A circuit board that includes a ceramic substrate; a protruding electrode on a surface of the ceramic substrate; and a protective layer containing a metal oxide and covering at least a portion of a lateral surface of the protruding electrode and extending continuously across a boundary between the portion of the lateral surface of the protruding electrode and the surface of the ceramic substrate.
A thermal analysis method and apparatus, and a computer program that enable highly accurate heat transfer simulation of a structure or space, while reducing calculation costs. By performing thermal analysis on a structure or space using the calculation meshes generated by initial dividing means, the spatial distribution of heat flux vectors J and temperature gradient vectors ∇T are calculated; by calculating the volume integrals of the inner products J·∇T of the heat flux vectors J and the temperature gradient vectors ∇T for individual partitioned regions and acquiring the absolute values of the volume integrals, thermal management sensitivity indices are calculated for the partitioned regions. Subsequently, partition of calculation meshes and subdivision of partitioned regions are performed on a predetermined number of partitioned regions that indicate greater indices among the calculated thermal management sensitivity indices, for example one partitioned region. Thermal analysis is performed again using the calculation meshes.
A power amplifier circuit includes an amplifier transistor having a collector terminal, an emitter terminal, and a base terminal, bias circuits, and a current limiter circuit. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current from an emitter terminal to the base terminal. The current limiter circuit includes a current limiting transistor an emitter terminal of which is connected to the bias circuit, a resistive element connected between the current limiting transistor and a power supply terminal, and a resistive element connected between the current limiting transistor and the constant current amplifier transistor. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current i3 from an emitter terminal to the base terminal.
A coil component includes a first outer magnetic body, a first outer insulator, a first inner magnetic body, an inner insulator, a second inner magnetic body, a second outer insulator, and a second outer magnetic body stacked sequentially, and a coil in the inner insulator and an internal magnetic body inside the coil. Volumes A, B, C, and D of the first and second outer insulators, the inner insulator, the coil, and the internal magnetic body, respectively, and volume E of the first outer magnetic body, the first inner magnetic body, the second inner magnetic body, and the second outer magnetic body satisfy 0.05≤A≤0.07, 0.2≤B≤0.4, 0.01≤C≤0.08, 0.03≤D≤0.05, and 0.4≤E≤0.71, where 0.05B≤C≤0.2B and A+B+C+D+E=1.
An inductor component includes first and second internal wiring lines, an interlayer insulating layer between the first and second internal wiring lines and having a first main surface facing the first internal wiring line, a second main surface facing the second internal wiring line, and a via extending between the first main surface and the second main surface, and a via wiring line inserted through the via that electrically connects the first and second internal wiring lines. In a first section including a central axis of the via wiring line, the first main surface includes a first portion in contact with the first internal wiring line. The second main surface includes a second portion that is parallel to the first portion. A straight line that includes the first portion is a first reference line. A straight line that includes the second portion is a second reference line.
An inductor component includes: a first internal conductor; a second internal conductor; an insulating interlayer disposed between the first internal conductor and the second internal conductor and having a first main surface on the first internal conductor side, a second main surface on the second internal conductor side, and a via extending therethrough between the first main surface and the second main surface; and a via conductor inserted through the via and electrically connecting the first internal conductor and the second internal conductor. In a first section including a central axis of the via conductor, the via conductor has a wedge portion interposed between the insulating interlayer and the first internal conductor in a direction parallel to the central axis.
A directional coupler includes a main line, a first sub-line, a second sub-line, a first phase shift circuit, a first short-circuit path, and a first short-circuit switch. The first phase shift circuit is connected between the first sub-line and the second sub-line. The first short-circuit path short-circuits both ends of the first phase shift circuit. The first short-circuit switch switches between conduction and non-conduction of the first short-circuit path.
H01P 5/18 - Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
A highly reliable multilayer coil component in which the internal stress is further alleviated, and a method for producing the same. The method produces a multilayer coil component that includes an insulator portion, a coil that is embedded in the insulator portion and includes a plurality of coil conductor layers electrically connected to one another, and an outer electrode that is disposed on a surface of the insulator portion and is electrically connected to an extended portion of the coil. The method includes forming a conductive paste layer by using a conductive paste; forming an insulating paste layer by using an insulating paste; forming a multilayer compact that includes the conductive paste layer and the insulating paste layer; and firing the multilayer compact, in which the conductive paste has a PVC of 60% or more and 80% or less (i.e., from 60% to 80%).
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
There is provided a power amplifier circuit capable of adjusting the gain according to the power mode. A power amplifier circuit includes: a splitter outputting an input signal by splitting the input signal to a signal RF1 and a signal RF2; amplifiers connected to the splitter; and an amplifier provided in or on a signal path branching from between the splitter and an input of the amplifier, connected in parallel with the amplifier, and connected to a biasing terminal supplied with a third bias current or voltage.
A Doherty amplifier circuit includes a carrier amplifier including one or more amplifiers, and a peaking amplifier including one or more amplifiers. At least one of the amplifiers includes a first transistor and a current draw circuit. The first transistor receives, at its base or gate, a first radio frequency signal, and outputs, from its emitter or source, a second radio frequency signal obtained by amplifying the first radio frequency signal. The current draw circuit draws, from the emitter or source of the first transistor, a current based on a control signal.
An inductor component includes a base body, first and second inner wiring line inside the base body, an inter-layer insulation layer, and a via-wiring line. The inter-layer insulation layer is inside the base body, and between the first and second inner wiring lines. The inter-layer insulation layer includes first and second major faces and a via-hole. The first major face faces the first inner wiring line. The second major face faces the second inner wiring line. The via-hole extends through the inter-layer insulation layer between the first and second major faces. The via-wiring line is in the via-hole, and electrically connects the first and second inner wiring lines. As seen in a first cross-section including a center axis of the via-wiring line, the via-wiring line includes a first portion in contact with the first inner wiring line, and a second portion in contact with the second inner wiring line.
A solid electrolytic capacitor that includes: an anode plate made of a valve metal; a porous layer on at least one of principal surface of the anode plate; a dielectric layer on a surface of the porous layer; a cathode layer that includes a solid electrolyte layer on the dielectric layer, the cathode layer including two or more cathode portions; a first insulating layer that surrounds at least one of the cathode portions as viewed in a thickness direction of the solid electrolytic capacitor, wherein a material of the first insulating layer fills a portion of the porous layer and is also present on a surface of the filled portion of the porous layer; and a first piercing section that pierces through both of the porous layer and the first insulating layer in the thickness direction.
A resonance device that includes: a first substrate having a first silicon substrate and a resonator, wherein the resonator includes a single-crystal silicon film and a first silicon oxide film interposed between the single-crystal silicon film and the first silicon substrate, and a through hole that passes through the single-crystal silicon film and the first silicon oxide film; a second substrate opposite the first substrate; a frame shaped bonding portion that bonds the first substrate to the second substrate to seal a vibration space of the resonator; and a first blocking member disposed in an interior of the through hole and surrounding a vibration portion of the resonator in a plan view of the first substrate so as to divide the first silicon oxide film, wherein the first blocking member has a lower helium permeability than the first silicon oxide film.
H03H 3/007 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
H03H 9/24 - Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
14.
RADIO FREQUENCY CIRCUIT, COMMUNICATION DEVICE, AND CONTROL METHOD
A radio frequency circuit that supports simultaneous communication using downlink MIMO in a first band and uplink communication in a second band includes first and second power amplifiers connected to first and second antenna terminals, respectively. When a first SRS in the first band is output through the first antenna terminal, the first power amplifier amplifies the first SRS, according to a first deterioration amount of a signal-to-noise ratio in the first band due to distortion of a transmission signal in the second band having leaked in through the first antenna terminal, and when a second SRS in the first band is output through the second antenna terminal, the second power amplifier amplifies the second SRS, according to a second deterioration amount of the signal-to-noise ratio in the first band due to distortion of the transmission signal in the second band having leaked in through the second antenna terminal.
A power amplifier circuit includes external input and output terminals; a first power amplifier with first input and output terminals, the first input terminal being connected to the external input terminal, the first output terminal being connected to the external output terminal; a second power amplifier having second input and output terminals, the second input terminal being connected to the external input terminal, the second output terminal being connected to the external output terminal; a power supply terminal that receives a power supply voltage that is supplied to the first power amplifier and controllably supplied to the second power amplifier; and a switch having first and second terminals, the first terminal being connected to the power supply terminal, the second terminal being connected to the second power amplifier.
An electrical device includes a thermally insulating layer including first and second opposing surfaces. The first surface of the thermally insulating layer is on a first surface of the electrical device. A thermally conductive layer is on the second surface of the thermally insulating layer. The electrical device further includes one or more thermal conductors in thermal contact with the thermally conductive layer to transfer heat away from the thermally conductive layer via one or more coolers provided externally to the electrical device. Such a composite layer arrangement maintains a temperature of a surface at a low value, allowing low temperature rated electronic components to be mounted directly onto the electrical device.
A directional coupler includes a main line, a sub-line, an output terminal, a first termination circuit, and a termination switch. The sub-line includes a first end and a second end. The output terminal is connected to one end of the first end and the second end. The first termination circuit connects a first output path, which connects the one end and the output terminal, to a ground. The termination switch switches between connection and non-connection between the first output path and the first termination circuit.
H03H 7/06 - Frequency selective two-port networks including resistors
H01P 5/18 - Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
H03H 7/46 - Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
A CPAP device includes a main unit including a first electric circuit including a blower and a connection terminal connected to the first electric circuit, and a base unit connectable to the main unit, including a blower tube, a second electric circuit different from the first electric circuit, and a connection terminal connected to the second electric circuit. The main unit has a first electrical connection portion including an exposed portion of the connection terminal and a first peripheral portion surrounding the first electrical connection portion. The base unit has a second electrical connection portion including an exposed portion of the connection terminal and a second peripheral portion surrounding the second electrical connection portion.
A CPAP device includes a main unit including an inlet, an outlet, and a first electric circuit including a blower; and a base unit, to which the main unit is attachable, including an outlet, an inlet, a blower tube, and a second electric circuit different from the first electric circuit. The main unit has a lower wall, and the lower wall has multiple connection terminals connected to the first electric circuit. The base unit has an upper wall, and the upper wall has multiple connection terminals connected to the second electric circuit. The multiple connection terminals and the multiple connection terminals are disposed side by side in a direction substantially parallel to a direction in which the lower wall and the upper wall face each other. One of the multiple connection terminals and the multiple connection terminals includes a biasing force generation member that generates biasing force.
An antenna module includes an antenna substrate and a feed circuit. The antenna substrate has an upper surface and a lower surface, and a radiating element having a flat plate shape is arranged in the antenna substrate. The feed circuit 105 is mounted on the lower surface of the antenna substrate and supplies a radio frequency signal to the radiating element. The antenna substrate includes a dielectric substrate on which the radiating element is arranged, a ground electrode, a feed wiring, and carbides. The ground electrode is arranged between the radiating element and the lower surface in the dielectric substrate. The feed wiring transmits the radio frequency signal supplied from the feed circuit to the radiating element. The carbides are disposed on at least a part of a side surface connecting the upper surface and the lower surface in the dielectric substrate.
A method is provided for sealing and contacting a microelectromechanical device that includes a silicon device wafer with MEMS device structures and a cap wafer with an electrical circuit. The device wafer includes a sealing region and an interconnection region. Moreover, the cap wafer includes a corresponding sealing region and an interconnection region. Layers of eutectic metal alloy material are deposited on the sealing and the interconnection regions of the device wafer and the cap wafer. The cap wafer is bonded to the device wafer so that the interconnection region of the device wafer is aligned with the interconnection region of the cap wafer and the sealing region of the device wafer is aligned with the sealing region of the cap wafer.
A displacement detection device includes a transmitter, a receiver, and a controller configured or programmed to output a first transmission signal to the transmitter to transmit a modulated wave and acquire a responsive first reception signal in a first measurement period, extract first phase information indicating a phase defined in a correlation between a first transmission signal and a reception signal, output a second transmission signal to the transmitter and acquire a responsive second reception signal in a second measurement period after the first measurement period, extract second phase information indicating a phase defined in a correlation between the second transmission signal and reception signal, and detect a displacement of an object between the first and second measurement periods, depending on a difference between the first and second phase information.
A battery pack includes a plurality of batteries, an isolating member that is arranged between the plurality of batteries and isolates the plurality of batteries from each other, and a heat absorbing agent that is housed inside the isolating member. The isolating member has a first housing space for housing the heat absorbing agent, and contains an amorphous engineering plastic. In addition, the isolating member has a first thin portion having a locally thin wall thickness in at least a part of a region where the first housing space faces each of the plurality of batteries.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
H01M 50/291 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
H01M 50/293 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
H01M 50/383 - Flame arresting or ignition-preventing means
24.
SOLID ELECTROLYTIC CAPACITOR ELEMENT AND SOLID ELECTROLYTIC CAPACITOR
A solid electrolytic capacitor element that includes: a valve acting metal substrate having a dielectric layer thereon; an insulating mask layer on the dielectric layer and separating the valve acting metal substrate into positive and negative electrode portions; a solid electrolyte layer on the dielectric layer, a tip of the solid electrolyte layer covering an outer surface of the insulating mask layer; a carbon layer on the solid electrolyte layer, a tip of the carbon layer covering a same position as the tip of the solid electrolyte layer or a position closer to the negative electrode portion; and a negative conductor layer on the carbon layer, a tip of the negative conductor layer covering a position closer to the negative electrode portion, and wherein the negative electrode portion has a negative conductor layer-non-formed region where the negative conductor layer does not cover a part of the carbon layer.
Circuits and methods for selectable conversion ratio power converters that include low-dropout (LDO) power supplies adapted to select voltage inputs based on the selected conversion ratio while achieving high efficiency. The LDO power supplies limit current through power FETs of power converters, thereby mitigating or eliminating potentially damaging events. In some embodiments, first and second full gate-drive LDOs have “wired-OR” outputs which may power a target circuit such as a pre-driver (and optionally, a level-shifter) coupled to the gate of a power FET. In some embodiments, first and second reduced gate-drive LDOs have “wired-OR” outputs that may power a final driver coupled to the gate of a power FET. Some embodiments have dual full gate-drive LDOs that power a target circuit such as a pre-driver (and optionally, a level-shifter), while dual reduced gate-drive LDOs that power a final driver coupled to the gate of the power FET.
H02M 3/157 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with digital control
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
A filter device includes first and second terminals, a first inductor located between the first and second terminals, and an LC series resonator connected in parallel to the first inductor and including a first capacitor and a second inductor. The first and second inductors are magnetically coupled to each other. An inductance of the first inductor is smaller than an inductance of the second inductor.
An inductor including an element body containing metal magnetic powder and resin and having a coil conductor that has a winding portion, an extended portion extended from the winding portion, and an outer electrode connection portion leading to the extended portion and connected to an outer electrode and is embedded in the element body; and an element body coat covering a surface of the element body. The outer electrode is formed on a surface of the element body and connected to the outer electrode connection portion, in which the outer electrode connection portion has a region covered with the element body coat and a region connected to the outer electrode on the surface of the element body.
A sintered body that includes: a spinel ferrite oxide having a main constituent of metal elements of Fe, Ni, Cu, and Zn; and Zr, Mn, Al, Co, and Cr. Wherein, when Zn, Ni, Cu, Zr, Mn, Al, Co, and Cr have a contained mole part: “a”, “b”, “c”, “d”, “e”, “f”, “g”, and “h”, respectively, and based on Fe being 100 mole parts: 49.0<100−a−b−c+2d+(1/2)e<50.0, 50.2
C04B 35/26 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
An object detection device includes a wave transmitter to transmit a sound wave to an object, a wave receiver to receive the sound wave and generate a signal representing a reception result, and a controller to control transmission of the sound wave by the wave transmitter and obtain the receive signal from the wave receiver. The controller is configured or programmed to output a transmit signal to cause the wave transmitter to transmit the sound wave and obtain a corresponding receive signal. The controller is configured or programmed to generate detection information about the object by performing complexification on a correlation signal representing a correlation between the transmit signal and the receive signal. A signal corrector is configured or programmed to correct any of the correlation signal, the receive signal, and the transmit signal to mitigate a direct-current component in the correlation signal targeted for the complex analysis.
G01S 7/539 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group using analysis of echo signal for target characterisation; Target signature; Target cross-section
G01S 7/52 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group
G01S 15/10 - Systems for measuring distance only using transmission of interrupted, pulse-modulated waves
A tire observation apparatus includes a computer and an imaging device including a camera and range sensors positioned at different angles relative to a ground surface. The computer is configured or programmed to calculate a position of a tire relative to the camera by using various distances to the tire calculated by the range sensors. By using the position of the tire, the computer is configured or programmed to calculate an amount of adjustment usable by the imaging device to adjust the position and an angle of the camera such that an imaging center of the camera is directed at a center of the tire or at a surface of the tire that is to be measured.
A communication circuit includes a transmission terminal to which a transmission signal is supplied, a first duplexer that has a transmission node, a reception node, and a common node, a first filter that has a first end part electrically connected to the common node of the first duplexer and a second end part electrically connected to an antenna terminal, a first auxiliary output terminal that outputs the transmission signal to an external circuit, an inductor that is part of a second filter and has a first end part and a second end part that is electrically connected to the first auxiliary output terminal, and a first switch that switches the electrical connection destination of the transmission terminal between the transmission node of the first duplexer and the first end part of the inductor.
A coil component includes a drum core including a winding core portion, and first and second flange portions; and a first metal terminal which includes a bonding portion, a connecting portion, a mounting portion, an extending portion, and a joining portion. The first flange portion includes a main body portion, an end-surface-side protruding portion protruding from an outer end surface of the main body portion and a bottom-surface-side protruding portion protruding from a bottom surface of the main body portion. In a direction parallel to a second axis, a shortest distance from an end of the end-surface-side protruding portion on the second positive direction side to the joining portion is a first distance. A maximum distance from the end of the end-surface-side protruding portion to a side end surface of the end-surface-side protruding portion is a second distance. The first distance is larger than the second distance.
To suppress a decrease in mounting strength of a coil component, a coil component includes a drum core including a winding core portion, and first and second flange portions. The coil component includes a first metal terminal which includes a bonding portion, a connecting portion, and a mounting portion. The bonding portion is bonded to the first flange portion with an adhesive. The mounting portion is closest to the first positive direction side in the first metal terminal and is separated from the first flange portion toward the first positive direction side. The connecting portion connects the bonding and mounting portions. The first flange portion has a facing surface that faces the mounting portion, a bonding surface, and a first inclined surface between the facing and bonding surfaces. The distance from the facing surface increases in a direction parallel to the first axis toward the bonding surface.
To suppress deformation of a mounting portion, a coil component includes a drum core including a winding core portion, a first flange portion, and a second flange portion. The coil component includes a first metal terminal. The first metal terminal includes a joining portion, a mounting portion, and an extending portion. A first wire end of the first wire is connected to a surface of the joining portion facing a first positive direction. The mounting portion is located closest to the first positive direction in the first metal terminal. The extending portion connects the mounting portion and the joining portion. The extending portion includes a second portion having a thickness dimension smaller than the thickness dimension of the mounting portion.
A Doherty amplifier circuit includes a carrier amplifier including one or more amplifiers, and a peaking amplifier including one or more amplifiers. At least one of the amplifiers includes a transistor and a feedback circuit. The transistor receives, at its base or gate, a radio frequency signal and a bias voltage or current which changes, and outputs an amplified radio frequency signal from its collector or drain. The feedback circuit provides, to the base or gate or the emitter or source of the transistor, a voltage or a current based on the amplified radio frequency signal.
An acoustic wave device includes a support substrate with a thickness in a first direction, an intermediate layer on the support substrate, a piezoelectric layer on the intermediate layer, and an IDT electrode including a first electrode finger at the piezoelectric layer in the first direction and extending in a second direction intersecting the first direction, a first busbar electrode connected to the first electrode finger, a second electrode finger facing the first electrode finger in a third direction orthogonal or substantially orthogonal to the second direction and extending in the second direction, and a second busbar electrode connected to the second electrode finger. The intermediate layer includes a void portion at least partially overlapping the IDT electrode in plan view, and a surface roughness of an inner sidewall of the intermediate layer is about 0.0055 μm or more.
A coil component includes a core including a winding core portion and a first flange portion that is disposed on a first end portion of the winding core portion in a direction in which the winding core portion extends. A first curved portion is formed at a connection between a bottom surface of the winding core portion and the first flange portion. A ratio of a length of the first curved portion in a height direction to a distance in the height direction between the bottom surface and a first terminal electrode is no less than 20% and no more than 60% (i.e., from 20% to 60%).
H01F 27/30 - Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
Commissariat A L'Energie Atomique Et Aux Energies Alternatives (France)
Inventor
Oukassi, Sami
Sallaz, Valentin
Voiron, Frédéric
Abstract
A supercapacitor that includes: a first electrode; a second electrode; and a composite solid electrolyte disposed between the first electrode and the second electrode. The composite solid electrolyte includes a dielectric matrix and an ionic conductor disposed in channels/pores in the dielectric matrix. Methods of fabricating such supercapacitors are also disclosed.
An acoustic wave device includes a piezoelectric material layer, and an IDT electrode on the piezoelectric material layer and including first electrode fingers and second electrode fingers arranged periodically. The electrode fingers each include at least one electrode layer including at least one of Nb, Pd, or Ni. A sum of thicknesses of the at least one electrode layer, calculated assuming that the electrode layer(s) includes Mo and based on a density ratio between the electrode layer(s) and Mo, is at least about 10% of a spatial period of the electrode fingers.
An acoustic wave device includes a support including a support substrate, a piezoelectric layer on the support substrate, a space overlapping at least a portion of the piezoelectric layer, and a functional electrode on the piezoelectric layer. The support includes a space at a position at least partially overlapping the functional electrode in plan view. The functional electrode includes a first metal layer and a second metal layer on at least a portion of the first metal layer. A linear expansion coefficient of the second metal layer is smaller than a linear expansion coefficient of the first metal layer.
A coil component includes an element body including a multilayer body in which a first ferrite layer, a first glass layer, and a second ferrite layer are laminated in that order; a coil embedded in the first glass layer; and an outer electrode provided on an outer surface of the element body and electrically connected to the coil. The first glass layer includes regions in which Cu and Mg coexist.
An amplifier module includes an antenna that includes four power feed points, and four power amplifiers. Output ends of the four power amplifiers are connected to the four power feed points in a one-to-one relationship. The four power feed points are arranged rotationally symmetrically around a center of the antenna when a main surface of the antenna is viewed in plan.
A power amplifier circuit and an LC circuit are included. The power amplifier circuit amplifies a radio frequency signal by switching between the first mode, in which power is amplified by using the envelope tracking system, and the second mode, in which power is amplified by using the average power tracking system. The LC circuit is connected, at its first end, to the power supply path of the power amplifier circuit and that is grounded, at its second end, through a switch circuit. The LC circuit includes a first capacitor and an inductor that is connected in series to the first capacitor. The switch circuit is controlled to be switched off in the first mode and is controlled to be switched on in the second mode.
An amplifier module includes an input terminal; a first preamplifier formed in or on a first substrate and configured to amplify a signal that is input to the input terminal; a first postamplifier and a second postamplifier that are formed in or on a second substrate and that are configured to receive an output of the first preamplifier and output a differential signal; an output balun configured to receive the differential signal that is output from the first postamplifier and the second postamplifier; and a variable capacitance element. The output balun includes a primary winding subjected to the differential signal and a secondary winding, and the variable capacitance element is connected in parallel with the primary winding of the output balun.
An amplifier circuit includes amplifiers, transformers, and a transmission line. A first end of an input-side coil is connected to an output terminal of the amplifier, a second end of the input-side coil is connected to an output terminal of the amplifier via the transmission line, a first end of an input-side coil is connected to an output terminal of the amplifier, a second end of the input-side coil is connected to the output terminal of the amplifier via the transmission line, a first end of an output-side coil is connected to an output terminal, a second end of the output-side coil is connected to a ground, a first end of an output-side coil is connected to an output terminal, and a second end of the output-side coil is connected to the ground.
An electronic component that includes: a base body having an outer surface defining a recess with an inner surface, wherein, when the recess is viewed in a direction orthogonal to the outer surface, at least a part of an outer edge of the recess is curved, and when the recess is viewed in a section orthogonal to the outer surface, at least a part of the inner surface of the recess is curved; a wiring inside the base body; and a glass film covering the outer surface of the base body and not covering the inner surface of the recess.
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 1/14 - Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
An acoustic wave device includes a support, a piezoelectric layer with an anisotropic coefficient of linear expansion, and including first and second main surfaces, at least one through-hole, a first electrode in or on the first main surface, and a second electrode in or on the second main surface and opposed to the first electrode. A cavity is provided in the support. At least a portion of the first and second electrodes overlaps the cavity in plan view. In plan view, the at least one through-hole is line symmetric about an axis of symmetry that passes a center of the cavity in a region where the first and second electrodes overlap each other and that extends in a direction in which the coefficient of linear expansion of the piezoelectric layer is greatest.
In a high frequency module, a plurality of filters is connected to an antenna terminal with a switch interposed. The plurality of filters includes a first filter that has a pass band including a frequency band of a first communication band and a second filter that has a pass band including a frequency band of a second communication band that is capable of simultaneous communication with the first communication band. A first electronic component having the first filter and a second antenna end resonator of the second filter is disposed on a first principal surface of the mounting substrate. A second electronic component having at least one second acoustic wave resonator other than a second antenna end resonator of the second filter is disposed on the first principal surface of the mounting substrate.
Filter devices and methods are disclosed. A single-crystal piezoelectric plate is attached to substrate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate. A conductor pattern formed on the piezoelectric plate defines a low band filter including low band shunt resonators and low band series resonators and a high band filter including high band shunt resonators and high band series resonators. Interleaved fingers of interdigital transducers (IDTs) of the low band shunt resonators are disposed on respective diaphragms having a first thickness, interleaved fingers of IDTs of the high band series resonators are disposed on respective diaphragms having a second thickness less than the first thickness, and interleaved fingers of IDTs of the low band series resonators and the high band shunt resonators are disposed on respective diaphragms having thicknesses intermediate the first thickness and the second thickness.
H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
An antenna module including a dielectric substrate having a long side and a short side, a ground electrode, a radiating element, a peripheral electrode, and a parasitic element. The radiating element is disposed to face the ground electrode. The peripheral electrode is disposed along the long side of the dielectric substrate and is electrically connected to the ground electrode. The parasitic element is disposed along the short side of the dielectric substrate and is disposed away from the radiating element. The radiating element is configured to emit radio waves in two polarization directions along the long side and the short side of the dielectric substrate. The shortest distance between the radiating element and the parasitic element is greater than the shortest distance between the radiating element and the peripheral electrode.
Described are concepts, circuits, systems and techniques directed toward N-phase control techniques useful in the design and control of supply generators configured for use in a wide variety of power management applications including, but not limited to mobile applications.
To provide a battery pack including a heat-absorbing member capable of suppressing permeation of a heat-absorbing agent. A battery pack includes a secondary battery and a heat-absorbing member that includes a heat-absorbing agent and an exterior member accommodating the heat-absorbing agent and is in contact with the secondary battery at least in part, wherein the exterior member includes a metal layer, a resin layer overlapping the metal layer, and a sealing portion sealing the heat-absorbing agent, the metal layer is located inside the exterior member, and the metal layers are joined to each other at the sealing portion.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
A coil component having improved magnetic characteristics. The coil component includes a body having a substantially hexahedral shape and including a winding portion formed by winding a conductive wire based on a winding axis and a magnetic body portion; and paired metal terminals having joint portions to which first and second ends of the conductive wire are electrically connected. Each of the paired metal terminals extends outside an outer surface of the body parallel to the winding axis. Of four quadrants separated from one another by imaginary coordinate axes that are orthogonal to one another with the center of the body as the origin in plan view in the winding axis direction, more than half the area of one of the joint portions is disposed in a quadrant not adjacent to the quadrant in which more than half the area of the other joint portion is disposed.
A multiplexer includes a common terminal, an inductor including a first end connected to the common terminal and a second end, a filter connected to the second end and having a first pass band, a filter connected to the common terminal and having a second pass band located on a higher frequency side relative to the first pass band, an inductor connected between a ground and a path that links the second end to the filter, and a capacitor connected between the path and the ground. A resonant frequency of an LC parallel resonance circuit including the inductor and the capacitor is located between the first pass band and the second pass band.
A method of controlling a converter apparatus operable based on a first frequency modulation control signal and at least one second frequency modulation control signal, includes determining updated periods of the first frequency modulation control signal and the at least one second frequency modulation control signal based on the output, for each second frequency modulation control signal, at a beginning of each period of the first frequency modulation control signal, determining a phase shift of the second frequency modulation control signal relative to the first frequency modulation control signal, when a difference between the phase shift and a target phase shift exceeds a predetermined threshold, determining the period of the second frequency modulation control signal as the updated period increased or decreased by a predetermined amplitude, otherwise determining the period of the second frequency modulation control signal as the updated period.
H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
H02M 3/156 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
56.
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
A multilayer substrate includes a multilayer body including first insulator layers and a second insulator layer stacked on each other. The multilayer body includes first and second regions when viewed in a stacking direction. The first region is a region that does not include the second insulator layer when viewed in the stacking direction. The second region is a region that includes the second insulator layer when viewed in the stacking direction. The first insulator layers include a small-area first insulator layer located in the first region and not located in the second region. The small-area first insulator layer overlaps the second insulator layer when viewed in a first direction. A porosity of the second insulator layer is higher than an overall porosity of the first insulator layers.
A circuit module comprises a substrate module, an electronic component, and a first conductive joining member. The substrate module includes a circuit substrate having an upper main surface and a lower main surface, an insulating member covering the upper main surface of the circuit substrate, an insulating member covering the upper main surface of the circuit substrate, and a first metal pin that passes through the insulating member parallel to a vertical axis and is electrically connected to the circuit substrate. The first metal pin has a first exposed portion. The first exposed portion is exposed from the insulating member to face a right direction. A first outer electrode has a left projecting portion projecting in a left direction from the left surface. A first conductive joining member joins the first exposed portion and the left projecting portion to each other.
A circuit board includes a substrate, a first mounting conductor, a first ground conductor, a first floating conductor, a signal line conductor, and a connection conductor. The first mounting conductor is on a surface of the substrate and includes a first external connection conductor. The first ground conductor is positioned on the substrate opposite to the first mounting conductor. The floating conductor is between the first mounting conductor and the first ground conductor. The signal line conductor is inside the substrate. The connection conductor connects the first mounting conductor and the signal line conductor. When viewed in a thickness direction of the substrate, the signal line conductor and the connection conductor are each provided at a position different from the first external connection conductor, and the floating conductor overlaps an entirety or substantially an entirety of the first external connection conductor.
The deterioration in characteristics of a filter is reduced. In a high frequency module, the filter includes a first substrate, a first functional electrode provided on the first substrate and forming a part of an antenna end resonator, a second substrate separate from the first substrate, and a second functional electrode provided on the second substrate and forming a part of at least one acoustic wave resonator other than the antenna end resonator among a plurality of acoustic wave resonators. A first electronic component including the first substrate and the first functional electrode is disposed on the first main surface of the mounting substrate. An inductor is adjacent to the first electronic component in a plan view from a thickness direction of the mounting substrate. The inductor does not overlap the antenna end resonator in a side view from a direction of a winding axis of a winding portion.
An alignment device includes a pallet including a flat plate portion and a lateral wall portion defining an alignment area to which chips are supplied, recessed portions defining holding positions in the alignment area to hold the chips in an alignment state, a supply port defined by a portion of the lateral wall portion being open and allowing the chips to be supplied into the alignment area from outside of the lateral wall portion, and a magnet defining a moving holder at least at either one of the flat plate portion or the lateral wall portion to cause each of the chips supplied from the supply port to the alignment area to move to a corresponding one of the recessed portions and hold each of the chips at a corresponding one of the recessed portions.
H01G 13/00 - Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups
H01G 4/012 - Form of non-self-supporting electrodes
A case includes a case body including an accommodation space to accommodate electronic components and a discharge port to discharge the electronic components accommodated in the accommodation space, a shutter slidable relative to the case body to open and close the discharge port, a slider integral with the shutter to perform a slide operation of the shutter, and an operation opening in the case body to expose the slider to outside to allow for operation of the slider. A seal including a portion that covers and seals at least the operation opening is attachable to the case body.
An antenna module has a substrate, a radiating element disposed in or on the substrate, a power feeding line, and a dielectric body. The substrate has a rectangular shape including first and second sides adjacent to each other. The power feeding line extends in a normal direction of the substrate and transfers radio frequency signals supplied from an RFIC to the radiating element. The dielectric body is disposed on a side surface of the substrate. The power feeding line is coupled to the radiating element at a position offset from the center of the radiating element in a first direction toward the first side. The dielectric body is disposed so as to cover the side surface of the substrate including the first side. The dielectric constant of the dielectric body is higher than the dielectric constant of the substrate.
H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
63.
HIGH FREQUENCY CIRCUIT AND COMMUNICATION APPARATUS
A high frequency circuit includes a power amplifier and a matching circuit connected to an output terminal of the power amplifier. The matching circuit includes an inductor connected in series to an output transmission path of the power amplifier, a capacitor connected in series to and between one end of the inductor and the ground, an inductor connected in series to and between the capacitor and the ground, a switch having a common terminal, a selection terminal, and a selection terminal, a capacitor connected in series to and between the common terminal and the one end of the inductor. The selection terminal is connected to the ground, and the selection terminal is connected to the other end of the inductor.
An acoustic wave device includes a monocrystalline spinel substrate made of a magnesium aluminate single crystal, a piezoelectric layer on the monocrystalline spinel substrate, and an IDT electrode on the piezoelectric layer. Euler angles (ϕ, θ, ψ) of the magnesium aluminate single crystal of the monocrystalline spinel substrate are within a range of any of regions A in FIGS. 5 to 41.
A multilayer coil component includes a multilayer body and outer electrodes. The multilayer body includes insulating layers and a coil. The insulating layers are stacked on top of one another in a stacking direction. The coil is embedded in the multilayer body. The outer electrodes are on an outer surface of the multilayer body and are electrically connected to the coil. The coil includes coil conductors, which are stacked together with the insulating layers in the stacking direction and electrically connected to each other. The coil includes a parallel section in which two or more of the coil conductors stacked in layers are electrically connected in parallel by via conductors interposed therebetween. The parallel section includes a first parallel section and a second parallel section, which is electrically connected in series with the first parallel section.
A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a connection terminal, and a wiring layer. The second electronic component is disposed on the second main surface of the mounting substrate. The connection terminal is disposed on the second main surface of the mounting substrate and is connected to the mounting substrate and the wiring layer. The wiring layer faces the second main surface of the mounting substrate with the second electronic component interposed therebetween and is in contact with the connection terminal. The wiring layer has a base material and an external connection electrode. The base material has a second conductive member connected to the first conductive member of the mounting substrate with the connection terminal interposed therebetween. The external connection electrode is connected to the second conductive member. The wiring layer is in contact with the second electronic component.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/552 - Protection against radiation, e.g. light
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
67.
ELECTROLYTIC SOLUTION FOR SECONDARY BATTERY, AND SECONDARY BATTERY
A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The electrolytic solution includes an electrolyte salt and a lithium fluorophosphate. The electrolyte salt includes an imide anion, and the imide anion includes at least one of an anion represented by Formula (1), an anion represented by Formula (2), an anion represented by Formula (3), or an anion represented by Formula (4). The lithium fluorophosphate includes lithium monofluorophosphate, lithium difluorophosphate, or both.
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, base electrode layers respectively provided on both end surfaces of the multilayer body in a length direction intersecting a lamination direction, and each connected to the internal electrode layers and each including glass and copper, and plated layers respectively provided on an outer side of the base electrode layers. A protective layer including sulfur is provided between the glass included in the base electrode layers and the plated layers.
A wireless power transmission system includes a structure surrounded as a whole by an electromagnetic wave-shielding member having an appropriate conductivity, at least one power transmission unit, and at least one power reception unit. A power reception unit includes a power receiver including a dielectric substrate, a rectifier circuit, and a power reception antenna. The power reception antenna includes power reception antenna lines in a same plane on the dielectric substrate. One ends of the power reception antenna lines are connected to the rectifier circuit, and other ends different from the one ends connected to the rectifier circuit are open ends. A planar shape of the dielectric substrate is a 2N-sided polygon with line symmetry (where N is an integer of two or more), and the power reception antenna lines are along N sides that are adjacent to and different from each other of the dielectric substrate.
A first receiving band and a first transmission band in band A and a second transmission band and a second receiving band in band B are listed in frequency order. A radio frequency module includes: first and second boards; a first filter having a passband that is the first transmission band; second and sixth filters each having a passband that is the first receiving band; third and fifth filters each having a passband that is the second receiving band; a first power amplifier connected to the first filter; a fourth filter having a passband that is the second transmission band; and a second power amplifier connected to the fourth filter. The first to third filters and the first power amplifier are disposed on the first board, and the fourth to sixth filters and the second power amplifier are disposed on the second board.
An increase in cost can be suppressed. A high frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a metal layer. The first electronic component and the second electronic component are disposed on a first main surface of the mounting substrate. The metal layer has a ground potential and covers a part of the resin layer. The metal layer overlaps a part of the first electronic component and overlaps a part of the second electronic component in plan view from a thickness direction of the mounting substrate. A height of the first electronic component is lower than a height of the second disposal condition in the thickness direction of the mounting substrate. A part of a main surface of the first electronic component that is far away from the mounting substrate is in contact with the metal layer.
An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.
A battery pack capable of improving safety is obtained. A battery pack according to an embodiment of the present disclosure includes a secondary battery provided in a power supply path and including a positive electrode and a negative electrode, a first terminal connected to one end of the power supply path, a second terminal connected to the other end of the power supply path, a cutoff circuit provided in the power supply path and cutting off a current flowing through the power supply path, a discharge circuit connected to the positive electrode of the secondary battery and the negative electrode of the secondary battery and discharging the secondary battery, and a control circuit monitoring the secondary battery and causing the cutoff circuit to cut off the current and causing the discharge circuit to discharge the secondary battery when an abnormality is detected based on a monitoring result.
H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
H01M 50/548 - Terminals characterised by the disposition of the terminals on the cells on opposite sides of the cell
74.
FILTER DEVICE AND HIGH-FREQUENCY FRONT-END CIRCUIT PROVIDED WITH THE SAME
A filter device includes a main body, an input terminal, an output terminal, a ground terminal, and resonators. The resonators are located in the main body and are electro-magnetically coupled with each other so as to transmit a signal from the input terminal to the output terminal. Each of the resonators includes a first path connected from nodes via capacitors to the ground terminal, and a second path connected from the nodes to the ground terminal without passing through the capacitors. The second path of a first resonator and the second path of a second resonator are partially shared. The filter device further includes a third path connected with the node of the first resonator and the node of the second resonator.
A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The negative electrode includes first fiber parts, covering parts, and second fiber parts, and has voids. The first fiber parts are coupled to each other to thereby form a three-dimensional mesh structure having the voids. The first fiber parts each include carbon as a constituent element. The covering parts each cover a surface of corresponding one of the first fiber parts, and each include silicon as a constituent element. At least some of the second fiber parts are each coupled to a surface of any of the covering parts. The second fiber parts each include carbon as a constituent element. The first fiber parts have an average fiber diameter that is greater than or equal to 10 nm and less than or equal to 8000 nm. The second fiber parts have an average fiber diameter that is greater than or equal to 1 nm and less than or equal to 300 nm. The negative electrode has a void rate that is greater than or equal to 40 vol % and less than or equal to 70 vol %.
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
There is provided a method for manufacturing a battery electrode. The method includes: forming a precursor of the battery electrode including a double-sided coating area in which both sides of a current collector are coated with an electrode material layer and a single-sided coating area adjacent to the double-sided coating area; subjecting the current collector located at a boundary portion between the double-sided coating area and the single-sided coating area to a heat treatment locally; and pressurizing the precursor of the battery electrode. The single-sided coating area includes a main side of the current collector that is coated with the electrode material layer.
A radio frequency circuit includes a carrier amplifier, a peak amplifier, a transformer, and an impedance converting circuit. One end of an input coil is connected to an output of the carrier amplifier, one end of an output coil is connected to an output terminal. The impedance converting circuit includes main and auxiliary lines. One end of the main line is connected to an output of the peak amplifier, and the other end of the main line is connected to the other end of the input coil. One end of the auxiliary line is connected to the one end of the main line, and the other end of the auxiliary line is connected to ground. A first direction from the one end to the other end of the main line, and a second direction from the other end to the one end of the auxiliary line (302) are the same.
A method of manufacturing an inductor component includes preparing an insulating paste that is photosensitive and that includes a filler material composed of quartz, a glass material and a resin material, and a conductive paste, forming a first insulating layer by applying the insulating paste, and exposing the first insulating layer in a state where a first portion of the first insulating layer is shielded by a mask. The method further includes removing the first portion of the first insulating layer to form a groove at a position corresponding to the first portion, applying the conductive paste in the groove to form a coil conductor layer in the groove, and applying the insulating paste on the first insulating layer and the coil conductor layer to form a second insulating layer.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
An electronic component that includes: a ceramic body; and an external electrode on a surface of the ceramic body, wherein the external electrode includes: a base layer in contact with the surface of the ceramic body, the base layer including a granulate of a metal material and a continuous phase of a titanium-containing oxide present around the granulate of the metal material; and a plating layer on the base layer.
A plurality of first terminal pins are placed side by side in a first direction. A plurality of second terminal pins are placed to extend in parallel with the plurality of first terminal pins. The plurality of first terminal pins and the plurality of second terminal pins include an inside face facing each other, an outside face opposite to the inside face, and side faces connecting the inside face and the outside face. At least one of the side faces includes a first portion having a relatively rough surface, and a second portion having a relatively fine surface and having approximately the same roughness as the inside face and the outside face.
A stacked semiconductor device capable of increasing heat dissipation comprises a first member and a second member. The first member includes a semiconductor substrate and a first electronic circuit. The first electronic circuit includes a semiconductor element provided on one surface of the semiconductor substrate. A second member is attached to a first surface, which is one surface of the first member. The second member includes a second electronic circuit including another semiconductor element. The second member is provided with a first opening that penetrates the second member in a thickness direction. A first conductor projection is coupled to the first electronic circuit. The first conductor projection protrudes from the first surface of the first member through the first opening of the second member to the outside of the first opening.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H03F 1/56 - Modifications of input or output impedances, not otherwise provided for
H03F 3/195 - High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
82.
FILTER APPARATUS AND RADIO-FREQUENCY FRONT END CIRCUIT INCORPORATING THE SAME
A filter apparatus includes an input terminal, first and second ground electrodes opposed to each other, and first and second filters connected to the input terminal. The first filter has a first passband. The second filter has a second passband higher than the first passband. Each of the first and second filters includes resonators in stages between the first and second ground electrodes. A resonator in the first stage in the first filter includes a capacitor connected to the second ground electrode and an inductor connected between the capacitor and the first ground electrode. A resonator in the first stage in the second filter includes a capacitor connected between the input terminal and the second ground electrode and an inductor connected between the capacitor and the second ground electrode.
A multiplexer includes a first filter connected between a common terminal and an input/output terminal and having a pass band including a first frequency band, a second filter connected between the common terminal and an input/output terminal and having a pass band including a second frequency band higher than the first frequency band, and an additional circuit connected in parallel to a path connecting the common terminal and the input/output terminal. The additional circuit includes a longitudinally coupled resonator including IDT electrodes. If a peak frequency in an IDT response occurring in a bandpass characteristic of the additional circuit is f1, and if a frequency corresponding to a lowest impedance among frequencies higher than the second frequency band in an impedance characteristic viewing the multiplexer from the common terminal is f2, f2×(1−0.0012)≤f1≤f2×(1+0.0012) is satisfied.
In a composite filter device, a first acoustic wave resonator includes a functional electrode on a first main surface of a first piezoelectric substrate, and a wiring electrode is on the first main surface and is not connected to a signal potential. A support is on the first main surface and surrounds the first acoustic wave resonator. A second piezoelectric substrate is on the support and includes a third main surface closer to the support than a fourth main surface. A second acoustic wave resonator includes a functional electrode on the third main surface. The second acoustic wave resonator is a parallel-arm resonator higher in resonant frequency than any other parallel-arm resonator or a series-arm resonator lower in resonant frequency than any other series-arm resonator. The second acoustic wave resonator and the wiring electrode overlap each other when viewed in plan.
A switching circuit includes: a substrate including input-and-output terminals; a switch provided to the substrate and including a source terminal, a gate terminal, and a drain terminal, the source terminal being connected to an input end of a power amplifier, the drain terminal being connected to a first input-and-output terminal; a voltage control circuit provided to the substrate and connected to the gate terminal; a switch provided to the substrate and including a source terminal, a gate terminal, and a drain terminal, the source terminal being connected to a second input-and-output terminal, the drain terminal being connected to an output end of the power amplifier; and a voltage control circuit provided to the substrate to be apart from the voltage control circuit and connected to the gate terminal.
H03K 17/56 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices
H03K 5/1252 - Suppression or limitation of noise or interference
86.
RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS
A radio-frequency module includes a module substrate, a carrier amplifier and a peak amplifier, a transformer, and a phase adjustment circuit. The carrier amplifier and the peak amplifier are included in a semiconductor IC. One end of an input-side coil is connected to an output terminal of the carrier amplifier. One end of the output-side coil is connected to a signal output terminal.
An acoustic wave device is provided that includes a piezoelectric layer and first and second resonators. The first resonator includes a first functional electrode and a first dielectric film on the piezoelectric layer. The second resonator includes a second functional electrode and a second dielectric film on the piezoelectric layer. The piezoelectric layer includes first and second resonator portions respectively including portions of the first and second resonators. Moreover, a resonant frequency of the first resonator is lower than that of the second resonator. A thickness of the first resonator portion is greater than that of the second resonator portion, and ts1/tp1≤ts2/tp2 is satisfied, where tp1, tp2, ts1, and ts2 are respectively thicknesses of the first and second resonator portions and the first and second dielectric films.
A fiber with which a further enhanced electric field intensity is obtained when a compressive force is applied across the longitudinal axis of the fiber. The fiber is composed of a potential generating filament having at least one interior angle of less than 120° in a contour shape in a sectional view in a direction perpendicular to a longitudinal axis of the fiber.
A radio-frequency circuit includes an antenna connection terminal, switch circuits, a duplexer, a low-pass filter, and a high-pass filter. The switch circuit includes a port connected to the antenna connection terminal and ports. The switch circuit includes a single transmission port connected to the port, a simultaneous transmission port connected to ports. The duplexer is connected to the port. The low-pass filter is disposed on a signal path connecting the port and the simultaneous transmission port. The high-pass filter is connected to the port. No filter is disposed on a signal path connecting the port and the single transmission port.
A conductive paste containing: a conductive powder; a glass frit; an organic vehicle; and a silicon resonate sintering retardant, and a content of the silicon resinate sintering retardant is 0.005 wt % or more in terms of metal based on 100 wt % of the conductive powder.
A semiconductor module comprises a first member including a semiconductor substrate made of a compound semiconductor and a first electronic circuit on the semiconductor substrate is mounted on a mounting surface of a module substrate, and a second member including a semiconductor layer formed of a single semiconductor thinner than the semiconductor substrate of the first member and a second electronic circuit on the semiconductor layer is bonded to an upper surface of the first member. First and second pads are respectively connected to the first electronic circuit on the first member and the second electronic circuit on the second member. A first wire connects the first pad and a substrate side pad. A second wire connects the second pad and a substrate side pad. An inter-member connection wire made of a conductor film on the first and second members connects the first and second electronic circuits.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
An acoustic wave device includes a first acoustic wave chip and a second acoustic wave chip mounted on a substrate, first bumps bonding the first acoustic wave chip to the substrate and including first ground bumps connected to a ground potential, second bumps bonding the second acoustic wave chip to the substrate and including second ground bumps connected to a ground potential. When a number of the first ground bumps is n1, a number of the second ground bumps is n2, a height of the first ground bumps is h1, and a height of the second ground bumps is h2, n1
A processing device includes an operation circuit that determines based on a first signal a swing start time, the first signal being acquired from a sensor that is attached to a striking member for striking a to-be-struck object by being swung and that detects deformation of the striking member when the striking member is swung. An absolute value of a difference between a reference value and a value of the first signal is defined as a first difference value. The operation circuit executes a first determination step in which an impact time is determined based on one or more times at which the first difference value becomes greater than or equal to a first determination value.
An inductor component includes a component body having a mounting surface and a top surface and provided therein with a spiral inductor wiring line advancing in the extending direction of a winding center axis. The inductor wiring line is connected to a first external electrode at a first end, and connected to a second external electrode at a second end. The component body includes: a first inclined surface connected to a first end of the mounting surface on a first side in a length direction and inclined toward the top surface as separating from the first end; and a second inclined surface connected to a second end of the mounting surface on a second side in the length direction and inclined toward the top surface as separating from the second end. The winding center axis extends in a direction parallel to the mounting surface and perpendicular to the length direction.
A coil component includes a core including a winding core portion and a pair of flange portions provided at both ends of the winding core portion, electrode portions provided in the flange portions, a wire wound around the winding core portion, and a magnetic plate fixed to the flange portions. The magnetic plate includes an annular first planar portion, a second planar portion that is located inside the inner circumference of the first planar portion and has a step between the first and the second planar portions, and a connection surface portion connecting the inner circumference of the first planar portion to the outer circumference of the second planar portion. The connection surface portion is configured by annularly disposing at least three slopes inclined with respect to the direction orthogonal to the first planar portion and has chamfered portions each being disposed between adjacent slopes.
A piezoelectric bulk wave device includes a support including a support substrate, a piezoelectric layer including a first main surface on the support side and a second main surface opposite from the first main surface, and at least one functional electrode including at least a portion on at least one of the first and second main surfaces. The at least one functional electrode is supported by the support and includes a functional electrode including a portion on the first main surface of the piezoelectric layer. A cavity portion is provided in the support and superposed on a portion of the functional electrode and an entirety or substantially an entirety of the piezoelectric layer in plan view. The piezoelectric layer is supported by the functional electrode supported by the support.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
An electronic component includes a ceramic body, and an external electrode on the ceramic body, the external electrode includes a base layer continuously covering an end surface of the ceramic body and a portion of a side surface bordering the end surface, and a plating layer covering the base layer, the ceramic body includes a recess open on the side surface, an opening of the recess includes a pair of edges, one edge of the opening is located within a covered region on the side surface covered with the base layer, and the other edge of the opening is spaced away from the covered region.
H01C 1/14 - Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
H01C 1/142 - Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 7/10 - Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
An acoustic wave device includes a piezoelectric substrate including an acoustic reflection layer and a piezoelectric layer on the acoustic reflection layer, and an IDT electrode on the piezoelectric substrate and including electrode fingers. When a wavelength defined by an electrode finger pitch of the IDT electrode is λ, a thickness of the piezoelectric layer is about 3λ or smaller. The electrode fingers include at least one electrode layer. A sum total of a thickness of the at least one electrode layer converted based on a density ratio of the at least one electrode layer and Al assuming that the at least one electrode layer includes Al is a same or larger than the thickness of the piezoelectric layer.
A multilayer ceramic capacitor includes dielectric layers and inner electrode layers that are stacked and each made of a ceramic material. Each of the inner electrode layers includes through holes. Inside the through holes, a portion of the dielectric layers is packed and Si that is derived from the dielectric layers segregates.
A multilayer ceramic capacitor includes dielectric layers and inner electrode layers stacked and each made of a ceramic material. Each of the inner electrode layers includes through holes. An average circularity of the through holes is equal to or greater than to about 0.6.
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