An weapon sight system includes a weapon sight having body with an optical element that is configured to superimpose a reticle that is visible through the optical element. The weapon sight includes a controller in electronic communication with and configured to control a light source. The light source may include an LED for generating a reticle image on the optical element at a plurality of different brightness conditions. The light source may include an array of LEDs for generating multiple different reticle images on the optical element. The weapon sight includes a Hall effect sensor in electronic communication with the controller to adjust user-selectable settings including reticle brightness or reticle image. The weapon sight system includes a magnetic input device for providing an input to the Hall effect sensor of the weapon sight.
An image sensor has a photocathode window assembly, an anode assembly, and a malleable metal seal. The photocathode window assembly has a photocathode layer. The anode assembly includes a silicon substrate that has an electron sensitive surface. The malleable metal seal bonds the photocathode window assembly and the silicon substrate to each other. A vacuum gap separates the photocathode layer from the electron sensitive surface. A first electrical connection and a second electrical connection are for a voltage bias of the photocathode layer relative to the electron sensitive surface.
An enhanced vision system includes a first optic subsystem and a transparent photodetector subsystem disposed within a common housing. The first optic subsystem may include passive devices such as simple or compound lenses, active devices such as low-light enhancing image intensifiers, or a combination of passive and active devices. The transparent photodetector subsystem receives the visible image exiting the first optic subsystem and converts a portion of the electromagnetic energy in the visible image to a signal communicated to image analysis circuitry. On a real-time or near real-time basis, the image analysis circuitry detects and identifies structures, objects, and/or individuals in the visible image. The image analysis circuitry provides an output that includes information regarding the structure, objects, and individuals to the system user contemporaneous with the system user viewing the visible image.
G06V 20/20 - Scenes; Scene-specific elements in augmented reality scenes
G02B 23/12 - Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices with means for image conversion or intensification
H04N 23/11 - Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
H04N 23/45 - Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
H04N 23/63 - Control of cameras or camera modules by using electronic viewfinders
Methods and systems are disclosed for a weapon sight with a tapered housing. The housing may be configured to enclose an optical bench and/or a portion of an adjuster assembly within the weapon sight. The housing may include an outer shell, a first window, and a second window. The first window may define a first area. The second window may define a second area. The second area may be greater than the first area, for example, such that the outer shell is tapered outward from the first opening to the second opening. The outer shell may define a first wall and a second wall that extend between the first opening and the second opening on opposed sides of an optical path of the weapon sight. The first wall and the second wall may be slanted outward from the first window to the second window.
A weapon system has an optical sight mounted to a weapon and a frame with a sight window that is configured to superimpose a reticle that is visible through the sight window in a first focal plane. An optoelectronic device is mounted to the weapon and includes an imager with a sensor array and a display device. An image processor is configured to receive image data captured by the sensor array and process the image data to generate a subset image that is received from a select region of the sensor array. The select region of the sensor array defines a second focal plane. A controller is configured to receive an input from an operator, and in response to the input, to select the select region of the sensor array for aligning the second focal plane with the first focal plane.
A holographic sight comprises a unitary optical component carrier having a plurality of receptacles for receiving optical components. A collimating optic abuts a surface of a first receptacle. A mirror abuts a surface of a second receptacle. A collar is positioned in a third receptacle and a laser diode is positioned within the collar. A first portion of the collar is affixed relative to a first portion of the third receptacle and a second portion of the collar is free to expand and contract relative to the third receptacle. The laser diode is affixed to the collar proximate the second portion and is free to move relative to the third receptacle with expansion and contraction of the second portion. The laser diode, the mirror, and the collimating optic are positioned relative to each other to create an optical path.
Methods and systems are disclosed for a modular weapon sight assembly. A weapon sight may include a base, an optical bench, an adjuster assembly, and/or a housing. The base may be configured to be releasably secured to a weapon. The optical bench may include a plurality of optical elements attached to a unitary component carrier. A relative position of the plurality of optical elements may define an optical path of the weapon sight. The base, the optical bench, the adjuster assembly, and the housing may be configured as separate modules. For example, the optical path of the optical bench may remain constant during adjustment and/or replacement of the base, the adjuster assembly, and/or the housing. A change in position of the base, the adjuster assembly, and/or the housing may not alter the relative position of the plurality of optical elements with respect to one another.
An enhanced vision system includes a first optic subsystem and a transparent photodetector subsystem disposed within a common housing. The first optic subsystem may include passive devices such as simple or compound lenses, active devices such as low-light enhancing image intensifiers, or a combination of passive and active devices. The transparent photodetector subsystem receives the visible image exiting the first optic subsystem and converts a portion of the electromagnetic energy in the visible image to a signal communicated to image analysis circuitry. On a real-time or near real-time basis, the image analysis circuitry detects and identifies structures, objects, and/or individuals in the visible image. The image analysis circuitry provides an output that includes information regarding the structure, objects, and individuals to the system user contemporaneous with the system user viewing the visible image.
G06V 20/20 - Scenes; Scene-specific elements in augmented reality scenes
G02B 23/12 - Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices with means for image conversion or intensification
H04N 23/11 - Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
H04N 23/45 - Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
H04N 23/63 - Control of cameras or camera modules by using electronic viewfinders
F41G 1/38 - Telescopic sights specially adapted for smallarms or ordnance; Supports or mountings therefor
An image sensor has a photocathode window assembly, an anode assembly, and a malleable metal seal. The photocathode window assembly has a photocathode layer. The anode assembly includes a silicon substrate that has an electron sensitive surface. The malleable metal seal bonds the photocathode window assembly and the silicon substrate to each other. A vacuum gap separates the photocathode layer from the electron sensitive surface. A first electrical connection and a second electrical connection are for a voltage bias of the photocathode layer relative to the electron sensitive surface.
Methods and systems are disclosed for a weapon sight with a tapered housing. The housing may be configured to enclose an optical bench and/or a portion of an adjuster assembly within the weapon sight. The housing may include an outer shell, a first window, and a second window. The first window may define a first area. The second window may define a second area. The second area may be greater than the first area, for example, such that the outer shell is tapered outward from the first opening to the second opening. The outer shell may define a first wall and a second wall that extend between the first opening and the second opening on opposed sides of an optical path of the weapon sight. The first wall and the second wall may be slanted outward from the first window to the second window.
A holographic sight comprises a unitary optical component carrier. The unitary optical component carrier may comprise a body with a first receptacle configured to receive a laser diode, a second receptacle configured to receive a mirror, a third receptacle configured to receive a collimating optic, a fourth receptacle configured to receive a grating, and a fifth receptacle configured to receive an image hologram. A laser diode may be received within opposing walls formed by the first receptacle. A mirror may be received in, and abut one or more surfaces of the second receptacle. A collimating optic may be received in, and abut one or more surfaces of the third receptacle. A grating may be received in, and abut one or more surfaces of the fourth receptacle. A hologram image may be received in, and abut one or more surfaces of the fifth receptacle.
F41G 1/30 - Reflecting sights specially adapted for smallarms or ordnance
G02B 23/10 - Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices involving prisms or mirrors reflecting into the field of view additional indications, e.g. from collimator
Methods and systems are disclosed for a modular weapon sight assembly. A weapon sight may include a base, an optical bench, an adjuster assembly, and/or a housing. The base may be configured to be releasably secured to a weapon. The optical bench may include a plurality of optical elements attached to a unitary component carrier. A relative position of the plurality of optical elements may define an optical path of the weapon sight. The base, the optical bench, the adjuster assembly, and the housing may be configured as separate modules. For example, the optical path of the optical bench may remain constant during adjustment and/or replacement of the base, the adjuster assembly, and/or the housing. A change in position of the base, the adjuster assembly, and/or the housing may not alter the relative position of the plurality of optical elements with respect to one another.
A holographic sight comprises a unitary optical component carrier having a plurality of receptacles for receiving optical components. A collimating optic abuts a surface of a first receptacle. A mirror abuts a surface of a second receptacle. A collar is positioned in a third receptacle and a laser diode is positioned within the collar. A first portion of the collar is affixed relative to a first portion of the third receptacle and a second portion of the collar is free to expand and contract relative to the third receptacle. The laser diode is affixed to the collar proximate the second portion and is free to move relative to the third receptacle with expansion and contraction of the second portion. The laser diode, the mirror, and the collimating optic are positioned relative to each other to create an optical path. The collar expands and contracts in response to changes in temperature to compensate for the unitary optical component carrier expanding and contracting in response to changes in temperature.
A holographic sight comprises a base, a support member attached to the base and extending upward therefrom, and a unitary optical component carrier formed with the support member. The support member is flexible and the unitary optical component carrier moveable in horizontal and vertical directions relative to the base. A bridge is attached to the base and forms an opening into which a portion of the unitary optical component carrier extends. A projection is coupled with the bridge and protrudes into the opening to abut the unitary optical component carrier. Extending the projection into the opening increases pressure applied by the projection to the optical component carrier. The increased pressure causes the unitary optical component carrier to be displaced.
An enhanced vision system includes a first optic subsystem and a transparent photodetector subsystem disposed within a common housing. The first optic subsystem may include passive devices such as simple or compound lenses, active devices such as low-light enhancing image intensifiers, or a combination of passive and active devices. The transparent photodetector subsystem receives the visible image exiting the first optic subsystem and converts a portion of the electromagnetic energy in the visible image to a signal communicated to image analysis circuitry. On a real-time or near real-time basis, the image analysis circuitry detects and identifies structures, objects, and/or individuals in the visible image. The image analysis circuitry provides an output that includes information regarding the structure, objects, and individuals to the system user contemporaneous with the system user viewing the visible image.
G09G 5/00 - Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators
G06V 20/20 - Scenes; Scene-specific elements in augmented reality scenes
G02B 23/12 - Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices with means for image conversion or intensification
A novel photocathode employing a conduction band barrier is described. Incorporation of a barrier optimizes a trade-off between photoelectron transport efficiency and photoelectron escape probability. The barrier energy is designed to achieve a net increase in photocathode sensitivity over a specific operational temperature range.
H01J 31/48 - Tubes with amplification of output effected by electron-multiplier arrangements within the vacuum space
H01J 31/49 - Pick-up tubes adapted for an input of electromagnetic radiation other than visible light and having an electric output, e.g. for an input of X-rays, for an input of infrared radiation
22.
Image intensifier with indexed compliant anode assembly
An image intensifier and a method of fabrication are disclosed. The image intensifier contains a photocathode assembly (120) including a vacuum window to generate photoelectrons in response to light, a vacuum package (110) and an anode assembly (130) to receive the photoelectrons. The anode assembly is mounted to the vacuum package via a compliant, springy, support structure (160). The anode additionally includes one or more insulating spacers (140) on the surface facing the photocathode so as to precisely index the position of the anode assembly with respect to the photocathode surface. The photocathode and vacuum window assembly is pressed into the vacuum package to generate a sealed leak tight vacuum envelope. During the photocathode assembly to vacuum package assembly pressing operation, the inner surface of the photocathode assembly contacts the insulating spacer/spacers of the anode assembly, thereby compressing the compliant support structure. This structure and assembly method result in a precisely indexed photocathode to anode assembly sealed image intensifier.
A holographic sight is provided having a housing that includes a plurality of holograph sight components. A laser diode mounted in the housing is configured to emit a laser light beam. The light beam is transmitted to an integrated diffraction grating and filter unit which includes a grating and a filter in a single device. The diffraction grating has a grating surface for diffracting the light beam and also diffracting unwanted ambient light transmitted into the housing. The filter is an optical filter contacting at least a portion of the grating. The optical filter is adapted to absorb at least one wavelength of the ambient light to inhibit the ambient light from diffracting into a visible spectrum that might otherwise be viewable to a user looking into the holographic sight.
An image sensor is disclosed that includes a solid state semiconductor imager having a metallized catch pad, a collimator having a metallized layer that faces a sensor anode, the metallized layer joined with the metallized catch pad to form a metal bond between the solid state semiconductor imager and the collimator. Methods of making the joined solid state semiconductor imager and collimator assembly are also disclosed.
H04N 3/14 - Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
H04N 5/335 - Transforming light or analogous information into electric information using solid-state image sensors [SSIS]
26.
Low energy portable low-light camera with wavelength cutoff
A sensor for night vision applications is provided, wherein the sensor comprises a semiconductor absorption layer of composition that limits long wavelength response cutoff to between 1.25 to 1.4 μm wavelength. The selection of this cutoff frequency provides improved dark current performance, thereby requiring less cooling of the sensor. Consequently, energy consumption is reduced, as the sensor does not require active cooling, so that the sensor is particularly beneficial for mobile night vision applications where battery weight is of high importance.
A novel photocathode employing a rectifying junction is described that permits color imaging extending applications for photocathodes in a variety of instruments and night vision devices.
H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
H01L 29/12 - Semiconductor bodies characterised by the materials of which they are formed
H01L 27/04 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
G01J 5/20 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
28.
Aiming sight having fixed light emitting diode (LED) array and rotatable collimator
An aiming sight includes a controller, a power supply, an LED array, and a collimator. The power supply powers the LEDs to turn-on and turn-off, and powers the collimator to rotate. The collimator rotates to different rotational positions while the controller, the power supply, and the LED array remain fixed in place. The LEDs are positioned such that one LED and the collimator are at a constant angle and separated by a constant focal distance for each collimator position. The controller controls the collimator to rotate to a collimator position to generate an aiming dot at an angular position corresponding to the collimator position. The controller turns-on the LED which is at the constant angle and separated from the collimator by the constant focal distance and turns-off the remaining LEDs such that the collimator collimates light from the turned-on LED into the aiming dot at the angular position corresponding to the collimator position.
A fused thermal and a direct view aiming sight includes an optical gun sight, a thermal sight, and a beam combiner. The optical sight generates a direct view image of an aiming point or reticle superimposed on a target scene. The thermal sight generates a monochromic thermal image of the target scene. The combiner is positioned behind a 1× non-magnified optical sight and the thermal sight and in front of an exit pupil of the thermal sight. The combiner is positioned right behind the intermediate image plane of a magnified optical sight between an objective lens and an eyepiece. The combiner passes the direct view image and reflects the thermal image to the exit pupil to fuse the thermal image onto the direct view image for an operator to see at the exit pupil as a combined thermal and direct view optical image of the target scene together with the aiming reticle.
G02B 23/00 - Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
A low profile holographic sight includes a base having a mounting mechanism and a body mounted on the base for housing a laser diode, an associated electronic control and power source, and optical elements including a collimator, a transmission image hologram of the reticle pattern, and a reflective diffraction grating, wherein the optical elements are arranged within the body to direct and fold the laser beam in a substantially generally horizontal path, and is insensitive to drift in laser wavelength. The optical elements superimpose an image of the reticle pattern over the direct view of the target scene in a generally parallel and close relationship with the barrel of a firearm, such as a shotgun or a rifle, upon which the sight is mounted.
Backthinning in an area selective manner is applied to CMOS imaging sensors 12 for use in electron bombarded active pixel array devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels of an active pixel array providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.
There is described-novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.
Bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the tube resulting therefrom.
There is described novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.
H01L 23/22 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device liquid at the normal operating temperature of the device
H01L 23/24 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel, at the normal operating temperature of the device
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