The present invention relates to a fixed-fixed membrane for a microelectromechanical system (MEMS) microphone. In one embodiment,
a MEMS acoustic sensor includes a substrate; a membrane situated parallel to the substrate; and at least one vent formed into the membrane, wherein the at least one vent is a curved opening in the membrane, and wherein the at least one vent is disposed substantially along a length of the membrane.
A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
Acoustic and other activity detection signaling is provided herein. Operations of a method can include determining a micro-electromechanical system (MEMS) device is no longer in an initialization state and receiving a first signal that instructs the MEMS device to perform event activity detection. The method can also include receiving one or more event signals and determining that an event signal of one or more event signals satisfies a defined event characteristic. The method can also include outputting a second signal that comprises information indicative of a detection of event activity at the MEMS device being more than the defined event characteristic.
G10L 25/18 - Speech or voice analysis techniques not restricted to a single one of groups characterised by the type of extracted parameters the extracted parameters being spectral information of each sub-band
G10L 25/51 - Speech or voice analysis techniques not restricted to a single one of groups specially adapted for particular use for comparison or discrimination
APPLYING A POSITIVE FEEDBACK VOLTAGE TO AN ELECTROMECHANICAL SENSOR UTILIZING A VOLTAGE-TO-VOLTAGE CONVERTER TO FACILITATE A REDUCTION OF CHARGE FLOW IN SUCH SENSOR REPRESENTING SPRING SOFTENING
Reducing a spring softening effect on a capacitive sense element of an electromechanical sensor is presented herein. A system, such as a microphone or an accelerometer, comprises an electromechanical sensor and a voltage-to-voltage converter component. The electromechanical sensor comprises a capacitive sense element and a bias voltage component that applies a bias voltage to a sense electrode of the capacitive sense element. The voltage-to-voltage converter component couples a positive feedback voltage to the sense electrode to maintain a constant charge at the sense electrode to facilitate a reduction of charge flow in the electromechanical sensor representing a spring softening effect on the capacitive sense element. In an example, the spring softening effect on the sense element alters a resonant frequency of the sense element and a gain of the sense element. In another example, the charge flow corresponds to a parasitic capacitance that is electrically coupled to the sense electrode.
G01P 1/00 - MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION OR SHOCK; INDICATING PRESENCE OR ABSENCE OF MOVEMENT; INDICATING DIRECTION OF MOVEMENT - Details of instruments
G01P 15/00 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
An ultrasonic transducer device comprises a piezoelectric micromachined ultrasonic transducer (PMUT), a transmitter with first and second differential outputs, and a controller. The PMUT includes a membrane layer. A bottom electrode layer, comprising a first bottom electrode and a second bottom electrode, is disposed above the membrane layer. The piezoelectric layer is disposed above the bottom electrode layer. The top electrode layer is disposed above the piezoelectric layer and comprises a segmented center electrode disposed above a center of the membrane layer and a segmented outer electrode spaced apart from the segmented center electrode. The controller, responsive to the PMUT being placed in a transmit mode, is configured to couple the first and second segments of the bottom electrode layer with ground, couple the first output of the transmitter with the segments of the segmented center electrode, and couple the second output with the segments of the segmented outer electrode.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
H10N 30/87 - Electrodes or interconnections, e.g. leads or terminals
6.
SIGNAL-TO-NOISE RATIO FOR PHOTOACOUSTIC GAS SENSORS
A bi-directional photoacoustic gas sensor includes a first photoacoustic cell, where an electromagnetic radiation source emits radiation to interact with an external gas and generate pressure waves that are detected by a MEMS diaphragm. A second photoacoustic cell has an interior volume and acoustic compliance that corresponds to the interior volume and acoustic compliance of the first photoacoustic cell. Processing circuitry within a substrate uses a first acoustic signal, received by the first photoacoustic cell, and a second acoustic signal, received by the second photoacoustic cell, to determine a bi-directional response of the gas sensor to remove noise and improve the sensor's signal-to-noise ratio.
G01N 21/17 - Systems in which incident light is modified in accordance with the properties of the material investigated
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
7.
Piezoelectric Micromachined Ultrasonic Transducer With A Patterned Membrane Structure
A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a substrate having an opening therethrough and a membrane attached to the substrate over the opening. An actuating structure layer on a surface of the membrane includes a piezoelectric layer sandwiched between the membrane and an upper electrode layer. The actuating structure layer is patterned to selectively remove portions of the actuating structure from portions of the membrane to form in a central portion proximate a center of the open cavity and three or more rib portions projecting radially outward from the central portion.
H10N 30/057 - Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
H10N 30/87 - Electrodes or interconnections, e.g. leads or terminals
Utilization of microphone ultrasonic response is described. A system, comprising: a microelectromechanical system (MEMS) microphone device configured to capture signal data representing an ultrasonic signal and an audio-band signal simultaneously, and a processing circuitry configured to adjust a configuration parameter associated with the MEMS microphone device based on the ultrasonic signal.
A system, comprising: a sigma-delta modulator using an integrator of a cascade-of-integrator feedback topology to perform operations is disclosed. The operations can comprise in response to receiving a gain value, applying the gain value to a group of feed-forward coefficients, determining a change in the gain value, and adjusting, during a clock cycle of a defined time period, a plurality of state variables of the sigma-delta modulator by multiplying each of the state variables by the scale factor that is a ratio of the gain value after determining the change in the gain value the gain value before determining the change in the gain value.
An example embodiment includes a head worn electronic device comprising a transceiver for communicating with a host device, an accelerometer having a plurality of axes for detecting three-dimensional forces applied to the head worn electronic device, and a processor. The processor is configured to receive a three-dimensional vibration vector from the accelerometer caused by a voice of a user while the head worn electronic device is positioned in a user's ear, process the three-dimensional vibration vector to determine a voice activity detection axis that correlates with vibrations caused by the voice of the user, perform processing of data from the voice activity detection axis to detect voice activity of the user, and send an instruction to the host device via the transceiver to control the host device based on the voice activity detection.
A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
A device comprises a processor communicatively coupled with an ultrasonic sensor which is configured to repeatedly emit ultrasonic pulses during transmit periods which are interspersed with receive periods. Returned ultrasonic signals corresponding to the emitted ultrasonic pulses are received by the ultrasonic sensor during the receive periods. The processor is configured to direct the ultrasonic sensor to listen, during a listening window, for a potentially interfering ultrasonic signal from a second ultrasonic sensor. The listening window is prior to a transmit period of the transmit periods. In response to detecting the potentially interfering ultrasonic signal during the listening window, the processor is configured to adjust operation of the ultrasonic sensor to avoid an ultrasonic collision with the second ultrasonic sensor to facilitate coexistence of the ultrasonic sensor and the second ultrasonic sensor in an operating environment shared by the ultrasonic sensor and the second ultrasonic sensor.
G01S 7/52 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group
G01S 15/10 - Systems for measuring distance only using transmission of interrupted, pulse-modulated waves
13.
COEXISTENCE OF ULTRASONIC TRANSDUCERS IN AN OPERATING ENVIRONMENT
A device comprises a processor coupled with an ultrasonic transducer which is configured to repeatedly emit ultrasonic pulses during transmit periods which are interspersed with listening windows. Each sequential pair of the transmit periods is separated by a single listening window of the listening windows. During a fixed portion of a listening window of the listening windows the ultrasonic transducer is configured to receive returned signals corresponding to an emitted ultrasonic pulse of the ultrasonic pulses which was transmitted during a transmit period of the transmit periods that immediately preceded the listening window. The processor randomizes an overall length of each listening window of the listening windows. The processor directs filtering of returned signals received during a plurality of the randomized listening windows to achieve filtered returned signals. The processor detects, using the filtered returned signals, a moving object in a field of view of the ultrasonic transducer.
Disclosed embodiments provide a self-contained topology that enables a significant noise reduction of capacitive sensor readout interfaces. For example, various embodiments can provide low noise capacitive sensor readout interfaces or analog front ends having a main buffer amplifier in a bootstrap configuration, wherein a bootstrap loop configuration comprises a negative capacitance coupled to an input of the main buffer amplifier with a negative impedance converter.
G01R 27/26 - Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants
15.
Parameterized Register Programming Protocol (RPP) To Save Layout Routing Area
A parameterized register interface of an integrated circuit and methods of register programming. An integrated circuit includes a digital controller, at least one client comprising at least one programmable register and a parameterized bus coupled to the digital controller and the client. The digital controller is configured to: transfer, via the parameterized bus, address data and/or register data between the digital controller and the client according to one or more interface signals conveyed over the parameterized bus; generate a transaction command comprising at least one transaction specific to the programmable register of the client, the transaction command generated according to a predetermined register programming protocol; and transfer, via the parameterized bus, the transaction command together with at least one predetermined combination of the interface signals to the client. The programmable register is configured to perform the transaction in accordance with the transaction command.
The present invention relates to an incremental analog to digital converter incorporating noise shaping and residual error quantization. In one embodiment, a circuit includes an incremental analog to digital converter, comprising a loop filter that filters an analog input signal in response to receiving a reset signal, resulting in a filtered analog input signal, and a successive approximation register (SAR) quantizer, coupled with the filtered analog input signal, that converts the filtered analog input signal to an intermediate digitized output of a first resolution based on a reference voltage, wherein the SAR quantizer comprises a feedback loop that shapes quantization noise generated by the SAR quantizer as a result of converting the filtered analog input signal; and a digital filter, coupled with the intermediate digitized output, that generates a digitized output signal of a second resolution, greater than the first resolution, by digitally filtering the intermediate digitized output.
H03M 1/46 - Analogue value compared with reference values sequentially only, e.g. successive approximation type with digital/analogue converter for supplying reference values to converter
H03M 1/06 - Continuously compensating for, or preventing, undesired influence of physical parameters
A MEMS sensor includes at least one anchor that extends into a MEMS layer and a proof mass suspended from the at least one anchor. Each anchor is coupled to the proof mass via two compliant springs that are oriented perpendicular to each other and attached to a respective anchor. The compliant springs absorb non-measured external forces such as shear forces that are applied to the sensor packaging, preventing these forces from modifying the relative location and operation of the proof mass.
Acoustic activity detection is provided herein. Operations of a method can include receiving an acoustic signal at a micro-electromechanical system (MEMS) microphone. Based on portions of the acoustic signal being determined to exceed a threshold signal level, output pulses are generated. Further, the method can include extracting information representative of a frequency of the acoustic signal based on respective spacing between rising edges of the output pulses.
A dynamically balanced 3-axis gyroscope architecture is provided. Various embodiments described herein can facilitate providing linear and angular momentum balanced 3-axis gyroscope architectures for better offset stability, vibration rejection, and lower part-to-part coupling.
G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
G01C 19/5747 - Structural details or topology the devices having two sensing masses in anti-phase motion each sensing mass being connected to a driving mass, e.g. driving frames
G01C 19/5762 - Structural details or topology the devices having a single sensing mass the sensing mass being connected to a driving mass, e.g. driving frames
20.
PRESSURE SENSOR AND MANUFACTURING METHOD FOR THE SAME
A pressure sensor includes a first electrode, a plurality of cavities, and a second electrode. The second electrode is disposed opposite the first electrode through the plurality of cavities. The second electrode includes a flat structure spanning two adjacent cavities of the plurality of cavities.
G01L 9/12 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
21.
MEMS design with shear force rejection for reduced offset
A MEMS sensor includes a central anchoring region that maintains the relative position of an attached proof mass relative to sense electrodes in the presence of undesired forces and stresses. The central anchoring region includes one or more first anchors that rigidly couple to a cover substrate and a base substrate. One or more second anchors are rigidly coupled to only the cover substrate and are connected to the one or more first anchors within the MEMS layer via an isolation spring. The proof mass in turn is connected to the one or more second anchors via one or more compliant springs.
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
22.
Round robin sensor device for processing sensor data
A round robin sensor device for processing sensor data is provided herein. The sensor device includes a multiplexer stage configured to sequentially select sensor outputs from one or more sensors continuously. Continuously and sequentially selecting sensor outputs results in a stream of selected sensor outputs. The sensor device also includes a charge-to-voltage converter operatively coupled to the multiplexer stage and configured to convert a charge from a first sensor of the one or more sensors to a voltage. Further, the sensor device includes a resettable integrator operatively coupled to the charge-to-voltage converter and configured to demodulate and integrate the voltage, resulting in an integrated voltage. Also included in the sensor device is an analog-to-digital converter operatively coupled to the resettable integrator and configured to digitize the integrated voltage to a digital code.
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
H03M 1/38 - Analogue value compared with reference values sequentially only, e.g. successive approximation type
G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
23.
Motion sensor with sigma-delta analog-to-digital converter having resistive continuous-time digital-to-analog converter feedback for improved bias instability
A motion sensor with sigma-delta analog-to-digital converter (ADC) having improved bias instability is presented herein. Differential outputs of a differential amplifier of the sigma-delta ADC are electrically coupled, via respective capacitances, to differential inputs of the differential amplifier. To minimize bias instability corresponding to flicker noise that has been injected into the differential inputs, the differential inputs are electrically coupled, via respective pairs of electronic switches, to feedback resistances based on a pair of switch control signals. In this regard, a first feedback resistance of the feedback resistances is electrically coupled to a first defined voltage, and a second feedback resistance of the feedback resistances is electrically coupled to a second defined reference voltage. The differential outputs are electrically coupled to differential inputs of a differential comparator of the sigma-delta ADC, and complementary outputs of the differential comparator comprise the pair of switch control signals.
G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
G01P 1/00 - MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION OR SHOCK; INDICATING PRESENCE OR ABSENCE OF MOVEMENT; INDICATING DIRECTION OF MOVEMENT - Details of instruments
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
G01C 19/5776 - Signal processing not specific to any of the devices covered by groups
Exemplary multipath digital microphones described herein can comprise exemplary embodiments of automatic gain control and multipath digital audio signal digital signal processing chains, which allow low power and die size to be achieved as described herein, while still providing a high DR digital microphone systems. Further non-limiting embodiments can facilitate switching between multipath digital audio signal digital signal processing chains while minimizing audible artifacts associated with either the change in the gain automatic gain control amplifiers switching between multipath digital audio signal digital signal processing chains.
A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
26.
METHOD AND SYSTEM FOR AUTOMATIC FACTORY CALIBRATION
A sensor may be automatically calibrated during manufacture by providing a sensor processing unit having an integrated sensor, performing a check to determine if the integrated sensor has been previously calibrated upon a reset. When it has been determined the integrated sensor has not been previously calibrated, an automated calibration pattern may be imparted to the sensor so that a calibration parameter is determined.
G01P 13/00 - Indicating or recording presence or absence of movement; Indicating or recording of direction of movement
G01S 11/14 - Systems for determining distance or velocity not using reflection or reradiation using ultrasonic, sonic or infrasonic waves
G06F 3/033 - Pointing devices displaced or positioned by the user; Accessories therefor
G01S 5/18 - Position-fixing by co-ordinating two or more direction or position-line determinations; Position-fixing by co-ordinating two or more distance determinations using ultrasonic, sonic, or infrasonic waves
G01D 18/00 - Testing or calibrating apparatus or arrangements provided for in groups
G06F 3/038 - Control and interface arrangements therefor, e.g. drivers or device-embedded control circuitry
G06F 3/0346 - Pointing devices displaced or positioned by the user; Accessories therefor with detection of the device orientation or free movement in a 3D space, e.g. 3D mice, 6-DOF [six degrees of freedom] pointers using gyroscopes, accelerometers or tilt-sensors
G01C 21/16 - Navigation; Navigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
G01S 11/16 - Systems for determining distance or velocity not using reflection or reradiation using difference in transit time between electromagnetic and sonic waves
G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
G01S 11/12 - Systems for determining distance or velocity not using reflection or reradiation using electromagnetic waves other than radio waves
A method including fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a hardmask on a second side of the device wafer, wherein the second side is planar. An etch stop layer is deposited over the hardmask and an exposed portion of the second side of the device wafer. A dielectric layer is formed over the etch stop layer. A via is formed within the dielectric layer. The via is filled with conductive material. A eutectic bond layer is formed over the conductive material. Portions of the dielectric layer uncovered by the eutectic bond layer is etched to expose the etch stop layer. The exposed portions of the etch stop layer is etched. A micro-electro-mechanical system (MEMS) device pattern is etched into the device wafer.
A gas sensor includes a plurality of sensing resistors that vary in resistance based on ambient temperature and the presence of certain gases, such as CO2 and H2O. The responses of each of the sensing resistors vary based on a base temperature of each of the sensing resistors. The base temperatures for each of the sensing resistors and configurations of the sensing resistors are selected to emphasize a response to a gas of interest (e.g., CO2) while de-emphasizing or canceling contributions from ambient temperature and gases that are not of interest (e.g., H2O).
G01N 27/18 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature caused by changes in the thermal conductivity of a surrounding material to be tested
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor
H05B 3/20 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
29.
SYSTEMS AND METHODS FOR CAPTURING STABILIZED IMAGES
Systems and methods are disclosed for capturing stabilized images. Motion of the mobile device is determined so that the relative position of the lens and image sensor may be adjusted to compensate for unintended motion. The relative position of the lens and image sensor may be periodically reset in response to a synchronization signal in between capturing images.
Embodiments for constant charge or capacitance for capacitive micro-electromechanical system (MEMS) sensors are presented herein. A MEMS device comprises a sense element circuit comprising a bias resistance, a charge-pump, and a capacitive sense element comprising an electrode and a sense capacitance. The charge-pump generates, at a bias resistor electrically coupled to the electrode, a bias voltage that is inversely proportional to a capacitance value comprising a value of the sense capacitance to facilitate maintenance of a nominally constant charge on the electrode. A sensing circuit comprises an alternating current (AC) signal source that generates an AC signal at a defined frequency; and generates, based on the AC signal, an AC test voltage at a test capacitance that is electrically coupled to the electrode. The sense element circuit generates, based on the AC test voltage at the defined frequency, an output signal representing the value of the sense capacitance.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
H02M 3/07 - Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
31.
MICROELECTROMECHANICAL SYSTEM MICROPHONE ARRAY CAPSULE
The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.
An inertial sensor such as a MEMS accelerometer or gyroscope has a proof mass that is driven by a self-test signal, with the response of the proof mass to the self-test signal being used to determine whether the sensor is within specification. The self-test signal is provided as a non-periodic self-test pattern that does not correlate with noise such as environmental vibrations that are also experienced by the proof mass during the self-test procedure. The sense output signal corresponding to the proof mass is correlated with the non-periodic self-test signal, such that an output correlation value corresponds only to the proof mass response to the applied self-test signal.
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
33.
HW programmable signal path event-based DSP for sensor mixed signal devices
A hardware-programmable digital signal path component for processing events from sensor mixed signal devices. A system includes a mixed signal component and a reconfigurable signal path component. The mixed signal component includes a group of sensor devices and generates one or more events from among the group of sensor devices. The signal path component receives the event(s), and includes a control unit component and a digital signal processor (DSP) component. The control unit component includes a programmable function enable mechanism, and distributes the received event(s) in combination with one or more functions among a set of predefined functions enabled by the programmable function enable mechanism. The DSP component is configured to perform one or more operations associated with the distributed event(s) in accordance with the enabled function(s).
An algorithm and architecture for sense transfer function estimation injects one or more test signals from a signal generator into a MEMS gyroscope to detect an output signal (e.g., proof mass output sense signal), including an in-phase (e.g., Coriolis) component and a quadrature component. The in-phase and quadrature components are encoded with reference signals to determine phase and/or gain variation and are processed via a variety of components (e.g., matrix rotation, digital gain, tones demodulator, transfer function errors estimation, etc.) to estimate a sense transfer function of the MEMS (e.g., Hs(fd)) and corresponding phase and/or gain offset of Hs(fd). The in-phase and quadrature components are also compensated for phase and/or gain offset by system components.
G01C 19/5656 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams the devices involving a micromechanical structure
G01C 25/00 - Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
35.
ULTRASONIC CLIFF DETECTION AND DEPTH ESTIMATION USING TILTED SENSORS
A robotic cleaning appliance includes a housing to which is coupled a surface treatment item and a sensor assembly with first and second transducers and an acoustic interface. The first sonic transducer transmits sonic signals through an acoustic interface and out of a first acoustic opening toward a surface beneath the robotic cleaning appliance. The sonic signals reflect from the surface as corresponding returned signals received by the second sonic transducer via a second acoustic opening port of the acoustic interface. A first annular ring is defined around the first acoustic opening port and a second annular rings is defined around the second acoustic opening port. The annular ring attenuate direct path echoes between the acoustic opening ports. The first and second acoustic opening ports are coupled the first and sonic transducers, respectively, via first and second horns; and the horns are tilted from orthogonal with the surface.
A robotic cleaning appliance includes a housing to which is coupled a surface treatment item and a sensor assembly with first and second transducers and an acoustic interface. The first sonic transducer transmits sonic signals through an acoustic interface and out of a first acoustic opening toward a surface beneath the robotic cleaning appliance. The sonic signals reflect from the surface as corresponding returned signals received by the second sonic transducer via a second acoustic opening port of the acoustic interface. A first plurality of annular rings is defined in the external surface around the first acoustic opening port and a second plurality of annular rings is defined in the external surface around the second acoustic opening port. The pluralities of annular rings attenuate direct path echoes from a subset of the transmitted sonic signals which attempt to travel across the external surface to the second acoustic opening port.
A modified version of a MEMS self-test procedure is presented that can be used to detect the amplitude and frequency of an external vibration from an ambient environment. The method implements processing circuitry that correlates an output sense signal, s(t), with a plurality of periodic signal portions and a plurality of shifted periodic signal portions to generate a plurality of correlation values. A frequency associated with the external vibration is determined based on the plurality of correlation values.
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
G01P 1/00 - MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION OR SHOCK; INDICATING PRESENCE OR ABSENCE OF MOVEMENT; INDICATING DIRECTION OF MOVEMENT - Details of instruments
G01D 1/08 - Measuring arrangements giving results other than momentary value of variable, of general application giving integrated values by intermittent summation over fixed periods of time
G01D 1/02 - Measuring arrangements giving results other than momentary value of variable, of general application giving mean values, e.g. root mean square values
G01D 1/16 - Measuring arrangements giving results other than momentary value of variable, of general application giving a value which is a function of two or more values, e.g. product or ratio
Described herein are methods and systems for controlling a sensor assembly with a plurality of same type sensors. Sensors are operated in active and inactive states. The activation state of at least one of the sensors is changed based on an operational parameter that relates to an environmental condition differentially affecting the plurality of same type sensors.
A hearable comprises a wearable structure including a speaker, a sensor, and a temperature compensating circuit which measures temperature in an environment of the sensor. A portion of the wearable structure, which includes the sensor and temperature compensating circuit, is disposed within a user’s ear when in use. A sensor processing unit which is communicatively coupled with the temperature compensating circuit: acquires temperature data from the temperature compensating circuit while the portion of the wearable structure is disposed within the ear of the user; builds a baseline model of normal temperature for the user; and compares a temperature measurement acquired from the temperature compensating circuit to the baseline model. In response to the comparison showing a deviation beyond a preset threshold from the baseline model, the sensor processing unit generates a health indicator for the user which is used to monitor an aspect of health of the user.
A61B 10/00 - Other methods or instruments for diagnosis, e.g. for vaccination diagnosis; Sex determination; Ovulation-period determination; Throat striking implements
40.
Systems and methods for operating a mems device based on sensed temperature gradients
An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
41.
Sensor with dimple features and improved out-of-plane stiction
A method includes fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a first mask on a second side of the device wafer, wherein the second side is planar. A plurality of dimple features is formed on an exposed portion on the second side of the device wafer. The first mask is removed from the second side of the device wafer. A second mask is deposited on the second side of the device wafer that corresponds to a standoff. An exposed portion on the second side of the device wafer is etched to form the standoff. The second mask is removed. A rough polysilicon layer is deposited on the second side of the device wafer. A eutectic bond layer is deposited on the standoff. In some embodiments, a micro-electro-mechanical system (MEMS) device pattern is etched into the device wafer.
Microelectromechanical system (MEMS) packages and methods of making thereof. A MEMS package includes at least one MEMS device disposed on a base substrate and a lid disposed on the base substrate. The lid is configured to enclose the at least one MEMS device. The lid includes a body portion configured to be coupled to the base substrate, a ceiling portion and a membrane. The ceiling portion, the body portion and the ceiling portion form a cavity in which the at least one MEMS device is enclosed. The membrane is configured to be in contact with the ceiling portion. The membrane is formed from a filtering fabric and is configured to substantially block one or more of liquids and contaminants from passing into the cavity.
Improving motion sensor robustness utilizing a room-temperature-volcanizing (RTV) material via a solder resist dam is presented herein. A sensor package comprises: a first semiconductor die; a second semiconductor die that is attached to the first semiconductor die to form a monolithic die; and a substrate comprising a top portion and a bottom portion, in which the top portion comprises a plurality of solder resist dams, the monolithic die is attached to the top portion of the substrate via the RTV material being disposed in a defined area of the top portion of the substrate, and the bottom portion of the substrate comprises electrical terminals that facilitate attachment and electrical coupling of signals of the sensor package to a printed circuit board.
A method includes depositing a passivation layer on a substrate; depositing and patterning a first polysilicon layer on the passivation layer; depositing and patterning a first oxide layer on the first polysilicon layer forming a patterned first oxide layer; depositing and patterning a second polysilicon layer on the patterned first oxide layer. A portion of the second polysilicon layer directly contacts a portion of the first polysilicon layer. A portion of the patterned second polysilicon layer corresponds to a bottom electrode. A second oxide layer is deposited on the patterned second polysilicon layer and on an exposed portion of the patterned first oxide layer. A portion of the second oxide layer corresponding to a sensing cavity is etched, exposing the bottom electrode. Another substrate is bonded to the second oxide layer enclosing the sensing cavity. A top electrode is disposed within the another substrate and positioned over the bottom electrode.
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
A pressure sensor comprises a polysilicon sensing membrane. The pressure sensor further includes one or more polysilicon electrodes disposed over a silicon substrate. The sensor also includes one or more polysilicon routing layers that electrically connects electrodes of the one or more polysilicon electrodes to one another, wherein the polysilicon sensing membrane deforms responsive to a stimuli and changes a capacitance between the polysilicon sensing membrane and the one or more polysilicon electrodes. The sensor also includes one or more vacuum cavities positioned between the polysilicon sensing membrane and the one or more polysilicon electrodes.
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
G01L 9/12 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance
Disclosed embodiments provide glitch prediction based on machine learning algorithms in mixed analog and digital systems, particularly directed to digital microelectromechanical (MEMS) multipath acoustic sensors or microphones, which allow seamless, low latency gain changes without audible artifacts or interruptions in the audio output signal.
An ultrasonic transducer device including a substrate, an edge support structure connected to the substrate, and a membrane connected to the edge support structure such that a cavity is defined between the membrane and the substrate, the membrane configured to allow movement at ultrasonic frequencies. The membrane includes a structural layer, a piezoelectric layer having a first surface and a second surface, a first electrode placed on the first surface of the piezoelectric layer, wherein the first electrode is located at the center of the membrane, a second electrode placed on the first surface of the piezoelectric layer, wherein the second electrode is a patterned electrode comprising more than one electrode components that are electrically coupled, and a third electrode coupled to the second surface of the piezoelectric layer and electrically coupled to ground.
A retinal projection display system includes at least one visible light source for projecting a visible light image, an infrared light source for projecting infrared light, a scanning mirror having a field of view larger than the visible light image, a reflective surface on which the visible light image is projected and on which the infrared light is reflected at least partially towards an eye of a user, wherein the reflective surface is larger than the visible light image, at least one infrared photodetector for receiving reflected infrared light that reflects off of the eye of the user, and a hardware computation module comprising a processor and a memory, the hardware computation module configured to determine a gaze direction of the user based at least in part on the reflected infrared light.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
49.
ANCHOR CONFIGURATIONS FOR AN ARRAY OF ULTRASONIC TRANSDUCERS
An ultrasonic transducer array including a substrate, a membrane overlying the substrate, the membrane configured to allow movement at ultrasonic frequencies, and a plurality of anchors connected to the substrate and connected to the membrane. The membrane includes a piezoelectric layer, a plurality of first electrodes, and a plurality of second electrodes, wherein each ultrasonic transducer of a plurality of ultrasonic transducers includes at least a first electrode and at least a second electrode. The plurality of anchors includes a first anchor including a first electrical connection for electrically coupling at least one first electrode to control circuitry and a second anchor including a second electrical connection for electrically coupling at least one second electrode. The ultrasonic transducer array could be either a two-dimensional array or a one-dimensional array of ultrasonic transducers.
A retinal projection display system includes a light source for projecting an image, a scanning mirror having a field of view larger than the image, and a reflective surface on which the image is projected, wherein the reflective surface is larger than the image. The scanning mirror projects the image onto a viewable region of the reflective surface such that the image is projected into a retina of a user.
Acoustic activity detection is provided herein. Operations of a method can include receiving an acoustic signal at a micro-electromechanical system (MEMS) microphone. Based on portions of the acoustic signal being determined to exceed a threshold signal level, output pulses are generated. Further, the method can include extracting information representative of a frequency of the acoustic signal based on respective spacing between rising edges of the output pulses.
A method includes forming a bumpstop from a first intermetal dielectric (IMD) layer and forming a via within the first IMD, wherein the first IMD is disposed over a first polysilicon layer, and wherein the first polysilicon layer is disposed over another IMD layer that is disposed over a substrate. The method further includes depositing a second polysilicon layer over the bumpstop and further over the via to connect to the first polysilicon layer. A standoff is formed over a first portion of the second polysilicon layer, and wherein a second portion of the second polysilicon layer is exposed. The method includes depositing a bond layer over the standoff.
A device includes a substrate and an intermetal dielectric (IMD) layer disposed over the substrate. The device also includes a first plurality of polysilicon layers disposed over the IMD layer and over a bumpstop. The device also includes a second plurality of polysilicon layers disposed within the IMD layer. The device includes a patterned actuator layer with a first side and a second side, wherein the first side of the patterned actuator layer is lined with a polysilicon layer, and wherein the first side of the patterned actuator layer faces the bumpstop. The device further includes a standoff formed over the IMD layer, a via through the standoff making electrical contact with the polysilicon layer of the actuator and a portion of the second plurality of polysilicon layers and a bond material disposed on the second side of the patterned actuator layer.
A device includes a substrate comprising a first standoff, a second standoff, a third standoff, a first cavity, a second cavity, and a bonding material covering a portion of the first, the second, and the third standoff. The first cavity is positioned between the first and the second standoffs, and the second cavity is positioned between the second and the third standoffs. The first cavity comprises a first cavity region and a second cavity region separated by a portion of the substrate extruding thereto, and wherein a depth associated with the first cavity region is greater than a depth associated with the second cavity. A surface of the first cavity is covered with a getter material.
The present disclosure relates to methods of enhancing a navigation solution about a device and a platform, wherein the mobility of the device may be constrained or unconstrained within the platform, and wherein the navigation solution is provided even in the absence of normal navigational information updates (such as, for example, GNSS). More specifically, the present method comprises utilizing measurements from sensors (e.g. accelerometers, gyroscopes, magnetometers etc.) within the device to calculate and resolve the attitude of the device and the platform, and the attitude misalignment between the device and the platform.
G01C 21/16 - Navigation; Navigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
G01C 25/00 - Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
G01C 21/20 - Instruments for performing navigational calculations
56.
SENSOR SIGNAL MULTIPLEXER AND DIGITIZER WITH ANALOG NOTCH FILTER AND OPTIMIZED SAMPLE FREQUENCY
The described technology is generally directed towards a sensor signal multiplexer and digitizer with analog notch filter and optimized sample frequency, and corresponding methods of use and manufacture. In some examples, the disclosed technologies can be used to reduce vibration sensitivity of an inertial measurement unit (IMU). The disclosed sensor signal multiplexer can sample sensor inputs on multiple input channels at a first, higher frequency, and integrate samples for each channel in order to generate lower frequency sensor outputs. The lower frequency sensor outputs can be converted to digital form.
A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.
G01N 25/56 - Investigating or analysing materials by the use of thermal means by investigating moisture content
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
G01L 19/06 - Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
G01L 19/00 - MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
G01N 27/22 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
G01N 27/04 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
Described herein are methods and systems for determining a relative position of different portions of a hinged device. Motion sensor data from sensor assemblies of each portion is fused to relate the device portions to a world frame. An angular orientation between the device portions is determined with respect to the hinge axis and accumulating sensor measurement errors are compensated by constraining determined axes of the sensor assemblies using the motion sensor data and known relationships between physical axes of the sensor assemblies and the mechanical hinge, such that the determined axes of the sensor assemblies are aligned along the hinge axis.
An interleaved cascaded integrator-comb (“CIC”) filter receives an interleaved sensor output signal, including a plurality of digitized sensor signals at an input clock rate. An integrator of the interleaved CIC filter processes the interleaved signal to output an integrated interleaved signal. A downsampler of the interleaved CIC filter buffers portions of the integrated interleaved corresponding to a decimation rate for the interleaved signal. The portions of the signals are provided to a comb filter, which outputs a decimated interleaved signal.
The described technology is generally directed towards an electrical current based temperature sensor and temperature information digitizer, referred to herein as a “temperature digitizer”. The temperature digitizer can include a sensor core, a digital to analog converter, a current comparator, and a processor. The processor can be configured to perform multiple current comparisons using the sensor core, digital to analog converter, and current comparator, and the processor can generate a digital code that reflects the results of the multiple current comparisons. The digital code represents the temperature.
G01K 7/01 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using semiconducting elements having PN junctions
61.
Applying a positive feedback voltage to an electromechanical sensor utilizing a voltage-to-voltage converter to facilitate a reduction of charge flow in such sensor representing spring softening
Reducing a sensitivity of an electromechanical sensor is presented herein. The electromechanical sensor comprises a sensitivity with respect to a variation of a mechanical-to-electrical gain of a sense element of the electromechanical sensor; and a voltage-to-voltage converter component that minimizes the sensitivity by coupling, via a defined feedback capacitance, a positive feedback voltage to a sense electrode of the sense element—the sense element electrically coupled to an input of the voltage-to-voltage converter component. In one example, the voltage-to-voltage converter component minimizes the sensitivity by maintaining, via the defined feedback capacitance, a constant charge at the sense electrode. In another example, the electromechanical sensor comprises a capacitive sense element comprising a first node comprising the sense electrode. Further, a bias voltage component can apply a bias voltage to a second node of the electromechanical sensor. In yet another example, the electromechanical sensor comprises a piezoelectric sense element.
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01P 1/00 - MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION OR SHOCK; INDICATING PRESENCE OR ABSENCE OF MOVEMENT; INDICATING DIRECTION OF MOVEMENT - Details of instruments
G01P 15/00 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
A microelectromechanical system (MEMS) microphone includes a cavity to receive an acoustic signal. The acoustic signal causes movement of a diaphragm relative to one or more other surfaces, which in turn results in an electrical signal representative of the received acoustic signal. A light sensor is included within the packaging of the MEMS microphone such that an output of the light sensor is representative of a light signal received with the acoustic signal. The output of the light sensor is used to modify the electrical signal representative of the received acoustic signal in a manner that limits light interference with an acoustical output signal.
Methods and systems for compensation of a microelectromechanical system (MEMS) sensor may include associating test temperature values with input test signal values, identifying temperature-input signal pairs, and applying one of the test temperature values and one of the test signal values to the MEMS sensor. Desired output signal values may be determined, with each of the desired output signal values corresponding to one of the applied temperature-input signal pairs. Measured output signal values from the MEMS sensor may be measured, with each of the measured output signal values corresponding to one of the applied temperature-input signal pairs. Compensation terms may be determined based on the plurality of temperature-input signal pairs, the corresponding plurality of measured output signal values, and the corresponding plurality of desired output signal values. Compensation terms may be used to modify a sense signal of the MEMS sensor.
G01C 19/5776 - Signal processing not specific to any of the devices covered by groups
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
64.
MEMS stress reduction structure embedded into package
A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.
Disclosed embodiments provide flexible performance, high dynamic range, microelectromechanical (MEMS) multipath digital microphones, which allow seamless, low latency transitions between audio signal paths without audible artifacts over interruptions in the audio output signal. Disclosed embodiments facilitate performance and power saving mode transitions maintaining high dynamic range capability.
An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.
A method includes forming an etch stop layer over a first side of a device wafer. The method also includes forming a polysilicon layer over the etch stop layer. A handle wafer is fusion bonded to the first side of the device wafer. A eutectic bond layer is formed on a second side of the device wafer. A micro-electro-mechanical system (MEMS) features are etched into the second side of the device wafer to expose the etch stop layer. The exposed etch stop layer is removed to expose the polysilicon layer. The exposed polysilicon layer is removed to expose a cavity formed between the handle wafer and the device wafer.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
68.
MEMS ELECTRICAL AND PHYSICAL CONNECTION VIA SOLDER COUPLINGS
A MEMS device, comprising a plurality of stacked layers, includes a plurality of solder couplings that mechanically fasten and electrically couple the MEMS device to an external component. The plurality of solder couplings is connected atop a portion of an upper surface that extends past an edge surface of a MEMS layer to form a shelf and are electrically connected via the shelf to receive signals generated by the MEMS device. These signals are provided to the external component via the solder couplings.
An ultrasonic transducer device comprises a controller and a differential piezoelectric micromachined ultrasonic transducer with a membrane later, a bottom electrode layer, a piezoelectric layer, and a top electrode layer comprising a first electrode with a positive voltage to displacement coefficient and a second electrode with a negative voltage to displacement coefficient. During a first period, the controller electrically decouples a first output of a first driver from the first electrode, electrically decouples a second output of a second driver from the second electrode, and electrically couples the first and second electrodes to equalize charge between them. During a second period, the controller electrically decouples the first and second electrodes, electrically couples the first output with the first electrode, and electrically couples the second output with the second electrode; where waveforms on the first and second outputs during the second time period are out of phase with one another.
B06B 1/02 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
70.
SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL SYSTEMS
Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
A robotic cleaning appliance includes a housing, surface treatment item, surface type detection sensor, and processor. The sensor emits sonic signals toward a surface being traversed and receives corresponding returned signals from the surface. The returned signals are used for surface type detection and include directly reflected primary returned signals and multi-path reflected secondary returned signals which return at a later time than the primary returned signals. The processor selects a window of time after transmission of a sonic signal such that the returned signals in the window comprise at least a portion of the secondary returned signals, wherein the window is related to round trip time-of-flight of the returned signals; processes the returned signals falling in the window to achieve a reflectivity metric; compares the reflectivity metric to a stored value; and based on the comparison, determines which surface type of a plurality of surface types has been detected.
G01S 15/50 - Systems of measurement based on relative movement of target
A47L 11/30 - Floor-scrubbing machines characterised by means for taking-up dirty liquid by suction
G01S 7/52 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group
A47L 11/40 - Parts or details of machines not provided for in groups , or not restricted to one of these groups, e.g. handles, arrangements of switches, skirts, buffers or levers
An ultrasonic transceiver system includes a transmitter block, a receiver block, a state machine, and a computing unit. The transmitter block contains circuitry configured to drive an ultrasound transducer. The receiver block contains circuitry configured to receive signals from the ultrasound transducer and convert the signals into digital data. The state machine is coupled to the transmitter and receiver blocks and contains circuitry configured to act as a controller for those blocks. The computing unit is coupled to the transmitter block, the receiver block, and the state machine and is configured to drive the transmitter block and process data received from the receiver block by executing instructions of a program. The program memory is coupled to the computing unit and is configured to store the program. The computing unit is configured to be reprogrammed with one or more additional programs stored in the program memory.
H04L 29/00 - Arrangements, apparatus, circuits or systems, not covered by a single one of groups
B06B 1/02 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy
G01S 7/523 - RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - Details of systems according to groups , , of systems according to group - Details of pulse systems
The described technology is generally directed towards a sensor output digitizer. The sensor output digitizer can comprise a multiplexer stage, a multi-stage analog to digital converter, and a digital output combiner. The multiplexer stage can be configured to sequentially select sensor outputs from one or more sensors, resulting in a stream of selected sensor outputs. The multi-stage analog to digital converter can be coupled with the multiplexer stage, and can be configured to convert the stream of selected sensor outputs into a stream of digitized outputs. The digital output combiner can be configured to re-scale and sum intermediate outputs of the multi-stage analog to digital converter to produce a stream of digitized sensor outputs.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
G01D 9/32 - Producing one or more recordings, each recording being of the values of two or more different variables there being a common recording element for two or more variables
H03M 1/14 - Conversion in steps with each step involving the same or a different conversion means and delivering more than one bit
H03M 1/16 - Conversion in steps with each step involving the same or a different conversion means and delivering more than one bit with scale factor modification, i.e. by changing the amplification between the steps
H03M 1/46 - Analogue value compared with reference values sequentially only, e.g. successive approximation type with digital/analogue converter for supplying reference values to converter
A robotic cleaning appliance includes a sonic transducer and a processor coupled with a housing. The sonic transducer transmits sonic signals toward a surface within its ringdown distance and receives corresponding returned signals. Following cessation of the sonic signals, the processor samples the ringdown signal generated by the sonic transducer during an early portion before the corresponding returned signals have reflected back to the sonic transducer, and during a later portion which includes the corresponding returned signals. The processor utilizes the sampled early portion to estimate a void ringdown signal of which represents performance of the sonic transducer in absence of returned signals being received. The processor compares the estimated void ringdown signal to the later portion of the ringdown signal and generates a metric based on the comparison. The processor utilizes the metric to determine a type of the surface, out of a plurality of surface types.
A47L 9/28 - Installation of the electric equipment, e.g. adaptation or attachment to the suction cleaner; Controlling suction cleaners by electric means
B25J 11/00 - Manipulators not otherwise provided for
G01N 29/22 - Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object - Details
75.
Demodulation phase calibration using external input
A MEMS device may output a signal during operation that may include an in-phase component and a quadrature component. An external signal having a phase that corresponds to the quadrature component may be applied to the MEMS device, such that the MEMS device outputs a signal having a modified in-phase component and a modified quadrature component. A phase error for the MEMS device may be determined based on the modified in-phase component and the modified quadrature component.
G01C 25/00 - Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
G01C 19/5776 - Signal processing not specific to any of the devices covered by groups
G01C 19/5719 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
A method includes fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a first mask on a second side of the device wafer, wherein the second side is planar. A plurality of dimple features is formed on an exposed portion on the second side of the device wafer. The first mask is removed from the second side of the device wafer. A second mask is deposited on the second side of the device wafer that corresponds to a standoff. An exposed portion on the second side of the device wafer is etched to form the standoff. The second mask is removed. A rough polysilicon layer is deposited on the second side of the device wafer. A eutectic bond layer is deposited on the standoff. In some embodiments, a micro-electro-mechanical system (MEMS) device pattern is etched into the device wafer.
Exemplary multipath digital microphone described herein can comprise exemplary embodiments of adaptive ADC range multipath digital microphones, which allow low power to be achieved for amplifiers or gain stages, as well as for exemplary adaptive ADCs in exemplary multipath digital microphone arrangements described herein, while still providing a high DR digital microphone systems. Further non-limiting embodiments can comprise an exemplary glitch removal component configured to minimize audible artifacts associated with the change in the gain of the exemplary adaptive ADCs.
Disclosed embodiments provide flexible performance, high dynamic range, microelectromechanical (MEMS) multipath digital microphones, which allow seamless, low latency transitions between audio signal paths without audible artifacts over interruptions in the audio output signal. Disclosed embodiments facilitate performance and power saving mode transitions maintaining high dynamic range capability.
A MEMS gyroscope includes a driven mass that moves in response to a drive force. A drive amplitude sense electrode is included as a feature of the drive mass and extends in a direction perpendicular to the drive direction. A change in capacitance is measured based on the relative location of the drive amplitude sense electrode to a known fixed position, which in turn is used to accurately determine a location of the driven mass.
G01C 19/5762 - Structural details or topology the devices having a single sensing mass the sensing mass being connected to a driving mass, e.g. driving frames
G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
A microelectromechanical system (MEMS) microphone includes a cavity to receive an acoustic signal. The acoustic signal causes movement of a diaphragm relative to one or more other surfaces, which in turn results in an electrical signal representative of the received acoustic signal. A light sensor is included within the packaging of the MEMS microphone such that an output of the light sensor is representative of a light signal received with the acoustic signal. The output of the light sensor is used to modify the electrical signal representative of the received acoustic signal in a manner that limits light interference with an acoustical output signal.
Environmental conditions affecting a sensor having a thermal coefficient are compensated by applying an adaptive filter to an environmental condition reference signal. The resulting adaptive cancellation signal may be used to provide feedback control to a first heating element.
A device includes a micro-electromechanical system (MEMS) element configured to sense acoustic signals. The device also includes a circuitry configured to enable the microphone element to sense the acoustic signals. The circuitry is further configured to disable the microphone element to prevent the microphone element to sense the acoustic signals. It is appreciated that the circuitry is further configured to apply a test signal to the MEMS element when the microphone element is disabled. The microphone element outputs a signal in response to the test signal to the circuitry. The circuitry in response to the output signal with a first value determines that a diaphragm of the MEMS element is nonoperational and the circuitry in response to the output signal with a second value determines that the diaphragm of the MEMS element is operational.
A microelectromechanical system (MEMS) test structure includes a plurality of capacitors formed from sense electrodes and capacitive plates having a predetermined geometry and size associated with a related MEMS device such as a MEMS sensor. Based on the predetermined relationships between the capacitors of the test structure, and between the test structure and the MEMS devices, an effect of fringing fields on the sensed capacitances of the MEMS devices may be eliminated, and the capacitive gap of the MEMS device may be accurately measured.
A MEMS accelerometer includes proof masses that move in-phase in response to a sensed linear acceleration. Self-test drive circuitry imparts an out-of-phase movement onto the proof masses. The motion of the proof masses in response to the linear acceleration and the self-test movement is sensed as a sense signal on common sense electrodes. Processing circuitry extracts from a linear acceleration signal corresponding to the in-phase movement due to linear acceleration and a self-test signal corresponding to the out-of-phase movement due to the self-test drive signal.
G01P 21/00 - Testing or calibrating of apparatus or devices covered by the other groups of this subclass
G01P 15/125 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01P 15/08 - Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
85.
On-chip signal path with electrical and physical connection
An exemplary microelectromechanical system (MEMS) device comprises a plurality of stacked layers, including at least one layer that includes micromechanical components that respond to a force to be measured. Two of the layers may include respective first and second external electrical connection points. A plurality of conductive paths may be disposed in a continuous manner over an external surface of each of the plurality of layers between the first and second external electrical connection points.
A method includes tab dicing a region of a tab region disposed between a first die and a second die. The tab region structurally connects the first die to the second die each including a MEMS device eutecticly bonded to a CMOS device. The tab region includes a handle wafer layer disposed over a fusion bond oxide layer that is disposed on an ACT layer. The tab region is positioned above a CMOS tab region that with the first and second die form a cavity therein. The tab dicing cuts through the handle wafer layer and leaves a portion of the fusion bond oxide layer underneath the handle wafer layer to form an oxide tether within the tab region. The oxide tether maintains the tab region in place and above the CMOS tab region. Subsequent to the tab dicing the first region, the tab region is removed.
A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
G01H 11/08 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
89.
Modification to rough polysilicon using ion implantation and silicide
A modification to rough polysilicon using ion implantation and silicide is provided herein. A method can comprise depositing a hard mask on a single crystal silicon, patterning the hard mask, and depositing metal on the single crystal silicon. The method also can comprise forming silicide based on causing the metal to react with exposed silicon of the single crystal silicon. Further, the method can comprise removing unreacted metal and stripping the hard mask from the single crystal silicon. Another method can comprise forming a MEMS layer based on fusion bonding a handle MEMS with a device layer. The method also can comprise implanting rough polysilicon on the device layer. Implanting the rough polysilicon can comprise performing ion implantation of the rough polysilicon. Further, the method can comprise performing high temperature annealing. The high temperature can comprise a temperature in a range between around 700 and 1100 degrees Celsius.
Magnetic-based collaborative positioning of a portable device involves obtaining magnetic field measurements for the portable device, obtaining magnetic fingerprint map information, obtaining parameters of motion of the portable device, obtaining collaborative assistance data from at least one neighbor portable device and determining position of the portable device based on the obtained magnetic field measurements, the obtained magnetic map information, the obtained motion parameters and the obtained collaborative assistance data.
G01C 21/00 - Navigation; Navigational instruments not provided for in groups
G01C 21/08 - Navigation; Navigational instruments not provided for in groups by terrestrial means involving use of the magnetic field of the earth
G01C 21/20 - Instruments for performing navigational calculations
G01C 21/16 - Navigation; Navigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
91.
Method and system for magnetic-based indoor vehicle positioning
Vehicle position is determined using magnetic field measurements within an indoor environment. Magnetic field measurements and sensor information are obtained from the vehicle and magnetic map information is obtained for the indoor environment. Parameters of vehicle motion are derived from the sensor information. The magnetic field measurements are processed to mitigate vehicular interference and then compensated for a magnetometer bias induced at least in part by the vehicle. Vehicle position is determined based at least in part on the compensated magnetic field magnetic measurements, the magnetic map information and the parameters of vehicle motion.
Systems and methods are provided for establishing contact tracing for a group of users within a venue. Position information in the venue may be estimated for each user over a period of time based at least in part on data from a portable device associated with each user. At least one contact parameter may be established so that contact between at least two users of the group of users during the period of time may be determined based at least in part on the at least one contact parameter and the estimated position information.
G16H 50/50 - ICT specially adapted for medical diagnosis, medical simulation or medical data mining; ICT specially adapted for detecting, monitoring or modelling epidemics or pandemics for simulation or modelling of medical disorders
H04W 4/029 - Location-based management or tracking services
A device comprises a processor coupled with an ultrasonic transducer coupled which is configured to emit an ultrasonic pulse and receive returned signals received after a ringdown period of the transducer and corresponding to the emitted ultrasonic pulse. The processor is configured to evaluate the returned signals to find a candidate echo, from an object located in a ringdown blind spot area, in a time window between one and two times the ringdown period; locate multiple echoes from the object of higher order than the candidate echo; validate the candidate echo as at least a secondary echo associated of the object; and determine, based on analysis of the returned signals, an estimated distance from the transducer to the object in the ringdown blind spot area, wherein the ringdown blind spot area is located between the transducer and a closest distance at which objects can be sensed by the transducer.
Technologies are provided for adaptive control of bias settings in a digital microphone. In some embodiments, a device includes a first component that provides data indicative of a clock frequency of operation in a functional mode of a digital microphone. The clock frequency clocks one or more microphone components having switching activity. The device also can include a second component that determines, using the clock frequency, an amount of bias current to supply to at least a first microphone component of the one or more microphone components. The device can further include a memory device that retains control parameters that include at least one of a first subset of parameters defining a relationship between current and frequency and a second subset of parameters defining a quantization of the relationship. The quantization including multiple bias current levels for respective frequency intervals.
H03F 3/183 - Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only
H03D 13/00 - Circuits for comparing the phase or frequency of two mutually-independent oscillations
G10H 5/00 - Instruments in which the tones are generated by means of electronic generators
H04M 1/00 - Substation equipment, e.g. for use by subscribers
G01R 23/10 - Arrangements for measuring frequency, e.g. pulse repetition rate; Arrangements for measuring period of current or voltage by converting frequency into a train of pulses, which are then counted
A method including fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a hardmask on a second side of the device wafer, wherein the second side is planar. An etch stop layer is deposited over the hardmask and an exposed portion of the second side of the device wafer. A dielectric layer is formed over the etch stop layer. A via is formed within the dielectric layer. The via is filled with conductive material. A eutectic bond layer is formed over the conductive material. Portions of the dielectric layer uncovered by the eutectic bond layer is etched to expose the etch stop layer. The exposed portions of the etch stop layer is etched. A micro-electro-mechanical system (MEMS) device pattern is etched into the device wafer.
An integrated navigation solution is provided for a device within a moving platform. Motion sensor data from a sensor assembly of the device is obtained, optical samples from at least one optical sensor for the platform are obtained and map information for an environment encompassing the platform is obtained. Correspondingly, an integrated navigation solution is generated based at least in part on the obtained motion sensor data using a nonlinear state estimation technique, wherein the nonlinear state estimation technique uses a nonlinear measurement model for optical sensor data. Generating the integrated navigation solution includes using the sensor data with the nonlinear state estimation technique and integrating the optical sensor data directly by updating the nonlinear state estimation technique using the nonlinear measurement model and the map information. The integrated navigation solution is then provided.
Facilitating powering up/down respective analog circuits of mixed-signal devices utilizing a reconfigurable power sequencer component and corresponding reconfigurable sequencer processing unit(s) is presented herein. A system can comprise a mixed-signal component comprising a group of analog circuits comprising respective inputs to facilitate a power-up and a power-down of respective portions of the analog circuits; and a reconfigurable power sequencer component that obtains, from a reconfigurable memory of the system, reprogrammable information representing respective timed sequences of digital outputs electronically coupled to the respective inputs of the group of analog circuits, and based on the reprogrammable information, generates the respective timed sequences of the digital outputs to facilitate the power-up and the power-down of the respective portions of the analog circuits.
A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
A device includes a micro-electromechanical system (MEMS) element configured to sense acoustic signals. The device also includes a circuitry configured to enable the microphone element to sense the acoustic signals. The circuitry is further configured to disable the microphone element to prevent the microphone element to sense the acoustic signals. It is appreciated that the circuitry is further configured to apply a test signal to the MEMS element when the microphone element is disabled. The microphone element outputs a signal in response to the test signal to the circuitry. The circuitry in response to the output signal with a first value determines that a diaphragm of the MEMS element is nonoperational and the circuitry in response to the output signal with a second value determines that the diaphragm of the MEMS element is operational.
Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement. Disclosed implementations can facilitate providing robust MEMS membranes and backplate structures, having edge pattern holes with a profile resembling at least one of an oval, an egg, an ellipse, a droplet, a cone, or a capsule or similar suitable configurations according to disclosed embodiments.
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