The present invention relates to a fixed-fixed membrane for a microelectromechanical system (MEMS) microphone. In one embodiment, a MEMS acoustic sensor includes a substrate; a membrane situated parallel to the substrate; and at least one vent formed into the membrane, wherein the at least one vent is a curved opening in the membrane, and wherein the at least one vent is disposed substantially along a length of the membrane.
Acoustic and other activity detection signaling is provided herein. Operations of a method can include determining a micro-electromechanical system (MEMS) device is no longer in an initialization state and receiving a first signal that instructs the MEMS device to perform event activity detection. The method can also include receiving one or more event signals and determining that an event signal of one or more event signals satisfies a defined event characteristic. The method can also include outputting a second signal that comprises information indicative of a detection of event activity at the MEMS device being more than the defined event characteristic.
A bi-directional photoacoustic gas sensor includes a first photoacoustic cell, where an electromagnetic radiation source emits radiation to interact with an external gas and generate pressure waves that are detected by a MEMS diaphragm. A second photoacoustic cell has an interior volume and acoustic compliance that corresponds to the interior volume and acoustic compliance of the first photoacoustic cell. Processing circuitry within a substrate uses a first acoustic signal, received by the first photoacoustic cell, and a second acoustic signal, received by the second photoacoustic cell, to determine a bi-directional response of the gas sensor to remove noise and improve the sensor's signal-to-noise ratio.
G01N 29/22 - Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object - Details
Utilization of microphone ultrasonic response is described. A system, comprising: a microelectromechanical system (MEMS) microphone device configured to capture signal data representing an ultrasonic signal and an audio-band signal simultaneously, and a processing circuitry configured to adjust a configuration parameter associated with the MEMS microphone device based on the ultrasonic signal.
A device comprises a processor coupled with an ultrasonic transducer which is configured to repeatedly emit ultrasonic pulses during transmit periods which are interspersed with listening windows. Each sequential pair of the transmit periods is separated by a single listening window of the listening windows. During a fixed portion of a listening window of the listening windows the ultrasonic transducer is configured to receive returned signals corresponding to an emitted ultrasonic pulse of the ultrasonic pulses which was transmitted during a transmit period of the transmit periods that immediately preceded the listening window. The processor randomizes an overall length of each listening window of the listening windows. The processor directs filtering of returned signals received during a plurality of the randomized listening windows to achieve filtered returned signals. The processor detects, using the filtered returned signals, a moving object in a field of view of the ultrasonic transducer.
Embodiments for constant charge or capacitance for capacitive micro-electro-mechanical system (MEMS) sensors are presented herein. A MEMS device comprises a sense element circuit comprising a bias resistance, a charge-pump, and a capacitive sense element comprising an electrode and a sense capacitance. The charge-pump generates, at a bias resistor electrically coupled to the electrode, a bias voltage that is inversely proportional to a capacitance value comprising a value of the sense capacitance to facilitate maintenance of a nominally constant charge on the electrode. A sensing circuit comprises an alternating current (AC) signal source that generates an AC signal at a defined frequency; and generates, based on the AC signal, an AC test voltage at a test capacitance that is electrically coupled to the electrode. The sense element circuit generates, based on the AC test voltage at the defined frequency, an output signal representing the value of the sense capacitance.
Systems and methods are disclosed for capturing stabilized images. Motion of the mobile device is determined so that the relative position of the lens and image sensor may be adjusted to compensate for unintended motion. The relative position of the lens and image sensor may be periodically reset in response to a synchronization signal in between capturing images.
An inertial sensor such as a MEMS accelerometer or gyroscope has a proof mass that is driven by a self-test signal, with the response of the proof mass to the self-test signal being used to determine whether the sensor is within specification. The self-test signal is provided as a non-periodic self-test pattern that does not correlate with noise such as environmental vibrations that are also experienced by the proof mass during the self-test procedure. The sense output signal corresponding to the proof mass is correlated with the non-periodic self-test signal, such that an output correlation value corresponds only to the proof mass response to the applied self-test signal.
Improving motion sensor robustness utilizing a room-temperature-volcanizing (RTV) material via a solder resist dam is presented herein. A sensor package comprises: a first semiconductor die; a second semiconductor die that is attached to the first semiconductor die to form a monolithic die; and a substrate comprising a top portion and a bottom portion, in which the top portion comprises a plurality of solder resist dams, the monolithic die is attached to the top portion of the substrate via the RTV material being disposed in a defined area of the top portion of the substrate, and the bottom portion of the substrate comprises electrical terminals that facilitate attachment and electrical coupling of signals of the sensor package to a printed circuit board.
Microelectromechanical system (MEMS) packages and methods of making thereof. A MEMS package includes at least one MEMS device disposed on a base substrate and a lid disposed on the base substrate. The lid is configured to enclose the at least one MEMS device. The lid includes a body portion configured to be coupled to the base substrate, a ceiling portion and a membrane. The body portion and the ceiling portion form a cavity in which the at least one MEMS device is enclosed. The membrane is formed from a filtering fabric and is configured to substantially block one or more liquids and contaminants from passing into the cavity.
A retinal projection display system includes at least one visible light source for projecting a visible light image, an infrared light source for projecting infrared light, a scanning mirror having a field of view larger than the visible light image, a reflective surface on which the visible light image is projected and on which the infrared light is reflected at least partially towards an eye of a user, wherein the reflective surface is larger than the visible light image, at least one infrared photodetector for receiving reflected infrared light that reflects off of the eye of the user, and a hardware computation module comprising a processor and a memory, the hardware computation module configured to determine a gaze direction of the user based at least in part on the reflected infrared light.
An ultrasonic transducer device including a substrate, an edge support structure connected to the substrate, and a membrane connected to the edge support structure such that a cavity is defined between the membrane and the substrate, the membrane configured to allow movement at ultrasonic frequencies. The membrane includes a structural layer, a piezoelectric layer having a first surface and a second surface, a first electrode placed on the first surface of the piezoelectric layer, wherein the first electrode is located at the center of the membrane, a second electrode placed on the first surface of the piezoelectric layer, wherein the second electrode is a patterned electrode comprising more than one electrode components that are electrically coupled, and a third electrode coupled to the second surface of the piezoelectric layer and electrically coupled to ground.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
G01H 11/08 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
A method includes forming a bumpstop from a first intermetal dielectric (IMD) layer and forming a via within the first IMD, wherein the first IMD is disposed over a first polysilicon layer, and wherein the first polysilicon layer is disposed over another IMD layer that is disposed over a substrate. The method further includes depositing a second polysilicon layer over the bumpstop and further over the via to connect to the first polysilicon layer. A standoff is formed over a first portion of the second polysilicon layer, and wherein a second portion of the second polysilicon layer is exposed. The method includes depositing a bond layer over the standoff.
A device includes a substrate comprising a first standoff, a second standoff, a third standoff, a first cavity, a second cavity, and a bonding material covering a portion of the first, the second, and the third standoff. The first cavity is positioned between the first and the second standoffs, and the second cavity is positioned between the second and the third standoffs. The first cavity comprises a first cavity region and a second cavity region separated by a portion of the substrate extruding thereto, and wherein a depth associated with the first cavity region is greater than a depth associated with the second cavity. A surface of the first cavity is covered with a getter material.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
Acoustic activity detection is provided herein. Operations of a method can include receiving an acoustic signal at a micro-electromechanical system (MEMS) microphone. Based on portions of the acoustic signal being determined to exceed a threshold signal level, output pulses are generated. Further, the method includes extracting information representative of a frequency of the acoustic signal based on respective spacing between rising edges of the output pulses.
A device includes a substrate and an intermetal dielectric (IMD) layer disposed over the substrate. The device also includes a first plurality of polysilicon layers disposed over the IMD layer and over a bumpstop. The device also includes a second plurality of polysilicon layers disposed within the IMD layer. The device includes a patterned actuator layer with a first side and a second side, wherein the first side of the patterned actuator layer is lined with a polysilicon layer, and wherein the first side of the patterned actuator layer faces the bumpstop. The device further includes a standoff formed over the IMD layer, a via through the standoff making electrical contact with the polysilicon layer of the actuator and a portion of the second plurality of polysilicon layers and a bond material disposed on the second side of the patterned actuator layer.
A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.
A method includes forming an etch stop layer over a first side of a device wafer. The method also includes forming a polysilicon layer over the etch stop layer. A handle wafer is fusion bonded to the first side of the device wafer. A eutectic bond layer is formed on a second side of the device wafer. A micro-electro-mechanical system (MEMS) features are etched into the second side of the device wafer to expose the etch stop layer. The exposed etch stop layer is removed to expose the polysilicon layer. The exposed polysilicon layer is removed to expose a cavity formed between the handle wafer and the device wafer.
Disclosed embodiments provide flexible performance, high dynamic range, microelectromechanical (MEMS) multipath digital microphones, which allow seamless, low latency transitions between audio signal paths without audible artifacts over interruptions in the audio output signal. Disclosed embodiments facilitate performance and power saving mode transitions maintaining high dynamic range capability.
A microelectromechanical system (MEMS) microphone includes a cavity to receive an acoustic signal. The acoustic signal causes movement of a diaphragm relative to one or more other surfaces, which in turn results in an electrical signal representative of the received acoustic signal. A light sensor is included within the packaging of the MEMS microphone such that an output of the light sensor is representative of a light signal received with the acoustic signal. The output of the light sensor is used to modify the electrical signal representative of the received acoustic signal in a manner that limits light interference with an acoustical output signal.
Environmental conditions affecting a sensor having a thermal coefficient are compensated by applying an adaptive filter to an environmental condition reference signal. The resulting adaptive cancellation signal may be used to provide feedback control to a first heating element.
A device includes a micro-electromechanical system (MEMS) element configured to sense acoustic signals. The device also includes a circuitry configured to enable the microphone element to sense the acoustic signals. The circuitry is further configured to disable the microphone element to prevent the microphone element to sense the acoustic signals. It is appreciated that the circuitry is further configured to apply a test signal to the MEMS element when the microphone element is disabled. The microphone element outputs a signal in response to the test signal to the circuitry. The circuitry in response to the output signal with a first value determines that a diaphragm of the MEMS element is nonoperational and the circuitry in response to the output signal with a second value determines that the diaphragm of the MEMS element is operational.
A method includes tab dicing a region of a tab region disposed between a first die and a second die. The tab region structurally connects the first die to the second die each including a MEMS device eutecticly bonded to a CMOS device. The tab region includes a handle wafer layer disposed over a fusion bond oxide layer that is disposed on an ACT layer. The tab region is positioned above a CMOS tab region that with the first and second die form a cavity therein. The tab dicing cuts through the handle wafer layer and leaves a portion of the fusion bond oxide layer underneath the handle wafer layer to form an oxide tether within the tab region. The oxide tether maintains the tab region in place and above the CMOS tab region. Subsequent to the tab dicing the first region, the tab region is removed.
A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
Magnetic-based collaborative positioning of a portable device involves obtaining magnetic field measurements for the portable device, obtaining magnetic fingerprint map information, obtaining parameters of motion of the portable device, obtaining collaborative assistance data from at least one neighbor portable device and determining position of the portable device based on the obtained magnetic field measurements, the obtained magnetic map information, the obtained motion parameters and the obtained collaborative assistance data.
G01C 21/20 - Instruments for performing navigational calculations
G01S 5/02 - Position-fixing by co-ordinating two or more direction or position-line determinations; Position-fixing by co-ordinating two or more distance determinations using radio waves
H04W 4/02 - Services making use of location information
H04W 4/33 - Services specially adapted for particular environments, situations or purposes for indoor environments, e.g. buildings
26.
METHOD AND SYSTEM FOR CONTACT TRACING USING POSITIONING IN A VENUE
Systems and methods are provided for establishing contact tracing for a group of users within a venue. Position information in the venue may be estimated for each user over a period of time based at least in part on data from a portable device associated with each user. At least one contact parameter may be established so that contact between at least two users of the group of users during the period of time may be determined based at least in part on the at least one contact parameter and the estimated position information.
G16H 50/30 - ICT specially adapted for medical diagnosis, medical simulation or medical data mining; ICT specially adapted for detecting, monitoring or modelling epidemics or pandemics for individual health risk assessment
A method including fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a hardmask on a second side of the device wafer, wherein the second side is planar. An etch stop layer is deposited over the hardmask and an exposed portion of the second side of the device wafer. A dielectric layer is formed over the etch stop layer. A via is formed within the dielectric layer. The via is filled with conductive material. A eutectic bond layer is formed over the conductive material. Portions of the dielectric layer uncovered by the eutectic bond layer is etched to expose the etch stop layer. The exposed portions of the etch stop layer is etched. A micro-electro-mechanical system (MEMS) device pattern is etched into the device wafer.
An odometry solution for a device within a moving platform is provided using a deep neural network. Radar measurements may be obtained, such that static objects are detected based at least in part on the obtained radar measurements. Odometry information for the platform is estimated based at least in part on the detected static objects and the obtained radar measurements.
G01S 7/41 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group using analysis of echo signal for target characterisation; Target signature; Target cross-section
G01S 13/60 - Velocity or trajectory determination systems; Sense-of-movement determination systems wherein the transmitter and receiver are mounted on the moving object, e.g. for determining ground speed, drift angle, ground track
G01S 13/931 - Radar or analogous systems, specially adapted for specific applications for anti-collision purposes of land vehicles
29.
METHOD AND SYSTEM FOR POSITIONING USING OPTICAL SENSOR AND MOTION SENSORS
An integrated navigation solution is provided for a device within a moving platform. Motion sensor data from a sensor assembly of the device is obtained, optical samples from at least one optical sensor for the platform are obtained and map information for an environment encompassing the platform is obtained. Correspondingly, an integrated navigation solution is generated based at least in part on the obtained motion sensor data using a nonlinear state estimation technique, wherein the nonlinear state estimation technique uses a nonlinear measurement model for optical sensor data. Generating the integrated navigation solution includes using the sensor data with the nonlinear state estimation technique and integrating the optical sensor data directly by updating the nonlinear state estimation technique using the nonlinear measurement model and the map information. The integrated navigation solution is then provided.
G01C 21/16 - Navigation; Navigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
G01C 21/36 - Input/output arrangements for on-board computers
30.
REDUCING DELAMINATION IN A PACKAGED INTEGRATED CIRCUIT
A sensor can comprise a sensor die with a first sensor surface and a second sensor surface opposite to the first sensor surface. The sensor can further comprise a die pad component with a first pad surface and a second pad surface opposite to the first pad surface, wherein the sensor die is vertically stacked with the die pad component, with the second sensor surface oriented toward the first pad surface. The sensor can further comprise a lead frame component with a first frame surface and a second frame surface opposite to the first frame surface, the die pad component is vertically stacked with the lead frame component, wherein the second pad surface is oriented toward the first frame surface, the second pad surface is isolated from the second frame surface, and the lead frame component is electrically connected to the sensor die.
H01L 23/053 - Containers; Seals characterised by the shape the container being a hollow construction and having an insulating base as a mounting for the semiconductor body
31.
SEMICONDUCTOR PACKAGE WITH BUILT-IN VIBRATION ISOLATION, THERMAL STABILITY, AND CONNECTOR DECOUPLING
A semiconductor package with design features, including an isolation structure for internal components and a flexible electrical connection, that minimizes errors due to environmental temperature, shock, and vibration effects. The semiconductor package may include a base having a first portion surrounded by a second portion. A connector assembly may be attached to the first portion. The connector assembly may extend through an opening in the base. A lid attached may be attached to, at least, the second portion. The attached lid may form a hermetically-sealed cavity defined by an upper surface of the first portion, the connector assembly, and an inner surface of the lid. An elastomer pad may be on the first portion and a sub-assembly may be on the elastomer pad. A flexible electrical connection may be formed between the connector assembly and the sub-assembly.
A MEMS accelerometer includes proof masses that move in-phase in response to a sensed linear acceleration. Self-test drive circuitry imparts an out-of-phase movement onto the proof masses. The motion of the proof masses in response to the linear acceleration and the self-test movement is sensed as a sense signal on common sense electrodes. Processing circuitry extracts from a linear acceleration signal corresponding to the in-phase movement due to linear acceleration and a self-test signal corresponding to the out-of-phase movement due to the self-test drive signal.
B81C 99/00 - Subject matter not provided for in other groups of this subclass
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
33.
ULTRASONIC FINGERPRINT SENSOR WITH A CONTACT LAYER OF NON-UNIFORM THICKNESS
An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers, a contact layer, a matching layer between the two-dimensional array and the contact layer, where the matching layer has a non-uniform thickness, and an array controller configured to control activation of ultrasonic transducers during an imaging operation for imaging a plurality of pixels within the two-dimensional array of ultrasonic transducers. During the imaging operation, the array controller is configured to activate different subsets of ultrasonic transducers associated with different regions of the two-dimensional array of ultrasonic transducers at different transmission frequencies, where the different frequencies are determined such that a thickness of the matching layer at a region is substantially equal to a quarter wavelength of the first transmission frequency for the region. The array controller is also configured to combine the plurality of pixels into a compound fingerprint image that compensates for the non-uniform thickness of the matching layer.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
G10K 9/125 - Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated using piezoelectric driving means with a plurality of active elements
34.
OPERATING A FINGERPRINT SENSOR COMPRISED OF ULTRASONIC TRANSDUCERS AND A PRESENCE SENSOR
In a method for operating a fingerprint sensor including a plurality of ultrasonic transducers and a presence sensor, the presence sensor proximate the fingerprint sensor is activated, where the presence sensor is for detecting interaction between an object and the fingerprint sensor. Subsequent to detecting interaction between an object and the fingerprint sensor at the presence sensor, a subset of ultrasonic transducers of the fingerprint sensor is activated, the subset of ultrasonic transducers for determining whether the object is a human finger, where the subset of ultrasonic transducers is proximate the presence sensor such that the subset of ultrasonic transducers and the presence sensor can concurrently interact with the object.
A MEMS system includes a gyroscope that generates a quadrature signal and an angular velocity signal. The MEMS system further includes an accelerometer that generates a linear acceleration signal. The quadrature signal and the linear acceleration signal are received by a processing circuitry that modifies the linear acceleration signal based on the quadrature signal to determine linear acceleration.
Described herein are methods and systems for configuring sensors to compensate for a temperature gradient. Multiple sensor sets, each having at least two sensors of a same type with orthogonal axes, are positioned to form at least one opposing sensor pair, in which an axis of one sensor of one sensor set is in an opposite orientation to an axis of one sensor of another sensor set. A combined measurement of each opposing sensor pair may be output which is compensated for an effect of a temperature gradient on sensor measurements of the sensors.
An exemplary microelectromechanical system (MEMS) device comprises a plurality of stacked layers, including at least one layer that includes micromechanical components that respond to a force to be measured. Two of the layers may include respective first and second external electrical connection points. A plurality of conductive paths may be disposed in a continuous manner over an external surface of each of the plurality of layers between the first and second external electrical connection points.
Exemplary embodiment of a tilting z-axis, out-of-plane sensing MEMS accelerometers and associated structures and configurations are described. Disclosed embodiments facilitate improved offset stabilization. Non-limiting embodiments provide exemplary MEMS structures and apparatuses characterized by one or more of having a sensing MEMS structure that is symmetric about the axis orthogonal to the springs or flexible coupling axis, a spring or flexible coupling axis that is aligned to one of the symmetry axes of the electrodes pattern, a different number of reference electrodes and sense electrodes, a reference MEMS structure having at least two symmetry axes, one which is along the axis of the springs or flexible coupling, and/or a reference structure below the spring or flexible coupling axis.
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01P 21/00 - Testing or calibrating of apparatus or devices covered by the other groups of this subclass
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
39.
SYSTEMS AND METHODS FOR OPERATING A MEMS DEVICE BASED ON SENSED TEMPERATURE GRADIENTS
An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.
A microelectromechanical (MEMS) device may be coupled to a dielectric material at an upper planar surface or lower planar surface of the MEMS device. One or more temperature sensors may be attached to the dielectric material layer. Signals from the one or more temperature sensors may be used to determine a thermal gradient along on axis that is normal to the upper planar surface and the lower planar surface. The thermal gradient may be used to compensate for values measured by the MEMS device.
An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers, wherein the two-dimensional array of ultrasonic transducers is substantially flat, a contact layer having a non-uniform thickness overlying the two-dimensional array, and an array controller configured to control activation of ultrasonic transducers during an imaging operation for imaging a plurality of pixels. For imaging a pixel of the plurality of pixels, the array controller is configured to activate a first subset of ultrasonic transducers of the two-dimensional array to generate an ultrasonic beam directed to a contact surface of the contact layer, and activate a second subset of ultrasonic transducers of the two-dimensional array to receive a reflected ultrasonic beam, wherein the second subset of ultrasonic transducers is at a location within the two-dimensional array to account for a local angle between the two-dimensional array and the contact surface where the ultrasonic beam interacts with the contact surface.
An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers, wherein the two-dimensional array of ultrasonic transducers is substantially flat, a contact layer having a non-uniform thickness overlying the two-dimensional array of ultrasonic transducers, and an array controller configured to control activation of ultrasonic transducers during an imaging operation. During the imaging operation, the array controller is configured to control a transmission frequency of activated ultrasonic transducers during the imaging operation, wherein a plurality of transmission frequencies are used during the imaging operation to account for an impact of an interference pattern caused by the non-uniform thickness of the contact layer, and is configured to capture at least one fingerprint image using the plurality of transmission frequencies.
In a method for determining whether a finger is a real finger at an ultrasonic fingerprint sensor, a first image of a fingerprint pattern is captured at an ultrasonic fingerprint sensor, wherein the first image is based on ultrasonic signals corresponding to a first time of flight range. A second image of the fingerprint pattern is captured at the ultrasonic fingerprint sensor, wherein the second image is based on ultrasonic signals corresponding to a second time of flight range, the second time of flight range being delayed compared to the first time of flight range. A difference in a width of ridges of the fingerprint pattern in the first image compared to the width of ridges of the fingerprint pattern in the second image is quantified. Based on the quantification of the difference, a probability whether the finger is a real finger is determined.
In a method for determining whether a finger is a real finger at an ultrasonic fingerprint sensor, a sequence of images of a fingerprint of a finger are captured at an ultrasonic fingerprint sensor, wherein the sequence of images includes images captured during a change in contact state between the finger and the ultrasonic fingerprint sensor. A plurality of transient features of the finger is extracted from the sequence of images. A classifier is applied to the plurality of transient features to classify the finger as one of a real finger and a fake finger. It is determined whether the finger is a real finger based on an output of the classifier.
A sensor includes a substrate, an oxide layer, a membrane, an electrode, and a trench. The oxide layer is disposed on the substrate. The membrane is positioned on the oxide layer. The membrane with the oxide layer and the substrate forms an enclosed cavity therein. The membrane comprises a rigid portion and a deformable portion wherein the deformable portion of the membrane_deforms responsive to stimuli. The oxide layer forms side walls of the cavity. The electrode is positioned on the substrate and within the cavity. The trench is formed in the oxide layer, and wherein the trench is covered with barrier material.
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
An ultrasonic transducer device including a substrate, an edge support structure connected to the substrate, and a membrane connected to the edge support structure such that a cavity is defined between the membrane and the substrate, the membrane configured to allow movement at ultrasonic frequencies. The membrane includes a first piezoelectric layer having a first surface and a second surface, a second piezoelectric layer having a first surface and a second surface, wherein the second surface of the first piezoelectric layer faces the first surface of the second piezoelectric layer, a first electrode coupled to the first surface of the first piezoelectric layer, a second electrode coupled to the second surface of the second piezoelectric layer, and a third electrode between the first piezoelectric layer and the second piezoelectric layer.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
B06B 1/02 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy
G01S 7/52 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group
G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
Described herein are methods and systems for configuring sensors to compensate for a temperature gradient. First and second sensors of the same type are arranged as opposing pairs with respect to a first axis that may be defined by a temperature gradient caused by at least one thermal element. Combining the output measurements of the first sensor and the second sensor allows effects of the temperature gradient on sensor measurements of the first sensor and the second sensor to be compensated. Further, multiple sensor sets, each having at least two sensors of a same type with orthogonal axes, are positioned to form at least one opposing sensor pair, in which an axis of one sensor of one sensor set is in an opposite orientation to an axis of one sensor of another sensor set. A combined measurement of each opposing sensor pair may be output which is compensated for an effect of a temperature gradient on sensor measurements of the sensors.
Exemplary multipath digital microphone described herein can comprise exemplary embodiments of adaptive ADC range multipath digital microphones, which allow low power to be achieved for amplifiers or gain stages, as well as for exemplary adaptive ADCs in exemplary multipath digital microphone arrangements described herein, while still providing a high DR digital microphone systems. Further non-limiting embodiments can comprise an exemplary glitch removal component configured to minimize audible artifacts associated with the change in the gain of the exemplary adaptive ADCs.
An integrated navigation solution is provided for a device within a moving platform. Motion sensor data is obtained from a sensor assembly of the device, radar measurements for the platform are obtained and map information for an environment encompassing the platform is obtained. Correspondingly, an integrated navigation solution is generated based at least in part on the obtained motion sensor data using a nonlinear state estimation technique, wherein the nonlinear state estimation technique uses a nonlinear measurement model for radar measurements. Generating the integrated navigation solution includes using the sensor data with the nonlinear state estimation technique and integrating the radar measurements directly by updating the nonlinear state estimation technique using the nonlinear measurement models and the map information. The integrated navigation solution is then provided.
G01S 13/72 - Radar-tracking systems; Analogous systems for two-dimensional tracking, e.g. combination of angle and range tracking, track-while-scan radar
G01S 13/931 - Radar or analogous systems, specially adapted for specific applications for anti-collision purposes of land vehicles
G01S 13/86 - Combinations of radar systems with non-radar systems, e.g. sonar, direction finder
A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a layer of piezoelectric material that is activated and sensed by an electrode and a conductive plane layer. The conductive plane layer may be electrically connected to processing circuitry by a via that extends through the piezoelectric layer. One or more isolation trenches extend through the conductive plane layer to isolate the conductive plane layer from other conductive plane layers of adjacent PMUT devices of a PMUT array.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H01L 27/20 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including magnetostrictive components
H01L 41/09 - Piezo-electric or electrostrictive elements with electrical input and mechanical output
A fingerprint sensor is provided herein. A method for operating the fingerprint sensor can comprise selecting a pair of electrode elements from a first set of electrode elements and a second set of electrode elements of a second electrode. The first electrode is located on a first side of a piezoelectric layer; the second electrode is located on a second side of the piezoelectric layer. The first side and the second side are opposite sides of the piezoelectric layer. The method also can comprise transmitting ultrasonic signals using the pair of electrode elements based on a position of a switch element being in a first position, and receiving ultrasonic signals using the pair of electrode elements based on the position of the switch element being in a second position.
G01S 7/52 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group
G06K 9/00 - Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
B06B 1/02 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
The subject disclosure provides exemplary 3-axis (e.g., GX, GY, and GZ) linear and angular momentum balanced vibratory rate gyroscope architectures with fully-coupled sense modes. Embodiments can employ balanced drive and/or balanced sense components to reduce induced vibrations and/or part to part coupling. Embodiments can comprise two inner frame gyroscopes for GY sense mode and an outer frame or saddle gyroscope for GX sense mode and drive system coupling, drive shuttles coupled to the two inner frame gyroscopes or outer frame gyroscope, and four GZ proof masses coupled to the inner frame gyroscopes for GZ sense mode. Components can be removed from an exemplary overall architecture to fabricate a single axis or two axis gyroscope and/or can be configured such that a number of proof-masses can be reduced in half from an exemplary overall architecture to fabricate a half-gyroscope. Other embodiments can employ a stress isolation frame to reduce package induced stress.
G01C 19/5783 - Mountings or housings not specific to any of the devices covered by groups
54.
APPLYING A POSITIVE FEEDBACK VOLTAGE TO AN ELECTROMECHANICAL SENSOR UTILIZING A VOLTAGE-TO-VOLTAGE CONVERTER TO FACILITATE A REDUCTION OF CHARGE FLOW IN SUCH SENSOR REPRESENTING SPRING SOFTENING
Reducing a sensitivity of an electromechanical sensor is presented herein. The electromechanical sensor comprises a sensitivity with respect to a variation of a mechanical-to-electrical gain of a sense element of the electromechanical sensor; and a voltage-to-voltage converter component that minimizes the sensitivity by coupling, via a defined feedback capacitance, a positive feedback voltage to a sense electrode of the sense element - the sense element electrically coupled to an input of the voltage-to-voltage converter component. In one example, the voltage-to-voltage converter component minimizes the sensitivity by maintaining, via the defined feedback capacitance, a constant charge at the sense electrode. In another example, the electromechanical sensor comprises a capacitive sense element comprising a first node comprising the sense electrode. Further, a bias voltage component can apply a bias voltage to a second node of the electromechanical sensor. In yet another example, the electromechanical sensor comprises a piezoelectric sense element.
H03F 1/38 - Positive-feedback circuit arrangements without negative feedback
G01D 5/00 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
APPLYING A POSITIVE FEEDBACK VOLTAGE TO AN ELECTROMECHANICAL SENSOR UTILIZING A VOLTAGE-TO-VOLTAGE CONVERTER TO FACILITATE A REDUCTION OF CHARGE FLOW IN SUCH SENSOR REPRESENTING SPRING SOFTENING
Reducing, at a common sense electrode of a group of sensors of a system, a common charge flow due to a common motion of the group of sensors is presented herein. The group of electromechanical sensors generates a common charge flow as a result of a common motion of the group of electromechanical sensors and a differential charge flow as a result of a differential motion of the group of electromechanical sensors - respective sense elements of the group of electromechanical sensors being electrically connected at the common sense electrode. The system further comprises a voltage-to-voltage converter component that generates, via an output of the voltage-to-voltage converter component, a positive feedback voltage, and minimizes the common charge flow by coupling, via a defined feedback capacitance, the positive feedback voltage to the common sense electrode - the common sense electrode being electrically coupled to an input of the voltage-to-voltage converter component.
H03F 1/38 - Positive-feedback circuit arrangements without negative feedback
G01D 5/00 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
G01D 3/02 - Measuring arrangements with provision for the special purposes referred to in the subgroups of this group with provision for altering or correcting the transfer function
56.
STRESS REDUCED DIAPHRAGM FOR A MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR
A micro-electro-mechanical system (MEMS) sensor can comprise a substantially rigid layer having a center. The MEMS sensor can further comprise a movable membrane that can be separated by a gap from, and be disposed substantially parallel to, the substantially rigid layer. The MEMS sensor can further include a plurality of pedestals extending into the gap, where a first pedestal of the plurality of pedestals can be of a first size, and be disposed a first distance from the center, and a second pedestal of the plurality of pedestals can be a second size different from the first size, and be disposed at a second distance from the center. In another aspect, the substantially rigid layer and the movable membrane can be suspended by a plurality of suspension points. In another aspect, at least one of the plurality of pedestals can be disposed so as to limit a deformation of the movable membrane.
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
G01L 19/06 - Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
An audio activity detector device is disclosed. The audio activity detector device comprises a closed loop feedback regulating circuit that supplies an input signal representative of a time-varying voltage signal to a quantizer circuit, wherein the quantizer circuit, as a function of the input signal, converts the input signal to a quantizer discrete-time signal; a first circuit that, as a function of the discrete-time signal, determines a key quantizer statistic value for the quantizer discrete-time signal; and a second circuit that, as a function of the key quantizer statistic value, determines a signal statistic value for the input signal and a gain control value.
A device includes a sensor die, an electrical coupling, a substrate, a liquid detection unit, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The liquid detection unit electrically is coupled to the sensor die. The housing unit and the substrate are configured to house the sensor die, the liquid detection unit, and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The liquid detection unit detects presence of liquid within an interior environment of the housing unit. In some embodiments, the device further includes a gel filled within the interior environment of the housing unit covering the sensor die and the substrate. The gel, e.g., silicone, fluoro silicone, etc., is configured to protect the sensor die, the electrical coupling, and the substrate from exposure to the liquid.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
G01L 19/00 - MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
G01N 27/22 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
In a method for correcting a fingerprint image, it is determined whether an object is interacting with the fingerprint sensor. Provided an object is not interacting with the fingerprint sensor, it is determined whether to capture a darkfield candidate image at the fingerprint sensor, wherein the darkfield candidate image is an image absent an object interacting with the fingerprint sensor. Responsive to making a determination to capture the darkfield candidate image, the darkfield candidate image is captured at the fingerprint sensor. Provided an object is interacting with the fingerprint sensor, it is determined whether to model a darkfield candidate image at the fingerprint sensor. Responsive determining to model the darkfield candidate image, the darkfield candidate image is modeled at the fingerprint sensor. A darkfield estimate is updated with the darkfield candidate image. A fingerprint image is captured at the fingerprint sensor. The fingerprint image is corrected using the darkfield estimate.
An exemplary sensor may include a MEMS layer anchored to a cap and a substrate by anchoring portions of the MEMS layer. A suspended spring-mass system may include springs, at least one rigid mass, and at least one movable mass. The anchoring springs may be torsionally compliant about one or more axes and coupled to the rigid mass such that forces imparted by the anchoring portions are not transmitted to the movable mass.
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01C 19/5747 - Structural details or topology the devices having two sensing masses in anti-phase motion each sensing mass being connected to a driving mass, e.g. driving frames
61.
ULTRASONIC FINGERPRINT SENSOR WITH A NON-UNIFORM CONTACT LAYER
A sensor device comprising a two-dimensional array of ultrasonic transducers, wherein the two-dimensional array of ultrasonic transducers is substantially flat, a non-uniform contact layer overlying the two-dimensional array of ultrasonic transducers, and a sensor processor is described. The sensor device is configured to: transmit ultrasonic signals using the two-dimensional array of ultrasonic transducers for reflection from an object in contact with the non-uniform contact layer, wherein the ultrasonic signals traverse the non-uniform contact layer, receive reflected ultrasonic signals at the two-dimensional array of ultrasonic transducers, obtain non-uniformity data characterizing the non-uniform contact layer, control operating parameters of the sensor device based on the non-uniformity data, and generate an image of the object in contact with the non-uniform contact layer based on the reflected ultrasonic signals, wherein the image is corrected for non-uniformity of the non-uniform contact layer.
A sensor includes a substrate, an electrode, a deformable membrane, and a compensating structure. The substrate includes a first side and a second side. The first side is opposite to the second side. The substrate comprises a cavity on the first side. The electrode is positioned at a bottom of the cavity on the first side of the substrate. The deformable membrane is positioned on the first side of the substrate. The deformable membrane encloses the cavity and deforms responsive to external stimuli. The compensation structure is connected to outer periphery of the deformable membrane. The compensation structure creates a bending force that is opposite to a bending force of the deformable membrane responsive to temperature changes and thermal coefficient mismatch.
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
G01L 19/04 - Means for compensating for effects of changes of temperature
A device includes a die comprising a sensor. The device also includes a substrate that is coupled to the die via the electrical coupling. The device further includes a packaging container. The packaging container and the substrate form a housing for the die. The packaging container comprises an opening that exposes at least a portion of the die to an environment external to the housing. The exposed surfaces of the die, interior of the housing, the electrical coupling, and the substrate to the environment external to the housing through the opening are coated with a conformal film. The conformal film prevents liquid, e.g., water, gas, etc., contact to the exposed surfaces of the die, the electrical coupling and the substrate.
In a method for operating a fingerprint sensor including a plurality of ultrasonic transducers, receiving a plurality of images corresponding to different subsets of the ultrasonic transducers of the fingerprint sensor are received, wherein the plurality of images are non-adjacent. For each image of the plurality of images, it is determined whether the image of the plurality of images is indicative of a fingerprint. Provided a number of images of the plurality of images that are indicative of a fingerprint satisfies a threshold, it is determined whether the images of the plurality of images that are indicative of a fingerprint are collectively indicative of a fingerprint. Provided the plurality of images are collectively indicative of a fingerprint, it is determined that the plurality of images include a fingerprint.
A piezoelectric mi cromachined ultrasound transducer (PMUT) device may include a plurality of layers including a structural layer, a piezoelectric layer, and electrode layers located on opposite sides of the piezoelectric layer. Conductive barrier layers may be located between the piezoelectric layer and the electrodes to the prevent diffusion of the piezoelectric layer into the electrode layers.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
A microelectromechanical (MEMS) accelerometer senses linear acceleration perpendicular to a MEMS device plane of the MEMS accelerometer based on a rotation of a proof mass out-of-plane about a rotational axis. A symmetry axis is perpendicular to the rotational axis. The proof mass includes a symmetric portion that is symmetric about the symmetry axis and that is contiguous with an asymmetric portion that is asymmetric about the symmetry axis.
B81B 5/00 - Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
In a method for generating an estimated fingerprint image, a ridge/valley pattern of a fingerprint of a finger is received. A sensor image including a partial fingerprint of the finger is received. Ridge/valley characteristics of the fingerprint are extracted from the sensor image including the partial fingerprint. An estimated fingerprint image is generated based at least on the ridge/valley pattern of the fingerprint and the ridge/valley characteristics of the fingerprint.
A microelectromechanical (MEMS) sensor comprises MEMS components located within a MEMS layer and located relative to one or more electrodes. A plurality of proof masses are located within the MEMS layer and are not electrically coupled to each other within the MEMS layer. Both the first proof mass and the second proof mass move relative to at least a common electrode of the one or more electrodes, such that the relative position of each of the proof masses relative to the electrode may be sensed. A sensed parameter may be determined based on the sensed relative positions.
G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
G01C 19/5719 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
G01C 19/574 - Structural details or topology the devices having two sensing masses in anti-phase motion
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
A MEMS gyroscope includes a proof mass of a suspended spring mass system that is driven at a drive frequency. The proof mass moves relative to a sense electrode such that an overlap of the proof mass and sense electrode changes during the drive motion. A Coriolis force causes the proof mass to move relative to the sense electrode. The overlap and the movement due to the Coriolis force are sensed, and angular velocity is determined based on the magnitude of a signal generated due to a change in overlap and the Coriolis force.
A survey for building fingerprint maps for an area may be achieved using map information to generate a grid of nodes and links, then transforming the grid to a directed graph, generating an improved tour that entirely traverses the directed graph and providing at least one survey route based at least in part on the tour to a surveyor that will perform the survey route. The provided survey route may be traversed with at least one device having an integrated sensor assembly that outputs data representing motion of the device and recording signal measurements with each device at a plurality of positions to generate a fingerprint map. The traversal of the provided survey route may be assessed through in-route assessment and/or post-route assessment. Depending on the assessment, the provided survey route may be re-traversed or a next survey route may be scheduled.
A device for reducing package stress sensitivity of a sensor includes one or more anchor points for attaching to a substrate; a rigid frame structure configured to at least partially support the sensor; and a compliant element between each anchor point and the rigid frame structure. Also disclosed is a device for supporting a micro-electro-mechanical (MEMS) sensor comprising four anchor points for attaching to a substrate; a rigid frame structure configured to support the MEMS sensor; and a crab-leg suspension element between each anchor point and the rigid frame structure, wherein the crab-leg suspension element is compliant. A method for reducing package stress sensitivity of a sensor is provided as well.
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
72.
SYSTEM FOR FUSING ACOUSTIC AND INERTIAL POSITION DETERMINATION
A synchronization system for an acoustic signal-based and inertial signal-based positioning system is provided that generates a magnetic field as a synchronization signal. The modulated magnetic synchronization signal is transmitted by a transmitter of the positioning system and received by the receiver of the positioning system. The receiver may make an acoustic position determination for the transmitter based on a received modulated synchronization signal and may make an inertial position determination for the transmitter based on the received inertial signal, such that the acoustic position determination and the inertial position determination are fused.
G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
G01C 21/16 - Navigation; Navigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
G01S 5/26 - Position of receiver fixed by co-ordinating a plurality of position lines defined by path-difference measurements
G06F 3/0346 - Pointing devices displaced or positioned by the user; Accessories therefor with detection of the device orientation or free movement in a 3D space, e.g. 3D mice, 6-DOF [six degrees of freedom] pointers using gyroscopes, accelerometers or tilt-sensors
G06F 3/033 - Pointing devices displaced or positioned by the user; Accessories therefor
G01S 5/18 - Position-fixing by co-ordinating two or more direction or position-line determinations; Position-fixing by co-ordinating two or more distance determinations using ultrasonic, sonic, or infrasonic waves
G01S 5/30 - Determining absolute distances from a plurality of spaced points of known location
G06F 3/038 - Control and interface arrangements therefor, e.g. drivers or device-embedded control circuitry
73.
THREE DIMENSIONAL OBJECT-LOCALIZATION AND TRACKING USING ULTRASONIC PULSES WITH SYNCHRONIZED INERTIAL POSITION DETERMINATION
A tracking method is disclosed. The method may include displaying visual content on a screen. A base station may be stationary with respect to the screen while the visual content is being displayed. In contrast, one or more objects may move with respect to the screen while the visual content is being displayed. The one or more objects may be tracked so that the movement thereof may be used to alter the visual content. Such tracking may involve the base station and the one or more objects sending and/or receiving one or more ultrasonic pulses. The tracked object also determines information using an inertial sensor assembly that receives a synchronization signal coordinated with the one or more ultrasonic pulses. Time-difference-of-arrival and/or time-of-flight of the one or more ultrasonic pulses may then be used to estimate a relative location and/or a relative orientation of the one or more objects with respect to the base station in three dimensional space, so that the estimate is fused with information determined by the inertial sensor assembly using the synchronization signal.
G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
G01C 21/16 - Navigation; Navigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
G01S 5/26 - Position of receiver fixed by co-ordinating a plurality of position lines defined by path-difference measurements
G06F 3/0346 - Pointing devices displaced or positioned by the user; Accessories therefor with detection of the device orientation or free movement in a 3D space, e.g. 3D mice, 6-DOF [six degrees of freedom] pointers using gyroscopes, accelerometers or tilt-sensors
G06F 3/033 - Pointing devices displaced or positioned by the user; Accessories therefor
G01S 5/18 - Position-fixing by co-ordinating two or more direction or position-line determinations; Position-fixing by co-ordinating two or more distance determinations using ultrasonic, sonic, or infrasonic waves
G01S 5/30 - Determining absolute distances from a plurality of spaced points of known location
A MEMS sensor includes a MEMS layer, a cap layer, and a substrate layer. The MEMS layer includes a suspended spring-mass system that moves in response to a sensed inertial force. The suspended spring-mass system is suspended from one or more anchors. The anchors are coupled to each of the cap layer and the substrate layer by anchoring components. The anchoring components are offset such that a force applied to the cap layer or the substrate layer causes a rotation of the anchor and such that the suspended spring-mass system substantially remains within the original MEMS layer.
G01C 19/5783 - Mountings or housings not specific to any of the devices covered by groups
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
In a method for darkfield tracking at a sensor, it is determined whether an object is interacting with the sensor. Provided an object is not interacting with the sensor, a determination that a darkfield candidate image can be captured at the sensor is made. It is determined whether to capture a darkfield candidate image at the sensor based at least in part on the determination that a darkfield candidate image can be captured at the sensor. Responsive to making a determination to capture the darkfield candidate image, the darkfield candidate image is captured at the sensor, wherein the darkfield candidate image is an image absent an object interacting with the sensor. A darkfield estimate is updated with the darkfield candidate image.
The present invention relates to systems and methods for operating a microphone mesh network. In one embodiment, a method includes connecting, via a device comprising a processor, to one or more active microphones in an area via a network; instructing, via the device, one or more selected microphones of the one or more active microphones to capture audio from an acoustic source; and receiving, via the device, the audio from the one or more selected microphones as input to one or more applications.
H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.
G01P 21/00 - Testing or calibrating of apparatus or devices covered by the other groups of this subclass
G01P 15/13 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by measuring the force required to restore a proofmass subjected to inertial forces to a null position
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
B81B 5/00 - Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
G01C 19/5719 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
The present invention relates to systems and methods for measuring misalignment between layers of a semiconductor device. In one embodiment, a method includes applying an input voltage to respective ones of one or more first electrodes associated with a first conductive layer of a semiconductor device; sensing an electrical property of one or more second electrodes associated with a second conductive layer of the semiconductor device in response to applying the input voltage to the respective ones of the one or more first electrodes; and calculating a misalignment between the first conductive layer of the semiconductor device and the second conductive layer of the semiconductor device in an in-plane direction as a function of the electrical property of the one or more second electrodes.
In a method for detection of defective ultrasonic transducers in an in ultrasonic sensing device, an ultrasonic signal is generated at an ultrasonic sensing device comprising a plurality of ultrasonic transducers. A reflected ultrasonic signal corresponding to the ultrasonic signal is received at at least one ultrasonic transducer of the plurality of ultrasonic transducers. It is determined whether performance the at least one ultrasonic transducer is degraded based at least in part on the reflected ultrasonic signal.
In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure. The angular rate sensor further includes an actuator for driving the drive mass into oscillation along a first axis in plane to the substrate and for driving the rotating structure into rotational oscillation around a second axis normal to the substrate; and a transducer to sense the motion of the rotating structure in response to a Coriolis force in a sense mode. In a second aspect the angular rate sensor comprises a substrate and two shear masses which are parallel to the substrate and anchored to the substrate via flexible elements. In further embodiments, a dynamically balanced 3-axis gyroscope architecture is provided.
G01C 19/574 - Structural details or topology the devices having two sensing masses in anti-phase motion
G01C 19/5755 - Structural details or topology the devices having a single sensing mass
G01C 19/5747 - Structural details or topology the devices having two sensing masses in anti-phase motion each sensing mass being connected to a driving mass, e.g. driving frames
81.
IMAGE GENERATION IN AN ELECTRONIC DEVICE USING ULTRASONIC TRANSDUCERS
A method for generating a composite image having an increased image pixel density by an array of ultrasonic transducers having a given spatial density is provided. The method comprises capturing a first set of pixels at an ultrasonic sensor using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of ultrasonic transducers. The first beamforming pattern and the second beamforming pattern are different. Pixels of the second set of pixels correspond to positions between pixels of the first set of pixels. The method additionally comprises combining the first and second sets of pixels to form the composite image.
Facilitating live fingerprint detection utilizing an integrated ultrasound and infrared (IR) sensor is presented herein. A fingerprint sensor can comprise a first substrate comprising the IR sensor, and a second substrate comprising an ultrasonic transducer. The second substrate is attached to a top portion of the first substrate, and a temperature output of the IR sensor facilitates a determination that a fingerprint output of the ultrasonic transducer corresponds to a finger. The IR sensor can comprise polysilicon comprising a thermopile and an array of photonic crystals thermally coupled to the thermopile.
Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
The present invention relates to systems and methods for detecting gases in an environment using chemical and thermal sensing. In one embodiment, a method includes exposing a chemiresistor embedded within a sensor pixel to a gas in an environment; setting a heater embedded within the sensor pixel to a sensing temperature, the sensing temperature being greater than room temperature; measuring an electrical resistance of the chemiresistor in response to setting the heater to the sensing temperature; and in response to a difference between the electrical resistance of the chemiresistor and a reference electrical resistance being less than a threshold, supplying a fixed power input to the heater embedded within the sensor pixel and measuring a temperature of the sensor pixel relative to a reference temperature.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
G01N 27/18 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature caused by changes in the thermal conductivity of a surrounding material to be tested
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
85.
OUT-OF-PLANE SENSING GYROSCOPE ROBUST TO EXTERNAL ACCELERATION AND ROTATION
A gyroscope includes drive portions, lever arms, and proof masses located in a device plane. The lever arms are caused to rotate about an anchoring point based on anti-phase movement of the drive portions along a first axis in the device plane, and are coupled to the proof masses to cause the proof masses to move in anti-phase along an axis perpendicular to the first axis in the device plane. In response to a Coriolis force applied to the proof masses, the lever arm rotates out of plane and the proof masses move relative to sense electrodes. The movement of the proof masses with respect to the sense electrodes is used to measure angular velocity.
G01C 19/574 - Structural details or topology the devices having two sensing masses in anti-phase motion
G01C 19/5747 - Structural details or topology the devices having two sensing masses in anti-phase motion each sensing mass being connected to a driving mass, e.g. driving frames
A MEMS sensor includes a proof mass that is suspended over a substrate. A sense electrode is located on a top surface of the substrate parallel to the proof mass, and forms a capacitor with the proof mass. The sense electrodes have a plurality of slots that provide improved performance for the MEMS sensor. A measured value sensed by the MEMS sensor is determined based on the movement of the proof mass relative to the slotted sense electrode.
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
87.
ANCHORING STRUCTURE FOR A SENSOR INSENSITIVE TO ANCHOR MOVEMENT
A MEMS sensor includes a substrate and a MEMS layer. A plurality of anchoring points within the MEMS layer suspend a suspended spring-mass system that includes active micromechanical components that respond to a force of interest such as linear acceleration, angular velocity, pressure, or magnetic field. Springs and rigid masses couple the active components to the anchoring points, such that displacements of the anchoring points do not substantially cause the active components within the MEMS layer to move out-of-plane.
Systems and methods are disclosed for coordinating applications by detecting a touch input and a related touch input at device locations associated with the applications, one of which is a user authentication application. A parameter may be established with the user authentication application so that the other application runs with the at least one parameter.
The positioning/navigation solution of a portable device may be enhanced by obtaining motion sensor data, estimating a trajectory for the portable device from the motion sensor data, obtaining map information for an environment encompassing locations of the portable device, representing the estimated trajectory using a set of connected vectors and performing global shape matching for the set of connected vectors as an aggregate whole from start to end of the trajectory to the map information as a global optimization problem to derive a solution path.
G01C 21/20 - Instruments for performing navigational calculations
G01C 21/16 - Navigation; Navigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
90.
MULTI-PATH SIGNAL PROCESSING FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) SENSORS
Multi-path signal processing for microelectromechanical systems (MEMS) sensors is described. An exemplary MEMS sensor apparatus can comprise a single MEMS sensor element and an associated integrated circuit (IC) that facilitates generating multiple output signals having different output signal electrical characteristics required by a host system. Provided implementations can minimize cost and IC die area of associated MEMS sensor apparatuses and systems by employing one or more signal multiplexers (MUXs) on a single common signal path from the single MEMS sensor element. In addition, various methods of generating multiple output signals having different output signal electrical characteristics from a single MEMS sensor element are described.
G01C 19/5776 - Signal processing not specific to any of the devices covered by groups
G01P 1/00 - MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION OR SHOCK; INDICATING PRESENCE OR ABSENCE OF MOVEMENT; INDICATING DIRECTION OF MOVEMENT - Details of instruments
H04R 1/04 - Structural association of microphone with electric circuitry therefor
A method includes receiving a signal from a sensor. The signal includes a first in-phase component and a first quadrature component. The first in-phase and quadrature components are identified. A rate signal is applied to the sensor and the sensor generates a sensed rate signal. A second in-phase and quadrature components associated with the sensed rate signal are determined. A phase error based on the first and the second in-phase components, and the first and the second quadrature components is determined. The method may further include reducing error in measurements associated with the sensor by dynamically compensating for the determined phase error, e.g., by modifying a clock signal, by changing a demodulation phase of a demodulator used to identify the in-phase and the quadrature components.
A micro-electro-mechanical system includes a proof mass, an anchor, an amplifier, a sense element, a reference element, and a feedback element. The proof mass is configured to move in response to a stimulus. The anchor is coupled to the proof mass via a spring. The amplifier is configured to receive a proof mass signal from the proof mass via the spring and the anchor. The amplifier may be configured to amplify the received proof mass signal to generate an output signal. The sense element may be connected between the proof mass and a first input signal. The reference element may be connected between the anchor and a second input signal. The feedback element may be connected between the proof mass and the output signal. The feedback element and the sense element may change in response to proof mass displacement.
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01C 19/5776 - Signal processing not specific to any of the devices covered by groups
G01P 15/12 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by alteration of electrical resistance
93.
INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND PRESSURE SENSOR
Integrated microelectromechanical systems (MEMS) acoustic sensor devices are disclosed. Integrated MEMS acoustic sensor devices can comprise a MEMS acoustic sensor element and a pressure sensor within the back cavity associated with the MEMS acoustic sensor element. Integrated MEMS acoustic sensor devices can comprise a port adapted to receive acoustic waves or pressure. Methods of fabrication are also disclosed.
A micro-electro-mechanical system sensor device is disclosed. The sensor device comprises a micro-electro-mechanical system (MEMS) layer, comprising: an actuator layer and a cover layer, wherein a portion of the actuator layer is coupled to the cover layer via a dielectric; and an out-of-plane sense element interposed between the actuator layer and the cover layer, wherein the MEMS device layer is connected to a complementary metal-oxide-semiconductor (CMOS) substrate layer via a spring and an anchor.
In a method for operating a fingerprint sensor comprising a plurality of ultrasonic transducers, a first subset of ultrasonic transducers of the fingerprint sensor are activated, the first subset of ultrasonic transducers for detecting interaction between an object and the fingerprint sensor. Subsequent to detecting interaction between an object and the fingerprint sensor, a second subset of ultrasonic transducers of the fingerprint sensor are activated, the second subset of ultrasonic transducers for determining whether the object is a human finger, wherein the second subset of ultrasonic transducers comprises a greater number of ultrasonic transducers than the first subset of ultrasonic transducers.
A Piezoelectric Micro machined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. The PMUT is also configured to operate in a Surface Acoustic Wave (SAW) mode. Also provided are an integrated MEMS array, a method for operating an array of PMUT / SAW dual-mode devices, and a PMUT / SAW dual-mode device.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
H03H 9/25 - Constructional features of resonators using surface acoustic waves
An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers including a plurality of sub-arrays of ultrasonic transducers, wherein a sub-array of ultrasonic transducers of the plurality of sub-arrays of ultrasonic transducers is independently controllable, and wherein a sub-array of ultrasonic transducers has an associated receive channel. A plurality of shift registers is configured to select a receive pattern of ultrasonic transducers of the two-dimensional array of ultrasonic transducers to activate during a receive operation. An array controller is configured to control selection of the ultrasonic transducers during the receive operation according to the receive pattern and configured to shift a position of the receive pattern within the plurality of shift registers such that the ultrasonic transducers activated during the receive operation moves relative to and within the two-dimensional array of ultrasonic transducers.
G10K 11/34 - Sound-focusing or directing, e.g. scanning using electrical steering of transducer arrays, e.g. beam steering
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers. A signal generator is configured to generate a plurality of transmit signals, wherein each transmit signal of the plurality of transmit signals has a different phase delay relative to other transmit signals of the plurality of transmit signals. A plurality of shift registers is configured to store a beamforming space including a beamforming pattern to apply to the two-dimensional array, wherein the beamforming pattern identifies a transmit signal of the plurality of transmit signals that is applied to each ultrasonic transducer of the beamforming space that is activated during a transmit operation. An array controller is configured to control activation of ultrasonic transducers during a transmit operation according to the beamforming pattern and configured to shift a position of the beamforming space within the plurality of shift registers such that the beamforming space moves within the two-dimensional array.
G10K 11/34 - Sound-focusing or directing, e.g. scanning using electrical steering of transducer arrays, e.g. beam steering
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
99.
SUPPLEMENTAL SENSOR MODES AND SYSTEMS FOR ULTRASONIC TRANSDUCERS
A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT / CMUT dual-mode devices, and a PMUT / CMUT dual-mode device.
B06B 1/02 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
100.
AN ULTRASONIC TRANSDUCER WITH A NON-UNIFORM MEMBRANE
A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device includes a substrate, an edge support structure connected to the substrate, and a membrane connected to the edge support structure such that a cavity is defined between the membrane and the substrate, the membrane configured to allow movement at ultrasonic frequencies, the membrane having non-uniform stiffness. The membrane includes a piezoelectric layer, a first electrode and a second electrode coupled to opposing sides of the piezoelectric layer, and a mechanical support layer coupled to one of the first electrode and the second electrode.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
G10K 9/122 - Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated using piezoelectric driving means
G10K 13/00 - Cones, diaphragms, or the like, for emitting or receiving sound in general
H01L 41/04 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof - Details of piezo-electric or electrostrictive elements
patents
