A method of fabricating a die for a microelectromechanical systems (MEMS) microphone includes the steps of forming a diaphragm, etching a plurality of slots through the diaphragm to define a plurality of springs, releasing the diaphragm and the plurality of springs, wherein the plurality of springs relieves intrinsic stress of the diaphragm, and sealing the plurality of slots with sealing material, thereby disabling the springs.
An ear-worn hearing device comprises a housing comprising an end portion configured for at least partial insertion into a user's ear, the housing comprises an opening at the end portion. A removable acoustic transducer assembly is disposed in the opening at the end portion. The transducer assembly is configured for removal from the end portion of the ear-worn hearing device housing. The transducer assembly comprises an acoustic transducer, a support structure mechanically coupled to the acoustic transducer, the open portion of the acoustic transducer acoustically coupled with an opening of the support structure; and a releasable retention structure configured to removably retain the transducer assembly in a cavity of the ear-worn hearing device housing. In some implementations a vibration isolation structure isolates the acoustic transceiver from vibration. In certain implementations, the transducer assembly includes an extraction feature that allows extraction from the end portion of the ear-worn device.
H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
An in-ear hearing device including an adjustable cable assembly is disclosed. The cable assembly includes a shape-configurable portion between an end portion connected an in-ear unit and a flexible end portion adjustably connected to a behind-the-ear (BTE) unit. The flexible end portion is retractably insertable into a housing of the BTE unit to adjust a length of the cable assembly between the in-ear unit and BTE unit. A cable-retention member of the BTE unit is engageable with the flexible end portion of the cable assembly to fix the cable assembly relative to the BTE unit.
A balanced armature receiver including a motor with a yoke for retaining magnets and fastening to an armature are disclosed. The yoke includes a close-ended wall structure defining a passage through which an armature is extendable. The close-ended wall structure includes a plurality of wall portions interconnecting a plurality of folded corner portions, wherein a thickness of the plurality of wall portions less than a thickness of the plurality of folded corner portions.
Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a receiver housing with a first internal volume and a second internal volume, a first diaphragm separating the first internal volume into a first front volume and a first back volume such that the first front volume has a first sound outlet port, a second diaphragm separating the second internal volume into a second front volume and a second back volume such that the second front volume has a second sound outlet port, a motor disposed at least partially inside the housing such that the motor including an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to one of the first diaphragm or the second diaphragm.
A balanced armature receiver can include a motor disposed in a case. The motor can include an armature having a first portion fixed to and extending from a yoke and a second portion extending through a coil tunnel. The second portion can have a free end-portion movably disposed in a magnet gap. The balanced armature receiver can include a damping compound-locating structure disposed on one or both of the armature and another portion of the receiver proximate the armature. The balanced armature receiver can include damping compound contacting the damping compound-locating structure and located between the armature and another portion of the receiver.
A loudspeaker for hearing devices including a diaphragm arranged in a housing to form a back volume and a front volume acoustically coupled to a sound port is disclosed. A surface of a first magnet in the front volume faces an opposing surface of a second magnet in the back volume, and the opposing surfaces of the magnets are separated by a gap and have the same magnetic polarity. An electrical coil assembly coupled to the diaphragm has a radial difference dimension to thickness dimension ratio greater than 1, wherein the diaphragm and the electrical coil assembly are movable in the gap between the magnets in response to an electrical audio signal applied to the electrical coil assembly.
An anchor assembly for a microelectromechanical systems (MEMS) vibration sensor suspension comprises an anchor body and at least one spring integrally extending from the anchor body. Each spring comprises a first section integrally extending at a first end away from the anchor body to a second end, and first lateral portions of second and third sections extending in opposite lateral directions from the second end. Each of the second and third sections includes a first leg that extends at a first end from the first lateral portion toward the anchor body, a second lateral portion that extends from a second end of the first leg away from the first section, and a second leg that extends from the second lateral portion at a first end away from the anchor body, wherein second ends of the second legs extend farther from the anchor body than the first lateral portions.
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01P 1/00 - MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION OR SHOCK; INDICATING PRESENCE OR ABSENCE OF MOVEMENT; INDICATING DIRECTION OF MOVEMENT - Details of instruments
A balanced armature receiver including a motor with a yoke for retaining magnets and fastening to an armature are disclosed. The yoke includes a close-ended wall structure formed of a soft magnetic material having multiple folded corners defining an armature passage. A first magnet retaining wall portion of the yoke is arranged in parallel with, and opposite, a second magnet retaining wall portion, wherein at least a portion of the first magnet retaining wall portion has a reduced thickness relative to other wall portions of the close-ended wall structure. The armature is connected to the reduced thickness portion of the first magnet retaining wall portion, thereby reducing an overall z-axis dimension of the motor.
A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm, a geometric central region surrounding the geometric center of the diaphragm assembly, and a plurality of pillars connecting the first and second diaphragms, each of the plurality of pillars having a cross-sectional shape having a maximum radial dimension, A, and a maximum circumferential dimension, B, wherein at least a first subset of the plurality of pillars is disposed within the geometric central region and wherein A is greater than B for the at least first sub set.
Two coils are wrapped in one of numerous different implementations. In one implementation, the two coils are wrapped about a portion of a bobbin that has at least three flanges. The first coil is disposed about a first portion of the bobbin between the first flange and the second flange, and a second coil is disposed about a second portion of the bobbin between the second flange and the third flange.
A method of forming a micro electro mechanical system (MEMS) assembly comprises providing a substrate having an electrically conductive layer disposed thereon. The method also comprises depositing, on the substrate over the electrically conductive layer, a bonding material having an elastic modulus of less than 500 MPa so as to form a bond layer. The bond layer is completely cured, and a MEMS die is attached to the completely cured bond layer.
A microelectromechanical systems (MEMS) die comprises a first diaphragm having a first side and a second side, and a second diaphragm having a first side facing the first side of the first diaphragm. A first plurality of interconnect strips is disposed along at least the first side of the first diaphragm, a second plurality of interconnect strips is disposed along the first side of the first diaphragm, and a third plurality of interconnect strips is disposed along the first side of the second diaphragm. First, second, and third runner strips are disposed along the second side of the first diaphragm transverse to the first, second, and third plurality of interconnect strips, respectively. Each of the first, second, and third runner strips is electrically connected to at least a subset of the first, second, and third plurality of interconnect strips, respectively, via electrical connections disposed through the first diaphragm.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
A microelectromechanical systems (MEMS) device comprises a MEMS die that comprises first and second diaphragms, a first plurality of electrodes each disposed on the first diaphragm, and a second plurality of electrodes each disposed on the second diaphragm. A fixed dielectric element is disposed between the first and second diaphragms and includes a plurality of apertures. The MEMS die further comprises a third plurality of electrodes, wherein each of the third plurality comprises a first conductive layer disposed on the first diaphragm proximate to at least one of the first plurality and a second conductive layer disposed on the second diaphragm proximate to at least one of the second plurality, and a conductive pin that extends through an aperture of the plurality of apertures and electrically connects the first conductive layer to the second conductive layer.
A microphone assembly includes a housing including a sound port and an external-device interface having a plurality of electrical contacts. An acoustic transducer, such as a MEMS microphone, is disposed in the housing and is in acoustic communication with the sound port. An electrical circuit is disposed in the housing that is electrically coupled to the acoustic transducer and to electrical contacts on the external-device interface. A magnetic transducer including an electrical coil disposed about a core, such as a telecoil or charging coil configuration, is fastened to the housing. The electrical coil having leads, at least one of the leads electrically terminated at a coil contact of the housing.
In accordance with one aspect, a device is provided having a transducer comprising a conductor, a diaphragm configured to move relative to the conductor, and a reference volume in communication with the external environment. The diaphragm separates the reference volume and the external environment. The device further includes a controller operably coupled to the transducer and configured to determine an air pressure of an external environment based at least in part on movement of the diaphragm.
G01L 19/00 - MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
A microphone assembly can include a form-factor adapter housing including an interface opening and an external acoustic port, and an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port and electrical interface contacts, a MEMS motor disposed in the internal housing, and an integrated circuit disposed in the internal housing, the integrated circuit electrically coupled to the MEMS motor and to the electrical interface contacts. The assembly can include an adapter interface located at the interface opening and comprising external host device interface contacts electrically coupled to the electrical interface contacts, the external host device interface contacts exposed to an exterior of the microphone assembly. The internal acoustic port can be acoustically coupled to the external acoustic port.
An acoustic sensor assembly includes a housing having an external-device interface and a sound port to an interior of the housing. An electro-acoustic transducer and an electrical circuit are disposed within the housing. The electro-acoustic transducer separates the interior into a front volume and a back volume, where the sound port acoustically couples the front volume to an exterior of the housing. The back volume includes a first portion and a second portion. The electrical circuit is electrically coupled to the electro-acoustic transducer and to the external-device interface. One or more apertures acoustically couple the first and second portions of the back volume and are structured to shape a frequency response of the acoustic sensor assembly.
H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
A diaphragm for a balanced armature receiver and combinations thereof. The diaphragm includes a paddle having an area of concentrated mass located at or near a central portion of the paddle, the area of concentrated mass having an area density greater than an area density of other portions of the paddle, wherein the area of concentrated mass shifts a bending-mode frequency of the paddle to a lower frequency compared to a bending-mode frequency of the paddle in the absence of the area of concentrated mass.
A balanced armature receiver includes a gas permeable barrier located on a portion of the receiver defining a back volume to provide barometric relief. The barrier can be located in a wall portion or diaphragm of the receiver to vent the back volume to an exterior of the receiver directly, via a front volume, or via a nozzle. The gas permeable barrier is impermeable to liquid infiltration and can be configured to influence the low frequency response of the receiver.
H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
Various embodiments of balanced armature receivers are disclosed, where the receiver includes a yoke which retains permanent magnets, a coil assembly having a coil tunnel, and an armature coupled to the yoke, with a movable portion extending through the coil tunnel and an end portion that is free to deflect between the magnets when an excitation signal is applied to the coil assembly. There are a stationary protrusion which extends from the stationary portion of the receiver toward the movable portion of the armature, and a movable protrusion which extends from the movable portion of the armature toward the stationary portion of the receiver. The stationary and movable protrusions are offset laterally.
A vibration sensor/accelerometer includes, in various implementations, a MEMS die that includes a plate having an aperture, an anchor disposed within the aperture, a plurality of arms (e.g., rigid arms) extending from the anchor, and a plurality of resilient members (e.g., looped or folded springs with a carefully designed spring stiffness), each resilient member connecting the plate to an arm of the plurality of arms. The plate may be made from a solid layer in which the resilient members are etched from the same layer. The MEMS die may also include top and bottom wafers, and travel stoppers extending from the top and bottom wafers as well as through the plate.
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
G01C 19/5755 - Structural details or topology the devices having a single sensing mass
G01H 11/06 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
A sound-producing balanced armature receiver, as disclosed, includes a receiver housing with a first internal volume, a second internal volume, and a sound outlet. The receiver includes a first diaphragm separating the first internal volume into a first front volume and a first back volume and a second diaphragm separating the second internal volume into a second front volume and a second back volume. The receiver also includes a motor inside the first back volume of the housing such that the motor includes an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to the second diaphragm while providing acoustic separation between the first internal volume and the second internal volume, and a back-volume increasing structure attached externally to the housing and acoustically coupled with the second back volume to provide additional volume to the second back volume.
A MEMS device can include a solid dielectric including a plurality of apertures, the solid dielectric having a first side and a second side. The MEMS device can include a first plurality of electrodes extending completely through a first subset of the plurality of apertures, a second plurality of electrodes extending partially through a second subset of the plurality of apertures, a third plurality of electrodes extending partially into a third subset of the plurality of apertures. The MEMS device can include a first diaphragm coupled to the first plurality and to the third plurality of electrodes, the first diaphragm facing the first side of the solid dielectric. The MEMS device can include a second diaphragm coupled to the first plurality and to the second plurality of electrodes the second diaphragm facing the second side of the solid dielectric.
An acoustic receiver includes a first receiver subassembly having bottom housing plate with at least a portion of a motor fastened thereto, and a second receiver subassembly having a closed-ended housing wall with at least one open end that is fastened to the bottom housing plate. A method of making and assembling the components is also described.
A balanced armature (BA) receiver and specifically a nickel-iron (Ni—Fe) alloy armature having improved robustness and performance receivers, as well as motors and receivers including such armatures are disclosed. The Ni—Fe armature has a nickel content of 45% or less by weight, 5% or less additive and impurities by weight, and the balance Fe. The armature can be configured as a U-reed, an E-reed or in some other configuration.
H04R 1/34 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means
A MEMS diaphragm assembly comprises a first diaphragm, a second diaphragm, and a stationary electrode assembly spaced between the first and second diaphragms and including a plurality of apertures disposed therethrough. Each of a plurality of pillars is disposed through one of the plurality of apertures and connects the first and second diaphragms. At least one of the first and second diaphragms is connected to the stationary electrode assembly at a geometric center of the assembly.
A PM signal generator can generate a variable PM signal based on a position of a movable element of a MEMS motor. A bias voltage generator can provide a bias voltage to the MEMS motor. The bias voltage generator can include a reference signal generator that can generate a reference signal that varies based on variation of pulses of the PM signal. The bias voltage can be based on the reference signal.
H02N 2/00 - Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
H02M 3/06 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider
29.
MICROPHONE ASSEMBLY WITH IMPROVED STARTUP SETTLING
The disclosure relates to a transducer assembly like a microphone including a bias circuit having a charge pump and a filter circuit coupled to a transducer. The filter circuit includes a voltage-controlled resistor located between an output of the charge pump and the transducer, and a capacitor coupled to the voltage-controlled resistor opposite the charge pump, wherein the bias circuit is configured with a larger bandwidth for faster settling during transient operation than during steady-state operation.
H04R 3/04 - Circuits for transducers for correcting frequency response
H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
H02M 1/44 - Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
The present disclosure relates to a transducer assembly including a transducer having a movable member, and a servo-loop controller configured to compensate for effects of a disturbance on the transducer assembly by adjusting a bias voltage applied to the transducer. A servo-loop controller having a smaller bandwidth for out-of-band disturbances than for in-band disturbances and configured to control the bias voltage based on a feedback signal generated by a sensor that detects an effect of the disturbance on the transducer assembly. The transducer assembly can be implemented as a microphone or a speaker among other sensors and actuators.
H04R 3/02 - Circuits for transducers for preventing acoustic reaction
H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
Various implementations of MEMS sensors include an IC die having a cavity that forms at least part of the back volume of the sensor. This arrangement helps to address the problems of lateral velocity gradients and viscosity-induced losses. In some of the embodiments, the cavity is specially configured (e.g., with pillars, channels, and/or rings) to reduce the lateral movement of air. Other solutions (used in conjunction with such cavities) include ways to make a diaphragm move more like a piston (e.g., by adding a protrusion that gives it more “up-down” motion and less lateral motion) or to use a piston (e.g., a rigid piece of silicon such as an integrated circuit die) in place of a diaphragm
Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a receiver housing with a first internal volume and a second internal volume, a first diaphragm separating the first internal volume into a first front volume and a first back volume such that the first front volume has a first sound outlet port, a second diaphragm separating the second internal volume into a second front volume and a second back volume such that the second front volume has a second sound outlet port, a motor disposed at least partially inside the housing such that the motor including an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to one of the first diaphragm or the second diaphragm.
A microelectromechanical systems (MEMS) die includes a first diaphragm and a second diaphragm, wherein the first diaphragm and the second diaphragm bound a sealed chamber. A stationary electrode is disposed within the sealed chamber between the first diaphragm and the second diaphragm. A tunnel passes through the first diaphragm and the second diaphragm without passing through the stationary electrode, wherein the tunnel is sealed off from the chamber. The MEMS die further includes a substrate having an opening formed therethrough, wherein the tunnel provides fluid communication from the opening, through the second diaphragm, and through the first diaphragm.
The present disclosure relates to dual-diaphragm moving-coil audio transducers for hearing devices. The transducer includes a magnetic circuit including an inner portion located between first and second coils coupled to corresponding diaphragms supported by a housing. An outer portion of the magnetic circuit is adjacent outer portions of the first and second coils. The transducer emits sound when the first diaphragm moves in a first direction and the second diaphragm moves in a second direction, opposite the first direction, in response to an electrical audio signal applied to the first and second coils.
A microphone assembly can include a microelectromechanical systems (MEMS) transducer comprising a transducer substrate, a diaphragm oriented substantially parallel to the transducer substrate and spaced apart from the transducer substrate to form a gap, and a counter electrode coupled to the transducer substrate, the counter electrode positioned between the diaphragm and the transducer substrate. The MEMS transducer can generate a signal representative of a change in capacitance between the counter electrode and the diaphragm. A back volume of the MEMS transducer can be an enclosed volume positioned between the transducer substrate and the diaphragm. The microphone assembly can include an integrated circuit that receives the signal, wherein every point within the back volume is less than a thermal boundary layer thickness from a nearest solid surface at an upper limit of an audio frequency band that the integrated circuit is monitoring.
A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm. A plurality of pillars connects the first and second diaphragms, wherein the plurality of pillars has a higher distribution density at a geometric center of the MEMS diaphragm assembly than at an outer periphery thereof.
A microelectromechanical system (MEMS) transducer includes a transducer substrate, a diaphragm, and a stiffening member. A first side of the diaphragm is coupled to the transducer substrate. A second side of the diaphragm is coupled to the stiffening member. The stiffening member includes a plurality of fingers extending inwards from a perimeter of an aperture defined by the transducer substrate.
A microphone device, an interface circuit and method are provided for managing a potential difference in sensitivity to a detected environmental stimulus associated with a sensor arrangement, where multiple electrical signals forming a differential signal can be produced, and the multiple electrical signals can be better balanced. Such an interface circuit, which can be used within a microphone device includes a bias voltage generator having one or more bias output voltage terminals, where a respective one of one or more DC bias voltages is produced at each of the bias output voltage terminals, for being coupled to a pair of transduction elements of a sensor. The interface circuit further includes an amplifier circuit having a first input terminal coupled to a first one of the pair of output terminals of the sensor and having a second input terminal coupled to a second one of the pair of output terminals of the sensor, the amplifier circuit producing a differential output signal. The interface circuit still further includes a compensation circuit coupled to the amplifier circuit for producing a balance signal based on an output signal being produced by the amplifier circuit, wherein the balance signal compensates for any difference in amplitude in the first and second electrical signals that are received by the amplifier circuit from the sensor.
The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes an output driver circuit, a low drop out (LDO) regulator circuit, and an over-voltage protection circuit with improved capacity and response time.
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
H02M 3/156 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
The present disclosure relates generally to digital microphone and other sensor assemblies including a transduction element and a successive-approximation (SA) quantizer configured to reuse a digital code generated for a prior sample period for a current sample period when a reuse condition is satisfied. The SA quantizer does not regenerate a new digital code for the current sample period when the digital code generated for the prior sample period is used thereby reducing power consumption.
A microelectromechanical systems (MEMS) device comprises a diaphragm assembly and a force feedback system. The diaphragm assembly includes a first diaphragm and a second diaphragm facing the first diaphragm, with a low pressure region being defined therebetween. The diaphragm assembly further includes a first plurality of electrodes, a second plurality of electrodes, and a third plurality of electrodes. A solid dielectric is spaced between the first and second diaphragms and includes a plurality of apertures. Each electrode of the first, second, and third pluralities of electrodes is disposed at least partially within an aperture of the plurality of apertures. The force feedback system receives output from the diaphragm assembly and produces a feedback voltage that is applied to the diaphragm assembly to produce an electrostatic force on the diaphragm assembly that counters a low-frequency pressure across the diaphragm assembly.
A digital microphone or other sensor assembly includes a transducer and an electrical circuit including a slew-rate controlled output buffer configured to reduce propagation delay and maintain output rise and fall time independent of PVT variation and load capacitance. In some embodiments, the portions of the output buffer are selectably disabled to reduce power consumption without adversely substantially increasing propagation delay.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
A microelectromechanical systems (MEMS) device includes a MEMS die and an electrical circuit electrically connected to the MEMS die. The electrical circuit includes a first capacitor that produces a first output signal based on a signal received from the MEMS die, and a second capacitor that produces a second output signal based on a signal received from the MEMS die. The electrical circuit is configured to determine a nominal capacitance of the MEMS die based on a ratio of the first output signal to the second output signal and a ratio of the capacitances of the first and second capacitors.
A MEMS die includes a substrate having an opening formed therein, and a diaphragm attached around a periphery thereof to the substrate and over the opening, wherein the diaphragm comprises first and second spaced apart layers. A backplate is disposed between the first and second spaced apart layers. One or more columnar supports are disposed through holes disposed through the backplate and connecting the first and second spaced apart layers. At least a partial vacuum exists between at least a portion of the first and second spaced apart layers. The first layer further comprises interior and exterior sub-layers at least proximate to each of the one or more columnar supports, wherein the interior sub-layers include one or more apertures disposed therethrough.
H04R 1/00 - LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS - Details of transducers
A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.
A microphone assembly including an acoustic transducer that generates an electrical signal responsive to acoustic activity, and an integrated circuit electrically coupled to the acoustic transducer and that receives the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity. The microphone assembly also includes a substrate comprising a first surface on which the integrated circuit is mounted, a guard ring mounted on the substrate and elevated relative to the first surface of the substrate, and a can mounted to the guard ring, wherein the can, the guard ring, and the substrate form a housing in which the transducer and integrated circuit are disposed.
The disclosure relates to microphone and other sensor assemblies having a transduction element and an integrated circuit. The integrated circuit includes a switched-capacitor delta-sigma analog-to-digital converter (ADC) including a first integrator stage having a switched-capacitor circuit and a first plurality of parallel amplifiers. A logic circuit coupled to the integrator circuit is configured to selectably disable a subset of enabled amplifiers of the first integrator stage during a first phase of operation and to re-enable the subset of disabled amplifiers during a second phase.
A MEMS die includes a substrate having an opening formed therein, a diaphragm having a first surface attached around a periphery thereof to the substrate and over the opening, and a backplate separated from a second surface of the diaphragm. The diaphragm includes at least one passage disposed between the first and second surfaces, and the at least one passage has a smaller cross-sectional area at the first surface than at the second surface.
A wearable audio device can include a microphone located to detect atmospheric sound including a user's voice. The device can include an acoustic vibration sensor located to detect sound including the user's voice conducted through the user's body. The device can include a body voice filter coupled to the acoustic vibration sensor. The device can include a filter parameter generator coupled to the acoustic vibration sensor and the body voice filter the filter parameter generator configured to generate parameters for the body voice filter based on a frequency characteristic of a signal obtained from the acoustic vibration sensor. The device can include a composite signal generator coupled to the body voice filter and the microphone and configured to generate a composite voice signal based on a low band signal obtained predominately from the body voice filter and based on a high band signal obtained predominately from the microphone.
3) in at least one direction and density selected to increase stiffness and reduce mass. In one implementation, at least the paddle includes a carbon fiber material. The resulting paddle has improved acoustic performance including improved frequency response and less resonance in the audio band, among other benefits.
The present disclosure relates to a balanced armature receiver (100) including a housing having a diaphragm comprising a movable paddle (116) disposed in the housing and separating the housing into a back volume (112) and a front volume (110) defined partly by space between a ceiling of the housing and the diaphragm, wherein the paddle is oriented non-parallel to the ceiling. A sound port (142) in the housing acoustically couples the front volume to an exterior of the housing, wherein the sound port is located on an end wall between the diaphragm and the ceiling. A motor disposed in the back volume includes a coil magnetically coupled to an armature having an end portion movably disposed between magnets retained by a yoke and coupled to the paddle.
The present disclosure relates generally to digital microphone and other sensor assemblies including a transducer, a delta-sigma analog-to-digital converter (ADC), a dynamic element matching (DELM) entity configured to compensate for nonlinearity resulting from variation among digital-to-analog conversion (DAC) elements of the ADC, and a control circuit configured to enable and disable the DELM based on a magnitude of a digital signal generated by the ADC.
The disclosure relates to a MEMS sensor and an assembly including the MEMS sensor and an electrical circuit disposed in an assembly housing. The sensor includes a suspended structure (148) having a top diaphragm (118), a central electrode (120) and a bottom diaphragm (122) connected by a pillar portion (134). A peripheral portion of the suspended structure is coupled to a support structure (114), forming a low pressure cavity (130). The MEMS sensor includes a top electrode (136) disposed between the top diaphragm and the central electrode and a bottom electrode (138) disposed between the bottom diaphragm and central electrode each coupled to the support structure, wherein in the event of a sound pressure condition, the suspended structures moves up or down together, while the top electrode and the bottom electrode remain substantially stationary.
Coil bobbins for balanced armature receivers are disclosed. The balanced armature receiver bobbin includes a coil support member, at least two flanges, and a shoulder. The coil support member has an armature passage extending between a first end and a second end thereof. The flanges extending radially from the coil support member such that the first flange extends from the coil support member proximate the first end and the second flange extends from the coil support member proximate the second end. The shoulder extends from the first flange, with the first flange located between the shoulder and the coil support member. The shoulder has a plurality of conductive coil pads disposed on a bottom portion thereof.
A balanced armature receiver including a diaphragm with an elastomer surround is disclosed. The surround is fastened to multiple surfaces of the diaphragm and can be a siloxane-based material. In one implementation, the diaphragm includes a paddle flexibly coupled to a frame and the surround covers a gap between the frame and the paddle.
The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes a variable gain signal processing circuit (203) that processes an electrical signal from the transducer and a gain control circuit (204) that compensates for transducer sensitivity drift caused by variation in an environmental condition of the transducer, and electrical circuits therefor.
The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes a transducer bias circuit that applies a bias to the transducer and a bias control circuit (204) that compensates for transducer sensitivity drift caused by variation in an environmental condition of the transducer, and electrical circuits therefor.
The present disclosure relates generally to digital microphone and other sensor assemblies including a transducer and a delta-sigma analog-to-digital converter (ADC) with digital-to-analog converter (DAC) element mismatch shaping and more particularly to sensor assemblies and electrical circuits therefor including a dynamic element matching (DELM) entity configured to select DAC elements based on data weighted averaging (DWA) and a randomized non-negative shift.
A MEMS device can include a first support layer, a second support layer, and a solid dielectric suspended between the first support layer and the second support layer. The solid dielectric can move relative to the first support layer and the second support layer and can include a plurality of apertures. The MEMS device can include a first plurality of electrodes coupled to the first support layer and the second support layer and extending through a first subset of the plurality of apertures. The MEMS device can include a second plurality of electrodes coupled to the first support layer and extending partially into a second subset of the plurality of apertures. The MEMS device can include a third plurality of electrodes coupled to the second support layer and extending partially into a third subset of the plurality of apertures.
A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate, the acoustic transducer configured to generate an electrical signal responsive to acoustic activity. An integrated circuit is disposed on the substrate and electrically coupled to the acoustic transducer, the integrated circuit configured to generate an output signal indicative of the acoustic activity based on the electrical signal from the acoustic transducer. An enclosure is coupled to the substrate and defines an internal volume between the enclosure and the substrate, the enclosure having an outer surface exposed to an outside environment of the microphone assembly, and an inner surface adjacent the internal volume. An insulating layer is disposed on the inner surface of the enclosure. The insulating layer comprises a fluoropolymer.
H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
A MEMS can include a substrate including a first side and a second side on an opposite side of the substrate from the first side. The MEMS device can include an aperture running through the substrate from the first side to the second side. The substrate can have an edge surrounding the aperture on the first side. The MEMS device can include a diaphragm located over the aperture on the first side. The MEMS device can include a support structure that extends at least partially across the aperture from the edge.
A microphone assembly includes an acoustic transducer configured to generate an analog signal in response to pressure changes sensed by the acoustic transducer. The analog signal includes frequency components below a threshold frequency. The microphone assembly also includes an integrated circuit electrically coupled to the acoustic transducer and configured to determine a characteristic of frequency components below the threshold frequency, determine whether the characteristic of the frequency components corresponds to a fall event, and generate an output signal in response to a determination that the characteristic of the frequency components corresponds to the fall event. The microphone assembly also includes a housing having an external device interface with electrical contacts. The acoustic transducer and the integrated circuit are disposed within the housing. The integrated circuit is electrically coupled to contacts of the external device interface.
H04R 1/00 - LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS - Details of transducers
The present disclosure relates to a sensor assembly (100) comprising: a base (102) having a host-device interface (104), a lid (108) mounted on the base (102) to form a housing (110), the lid (108) having an insulative structural core (112) between an inner metal skin (114) and an outer metal skin (116); and a transduction element (118) disposed in the housing (112). Advantageously, the lid (108) of the sensor assembly (100) can help to minimize and reduce undesirable thermo-acoustic effects produced by external environmental conditions that may result in acoustic artifacts.
A first electrode of a MEMS device can be oriented lengthwise along and parallel to an axis, and can have a first end and a second end. A second electrode can be oriented lengthwise along and parallel to the axis and can have a first end and a second end. A third electrode can be oriented lengthwise along and parallel to the axis and can have a first end and a second end. The first, second, and third electrodes can each be located at least partially within an aperture of a plurality of apertures of a solid dielectric that can surround the second electrode second end and the third electrode first end. The second electrode first end and the third electrode second end can be located outside of the solid dielectric.
The present disclosure relates to microphone devices. One microphone assembly includes a transducer and a housing. The microphone assembly includes an integrated circuit coupled to the transducer. The housing includes a port, a base, and a cover. The cover includes an inner wall and an outer wall. The inner wall and outer wall can be coupled to the base. The inner wall and the base are mechanically coupled and define an enclosed volume. The transducer is disposed in the enclosed volume.
A MEMS device can include a substrate having a first side and a second side, the substrate including an aperture extending from the first side through the substrate to the second side. The device can include a support structure coupled to the substrate the first side. The device can include a resilient structure coupled to the support structure. The device can include a rigid movable plate coupled to the support structure via the resilient structure and positioned over the aperture. The device can include a proof mass coupled to the movable plate, the proof mass extending into the aperture. The device can include an electrode located on an opposite side of the movable plate from the proof mass.
G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.
Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a receiver housing with a first internal volume and a second internal volume, a first diaphragm separating the first internal volume into a first front volume and a first back volume such that the first front volume has a first sound outlet port, a second diaphragm separating the second internal volume into a second front volume and a second back volume such that the second front volume has a second sound outlet port, a motor disposed at least partially inside the housing such that the motor including an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to one of the first diaphragm or the second diaphragm.
A sensor device includes a substrate, a microelectromechanical systems (MEMS) transducer disposed on the substrate, in integrated circuit, and a cover disposed on the substrate. The sensor device includes a port or an opening for allowing acoustic energy to be incident on the MEMS transducer. The sensor device further includes an ingress protection element positioned to cover the port, the ingress protection element comprising at least one non-planar portion.
An integrated circuit connectable to a sensor includes a transconductance element and a current-input analog-to-digital converter (I-ADC). The transconductance element is connectable to the sensor and is configured to generate a current signal representative of an output of the sensor. The I-ADC is configured to sample and quantize the current signal to generate a corresponding digital sensor signal. The I-ADC includes a continuous-time (CT) integrator stage, a discrete-time (DT) integrator stage, and a feedback digital-to-analog converter (FB-DAC). The CT integrator stage is configured to receive the current output and the I-ADC is configured to generate the digital sensor signal based on an output of the CT integrator stage and an output of the DT integrator stage. The FB-DAC is configured to provide a feedback signal based on the digital sensor signal for adding to the current signal.
An MEMS acoustic transducer includes a substrate having an opening formed therein, a diaphragm comprising a slotted insulative layer, and a first conductive layer. The slotted insulative layer is attached around a periphery thereof to the substrate and over the opening, and the first conductive layer is disposed on a first surface of the slotted insulative layer. A backplate is separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate.
An acoustic sensor assembly that produces an electrical signal representative of an acoustic signal, includes an acoustic transduction element disposed in a housing and acoustically, a heat source causing air pressure variations within the housing when energized, and an electrical circuit electrically coupled to the acoustic transduction element and to contacts on an external-device interface of the housing, wherein the electrical circuit is configured to energize the heat source and determine a non-acoustic condition or change therein based on an amplitude of air pressure variations detected by the acoustic transduction element.
G01H 11/06 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
H04R 1/04 - Structural association of microphone with electric circuitry therefor
A wearable audio device, like a wireless earpiece, that generates a composite voice signal based on a low band signal and a high band signal is disclosed. The low band signal includes a component of the user's voice obtained from an acoustic vibration sensor that detect body conducted sounds and the high band signal includes a component of the user's voice obtained from a microphone that detects atmospheric sounds, wherein the low band signal is obtained predominately from the acoustic vibration sensor and the high band signal is obtained predominately from the microphone. The low and high band signals are based on one or more characteristics of the vibration sensor signal.
A microelectromechanical systems (MEMS) microphone and form-factor adapter can include an adapter housing including an opening and an outer acoustic port and can include a MEMS microphone disposed at least partially within the adapter housing. The MEMS microphone can include a microphone housing, a MEMS motor disposed in the microphone housing and acoustically coupled to the outer acoustic port of the adapter housing via an acoustic port of the microphone housing, and an electrical circuit disposed in the microphone housing and electrically coupled to the MEMS motor and to electrical contacts on an exterior of the microphone housing. The electrical contacts can be physically accessible through the opening of the adapter housing. The adapter housing can change a form-factor of the MEMS microphone.
A transducer assembly can include a base. The transducer assembly can include a stress isolation standoff located on the base. The transducer assembly can include a MEMS die disposed on the stress isolation standoff. The transducer assembly can include a die attach adhesive disposed between the MEMS die and the base. The die attach adhesive can bond the MEMS die to the base. The stress isolation standoff can be embedded in the die attach adhesive between the base and the MEMS die.
A sensor package can include a substrate including a plurality of layers. The plurality of layers can include a first pair of layers and a second pair of layers different from the first pair of layers. The substrate can have a first side and a second side opposite the first side. The sensor package can include a transducer coupled to the second side of the substrate. The sensor package can include an inductor electrically coupled to the transducer. The inductor can be configured as a single layer trace on an inductor layer within the substrate and disposed between the first pair of layers within the substrate. The first pair of layers can be more distal from the second side of the substrate than the second pair of layers.
A sensor signal processing circuit including a delta-sigma analog-to-digital converter (ADC) and a control circuit is disclosed. The circuit is configured to adaptively activate one or more segments of current elements for sequential sampling periods based on a digital signal input to a DAC, wherein less than N current elements are allocated to each segment, each current element in an active segment is enabled and either contributes to a feedback signal of the DAC or does not contribute to the feedback signal, and current elements not in an active segment are disabled. The circuit can be integrated with an acoustic or other sensor as part of a sensor assembly.
A microphone assembly includes a housing having a host device interface, a MEMS transducer disposed in the housing and configured to generate electrical signals in response to acoustic activity, an integrated circuit disposed in the housing and configured to process the electrical signals from the MEMS transducer and generate an output representative of the acoustic activity, a host communication path between the integrated circuit and contacts of the host device interface, and a secure communication path between the integrated circuit and an output interface. The secure communication path is isolated from the host communication path. The integrated circuit is configured to indicate a state of the microphone assembly at the output interface via the secure communication path in response to a command received at the microphone assembly.
An implementation of a MEMS device includes a constrained diaphragm comprising a surface, the diaphragm having a net compressive stress; and a backplate comprising a surface facing the surface of the diaphragm, the surface of the backplate having a center, and a post extending from the surface of the backplate, wherein the post is located at or near a center of the surface and limits a maximum deflection of the diaphragm.
The present disclosure relates to an integrated circuit connectable to a microelectromechanical system (MEMS) transducer. The MEMS transducer is configured to generate a transducer audio signal in response to sound. The integrated circuit comprises a digital scrambling circuit coupled to a data communication interface. The digital scrambling circuit is configured to convert a digital audio stream, representative of the transducer audio signal, into a corresponding scrambled data stream. The integrated circuit additionally comprises a data bus interface coupled to the digital scrambling circuit and configured to output the scrambled data stream.
A sensor assembly including a capacitive sensor, like a microelectromechanical (MEMS) microphone, and an electrical circuit therefor are disclosed. The electrical circuit includes a first transistor having an input gate connectable to the capacitive sensor, a second transistor having an input gate coupled to an output of the first transistor, a feedforward circuit interconnecting a back-gate of the second transistor and the output of the first transistor, and a filter circuit interconnecting the output of the first transistor and the input gate of the second transistor.
H03F 1/22 - Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
G01R 27/26 - Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
H03F 1/26 - Modifications of amplifiers to reduce influence of noise generated by amplifying elements
H03F 3/187 - Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only in integrated circuits
H03F 3/21 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
H03F 3/213 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only in integrated circuits
A microphone can include an adapter housing. The adapter housing can include an opening and an outer acoustic port. The microphone can include an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port. The internal microphone assembly can include a plurality of contacts disposed on the internal housing. The contacts can be accessible through the opening of the adapter housing. An interior of the internal housing can be acoustically coupled to the outer acoustic port via the internal acoustic port.
A microphone assembly includes a substrate and a microelectromechanical systems (MEMS) die. The substrate comprises a top layer and a bottom layer. The top layer comprises a layer of solder mask material spanning across at least a portion of the substrate and one or more standoffs formed of the solder mask material. The one or more standoffs and the layer of solder mask material comprising a single, contiguous structure. The MEMS die is disposed on the one or more standoffs and is coupled to the substrate via a bonding material. The bonding material forms an acoustic seal between the substrate and the MEMS die.
An acoustic device and method generates an acoustic signal by applying an excitation signal to a first coil disposed about an armature of an acoustic receiver. A second coil magnetically coupled to the first coil generates an electrical output signal in response to the excitation signal applied to the first coil, wherein the output signal of the second coil is indicative of a change in a state or operation of the receiver or acoustic device. In some embodiments, the first and second coils are wired independently of each other, and the acoustic device further includes an electrical circuit which determines the change in the acoustic performance based on a change in the electrical output signal of the second coil.
A capacitive sensor assembly includes a capacitive transduction element and an electrical circuit disposed in the housing and electrically coupled to contacts on an external-device interface of the housing. The electrical circuit includes a sampling circuit having an operational sampling phase during which a voltage produced by the capacitive sensor is sampled by a sampling capacitor coupled to a comparator and an operational charging phase during which a second capacitor is charged by a charge and discharge circuit until the output of the comparator changes state, wherein the output of the sampling circuit is a pulse width modulated signal representative of the voltage on the input of the sampling circuit during each sample period. The output of the sampling circuit can be coupled to a delta-sigma analog-to-digital (A/D) converter.
G01D 5/00 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
G01D 5/24 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
A microphone assembly includes a housing including a base, a cover, and a sound port. The microphone assembly further includes an acoustic transducer and an electrical circuit, both of which are disposed in an enclosed volume of the housing. The transducer and electrical circuit work in concert to convert sound waves into a processed digital audio signal. The electrical circuit is configured to process digital data in a series of frames that correspond to a fixed period in time. The electrical circuit is further configured to reduce noise in the resulting signal by varying the current draw required in a randomized or pseudo-randomized fashion between adjacent frames of digital data.
G06F 3/00 - Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
G06F 3/05 - Digital input using the sampling of an analogue quantity at regular intervals of time
A diaphragm for use in a transducer, the diaphragm including a flexible layer configured to deflect in response to changes in a differential pressure. The flexible layer includes a lattice grid. The lattice grid includes a first plurality of substantially elongate openings oriented along an axis and a second plurality of substantially elongate openings extending generally parallel to the axis. The second plurality of openings is substantially offset from the first plurality of openings in a direction substantially parallel to the axis. The first plurality of openings and the second plurality of openings define a first plurality of spaced apart grid beams extending between and substantially parallel to the axis and a second plurality of spaced apart grid beams extending substantially perpendicular to the axis. The second plurality of grid beams is configured to connect adjacent ones of the first plurality of grid beams.
A MEMS transducer for a microphone includes a closed chamber, an array of conductive pins, a dielectric grid, and a diaphragm. The closed chamber is at a pressure lower than atmospheric pressure. The array of conductive pins is in a fixed position in the closed chamber, distributed in two dimensions, and have gaps formed therebetween. The dielectric grid is positioned within the closed chamber, includes a grid of dielectric material positioned between the gaps of the array of conductive pins, and is configured to move parallel to the conductive pins. The diaphragm is configured to form a portion of the closed chamber and deflect in response to changes in a differential pressure between the pressure within the closed chamber and a pressure outside the transducer. The diaphragm is configured to move the dielectric grid relative to the array of conductive pins in response to a change in the differential pressure.
A microelectromechanical systems (MEMS) die includes a substrate, a back plate, and a diaphragm. The back plate is coupled to the substrate and includes a dielectric layer and an electrode. The electrode is coupled to the dielectric layer and defines an opening that exposes a central portion of the dielectric layer. The diaphragm is oriented parallel to the back plate and is spaced apart from the back plate. In one implementation, a diameter of the opening is greater than or equal to 1/10 of the diameter of the diaphragm.
An acoustic transducer for generating electrical signals in response to acoustic signals includes a transducer substrate, a back plate, and a diaphragm assembly. The diaphragm assembly includes a first diaphragm and a second diaphragm coupled thereto. The second diaphragm is positioned closer to the back plate than the first diaphragm. The second diaphragm includes a plurality of diaphragm apertures configured to allow air to pass through the second diaphragm. Each of the back plate and the first diaphragm are coupled to the transducer substrate at their periphery. In an embodiment, the transducer includes a post coupled to the first diaphragm and the second diaphragm, the post configured to prevent movement of the second diaphragm relative to the first diaphragm in a direction substantially perpendicular to the second diaphragm.
A microphone assembly includes a substrate, an acoustic transducer, an integrated circuit, and a cover couples to the substrate to enclose a back volume of the microphone assembly in which the acoustic transducer and the integrated circuit are disposed. The acoustic transducer includes a back plate and a diaphragm oriented parallel to the back plate disposed over an aperture in the substrate to receive acoustic signals. The cover is a metallic material with a thickness and a corresponding thermal diffusivity to attenuate incoming radio-frequency signals. The attenuation of the radio-frequency signals prevents ambient noise detectable by the microphone assembly.
A microelectromechanical system (MEMS) transducer for integration in a microphone assembly is designed to produce heat-generated acoustic signals. The MEMS transducer generally comprises a substrate having an aperture, a transduction element located at least partially over the aperture and coupled to the substrate, electrical contacts coupled to the transduction element, and a resistor integrated with the substrate or the transduction element. The resistor is coupled to electrical contacts that are electrically isolated from the contacts of the MEMS transducer or transduction element. The transduction element includes an insulating material coupled to the substrate. The transduction element comprises a fixed electrode and a movable electrode located at least partially over the aperture of the substrate. The fixed electrode or the moving electrode is formed on the insulating material. The resistor can be formed on the insulating material or suspended from the insulating material.
Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a receiver housing with a first internal volume and a second internal volume, a first diaphragm separating the first internal volume into a first front volume and a first back volume such that the first front volume has a first sound outlet port, a second diaphragm separating the second internal volume into a second front volume and a second back volume such that the second front volume has a second sound outlet port, a motor disposed at least partially inside the housing such that the motor including an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to one of the first diaphragm or the second diaphragm.
Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a housing, a first diaphragm, and a motor. The housing has an internal volume separated by the first diaphragm into a first front volume and a first back volume such that the first front volume has a first sound outlet. The first diaphragm includes a first paddle movable about a first hinge. The motor is disposed in the housing and includes an armature mechanically coupled to the first paddle. The first hinge is located between opposite ends of the first paddle such that actuation of the armature pivots both ends of the first paddle about the hinge.
Two coils are wrapped in one of numerous different implementations. In one implementation, the two coils are wrapped about a portion of a bobbin that has at least three flanges. The first coil is disposed about a first portion of the bobbin between the first flange and the second flange, and a second coil is disposed about a second portion of the bobbin between the second flange and the third flange.
A one-piece sound port adapter for a microphone assembly includes a body member configured to be fitted over a sound port of the microphone assembly. The body member includes an acoustic channel defined in part by a cavity having a sound inlet and a sound outlet, where the sound outlet is acoustically coupled to the sound port. A wall portion of the body member extends into the cavity and configured to modify an acoustic property of the acoustic channel. When mounted, the one-piece sound port adapter converts the microphone assembly from a top or bottom port microphone assembly to a side-port microphone assembly.
According to some embodiments, the present disclosure is directed to a printed circuit board for a microphone assembly that includes a top layer structured for a MEMS transducer to be mounted thereon, a bottom layer, at least one edge, a ground plane, and a conductor electrically connected to the ground plane and the bottom layer. The MEMS transducer includes a transducer substrate, a back plate and a diaphragm. The conductor extends vertically from the top layer to the bottom layer of the printed circuit board, and horizontally along a portion of a length of at least one edge of the printed circuit board. The printed circuit board includes two short edges and two long edges, and the conductor is connected to at least one of the four edges.
Acoustic transducers for generating electrical signals in response to acoustic signals are disclosed. In some embodiments, an acoustic transducer includes an at least partially evacuated hermetically sealed cavity defined in part by a first diaphragm. The acoustic transducer also includes a backplate disposed at least partially within the cavity. The cavity having a pressure lower than atmospheric pressure. The acoustic transducer further includes a pressure sensor coupled to the backplate and configured to sense the pressure in the cavity.
H04R 1/00 - LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS - Details of transducers
H04R 1/04 - Structural association of microphone with electric circuitry therefor
H04R 7/02 - Diaphragms for electromechanical transducers; Cones characterised by the construction
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
G01L 21/12 - Vacuum gauges by measuring variations in the heat conductivity of the medium, the pressure of which is to be measured measuring changes in electric resistance of measuring members, e.g. of filaments; Vacuum gauges of the Pirani type
Sound-producing acoustic receivers and hearing devices implementing such receivers are disclosed. The acoustic receiver includes a receiver housing, an output port, a receiver motor assembly, and a transducer. The receiver housing includes a diaphragm that separates the receiver housing into a back volume and a front volume. The output port is located on the receiver housing and acoustically coupled to the front volume of the receiver housing. The receiver motor assembly is disposed in the back volume and is mechanically coupled to the diaphragm. The transducer is fastened to the receiver housing.
A sensor assembly includes a housing having an external-device interface and a sound port to an interior to the housing. A transducer and an electrical circuit are disposed within the housing. The transducer is acoustically coupled to the sound port while the electrical circuit is electrically coupled to the transducer and the external-device interface. A cavity is formed in a portion of the sensor assembly. In some embodiments, the portion is a base of the housing of the sensor assembly. In other embodiments, the portion is a sound port adapter coupled to the sensor assembly. In any case, the cavity is acoustically coupled to the interior of the housing via the sound port and includes a wall portion structured to modify an acoustic property of the sensor assembly.
H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
H04R 1/04 - Structural association of microphone with electric circuitry therefor
patents
