Abstract

In accordance with one aspect, a device is provided having a transducer comprising a conductor, a diaphragm configured to move relative to the conductor, and a reference volume in communication with the external environment. The diaphragm separates the reference volume and the external environment. The device further includes a controller operably coupled to the transducer and configured to determine an air pressure of an external environment based at least in part on movement of the diaphragm.

IPC Classes  ?

• G01L 19/00 - MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
• G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
• H04R 19/00 - Electrostatic transducers
• H04R 19/04 - Microphones

Abstract

A microphone assembly can include a form-factor adapter housing including an interface opening and an external acoustic port, and an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port and electrical interface contacts, a MEMS motor disposed in the internal housing, and an integrated circuit disposed in the internal housing, the integrated circuit electrically coupled to the MEMS motor and to the electrical interface contacts. The assembly can include an adapter interface located at the interface opening and comprising external host device interface contacts electrically coupled to the electrical interface contacts, the external host device interface contacts exposed to an exterior of the microphone assembly. The internal acoustic port can be acoustically coupled to the external acoustic port.

IPC Classes  ?

• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 19/04 - Microphones

Abstract

An acoustic sensor assembly includes a housing having an external-device interface and a sound port to an interior of the housing. An electro-acoustic transducer and an electrical circuit are disposed within the housing. The electro-acoustic transducer separates the interior into a front volume and a back volume, where the sound port acoustically couples the front volume to an exterior of the housing. The back volume includes a first portion and a second portion. The electrical circuit is electrically coupled to the electro-acoustic transducer and to the external-device interface. One or more apertures acoustically couple the first and second portions of the back volume and are structured to shape a frequency response of the acoustic sensor assembly.

IPC Classes  ?

• H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
• H04R 19/04 - Microphones
• H04R 1/04 - Structural association of microphone with electric circuitry therefor

Abstract

A diaphragm for a balanced armature receiver and combinations thereof. The diaphragm includes a paddle having an area of concentrated mass located at or near a central portion of the paddle, the area of concentrated mass having an area density greater than an area density of other portions of the paddle, wherein the area of concentrated mass shifts a bending-mode frequency of the paddle to a lower frequency compared to a bending-mode frequency of the paddle in the absence of the area of concentrated mass.

IPC Classes  ?

• H04R 7/20 - Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands
• H04R 9/04 - Construction, mounting, or centering of coil

Abstract

A balanced armature receiver includes a gas permeable barrier located on a portion of the receiver defining a back volume to provide barometric relief. The barrier can be located in a wall portion or diaphragm of the receiver to vent the back volume to an exterior of the receiver directly, via a front volume, or via a nozzle. The gas permeable barrier is impermeable to liquid infiltration and can be configured to influence the low frequency response of the receiver.

IPC Classes  ?

• H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
• H04R 11/02 - Loudspeakers

Abstract

Various embodiments of balanced armature receivers are disclosed, where the receiver includes a yoke which retains permanent magnets, a coil assembly having a coil tunnel, and an armature coupled to the yoke, with a movable portion extending through the coil tunnel and an end portion that is free to deflect between the magnets when an excitation signal is applied to the coil assembly. There are a stationary protrusion which extends from the stationary portion of the receiver toward the movable portion of the armature, and a movable protrusion which extends from the movable portion of the armature toward the stationary portion of the receiver. The stationary and movable protrusions are offset laterally.

IPC Classes  ?

• H01F 7/08 - Electromagnets; Actuators including electromagnets with armatures
• H01F 7/126 - Supporting or mounting

Abstract

A vibration sensor/accelerometer includes, in various implementations, a MEMS die that includes a plate having an aperture, an anchor disposed within the aperture, a plurality of arms (e.g., rigid arms) extending from the anchor, and a plurality of resilient members (e.g., looped or folded springs with a carefully designed spring stiffness), each resilient member connecting the plate to an arm of the plurality of arms. The plate may be made from a solid layer in which the resilient members are etched from the same layer. The MEMS die may also include top and bottom wafers, and travel stoppers extending from the top and bottom wafers as well as through the plate.

IPC Classes  ?

• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• G01C 19/5755 - Structural details or topology the devices having a single sensing mass
• G01H 11/06 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means

Abstract

A sound-producing balanced armature receiver, as disclosed, includes a receiver housing with a first internal volume, a second internal volume, and a sound outlet. The receiver includes a first diaphragm separating the first internal volume into a first front volume and a first back volume and a second diaphragm separating the second internal volume into a second front volume and a second back volume. The receiver also includes a motor inside the first back volume of the housing such that the motor includes an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to the second diaphragm while providing acoustic separation between the first internal volume and the second internal volume, and a back-volume increasing structure attached externally to the housing and acoustically coupled with the second back volume to provide additional volume to the second back volume.

IPC Classes  ?

• H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
• H04R 9/06 - Loudspeakers
• H04R 7/20 - Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands
• H04R 11/02 - Loudspeakers

Abstract

A MEMS device can include a solid dielectric including a plurality of apertures, the solid dielectric having a first side and a second side. The MEMS device can include a first plurality of electrodes extending completely through a first subset of the plurality of apertures, a second plurality of electrodes extending partially through a second subset of the plurality of apertures, a third plurality of electrodes extending partially into a third subset of the plurality of apertures. The MEMS device can include a first diaphragm coupled to the first plurality and to the third plurality of electrodes, the first diaphragm facing the first side of the solid dielectric. The MEMS device can include a second diaphragm coupled to the first plurality and to the second plurality of electrodes the second diaphragm facing the second side of the solid dielectric.

IPC Classes  ?

• B81B 7/04 - Networks or arrays of similar microstructural devices
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Abstract

An acoustic receiver includes a first receiver subassembly having bottom housing plate with at least a portion of a motor fastened thereto, and a second receiver subassembly having a closed-ended housing wall with at least one open end that is fastened to the bottom housing plate. A method of making and assembling the components is also described.

IPC Classes  ?

• H04R 11/02 - Loudspeakers
• H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
• H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
• H04R 7/12 - Non-planar diaphragms or cones

Abstract

A balanced armature (BA) receiver and specifically a nickel-iron (Ni—Fe) alloy armature having improved robustness and performance receivers, as well as motors and receivers including such armatures are disclosed. The Ni—Fe armature has a nickel content of 45% or less by weight, 5% or less additive and impurities by weight, and the balance Fe. The armature can be configured as a U-reed, an E-reed or in some other configuration.

IPC Classes  ?

• H04R 11/02 - Loudspeakers
• H04R 1/02 - Casings; Cabinets; Mountings therein
• H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
• H04R 7/12 - Non-planar diaphragms or cones
• H04R 1/34 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means

Abstract

A MEMS diaphragm assembly comprises a first diaphragm, a second diaphragm, and a stationary electrode assembly spaced between the first and second diaphragms and including a plurality of apertures disposed therethrough. Each of a plurality of pillars is disposed through one of the plurality of apertures and connects the first and second diaphragms. At least one of the first and second diaphragms is connected to the stationary electrode assembly at a geometric center of the assembly.

IPC Classes  ?

• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• H04R 7/12 - Non-planar diaphragms or cones

Abstract

A PM signal generator can generate a variable PM signal based on a position of a movable element of a MEMS motor. A bias voltage generator can provide a bias voltage to the MEMS motor. The bias voltage generator can include a reference signal generator that can generate a reference signal that varies based on variation of pulses of the PM signal. The bias voltage can be based on the reference signal.

IPC Classes  ?

• H02N 2/00 - Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
• H02M 3/06 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider

Abstract

The disclosure relates to a transducer assembly like a microphone including a bias circuit having a charge pump and a filter circuit coupled to a transducer. The filter circuit includes a voltage-controlled resistor located between an output of the charge pump and the transducer, and a capacitor coupled to the voltage-controlled resistor opposite the charge pump, wherein the bias circuit is configured with a larger bandwidth for faster settling during transient operation than during steady-state operation.

IPC Classes  ?

• H04R 3/04 - Circuits for transducers for correcting frequency response
• H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
• H02M 1/44 - Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
• H04R 19/04 - Microphones
• H04R 1/04 - Structural association of microphone with electric circuitry therefor

Abstract

The present disclosure relates to a transducer assembly including a transducer having a movable member, and a servo-loop controller configured to compensate for effects of a disturbance on the transducer assembly by adjusting a bias voltage applied to the transducer. A servo-loop controller having a smaller bandwidth for out-of-band disturbances than for in-band disturbances and configured to control the bias voltage based on a feedback signal generated by a sensor that detects an effect of the disturbance on the transducer assembly. The transducer assembly can be implemented as a microphone or a speaker among other sensors and actuators.

IPC Classes  ?

• H04R 3/02 - Circuits for transducers for preventing acoustic reaction
• H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• B81B 7/00 - Microstructural systems
• H04R 19/04 - Microphones
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 3/04 - Circuits for transducers for correcting frequency response

Abstract

Various implementations of MEMS sensors include an IC die having a cavity that forms at least part of the back volume of the sensor. This arrangement helps to address the problems of lateral velocity gradients and viscosity-induced losses. In some of the embodiments, the cavity is specially configured (e.g., with pillars, channels, and/or rings) to reduce the lateral movement of air. Other solutions (used in conjunction with such cavities) include ways to make a diaphragm move more like a piston (e.g., by adding a protrusion that gives it more “up-down” motion and less lateral motion) or to use a piston (e.g., a rigid piece of silicon such as an integrated circuit die) in place of a diaphragm

IPC Classes  ?

• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Abstract

Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a receiver housing with a first internal volume and a second internal volume, a first diaphragm separating the first internal volume into a first front volume and a first back volume such that the first front volume has a first sound outlet port, a second diaphragm separating the second internal volume into a second front volume and a second back volume such that the second front volume has a second sound outlet port, a motor disposed at least partially inside the housing such that the motor including an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to one of the first diaphragm or the second diaphragm.

IPC Classes  ?

• H04R 11/02 - Loudspeakers
• H04R 1/10 - Earpieces; Attachments therefor
• H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
• H04R 9/04 - Construction, mounting, or centering of coil

Abstract

A microelectromechanical systems (MEMS) die includes a first diaphragm and a second diaphragm, wherein the first diaphragm and the second diaphragm bound a sealed chamber. A stationary electrode is disposed within the sealed chamber between the first diaphragm and the second diaphragm. A tunnel passes through the first diaphragm and the second diaphragm without passing through the stationary electrode, wherein the tunnel is sealed off from the chamber. The MEMS die further includes a substrate having an opening formed therethrough, wherein the tunnel provides fluid communication from the opening, through the second diaphragm, and through the first diaphragm.

IPC Classes  ?

• B81B 7/00 - Microstructural systems

Abstract

The present disclosure relates to dual-diaphragm moving-coil audio transducers for hearing devices. The transducer includes a magnetic circuit including an inner portion located between first and second coils coupled to corresponding diaphragms supported by a housing. An outer portion of the magnetic circuit is adjacent outer portions of the first and second coils. The transducer emits sound when the first diaphragm moves in a first direction and the second diaphragm moves in a second direction, opposite the first direction, in response to an electrical audio signal applied to the first and second coils.

IPC Classes  ?

• H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
• H04R 7/16 - Mounting or tensioning of diaphragms or cones
• H04R 1/10 - Earpieces; Attachments therefor

Abstract

A microphone assembly can include a microelectromechanical systems (MEMS) transducer comprising a transducer substrate, a diaphragm oriented substantially parallel to the transducer substrate and spaced apart from the transducer substrate to form a gap, and a counter electrode coupled to the transducer substrate, the counter electrode positioned between the diaphragm and the transducer substrate. The MEMS transducer can generate a signal representative of a change in capacitance between the counter electrode and the diaphragm. A back volume of the MEMS transducer can be an enclosed volume positioned between the transducer substrate and the diaphragm. The microphone assembly can include an integrated circuit that receives the signal, wherein every point within the back volume is less than a thermal boundary layer thickness from a nearest solid surface at an upper limit of an audio frequency band that the integrated circuit is monitoring.

IPC Classes  ?

• H04R 1/02 - Casings; Cabinets; Mountings therein

Abstract

A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm. A plurality of pillars connects the first and second diaphragms, wherein the plurality of pillars has a higher distribution density at a geometric center of the MEMS diaphragm assembly than at an outer periphery thereof.

IPC Classes  ?

• H04R 7/00 - Diaphragms for electromechanical transducers; Cones
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• H04R 7/04 - Plane diaphragms

Abstract

A microelectromechanical system (MEMS) transducer includes a transducer substrate, a diaphragm, and a stiffening member. A first side of the diaphragm is coupled to the transducer substrate. A second side of the diaphragm is coupled to the stiffening member. The stiffening member includes a plurality of fingers extending inwards from a perimeter of an aperture defined by the transducer substrate.

IPC Classes  ?

• H04R 19/04 - Microphones
• H04R 1/02 - Casings; Cabinets; Mountings therein

Abstract

A microphone device, an interface circuit and method are provided for managing a potential difference in sensitivity to a detected environmental stimulus associated with a sensor arrangement, where multiple electrical signals forming a differential signal can be produced, and the multiple electrical signals can be better balanced. Such an interface circuit, which can be used within a microphone device includes a bias voltage generator having one or more bias output voltage terminals, where a respective one of one or more DC bias voltages is produced at each of the bias output voltage terminals, for being coupled to a pair of transduction elements of a sensor. The interface circuit further includes an amplifier circuit having a first input terminal coupled to a first one of the pair of output terminals of the sensor and having a second input terminal coupled to a second one of the pair of output terminals of the sensor, the amplifier circuit producing a differential output signal. The interface circuit still further includes a compensation circuit coupled to the amplifier circuit for producing a balance signal based on an output signal being produced by the amplifier circuit, wherein the balance signal compensates for any difference in amplitude in the first and second electrical signals that are received by the amplifier circuit from the sensor.

IPC Classes  ?

• H04R 1/08 - Mouthpieces; Attachments therefor
• H03F 3/183 - Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only
• H04R 29/00 - Monitoring arrangements; Testing arrangements
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 1/26 - Spatial arrangement of separate transducers responsive to two or more frequency ranges
• H04R 19/04 - Microphones
• H04R 3/00 - Circuits for transducers

Abstract

The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes an output driver circuit, a low drop out (LDO) regulator circuit, and an over-voltage protection circuit with improved capacity and response time.

IPC Classes  ?

• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• H02M 3/156 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
• H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
• H04R 1/08 - Mouthpieces; Attachments therefor

Abstract

The present disclosure relates generally to digital microphone and other sensor assemblies including a transduction element and a successive-approximation (SA) quantizer configured to reuse a digital code generated for a prior sample period for a current sample period when a reuse condition is satisfied. The SA quantizer does not regenerate a new digital code for the current sample period when the digital code generated for the prior sample period is used thereby reducing power consumption.

IPC Classes  ?

• H04R 3/02 - Circuits for transducers for preventing acoustic reaction
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Abstract

A microelectromechanical systems (MEMS) device comprises a diaphragm assembly and a force feedback system. The diaphragm assembly includes a first diaphragm and a second diaphragm facing the first diaphragm, with a low pressure region being defined therebetween. The diaphragm assembly further includes a first plurality of electrodes, a second plurality of electrodes, and a third plurality of electrodes. A solid dielectric is spaced between the first and second diaphragms and includes a plurality of apertures. Each electrode of the first, second, and third pluralities of electrodes is disposed at least partially within an aperture of the plurality of apertures. The force feedback system receives output from the diaphragm assembly and produces a feedback voltage that is applied to the diaphragm assembly to produce an electrostatic force on the diaphragm assembly that counters a low-frequency pressure across the diaphragm assembly.

IPC Classes  ?

• H04R 3/02 - Circuits for transducers for preventing acoustic reaction
• H04R 19/04 - Microphones
• H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
• H04R 3/04 - Circuits for transducers for correcting frequency response
• H04R 1/02 - Casings; Cabinets; Mountings therein
• B81B 7/00 - Microstructural systems

Abstract

A digital microphone or other sensor assembly includes a transducer and an electrical circuit including a slew-rate controlled output buffer configured to reduce propagation delay and maintain output rise and fall time independent of PVT variation and load capacitance. In some embodiments, the portions of the output buffer are selectably disabled to reduce power consumption without adversely substantially increasing propagation delay.

IPC Classes  ?

• H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
• H04R 3/00 - Circuits for transducers

Abstract

A microelectromechanical systems (MEMS) device includes a MEMS die and an electrical circuit electrically connected to the MEMS die. The electrical circuit includes a first capacitor that produces a first output signal based on a signal received from the MEMS die, and a second capacitor that produces a second output signal based on a signal received from the MEMS die. The electrical circuit is configured to determine a nominal capacitance of the MEMS die based on a ratio of the first output signal to the second output signal and a ratio of the capacitances of the first and second capacitors.

IPC Classes  ?

• B81B 7/00 - Microstructural systems
• H04R 3/04 - Circuits for transducers for correcting frequency response

Abstract

A MEMS die includes a substrate having an opening formed therein, and a diaphragm attached around a periphery thereof to the substrate and over the opening, wherein the diaphragm comprises first and second spaced apart layers. A backplate is disposed between the first and second spaced apart layers. One or more columnar supports are disposed through holes disposed through the backplate and connecting the first and second spaced apart layers. At least a partial vacuum exists between at least a portion of the first and second spaced apart layers. The first layer further comprises interior and exterior sub-layers at least proximate to each of the one or more columnar supports, wherein the interior sub-layers include one or more apertures disposed therethrough.

IPC Classes  ?

• H04R 1/00 - LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS - Details of transducers
• H04R 1/08 - Mouthpieces; Attachments therefor
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• B81B 7/00 - Microstructural systems

Abstract

A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.

IPC Classes  ?

• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Abstract

A microphone assembly including an acoustic transducer that generates an electrical signal responsive to acoustic activity, and an integrated circuit electrically coupled to the acoustic transducer and that receives the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity. The microphone assembly also includes a substrate comprising a first surface on which the integrated circuit is mounted, a guard ring mounted on the substrate and elevated relative to the first surface of the substrate, and a can mounted to the guard ring, wherein the can, the guard ring, and the substrate form a housing in which the transducer and integrated circuit are disposed.

IPC Classes  ?

• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 1/08 - Mouthpieces; Attachments therefor
• H04R 19/04 - Microphones
• B81B 7/00 - Microstructural systems
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

The disclosure relates to microphone and other sensor assemblies having a transduction element and an integrated circuit. The integrated circuit includes a switched-capacitor delta-sigma analog-to-digital converter (ADC) including a first integrator stage having a switched-capacitor circuit and a first plurality of parallel amplifiers. A logic circuit coupled to the integrator circuit is configured to selectably disable a subset of enabled amplifiers of the first integrator stage during a first phase of operation and to re-enable the subset of disabled amplifiers during a second phase.

IPC Classes  ?

• H04R 19/04 - Microphones
• H04R 3/00 - Circuits for transducers
• H03F 3/45 - Differential amplifiers
• H03M 3/00 - Conversion of analogue values to or from differential modulation

Abstract

A MEMS die includes a substrate having an opening formed therein, a diaphragm having a first surface attached around a periphery thereof to the substrate and over the opening, and a backplate separated from a second surface of the diaphragm. The diaphragm includes at least one passage disposed between the first and second surfaces, and the at least one passage has a smaller cross-sectional area at the first surface than at the second surface.

IPC Classes  ?

• H04R 19/04 - Microphones
• H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
• H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery

Abstract

A wearable audio device can include a microphone located to detect atmospheric sound including a user's voice. The device can include an acoustic vibration sensor located to detect sound including the user's voice conducted through the user's body. The device can include a body voice filter coupled to the acoustic vibration sensor. The device can include a filter parameter generator coupled to the acoustic vibration sensor and the body voice filter the filter parameter generator configured to generate parameters for the body voice filter based on a frequency characteristic of a signal obtained from the acoustic vibration sensor. The device can include a composite signal generator coupled to the body voice filter and the microphone and configured to generate a composite voice signal based on a low band signal obtained predominately from the body voice filter and based on a high band signal obtained predominately from the microphone.

IPC Classes  ?

• H04R 3/00 - Circuits for transducers
• H04R 3/02 - Circuits for transducers for preventing acoustic reaction

Abstract

3) in at least one direction and density selected to increase stiffness and reduce mass. In one implementation, at least the paddle includes a carbon fiber material. The resulting paddle has improved acoustic performance including improved frequency response and less resonance in the audio band, among other benefits.

IPC Classes  ?

• H04R 7/20 - Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands
• H04R 11/02 - Loudspeakers
• H04R 7/14 - Non-planar diaphragms or cones corrugated, pleated, or ribbed

Abstract

The present disclosure relates to a balanced armature receiver (100) including a housing having a diaphragm comprising a movable paddle (116) disposed in the housing and separating the housing into a back volume (112) and a front volume (110) defined partly by space between a ceiling of the housing and the diaphragm, wherein the paddle is oriented non-parallel to the ceiling. A sound port (142) in the housing acoustically couples the front volume to an exterior of the housing, wherein the sound port is located on an end wall between the diaphragm and the ceiling. A motor disposed in the back volume includes a coil magnetically coupled to an armature having an end portion movably disposed between magnets retained by a yoke and coupled to the paddle.

IPC Classes  ?

• H04R 11/02 - Loudspeakers
• H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
• H04R 9/06 - Loudspeakers

Abstract

The present disclosure relates generally to digital microphone and other sensor assemblies including a transducer, a delta-sigma analog-to-digital converter (ADC), a dynamic element matching (DELM) entity configured to compensate for nonlinearity resulting from variation among digital-to-analog conversion (DAC) elements of the ADC, and a control circuit configured to enable and disable the DELM based on a magnitude of a digital signal generated by the ADC.

IPC Classes  ?

• H04R 3/02 - Circuits for transducers for preventing acoustic reaction
• H03M 3/00 - Conversion of analogue values to or from differential modulation
• H04R 19/04 - Microphones
• H04R 3/04 - Circuits for transducers for correcting frequency response

Abstract

The disclosure relates to a MEMS sensor and an assembly including the MEMS sensor and an electrical circuit disposed in an assembly housing. The sensor includes a suspended structure (148) having a top diaphragm (118), a central electrode (120) and a bottom diaphragm (122) connected by a pillar portion (134). A peripheral portion of the suspended structure is coupled to a support structure (114), forming a low pressure cavity (130). The MEMS sensor includes a top electrode (136) disposed between the top diaphragm and the central electrode and a bottom electrode (138) disposed between the bottom diaphragm and central electrode each coupled to the support structure, wherein in the event of a sound pressure condition, the suspended structures moves up or down together, while the top electrode and the bottom electrode remain substantially stationary.

IPC Classes  ?

• H04R 19/00 - Electrostatic transducers
• H04R 19/04 - Microphones
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
• H04R 7/16 - Mounting or tensioning of diaphragms or cones

Abstract

Coil bobbins for balanced armature receivers are disclosed. The balanced armature receiver bobbin includes a coil support member, at least two flanges, and a shoulder. The coil support member has an armature passage extending between a first end and a second end thereof. The flanges extending radially from the coil support member such that the first flange extends from the coil support member proximate the first end and the second flange extends from the coil support member proximate the second end. The shoulder extends from the first flange, with the first flange located between the shoulder and the coil support member. The shoulder has a plurality of conductive coil pads disposed on a bottom portion thereof.

IPC Classes  ?

• H01F 27/32 - Insulating of coils, windings, or parts thereof
• H01H 50/30 - Mechanical arrangements for preventing or damping vibration or shock, e.g. by balancing of armature
• H04R 1/10 - Earpieces; Attachments therefor
• H04R 11/02 - Loudspeakers
• H04R 1/06 - Arranging circuit leads; Relieving strain on circuit leads

Abstract

A balanced armature receiver including a diaphragm with an elastomer surround is disclosed. The surround is fastened to multiple surfaces of the diaphragm and can be a siloxane-based material. In one implementation, the diaphragm includes a paddle flexibly coupled to a frame and the surround covers a gap between the frame and the paddle.

IPC Classes  ?

• H04R 11/02 - Loudspeakers
• H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
• H04R 7/12 - Non-planar diaphragms or cones
• H04R 1/02 - Casings; Cabinets; Mountings therein

Abstract

The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes a variable gain signal processing circuit (203) that processes an electrical signal from the transducer and a gain control circuit (204) that compensates for transducer sensitivity drift caused by variation in an environmental condition of the transducer, and electrical circuits therefor.

IPC Classes  ?

• H04R 29/00 - Monitoring arrangements; Testing arrangements
• H04R 3/00 - Circuits for transducers
• H04R 19/04 - Microphones

Abstract

The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes a transducer bias circuit that applies a bias to the transducer and a bias control circuit (204) that compensates for transducer sensitivity drift caused by variation in an environmental condition of the transducer, and electrical circuits therefor.

IPC Classes  ?

• H04R 29/00 - Monitoring arrangements; Testing arrangements
• H04R 3/00 - Circuits for transducers
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• B81B 7/00 - Microstructural systems
• H04R 19/04 - Microphones

Abstract

The present disclosure relates generally to digital microphone and other sensor assemblies including a transducer and a delta-sigma analog-to-digital converter (ADC) with digital-to-analog converter (DAC) element mismatch shaping and more particularly to sensor assemblies and electrical circuits therefor including a dynamic element matching (DELM) entity configured to select DAC elements based on data weighted averaging (DWA) and a randomized non-negative shift.

IPC Classes  ?

• H03M 3/00 - Conversion of analogue values to or from differential modulation
• B81B 7/00 - Microstructural systems
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 19/04 - Microphones
• H04R 3/02 - Circuits for transducers for preventing acoustic reaction

Abstract

A MEMS device can include a first support layer, a second support layer, and a solid dielectric suspended between the first support layer and the second support layer. The solid dielectric can move relative to the first support layer and the second support layer and can include a plurality of apertures. The MEMS device can include a first plurality of electrodes coupled to the first support layer and the second support layer and extending through a first subset of the plurality of apertures. The MEMS device can include a second plurality of electrodes coupled to the first support layer and extending partially into a second subset of the plurality of apertures. The MEMS device can include a third plurality of electrodes coupled to the second support layer and extending partially into a third subset of the plurality of apertures.

IPC Classes  ?

• H01L 29/84 - Types of semiconductor device controllable by variation of applied mechanical force, e.g. of pressure
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Abstract

A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate, the acoustic transducer configured to generate an electrical signal responsive to acoustic activity. An integrated circuit is disposed on the substrate and electrically coupled to the acoustic transducer, the integrated circuit configured to generate an output signal indicative of the acoustic activity based on the electrical signal from the acoustic transducer. An enclosure is coupled to the substrate and defines an internal volume between the enclosure and the substrate, the enclosure having an outer surface exposed to an outside environment of the microphone assembly, and an inner surface adjacent the internal volume. An insulating layer is disposed on the inner surface of the enclosure. The insulating layer comprises a fluoropolymer.

IPC Classes  ?

• H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
• H04R 19/04 - Microphones
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 3/00 - Circuits for transducers
• C09D 127/18 - Homopolymers or copolymers of tetrafluoroethene
• B81B 7/00 - Microstructural systems
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate

Abstract

A MEMS can include a substrate including a first side and a second side on an opposite side of the substrate from the first side. The MEMS device can include an aperture running through the substrate from the first side to the second side. The substrate can have an edge surrounding the aperture on the first side. The MEMS device can include a diaphragm located over the aperture on the first side. The MEMS device can include a support structure that extends at least partially across the aperture from the edge.

IPC Classes  ?

• H04R 19/00 - Electrostatic transducers
• H04R 19/04 - Microphones
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Abstract

A microphone assembly includes an acoustic transducer configured to generate an analog signal in response to pressure changes sensed by the acoustic transducer. The analog signal includes frequency components below a threshold frequency. The microphone assembly also includes an integrated circuit electrically coupled to the acoustic transducer and configured to determine a characteristic of frequency components below the threshold frequency, determine whether the characteristic of the frequency components corresponds to a fall event, and generate an output signal in response to a determination that the characteristic of the frequency components corresponds to the fall event. The microphone assembly also includes a housing having an external device interface with electrical contacts. The acoustic transducer and the integrated circuit are disposed within the housing. The integrated circuit is electrically coupled to contacts of the external device interface.

IPC Classes  ?

• H04R 3/00 - Circuits for transducers
• H04R 29/00 - Monitoring arrangements; Testing arrangements
• H04R 1/00 - LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS - Details of transducers
• H04R 1/08 - Mouthpieces; Attachments therefor

Abstract

The present disclosure relates to a sensor assembly (100) comprising: a base (102) having a host-device interface (104), a lid (108) mounted on the base (102) to form a housing (110), the lid (108) having an insulative structural core (112) between an inner metal skin (114) and an outer metal skin (116); and a transduction element (118) disposed in the housing (112). Advantageously, the lid (108) of the sensor assembly (100) can help to minimize and reduce undesirable thermo-acoustic effects produced by external environmental conditions that may result in acoustic artifacts.

IPC Classes  ?

• H04R 19/00 - Electrostatic transducers
• B81B 7/00 - Microstructural systems
• H04R 19/04 - Microphones

Abstract

A first electrode of a MEMS device can be oriented lengthwise along and parallel to an axis, and can have a first end and a second end. A second electrode can be oriented lengthwise along and parallel to the axis and can have a first end and a second end. A third electrode can be oriented lengthwise along and parallel to the axis and can have a first end and a second end. The first, second, and third electrodes can each be located at least partially within an aperture of a plurality of apertures of a solid dielectric that can surround the second electrode second end and the third electrode first end. The second electrode first end and the third electrode second end can be located outside of the solid dielectric.

IPC Classes  ?

• H01L 29/84 - Types of semiconductor device controllable by variation of applied mechanical force, e.g. of pressure
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Abstract

The present disclosure relates to microphone devices. One microphone assembly includes a transducer and a housing. The microphone assembly includes an integrated circuit coupled to the transducer. The housing includes a port, a base, and a cover. The cover includes an inner wall and an outer wall. The inner wall and outer wall can be coupled to the base. The inner wall and the base are mechanically coupled and define an enclosed volume. The transducer is disposed in the enclosed volume.

IPC Classes  ?

• H04R 1/08 - Mouthpieces; Attachments therefor
• H04R 7/16 - Mounting or tensioning of diaphragms or cones

Abstract

A MEMS device can include a substrate having a first side and a second side, the substrate including an aperture extending from the first side through the substrate to the second side. The device can include a support structure coupled to the substrate the first side. The device can include a resilient structure coupled to the support structure. The device can include a rigid movable plate coupled to the support structure via the resilient structure and positioned over the aperture. The device can include a proof mass coupled to the movable plate, the proof mass extending into the aperture. The device can include an electrode located on an opposite side of the movable plate from the proof mass.

IPC Classes  ?

• G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure

Abstract

Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a receiver housing with a first internal volume and a second internal volume, a first diaphragm separating the first internal volume into a first front volume and a first back volume such that the first front volume has a first sound outlet port, a second diaphragm separating the second internal volume into a second front volume and a second back volume such that the second front volume has a second sound outlet port, a motor disposed at least partially inside the housing such that the motor including an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to one of the first diaphragm or the second diaphragm.

IPC Classes  ?

• H04R 11/02 - Loudspeakers
• H04R 1/10 - Earpieces; Attachments therefor
• H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
• H04R 9/04 - Construction, mounting, or centering of coil

Abstract

A sensor device includes a substrate, a microelectromechanical systems (MEMS) transducer disposed on the substrate, in integrated circuit, and a cover disposed on the substrate. The sensor device includes a port or an opening for allowing acoustic energy to be incident on the MEMS transducer. The sensor device further includes an ingress protection element positioned to cover the port, the ingress protection element comprising at least one non-planar portion.

IPC Classes  ?

• H04R 1/02 - Casings; Cabinets; Mountings therein
• B81B 7/00 - Microstructural systems

Abstract

A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.

IPC Classes  ?

• H04R 25/00 - Deaf-aid sets
• H04R 19/04 - Microphones
• H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
• H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• B81B 7/00 - Microstructural systems
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 3/00 - Circuits for transducers
• H04R 7/10 - Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact

Abstract

An integrated circuit connectable to a sensor includes a transconductance element and a current-input analog-to-digital converter (I-ADC). The transconductance element is connectable to the sensor and is configured to generate a current signal representative of an output of the sensor. The I-ADC is configured to sample and quantize the current signal to generate a corresponding digital sensor signal. The I-ADC includes a continuous-time (CT) integrator stage, a discrete-time (DT) integrator stage, and a feedback digital-to-analog converter (FB-DAC). The CT integrator stage is configured to receive the current output and the I-ADC is configured to generate the digital sensor signal based on an output of the CT integrator stage and an output of the DT integrator stage. The FB-DAC is configured to provide a feedback signal based on the digital sensor signal for adding to the current signal.

IPC Classes  ?

• H04R 3/06 - Circuits for transducers for correcting frequency response of electrostatic transducers

Abstract

An MEMS acoustic transducer includes a substrate having an opening formed therein, a diaphragm comprising a slotted insulative layer, and a first conductive layer. The slotted insulative layer is attached around a periphery thereof to the substrate and over the opening, and the first conductive layer is disposed on a first surface of the slotted insulative layer. A backplate is separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate.

IPC Classes  ?

• H04R 19/00 - Electrostatic transducers
• H04R 19/04 - Microphones
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers

Abstract

An acoustic sensor assembly that produces an electrical signal representative of an acoustic signal, includes an acoustic transduction element disposed in a housing and acoustically, a heat source causing air pressure variations within the housing when energized, and an electrical circuit electrically coupled to the acoustic transduction element and to contacts on an external-device interface of the housing, wherein the electrical circuit is configured to energize the heat source and determine a non-acoustic condition or change therein based on an amplitude of air pressure variations detected by the acoustic transduction element.

IPC Classes  ?

• H04R 1/08 - Mouthpieces; Attachments therefor
• H04R 9/08 - Microphones
• H04R 11/04 - Microphones
• H04R 19/04 - Microphones
• G01H 11/06 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 3/00 - Circuits for transducers

Abstract

A wearable audio device, like a wireless earpiece, that generates a composite voice signal based on a low band signal and a high band signal is disclosed. The low band signal includes a component of the user's voice obtained from an acoustic vibration sensor that detect body conducted sounds and the high band signal includes a component of the user's voice obtained from a microphone that detects atmospheric sounds, wherein the low band signal is obtained predominately from the acoustic vibration sensor and the high band signal is obtained predominately from the microphone. The low and high band signals are based on one or more characteristics of the vibration sensor signal.

IPC Classes  ?

• H04R 3/00 - Circuits for transducers
• H04R 3/02 - Circuits for transducers for preventing acoustic reaction

Abstract

A microelectromechanical systems (MEMS) microphone and form-factor adapter can include an adapter housing including an opening and an outer acoustic port and can include a MEMS microphone disposed at least partially within the adapter housing. The MEMS microphone can include a microphone housing, a MEMS motor disposed in the microphone housing and acoustically coupled to the outer acoustic port of the adapter housing via an acoustic port of the microphone housing, and an electrical circuit disposed in the microphone housing and electrically coupled to the MEMS motor and to electrical contacts on an exterior of the microphone housing. The electrical contacts can be physically accessible through the opening of the adapter housing. The adapter housing can change a form-factor of the MEMS microphone.

IPC Classes  ?

• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 19/04 - Microphones

Abstract

A transducer assembly can include a base. The transducer assembly can include a stress isolation standoff located on the base. The transducer assembly can include a MEMS die disposed on the stress isolation standoff. The transducer assembly can include a die attach adhesive disposed between the MEMS die and the base. The die attach adhesive can bond the MEMS die to the base. The stress isolation standoff can be embedded in the die attach adhesive between the base and the MEMS die.

IPC Classes  ?

• B81B 7/00 - Microstructural systems
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• H04R 19/04 - Microphones
• H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
• H04R 19/00 - Electrostatic transducers

Abstract

A sensor package can include a substrate including a plurality of layers. The plurality of layers can include a first pair of layers and a second pair of layers different from the first pair of layers. The substrate can have a first side and a second side opposite the first side. The sensor package can include a transducer coupled to the second side of the substrate. The sensor package can include an inductor electrically coupled to the transducer. The inductor can be configured as a single layer trace on an inductor layer within the substrate and disposed between the first pair of layers within the substrate. The first pair of layers can be more distal from the second side of the substrate than the second pair of layers.

IPC Classes  ?

• B81B 7/00 - Microstructural systems
• H04R 19/04 - Microphones

Abstract

A sensor signal processing circuit including a delta-sigma analog-to-digital converter (ADC) and a control circuit is disclosed. The circuit is configured to adaptively activate one or more segments of current elements for sequential sampling periods based on a digital signal input to a DAC, wherein less than N current elements are allocated to each segment, each current element in an active segment is enabled and either contributes to a feedback signal of the DAC or does not contribute to the feedback signal, and current elements not in an active segment are disabled. The circuit can be integrated with an acoustic or other sensor as part of a sensor assembly.

IPC Classes  ?

• H04R 3/02 - Circuits for transducers for preventing acoustic reaction
• H03M 3/00 - Conversion of analogue values to or from differential modulation
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 19/04 - Microphones
• H04R 29/00 - Monitoring arrangements; Testing arrangements

Abstract

A microphone assembly includes a housing having a host device interface, a MEMS transducer disposed in the housing and configured to generate electrical signals in response to acoustic activity, an integrated circuit disposed in the housing and configured to process the electrical signals from the MEMS transducer and generate an output representative of the acoustic activity, a host communication path between the integrated circuit and contacts of the host device interface, and a secure communication path between the integrated circuit and an output interface. The secure communication path is isolated from the host communication path. The integrated circuit is configured to indicate a state of the microphone assembly at the output interface via the secure communication path in response to a command received at the microphone assembly.

IPC Classes  ?

• H04R 1/04 - Structural association of microphone with electric circuitry therefor

Abstract

An implementation of a MEMS device includes a constrained diaphragm comprising a surface, the diaphragm having a net compressive stress; and a backplate comprising a surface facing the surface of the diaphragm, the surface of the backplate having a center, and a post extending from the surface of the backplate, wherein the post is located at or near a center of the surface and limits a maximum deflection of the diaphragm.

IPC Classes  ?

• B81B 7/00 - Microstructural systems
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• H04R 19/00 - Electrostatic transducers

Abstract

The present disclosure relates to an integrated circuit connectable to a microelectromechanical system (MEMS) transducer. The MEMS transducer is configured to generate a transducer audio signal in response to sound. The integrated circuit comprises a digital scrambling circuit coupled to a data communication interface. The digital scrambling circuit is configured to convert a digital audio stream, representative of the transducer audio signal, into a corresponding scrambled data stream. The integrated circuit additionally comprises a data bus interface coupled to the digital scrambling circuit and configured to output the scrambled data stream.

IPC Classes  ?

• H04R 19/04 - Microphones
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 3/00 - Circuits for transducers
• H04R 19/00 - Electrostatic transducers

Abstract

A communication system and method is disclosed. The system and method provides for acoustic echo cancellation. For instance, a processor implements a non-linear loudspeaker model to approximate loudspeaker performance. Using the model, a cancellation signal may be generated to ameliorate cross-talk between a loudspeaker and microphone to diminish an echo.

IPC Classes  ?

• H04M 9/08 - Two-way loud-speaking telephone systems with means for conditioning the signal, e.g.  for suppressing echoes for one or both directions of traffic
• H04R 3/02 - Circuits for transducers for preventing acoustic reaction

Abstract

A sensor assembly including a capacitive sensor, like a microelectromechanical (MEMS) microphone, and an electrical circuit therefor are disclosed. The electrical circuit includes a first transistor having an input gate connectable to the capacitive sensor, a second transistor having an input gate coupled to an output of the first transistor, a feedforward circuit interconnecting a back-gate of the second transistor and the output of the first transistor, and a filter circuit interconnecting the output of the first transistor and the input gate of the second transistor.

IPC Classes  ?

• H03F 1/22 - Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
• G01R 27/26 - Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• H03F 1/26 - Modifications of amplifiers to reduce influence of noise generated by amplifying elements
• H03F 3/187 - Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only in integrated circuits
• H03F 3/21 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
• H03F 3/213 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only in integrated circuits
• H04R 3/00 - Circuits for transducers

Abstract

A microphone can include an adapter housing. The adapter housing can include an opening and an outer acoustic port. The microphone can include an internal microphone assembly disposed at least partially within the adapter housing. The internal microphone assembly can include an internal housing having an internal acoustic port. The internal microphone assembly can include a plurality of contacts disposed on the internal housing. The contacts can be accessible through the opening of the adapter housing. An interior of the internal housing can be acoustically coupled to the outer acoustic port via the internal acoustic port.

IPC Classes  ?

• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 19/04 - Microphones

Abstract

A microphone assembly includes a substrate and a microelectromechanical systems (MEMS) die. The substrate comprises a top layer and a bottom layer. The top layer comprises a layer of solder mask material spanning across at least a portion of the substrate and one or more standoffs formed of the solder mask material. The one or more standoffs and the layer of solder mask material comprising a single, contiguous structure. The MEMS die is disposed on the one or more standoffs and is coupled to the substrate via a bonding material. The bonding material forms an acoustic seal between the substrate and the MEMS die.

IPC Classes  ?

• H04R 19/04 - Microphones
• B81B 7/00 - Microstructural systems
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
• H04R 19/00 - Electrostatic transducers

Abstract

An acoustic device and method generates an acoustic signal by applying an excitation signal to a first coil disposed about an armature of an acoustic receiver. A second coil magnetically coupled to the first coil generates an electrical output signal in response to the excitation signal applied to the first coil, wherein the output signal of the second coil is indicative of a change in a state or operation of the receiver or acoustic device. In some embodiments, the first and second coils are wired independently of each other, and the acoustic device further includes an electrical circuit which determines the change in the acoustic performance based on a change in the electrical output signal of the second coil.

IPC Classes  ?

• H04R 11/02 - Loudspeakers
• H04R 7/16 - Mounting or tensioning of diaphragms or cones

Abstract

Methods and systems are disclosed herein for improvements relating to compressed automatic speech recognition (ASR) systems. The ASR system may comprise a compressed acoustic engine and an adaptive decoder. The adaptive decoder may be dynamically compiled based on characteristics of the compressed acoustic engine and a current state of the application device. In some embodiments, a dynamic command list is used to manage context-specific commands. Two or more commands recognized by the adaptive decoder may be confusable due to compression of the ASR system. Alternate commands may be determined that are semantically equivalent but phonetically different than the confusable commands to reduce classification error of the adaptive decoder. An alternate command may replace one or more of the confusable commands in the adaptive decoder. In some embodiments, a user interface is displayed to a user of the ASR system to select the alternate command for replacement in the decoder.

IPC Classes  ?

• G10L 15/187 - Phonemic context, e.g. pronunciation rules, phonotactical constraints or phoneme n-grams
• G10L 15/22 - Procedures used during a speech recognition process, e.g. man-machine dialog
• G06F 40/237 - Lexical tools

Abstract

A capacitive sensor assembly includes a capacitive transduction element and an electrical circuit disposed in the housing and electrically coupled to contacts on an external-device interface of the housing. The electrical circuit includes a sampling circuit having an operational sampling phase during which a voltage produced by the capacitive sensor is sampled by a sampling capacitor coupled to a comparator and an operational charging phase during which a second capacitor is charged by a charge and discharge circuit until the output of the comparator changes state, wherein the output of the sampling circuit is a pulse width modulated signal representative of the voltage on the input of the sampling circuit during each sample period. The output of the sampling circuit can be coupled to a delta-sigma analog-to-digital (A/D) converter.

IPC Classes  ?

• H04R 3/00 - Circuits for transducers
• G01D 5/00 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
• H04R 19/04 - Microphones
• G01D 5/24 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance

Abstract

A microphone assembly includes a housing including a base, a cover, and a sound port. The microphone assembly further includes an acoustic transducer and an electrical circuit, both of which are disposed in an enclosed volume of the housing. The transducer and electrical circuit work in concert to convert sound waves into a processed digital audio signal. The electrical circuit is configured to process digital data in a series of frames that correspond to a fixed period in time. The electrical circuit is further configured to reduce noise in the resulting signal by varying the current draw required in a randomized or pseudo-randomized fashion between adjacent frames of digital data.

IPC Classes  ?

• H04R 3/00 - Circuits for transducers
• H04R 1/08 - Mouthpieces; Attachments therefor
• G06F 3/00 - Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
• G06F 3/05 - Digital input using the sampling of an analogue quantity at regular intervals of time
• G06F 3/16 - Sound input; Sound output

Abstract

A diaphragm for use in a transducer, the diaphragm including a flexible layer configured to deflect in response to changes in a differential pressure. The flexible layer includes a lattice grid. The lattice grid includes a first plurality of substantially elongate openings oriented along an axis and a second plurality of substantially elongate openings extending generally parallel to the axis. The second plurality of openings is substantially offset from the first plurality of openings in a direction substantially parallel to the axis. The first plurality of openings and the second plurality of openings define a first plurality of spaced apart grid beams extending between and substantially parallel to the axis and a second plurality of spaced apart grid beams extending substantially perpendicular to the axis. The second plurality of grid beams is configured to connect adjacent ones of the first plurality of grid beams.

IPC Classes  ?

• H04R 19/00 - Electrostatic transducers
• H04R 19/04 - Microphones
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• H04R 7/16 - Mounting or tensioning of diaphragms or cones

Abstract

A MEMS transducer for a microphone includes a closed chamber, an array of conductive pins, a dielectric grid, and a diaphragm. The closed chamber is at a pressure lower than atmospheric pressure. The array of conductive pins is in a fixed position in the closed chamber, distributed in two dimensions, and have gaps formed therebetween. The dielectric grid is positioned within the closed chamber, includes a grid of dielectric material positioned between the gaps of the array of conductive pins, and is configured to move parallel to the conductive pins. The diaphragm is configured to form a portion of the closed chamber and deflect in response to changes in a differential pressure between the pressure within the closed chamber and a pressure outside the transducer. The diaphragm is configured to move the dielectric grid relative to the array of conductive pins in response to a change in the differential pressure.

IPC Classes  ?

• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• H04R 1/32 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only

Abstract

A microelectromechanical systems (MEMS) die includes a substrate, a back plate, and a diaphragm. The back plate is coupled to the substrate and includes a dielectric layer and an electrode. The electrode is coupled to the dielectric layer and defines an opening that exposes a central portion of the dielectric layer. The diaphragm is oriented parallel to the back plate and is spaced apart from the back plate. In one implementation, a diameter of the opening is greater than or equal to 1/10 of the diameter of the diaphragm.

IPC Classes  ?

• H04R 19/00 - Electrostatic transducers
• H04R 19/04 - Microphones
• H04R 7/04 - Plane diaphragms
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 3/00 - Circuits for transducers
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Abstract

An acoustic transducer for generating electrical signals in response to acoustic signals includes a transducer substrate, a back plate, and a diaphragm assembly. The diaphragm assembly includes a first diaphragm and a second diaphragm coupled thereto. The second diaphragm is positioned closer to the back plate than the first diaphragm. The second diaphragm includes a plurality of diaphragm apertures configured to allow air to pass through the second diaphragm. Each of the back plate and the first diaphragm are coupled to the transducer substrate at their periphery. In an embodiment, the transducer includes a post coupled to the first diaphragm and the second diaphragm, the post configured to prevent movement of the second diaphragm relative to the first diaphragm in a direction substantially perpendicular to the second diaphragm.

IPC Classes  ?

• H04R 7/26 - Damping by means acting directly on free portion of diaphragm or cone
• H04R 7/04 - Plane diaphragms
• H04R 19/04 - Microphones
• H04R 1/04 - Structural association of microphone with electric circuitry therefor

Abstract

A microphone assembly includes a substrate, an acoustic transducer, an integrated circuit, and a cover couples to the substrate to enclose a back volume of the microphone assembly in which the acoustic transducer and the integrated circuit are disposed. The acoustic transducer includes a back plate and a diaphragm oriented parallel to the back plate disposed over an aperture in the substrate to receive acoustic signals. The cover is a metallic material with a thickness and a corresponding thermal diffusivity to attenuate incoming radio-frequency signals. The attenuation of the radio-frequency signals prevents ambient noise detectable by the microphone assembly.

IPC Classes  ?

• H04R 19/04 - Microphones
• H04R 1/08 - Mouthpieces; Attachments therefor
• H04R 1/04 - Structural association of microphone with electric circuitry therefor

Abstract

Systems and methods are disclosed for processing audio for an electronic device, the electronic device including an integrated speech enhanced voice trigger module that can provide an improvement over existing voice trigger modules by effectively combining together voice trigger techniques and speech enhancement techniques. In various embodiments, the integrated speech enhanced voice trigger module is configured to reduce mismatches in types and levels of noise that are encountered during both voice trigger training and runtime. This can result in a higher true positive rate (TPR), a lower false alarm (FA), and a lower impostor acceptance rate (IAR). The disclosed integrated speech enhanced voice trigger module can be used be used with an electronic device having a single microphone or a plurality of microphones.

IPC Classes  ?

• G10L 21/0232 - Processing in the frequency domain
• G10L 21/0224 - Processing in the time domain
• G10L 15/06 - Creation of reference templates; Training of speech recognition systems, e.g. adaptation to the characteristics of the speaker's voice
• G10L 15/22 - Procedures used during a speech recognition process, e.g. man-machine dialog

Abstract

A microelectromechanical system (MEMS) transducer for integration in a microphone assembly is designed to produce heat-generated acoustic signals. The MEMS transducer generally comprises a substrate having an aperture, a transduction element located at least partially over the aperture and coupled to the substrate, electrical contacts coupled to the transduction element, and a resistor integrated with the substrate or the transduction element. The resistor is coupled to electrical contacts that are electrically isolated from the contacts of the MEMS transducer or transduction element. The transduction element includes an insulating material coupled to the substrate. The transduction element comprises a fixed electrode and a movable electrode located at least partially over the aperture of the substrate. The fixed electrode or the moving electrode is formed on the insulating material. The resistor can be formed on the insulating material or suspended from the insulating material.

IPC Classes  ?

• H04R 19/00 - Electrostatic transducers
• H04R 19/04 - Microphones
• B81B 7/00 - Microstructural systems
• H04R 29/00 - Monitoring arrangements; Testing arrangements
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 3/00 - Circuits for transducers

Abstract

Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a receiver housing with a first internal volume and a second internal volume, a first diaphragm separating the first internal volume into a first front volume and a first back volume such that the first front volume has a first sound outlet port, a second diaphragm separating the second internal volume into a second front volume and a second back volume such that the second front volume has a second sound outlet port, a motor disposed at least partially inside the housing such that the motor including an armature mechanically coupled to both the first diaphragm and the second diaphragm, an acoustic seal between the first front volume and the second back volume such that the acoustic seal accommodates the mechanical coupling of the armature to one of the first diaphragm or the second diaphragm.

IPC Classes  ?

• H04R 11/02 - Loudspeakers
• H04R 1/10 - Earpieces; Attachments therefor
• H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
• H04R 9/04 - Construction, mounting, or centering of coil

Abstract

Sound-producing acoustic receivers are disclosed. The acoustic receiver includes a housing, a first diaphragm, and a motor. The housing has an internal volume separated by the first diaphragm into a first front volume and a first back volume such that the first front volume has a first sound outlet. The first diaphragm includes a first paddle movable about a first hinge. The motor is disposed in the housing and includes an armature mechanically coupled to the first paddle. The first hinge is located between opposite ends of the first paddle such that actuation of the armature pivots both ends of the first paddle about the hinge.

IPC Classes  ?

• H04R 11/02 - Loudspeakers
• H04R 1/10 - Earpieces; Attachments therefor

Abstract

Two coils are wrapped in one of numerous different implementations. In one implementation, the two coils are wrapped about a portion of a bobbin that has at least three flanges. The first coil is disposed about a first portion of the bobbin between the first flange and the second flange, and a second coil is disposed about a second portion of the bobbin between the second flange and the third flange.

IPC Classes  ?

• H04R 9/06 - Loudspeakers
• H04R 9/04 - Construction, mounting, or centering of coil
• H04R 11/02 - Loudspeakers
• H04R 1/02 - Casings; Cabinets; Mountings therein
• H04R 3/12 - Circuits for transducers for distributing signals to two or more loudspeakers

Abstract

A one-piece sound port adapter for a microphone assembly includes a body member configured to be fitted over a sound port of the microphone assembly. The body member includes an acoustic channel defined in part by a cavity having a sound inlet and a sound outlet, where the sound outlet is acoustically coupled to the sound port. A wall portion of the body member extends into the cavity and configured to modify an acoustic property of the acoustic channel. When mounted, the one-piece sound port adapter converts the microphone assembly from a top or bottom port microphone assembly to a side-port microphone assembly.

IPC Classes  ?

• H04R 19/00 - Electrostatic transducers
• H04R 1/08 - Mouthpieces; Attachments therefor
• B81B 7/00 - Microstructural systems
• H04R 1/02 - Casings; Cabinets; Mountings therein
• H04R 1/04 - Structural association of microphone with electric circuitry therefor

Abstract

According to some embodiments, the present disclosure is directed to a printed circuit board for a microphone assembly that includes a top layer structured for a MEMS transducer to be mounted thereon, a bottom layer, at least one edge, a ground plane, and a conductor electrically connected to the ground plane and the bottom layer. The MEMS transducer includes a transducer substrate, a back plate and a diaphragm. The conductor extends vertically from the top layer to the bottom layer of the printed circuit board, and horizontally along a portion of a length of at least one edge of the printed circuit board. The printed circuit board includes two short edges and two long edges, and the conductor is connected to at least one of the four edges.

IPC Classes  ?

• H05K 1/02 - Printed circuits - Details
• B81B 7/00 - Microstructural systems
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

Acoustic transducers for generating electrical signals in response to acoustic signals are disclosed. In some embodiments, an acoustic transducer includes an at least partially evacuated hermetically sealed cavity defined in part by a first diaphragm. The acoustic transducer also includes a backplate disposed at least partially within the cavity. The cavity having a pressure lower than atmospheric pressure. The acoustic transducer further includes a pressure sensor coupled to the backplate and configured to sense the pressure in the cavity.

IPC Classes  ?

• H04R 1/00 - LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS - Details of transducers
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 19/04 - Microphones
• H04R 7/02 - Diaphragms for electromechanical transducers; Cones characterised by the construction
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
• G01L 21/12 - Vacuum gauges by measuring variations in the heat conductivity of the medium, the pressure of which is to be measured measuring changes in electric resistance of measuring members, e.g. of filaments; Vacuum gauges of the Pirani type

Abstract

Sound-producing acoustic receivers and hearing devices implementing such receivers are disclosed. The acoustic receiver includes a receiver housing, an output port, a receiver motor assembly, and a transducer. The receiver housing includes a diaphragm that separates the receiver housing into a back volume and a front volume. The output port is located on the receiver housing and acoustically coupled to the front volume of the receiver housing. The receiver motor assembly is disposed in the back volume and is mechanically coupled to the diaphragm. The transducer is fastened to the receiver housing.

IPC Classes  ?

• H04R 25/00 - Deaf-aid sets
• H04R 19/04 - Microphones
• A61B 8/02 - Measuring pulse or heart rate
• A61B 8/04 - Measuring blood pressure

Abstract

A sensor assembly includes a housing having an external-device interface and a sound port to an interior to the housing. A transducer and an electrical circuit are disposed within the housing. The transducer is acoustically coupled to the sound port while the electrical circuit is electrically coupled to the transducer and the external-device interface. A cavity is formed in a portion of the sensor assembly. In some embodiments, the portion is a base of the housing of the sensor assembly. In other embodiments, the portion is a sound port adapter coupled to the sensor assembly. In any case, the cavity is acoustically coupled to the interior of the housing via the sound port and includes a wall portion structured to modify an acoustic property of the sensor assembly.

IPC Classes  ?

• H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
• H04R 1/04 - Structural association of microphone with electric circuitry therefor

Abstract

The disclosure describes devices and methods of providing a DC bias voltage in a microphone assembly. Particularly, one implementation of such a device may be implemented on an integrated circuit that includes a direct current (DC) bias circuit. The DC bias circuit may be coupled to a transducer and configured to supply a DC bias signal to the transducer. The DC bias circuit includes a multi-stage charge pump and a low pass filter (LUFF) circuit. The multi-stage charge pump includes transistors that are fabricated with deep trench isolation (DTI).

IPC Classes  ?

• H04R 19/00 - Electrostatic transducers
• H04R 19/04 - Microphones
• H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode

Abstract

A microphone assembly including an acoustic transducer configured to generate an electrical signal responsive to acoustic activity, an integrated circuit electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity, a cover, and a substrate. The substrate including a first surface and a second surface to which the cover is coupled. The second surface is disposed at a perimeter of the substrate and the first surface is raised with respect to the second surface. The cover is coupled to the substrate to form a housing in which the transducer and the integrated circuit are disposed.

IPC Classes  ?

• H04R 19/04 - Microphones
• H04R 1/08 - Mouthpieces; Attachments therefor
• H04R 1/04 - Structural association of microphone with electric circuitry therefor

Abstract

A force feedback actuator includes a pair of electrodes and a dielectric member. The pair of electrodes are spaced apart from one another to form a gap. The dielectric member is disposed at least partially within the gap. The dielectric member includes a first portion having a first permittivity and a second portion having a second permittivity that is different from the first permittivity. The dielectric member and the pair of electrodes are configured for movement relative to each other.

IPC Classes  ?

• H04R 19/00 - Electrostatic transducers
• H04R 19/04 - Microphones
• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
• H04R 1/04 - Structural association of microphone with electric circuitry therefor

Abstract

An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.

IPC Classes  ?

• H04R 19/04 - Microphones
• H04R 7/14 - Non-planar diaphragms or cones corrugated, pleated, or ribbed
• H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery

Abstract

An acoustic transducer comprises a transducer substrate defining an aperture therein. A diaphragm is disposed on the transducer substrate. The diaphragm comprises a diaphragm inner portion disposed over the aperture such that an outer edge of the diaphragm inner portion is located radially inwards of a rim of the aperture, the diaphragm inner portion having a first stress. A diaphragm outer portion extends radially from the outer edge of the diaphragm inner portion to at least the rim of the aperture, the diaphragm outer portion having a second stress different from the first stress.

IPC Classes  ?

• H04R 11/04 - Microphones
• H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers

Abstract

The disclosure describes devices and methods for starting up a microphone assembly. The device may be implemented on an integrated circuit that includes a direct current (DC) bias circuit. The DC bias circuit may be coupled to a transducer and configured to supply a DC bias signal to the transducer. The DC bias circuit includes a multi-stage charge pump and a low pass filter (LPF) circuit. The LPF circuit includes an adjustable resistance and a capacitor. A resistance of the adjustable resistance may be reduced to reduce the settling time of the LPF while starting (e.g., turning on) the microphone assembly.

IPC Classes  ?

• H04R 19/04 - Microphones
• H03H 7/06 - Frequency selective two-port networks including resistors
• H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
• H04R 3/04 - Circuits for transducers for correcting frequency response
• H04R 1/04 - Structural association of microphone with electric circuitry therefor

Abstract

Microphone devices and methods for manufacturing microphone devices that include a substrate having a first surface and a second surface, a cover secured to the first surface of the substrate to form an enclosed back volume, an application specific integrated circuit (ASIC) embedded between the first surface and the second surface of the substrate, a microelectromechanical systems (MEMS) transducer mounted on the first surface of the substrate, and an inductor mounted on the first surface of the substrate.

IPC Classes  ?

• H04R 3/00 - Circuits for transducers
• H04R 19/04 - Microphones
• H01F 27/40 - Structural association with built-in electric component, e.g. fuse
• H04R 1/04 - Structural association of microphone with electric circuitry therefor
• H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Abstract

A system and method in an audio signal electrical circuit including a feedback loop with a digital filter coupled to a current digital to analog converter (IDAC) includes providing an output signal from the IDAC to analog elements of the audio signal electrical circuit, the output signal from the IDAC based upon a reference signal input to the IDAC when an output of the digital filter is not input to the IDAC. The system and method also include comparing an output signal of the audio signal electrical circuit to a reference, and calibrating the audio signal electrical circuit to correspond the output signal of the audio signal electrical circuit to the reference. Calibration of the audio signal electrical circuit enables more precise control of a cut-off frequency of a microphone signal when the output of the digital filter is input to the IDAC.

IPC Classes  ?

• H04R 3/04 - Circuits for transducers for correcting frequency response
• H03G 5/28 - Automatic control in frequency-selective amplifiers having semiconductor devices
• H03G 3/30 - Automatic control in amplifiers having semiconductor devices

Abstract

An acoustic transducer comprises a transducer substrate having an aperture defined therethrough. At least one diaphragm is disposed on the transducer substrate over the aperture. A back plate is disposed on the transducer substrate and axially spaced apart from the at least one diaphragm. A perimetral support structure is disposed circumferentially between the at least one diaphragm and the back plate at a radially outer perimeter of the back plate. A plurality of perimetral release holes are defined circumferentially through at least one of the at least one diaphragm or the back plate proximate to and radially inwards of the perimetral support structure, at least a portion of the plurality of perimetral release holes defining a non-circular shape.

IPC Classes  ?

• H04R 1/08 - Mouthpieces; Attachments therefor

Abstract

A microphone assembly includes an acoustic filter with a first highpass cut-off frequency. The microphone assembly additionally includes a forward signal path and a feedback signal path. The forward signal path is configured to amplify or buffer an electrical signal generated by a transducer in response to sound and to convert the electrical signal to a digital signal. The feedback signal path is configured to generate a digital control signal based on the digital signal and to generate and output a sequence of variable current pulses based on the digital control signal. The variable current pulses suppress frequencies of the electrical signal below a second highpass cut-off frequency, higher than the first highpass cut-off frequency.

IPC Classes  ?

• H04R 3/00 - Circuits for transducers
• H04R 19/04 - Microphones
• H04R 19/00 - Electrostatic transducers
• G06F 3/16 - Sound input; Sound output
• H04R 3/02 - Circuits for transducers for preventing acoustic reaction
• H04R 3/06 - Circuits for transducers for correcting frequency response of electrostatic transducers

Abstract

A MEMS transducer includes a transducer substrate, a counter electrode, and a diaphragm. The counter electrode is coupled to the transducer substrate. The diaphragm is oriented substantially parallel to the counter electrode and is spaced apart from the counter electrode to form a gap. A back volume of the MEMS transducer is an enclosed volume positioned between the counter electrode and the diaphragm. A height of the gap between the counter electrode and the diaphragm is less than two times the thermal boundary layer thickness within the back volume at an upper limit of the audio frequency band of the MEMS transducer.

IPC Classes  ?

• H04R 1/02 - Casings; Cabinets; Mountings therein

Abstract

An acoustic receiver includes a first receiver subassembly having a bottom housing plate with a motor assembly fastened thereto, and a second receiver subassembly having a closed-ended receiver housing sidewall fastened to the bottom housing plate that includes at least one sidewall opening where a portion of the acoustic receiver is disposed in the at least one sidewall opening.

IPC Classes  ?

• H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
• H04R 9/06 - Loudspeakers
• H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
• H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery