material at least partially formed of a first semiconductor material, and a second base material at least partially formed of a second semiconductor material having thermal conductivity higher than that of the first semiconductor material and in which a power amplifier circuit is formed. The first base material and the second base material are arranged on the main surface, the second base material is arranged between the module substrate and the first base material, bonded to the first base material, and connected to the main surface with an electrode interposed therebetween, one of the first base material and the second base material is connected to the main surface with an electrode interposed therebetween, and in plan view of the module substrate, an area of the electrode is larger than an area of the electrode.
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
A multilayer ceramic capacitor includes a multilayer body including dielectric layers, internal electrode layers, and first and second end surfaces facing each other in a length direction, a first external electrode on a side of the first end surface, and a second external electrode on a side of the second end surface. The first and second external electrodes each include lower and upper electrode layers, the lower electrode layers include a metal component and a glass component, the upper electrode layers include a metal component and a glass component, and include pores, an amount of the glass component in the upper electrode layers is less than an amount of the glass component in the lower electrode layers, and a maximum inscribed circle diameter of the pores in the upper electrode layers is greater than or equal to about 0.02 μm and less than or equal to about 0.52 μm.
Provided are a transformer and a method for manufacturing a transformer. The transformer includes a magnetic core including: a top substrate and a bottom substrate arranged opposite to each other, and a plurality of winding posts located therebetween; and a winding including a primary side winding wrapped around the plurality of winding posts and a secondary side winding. The primary side winding includes two sub-windings connected in parallel, each including: a main turn including respective at least one turn wrapped on at least two winding posts, respectively, and the at least two winding posts have a single magnetic flux direction; and an additional turn including at least one turn wrapped on at least one additional winding post on which a corresponding main turn of the other sub-winding wraps, and the additional turn has a magnetic flux direction opposite to the single magnetic flux direction.
H01F 27/30 - Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
H01F 1/03 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
H01F 27/00 - MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - Details of transformers or inductances, in general
H01F 27/245 - Magnetic cores made from sheets, e.g. grain-oriented
A multilayer ceramic capacitor includes a multilayer body including dielectric layers, first and second internal electrode layers on the dielectric layers and respectively exposed at first and second end surfaces, and first and second external electrodes respectively located on first and second end surfaces of the multilayer body. The multilayer body includes an inner layer portion, and first and second main-surface-side outer layer portions each including a protective structure made of metal and not overlapping the inner layer portion when the multilayer ceramic capacitor is seen from above. The protective structure is not in contact with first and second end surfaces.
H01G 2/00 - CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE - Details of capacitors not covered by a single one of groups
A multilayer ceramic capacitor includes a multilayer body including an inner layer portion including dielectric layers and internal electrodes, and outer layer portions, two external electrodes each including a foundation electrode layer connected to the internal electrodes, and a conductive resin layer in contact with the foundation electrode layer. An end region of each of the internal electrodes is connected to the foundation electrode layer and is thicker than regions of the respective internal electrodes other than the end region. The internal electrodes include first and second internal electrodes. The first internal electrodes each include a first opposing portion, and a first lead-out portion. The second internal electrodes each include a second opposing portion, and a second lead-out portion. Distances between end regions of the first and second lead-out portions adjacent to each other are shorter than distances between the respective first and second opposing portions adjacent to each other.
A magnetic coupling coefficient between a power reception coil and a communication antenna is 0.3 or less. A power management circuit suppresses electromagnetic interference between the power reception coil and the communication antenna in a predetermined time period by causing a rectification stopping circuit to operate to keep the rectification stopping circuit in an operation state in the predetermined time period with a received power voltage exceeding a first threshold value and by changing a resonant frequency of a power reception resonant circuit to a frequency different from a frequency being used in a wireless communication circuit to keep the resonant frequency in a changed state.
H02J 50/12 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
H02J 50/80 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
H02M 3/335 - Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
H04B 5/00 - Near-field transmission systems, e.g. inductive loop type
A filter that includes: a filter base portion having a first main surface and a second main surface opposite to the first main surface, the filter base defining a plurality of through-holes communicating between the first main surface and the second main surface; and a support portion on the filter base portion, wherein the support portion includes: a main body portion on the first main surface and including a plurality of fixing portions in some of the plurality of through-holes; and a protruding portion protruding toward an outer side portion of the main body portion in a direction along the first main surface from a fixing portion located on a sidewall side of the main body portion among the plurality of fixing portions, and a thickness of the protruding portion is smaller than a thickness of the main body portion.
B01D 29/05 - Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups ; Filtering elements therefor with flat filtering elements supported
B01D 39/20 - Other self-supporting filtering material of inorganic material, e.g. asbestos paper or metallic filtering material of non-woven wires
C12N 1/02 - Separating microorganisms from their culture media
A radio frequency module includes a module board, a transmission power amplifier, a first inductance element mounted on a first principal surface and connected to an output terminal of the transmission power amplifier, a reception low-noise amplifier, and a second inductance element mounted on a first principal surface connected to an input terminal of the reception low-noise amplifier. In a plan view of the module board, a conductive member mounted on the first principal surface is disposed between the first inductance element and the second inductance element.
An integrated circuit includes a first base that has at least a part formed of a first semiconductor material and that includes an electric circuit (for example, a control circuit or a switching circuit), a second base that has at least a part formed of a second semiconductor material having a thermal conductivity lower than the first semiconductor material and that includes a power amplifier circuit, and a low thermal conductive member that has at least a part formed of a low thermal conductive material having a thermal conductivity lower than the second semiconductor material and that is disposed between the electric circuit and the power amplifier circuit. At least a part of the first base overlaps at least a part of the second base in plan view.
A radio frequency module includes a module substrate having a main surface, a first circuit component arranged on the main surface, a resin member arranged on the main surface and covering a side surface of the first circuit component, a metal shield layer in contact with a top surface of the resin member and a top surface of the first circuit component, and an engraved portion provided on the top surface of the resin member. When the main surface is viewed in plan, the engraved portion does not overlap the first circuit component.
Provided is a battery that has a high capacity retention ratio and has a shape that is not swollen, if the battery is repeatedly charged and discharged. Provided is a battery including: an electrode body where a positive electrode and a negative electrode are alternately stacked with a separator provided therebetween and wound in a flattened shape; an electrolyte; and an exterior material, where at least one of the electrolyte, the separator, or the exterior material includes a filler, and the filler includes a zeolite having no Si as a constituent element.
In an acoustic wave device, a piezoelectric layer is provided directly or indirectly on a support substrate, an IDT electrode is provided on the piezoelectric layer, an overlap region includes a middle region and first and second edge regions, and first and second conductive layers are provided on a second main surface of the piezoelectric layer to overlap at least some portions of the first and second edge regions in plan view and at least some portions of first and second busbars in plan view.
An acoustic wave device is provided that includes a piezoelectric layer including lithium niobate or lithium tantalate, and a series arm resonator and a parallel arm resonator that each include at least a pair of a first electrode and a second electrode on the piezoelectric layer. The acoustic wave device uses a bulk wave in a first thickness-shear mode. Moreover, a film thickness of a first portion of the piezoelectric layer in the series arm resonator is different from a film thickness of a second portion of the piezoelectric layer in the parallel arm resonator. In each of the series arm resonator and the parallel arm resonator, assuming a film thickness of the piezoelectric layer is d and a distance between centers of the first electrode and the second electrode adjacent to each other is p, a ratio d/p is less than or equal to about 0.5.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
A tire observation apparatus includes an imager to acquire image information on a traveling vehicle, a trajectory estimator, a position adjuster, and a movable assembly. The trajectory estimator is operable to estimate a trajectory of a tire based on image information obtained at at least one point in time and tire information including at least one of a width, a diameter, and a groove pattern of the tire. The position adjuster calculates, based on the trajectory, an adjustment amount that satisfies observation conditions regarding a position and an angle of the imager to observe a state of the tire. The movable assembly changes the position and the angle of the imager based on the adjustment amount.
A periscope camera module includes a refractor to refract, in a direction of a second optical axis, incoming light that entered along a first optical axis, and a driver to rotate the refractor together with a holder around a first rotation axis and a second rotation axis. The driver includes a magnet and coils. The magnet is provided on the holder opposite to a side on which the incoming light enters the refractor in a direction of the first optical axis, and the coils face the magnet, and are provided on the same or substantially the same plane perpendicular or substantially perpendicular to the first optical axis.
A filter device is provided that includes a substrate and a piezoelectric plate attached to the substrate. A conductor pattern is formed at a first surface of the piezoelectric plate and includes interdigital transducers of series and shunt resonators that each have interleaved fingers at respective diaphragms of the plate suspended. A first dielectric coating layer is formed over the interleaved fingers of the IDTs and on the first surface of the piezoelectric plate; and a second dielectric coating layer is formed on the second surface of the piezoelectric plate that is opposite the first surface. The second dielectric coating layer of the shunt resonator has a greater thickness than a thickness of the at least one second dielectric coating layer of the series resonator.
H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
A laminate structure that includes: a resin film containing a thermoplastic resin and having a plurality of voids; and a conductor layer adjacent to a main surface of the resin film, wherein a first set of voids of the plurality of voids are localized between a first position proximal to an end surface of the resin film facing the conductor layer and a second position distant from the first position by one-third of the thickness of the resin film in a lamination direction of the resin film and the conductor layer such that the first set of voids between the first position and the second position are greater in number than a second set of voids between the second position and a third position distant from the second position by one-third of the thickness of the resin film in a direction away from the first position in the lamination direction.
A container including an RFID module is provided that includes a base, a metal film, and a slit. The base has an insulating property. The metal film is on a first main surface of the base. The slit separates the metal film into a first metal region and a second metal region. The RFID module includes an RFIC element, a filter circuit configured to transmit a current due to an electromagnetic wave at a natural resonance frequency being a communication frequency to the RFIC element, and first and second electrodes to be connected to the filter circuit. The first electrode of the RFID module and the first metal region of the metal film are electrically connected to each other. The second electrode of the RFID module and the second metal region of the metal film are electrically connected to each other.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
A film capacitor that includes a wound body having a dielectric film and a metal layer. When a film face positioned at an average height in the thickness direction is defined in an area range of 100 μm by 140 μm of the first main surface of the dielectric film, an area ratio of a region having a height higher than the film face by 0.05 μm or more and less than 0.20 μm is 6.04% or less, an area ratio of a region having a height higher than the film face by 0.20 μm or more and less than 2.50 μm is 0.0998% to 1.13%, and an area ratio of a region having a height higher than the film face by 2.50 μm or more is 0.100% or less.
Disclosed herein are systems and methods for force wave determination. A method includes receiving both first candidate information indicating a first candidate force wave as a candidate of a force wave and second candidate information indicating a second candidate force wave as a different candidate of the force wave; modulating the first candidate force wave and the second candidate force wave by the envelope based on the first candidate information and the second candidate information, respectively, to generate a first waveform signal and a second waveform signal; configuring the target object to generate a first candidate vibration based on the first waveform signal and a second candidate vibration based on the second waveform signal, respectively; receiving a selection of one of the first candidate vibration and the second candidate vibration; and determining the force wave based on the selection.
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