Murata Manufacturing Co., Ltd.

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IPC Class
H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details 1,023
H01G 4/30 - Stacked capacitors 963
H01F 27/28 - Coils; Windings; Conductive connections 900
H01F 27/29 - Terminals; Tapping arrangements 804
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1.

POWER SUPPLY CONTROL APPARATUS AND POWER SUPPLY APPARATUS

      
Application Number 18427422
Status Pending
Filing Date 2024-01-30
First Publication Date 2024-07-18
Owner MURATA MANUFACTURING CO., LTD. (Japan)
Inventor Shimura, Jusuke

Abstract

A power supply control apparatus according to an embodiment of the present technology includes a controller and sensors. The controller controls discharging of secondary battery units coupled in parallel to each other. The sensors are assigned to the secondary batteries on a one-to-one basis. The sensors each detect a current flowing through a current path of corresponding one of the secondary batteries or a physical quantity having a predetermined correlation with the current. The controller switches coupling between a first secondary battery and each of one or more second secondary batteries from parallel coupling to series coupling by controlling a switching unit based on a detection result obtained from each of the sensors. The first secondary battery is any one of the secondary batteries. The one or more second secondary batteries are one or more of the secondary batteries other than the first secondary battery.

IPC Classes  ?

  • H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries

2.

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR FILTERS WITH SUB-RESONATORS HAVING DIFFERENT MARK AND PITCH

      
Application Number 18620535
Status Pending
Filing Date 2024-03-28
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Jachowski, Douglas
  • Dyer, Greg

Abstract

Radio frequency filters are disclosed. A bandpass filter is discloses that includes one first bulk acoustic resonator on a first chip including a first piezoelectric layer having an LN-equivalent thickness less than or equal to 535 nm; a second bulk acoustic resonator on a second chip including a second piezoelectric layer having a thickness greater than the LN-equivalent thickness of the piezoelectric layer on the first chip; and a circuit card coupled to the first chip and the second chip and that electrically connects the first chip to the second chip.

IPC Classes  ?

  • H03H 9/56 - Monolithic crystal filters
  • H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator

3.

FILTER DEVICE

      
Application Number 18420915
Status Pending
Filing Date 2024-01-24
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Okada, Takuro
  • Iwamoto, Hideki
  • Nakamura, Kentaro

Abstract

A filter device includes at least one first acoustic wave resonator and at least one second acoustic wave resonator. The at least one first acoustic wave resonator includes a first piezoelectric substrate and first and second IDT electrodes. The first piezoelectric substrate includes a piezoelectric layer with first and second main surfaces facing each other. The first IDT electrode is on the first main surface. The second IDT electrode is on the second main surface and faces the first IDT electrode. The at least one second acoustic wave resonator includes a second piezoelectric substrate and a third IDT electrode. The second piezoelectric substrate includes a piezoelectric layer with third and fourth main surfaces facing each other. The third IDT electrode is on one of the third and fourth main surfaces.

IPC Classes  ?

  • H03H 9/64 - Filters using surface acoustic waves
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/145 - Driving means, e.g. electrodes, coils for networks using surface acoustic waves

4.

SECONDARY BATTERY AND METHOD FOR MANUFACTURING THE SAME

      
Application Number 18435165
Status Pending
Filing Date 2024-02-07
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Fujioka, Masato

Abstract

A secondary battery that includes: a semi-solid electrode including an electrode active material, a conductive aid including conductive particles, and an electrolytic solution; and a separator in contact with the semi-solid electrode, in which a minimum particle diameter D5P (μm) of the conductive particles included in the semi-solid electrode is larger than a maximum pore diameter D95 (μm) of an intermediate layer region of the separator.

IPC Classes  ?

  • H01M 4/139 - Processes of manufacture
  • H01M 4/02 - Electrodes composed of, or comprising, active material
  • H01M 4/04 - Processes of manufacture in general
  • H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
  • H01M 10/04 - Construction or manufacture in general
  • H01M 10/44 - Methods for charging or discharging

5.

TRACKER MODULE

      
Application Number 18619853
Status Pending
Filing Date 2024-03-28
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Uejima, Takanori
  • Miura, Masanari
  • Kogure, Takeshi

Abstract

A tracker module is provided that includes a module laminate, an integrated circuit disposed on the module laminate, and a power inductor disposed on the module laminate. The integrated circuit includes at least one switch included in a pre-regulator circuit that converts an input voltage into a first voltage using the power inductor, at least one switch included in a switched-capacitor circuit that generates a plurality of discrete voltages from the first voltage, and at least one switch included in a supply modulator that selectively outputs, based on an envelope signal, at least one of the plurality of discrete voltages.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages

6.

LAMINATED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

      
Application Number 18623486
Status Pending
Filing Date 2024-04-01
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Arakawa, Yusuke
  • Namba, Ryotaro

Abstract

A laminated structure that includes: a resin substrate; a barrier film on the resin substrate and containing a first metal element; and a metal layer on the barrier film and containing a second metal element, where a part of the metal layer penetrates the barrier film and extends to an inside of the resin substrate.

IPC Classes  ?

  • B32B 3/26 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids
  • B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
  • B32B 38/00 - Ancillary operations in connection with laminating processes

7.

CAPACITOR ELEMENT, MODULE, AND SEMICONDUCTOR COMPOSITE DEVICE

      
Application Number 18618058
Status Pending
Filing Date 2024-03-27
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Takahashi, Akitomo
  • Furukawa, Takeshi
  • Himeda, Koshi

Abstract

A capacitor element that includes: a capacitor portion including an anode plate having a porous portion on a core portion, a dielectric layer on the porous portion, and a cathode layer on the dielectric layer; a first cathode through conductor and a second cathode through conductor each penetrating the dielectric layer and the anode plate in a thickness direction and electrically connected to the cathode layer; and an anode through conductor penetrating the dielectric layer and the anode plate in the thickness direction and electrically connected to the anode plate, wherein, in a plan view from a thickness direction of the anode plate, a first center-to-center distance between the first anode through conductor and the first cathode through conductor is equivalent to a second center-to-center distance between the first anode through conductor and the second cathode through conductor.

IPC Classes  ?

  • H01G 9/012 - Terminals specially adapted for solid capacitors
  • H01G 9/055 - Etched foil electrodes
  • H01G 9/10 - Sealing, e.g. of lead-in wires
  • H01G 9/28 - Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass
  • H01L 23/498 - Leads on insulating substrates
  • H02M 3/00 - Conversion of dc power input into dc power output

8.

MULTILAYER CERAMIC CAPACITOR

      
Application Number 18621196
Status Pending
Filing Date 2024-03-29
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Nishibayashi, Kazuhiro
  • Kawasaki, Yuko

Abstract

When a multilayer ceramic capacitor is viewed as a section of a central portion in a width direction cut parallel or substantially parallel or substantially parallel or substantially parallel to a side surface, in an internal electrode layer in a central portion in a lamination direction and including an extremity spaced apart from an end surface, any one of five segments of the internal electrode layer that are horizontally and successively positioned from the extremity has a length greater than about 0.2 times of an average length of ten segments of the internal electrode layer that are horizontally and successively positioned in a central portion in a length direction.

IPC Classes  ?

  • H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
  • H01G 4/12 - Ceramic dielectrics
  • H01G 4/30 - Stacked capacitors

9.

BATTERY PACK

      
Application Number 18387982
Status Pending
Filing Date 2023-11-08
First Publication Date 2024-07-18
Owner MURATA MANUFACTURING CO., LTD. (Japan)
Inventor
  • Kherde, Harish
  • Nagara, Yohei

Abstract

A battery pack is provided and includes: a secondary battery; and a storage portion that has a cylindrical shape with an axis and accommodates the secondary battery, an inner peripheral surface of the storage portion being a tapered surface that has an inclination in which a diameter of the inner peripheral surface increases from a side of the first end toward a side of the second end in the direction of the axis, the storage portion having a groove that extends in the direction of the axis on an outer peripheral surface, a bottom surface of the groove being a tapered surface that has an inclination in which a depth of the groove increases from the side of the first end toward the side of the second end in the direction of the axis, and in a sectional shape of the storage portion taken along a first plane including the axis and a deepest point of the groove, a second angle formed by the axis and a second intersection line of the first plane and the bottom surface being larger than a first angle formed by the axis and a first intersection line of the first plane and the inner peripheral surface.

IPC Classes  ?

  • H01M 50/291 - Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
  • H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
  • H01M 50/26 - Assemblies sealed to each other in a non-detachable manner

10.

CONDUCTIVE TWO-DIMENSIONAL PARTICLE AND METHOD FOR PRODUCING THE SAME

      
Application Number 18616605
Status Pending
Filing Date 2024-03-26
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Koyanagi, Masashi

Abstract

A conductive two-dimensional particle that includes: a plurality of layered materials each having one layer or plural layers, the one layer or plural layers including a layer body represented by: MmXn, wherein M is at least one metal of Group 3-7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, m is more than n and 5 or less, and a modifier or terminal T on a surface of the layer body; and an oxygen atom bonding a first titanium atom of a first layered material of the plurality of layered materials to a second titanium atom of a second layered material of the plurality of layered materials, wherein the conductive two-dimensional particle does not contain a chlorine atom, an iodine atom, and a bromine atom, and has at least one of a fluorine atom, an oxygen atom, or a hydroxyl group.

IPC Classes  ?

  • C01B 32/05 - Preparation or purification of carbon not covered by groups , , ,
  • C08K 3/04 - Carbon

11.

MULTILAYER CERAMIC CAPACITOR

      
Application Number 18410054
Status Pending
Filing Date 2024-01-11
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Tahara, Retsu
  • Mishiro, Taeko

Abstract

A multilayer ceramic capacitor includes a multilayer body including dielectric layers. A difference between an RGB value which reproduces a color tone of ends in a width direction y of a first and second main-surface-side outer layer portions of the multilayer body and an RGB value which reproduces a color tone of ends in the width direction of a first and second side-surface-side outer layer portions is not smaller than about 45 and not larger than about 100, a monotectoid phase is provided in the first and second side-surface-side outer layer portions in a WT cross-section, includes at least one of Ca and Si, and a region where the monotectoid phase is provided is not larger than about 3% of a total area of the first and second side-surface-side outer layer portions in the WT cross-section of the multilayer body.

IPC Classes  ?

  • H01G 4/30 - Stacked capacitors
  • H01G 4/008 - Selection of materials
  • H01G 4/012 - Form of non-self-supporting electrodes
  • H01G 4/12 - Ceramic dielectrics
  • H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

12.

MULTILAYER CERAMIC ELECTRONIC COMPONENT

      
Application Number 18619250
Status Pending
Filing Date 2024-03-28
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Yasuda, Tatsunori
  • Semasa, Kouhei

Abstract

A multilayer ceramic capacitor includes a multilayer body, and first and second external electrodes on both ends of the multilayer body. A first end surface of the multilayer body includes first protruded portions partially protruding in one of length directions, from a corresponding one of first step layers, in a region including a corresponding one of dielectric layers being adjacent to at least one side, in the lamination directions, of the corresponding one of the first step layers, and a second end surface including second protruded portions each partially protruding in another one of the length directions, from a corresponding one of second step layers, in a region including another corresponding one of the dielectric layers being adjacent to at least one side, in the lamination directions, of the corresponding one of the second step layers.

IPC Classes  ?

  • H01G 4/30 - Stacked capacitors
  • H01G 4/008 - Selection of materials
  • H01G 4/012 - Form of non-self-supporting electrodes
  • H01G 4/12 - Ceramic dielectrics
  • H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

13.

CASE

      
Application Number 18619238
Status Pending
Filing Date 2024-03-28
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Serita, Noboru

Abstract

A case includes a case body including a discharge port through which electronic components are dischargeable, an upper guide slit and a lower guide slit communicating with the discharge port, and a shutter slidably inserted into the guide slits and movable to open and close the discharge port. The case body includes a front inner wall surface and a rear inner wall surface facing each other to define the upper guide slit therebetween and a lower inner wall surface and an upper inner wall surface defining the lower guide slit therebetween. The shutter includes a pair of first and second main surfaces, and includes, on at least one of the pair of main surfaces, an increased thickness portion extending in a sliding direction in which the shutter slides.

IPC Classes  ?

14.

CARRIER TAPE

      
Application Number 18618150
Status Pending
Filing Date 2024-03-27
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Shimizu, Yasuhiro

Abstract

A carrier tap has a belt shape and includes material forming layers laminated in a lamination direction, a front surface and a back surface opposed to each other in a height direction corresponding to the lamination direction, and accommodating portions that each accommodate a component. The accommodating portions are each adjacent to the front surface and each aligned along a length direction with a partition wall interposed therebetween. The partition wall includes a top lower in height than a top of the front surface.

IPC Classes  ?

  • B65D 73/02 - Articles, e.g. small electrical components, attached to webs

15.

CASE

      
Application Number 18619240
Status Pending
Filing Date 2024-03-28
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Serita, Noboru

Abstract

A case includes a case body including a discharge port through which electronic components are dischargeable, an upper guide slit and a lower guide slit communicating with the discharge port, and a shutter slidably inserted into the guide slits and movable to open and close the discharge port. The case body includes a front inner wall surface and a rear inner wall surface facing each other to define the upper guide slit therebetween and a lower inner wall surface and an upper inner wall surface defining the lower guide slit therebetween. The shutter includes a first main surface and a second main surface, and includes thereon an urging structure to elastically urge the shutter toward at least one of the inner wall surfaces.

IPC Classes  ?

  • H05K 13/02 - Feeding of components
  • H05K 13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

16.

RADIO-FREQUENCY CIRCUIT AND COMMUNICATION DEVICE

      
Application Number 18619214
Status Pending
Filing Date 2024-03-28
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Tanaka, Satoshi
  • Sakurai, Satoshi
  • Mori, Hirotsugu

Abstract

A radio-frequency circuit is capable of performing either uplink MIMO or uplink non-MIMO of a first band. The radio-frequency circuit includes a first power amplifier capable of amplifying a signal in the first band, a first circuit capable of adjusting linearity of output power with respect to input power into the first power amplifier, a second power amplifier capable of amplifying a signal in the first band, and a second circuit capable of adjusting linearity of output power with respect to input power into the second power amplifier. Assuming the uplink MIMO is performed using a first transmission signal output from the first power amplifier and a second transmission signal output from the second power amplifier, saturated output powers of the first power amplifier and the second power amplifier are increased due to the first circuit and the second circuit.

IPC Classes  ?

  • H04B 1/04 - Circuits
  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation

17.

POWER AMPLIFYING DEVICE

      
Application Number 18500417
Status Pending
Filing Date 2023-11-02
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Komamura, Yusaku

Abstract

A power amplifying device includes first unit transistors and second unit transistors. The first unit transistors are connected in parallel and configured to amplify a radio frequency signal and to output a resultant signal. The second unit transistors are connected in parallel and configured to amplify the signal output by the first unit transistors and to output a resultant signal. Each of the first unit transistors is smaller than each of the second unit transistors.

IPC Classes  ?

  • H03F 1/30 - Modifications of amplifiers to reduce influence of variations of temperature or supply voltage
  • H03F 3/217 - Class D power amplifiers; Switching amplifiers

18.

ANTENNA DEVICE AND COMMUNICATION DEVICE

      
Application Number 18619207
Status Pending
Filing Date 2024-03-28
First Publication Date 2024-07-18
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ueda, Hideki
  • Nemoto, Takaya
  • Onaka, Kengo

Abstract

An array accommodated in a housing includes multiple antenna elements. The antenna elements face an inside surface of the housing and are arrayed in a first direction at least one-dimensionally. A waveguide is coupled to the antenna elements of the array antenna and extends from the array antenna toward the inside surface of the housing. The waveguide has a housing-side end face facing the inside surface of the housing and an antenna-side end face facing the array antenna. A length from one end to an opposite end of the housing-side end face in the first direction is greater than a length from one end to an opposite end of the antenna-side end face in the first direction. An antenna device that can improve antenna gain without increasing the size of the antenna module is provided.

IPC Classes  ?

  • H01Q 21/29 - Combinations of different interacting antenna units for giving a desired directional characteristic
  • H01Q 13/02 - Waveguide horns
  • H01Q 21/08 - Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along, or adjacent to, a rectilinear path
  • H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction

19.

ACOUSTIC WAVE FILTER

      
Application Number 18391745
Status Pending
Filing Date 2023-12-21
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Tamaoki, Norikazu

Abstract

An acoustic wave filter includes a filter circuit and an additional circuit including IDTs and a reflector. A first excitation portion of one of the IDTs is adjacent to the reflector. An outermost IDT includes ((N/2)+1) electrode fingers when a total number N of the electrode fingers included in the outermost IDT is an even number, or the outermost IDT includes ((N+1)/2) electrode fingers when the total number N is an odd number. A second excitation portion of the one of the IDTs includes two or more electrode fingers, except the electrode fingers of the first excitation portion. Assuming an average arrangement pitch of the electrode fingers included in the first excitation portion is px and an average arrangement pitch of reflection electrode fingers is pr, pr/px has a value in a range from about 0.5 to about 0.97 or a range from about 1.15 to about 2.0.

IPC Classes  ?

  • H03H 9/64 - Filters using surface acoustic waves
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details

20.

SWITCHING POWER SUPPLY DEVICE

      
Application Number 18399221
Status Pending
Filing Date 2023-12-28
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ishikura, Yuki
  • Hosotani, Tatsuya
  • Takatsuji, Hiroyuki

Abstract

A circuit board of a switching power supply device includes a positive terminal circuit pattern and a negative terminal circuit pattern that are provided on a component mount surface and respectively supply currents from input parts to two input terminals of a common mode choke coil. The positive terminal circuit pattern and the negative terminal circuit pattern are positioned in parallel and close to each other. The component mount surface of the circuit board includes a component mount surface side ground pattern arranged below the common mode choke coil. A heat dissipation ground surface of the circuit board includes a ground pattern and a plurality of heat dissipation conductor patterns. Input terminals and output terminals of the common mode choke coil are respectively electrically and thermally connected to the heat dissipation conductor patterns via through-hole conductors provided between the component mount surface and the heat dissipation ground surface.

IPC Classes  ?

  • H02M 3/158 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
  • H02M 1/14 - Arrangements for reducing ripples from dc input or output
  • H02M 1/32 - Means for protecting converters other than by automatic disconnection

21.

ACOUSTIC WAVE ELEMENT, ACOUSTIC WAVE FILTER DEVICE, AND MULTIPLEXER

      
Application Number 18399791
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Konaka, Yohei

Abstract

An acoustic wave element includes a piezoelectric substrate, an IDT electrode including comb electrode fingers, and a reflector including reflective electrode fingers. An average value of all pitches of the comb electrode fingers is smaller than an average value of all pitches of the reflective electrode fingers. When a total number of the comb electrode fingers is defined as N, at least one n-th end-side pitch satisfying 1≤n≤(0.233×N) is smaller than the average value of all the pitches of the comb electrode fingers.

IPC Classes  ?

  • H03H 9/135 - Driving means, e.g. electrodes, coils for networks consisting of magnetostrictive materials
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/58 - Multiple crystal filters
  • H03H 9/70 - Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common or source

22.

FILTER DEVICE AND MULTIPLEXER

      
Application Number 18399792
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Sato, Tomoya
  • Furusato, Hiroyuki
  • Okude, Takayuki
  • Kondo, Seima
  • Okubo, Kota
  • Kameoka, Yoshinori

Abstract

A filter device includes a piezoelectric substrate, a dielectric layer on the piezoelectric substrate, a first IDT electrode on the dielectric layer, a second IDT electrode positioned on the piezoelectric substrate in an area where the dielectric layer is not provided such that the first and second IDT electrodes are side by side in an acoustic wave propagation direction extending along a principal surface of the piezoelectric substrate, a first reflector on the dielectric layer and adjacent to the first IDT electrode on a side of the second IDT electrode, and a second reflector on the piezoelectric substrate and adjacent to the second IDT electrode on a side of the first IDT electrode. The dielectric layer includes an edge portion between the first and second reflectors in planar view seen from a stacking direction of the piezoelectric substrate and the dielectric layer.

IPC Classes  ?

  • H03H 9/05 - Holders or supports
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/64 - Filters using surface acoustic waves

23.

OPTICAL COMPONENT

      
Application Number 18400348
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Nagata, Masaki
  • Shimizu, Yasuhiro
  • Mori, Naoya
  • Shimada, Kazuho

Abstract

An optical component including: a first block having a first refractive index and a first reflective surface; a first light absorbing member containing a first metal ion that absorbs light having a first specific wavelength and has a second refractive index different from the first refractive index; a first buffer layer between and in contact with each of the first light absorbing member and the first block, and having a third refractive index having a value between the first refractive index and the second refractive index, wherein the first light absorbing member, the first buffer layer, and the first block are arranged in this order in a first direction such that first block reflects light traveling in the first direction in a second direction different from the first direction on the first reflective surface.

IPC Classes  ?

24.

POWER AMPLIFIER CIRCUIT

      
Application Number 18403131
Status Pending
Filing Date 2024-01-03
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Tanaka, Satoshi
  • Honda, Yuri
  • Sato, Hideyuki

Abstract

A power amplifier circuit includes: a first amplifier; a second amplifier; and an impedance inverter that delays an output of the first amplifier by a time equivalent to ¼ of a wavelength of a transmission line, and combines the output of the first amplifier delayed by the impedance inverter and an output of the second amplifier and outputs a combined output. The impedance inverter includes a plurality of unit circuits each constituted by an inductor and a capacitor, the plurality of unit circuits are cascade-connected to an output side of the first amplifier, an element included in each unit circuit of the plurality of unit circuits is connected in series to the element of an adjacent unit circuit, and another element included in each unit circuit of the plurality of unit circuits is connected between one end of the element of the same unit circuit.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 1/56 - Modifications of input or output impedances, not otherwise provided for
  • H03F 3/21 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only

25.

POWER AMPLIFIER CIRCUIT

      
Application Number 18403741
Status Pending
Filing Date 2024-01-04
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Takezono, Naofumi
  • Yoshimi, Shunji

Abstract

A power amplifier circuit includes a first amplifier, a second amplifier, a third amplifier, and a harmonic suppression circuit. The first amplifier operates on power supplied through a first supply line, and amplifies a first transmit signal in a first frequency band. The second amplifier operates on power supplied through a second supply line connected to the first supply line, and amplifies a second transmit signal in a second frequency band different from the first frequency band. The third amplifier shares an antenna with the second amplifier, and amplifies a receive signal in the second frequency band received from the antenna. The harmonic suppression circuit generates, based on a harmonic of the first transmit signal, a suppression signal to suppress the harmonic to be transferred to the first supply line, and outputs the suppression signal to the first supply line or the second supply line.

IPC Classes  ?

  • H03F 1/26 - Modifications of amplifiers to reduce influence of noise generated by amplifying elements
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages

26.

COMPOSITE ELECTRONIC COMPONENT

      
Application Number 18404939
Status Pending
Filing Date 2024-01-05
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Fujita, Yukihiro
  • Yamato, Ryutaro
  • Funaki, Tatsuya
  • Satake, Yoshiaki

Abstract

A composite electronic component includes circuit layers, each including an electronic component, that are laminated, first and second circuit layers, a ceramic electronic component between the first and second circuit layers and including via electrodes extending through a body mainly including ceramic and being exposed at a corresponding one of a main surface on one side and a main surface on another side, and a sealing resin covering at least the ceramic electronic component at a location between the first and second circuit layers. At least one electronic component included in each of the first and second circuit layers are electrically connected by the via electrodes.

IPC Classes  ?

  • H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers
  • H01L 23/15 - Ceramic or glass substrates
  • H01L 23/528 - Layout of the interconnection structure
  • H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
  • H01L 23/64 - Impedance arrangements

27.

POWER AMPLIFIER CIRCUIT

      
Application Number 18405125
Status Pending
Filing Date 2024-01-05
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Honda, Yuri

Abstract

A power amplifier circuit includes a first amplifier, a second amplifier, and, an output terminal. The power amplifier circuit includes an impedance conversion unit connected to an output end of one amplifier, which is either the first amplifier or the second amplifier. The impedance conversion unit includes a first line with one end connected to the output end, a second line with one end connected to another end of the first line, and a first capacitor with one end connected to a connection point between the first line and the second line and with another end connected to a reference potential. The first line and the second line are coupled to each other. A signal based on a connection point between an output end of another amplifier of the first amplifier and the second amplifier and another end of the second line is outputted from the output terminal.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 1/56 - Modifications of input or output impedances, not otherwise provided for
  • H03F 3/21 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only

28.

Power Transmission Gate Using Charge Pump

      
Application Number 18465384
Status Pending
Filing Date 2023-09-12
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Cook, Aaron
  • Perreault, David J.
  • Hoversten, John R.

Abstract

Described is a power transmission gate which includes a charge pump, an NMOS transistor, and a gate driver circuit configured to power (or bias or “drive”) a gate of the NMOS transistor. With this arrangement, a power transmission gate capable of achieving substantially the same resistance provided by prior art power transmission gates while having a footprint of just over one NMOS size unit is provided.

IPC Classes  ?

  • H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
  • H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode

29.

CIRCUIT MODULE

      
Application Number 18475392
Status Pending
Filing Date 2023-09-27
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Otsubo, Yoshihito

Abstract

A circuit module includes an upper circuit board, a lower circuit board, a first conductor member, a second conductor member, and a first component. The upper circuit board has a first upper main surface and a first lower main surface. The lower circuit board has a second upper main surface and a second lower main surface, is disposed below the upper circuit board, and overlaps the upper circuit board as viewed in the downward direction. The first component is mounted on the first lower main surface or the second upper main surface. The first conductor member is a metal pin and is connected to the first lower main surface. The second conductor member is a metal pin and is connected to the second upper main surface. The second conductor member is electrically connected to the first conductor member.

IPC Classes  ?

  • H01R 12/52 - Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
  • H05K 1/18 - Printed circuits structurally associated with non-printed electric components

30.

INDUCTOR COMPONENT

      
Application Number 18488585
Status Pending
Filing Date 2023-10-17
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Sano, Rikiya
  • Miyake, Isamu
  • Kondo, Kenta

Abstract

An inductor component includes an element body and an inductor wiring. The element body has a planar first main surface. The inductor wiring extends inside the element body. The inductor wiring includes a plurality of wiring portions arrayed in a direction perpendicular to the first main surface. The element body includes a plurality of interlayer insulating layers filling spaces between the wiring portions that are adjacent to each other in a direction perpendicular to the first main surface. The interlayer insulating layers each contain an insulating base material and a plurality of filler particles dispersed within the base material. In a first interlayer insulating layer, which is one of the plurality of interlayer insulating layers, the average particle size of the filler particles is less than or equal to the standard deviation of the thickness of the first interlayer insulating layer.

IPC Classes  ?

  • H01F 27/32 - Insulating of coils, windings, or parts thereof
  • H01F 27/28 - Coils; Windings; Conductive connections

31.

INDUCTOR COMPONENT

      
Application Number 18490455
Status Pending
Filing Date 2023-10-19
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Sakaguchi, Shingo

Abstract

An inductor component includes an element body and inductor wiring. Among outer surfaces of the element body, one specific surface is defined as a first main surface, one surface perpendicular to the first main surface is defined as a first end surface, and one surface perpendicular to the first main surface and the first end surface is defined as a bottom surface. The inductor wiring includes a winding portion. The winding portion includes an upper side portion, a lower side portion, and a first lateral side portion. The first lateral side portion linearly extends from an end of the lower side portion facing the first end surface to the same position as that of an end of the upper side portion facing the first end surface in a direction perpendicular to the first end surface.

IPC Classes  ?

  • H01F 27/28 - Coils; Windings; Conductive connections
  • H01F 17/00 - Fixed inductances of the signal type
  • H01F 27/29 - Terminals; Tapping arrangements
  • H01F 27/32 - Insulating of coils, windings, or parts thereof

32.

FILTER DEVICE AND RADIO FREQUENCY FRONT END CIRCUIT

      
Application Number 18530295
Status Pending
Filing Date 2023-12-06
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Kikuda, Masayuki

Abstract

A filter device includes input and output terminals, first and second ground electrodes opposed to each other, and a resonator connected to one of the input and output terminals. The resonator includes a third ground electrode, and first, second, and third resonant portions. The third ground electrode is between and connected to the first and second ground electrodes. The first resonant portion is between the first and third ground electrodes, and connected to the third ground electrode and one of the input and output terminals. The second resonant portion is between the first and third ground electrodes, and connected to the third ground electrode. The third resonant portion is between the second and third ground electrodes, and connected to the third ground electrode.

IPC Classes  ?

  • H03H 7/01 - Frequency selective two-port networks
  • H01F 27/28 - Coils; Windings; Conductive connections
  • H01F 27/40 - Structural association with built-in electric component, e.g. fuse
  • H01G 4/30 - Stacked capacitors
  • H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations

33.

FILTER DEVICE, ANTENNA DEVICE, AND ANTENNA MODULE

      
Application Number 18603323
Status Pending
Filing Date 2024-03-13
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Tachibana, Shinya

Abstract

A filter device has a pass band in a band and an attenuation band in an band. The filter device includes first and second terminals, a first inductor connected to the first terminal, and an LC series resonator including a capacitor and a second inductor arranged in, among a first and second paths provided in parallel between the inductor and the terminal, the first path. The first inductor and the second inductor are magnetically coupled to each other.

IPC Classes  ?

  • H03H 7/01 - Frequency selective two-port networks
  • H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network

34.

ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE

      
Application Number 18611815
Status Pending
Filing Date 2024-03-21
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Yamane, Takashi
  • Inoue, Kazunori

Abstract

An acoustic wave device includes an acoustic wave element including a support including a support substrate having a thickness in a first direction, a piezoelectric layer laminated on the support portion and including a first main surface and a second main surface opposite to the first main surface in the first direction, and a functional electrode on at least one of the first main surface and the second main surface of the piezoelectric layer, and a package to house the acoustic wave element. The support portion includes a first space on a piezoelectric layer side at a position where the first space at least partially overlaps the functional electrode in a plan view in the first direction, the package includes a second space outside the first space, and the piezoelectric layer includes a through-hole communicating with the first space and the second space.

IPC Classes  ?

  • H03H 9/10 - Mounting in enclosures
  • H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/05 - Holders or supports
  • H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator

35.

TRACKER MODULE

      
Application Number 18611882
Status Pending
Filing Date 2024-03-21
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Aramata, Tomohide
  • Kogure, Takeshi
  • Matsui, Toshiki
  • Fukuda, Yuuki

Abstract

A tracker module includes a module laminate and an integrated circuit, a filter circuit and an output terminal arranged in or on the module laminate. The integrated circuit includes at least one switch of a switched-capacitor circuit, and at least one switch of a supply modulator. The switched-capacitor circuit is configured to generate a plurality of discrete voltages. The supply modulator is configured to generate an intermediate output by selectively switching among the plurality of discrete voltages based on an envelope signal to vary the intermediate output with the envelope signal. The envelope signal is associated with a signal to be processed by an external circuit that is out of the tracker module. The filter circuit filters the intermediate output to generate a filtered output, and the output terminal provides the filtered output to the external circuit to power the external circuit.

IPC Classes  ?

  • H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages

36.

ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE

      
Application Number 18613799
Status Pending
Filing Date 2024-03-22
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Inoue, Kazunori

Abstract

An acoustic wave device includes a support substrate including a hollow portion, a piezoelectric layer laminated on the support substrate and including a membrane portion at least partially overlapping the hollow portion in a lamination direction, and an electrode on the piezoelectric layer. The electrode includes an IDT electrode finger and an electrode portion other than the IDT electrode finger. The IDT electrode finger is provided on the membrane portion, and an outer contour of the electrode portion intersects with a boundary of the membrane portion in plan view.

IPC Classes  ?

  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 3/04 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
  • H03H 9/145 - Driving means, e.g. electrodes, coils for networks using surface acoustic waves

37.

TRACKER MODULE AND COMMUNICATION DEVICE

      
Application Number 18614934
Status Pending
Filing Date 2024-03-25
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Kogure, Takeshi
  • Aramata, Tomohide
  • Matsui, Toshiki
  • Fukuda, Yuuki

Abstract

A tracker module structure includes a module laminate, an integrated circuit disposed on the module laminate , and a plurality of capacitors that are disposed on the module laminate and includes one or more capacitors in a switched-capacitor circuit. The switched-capacitor circuit is configured to generate a plurality of discrete voltages. The integrated circuit includes a switch that is included in the switched-capacitor circuit and a switch that is included in the supply modulator. The plurality of capacitors include a first flying capacitor and a second flying capacitor that are configured to be charged and discharged in a complementary manner, and a third flying capacitor that is configured to be charged at a same timing as the first flying capacitor and be discharged at a same timing as the first flying capacitor. The second flying capacitor is disposed between the first flying capacitor and the third flying capacitor.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages

38.

TRACKER MODULE AND COMMUNICATION DEVICE

      
Application Number 18616654
Status Pending
Filing Date 2024-03-26
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Kogure, Takeshi
  • Aramata, Tomohide
  • Fukuda, Yuuki
  • Matsui, Toshiki

Abstract

A tracker module includes a module laminate, a first integrated circuit and a second integrated circuit on the module laminate, and a capacitor disposed on the module laminate and included in a switched-capacitor circuit. The switched-capacitor circuit is configured to generate discrete voltages based on an input voltage. The first integrated circuit includes a switch included in the switched-capacitor circuit. The second integrated circuit includes a switch included in at least one of a supply modulator and a pre-regulator circuit. The supply modulator is configured to selectively output at least one of the discrete voltages based on an envelope signal. The pre-regulator circuit is configured to convert the input voltage into a first voltage and output the first voltage to the switched-capacitor circuit. A distance between the first integrated circuit and the capacitor is shorter than a distance between the second integrated circuit and the capacitor.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages

39.

TRACKER MODULE AND COMMUNICATION DEVICE

      
Application Number 18616760
Status Pending
Filing Date 2024-03-26
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Kogure, Takeshi
  • Aramata, Tomohide
  • Matsui, Toshiki
  • Fukuda, Yuuki

Abstract

A tracker module is provided that includes a module laminate and an integrated circuit on the module laminate. The integrated circuit includes a switch unit included in an output switch circuit that selectively outputs at least one of multiple discrete voltages based on a first digital control signal. The first digital control signal includes a digital control line/logic signal indicating one of the multiple discrete voltages. The module laminate includes multiple lines and a ground electrode. The lines are connected to the integrated circuit and the first digital control signal flows through the lines. The ground electrode is connected to a ground terminal. In a sectional view of the module laminate, at least part of the lines is disposed between the integrated circuit and a ground electrode. In a plan view of the module laminate, at least part of the lines matches the ground electrode.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages

40.

ACOUSTIC WAVE ELEMENT, ACOUSTIC WAVE FILTER DEVICE, AND MULTIPLEXER

      
Application Number 18401756
Status Pending
Filing Date 2024-01-02
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Konaka, Yohei

Abstract

In an acoustic wave element, a distance between a comb electrode finger closest to a reflector and a reflective electrode finger closest to an interdigital transducer (IDT) electrode is set as an IDT-reflector gap. An inter-center distance between adjacent electrode fingers is set as a pitch. The electrode fingers in a direction from the comb electrode finger closest to the reflector toward a center are sequentially set as an n-th end-side electrode finger, and a pitch between the n-th end-side electrode finger and an (n+1)-th end-side electrode finger is set as an n-th end-side pitch. An average value of each pitch by all the comb electrode fingers is set as an average IDT pitch, and an average value of each pitch by the reflective electrode fingers is set as an average reflector pitch.

IPC Classes  ?

  • H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
  • H03H 9/56 - Monolithic crystal filters

41.

CYLINDRICAL BATTERY

      
Application Number 18402367
Status Pending
Filing Date 2024-01-02
First Publication Date 2024-07-11
Owner MURATA MANUFACTURING CO., LTD. (Japan)
Inventor Sodeyama, Kunio

Abstract

A cylindrical battery is provided and includes a columnar electrode body, a cylindrical battery can in which one end portion is opened and the electrode body is accommodated, and a current interrupt device provided at the one end portion. The current interrupt device includes a cover, a holder provided inside the cover, and a disk provided inside the holder.

IPC Classes  ?

  • H01M 50/578 - Devices or arrangements for the interruption of current in response to pressure
  • H01M 10/04 - Construction or manufacture in general
  • H01M 50/586 - Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries inside the batteries, e.g. incorrect connections of electrodes
  • H01M 50/591 - Covers

42.

SWITCHING POWER SUPPLY DEVICE

      
Application Number 18403297
Status Pending
Filing Date 2024-01-03
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Hosotani, Tatsuya
  • Takatsuji, Hiroyuki
  • Ishikura, Yuki

Abstract

A noise reduction circuit includes a surface-mount common mode choke coil mounted on a circuit board. Output terminals of the common mode choke coil are connected to an input capacitor via second circuit patterns. Two terminals of the input capacitor are connected to two input ends of a switching circuit via third circuit patterns. Path lengths of the second circuit patterns are longer than path lengths of the third circuit patterns. Of a plurality of current paths, the path lengths of the third circuit patterns are shortest in comparison with path lengths of other current paths. First circuit patterns are parallel and face each other to form a first parasitic capacitance, and the second circuit patterns are parallel and face each other to form second parasitic capacitances.

IPC Classes  ?

  • H02M 3/158 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
  • H02M 1/14 - Arrangements for reducing ripples from dc input or output
  • H02M 1/44 - Circuits or arrangements for compensating for electromagnetic interference in converters or inverters

43.

INDUCTOR COMPONENT

      
Application Number 18403330
Status Pending
Filing Date 2024-01-03
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Seko, Atsushi

Abstract

An inductor component includes a base body including an insulating layer, internal wiring provided inside the base body and constituting a coil spirally wound by electrically coupling at least part of the internal wiring, and an outer electrode electrically coupled to the coil. The insulating layer is provided with a groove starting from an interface, as a point of origin, between the internal wiring and the insulating layer and extending obliquely with respect to a surface of the internal wiring.

IPC Classes  ?

  • H01F 27/32 - Insulating of coils, windings, or parts thereof
  • H01F 27/28 - Coils; Windings; Conductive connections

44.

VIBRATION WAVE RADIATING DEVICE

      
Application Number 18404938
Status Pending
Filing Date 2024-01-05
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Ito, Ryota

Abstract

In a vibration wave radiating device, when a distance between a connection portion and a reflecting plane portion in a direction orthogonal to the reflecting plane portion is TD, an angle defined by a virtual line parallel to the reflecting plane portion and a back surface of a vibrating portion in a longitudinal section is θ, a shortest distance between a peripheral edge of the back surface at an end of the vibrating portion opposite to the connection portion and a peripheral edge of the reflecting plane portion is L, and a wavelength of a vibration wave emitted from the vibrating portion is λ, a relationship indicated by 0.78λ≤L≤1.19λ or 1.5λ≤L≤2.14λ is satisfied when TD=0 and 35°≤θ≤55°.

IPC Classes  ?

  • H02N 99/00 - Subject matter not provided for in other groups of this subclass

45.

POWER AMPLIFIER CIRCUIT

      
Application Number 18405258
Status Pending
Filing Date 2024-01-05
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Imai, Shohei

Abstract

A divider circuit divides an input signal into first, second, third, and fourth input signals. A first carrier amplifier amplifies the first input signal and outputs a first output signal. A first peak amplifier amplifies the second input signal and outputs a second output signal. A first converter inputs the first and second output signals. A second carrier amplifier amplifies the third input signal and outputs a third output signal, the first and second carrier amplifiers forming a differential pair. A second peak amplifier amplifies the fourth input signal and outputs a fourth output signal, the first and second peak amplifiers forming a differential pair. A second converter inputs the third output signal and is electrically connected to the first converter. A combiner is electrically connected to an output terminal or a ground and to the first and second converters.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 1/56 - Modifications of input or output impedances, not otherwise provided for
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
  • H03F 3/60 - Amplifiers in which coupling networks have distributed constants, e.g. with waveguide resonators

46.

INDUCTOR COMPONENT

      
Application Number 18447004
Status Pending
Filing Date 2023-08-09
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Sakaguchi, Shingo

Abstract

An inductor component includes an element body and inductor wiring. The element body has first and second electrodes connected to first and second ends of the inductor wiring, respectively. One outer surface of the element body is a first main surface, one surface perpendicular to the first main surface is a first end surface, and one surface perpendicular to the first main and end surfaces is a bottom surface. The first electrode includes a first bottom surface electrode portion and a first end surface electrode portion. A size of the first bottom surface electrode portion in a direction perpendicular to the bottom surface is a thickness, and a portion of the first bottom surface electrode portion farthest from the first end surface is a leading end. The thickness of at least part of the first bottom surface electrode portion including the leading end decreases toward the leading end.

IPC Classes  ?

47.

BIOSIGNAL ELECTRODE

      
Application Number 18480702
Status Pending
Filing Date 2023-10-04
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Yoshida, Koji
  • Torita, Takeshi
  • Okamura, Ichitaro
  • Sugiura, Kosuke
  • Fujiwaki, Mika

Abstract

A biosignal electrode that includes a substrate having first and second opposed main surfaces; a conductive material pattern on the first main surface of the substrate, the conductive material pattern defining a plurality of open spaces extending through the conductive material pattern and exposing the first surface of the substrate therethrough; and a biocompatible glue material within the plurality of open spaces of the conductive material pattern.

IPC Classes  ?

  • A61B 5/265 - Bioelectric electrodes therefor characterised by the electrode materials containing silver or silver chloride
  • A61B 5/257 - Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes
  • A61B 5/273 - Connection of cords, cables or leads to electrodes
  • A61B 5/28 - Bioelectric electrodes therefor specially adapted for particular uses for electrocardiography [ECG]
  • A61B 5/291 - Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]

48.

CIRCUIT MODULE

      
Application Number 18483870
Status Pending
Filing Date 2023-10-10
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Otsubo, Yoshihito

Abstract

A first sealing resin is disposed between a first lower main surface and a second upper main surface. An upper circuit board first mounting electrode is disposed on the first lower main surface. A lower circuit board first mounting electrode is disposed on the second upper main surface. A first component is mounted on the lower circuit board first mounting electrode and is disposed in the first sealing resin. A first conductor layer is disposed on an upper circuit board. As viewed in the downward direction, a heat conduction member overlaps the first component, is disposed in a space between the first lower main surface and the second upper main surface, and is coupled to the first conductor layer via a conductor. A part of a heat dissipation member is exposed from the first sealing resin in a direction orthogonal to an up-down axis.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • H01L 23/367 - Cooling facilitated by shape of device
  • H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers
  • H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices the devices being of types provided for in two or more different main groups of groups , or in a single subclass of , , e.g. forming hybrid circuits
  • H05K 1/14 - Structural association of two or more printed circuits
  • H05K 1/18 - Printed circuits structurally associated with non-printed electric components

49.

CIRCUIT MODULE

      
Application Number 18483929
Status Pending
Filing Date 2023-10-10
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Otsubo, Yoshihito
  • Nakagoshi, Hideo
  • Yoshimori, Hiroki

Abstract

An upper circuit board body has a first upper main surface and a first lower main surface. A lower circuit board body has a second upper main surface and a second lower main surface. A lower circuit board first mounting electrode and one or more lower circuit board second mounting electrodes are disposed on the second upper main surface. A first component is mounted on the one or more lower circuit board second mounting electrodes. A first conductor member is mounted on the lower circuit board first mounting electrode and is disposed on the left of the first component. A second conductor member is disposed on the first lower main surface, is connected to the upper end of the first conductor member, and overlaps at least a part of the first component as viewed in the downward direction.

IPC Classes  ?

  • H05K 1/14 - Structural association of two or more printed circuits
  • H05K 1/02 - Printed circuits - Details

50.

ACOUSTIC RESONATOR LID FOR THERMAL TRANSPORT

      
Application Number 18488277
Status Pending
Filing Date 2023-10-17
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Koulakis, John
  • Dyer, Greg
  • Mchugh, Sean
  • Turner, Patrick

Abstract

An apparatus for filtering radio frequency signals is provided. The apparatus includes a substrate and a membrane coupled to the substrate that includes piezoelectric material. The apparatus also includes an interdigital transducer (IDT) coupled to the membrane and includes a plurality of interleaved fingers. The apparatus also includes a lid, in which the membrane is arranged between the substrate and the lid with a first cavity having a first height between the lid and a first main surface of the membrane and a second cavity having a second height between the substrate and a second main surface of the membrane that opposes the first main surface. Moreover, the first height between the lid and the first main surface of the membrane is greater than a pitch of at least one pair of interleaved fingers of the plurality of interleaved fingers and at most four times greater than the second height.

IPC Classes  ?

  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/56 - Monolithic crystal filters

51.

MULTILAYER RESIN SUBSTRATE AND ELECTRONIC COMPONENT

      
Application Number 18524031
Status Pending
Filing Date 2023-11-30
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Matsuda, Kenji

Abstract

A multilayer resin substrate includes first and second substrates joined to overlap each other, a first signal electrode on a joint surface between the first and second substrates, a first via-conductor in the first substrate and joined to the first signal electrode, a first ground electrode in or on the second substrate and overlapping the first signal electrode, a first floating electrode in the second substrate and between the first signal electrode and the first ground electrode. The first signal electrode includes a first joint joined to the first via-conductor and a wiring portion extending in a signal transmission direction. In a line-width direction transverse to the signal transmission direction, the first joint has a line width greater than that of the wiring portion. When viewed in the thickness direction, the first floating electrode overlaps the first joint of the first signal electrode.

IPC Classes  ?

52.

OPTIMAL PHASE CONDITION DETERMINATION METHOD, ANTENNA MODULE, AND COMMUNICATION SYSTEM

      
Application Number 18611769
Status Pending
Filing Date 2024-03-21
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Koshino, Kouichi

Abstract

A short-axis intensity is obtained under a plurality of phase conditions including different phase conditions of a high-frequency signal supplied to a plurality of antenna devices included in an array antenna. The short-axis intensity is a maximum value of a short-axis direction component of an electric field vector of a composite wave of radio waves radiated in a first direction from the respective antenna devices. An optimal phase condition of the high-frequency signal supplied to the plurality of antenna devices is determined in a manner such that the short-axis intensity of the composite wave is maximized.

IPC Classes  ?

  • H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
  • H04B 7/06 - Diversity systems; Multi-antenna systems, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station
  • H04B 7/10 - Polarisation diversity; Directional diversity

53.

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

      
Application Number 18612190
Status Pending
Filing Date 2024-03-21
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Ookawa, Noriyuki

Abstract

An electronic component that includes: a base body; and an external electrode that covers a part of an outer surface of the base body, the external electrode including: an underlying electrode containing copper and silicon; and a metal layer that covers an outer surface of the underlying electrode, wherein at least some of the copper has copper particles with a flattening ratio of 0.5 or less, and when the underlying electrode is viewed in section, the silicon is distributed so as to fill gaps between the copper particles.

IPC Classes  ?

  • H01G 4/30 - Stacked capacitors
  • H01G 4/012 - Form of non-self-supporting electrodes
  • H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

54.

SENSING DEVICE AND DEVICE SET

      
Application Number 18614898
Status Pending
Filing Date 2024-03-25
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Shimuta, Toru
  • Hanada, Kaname

Abstract

A sensing device is provided that includes a non-flexible body that is wearable on a user's finger and a biosensor that measures biological information through the finger. The body has an inner peripheral surface facing a pad, a back, an outer side surface, and an inner side surface. The biosensor is on the inner peripheral surface to face the pad when the body is worn on the finger. In a cross-section of the inner peripheral surface, a first distance between a portion of the inner peripheral surface that faces the pad of the finger and a portion of the inner peripheral surface that faces the back of the finger is shorter than a second distance between a portion of the inner peripheral surface that faces the outer side surface of the finger and a portion of the inner peripheral surface that faces the inner side surface of the finger.

IPC Classes  ?

  • A61B 5/024 - Measuring pulse rate or heart rate
  • A61B 5/00 - Measuring for diagnostic purposes ; Identification of persons

55.

MODULE

      
Application Number 18614965
Status Pending
Filing Date 2024-03-25
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Otsubo, Yoshihito
  • Takeuchi, Morio

Abstract

A module includes a die pad arranged to locate a lower end thereof on a reference plane, a signal terminal arranged to locate a lower end thereof on the reference plane, an electronic component fixed as being superimposed above the die pad, and a sealing resin arranged to seal the die pad, the signal terminal, and the electronic component from above. The electronic component is provided with a component first surface facing a side of the die pad and a component second surface facing a side opposite to the die pad. The component second surface and the signal terminal are electrically connected to each other through a first wire. The die pad includes a die pad main body on which the electronic component is carried and a surrounding portion extending from the die pad main body along the reference plane to surround the signal terminal apart from the signal terminal.

IPC Classes  ?

  • H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
  • H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
  • H01L 23/60 - Protection against electrostatic charges or discharges, e.g. Faraday shields
  • H01L 23/66 - High-frequency adaptations
  • H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

56.

TRACKER MODULE

      
Application Number 18615010
Status Pending
Filing Date 2024-03-25
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Kogure, Takeshi
  • Aramata, Tomohide
  • Matsui, Toshiki
  • Fukuda, Yuuki

Abstract

A tracker module includes an integrated circuit, a first capacitor and a second capacitor arranged in or on a module laminate. The integrated circuit includes at least one switch in a switched-capacitor circuit and at least one switch in a supply modulator. The switched-capacitor circuit is configured to generate a plurality of discrete voltages. The supply modulator is configured to generate an output voltage by selectively switching among the plurality of discrete voltages based on a control signal. The first capacitor is a flying capacitor of the switched-capacitor circuit. The second capacitor is a smoothing capacitor of the switched-capacitor circuit. In a plan view of the module laminate, the first capacitor is arranged closer to the integrated circuit than the capacitor.

IPC Classes  ?

  • H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
  • H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode

57.

MULTILAYER CERAMIC CAPACITOR

      
Application Number 18616240
Status Pending
Filing Date 2024-03-26
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Yasuda, Tatsunori
  • Kurokawa, Kazuki

Abstract

A multilayer ceramic electronic component includes a multilayer body including first and second internal electrode layers alternately laminated with ceramic layers and exposed at one of first and second end surfaces, first step layers on a same plane as a respective one of the second internal electrode layers and exposed at the first end surface, and second step layers on a same plane as a respective one of the first internal electrode layers and exposed at the second end surface. Each of the first step layers and a corresponding one of the second internal electrode layers have a distance therebetween that increases closer to the first main surface than the second main surface, and each of the second step layers and a corresponding one of the first internal electrode layers have a distance therebetween that increases closer to the first main surface than the second main surface.

IPC Classes  ?

  • H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
  • H01G 4/012 - Form of non-self-supporting electrodes
  • H01G 4/30 - Stacked capacitors

58.

TRACKER MODULE AND COMMUNICATION DEVICE

      
Application Number 18616848
Status Pending
Filing Date 2024-03-26
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Kogure, Takeshi
  • Aramata, Tomohide
  • Fukuda, Yuuki
  • Matsui, Toshiki

Abstract

A tracker module is provided that includes a module substrate, an integrated circuit disposed on the module substrate, and a capacitor disposed on the module substrate and included in a switched-capacitor circuit. The switched-capacitor circuit generates multiple discrete voltages based on an input voltage. The integrated circuit includes a switch included in the switched-capacitor circuit and a switch included in an output switch circuit. The output switch circuit selectively outputs at least one of the multiple discrete voltages. The integrated circuit and the capacitor are adjacent to each other.

IPC Classes  ?

  • H04B 1/04 - Circuits
  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 3/213 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only in integrated circuits

59.

ELECTRONIC COMPONENT CONTAINER

      
Application Number 18617692
Status Pending
Filing Date 2024-03-27
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Nakagawa, Kiyoyuki

Abstract

An electronic component container includes a component accommodating space to accommodate electronic components, and a discharge port through which the electronic components accommodated in the component accommodating space are dischargeable to an outside. An inner wall surface of the component accommodating space has a skewness Rsk of about −0.8 or greater and about −0.3 or less.

IPC Classes  ?

  • H05K 13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • B65D 25/30 - Hand holes
  • B65D 25/52 - Devices for discharging successive articles or portions of contents

60.

TRACKER MODULE AND COMMUNICATION DEVICE

      
Application Number 18618120
Status Pending
Filing Date 2024-03-27
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Fukasawa, Mikiko
  • Tomita, Takayuki
  • Kogure, Takeshi
  • Oomori, Kenzou

Abstract

A tracker module is provided that includes a module laminate and one or more integrated circuits that are disposed on the module laminate and that includes an integrated circuit. The integrated circuit includes a switch included in a pre-regulator circuit, at least one switch included in a switched-capacitor circuit, a first IC terminal connected to the switch included in the pre-regulator circuit, and a second IC terminal connected to one of the at least one switch included in the switched-capacitor circuit. The at least one integrated circuit includes a switch included in a supply modulator. The module laminate includes a signal line with which the first IC terminal is connected to the second IC terminal.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages

61.

MULTILAYER CERAMIC CAPACITOR

      
Application Number 18618166
Status Pending
Filing Date 2024-03-27
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Yasuda, Tatsunori
  • Kurokawa, Kazuki

Abstract

A multilayer ceramic electronic component includes a multilayer body including first and second internal electrode layers each alternately laminated with ceramic layers and exposed at a respective end surface, first step layers on a same plane as a respective one of the second internal electrode layers and exposed at a first end surface, and second step layers on a same plane as a respective one of the first internal electrode layers and exposed at a second end surface. The first step layers each have a thickness in a height direction of the multilayer body greater at a location closer to the first main surface than the second main surface, and the second step layers each have a thickness in the height direction of the multilayer body greater at a location closer to the first main surface than the second main surface.

IPC Classes  ?

62.

TRACKER MODULE

      
Application Number 18618287
Status Pending
Filing Date 2024-03-27
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Aramata, Tomohide
  • Kogure, Takeshi
  • Matsui, Toshiki
  • Fukuda, Yuuki

Abstract

A tracker module is provided that includes an integrated circuit on or in a module laminate, and external connection terminals including first and second external connection terminals. The integrated circuit includes a switch included in a pre-regulator circuit, a switch included in a switched-capacitor circuit, a switch included in a supply modulator, a first IC terminal connected to the first external connection terminal, and a second IC terminal connected to the second external connection terminal. The first external connection terminal is connected to a power inductor that is disposed outside the tracker module. The second external connection terminal is an input terminal for a digital control signal for the supply modulator. A distance between the first external connection terminal and the first IC terminal is shorter than a distance between the second external connection terminal and the second IC terminal.

IPC Classes  ?

  • H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages

63.

Enhanced Gate Driver

      
Application Number 17969557
Status Pending
Filing Date 2022-10-19
First Publication Date 2024-07-11
Owner MURATA MANUFACTURING CO., LTD. (Japan)
Inventor Wu, Gary Chunshien

Abstract

Circuitry and methods for an improved gate driver circuit for power converters. The improved gate driver circuit substantially reduces propagation delay and transition losses in the floating-gate side of the gate driver circuit. One embodiment includes an inverter having an input configured to receive a state transition signal and an output configured to be coupled to a control input of a switching device. The inverter includes a first NFET having a control gate configured to be coupled to the state transition signal, a second NFET having a control gate coupled to the output of a reference circuit, and a PFET having a control gate configured to be coupled to the state transition signal, wherein the output of the inverter is a node between the conduction channels of the first NFET and the second NFET and the conduction channels of the first NFET, second NFET, and PFET are coupled in series.

IPC Classes  ?

  • H02M 1/088 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the simultaneous control of series or parallel connected semiconductor devices
  • H02M 7/5387 - Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration

64.

ELECTRONIC COMPONENT

      
Application Number 18400401
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-07-11
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Yokomizo, Satoshi
  • Chikuma, Shinobu
  • Mukobata, Yohei

Abstract

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The external electrodes each include a first Sn plated layer that covers an outer surface of the interposer board in a vicinity of at least one board end surface.

IPC Classes  ?

  • H01G 2/06 - Mountings specially adapted for mounting on a printed-circuit support
  • H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
  • H01G 4/30 - Stacked capacitors

65.

ACOUSTIC WAVE DEVICE

      
Application Number 18390436
Status Pending
Filing Date 2023-12-20
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Oshima, Naoki

Abstract

In an acoustic wave device, a resonator including an IDT electrode and a portion of a piezoelectric substrate includes a middle region, a first gap region, a second gap region, a first edge region, a second edge region, a first intermediate region, and a second intermediate region. The first intermediate region is located between the middle region and the first edge region. The second intermediate region is located between the middle region and the second edge region. An acoustic wave velocity in the first intermediate region and in the second intermediate region are lower than an acoustic wave velocity in the middle region and higher than an acoustic wave velocity in the first edge region and an acoustic wave velocity in the second edge region.

IPC Classes  ?

  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/145 - Driving means, e.g. electrodes, coils for networks using surface acoustic waves
  • H03H 9/25 - Constructional features of resonators using surface acoustic waves

66.

ACOUSTIC RESONATOR HAVING SYMMETRIC COATING MATERIAL FOR IMPROVED COUPLING

      
Application Number 18394448
Status Pending
Filing Date 2023-12-22
First Publication Date 2024-07-04
Owner Murata Manufacturing co., Ltd. (Japan)
Inventor
  • Koulakis, John
  • Morosin, Drew

Abstract

An acoustic resonator is provided that includes a substrate; a piezoelectric layer having first and second surfaces that oppose each other with the second surface coupled to the substrate either directly or via one or more intermediate layers. The piezoelectric layer includes a diaphragm over a cavity extending in at least one of the substrate and the one or more intermediate layers. An interdigital transducer (IDT) is disposed at the piezoelectric layer and has interleaved fingers on the diaphragm. Moreover, first and second dielectric layers are disposed on opposing surfaces of the diaphragm, where the first and second dielectric layers have a first thickness and the piezoelectric layer has a second thickness greater than the first thickness. The first and second dielectric layers each comprise one of ZnS, HfN, HfO2, ZnO and Ta2O5, to improve an electrotechnical coupling of the acoustic resonator.

IPC Classes  ?

  • H03H 9/145 - Driving means, e.g. electrodes, coils for networks using surface acoustic waves
  • H03H 3/08 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/25 - Constructional features of resonators using surface acoustic waves

67.

BIOMEDICAL DATA RELAY DEVICE AND BIOMEDICAL-DEVICE WIRELESS COMMUNICATION SYSTEM

      
Application Number 18402977
Status Pending
Filing Date 2024-01-03
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Saitou, Hiroki
  • Kimura, Shuto
  • Sano, Takaya
  • Tanaka, Koji

Abstract

A biomedical data relay device includes a first communication unit, an output unit, and a first controller. The first communication unit is capable of receiving biometric information from a biomedical device through wireless communication. The output unit is capable of outputting biometric information to a display. The output unit outputs, in a case where the first communication unit loses wireless communication with the biomedical device, the received biometric information to the display. The first controller counts a first time period in which the first communication unit is in a state of being unable to communicate wirelessly with the biomedical device. The first controller maintains a power-on state in a case where wireless communication becomes available before the first time period reaches a first specified time period, which is predetermined.

IPC Classes  ?

  • H04W 76/18 - Management of setup rejection or failure
  • G16H 40/63 - ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices for the operation of medical equipment or devices for local operation
  • H04W 52/02 - Power saving arrangements

68.

MAGNETIC SENSOR, POSITION DETECTOR INCLUDING THE SAME, AND METHOD OF MANUFACTURING MAGNETIC SENSOR

      
Application Number 18406544
Status Pending
Filing Date 2024-01-08
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Nakamura, Daisuke
  • Ibusuki, Takahiro

Abstract

An output value of a magnetic sensor when an intensity of a signal magnetic field is zero is displaced from zero due to a difference between a magnetization state of magnetized fixed layers of magnetoresistance effect stacks in each of a first magnetoresistance effect element and a fourth magnetoresistance effect element and a magnetization state of magnetized fixed layers of magnetoresistance effect stacks in each of a second magnetoresistance effect element and a third magnetoresistance effect element.

IPC Classes  ?

  • G01R 33/09 - Magneto-resistive devices
  • G01R 33/00 - Arrangements or instruments for measuring magnetic variables
  • H10N 50/10 - Magnetoresistive devices

69.

SECONDARY BATTERY

      
Application Number 18582255
Status Pending
Filing Date 2024-02-20
First Publication Date 2024-07-04
Owner MURATA MANUFACTURING CO., LTD. (Japan)
Inventor Hiratsuka, Toshihiro

Abstract

A secondary battery includes a battery device in which a positive electrode and a negative electrode are stacked on each other with a separator interposed between the positive electrode and the negative electrode and a stack of the positive electrode, the negative electrode, and the separator is wound about a winding axis. A section of the battery device has an elongated shape defined by a major axis and a minor axis. The section intersects the winding axis. The battery device includes a flat region and a curved region. The flat region extends in a direction of the major axis. The curved region is coupled to the flat region and is curved. The positive electrode includes a positive electrode current collector and a positive electrode active material layer. The positive electrode active material layer is provided on the positive electrode current collector. The negative electrode includes a negative electrode current collector and a negative electrode active material layer. The negative electrode active material layer is provided on the negative electrode current collector and opposed to the positive electrode active material layer. At least the positive electrode active material layer in an innermost wind of the positive electrode of the battery device includes a first part and a second part. The first part includes a positive electrode active material having a first area density. The second part includes a positive electrode active material having a second area density that is lower than the first area density. The second part is provided at least on both a whole of the positive electrode active material layer in the innermost wind in the curved region and the positive electrode active material layer in the innermost wind in a portion, of the flat region, that is in a vicinity of a border between the flat region and the curved region.

IPC Classes  ?

  • H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
  • H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
  • H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
  • H01M 4/02 - Electrodes composed of, or comprising, active material

70.

INDUCTOR COMPONENT

      
Application Number 18601691
Status Pending
Filing Date 2024-03-11
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Nakashima, Yasunari
  • Tajima, Shinya
  • Shimoda, Yuta
  • Takahashi, Daisuke

Abstract

An inductor component includes an element body, a coil provided in the element body, and an outer electrode provided to the element body and electrically connected to the coil. The outer electrode includes an underlying layer embedded in the element body in which part of the underlying layer protrudes from a surface of the element body, and a coating film that covers a portion of the underlying layer exposed at the element body.

IPC Classes  ?

71.

ULTRASONIC MOTOR

      
Application Number 18603443
Status Pending
Filing Date 2024-03-13
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Hashimoto, Akari
  • Kashiura, Hideaki

Abstract

An ultrasonic motor that includes a case having a first case member having a plate shape portion including a first main surface and a second main surface and a side surface connecting the first main surface and the second main surface; a first bearing portion attached to the first case member and that supports the shaft; a second case member disposed on a second main surface side of the first case member, and having a cup shape portion including a bottom portion and a side wall portion, wherein the side wall portion has a plurality of support portions that protrude toward an inside of the case and support the second main surface of the first case member, and a plurality of fixing portions that fix the first case member to the second case member; and a second bearing portion attached to the second case member and that supports the shaft.

IPC Classes  ?

  • H02N 2/00 - Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
  • H02N 2/10 - Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors

72.

CURRENT SENSOR, METHOD OF CORRECTING THE SAME, AND METHOD OF CORRECTING A PLURALITY OF CURRENT SENSORS

      
Application Number 18607619
Status Pending
Filing Date 2024-03-18
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Komoda, Junya
  • Maeda, Tatsuki

Abstract

A current sensor includes first and second magnetic detectors. An interval in a second direction between the second magnetic detector and a measurement target bus bar is larger than an interval in the second direction between the first magnetic detector and the measurement target bus bar. While a processing circuit performs mutual reduction and cancellation of detection values obtained by the first and second magnetic detectors, of a magnetic field component in a first direction of an external magnetic field generated from an adjacent bus bar, the processing circuit calculates a value of a current that flows through the measurement target bus bar based on a difference in absolute value between the detection values obtained by the first and second magnetic detectors, of the magnetic field component in the first direction of the magnetic field generated by the current that flows in the measurement target bus bar.

IPC Classes  ?

  • G01R 15/20 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices
  • G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof

73.

ELECTRONIC COMPONENT

      
Application Number 18608068
Status Pending
Filing Date 2024-03-18
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Oie, Hirofumi
  • Teramoto, Masahiro

Abstract

To provide an electronic component capable of improving the visibility of an identification mark, while maintaining the strength of a substrate body. An electronic component includes substrate body that includes a plurality of insulating substrates laminated in thickness direction and that has a pair of principal surfaces and side surface, LC resonator that includes inductor conductor disposed on at least one of the plurality of substrates, and capacitor conductor disposed on at least one of the plurality of substrates and electrically connected to inductor conductor, shield conductor that is disposed on principal surface and that is electrically connected to ground, and identification mark that is provided on surface of shield conductor.

IPC Classes  ?

  • H01G 2/24 - Distinguishing marks, e.g. colour coding
  • H01F 17/00 - Fixed inductances of the signal type
  • H01F 27/36 - Electric or magnetic shields or screens
  • H01G 2/22 - Electrostatic or magnetic shielding
  • H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations

74.

MULTILAYER CERAMIC CAPACITOR

      
Application Number 18609020
Status Pending
Filing Date 2024-03-19
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ohara, Takashi
  • Onishi, Hideyasu

Abstract

A multilayer ceramic capacitor includes a multilayer body including dielectric layers made of ceramic and stacked together, and inner electrodes arranged along multiple interfaces between the dielectric layers, with each inner electrode extending along a respective interface. The inner electrodes include silver as a conductive material and also include at least one of AgTiO3, EuTiO3, or NaTio3.

IPC Classes  ?

  • H01G 4/008 - Selection of materials
  • H01G 4/012 - Form of non-self-supporting electrodes
  • H01G 4/12 - Ceramic dielectrics
  • H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
  • H01G 4/30 - Stacked capacitors

75.

CONDUCTIVE PASTE

      
Application Number 18609022
Status Pending
Filing Date 2024-03-19
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ohara, Takashi
  • Onishi, Hideyasu

Abstract

A conductive paste included in inner electrodes of a multilayer ceramic capacitor is fired and includes a conductive metal powder, a ceramic powder, an organic solvent, and an organic binder. The conductive metal powder includes copper, and at least a portion of the ceramic powder is a powder of at least one oxide of an ABO3 type with a specified ionic radius in which a ratio of a six-coordinate ionic radius of an A-site element in ABO3 to a six-coordinate ionic radius of copper is about 0.96 or greater and about 1.04 or less.

IPC Classes  ?

  • H01G 4/008 - Selection of materials
  • C04B 35/462 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates
  • C04B 35/465 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
  • C04B 35/468 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
  • C04B 35/49 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates containing also titanium oxide or titanates
  • C04B 35/636 - Polysaccharides or derivatives thereof
  • H01G 4/12 - Ceramic dielectrics
  • H01G 4/30 - Stacked capacitors

76.

INSPECTION CONNECTOR

      
Application Number 18609500
Status Pending
Filing Date 2024-03-19
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Abe, Manabu
  • Yamaguchi, Ryo
  • Araki, Kiyoto

Abstract

A cylindrical member has a cylindrical shape having a central axis line extending in an upward-downward direction. A signal terminal holding member is located inside the cylindrical member in a lower portion of the cylindrical member, and is held by the cylindrical member. A first signal terminal is supported by the signal terminal holding member. A circuit substrate is held by the signal terminal holding member. The circuit substrate includes a substrate main body and one or more signal wires. Each of the one or more signal wires includes a first end portion located in an upper portion of the substrate main body and a second end portion located in a lower portion of the substrate main body. Each of the one or more second end portions is electrically connected to any one of the one or more first signal terminals.

IPC Classes  ?

  • G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures

77.

USER INTERFACE DEVICE

      
Application Number 18610323
Status Pending
Filing Date 2024-03-20
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Sugahara, Kohei
  • Watanabe, Hiroshi
  • Inoue, Koichi
  • Kato, Takatoshi

Abstract

A user interface device includes a grip including dimensions in a radial direction and a circumferential direction and extending in a longitudinal direction, and at least one optical sensor provided at the grip including a proximity sensor that includes a light emitter and a light receiver, and a force sensor to detect a contact force by an object. The proximity sensor emits light from the light emitter to a predetermined detection range around the force sensor, and detects when the object is in proximity to the force sensor according to a light reception result obtained by light incident from the detection range to be received by the light receiver. The detection range is biased to one side in the circumferential direction from a position of the force sensor toward an outer side portion in the radial direction, and is wider in the circumferential direction than in the longitudinal direction.

IPC Classes  ?

  • G06F 3/03 - Arrangements for converting the position or the displacement of a member into a coded form
  • A63F 13/213 - Input arrangements for video game devices characterised by their sensors, purposes or types comprising photodetecting means, e.g. cameras, photodiodes or infrared cells
  • A63F 13/218 - Input arrangements for video game devices characterised by their sensors, purposes or types using pressure sensors, e.g. generating a signal proportional to the pressure applied by the player
  • G06F 3/038 - Control and interface arrangements therefor, e.g. drivers or device-embedded control circuitry

78.

ELECTRONIC COMPONENT

      
Application Number 18610460
Status Pending
Filing Date 2024-03-20
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Oie, Hirofumi
  • Teramoto, Masahiro

Abstract

To provide an electronic component capable of improving the adhesiveness of the shield conductor provided on the outer surface of the substrate body, to the substrate body, while suppressing a deterioration of the characteristics of an LC resonator provided in the substrate body. An electronic component comprises substrate body that includes substrates being insulating and laminated, and that has principal surfaces and side surface, LC resonator that includes inductor conductor disposed on substrates and capacitor conductor disposed on substrates and electrically connected to the inductor conductor, shield conductor that is disposed on principal surface and that is electrically connected to a ground, outer electrode that is disposed on principal surfaces and that is electrically connected to the LC resonator, and protective layer that covers shield conductor disposed on principal surface and principal surface, in a manner straddling interface between shield conductor disposed on principal surface and substrate body.

IPC Classes  ?

  • H01F 27/28 - Coils; Windings; Conductive connections
  • H01F 27/29 - Terminals; Tapping arrangements
  • H01F 27/40 - Structural association with built-in electric component, e.g. fuse
  • H03H 7/00 - Multiple-port networks comprising only passive electrical elements as network components

79.

ELECTRONIC COMPONENT

      
Application Number 18610464
Status Pending
Filing Date 2024-03-20
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Matsui, Togo

Abstract

An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.

IPC Classes  ?

  • H01G 4/008 - Selection of materials
  • H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
  • H01G 4/30 - Stacked capacitors

80.

LNA ARCHITECTURE WITH CONFIGURABLE FEEDBACK FILTERING

      
Application Number 18147607
Status Pending
Filing Date 2022-12-28
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ayranci, Emre
  • Rui, Mengsheng
  • Sanner, Miles
  • Rungta, Anant

Abstract

A low noise amplifier (LNA) with configurable feedback that includes a filter circuit for improved stability is presented. The filter circuit includes an L-C tank. The filter circuit further includes a resistor in parallel with the L-C tank. The filter circuit is tunable/adjustable/programmable. The filter circuit further includes a capacitor selectively arranged in parallel with the L-C tank. The filter circuit is coupled to an input of the LNA via a series resistor. The filter circuit is coupled between the input and an output of the LNA via one or more switches. The LNA includes a first stage with a common-source transistor and a common-gate transistor. The LNA further includes a wideband feedback circuit coupled between the input and output of the first stage. The LNA includes a source-follower circuit. The source follower circuit is configurable as a second stage, or a feedback circuit, coupled to the filter circuit.

IPC Classes  ?

  • H03F 1/26 - Modifications of amplifiers to reduce influence of noise generated by amplifying elements
  • H03F 3/195 - High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
  • H03F 3/72 - Gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal

81.

SWITCHING MODULE

      
Application Number 18215273
Status Pending
Filing Date 2023-06-28
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Hattori, Kazuo

Abstract

In a switching module, a determiner of a controller performs a first determination, in which a commander controls relays of first bidirectional switches to an opened state and controls relays of second bidirectional switches to a closed state by outputting an opening command signal to the relays of the first bidirectional switches and outputs a closing command signal to the relays of the second bidirectional switches, and the determiner determines that at least one of the relays of the first bidirectional switches controlled to the opened state has a short-circuit fault in a case where a difference voltage between a voltage measured by a voltmeter connected to the relay of one of the first bidirectional switches controlled to the opened state and a voltage measured by a voltmeter is within a preset voltage range.

IPC Classes  ?

  • H02M 1/32 - Means for protecting converters other than by automatic disconnection
  • G01R 31/52 - Testing for short-circuits, leakage current or ground faults
  • H02H 1/00 - EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS - Details of emergency protective circuit arrangements
  • H02H 7/12 - Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from norm for rectifiers for static converters or rectifiers
  • H02M 5/293 - Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only

82.

VIRUS-INACTIVATING LIQUID AGENT AND VIRUS-INACTIVATING ARTICLE

      
Application Number 18337547
Status Pending
Filing Date 2023-06-20
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ogawa, Yuusuke
  • Torita, Takeshi
  • Okamura, Ichitaro
  • Kolbe, Gerald Lee

Abstract

A virus-inactivating liquid agent that includes: a liquid medium; and particles of a layered material including one or plural layers, wherein the one or plural layers include a layer body represented by: MmXn, wherein M is at least one metal of Group 3, 4, 5, 6, or 7; X is a carbon atom, a nitrogen atom, or a combination thereof; n is 1 to 4; m is more than n and 5 or less; and a modifier or terminal T exists on a surface of the layer body, and T is at least one of a hydroxyl group, a fluorine atom, a chlorine atom, or an oxygen atom.

IPC Classes  ?

  • A01N 59/16 - Heavy metals; Compounds thereof
  • A01N 25/34 - Shaped forms, e.g. sheets, not provided for in any other group of this main group
  • A01P 1/00 - Disinfectants; Antimicrobial compounds or mixtures thereof

83.

Power Converters with Integrated Bidirectional Startup

      
Application Number 18392695
Status Pending
Filing Date 2023-12-21
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Low, Aichen

Abstract

Circuits and methods encompassing a power converter that can be started and operated in a reversed unidirectional manner or in a bidirectional manner while providing sufficient voltage for an associated auxiliary circuit and start-up without added external circuitry for a voltage booster and/or a pre-charge circuit-that is, with zero external components or a reduced number of external components. Embodiments include an auxiliary circuit configured to selectively couple the greater of a first or a second voltage from a power converter to provide power to the auxiliary circuit. Embodiments include an auxiliary circuit configured to select a subcircuit coupled to the greater of a first or a second voltage from a power converter to provide an output for the auxiliary circuit. Embodiments include a charge pump including a gate driver configured to be selectively coupled to one of a first voltage node or second voltage node of the charge pump.

IPC Classes  ?

  • H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
  • H02M 1/36 - Means for starting or stopping converters

84.

RADIO FREQUENCY CIRCUIT AND COMMUNICATION DEVICE

      
Application Number 18411054
Status Pending
Filing Date 2024-01-12
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Nakajima, Reiji

Abstract

Reduction of reception sensitivity, which is caused by inter-modulation distortion occurring between a first transmit signal and a second transmit signal, is suppressed. A first filter has a passband including the transmit band of a first communication band. A second filter has a passband including the transmit band of a second communication band. A third filter has a passband including the receive band of the first communication band. The first communication band and the second communication band are communication bands available for simultaneous transmission. At least a part of the frequency range of the inter-modulation distortion, which occurs between the first transmit signal in the first communication band and the second transmit signal in the second communication band, overlaps at least a part of the receive band of the first communication band.

IPC Classes  ?

  • H04B 1/00 - TRANSMISSION - Details of transmission systems not characterised by the medium used for transmission
  • H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages

85.

VOLTAGE CONVERSION SYSTEM, POWER CONVERTER SYSTEM, AND VOLTAGE CONVERSION METHOD

      
Application Number 18603331
Status Pending
Filing Date 2024-03-13
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Tsuda, Kazunori

Abstract

A voltage conversion system includes a capacitive voltage converter including at least one flying capacitor and switches, a controller configured or programmed to perform switching operations of the switches, and a balance circuit to perform charge-and-discharge control of at least one flying capacitor such that the charge voltage of at least one flying capacitor matches a target charge voltage corresponding to an input voltage or an output voltage. The controller is configured or programmed to perform the switching operations of the switches when the charge voltage matches the target charge voltage.

IPC Classes  ?

  • H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
  • H02M 1/00 - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF - Details of apparatus for conversion
  • H02M 1/32 - Means for protecting converters other than by automatic disconnection

86.

ACOUSTIC WAVE FILTER

      
Application Number 18603650
Status Pending
Filing Date 2024-03-13
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Oshima, Naoki

Abstract

An acoustic wave filter includes an acoustic wave resonant circuit in or on at least one of a series arm or a parallel arm. The acoustic wave resonant circuit includes divided resonant devices connected to one another in series. A first divided resonant device among the divided resonant devices includes one first resonator. A second divided resonant device among the divided resonant devices includes two parallel divided resonators connected to each other in parallel. Each of the first resonator and the parallel divided resonators includes an IDT electrode including electrode fingers. An electrode finger pitch of the electrode fingers is different between at least one of the parallel divided resonators and the first resonator.

IPC Classes  ?

  • H03H 9/64 - Filters using surface acoustic waves
  • H04B 1/00 - TRANSMISSION - Details of transmission systems not characterised by the medium used for transmission

87.

POWER DIVIDER

      
Application Number 18605938
Status Pending
Filing Date 2024-03-15
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Ogata, Makoto

Abstract

A power divider includes a common terminal, a ground terminal, first and second terminals, a first circuit connected to a common terminal, and a second circuit to divide a signal from the first circuit and transfer divided signals to the first and second terminals. The first circuit includes inductors connected in parallel between the common terminal and a branching point, and capacitors each connected between a corresponding end of the inductors and a ground terminal. The second circuit includes one inductor connected between the branching point and the first terminal, another inductor connected between the branching circuit and the second terminal, one capacitor connected between the first terminal and the ground terminal, another capacitor connected between the second terminal and the ground terminal, and a resistor connected between the first and second terminals.

IPC Classes  ?

  • H01P 5/16 - Conjugate devices, i.e. devices having at least one port decoupled from one other port
  • H01F 27/28 - Coils; Windings; Conductive connections
  • H01F 27/29 - Terminals; Tapping arrangements
  • H01F 27/40 - Structural association with built-in electric component, e.g. fuse

88.

ACOUSTIC WAVE FILTER DEVICE AND MULTIPLEXER

      
Application Number 18607633
Status Pending
Filing Date 2024-03-18
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Uesaka, Kenichi

Abstract

An acoustic wave filter device includes series arm resonators and parallel arm resonators. A parallel arm resonator that has the highest resonant frequency has a reflector wavelength that is the same or substantially the same as an IDT wavelength and has an IDT-reflector gap that is about 0.5 times the reflector wavelength. The remaining parallel arm resonators each have a reflector wavelength longer than the IDT wavelength and have an IDT-reflector gap shorter than about 0.5 times the reflector wavelength.

IPC Classes  ?

  • H03H 9/145 - Driving means, e.g. electrodes, coils for networks using surface acoustic waves
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/64 - Filters using surface acoustic waves

89.

VIBRATION DEVICE

      
Application Number 18607872
Status Pending
Filing Date 2024-03-18
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Namatsu, Tatsuya
  • Hashimoto, Junichi
  • Mouri, Takao

Abstract

A vibration device including: a fixing member; a vibration member elastically coupled to the fixing member so as to vibrate in a left-right direction with respect to the fixing member; a film member having an upper main surface and a lower main surface arranged in an up-down direction and having a shape extending in the left-right direction, the film member constructed to expand and contract in the left-right direction when voltage is applied thereto, a left end portion of the film member being supported by the vibration member, and a right end portion of the film member being supported by the fixing member; a support member on the upper main surface or the lower main surface of the film member, wherein a boundary between the support member and the film member when viewed in the up-down direction includes an intersection portion intersecting a straight line extending in a front-back direction.

IPC Classes  ?

  • B06B 1/02 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy

90.

ELECTRONIC COMPONENT AND FILM FORMING METHOD

      
Application Number 18608018
Status Pending
Filing Date 2024-03-18
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ooshima, Tomoya
  • Hoshino, Yuuta

Abstract

An electronic component that includes: a base body having an outer surface, and the outer surface having a recess that is a site recessed with respect to a periphery of the outer surface; and a glass film that covers at least a portion of the outer surface of the base body having the recess, wherein a part of the glass film that covers the recess is recessed with respect to the periphery of the outer surface of the glass film, and a ratio of a minimum value of a thickness of the glass film covering the recess to a maximum value of the thickness is 0.05 to 0.8.

IPC Classes  ?

  • H01C 1/034 - Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
  • H01C 17/02 - Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing

91.

MULTILAYER CERAMIC CAPACITOR

      
Application Number 18608994
Status Pending
Filing Date 2024-03-19
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ohara, Takashi
  • Onishi, Hideyasu

Abstract

A multilayer ceramic capacitor includes a multilayer body including dielectric layers made of ceramic and stacked together, and inner electrodes arranged along interfaces between the dielectric layers with each inner electrode extending along a respective interface. The inner electrodes include at least one of CuTiO3, CoTiO3, or CrTiO3, and a conductive metal that is preferably copper.

IPC Classes  ?

  • H01G 4/008 - Selection of materials
  • H01G 4/012 - Form of non-self-supporting electrodes
  • H01G 4/12 - Ceramic dielectrics
  • H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
  • H01G 4/30 - Stacked capacitors

92.

MULTILAYER CERAMIC CAPACITOR

      
Application Number 18608996
Status Pending
Filing Date 2024-03-19
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Hashimoto, Hideyuki
  • Sasabayashi, Takehisa

Abstract

A multilayer ceramic capacitor includes a body including dielectric ceramic layers and inner electrode layers. The dielectric ceramic layers include crystal grains including a perovskite oxide including at least one A-site element and at least one B-site element. When a cross-section of the dielectric ceramic layers is observed using a scanning transmission electron microscope, the dielectric ceramic layers include grains, on which a plane of a perovskite structure is observed, as crystal grains. In the cross-section, a percentage by number of the grains in the crystal grains is about 4% or more.

IPC Classes  ?

  • H01G 4/12 - Ceramic dielectrics
  • H01G 4/012 - Form of non-self-supporting electrodes
  • H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
  • H01G 4/30 - Stacked capacitors

93.

MULTILAYER CERAMIC CAPACITOR

      
Application Number 18608997
Status Pending
Filing Date 2024-03-19
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ohara, Takashi
  • Onishi, Hideyasu

Abstract

A multilayer ceramic capacitor includes a multilayer body including dielectric layers made of ceramic and stacked together, and inner electrodes arranged along multiple interfaces between the dielectric layers, with each inner electrode extending along a respective interface. The inner electrodes include a silver/palladium alloy as a conductive material and also include at least one of (Ag0.7, Pd0.3)TiO3, NaTiO3, and EuTiO3.

IPC Classes  ?

  • H01G 4/008 - Selection of materials
  • H01G 4/12 - Ceramic dielectrics
  • H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
  • H01G 4/30 - Stacked capacitors

94.

MULTILAYER CERAMIC CAPACITOR

      
Application Number 18608999
Status Pending
Filing Date 2024-03-19
First Publication Date 2024-07-04
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Hashimoto, Hideyuki
  • Sasabayashi, Takehisa

Abstract

A multilayer ceramic capacitor includes dielectric ceramic layers and inner electrode layers. The dielectric ceramic layers include crystal grains including a perovskite oxide including at least one A-site element and at least one B-site element. When a cross-section of the dielectric ceramic layers is observed using a scanning transmission electron microscope, the dielectric ceramic layers include grains, on which a plane of a perovskite structure is observed, as crystal grains. The grains, when subjected to compositional analysis by energy dispersive x-ray spectroscopy, have an atom-distributed region in which a concentration of the A-site element or B-site element (c) subtracted from a maximum concentration of the element (cmax) (Δc=cmax−c) is about 2 atm % or less, at one or more atomic sites in the grains, and an area of the atom-distributed region (SΔc≤2%) is about 0.050 nm2 or less.

IPC Classes  ?

95.

CAPACITOR

      
Application Number 18606126
Status Pending
Filing Date 2024-03-15
First Publication Date 2024-07-04
Owner
  • Murata Manufacturing Co., Ltd. (Japan)
  • SHIZUKI ELECTRIC CO., INC. (Japan)
Inventor
  • Inakura, Tomoki
  • Hiragami, Yoshiyuki

Abstract

A capacitor that includes: a capacitor element; an external electrode on an end face of the capacitor element; and a lead terminal bonded to the external electrode, wherein the external electrode has a porosity of 8% to 20%. The external electrode may be a metallikon electrode. The external electrode may also contain an alloy of zinc and aluminum.

IPC Classes  ?

96.

3-D Integrated Circuit Antenna Arrays

      
Application Number 18088444
Status Pending
Filing Date 2022-12-23
First Publication Date 2024-06-27
Owner MURATA MANUFACTURING CO., LTD. (Japan)
Inventor
  • Bacon, Peter
  • Goktepeli, Sinan
  • Kouassi, Kouassi Sebastien

Abstract

Antenna structures that can be located in close proximity with respect to an associated RFFE IC regardless of antenna element size. An antenna structure, including a grid or planar antenna or an array of antenna elements, is co-fabricated as part of or with one or more associated RFFE ICs using 3-D stacking of IC dies, either directly or as part of an embedded die packaging technology. Some embodiments include a combinable co-fabricated antenna element, including at least one internally co-fabricated RF antenna element configured to be electrically connectable to a corresponding RF antenna element in a second combinable co-fabricated antenna element by means of 3-D integrated circuit stacking. Some embodiments include a plurality of combinable co-fabricated antenna elements coupled together by means of 3-D integrated circuit stacking such that the antenna elements form a grid antenna or comprise an array of antenna patches.

IPC Classes  ?

  • H01Q 9/04 - Resonant antennas
  • H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles
  • H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart

97.

RADIO FREQUENCY CIRCUIT AND COMMUNICATION DEVICE

      
Application Number 18420811
Status Pending
Filing Date 2024-01-24
First Publication Date 2024-06-27
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Hanaoka, Kunitoshi

Abstract

A radio frequency circuit includes an antenna terminal, a transmission filter, multiple reception filters, a first switch, and a second switch. In the first switch, a first terminal is connectable to a second terminal or a third terminal. In the second switch, a fourth terminal is connectable to a fifth terminal. The multiple reception filters are connected to the second terminal or the third terminal of the first switch. The first terminal of the first switch is connected to the antenna terminal. The fourth terminal of the second switch is connected to the second terminal of the first switch. The fifth terminal of the second switch is connected to the transmission filter.

IPC Classes  ?

  • H04B 1/00 - TRANSMISSION - Details of transmission systems not characterised by the medium used for transmission
  • H04B 1/04 - Circuits

98.

FERRITE SINTERED BODY AND MULTILAYER COIL COMPONENT

      
Application Number 18426915
Status Pending
Filing Date 2024-01-30
First Publication Date 2024-06-27
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor Sugii, Kazutoshi

Abstract

A ferrite sintered body contains a main component and a sub component. The main component contains from 4 mol % to 13 mol % of Fe in terms of Fe2O3, from 47 mol % to 58 mol % of Zn in terms of ZnO, from 1 mol % to 4 mol % of Cu in terms of CuO, from 2 mol % to 8 mol % of Ni in terms of NiO, and from 28 mol % to 36 mol % of Si in terms of SiO2. The sub component contains, per 100 parts by weight of the main component, from 0.8 parts by weight to 3 parts by weight of Bi in terms of Bi2O3 and from 0.005 parts by weight to 0.1 parts by weight of Zr in terms of ZrO2.

IPC Classes  ?

  • H01F 1/03 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
  • C04B 35/26 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
  • H01F 5/06 - Insulation of windings

99.

MULTILAYER CERAMIC CAPACITOR

      
Application Number 18429623
Status Pending
Filing Date 2024-02-01
First Publication Date 2024-06-27
Owner Murata Manufacturing Co., Ltd. (Japan)
Inventor
  • Ueno, Kenji
  • Isota, Shinya
  • Oshima, Yuta

Abstract

A multilayer ceramic capacitor includes a multilayer body including an inner layer portion in which multiple inner electrode layers and multiple inner dielectric layers are stacked alternately and two outer layer portions located at the surfaces on two sides of the inner layer portion in the stacking direction, with one outer layer portion on each side, and two outer electrodes located at end surfaces of the multilayer body, which are the surfaces on two sides in the length direction, with one outer electrode at each end surface. The inner electrode layers include outermost inner electrode layers, which are the closest to each of the outer layer portions, and an inside inner electrode layer, which is an inner electrode layer other than the outermost inner electrode layers.

IPC Classes  ?

  • H01G 4/008 - Selection of materials
  • H01G 4/012 - Form of non-self-supporting electrodes
  • H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
  • H01G 4/30 - Stacked capacitors

100.

BATTERY PACK, ELECTRIC TOOL, AND ELECTRIC VEHICLE

      
Application Number 18442881
Status Pending
Filing Date 2024-02-15
First Publication Date 2024-06-27
Owner MURATA MANUFACTURING CO., LTD. (Japan)
Inventor Oshida, Takumi

Abstract

Provided is a battery pack with improved heat dissipation characteristics and the like. A battery pack includes a spacer member, the spacer member is composed of a first insulating member and a second insulating member, the first insulating member and the second insulating member are in contact with a predetermined inner surface of an exterior case, the first insulating member is disposed to surround the second insulating member, and the first insulating member and the second insulating member satisfy the following relationships (1) to (3). Provided is a battery pack with improved heat dissipation characteristics and the like. A battery pack includes a spacer member, the spacer member is composed of a first insulating member and a second insulating member, the first insulating member and the second insulating member are in contact with a predetermined inner surface of an exterior case, the first insulating member is disposed to surround the second insulating member, and the first insulating member and the second insulating member satisfy the following relationships (1) to (3). Specific ⁢ gravity : first ⁢ insulating ⁢ member < second ⁢ insulating ⁢ member ( 1 ) Young ’ ⁢ s ⁢ modulus : first ⁢ insulating ⁢ member > second ⁢ insulating ⁢ member ( 2 ) Thermal ⁢ conductivity : first ⁢ insulating ⁢ member < second ⁢ insulating ⁢ member ( 3 )

IPC Classes  ?

  • H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
  • H01M 10/613 - Cooling or keeping cold
  • H01M 10/6235 - Power tools
  • H01M 10/625 - Vehicles
  • H01M 10/643 - Cylindrical cells
  • H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
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