A print tile for a printhead assembly in a printer includes a base plate, a printhead, a nozzle plate attached to the printhead, and a plurality of mounting elements. The base plate has an upper surface, a lower surface opposite the upper surface, and a slot extending through the base plate. The printhead has a lower part received in the slot and including a plurality of nozzles from which a print material is to be ejected in a printing operation. The plurality of mounting elements mounts the nozzle plate to the base plate, while permitting adjustment of a position of the printhead relative to the base plate. The base plate includes first and second adjustable lifts correspondingly under first and second end portions of the nozzle plate, to adjust positions of the first and second end portions of the nozzle plate independently one from another.
Embodiments of inkjet printers, and methods of operating inkjet printers, are described herein. The inkjet printers include a substrate support a print support comprising a printhead assembly movably coupled to a printhead assembly support disposed across the substrate support, and a printhead management unit comprising a first printhead cleaner having a first areal extent and a second printhead cleaner having a second areal extent different from the first areal extent. The first and second printhead cleaner can be used in cleaning processes to optimize the cleaning process.
A manufacturing system includes a dispenser unit movably coupled to a support, the dispenser unit comprising a location sensor and a reference detector; a test unit comprising a surface for receiving material from the dispenser unit and an imaging device for imaging the material on the surface; a location reference mounted to a stationary component of the manufacturing system; and a controller configured to control the dispenser unit and the reference detector to detect the location reference; calibrate a position of the dispenser unit based on detecting the location reference; control the test unit to image the material on the surface; control the dispenser unit and the reference detector to detect an aspect of the material on the surface; compare the image of the material captured by the test unit with the aspect of the material detected by the reference detector; and calibrate the test unit based on the comparison.
A inkjet printer is described herein that has a substrate staging portion with a discontinuous gas float system comprising a plurality of gas float members separated by gaps. The gaps enable interoperation with an end effector to deposit and retrieve substrates on a gas cushion provided by the gas float members.
H10K 71/13 - Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
A printhead assembly for an inkjet printer is described herein. The printhead assembly includes a printhead having a plurality of nozzles, a nozzle plate attached to the printhead, and a base plate attached to the nozzle plate by at least three fasteners that provide independent positioning of the nozzle plate with respect to the base plate in three independent dimensions. The printhead assembly has fluid connections between the printheads and a fluid manifold that has alignment features. The printhead assembly also has a tile structure that couples to the base plate, the tile structure having a first section flexibly coupled to a second section.
A reservoir for a print material in a printer includes an inner vessel to contain the print material, a housing in which the inner vessel is received, a weight sensor, a source tube, a drain tube and a pressure control port. The weight sensor is disposed between a bottom portion of the inner vessel and a bottom portion of the housing, and supporting the inner vessel. The source tube extends through the housing to supply the print material to the inner vessel. The drain tube extends through the housing to discharge the print material from the inner vessel. The pressure control port extends through the housing to supply a pressurized gas for pressurizing an interior of the housing to cause the print material in the inner vessel to be discharged through the drain tube.
A substrate holder for an inkjet printer is described herein. The substrate holder has a contact member having a contact surface and a carriage surface opposite from the contact surface and a carriage coupled to the carriage surface, the carriage having a direction of motion extending in a first direction. The carriage has a base member and a linear slide mechanism coupling the base member to the contact member, the linear slide mechanism oriented with a direction of linear displacement at an acute angle with the direction of motion in a plane parallel to the contact surface.
B41J 11/58 - Supply holders for sheets or fan-folded webs, e.g. shelves, tables, scrolls, pile holders
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
8.
TEST SUBSTRATE FOR INKJET PRINTER DROP PLACEMENT ANALYZER
A substrate for an inkjet printer is described herein. The substrate comprises a material selected to provide high contrast reflected light and having a print material receiving surface with a neutral response to the print material.
B41J 2/005 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
9.
DROP PLACEMENT ANALYZER FOR INKJET PRINTING SYSTEM
A drop placement analyzer for an inkjet printer is described herein. The drop placement analyzer comprises a film support that has an opaque, optically non-interfering vacuum surface for immobilizing a film against the optically non-interfering vacuum surface and photographing drops disposed on the film from the same side of the film on which the drops are disposed.
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
A substrate preparation chamber is described herein. The substrate preparation chamber comprises an enclosure, a rotatable substrate support disposed within the enclosure, and an atmosphere replacement system coupled to the enclosure. The substrate preparation chamber can be used with an inkjet printing system, where the substrate preparation chamber is coupled to a printing enclosure such that a door is operable to place the enclosure of the substrate preparation chamber in fluid communication with the printing enclosure.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
C23C 14/56 - Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
A deposition device is described. The deposition device has a substrate support and an imaging system disposed to image a portion of a substrate positioned on the substrate support. The imaging system comprises an LED light source and an imaging unit, and is coupled to a deposition assembly disposed across the substrate support.
A61B 1/04 - Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
A printing system is described herein. The printing system has a massive base disposed on a flotation support, a flotation substrate support disposed on the base, a print support comprising a printhead assembly support and an auxiliary support, a printhead assembly coupled to the printhead assembly support, and a printhead supply assembly coupled to the auxiliary support.
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
B41J 29/00 - TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS - Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
Methods of controlling an inkjet printer are disclosed. The methods include defining shape information using a design graphics system. The shape information includes fill colors for shapes, and may include colors for edges. The colors are interpreted as one or more attributes, such as film thickness or material, for a film to be formed on a substrate.
B05B 12/12 - Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material discharged, of ambient medium or of target responsive to conditions of ambient medium or target, e.g. humidity, temperature
B41J 2/105 - Ink jet characterised by jet control for binary-valued deflection
B41J 3/36 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for portability
H04N 1/32 - Circuits or arrangements for control or supervision between transmitter and receiver
Methods and apparatus are described herein for measurement of droplets dispensed from a printhead of an inkjet printer onto a substrate. An inkjet printer described herein comprises a printhead assembly comprising a printhead and an imaging system, the imaging system comprising a camera and a strobed LED source; and a deposition unit for positioning a substrate to receive droplets dispensed from the printhead and for imaging the droplets using the imaging system and the strobed LED source. Methods described herein comprise dispensing droplets of a liquid from a printhead of a printhead assembly of an inkjet printer onto a substrate; positioning the substrate with respect to an imaging system coupled to the printhead assembly, the imaging system comprising a camera and an LED light source; and imaging the droplets on the substrate by relatively scanning the substrate and the imaging system and strobing the LED light source.
A printer includes a substrate support, a printhead assembly, first and second actuators, and a controller. The printhead assembly deposits material on a substrate supported on the substrate support. The first actuator is disposed at a side of the substrate support and coupled to a first linear track disposed along the side of the substrate support and oriented in a first direction. The second actuator is disposed at an end of the substrate support and coupled to a second linear track disposed along the end of the substrate support and oriented in a second direction perpendicular to the first direction. The first and second actuators are positioned to engage with the substrate simultaneously. The controller moves the first and second actuators together to rotate the substrate.
B41J 25/304 - Bodily-movable mechanisms for print heads or carriages movable towards or from paper surface
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B41J 13/00 - Devices or arrangements specially adapted for supporting or handling copy material in short lengths, e.g. sheets
Methods of processing substrates are described herein that include depositing a conductive material on a substrate, applying a primer material soluble in water or aqueous acid onto the conductive material, inkjet printing an acid-resistant patterning material reactive with the primer material onto the primer material according to a pattern to form an acid-resistant mask, and exposing the substrate to an acid to etch exposed portions of the conductive material.
A system for drying material deposited on a substrate to form a solid, film layer includes a temperature-controlled substrate support apparatus to support a substrate; and an electromagnetic energy transmission system positioned to direct electromagnetic energy along a path incident on one or more locations on a surface of the substrate when supported by the substrate support apparatus. The electromagnetic energy transmission system is configured to transmit the electromagnetic energy in an amount sufficient to excite molecules of a liquid material deposited at the one or more locations of the substrate.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
A deposition device is described. The deposition device has a substrate support and a laser imaging system disposed to image a portion of a substrate positioned on the substrate support. The laser imaging system comprises a laser source and an imaging unit, and is coupled to a deposition assembly disposed across the substrate support.
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
B05D 3/06 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
A display device that uses one or more light coupling layers is described herein, along with methods of making such devices. One device includes an array of blue light emitting elements formed on a substrate, a light coupling material formed over the array of blue light emitting elements, and a quantum dot light converting material disposed in a portion of a pixel structure formed over the array of blue light emitting elements. The light coupling material has a high refractive index and may be, or include, a polymer material.
H01L 31/0352 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
An inkjet printer is disclosed that has a substrate support; a calibration module disposed adjacent to the substrate support and comprising a stage member; and a print assembly disposed across the substrate support, the print assembly comprising a printhead and a calibration imaging device positionable to face the stage member.
Methods of processing substrates are described herein that include depositing a patterned polymer precursor layer by inkjet printing on a substrate comprising a dielectric material, curing the precursor layer to form a patterned polymer layer, and exposing the substrate, with the patterned polymer layer, to a remote plasma etch chemistry selective to the dielectric material. These methods can be performed on display substrates, particularly OLED and/or quantum dot display substrates.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
22.
PRINTING SYSTEM, PROCESS CHAMBER AND PRINTING METHOD FOR HANDLING SUBSTRATES IN DIFFERENT ORIENTATIONS
A printing system includes process chambers arranged along a conveyance path for deposition and post-deposition processing of print material on a substrate. Each process chamber has a substrate support with a configuration associated with a first format and a second format. An input rotation chamber is upstream of the process chambers for selectively rotating the substrate from a first orientation associated with the first format to a second orientation associated with the second format. An output rotation chamber is downstream of the process chambers for selectively rotating the substrate, with processed print material thereon, back to an orientation associated with the first format. The first format is one of a portrait format and a landscape format. The second format is the other of the portrait format and the landscape format.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A holder assembly includes a base, a drive assembly coupled to the base, a motive source connected to the drive assembly, a vertical force applicator connected to the drive assembly along a connection edge thereof, and a gripping member coupled to the base, the gripping member having a contact surface coupled to a vacuum source, wherein the drive assembly has a first position with the flattening member engaged with the contact surface and a second position with the flattening member positioned away from the contact surface.
B65H 5/08 - Feeding articles separated from piles; Feeding articles to machines by grippers, e.g. suction grippers
B25J 15/06 - Gripping heads with vacuum or magnetic holding means
B65G 47/91 - Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
B65G 49/05 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
B65H 3/08 - Separating articles from piles using pneumatic force
B65H 5/14 - Feeding articles separated from piles; Feeding articles to machines by grippers, e.g. suction grippers - Details of grippers; Actuating mechanisms therefor
An inkjet printer has a print assembly and a print material feed system comprising a first circulation circuit and a second circulation circuit, the first circulation circuit fluidly coupled between the second circulation circuit and the print assembly.
B41J 2/005 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
An inkjet printing system with a droplet measurement apparatus is described herein. The droplet measurement apparatus has a light source with a collimating optical system, an imaging device disposed along an optical path of the collimating optical system, and a droplet illumination zone in the optical path of the collimating optical system, the droplet illumination zone having a varying droplet illumination location, wherein the light source, the imaging device, or both are adjustable to place a focal plane of the imaging device at the droplet illumination location. The droplet measurement apparatus is structured to accommodate at least a portion of a dispenser of the printing system within the droplet illumination zone.
An inkjet printer is described. The inkjet printer has a gas cushion substrate support; a print assembly comprising a dispenser with an ejection surface facing the gas cushion substrate support; and a proximity sensor disposed in a surface of the gas cushion substrate support facing the ejection surface. A method is described that includes disposing a workpiece on a gas cushion support of an inkjet printer; supporting the workpiece on a gas cushion above a surface of the gas cushion support; detecting a distance of the workpiece from the surface of the gas cushion support; determining a difference between the distance and a target distance; comparing the difference to a tolerance; and adjusting the distance of the workpiece from the surface of the gas cushion support based on the comparison.
A system comprises a floatation table comprising a plurality of ports to flow gas sufficient to produce a gas bearing to float a substrate over the floatation table; a fluidic network coupled to supply gas to the plurality of ports of the floatation table; and a controller configured to control the fluidic network to independently control flows of gas through ports of the plurality of ports disposed in each of a first zone, a second zone, and a third zone of the floatation table. The first, second, and third zones are defined by sections of the floatation table extending parallel to a direction the substrate is conveyed along the floatation table. The first zone is defined by a central section of the floatation table disposed between two sections defining the second zone, and the first and second zones are disposed between two sections defining the third zone.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B05B 13/02 - Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
28.
INKJET PRINTER WITH TEMPERATURE CONTROLLED SUBSTRATE SUPPORT
An inkjet printer is described. The inkjet printer has a gas cushion substrate support having a metal support surface; a print assembly with a dispenser having ejection nozzles facing the support surface; a gas source fluidly coupled to the gas cushion substrate support by a gas conduit; and a thermal control system coupled to the gas conduit.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
In a printing method, at least one image of a substrate supported in a printing system is acquired. An actual position of a first alignment feature on the substrate in a frame of reference of the printing system is determined based on the at least one image. Expected positions of second alignment features on the substrate are determined based on the actual position of the first alignment feature. Actual positions of the second alignment features in the frame of reference of the printing system are determined based on the at least one image and the expected positions of the second alignment features. Target positions of print regions on the substrate are determined based on the actual positions of the second alignment features. Ejection of print material onto the substrate in the print regions is controlled based on the target positions of the print regions.
A mechanism is described that features a body with three link points, each with a rigid adjustable length link member coupling the link point to a ground using biaxial rotary couplings giving rotation orientation to position the body in three dimensions relative to the three grounds. An inkjet printer is also described using the mechanism with a substrate support.
B05C 13/00 - Means for manipulating or holding work, e.g. for separate articles
B05C 11/00 - Component parts, details or accessories not specifically provided for in groups
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A print material includes a vinylic molecule, a vinylic cross-linker molecule having a plurality of vinyl groups, a quantum dot, a light-scattering particle having a surface composition, and a dispersant having a chemical affinity matched to the surface composition. Methods of making and using such print materials are also described.
A printing system includes a substrate support, a printhead assembly positioned facing the substrate support, and an imager. The printhead assembly includes a plurality of dispensing nozzles extending in an ejection direction towards the substrate support and a plurality of marks. The imager is movable relative to the printhead assembly and oriented in a direction opposite to the ejection direction for capturing at least one image including the plurality of marks indicating positions of the plurality of dispensing nozzles in the printhead assembly.
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
B41J 11/20 - Platen adjustments for varying the strength of impression, for a varying number of papers, for wear or for alignment
H04N 3/14 - Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
33.
INKJET PRINTER WITH SUBSTRATE HEIGHT POSITION CONTROL
An inkjet printer is described. The inkjet printer has a substrate holder assembly that includes a base member having a long axis in a first direction and a short axis in a second direction perpendicular to the first direction; a contact member coupled to the base member, the contact member having a long axis in the first direction and a short axis in the second direction; a holder carriage coupled to the base member; a linear extender coupled between the base member and the contact member and extending in a third direction intersecting with the first direction and the second direction from the base member toward the contact member; and a flex member coupled to the base member, extending in the second direction between the linear extender and the contact member, and having a flex direction in a direction perpendicular to the first direction and the second direction.
Embodiments described herein provide a print material, comprising a curable precursor mixture; and a plurality of light-scattering particles, wherein a droplet of the print material having diameter of about 30 μm has a maximum transmission haze at a wavelength less than about 500 nm and a transmission haze at an infrared wavelength up to about 1,600 nm that is less than 60% of the maximum transmission haze. In some cases, a polymer film having thickness of about 20 μm made from a print material has a maximum transmission haze at a wavelength less than about 500 nm and a transmission haze at an infrared wavelength up to about 1,600 nm that is less than 60% of the maximum transmission haze. A process is also described, including applying the material above to a substrate as a print material and solidifying the print material to form a structure on the substrate.
Ligand-capped scattering nanoparticles, curable ink compositions containing the ligand-capped scattering nanoparticles, and methods of forming films from the ink compositions are provided. Also provided are cured films formed by curing the ink compositions and photonic devices incorporating the films. The ligands bound to the inorganic scattering nanoparticles include a head group and a tail group. The head group includes a polyamine chain and binds the ligands to the nanoparticle surface. The tail group includes a polyalkylene oxide chain.
A system may include a support surface for supporting a substrate, a plurality of first passages arranged to distribute flows of a first gas to establish a gas bearing to float the substrate above the support surface, and a plurality of second passages arranged to distribute flows of a second gas to convey the substrate along the support surface. A method may include floating a substrate above a support surface of a substrate support apparatus via a gas bearing; and while floating the substrate, conveying the substrate along the support surface by flowing gas toward a surface of the substrate and in a non perpendicular direction relative to the surface of the substrate.
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
37.
QUANTUM DOT COLOR FILTER INK COMPOSITIONS AND DEVICES UTILIZING THE SAME
Liquid ink compositions containing quantum dots for optoelectronic display applications are provided. Also provided are solid films formed by drying the ink compositions, optical elements incorporating the solid films, display devices incorporating the optical elements, and methods of forming the solid films, optical elements, and the devices. Liquid ink compositions and solid films made by drying the liquid ink compositions include one or more blue light-absorbing materials in combination with red light-emitting QDs or green light-emitting QDs.
A61K 47/69 - Medicinal preparations characterised by the non-active ingredients used, e.g. carriers or inert additives; Targeting or modifying agents chemically bound to the active ingredient the non-active ingredient being chemically bound to the active ingredient, e.g. polymer-drug conjugates the conjugate being characterised by physical or galenical forms, e.g. emulsion, particle, inclusion complex, stent or kit
38.
LIGHT-EMITTING DIODES WITH LIGHT COUPLING AND CONVERSION LAYERS
Light-emitting sub-pixels and pixels for micro-light-emitting diode-based displays are provided. Also provided are methods of fabricating individual sub-pixels, pixels, and arrays of the pixels. The sub-pixels include a double-layered film that includes a coupling layer disposed over a light-emitting diode and a light-emission layer disposed over the coupling layer.
G02F 1/1334 - Constructional arrangements based on polymer-dispersed liquid crystals, e.g. microencapsulated liquid crystals
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
39.
SYSTEMS AND METHODS FOR DRYING PATTERNED OLED FORMULATIONS
A drying chamber for drying a substrate patterned with display areas wetted by OLED materials dissolved or suspended in a volatile carrier liquid and separated from one another by dry boundary regions. A mask adjusts drying rate of the carrier liquid during vacuum extraction using vapor-transmissive areas opposite the wet areas and vapor-barrier regions opposite the dry boundary regions, or by confining the wet areas collectively in a chamber volume small enough to quickly saturate with the carrier liquid before vacuum extraction.
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
40.
PRINTHEAD ADJUSTMENT DEVICES, SYSTEMS, AND METHODS
A printing system includes a printhead carriage supporting a printhead and mounted to translate along a beam extending in an x-axis direction of an x-axis, y-axis, z-axis Cartesian coordinate system. A method of controlling the printing system includes sensing one or more of a rotational orientation of the printhead about the x-axis, y-axis, and the z-axis and a position of the printhead along the y-axis and z-axis. Based on the sensed one or more of the rotational orientation and the position, a position of one or more bearings arranged to support the printhead carriage on the beam is adjusted. Adjusting the position of the one or more bearings adjusts one or both of the rotational orientation of the printhead and the position of the printhead. Systems and methods relate to control of printing systems.
The present teachings relate to various embodiments of a curable ink composition, which once printed and cured form polymeric films on a substrate such as, but not limited by, an OLED device substrate. Various embodiments of the curable ink compositions comprise di(meth)acrylate monomers, as well as multifunctional crosslinking agents and curing kinetics control additives.
C09D 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
42.
LIGHT-EMITTING DEVICES WITH IMPROVED LIGHT OUTCOUPLING
Optoelectronic devices that include a composite film in a multilayered encapsulation stack are provided. Also provided are methods of forming the light reflection-modifying structures, as well as other polymeric device layers, using inkjet printing. The composite films include a first, lower refractive index domain and a second, higher refractive index domain.
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
43.
SYSTEMS AND METHODS FOR PROFILING MATERIAL LAYERS ON A SUBSTRATE
A method of profiling a material layer on a substrate, the method comprising detecting reflected light from a plurality of pixels on a substrate, each pixel of the plurality of pixels containing a layer of material; calculating a thickness of the layer of material of each of the plurality of pixels based on the detected reflected light, and outputting thickness profiles for the plurality of pixels in a spatially resolved arrangement relative to a plane of the substrate.
Organic ligand-capped quantum dots and curable ink compositions containing the organic ligand-capped quantum dots are provided. Also provided are thin films formed from the ink compositions.
H01L 33/06 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
45.
TWO-STEP PROCESS FOR FORMING CURED POLYMERIC FILMS FOR ELECTRONIC DEVICE ENCAPSULATION
Methods for increasing the degree of curing and/or reducing the volatile photoinitiator concentration in cured polymeric film, and particularly in cured polymeric films in a multilayered thin film encapsulation stack are provided. Also provided are highly crosslinked and/or low-outgassing thin polymeric films and encapsulation stacks made using the methods.
Method of analyzing film on a substrate comprises receiving three-dimensional data obtained from measurements of a plurality of pixels on a substrate, the plurality of pixels comprising film layers; extracting a plurality of parameters based on the received three-dimensional data, the plurality of parameters comprising at least an average thickness for the film layers of the pixels, area aperture ratios for the film layers of the pixels, and a pitch between pixels, wherein the extraction is based on a predetermined pattern for the pixels on the substrate; displaying a user interface comprising a graphical representation of parameters for the film layers of the pixels; and dynamically modifying the graphical representation of the parameters in response to user input of the displayed user interface, the dynamically modifying causing the displayed graphical images to appear as continuously changing.
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
B05B 1/02 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops
B41J 2/15 - Arrangement thereof for serial printing
B05B 12/12 - Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material discharged, of ambient medium or of target responsive to conditions of ambient medium or target, e.g. humidity, temperature
47.
COMPOSITIONS AND TECHNIQUES FOR FORMING ORGANIC THIN FILMS
The present teachings relate to various embodiments of a curable ink composition, which once printed and cured form high glass transition temperature polymeric films on a substrate such as, but not limited by, an OLED device substrate. Various embodiments of the curable ink compositions comprise di(meth)acrylate monomers, as well as multifunctional crosslinking agents.
This disclosure provides a high precision measurement system for rapid, accurate determination of height of a deposition source relative to a deposition target substrate. In one embodiment, each of two transport paths of an industrial printer mounts a camera and a high precision sensor. The cameras are used to achieve registration between split transport axes, and the positions of the high precision sensors are each precisely determined in terms of xy position. One of the high precision sensors is used to measure height of the deposition source, while another measures height of the target substrate. Relative z axis position between these sensors is identified to provide for precise z-coordinate identification of both source and target substrate. Disclosed embodiments permit dynamic, real-time, high precision height measurement to micron or submicron accuracy.
B05D 1/40 - Distributing applied liquids or other fluent materials by members moving relatively to surface
B05D 1/42 - Distributing applied liquids or other fluent materials by members moving relatively to surface by non-rotary members
B05B 13/04 - Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during operation
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The present teachings relate to various embodiments of ink compositions, which once printed and cured on a substrate form a continuous composite film layer that includes a first pattern of polymeric areas having a first refractive index (RI) interspersed within a second pattern of polymeric areas having an RI that is higher in comparison to the RI of the first pattern of polymeric areas. Various embodiments of composite thin films so formed on a substrate can be tuned so as to enhance light outcoupling or extraction for various light-emitting devices of the present teachings, such as, but not limited by, an OLED display or lighting device.
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
50.
MANUFACTURING ENCLOSURE ENVIRONMENTAL CONTAINMENT SYSTEMS AND METHODS
What is disclosed herein are embodiments of an enclosed manufacturing system configured to provide a controlled process environment for various articles of manufacture requiring a controlled process environment, and additionally to contain a process environment within the enclosure during periods of external access to the interior of the enclosed manufacturing system. Various embodiments of manufacturing systems of the present teaching can contain the environment within a manufacturing enclosure so as to minimize the interaction of an environment external to a manufacturing enclosure with the internal enclosure environment.
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 11/00 - Component parts, details or accessories not specifically provided for in groups
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
B08B 15/02 - Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area using chambers or hoods covering the area
F24F 3/16 - Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by ozonisation
51.
METHODS OF ETCHING CONDUCTIVE FEATURES, AND RELATED DEVICES AND SYSTEMS
A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically insulating surface of a substrate, depositing an anti-corrosive material layer over the conductive material layer, and depositing an etch-resist material layer over the anti-corrosive material layer. The etch-resist material layer may be deposited over the anti-corrosive material layer, and the anti-corrosive material layer forming a bi-component etch mask in a pattern resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer, the covered portions being positioned at locations corresponding to one or more conductive features of the device. A wet-etch process is performed to remove the exposed portions of the conductive material layer from the electrically insulating substrate, and the bi-component etch mask is removed to expose the remaining conductive material. Systems and devices relate to devices with patterned features.
C23F 1/08 - Apparatus, e.g. for photomechanical printing surfaces
C23F 1/18 - Acidic compositions for etching copper or alloys thereof
C23F 11/10 - Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
52.
DISPLAY DEVICES UTILIZING QUANTUM DOTS AND INKJET PRINTING TECHNIQUES THEREOF
Ink compositions for forming quantum dot-containing films are provided. Also provided are methods for forming the quantum dot-containing films via inkjet printing and photonic devices that incorporate the quantum dot-containing films as light-emitting layers. The ink compositions include the quantum dots, di(meth)acrylate monomers or a combination of di(meth)acrylate and mono(meth)acrylate monomers, and a one or more multifunctional crosslinking agents.
For various embodiments of a printhead assembly or ink stick assembly of the present teachings, each an ink stick assembly can be a self-contained assembly, of which a plurality of self-contained ink stick assemblies can be readily interchanged into a printing system during a printing process. Various embodiments of a self-contained ink stick assembly can have a fluidic system that can include a local ink reservoir, which can be in fluid communication with a bulk ink reservoir. Filling of a bulk ink reservoir can be done in a manual or automated mode. According to the present teachings, a bulk ink reservoir can have a volume sufficient to provide a continuous supply of ink to a local ink reservoir over the course of a printing process.
The present teachings relate to various embodiments of methods for forming organic polymer thin films on a device substrate using an ink composition, which once printed and cured forms an organic thin film on the substrate. The ink composition include one or more a neopentyl glycol-based di(meth)acrylate monomers.
C09D 11/10 - Printing inks based on artificial resins
C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
55.
TRANSPORT PATH CORRECTION TECHNIQUES AND RELATED SYSTEMS, METHODS AND DEVICES
A printer deposits material onto a substrate as part of a manufacturing process for an electronic product. At least one mechanical component experiences mechanical error, which is mitigated using transducers that equalize position of a transported thing, e.g., to provide an "ideal" conveyance path; a substrate conveyance system and/or a printhead conveyance system can each use transducers in this manner to improve precise droplet placement. In one embodiment, errors are measured in advance, with corrections being "played back" during production runs to mitigate repeatable transport path error. In a still more detailed embodiment, the transducers can be predicated on voice coils, which cooperate with a floatation table and floating, mechanical pivot assembly to provide frictionless, but mechanically-supported error correction.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an "ideal" conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
The present teachings relate to various embodiments of an ink composition, which once printed and cured forms an organic thin film on a substrate such as, but not limited by, an OLED device substrate. Various embodiments of the ink composition include a polyethylene glycol di(meth)acrylate in combination with an alkoxylated aliphatic di(meth)acrylate monomer, which acts as a controlled spreading modifier.
Improved manufacturing using a printer that deposits a liquid to fabricate a layer having specified thickness includes automated adjustment or print parameters based on ink or substrate characteristics which have been specifically measured or estimated. In one embodiment, ink spreading characteristics are used to select droplet size used to produce a particular layer, and/or to select a specific baseline volume/area or droplet density that is then scaled and/or adjusted to provide for layer homogeneity. In a second embodiment, expected per-droplet particulars are used to interleave droplets in order to carefully control melding of deposited droplets, and so assist with layer homogeneity. The liquid layer is then cured or baked to provide for a permanent structure.
B41J 2/005 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
B41J 2/015 - Ink jet characterised by the jet generation process
B41J 2/04 - Ink jet characterised by the jet generation process generating single droplets or particles on demand
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
59.
SYSTEMS AND METHODS FOR THERMAL PROCESSING OF A SUBSTRATE
Various materials can be deposited on an OLED substrate at various steps, in which the materials may subsequently require drying, baking and a combination thereof. Given the critical nature of drying and baking steps, the inventors of the present teachings have designed various modules for carrying out drying and baking which can be used as a process development module, and additionally for as a dedicated process module in production.
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
A printing system for printing a substrate can be housed in a gas enclosure, where the environment within the enclosure can be maintained as a controlled printing environment. The controlled environment can include control of the type of gas environment within the gas enclosure, the size and level particulate matter within the enclosure, control of the temperature within the enclosure and control of lighting. Various embodiments can include an X-axis and a Y-axis motion system utilizing linear air-bearing technology, as well as an ultrasonic floatation table as a substrate apparatus that are configured to substantially decrease excess thermal load within the enclosure. Additionally, an X-axis and a Y-axis motion system utilizing linear air-bearing motion systems, and an ultrasonic floatation table as a substrate apparatus are low-particle generating devices, which in conjunction with a filtration and circulation system can, provide a low-particle printing system environment.
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
F24F 3/16 - Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by ozonisation
B41J 2/165 - Prevention of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
The present teachings relate to various embodiments of an ink composition, which once printed and cured forms an organic thin film on a substrate such as, but not limited by, an OLED device substrate. Various embodiments of the ink compositions comprise polyethylene glycol di(meth)acrylate monomers, mono(meth)acrylate monomers and multifunctional crosslinking agents.
C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface- activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch resist mask.
G03F 1/92 - Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof prepared from printing surfaces
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
The present teachings disclose various embodiments of a printing system for printing a substrate, in which the printing system can be housed in a gas enclosure, where the environment within the enclosure can be maintained as a controlled printing environment. A controlled environment of the present teachings can include control of the type of gas environment within the gas enclosure, the size and level particulate matter within the enclosure, control of the temperature within the enclosure and control of lighting. Various embodiments of a printing system of the present teachings can include a bulk ink delivery system that can be external to a gas enclosure. A bulk ink delivery system according to the present teachings can supply ink to a local ink delivery system that is internal to the gas enclosure.
B41J 3/28 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for printing downwardly on flat surfaces, e.g. of books, drawings, boxes
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
Embodiments of an enclosed coating system according to the present teachings can be useful for patterned area coating of substrates in the manufacture of a variety of apparatuses and devices in a wide range of technology areas, for example, but not limited by, OLED displays, OLED lighting, organic photovoltaics, Perovskite solar cells, and organic semiconductor circuits. Enclosed and environmentally controlled coating systems of the present teachings can provide several advantages, such as: 1) Elimination of a range of vacuum processing operations such coating-based fabrication can be performed at atmospheric pressure. 2) Controlled patterned coating eliminates material waste, as well as eliminating additional processing typically required to achieve patterning of an organic layer. 3) Various formulations used for patterned coating with various embodiments of an enclosed coating apparatus of the present teachings can have a wide range of physical properties, such as viscosity and surface tension.
A droplet measurement system (DMS) is used in concern with an industrial printer used to fabricate a thin film layer of a flat panel electronic device. A clear tape serves as a printing substrate to receive droplets from hundreds of nozzles simultaneously, while an optics system photographs the deposited droplets through the tape (i.e., through a side opposite the printhead). This permits immediate image analysis of deposited droplets, for parameters such as per-nozzle volume, landing position and other characteristics, without having to substantially reposition the DMS or printhead. The tape can then be advanced and used for a new measurement. By providing such a high degree of concurrency, the described system permits rapid measurement and update of droplet parameters for printers that use hundreds or thousands of nozzles, to provide a real-time understanding of per-nozzle expected droplet parameters, in a manner that can be factored into print planning.
The present teachings relate to various embodiments of an ink composition, which once printed and cured forms an organic thin film on a substrate such as, but not limited by, an OLED device substrate. Various embodiments of the ink can be printed using an industrial inkjet printing system that can be housed in a gas enclosure, which gas enclosure defines an interior that has a controlled environment maintained as an inert and substantially low-particle process environment. Patterned printing of an organic thin film on a substrate, for example, but not limited by, an OLED device substrate, in such a controlled environment can ensure a high-volume, high yield process for a variety of OLED devices.
The present teachings relate to various embodiments of a gas enclosure system that can have a particle control system that can include a multi-zone gas circulation and filtration system, a low-particle-generating X-axis linear bearing system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. Various components of a particle control system can include a tunnel circulation and filtration system that can be in flow communication with bridge circulation and filtration system. Various embodiments of a tunnel circulation and filtration system can provide cross-flow circulation and filtration of gas about a floatation table of a printing system. Various embodiments of a gas enclosure system can have a bridge circulation and filtration system that can provide circulation and filtration of gas about a printing system bridge and related apparatuses and devices.
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
68.
TECHNIQUES FOR ARRAYED PRINTING OF A PERMANENT LAYER WITH IMPROVED SPEED AND ACCURACY
A repeatable manufacturing process uses a printer to deposits liquid for each product carried by a substrate to form respective thin films. The liquid is dried, cured or otherwise processed to form from the liquid a permanent layer of each respective product. To perform printing, each newly-introduced substrate is roughly mechanically aligned, with an optical system detecting sub-millimeter misalignment, and with software correcting for misalignment. Rendering of adjusted data is performed such that nozzles are variously assigned dependent on misalignment to deposit droplets in a regulated manner, to ensure precise deposition of liquid for each given area of the substrate. For example, applied to the manufacture of flat panel displays, software ensures that exactly the right amount of liquid is deposited for each "pixel" of the display, to minimize likelihood of visible discrepancies in the resultant display.
B41J 2/12 - Ink jet characterised by jet control testing or correcting charge or deflection
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
The present teachings disclose various embodiments of a printing system for printing a substrate, in which the printing system can be housed in a gas enclosure, where the environment within the enclosure can be maintained as a controlled printing environment. A controlled environment of the present teachings can include control of the type of gas environment within the gas enclosure, the size and level particulate matter within the enclosure, control of the temperature within the enclosure and control of lighting. Various embodiments of a printing system of the present teachings can include a Y-axis motion system and a Z-axis moving plate that are configured to substantially decrease excess thermal load within the enclosure by, for example, eliminating or substantially minimizing the use of conventional electric motors.
B05D 5/06 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
B41J 2/015 - Ink jet characterised by the jet generation process
H01J 9/38 - Exhausting, degassing, filling, or cleaning vessels
70.
GAS CUSHION APPARATUS AND TECHNIQUES FOR SUBSTRATE COATING
A coating can be provided on a substrate. Fabrication of the coating can include forming a solid layer in a specified region of the substrate while supporting the substrate in a coating system using a gas cushion. For example, a liquid coating can be printed over the specified region while the substrate is supported by the gas cushion. The substrate can be held for a specified duration after the printing the patterned liquid. The substrate can be conveyed to a treatment zone while supported using the gas cushion. The liquid coating can be treated to provide the solid layer including continuing to support the substrate using the gas cushion.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
71.
APPARATUS AND TECHNIQUES FOR ELECTRONIC DEVICE ENCAPSULATION
Apparatus and techniques for use in manufacturing a light emitting device, such as an organic light emitting diode (OLED) device can include using one or more modules having a controlled environment. The controlled environment can be maintained at a pressure at about atmospheric pressure or above atmospheric pressure. The modules can be arranged to provide various processing regions and to facilitate printing or otherwise depositing one or more patterned organic layers of an OLED device, such as an organic encapsulation layer (OEL) of an OLED device. In an example, uniform mechanical support for a substrate can be provided at least in part using a gas cushion, such as during one or more of a printing, holding, or curing operation comprising an OEL fabrication process. In another example, uniform mechanical support for the substrate can be provided using a distributed vacuum region, such as provided by a porous medium.
Apparatus and techniques are described herein for use in manufacturing electronic devices such as can include organic light emitting diode (OLED) devices. Such apparatus and techniques can include using one or more modules having a controlled environment. For example, a substrate can be received from a printing system located in a first processing environment, and the substrate can be provided a second processing environment, such as to an enclosed thermal treatment module comprising a controlled second processing environment. The second processing environment can include a purified gas environment having a different composition than the first processing environment.
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
73.
INK-BASED LAYER FABRICATION USING HALFTONING TO CONTROL THICKNESS
An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e.g., without unintended gaps or holes) while providing for variable volume and, thus, contributes to variable ink/material buildup to achieve desired thickness. The ink is jetted as liquid or aerosol that suspends material used to form the material layer, for example, an organic material used to form an encapsulation layer for a flat panel device. The deposited layer is then cured or otherwise finished to complete the process.
Ink compositions comprising polythiophenes and methicone that are formulated for Inkjet printing the hole injecting layer (HIL) of an organic light emitting diode (OLED) are provided. Also provided are methods of inkjet printing the HILs using the ink compositions. Ink compositions for inkjet printing layers in organic light emitting diodes (OLEDs) have been proposed. However, problems associated with inadequate wetting properties of the ink compositions has stifled the development of printable inks because improper wetting leads to non-uniform film formation and, therefore, non-uniform luminescence from organic light emitting diode pixels that incorporate the printed films.
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
75.
ESTER-BASED SOLVENT SYSTEMS FOR PRINTABLE ORGANIC LIGHT-EMITTING DIODE INK FORMULATIONS
Ink compositions for forming active layers in an organic light-emitting diode are provided. Also provided are methods of forming active layers of an OLED using the ink compositions. The ink compositions comprise a solvent system in which a substantial majority of the solvent is comprised of one or more ester compounds.
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
C08G 75/06 - Polythioethers from cyclic thioethers
The present teachings relate to various embodiments of a gas enclosure system that can have various components comprising a particle control system that can provide a low-particle zone proximal to a substrate. Various components of a particle control system can include a gas circulation and filtration system, a low-particle-generating motion system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. In addition to maintaining substantially low levels for each species of various reactive species, including various reactive atmospheric gases, such as water vapor and oxygen, for various embodiments of a gas enclosure system that have a particle control system, an on-substrate particle specification can be readily met. Accordingly, processing of various substrates in an inert, low-particle gas environment according to systems and methods of the present teachings can have substantially lower manufacturing defects.
An ink printing process employs per-nozzle droplet volume measurement and processing software that plans droplet combinations to reach specific aggregate ink fills per target region, guaranteeing compliance with minimum and maximum ink fills set by specification. In various embodiments, different droplet combinations are produced through different printhead/substrate scan offsets, offsets between printheads, the use of different nozzle drive waveforms, and/or other techniques. These combinations can be based on repeated, rapid droplet measurements that develop understandings for each nozzle of means and spreads for expected droplet volume, velocity and trajectory, with combinations of droplets being planned based on these statistical parameters. Optionally, random fill variation can be introduced so as to mitigate Mura effects in a finished display device. The disclosed techniques have many possible applications.
The present teachings disclose various embodiments of a gas enclosure system can have a a gas enclosure that can include a printing system enclosure and an auxiliary enclosure. In various embodiments of a gas enclosure system of the present teachings, a printing system enclosure can be isolated from an auxiliary enclosure. Various systems and methods of the present teachings can provide for the ongoing management of a printing system by utilizing various embodiments of isolatable enclosures. For example, various measurement and maintenance process steps for the management of a printhead assembly can be performed in an auxiliary enclosure, which can be isolated from a printing system enclosure of a gas enclosure system, thereby preventing or minimizing interruption of a printing process.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
This disclosure provides techniques for assessing quality of a deposited film layer of an organic light emitting diode ("OLED") device. An image is captured and filtered to identify a deposited layer that is to be analyzed. Image data representing this layer can be optionally converted to brightness (grayscale) data. A gradient function is then applied to emphasize discontinuities in the deposited layer. Discontinuities are then compared to one or more thresholds and used to ascertain quality of the deposited layer, with optional remedial measures then being applied. The disclosed techniques can be applied in situ, to quickly identify potential defects such as delamination before ensuing manufacturing steps are applied. In optional embodiments, remedial measures can be taken dependent on whether defects are determined to exist.
A method of manufacturing an organic-light emitting diode (OLED) display can include providing on a substrate a first electrode associated with a first sub-pixel and a second electrode associated with a second sub-pixel, wherein a gap is formed between the first electrode and the second electrode and wherein the first electrode and the second electrode are positioned in a well having boundaries defined by a confinement structure on the substrate. The method can also include depositing in the well with the electrodes positioned therein, active OLED material to form a substantially continuous layer of active OLED material that spans the boundaries of the well such that a surface of the layer of active OLED material that faces away from the substrate has a non-planar topography. The depositing can be via inkjet printing.
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
81.
HIGH RESOLUTION ORGANIC LIGHT-EMITTING DIODE DEVICES
In accordance with an exemplary embodiment of the present disclosure, a method of manufacturing an organic light-emissive display can be provided. A plurality of electrodes can be provided on a substrate. A first hole conducting layer can be deposited via inkjet printing over the plurality of electrodes on the substrate. A liquid affinity property of selected surface portions of the first hole conducting layer can be altered to define emissive layer confinement regions. Each emissive layer confinement region can have a portion that respectively corresponds to each of the plurality of electrodes provided on the substrate. An organic light-emissive layer can be deposited via inkjet printing within each emissive layer confinement region.
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
82.
TECHNIQUES FOR PRINT INK VOLUME CONTROL TO DEPOSIT FLUIDS WITHIN PRECISE TOLERANCES
An ink printing process employs per-nozzle droplet volume measurement and processing software that plans droplet combinations to reach specific aggregate ink fills per target region, guaranteeing compliance with minimum and maximum ink fills set by specification. In various embodiments, different droplet combinations are produced through different print head/substrate scan offsets, offsets between print heads, the use of different nozzle drive waveforms, and/or other techniques. Optionally, patterns of fill variation can be introduced so as to mitigate observable line effects in a finished display device. The disclosed techniques have many other possible applications.
The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.
Gas bearing systems, print gap control systems, and methods of print gap control are provided. The gas bearing systems can accommodate one or more print module packages. The systems and methods can be used for inkjet and/or thermal printing applications such as manufacturing organic light emitting devices (OLEDs). Gas bearing systems can employ one or more of pressurized gas and vacuum. For oxygen-sensitive applications, an inert gas, such as nitrogen gas, can be employed as the pressurized gas. Fluid channels and apertures of the gas bearing systems can be varied in terms of size and relative position to one another. Fluid channels and apertures can be grouped and paired with one or more manifolds and ultimately a pressurized gas and/or vacuum source.
Features for various embodiments of a self-contained printhead unit, including an on-board fluidic system, quick-coupling electrical and pneumatic interfacing, in conjunction with the features of various embodiments of a kinematic mounting and air bearing clamping assembly, as well as contactless integration to a waste assembly, together provide for the ready interchangeability of a plurality of printhead units in a printing system during a printing process, while at the same time preventing cross-contamination of a plurality of end-user selected inks contained in each of a plurality of printhead units.
The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.
Film-forming formulations are provided that satisfy a plurality of criteria for inkjet printing, thermal printing, or both. Criteria for film-forming formulations are also provided for selecting vehicles, combinations of vehicles, and film-forming materials, based upon viscosity, surface tension, solubility, and properties of printed films formed by such formulations. Film-forming formulations useful in the fabrication of organic light emitting devices (OLEDs) are provided including formulations useful for the fabrication of OLED hole transport layers, hole injection layers, electron transport layers, electron injection layers, and emissive layers, of an OLED. Methods of evaluating formulations for suitability in inkjet printing, thermal printing, or both, are also provided.
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
B41J 2/005 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
Film-forming apparatuses, systems, and methods are provided. The apparatus can include a substrate positioning system and a printing array that includes an inkjet printing array and/or a thermal printing array. The positioning system can be a gas-bearing plate system. The positioning system can be configured to move a substrate between a first position, away from the printing array, and a second position, above the printing array. The apparatuses, systems, and methods can be used to manufacture organic light emitting devices (OLEDs), for example, flat panel displays.
Systems, apparatuses, and methods are provided that include or use a chuck, an inkjet printhead, and a gas knife to form film layers on a substrate, which have uniform feature dimensions and which avoid pile-up of inkjet ink. In some systems, a gas movement device is used instead of a gas knife. The systems, apparatus, and methods can be used to print layers on a substrate, which are used in an organic light emitting device.
The present teachings provide methods for depositing and patterning organic light-emitting device (OLED) buffer layers. The method can use a thermal printing process and one or more additional processes, such as vacuum thermal evaporation (VTE), to create an OLED stack. OLED stack structures are also provided wherein which at least one of the charge injection or charge transport layers is formed by a thermal printing method at a high deposition rate. The organic layer can be subject to post-deposition treatment such as baking. The structure of the organic layer can be amorphous, crystalline, porous, dense, smooth, rough, or a combination thereof, depending on deposition parameters and post-treatment conditions. The organic layer can improve light out-coupling efficiency of an OLED, increase conductivity, decrease index of refraction, and/or modify the emission chromaticity of an OLED.
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
91.
MATERIALS AND METHODS FOR OLED MICROCAVITIES AND BUFFER LAYERS
The present teachings provide methods for forming organic layers for an organic light- emitting device (OLED) using an inkjet printing or thermal printing process. The method can further use one or more additional processes, such as vacuum thermal evaporation (VTE), to create an OLED stack. OLED stack structures are also provided wherein at least one of the charge injection or charge transport layers is formed by an inkjet printing or thermal printing method at a high deposition rate. The structure of the organic layer can be amorphous, crystalline, porous, dense, smooth, rough, or a combination thereof, depending on deposition parameters and post-treatment conditions. An OLED microcavity is also provided and can be formed by one of more of the methods.
H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
92.
METHOD AND APPARATUS FOR PRINTING USING A FACETTED DRUM
The disclosure generally relates to a method and apparatus for printing from a rotating source. In an exemplary embodiment, the disclosure relates to a facetted drum for simultaneously printing multiple pixels. The facetted drum includes a support structure and a plurality of printheads affixed to the support structure, each printhead having at least one microporous structure for receiving a first quantity of liquid ink having dissolved or suspended film material in a carrier fluid and dispensing a second quantity of ink material substantially free of the carrier fluid. The plurality of printheads are positioned proximal to a substrate to simultaneously print a plurality of spatially-discrete and image-resolved pixels on the substrate.
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
B41J 2/005 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
B41J 2/435 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
93.
METHOD AND APPARATUS FOR DELIVERING INK MATERIAL FROM A DISCHARGE NOZZLE
The disclosure relates to a method for loading ink material into discharge nozzle having a non-discharge surface and a plurality of micropores. The method includes the steps of providing a quantity of liquid ink material defined by a carrier fluid containing dissolved or suspended film material; delivering the quantity of liquid ink onto the discharge nozzle and directing a portion of the delivered ink into at least one micropore; flowing a pressurized gas over the surface to drive the delivered ink material into the least one nozzle; evaporating the carrier fluid from the delivered ink to form a substantially carrier-free ink material at the micropore; and dispensing the substantially carrier-free ink material from the nozzle. The surface can be configured to reject the ink and the plurality of nozzles are configured to receive the ink.
Embodiments are disclosed of apparatus and methods for depositing one or more organic materials onto a substrate. One or more thin films can thereby be formed. The organic materials can be those employed in organic LED (OLED) technologies.
The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.
A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.
B41J 2/32 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
97.
METHOD AND APPARATUS FOR DEPOSITING A FILM USING A ROTATING SOURCE
The disclosure generally relates to a method and apparatus for depositing a substantially solid film onto a substrate. The solid film can be an Organic Light- Emitting Diode ("OLED"). In one embodiment, the disclosure relates to using a material supply, a rotating or moving mechanism having at least one transfer surface which is supplied with film material in one orientation and delivers film material to the substrate at a second orientation such that film material delivered to the substrate deposits in substantially solid form. The delivery to the substrate can be performed without the transfer surface materially contacting the substrate. The film material can be deposited on the transfer surface in either solid form or in liquid form (e.g., as a mixture of carrier liquid and dissolved or suspended film material).
In one embodiment, the disclosure relates to providing a first gas stream carrying vaporized material and depositing the vaporized material onto a substrate by directing a plurality of gas streams containing the vaporized material to a substrate, forming an gas curtain around the streams to prevent its dissemination beyond a target print area, and allowing the vaporized material to condense on the target print area. In another embodiment, heat is used to regulate the flow of the material and the thickness of the deposited layer.
The present teachings relate to methods and apparatus for depositing one or more materials (e.g., one or more films, such as one or more solids) on one or more substrates, which may form part of an OLED or other type(s) of display. In some embodiments, the disclosure relates to apparatus and methods for depositing ink on one or more substrates. The apparatus can include, for example, one or more chambers for receiving ink, and plural orifices configured in the one or more chambers which are adapted for ejecting droplets of the ink; a discharge nozzle comprising an array of micro-pores (e.g., configured in a rectangular array), with each micro-pore having an inlet port and an outlet port, and the discharge nozzle receiving plural quantities (e.g., droplets) of ink from the chamber(s) via the orifices at the inlet ports and dispensing the ink from the outlet ports. The droplets of ink can be received at unique, spaced-apart locations on the inlet ports of the discharge nozzle. In some embodiments, a single liquid ink-holding chamber, which includes plural orifices (e.g., three), receives ink in liquid form having a plurality of suspended particles, and droplets of the ink are ejected substantially simultaneously from the chamber to respective, spaced-apart locations on the discharge nozzle; and the discharge nozzle evaporates the carrier liquid and deposits the solid particles on one or more substrates.
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