DuPont Electronics, Inc.

United States of America

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C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors 38
C09D 11/322 - Pigment inks 33
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C08J 5/18 - Manufacture of films or sheets 25
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01 - Chemical and biological materials for industrial, scientific and agricultural use 33
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1.

AQUEOUS INKJET INKS CONTAINING SILANIZED SILICA PARTICLES

      
Application Number 18468927
Status Pending
Filing Date 2023-09-18
First Publication Date 2024-04-18
Owner
  • DUPONT ELECTRONICS, INC. (USA)
  • ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (USA)
Inventor
  • Li, Xiaoqing
  • Chi, Changzai
  • Huh, Ji Yeon

Abstract

The present disclosure pertains an aqueous inkjet ink having self-dispersing pigment or pigment dispersed by polyurethane or acrylic dispersant polymer with alkaline neutralized carboxyl functional group, polyurethane or acrylic binder particles, and less than 3 wt % of surface modified silanized colloid silica particles with particle size smaller than 30 nm as an additive.

IPC Classes  ?

  • C09D 11/322 - Pigment inks
  • C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes

2.

TRANSPARENT CONDUCTIVE SUBSTRATE AND A DOUBLE-SIDE PHOTOLITHOGRAPHIC METHOD USING THE SAME

      
Application Number 18454300
Status Pending
Filing Date 2023-08-23
First Publication Date 2024-03-07
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor Chen, Yi-Ting

Abstract

The present invention provides a transparent conductive substrate, sequentially comprising: a first resist layer, a first transparent conductive layer, a transparent core, a second transparent conductive layer, and a second resist layer; wherein the first resist layer is composed of a UV-light sensitive composition (C1); and the second resist layer is composed of a visible-light sensitive composition (C2). The present invention provides a transparent conductive substrate, sequentially comprising: a first resist layer, a first transparent conductive layer, a transparent core, a second transparent conductive layer, and a second resist layer; wherein the first resist layer is composed of a UV-light sensitive composition (C1); and the second resist layer is composed of a visible-light sensitive composition (C2). The present invention provides a double-side photolithographic method for manufacturing transparent conductive laminates. The transparent conductive laminates manufactured by the inventive method may be incorporated into touch panels.

IPC Classes  ?

  • G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F 7/42 - Stripping or agents therefor

3.

ELECTROLYTIC COPPER FOIL, A METHOD FOR MANUFACTURING THE SAME, AND ARTICLES MADE THEREFROM

      
Application Number 18343029
Status Pending
Filing Date 2023-06-28
First Publication Date 2024-02-15
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor Lin, Shih-Ching

Abstract

Disclosed are electrolytic copper foils, characterized in that: an electrodeposited surface of the electrolytic copper foil has an average surface roughness (Sz) of 3.50 μm or less; the electrolytic copper foil has a twin grain boundary ratio of 35% or less, or a total grain boundary density of 3.50 μm−1 or more after heat treatment at 200° C. for 2 hours; the electrolytic copper foil is manufactured by electrodepositing in an electrolytic solution; and the electrolytic solution comprises 0.01 ppm to 25.0 ppm of chloride ion and 0.01 ppm to 75.0 ppm of an additive. Also disclosed are methods of manufacturing the electrolytic copper foils, and articles made therefrom. The articles include negative electrode current collectors of lithium-ion batteries or electrical double-layer capacitors, resin coated coppers, copper clad laminates, flexible copper clad laminates, various types of printed circuit boards, and the like.

IPC Classes  ?

4.

DICARBONYL HALIDES, POLYMER COMPOSITIONS AND FILMS MADE THEREFROM

      
Application Number 18342108
Status Pending
Filing Date 2023-06-27
First Publication Date 2024-02-15
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Hostetler, Greg A.
  • Kourtakis, Kostantinos

Abstract

In a first aspect, a dicarbonyl halide includes an alicyclic group. In a second aspect, a polymer composition is derived from the dicarbonyl halide, a dianhydride and a diamine, wherein the polymer composition is a poly(amide-imide) or a poly(amide-ester-imide), wherein the poly(amide-ester-imide) is further derived from a polyol. In a third aspect, a polymer film includes the polymer composition. In a fourth aspect, an electronic device includes the polymer film. In a fifth aspect, a metal-clad laminate includes the polymer film.

IPC Classes  ?

5.

EDRA

      
Application Number 018981001
Status Pending
Filing Date 2024-01-31
Owner DuPont Electronics, Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

copper clad laminates for use in the manufacture of printed circuit board applications.

6.

EDRA

      
Serial Number 98384622
Status Pending
Filing Date 2024-01-31
Owner DuPont Electronics, Inc. ()
NICE Classes  ? 06 - Common metals and ores; objects made of metal

Goods & Services

copper clad laminates for use in the manufacture of printed circuit board applications

7.

PLASMASOLV

      
Serial Number 98341424
Status Pending
Filing Date 2024-01-04
Owner DuPont Electronics, Inc. ()
NICE Classes  ? 03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations

Goods & Services

CHEMICAL COMPOSITIONS FOR CLEANING PLASMA ETCH EQUIPMENT AND PLASMA EXPOSED SUBSTRATES

8.

MULTIFUNCTIONAL SHEETS AND LAMINATES, ARTICLES, AND METHODS

      
Application Number 18249775
Status Pending
Filing Date 2020-10-23
First Publication Date 2023-12-14
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Wang, Ping
  • Wang, Chong Yang
  • Yang, Zheyue

Abstract

The present disclosure is directed to a multifunctional laminate, a portable electronic device comprising an ultrahigh molecular weight polyethylene (UHMWPE) sheet, and methods for making and using the multifunctional laminate in a portable electronic device.

IPC Classes  ?

  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins

9.

COPPER FOIL, FLEXIBLE COPPER-CLAD LAMINATE, AND PRINTED CIRCUIT MADE THEREFROM

      
Application Number 18302258
Status Pending
Filing Date 2023-04-18
First Publication Date 2023-11-02
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Lin, Shih-Ching
  • Li, Tung Lin

Abstract

Disclosed are surface-treated copper foils having at least one treated surface that exhibit high conductivity and a set of surface properties. Also provided are flexible copper-clad laminates and printed circuits made therefrom. The present printed circuits exhibit low insertion loss and are suitable for use in high speed/high frequency applications.

IPC Classes  ?

  • H05K 1/09 - Use of materials for the metallic pattern
  • H05K 1/03 - Use of materials for the substrate
  • H05K 1/02 - Printed circuits - Details

10.

CURABLE SILOXANE COMPOSITION AND USE THEREOF IN SKIN CARE PRODUCTS

      
Application Number CN2023088231
Publication Number 2023/202470
Status In Force
Filing Date 2023-04-13
Publication Date 2023-10-26
Owner
  • DUPONT ELECTRONICS, INC. (USA)
  • ROHM AND HAAS ELECTRONIC MATERIALS (SHANGHAI) CO., LTD. (China)
Inventor
  • Yang, Zheyue
  • Shi, Yuan
  • Qi, Xiaoman
  • Wu, Qiuju
  • Lyu, Jian

Abstract

A curable siloxane composition, and a use thereof in skin care products. Provided is a curable silicone composition, comprising: (a) based on the total weight of the curable silicone composition, an organosiloxane component having an alkenyl content of 0.01 to 2 mol/kg; (b) based on the total weight of the curable silicone composition, an organosiloxane component having a hydrogen content of 0.01 to 2 mol/kg; (c) a curing catalyst, wherein the molar ratio of alkenyl to hydrogen in silicon hydrogen bonds is 0.8 or greater.

IPC Classes  ?

  • C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
  • C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
  • C08G 77/04 - Polysiloxanes
  • C08L 83/04 - Polysiloxanes
  • C08L 83/05 - Polysiloxanes containing silicon bound to hydrogen
  • C08L 83/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
  • C09J 183/04 - Polysiloxanes
  • C09J 183/05 - Polysiloxanes containing silicon bound to hydrogen
  • C09J 183/07 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
  • A61K 8/00 - Cosmetics or similar toiletry preparations

11.

PRINTING FORM PRECURSOR AND PRINTING FORM THEREOF

      
Application Number 18187217
Status Pending
Filing Date 2023-03-21
First Publication Date 2023-10-05
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Lungu, Adrian
  • Lungu, Violeta
  • Hackler, Mark A

Abstract

The invention pertains to a printing form precursor, and particularly a printing form precursor that can form printing forms, or printing plates, having improved properties. The printing form precursor includes a photopolymerizable composition containing an additive having a structure of Formula (I). The presence of the additive results in ease of processing and/or better cleanout and reduction in webmarkings on solid areas of the printing form.

IPC Classes  ?

  • B41C 1/055 - Thermographic processes for producing formes

12.

POLYMER FILMS AND ELECTRONIC DEVICES

      
Application Number 18322816
Status Pending
Filing Date 2023-05-24
First Publication Date 2023-09-21
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Johnson, Joseph Casey
  • Losey, Delanie J
  • Scott, Peggy
  • Simone, Christopher Dennis

Abstract

In a first aspect, a polymer film includes a polyimide, wherein the polyimide includes two or more dianhydrides, including a first monomer that is a crankshaft monomer and a second monomer that is a rigid non-rotational monomer, and one or more diamines including a third monomer that is a flexible monomer. The crankshaft monomer and the flexible monomer include a combined 65 to 99 mol % of the total of all three monomers. The rigid non-rotational monomer includes 1 to 35 mol % of the total of all three monomers. The polymer film has a dielectric dissipation loss factor, Df, of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m2×day) or less.

IPC Classes  ?

  • H05K 1/03 - Use of materials for the substrate
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups

13.

POLYMER FILMS AND ELECTRONIC DEVICES

      
Application Number 18322835
Status Pending
Filing Date 2023-05-24
First Publication Date 2023-09-21
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Johnson, Joseph Casey
  • Losey, Delanie J
  • Scott, Peggy
  • Simone, Christopher Dennis

Abstract

In a first aspect, a polymer film includes a polyimide, wherein the polyimide includes two or more dianhydrides, including 15 to 35 mol % of a first monomer that is a crankshaft monomer and 15 to 35 mol % of a second monomer that is a flexible monomer, and two or more diamines, including 1 to 35 mol % of a third monomer that is a rotational inhibitor monomer and 15 to 49 mol % a fourth monomer that is a rigid rotational monomer, wherein the mol % of each monomer is based on the total of all four monomers. The polymer film has a dielectric dissipation loss factor, Df, of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m2×day) or less.

IPC Classes  ?

  • H05K 1/03 - Use of materials for the substrate
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups

14.

POLYMER COMPOSITIONS AND COATING SOLUTIONS

      
Application Number 18168036
Status Pending
Filing Date 2023-02-13
First Publication Date 2023-09-07
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Kourtakis, Kostantinos
  • Mulzer, Michael
  • Samson, Benjamin
  • Kwasny, Michael Thomas

Abstract

In a first aspect, a polymer composition includes a first polymer derived from a soluble polymer composition having an imide group and a Tg reducing compound having an amine group. The first polymer has a glass transition temperature that is lower than a second polymer derived from the same soluble polymer composition, but without a Tg reducing compound having an amine group. In a second aspect, a coating solution includes a soluble polymer having an imide group and a Tg reducing compound having an amine moiety that can be an amine or a first masked amine that can be converted to an amine, wherein the first masked amine can be chemically converted, thermally converted, photo-converted or dissociated.

IPC Classes  ?

  • C09D 179/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

15.

SELF-SANITIZING STRUCTURE FOR IMPLEMENTING SANITIZATION PATTERNS THAT NEUTRALIZE INFECTIOUS AGENTS ON THE STRUCTURE'S SURFACES

      
Application Number 18296427
Status Pending
Filing Date 2023-04-06
First Publication Date 2023-08-03
Owner DuPont Electronics, Inc. (USA)
Inventor
  • Wu, Wei
  • Blackman, Gregory Scott
  • Olson, Barry D.
  • Wyant, Timothy S.
  • Zare Bidoky, Fazel
  • Moseley, Michael R.

Abstract

Embodiments of the invention include a self-sanitizing structure and method of forming the same, where the self-sanitizing structure includes a body having a contact surface that can be contacted by a person, along with an energy source formed as an array of addressable energy sources. The energy source generates electromagnetic radiation and directs the electromagnetic radiation through the body to the contact surface. The body scatters the electromagnetic radiation and passes it through the body to the contact surface in a manner that maintains the scattered electromagnetic radiation that reaches the contact surface as sanitizing electromagnetic radiation at or above a minimum irradiance level that neutralizes infectious agents. A sensor system generates touch data in response to the contact surface being touched, and a controller uses the touch data to control the addressable energy sources.

IPC Classes  ?

16.

Polyamic acid solutions, polyimide films and electronic devices

      
Application Number 18193224
Grant Number 11834561
Status In Force
Filing Date 2023-03-30
First Publication Date 2023-07-27
Grant Date 2023-12-05
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor Hsiao, Ming-Siao

Abstract

A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.

IPC Classes  ?

  • C08J 5/18 - Manufacture of films or sheets
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
  • H05K 1/03 - Use of materials for the substrate

17.

METHOD FOR PRODUCING ELECTRICAL CIRCUITRY ON FILLED ORGANIC POLYMERS

      
Application Number 18086404
Status Pending
Filing Date 2022-12-21
First Publication Date 2023-07-13
Owner
  • DUPONT SAFETY & CONSTRUCTION, INC. (USA)
  • DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Wyant, Timothy Scott
  • Blackman, Gregory Scott
  • Tremel, James Daniel
  • Pollak, Keith William
  • Zare Bidoky, Fazel

Abstract

Electrical circuitry is produced on the surface of an organic polymer. The electrical circuitry is produced on a support, and a polymerizable composition is brought into contact with the support and the circuitry. The polymerizable composition is polymerized while in contact with support and the circuitry to produce a solid, organic polymer. The electrical circuitry becomes adhered to and partially embedded in a surface of the solid organic polymer. The support may be removed subsequent to the polymerization step to expose the circuitry at the surface of the solid organic polymer.

IPC Classes  ?

  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits
  • H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups
  • H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
  • H05K 1/03 - Use of materials for the substrate
  • H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
  • H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

18.

INKJET INK AND PRIMER FLUID SET

      
Application Number US2022078847
Publication Number 2023/114574
Status In Force
Filing Date 2022-10-28
Publication Date 2023-06-22
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor Li, Xiaoqing

Abstract

The present disclosure provides an ink fluid set containing an aqueous primer coating fluid and an aqueous inkjet ink or inkjet ink set. The aqueous primer coating fluid comprises two parts that are mixed together prior to application to form a coating on a print substrate. The aqueous inkjet ink or inkjet ink set is subsequently printed on the primer coated substrate. This fluid set is particularly suitable for printing on non-porous plastic substrate.

IPC Classes  ?

  • C09D 11/54 - Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
  • C09D 11/40 - Ink-sets specially adapted for multi-colour inkjet printing
  • C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
  • C09D 11/322 - Pigment inks
  • C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
  • C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09D 11/107 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof

19.

AQUEOUS INKJET INKS CONTAINING A POLYURETHANE POLYMER

      
Application Number US2022078849
Publication Number 2023/114575
Status In Force
Filing Date 2022-10-28
Publication Date 2023-06-22
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Li, Xiaoqing
  • Huh, Ji Yeon

Abstract

The present disclosure pertains to an aqueous inkjet ink containing a pigment as colorant, a polymeric dispersant, a polyurethane binder, and an aqueous vehicle. The inks show improved properties for printing on low and non-absorption substrates.

IPC Classes  ?

  • C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
  • C09D 11/322 - Pigment inks
  • C09D 11/326 - Pigment inks characterised by the pigment dispersant

20.

POLYIMIDE FILMS AND ELECTRONIC DEVICES

      
Application Number 18164878
Status Pending
Filing Date 2023-02-06
First Publication Date 2023-06-15
Owner DUPONT ELECTRONCS, INC. (USA)
Inventor
  • Kourtakis, Kostantinos
  • Rossi, Gene M
  • Johnson, Joseph Casey
  • Kwasny, Michael Thomas

Abstract

In a first aspect, a polyimide film includes a polyimide derived from a dianhydride and a diamine. The dianhydride, the diamine or both the dianhydride and the diamine include an alicyclic monomer, an aliphatic monomer or both an alicyclic monomer and an aliphatic monomer. The polyimide film has an L* of at least 90, a b* of 1.25 or less, a yellowness index of 2.25 or less and a haze of less than 1% for a film thickness of 50 μm. In a second aspect, an electronic device includes the polyimide film of the first aspect.

IPC Classes  ?

  • C08J 5/18 - Manufacture of films or sheets
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

21.

POLYIMIDE FILMS

      
Application Number 17958675
Status Pending
Filing Date 2022-10-03
First Publication Date 2023-05-04
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Maclaughlin, Laila
  • Eichel, Daniel Robert
  • Kourtakis, Kostantinos
  • Carney, Thomas Edward

Abstract

In a first aspect, a polyimide film includes a substantially chemically converted polyimide and at least 10 volume percent of an inorganic filler, based on a total volume of the polyimide film. A void ratio of the polyimide film is 0.75 or less. In a second aspect, a polyimide film includes a substantially chemically converted polyimide and at least 10 volume percent of an organic filler, based on a total volume of the polyimide film. A void ratio of the polyimide film is 1.0 or less.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08K 3/04 - Carbon
  • C08K 3/22 - Oxides; Hydroxides of metals

22.

UV-CURING RESIN COMPOSITIONS FOR HARD COAT APPLICATIONS

      
Application Number 17504019
Status Pending
Filing Date 2021-10-18
First Publication Date 2023-04-20
Owner
  • Rohm and Haas Electronic Materials LLC (USA)
  • DuPont Electronics, Inc. (USA)
Inventor
  • Mulzer, Michael
  • Hernandez, Kenneth
  • Stella, Andrew
  • Bu, Lujia
  • Zhang, Jieqian
  • Wang, Deyan
  • Cen, Yinjie

Abstract

Disclosed is an actinic radiation curable (meth)acrylic composition for use in hardcoats for optical displays containing one or more multifunctional (meth)acrylate monomers, one or more Si-containing (meth)acrylate monomers, one or more UV radical initiators, one or more monomers to improve surface cure, nanoparticles, and one or more organic solvents. Coated hardcoat articles made from this composition exhibit improved properties for use in display applications.

IPC Classes  ?

  • C09D 133/08 - Homopolymers or copolymers of acrylic acid esters

23.

Chemical mechanical polishing pad and preparation thereof

      
Application Number 17500669
Grant Number 11679531
Status In Force
Filing Date 2021-10-13
First Publication Date 2023-04-13
Grant Date 2023-06-20
Owner
  • Rohm and Haas Electronic Materials CMP Holdings, Inc. (USA)
  • DuPont Electronics, Inc. (USA)
Inventor
  • Qian, Bainian
  • Blomquist, Robert M.
  • El-Sayed, Lyla M.
  • Mills, Michael E.
  • Reddy, Kancharla-Arun
  • Taylor, Bradley K.
  • Xia, Shijing

Abstract

The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is prepared by extruding a compounded photopolymerizable composition followed by exposure to UV light.

IPC Classes  ?

  • B29C 35/00 - Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
  • B29C 35/08 - Heating or curing, e.g. crosslinking or vulcanising by wave energy or particle radiation
  • B29C 48/00 - Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
  • B29K 9/06 - SB polymers, i.e. butadiene-styrene polymers
  • B29L 31/00 - Other particular articles
  • B29K 96/04 - Block polymers
  • B29K 105/00 - Condition, form or state of moulded material

24.

ARTICLES HAVING INORGANIC SUBSTRATES AND POLYMER FILM LAYERS

      
Application Number 17903762
Status Pending
Filing Date 2022-09-06
First Publication Date 2023-03-16
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Kourtakis, Kostantinos
  • Samson, Benjamin
  • Hernandez, Kenneth
  • Johnson, Ross S
  • Walls, Dennis
  • Xiao, Neng
  • Zhang, Lei
  • Johnson, Joseph Casey

Abstract

In a first aspect, an article includes an inorganic substrate and a polymer film layer. The inorganic substrate includes a material including a ceramic, a glass, a glass-ceramic or a mixture thereof. The material includes a metal cation selected from the group consisting of silicon, aluminum, titanium, zirconium, tantalum, niobium and mixtures thereof and oxygen. The polymer film layer includes a polymer including an imide group. From an interface where the inorganic substrate contacts the polymer film layer, a line-profile of a CNO— signal from negative secondary ion mass spectroscopy decreases as it moves away from the interface and into the bulk of the polymer film layer.

IPC Classes  ?

  • B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
  • B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin

25.

ARTICLES HAVING POLYMER FILM LAYERS

      
Application Number 17903775
Status Pending
Filing Date 2022-09-06
First Publication Date 2023-03-16
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Kourtakis, Kostantinos
  • Samson, Benjamin
  • Walls, Dennis
  • Xiao, Neng
  • Zhang, Lei

Abstract

In a first aspect, an article includes a first polymer film layer and a second polymer film layer. The first polymer film layer includes a first polymer including a first imide group. The second polymer film layer includes a second polymer including a second imide group.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • B32B 3/02 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B32B 27/16 - Layered products essentially comprising synthetic resin specially treated, e.g. irradiated

26.

LOW-COLOR POLYMERS FOR USE IN ELECTRONIC DEVICES

      
Application Number 17982217
Status Pending
Filing Date 2022-11-07
First Publication Date 2023-03-09
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Auman, Brian C.
  • Summers, John Donald
  • Radu, Nora Sabina
  • Ngai, Chai Kit
  • Atkinson, Wayne
  • Li, Wei
  • Maeyer, Jonathan Timothy

Abstract

Disclosed is a polyimide film that exhibits: an in-plane coefficient of thermal expansion (CTE) that is less than 75 ppm/° C. between 50° C. and 250° C.; a glass transition temperature (Tg) that is greater than 250° C. for the polyimide film cured at 260° C. in air; a 1% TGA weight loss temperature that is greater than 450° C.; a tensile modulus that is between 1.5 GPa and 5.0 GPa; an elongation to break that is greater than 20%; an optical retardation at 550 nm that is less than 100 nm for a 10-μm film; a birefringence at 633 nm that is less than 0.002; a haze that is less than 1.0%; a b* that is less than 3; a yellowness index that is less than 5; and an average transmittance between 380 nm and 780 nm that is greater than 88%.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08J 5/18 - Manufacture of films or sheets
  • G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
  • G02F 1/1333 - Constructional arrangements

27.

A PRINTING FORM PRECURSOR AND PRINTING FORM THEREOF

      
Application Number US2022074135
Publication Number 2023/015115
Status In Force
Filing Date 2022-07-26
Publication Date 2023-02-09
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Lungu, Adrian
  • Lungu, Violeta
  • Hackler, Mark A.

Abstract

The invention pertains to a printing form precursor, and particularly a printing form precursor that can form printing forms, or printing plates, having improved properties. The printing form precursor includes a photopolymerizable composition containing an additive having a structure of Formula (I). The presence of the additive results in ease of processing and/or better cleanout and reduction in webmarkings on solid areas of the printing form.

IPC Classes  ?

  • G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
  • G03F 7/20 - Exposure; Apparatus therefor

28.

INKJET INK AND PRIMER FLUID SET

      
Application Number 17756969
Status Pending
Filing Date 2020-12-09
First Publication Date 2023-01-26
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Li, Xiaoqing
  • Huh, Ji Yeon
  • Kirkpatrick, Cullen

Abstract

The present disclosure provides an inkjet ink and primer fluid set containing an aqueous primer composition and aqueous inkjet inks. At least one of the inks contains a first pigment dispersion and a second pigment dispersion. The first pigment dispersion forms an aggregation with the primer composition whereas the second pigment dispersion does not form an aggregation with the primer composition.

IPC Classes  ?

  • C09D 11/40 - Ink-sets specially adapted for multi-colour inkjet printing
  • C09D 11/322 - Pigment inks
  • C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes

29.

INKJET INK AND PRIMER FLUID SET

      
Application Number 17757019
Status Pending
Filing Date 2020-12-09
First Publication Date 2023-01-26
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Li, Xiaoqing
  • Huh, Ji Yeon
  • Kirkpatrick, Cullen

Abstract

The present disclosure provides an inkjet ink and primer fluid set containing an aqueous primer composition and aqueous inkjet inks. The aqueous primer composition forms a coating on a print substrate. The inkjet inks contain a polymeric binder that interacts with the primer composition. This fluid set is particularly suitable for printing on non-porous plastic substrate.

IPC Classes  ?

  • C09D 11/54 - Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
  • C09D 11/322 - Pigment inks
  • C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
  • C09D 11/40 - Ink-sets specially adapted for multi-colour inkjet printing

30.

INKJET INK AND PRIMER FLUID SET

      
Application Number 17757015
Status Pending
Filing Date 2020-12-09
First Publication Date 2023-01-26
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Li, Xiaoqing
  • Huh, Ji Yeon
  • Kirkpatrick, Cullen

Abstract

The present disclosure provides an inkjet ink and primer fluid set containing an aqueous primer composition, an aqueous white inkjet ink, and aqueous non-white colored inkjet inks. The aqueous primer composition forms a coating on a print substrate. This fluid set is particularly suitable for printing on non-porous plastic substrate.

IPC Classes  ?

  • C09D 11/322 - Pigment inks
  • C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
  • C09D 11/40 - Ink-sets specially adapted for multi-colour inkjet printing
  • B41J 2/21 - Ink jet for multi-colour printing
  • C09D 11/54 - Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink

31.

ELECTROACTIVE COMPOUNDS

      
Application Number 17783009
Status Pending
Filing Date 2020-12-08
First Publication Date 2023-01-12
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Diev, Viacheslav V.
  • Kondakov, Denis Yurievich
  • Zou, Yunlong

Abstract

There is provided a polycyclic aromatic compound having a single boron-nitrogen bond and including a core structure of Core A, Core B, or Core C There is provided a polycyclic aromatic compound having a single boron-nitrogen bond and including a core structure of Core A, Core B, or Core C There is provided a polycyclic aromatic compound having a single boron-nitrogen bond and including a core structure of Core A, Core B, or Core C In the formulas: Q1 and Q2 are the same or different and are a single bond, O, S, NR12, BR12, CR13R14, or SiR13R14; and R12-R14 are the same or different and are alkyl, carbocyclic aryl, heteroaryl, or substituted derivatives thereof.

IPC Classes  ?

  • C07F 5/02 - Boron compounds
  • H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof

32.

Printing form precursor, a process for making the precursor, and a method for preparing a printing form from the precursor

      
Application Number 17939588
Grant Number 11858252
Status In Force
Filing Date 2022-09-07
First Publication Date 2023-01-05
Grant Date 2024-01-02
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Blomquist, Robert M
  • Taylor, Bradley K
  • Locke, John Stephen
  • Hackler, Mark A

Abstract

The invention pertains to a photosensitive element, particularly a photopolymerizable printing form precursor; a method of preparing the photosensitive element to form a printing form for use in relief printing; and, a process of making the photosensitive element. The printing form precursor includes a layer of a photosensitive composition, a digital layer that is adjacent to a side of the photosensitive layer, and a cell pattern layer that is disposed between the photosensitive layer and the digital layer. The cell pattern layer includes a plurality of features in which each feature an area between 5 to 750 square microns and is composed of an ink that is opaque to actinic radiation and transparent to infrared radiation. Since the cell pattern layer is integral with the printing form precursor, digital imaging can occur rapidly with relatively low resolution optics to form a mask without needing to also form a microcell pattern of the digital layer. The printing form precursor having the integrated cell pattern layer facilitates the preparation of relief printing forms to have a print surface suitable for printing solids with uniform, dense coverage of ink.

IPC Classes  ?

33.

CONDUCTIVE PASTE COMPRISING COPPER PARTICLES AND USE THEREOF TO PRODUCE ELECTRONIC COMPONENTS

      
Application Number US2022072979
Publication Number 2022/272224
Status In Force
Filing Date 2022-06-16
Publication Date 2022-12-29
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Tachibana, Yusuke
  • Matsuura, Yumi
  • Sato, Yoshie

Abstract

Provided herein is a conductive paste comprising copper particles, glass frit, and an organic vehicle. The conductive paste is useful as a precursor to electronic components, such as dielectric filters. Further provided herein is a method of manufacture for electronic components, such as dielectric filters.

IPC Classes  ?

  • H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
  • H01P 1/20 - Frequency-selective devices, e.g. filters

34.

POLYMERS FOR USE IN ELECTRONIC DEVICES

      
Application Number CN2021098525
Publication Number 2022/256951
Status In Force
Filing Date 2021-06-07
Publication Date 2022-12-15
Owner
  • DUPONT ELECTRONICS, INC. (USA)
  • ROHM AND HAAS ELECTRONIC MATERIALS (SHANGHAI) CO., LTD. (China)
Inventor
  • Li, Yang
  • Liu, Yuchen
  • Yeh, Grace
  • Radu, Nora
  • Siegelman, Rebecca
  • Older, Christina
  • Hostetler, Greg
  • Fennimore, Adam

Abstract

Disclosed is a polyimide film prepared from a liquid composition comprising a liquid composition comprising (a) a polyamic acid having a repeat unit structure of Formula I wherein Rais the same or different at each occurrence and represents one or more tetracarboxylic acid component residues and Rb is the same or different at each occurrence and represents one or more diamine component residues, (b) one or more phosphorous-containing additivesm and (c) a high-boiling aprotic solvent. Also disclosed are processes for making the film and uses of the film in electronic devices.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08J 5/18 - Manufacture of films or sheets
  • C08K 5/49 - Phosphorus-containing compounds
  • C08K 3/32 - Phosphorus-containing compounds
  • G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
  • G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
  • H01L 51/05 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier

35.

COVER WINDOW ASSEMBLY, RELATED ARTICLES AND METHODS

      
Application Number 17776480
Status Pending
Filing Date 2020-11-18
First Publication Date 2022-12-08
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Carbajal, Leopoldo Alejandro
  • Lamontia, Mark Allan
  • Yahyazadehfar, Mobin
  • Samadidooki, Aref

Abstract

The present invention is directed to a cover window assembly comprising a multi-layer films of polymeric and inorganic materials for a variety of articles, and the related articles and methods. The cover window assembly exhibits high resistance to strain and impact damage for the articles including display devices, particularly flexible display devices.

IPC Classes  ?

  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
  • B32B 7/022 - Mechanical properties
  • G02B 1/14 - Protective coatings, e.g. hard coatings

36.

MOVEABLE GRIPPER FOR GRIPPING A CONTAINER AND HEATING CONTENTS OF THE CONTAINER THROUGH DYNAMICALLY CONTROLLED THERMAL CONTACT AND HEAT SETTINGS

      
Application Number 17313177
Status Pending
Filing Date 2021-05-06
First Publication Date 2022-11-10
Owner DuPont Electronics, Inc. (USA)
Inventor
  • Tremel, James Daniel
  • Manelis, Matthew James
  • Wong, Chun Keung
  • Wu, Wei
  • Strubhar, Todd Mahlon

Abstract

Embodiments of the invention are directed to an apparatus that includes a moveable gripper element including a flexible inner sleeve. A mechanical energy source mechanism is communicatively coupled to the moveable gripper element, and a sensor network is communicatively coupled to the moveable gripper. A controller is communicatively coupled to the mechanical energy source mechanism and the sensor network. The flexible inner sleeve defines an adjustable opening. The controller controls the mechanical energy source mechanism to transfer to the moveable gripper element a gripping force configured to move the moveable outer sleeve, reduce a size of the adjustable opening, and bring the flexible inner sleeve into an initial level of thermal contact with a container positioned within the adjustable opening. The controller is configured to, subsequent to establishing the initial level of thermal contact, control the mechanical energy source mechanism to make adjustments to the gripping force.

IPC Classes  ?

  • H05B 1/02 - Automatic switching arrangements specially adapted to heating apparatus
  • B25J 13/08 - Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
  • B25J 15/00 - Gripping heads
  • H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
  • G06N 20/00 - Machine learning

37.

MOVEABLE GRIPPER FOR GRIPPING A CONTAINER AND HEATING CONTENTS OF THE CONTAINER THROUGH DYNAMICALLY CONTROLLED THERMAL CONTACT AND HEAT SETTINGS

      
Application Number 17313141
Status Pending
Filing Date 2021-05-06
First Publication Date 2022-11-10
Owner DuPont Electronics, Inc. (USA)
Inventor
  • Tremel, James Daniel
  • Manelis, Matthew James
  • Wong, Chun Keung
  • Wu, Wei
  • Strubhar, Todd Mahlon

Abstract

Embodiments of the invention are directed to an apparatus that includes a moveable gripper element that includes a flexible inner sleeve. A mechanical energy source mechanism is communicatively coupled to the moveable gripper element, and the flexible sleeve defines an opening. The mechanical energy source mechanism transfers to the moveable gripper element a gripping force configured to move the moveable outer sleeve, reduce a size of the adjustable opening, and bring the flexible inner sleeve into an initial level of thermal contact with a container positioned within the adjustable opening. The mechanical energy source mechanism is configured to, subsequent to establishing the initial level of thermal contact, make adjustments to the gripping force, wherein the adjustment to gripping force increase thermal contact points at an interface between the flexible inner sleeve and the container; and displace air from the interface between the flexible inner sleeve and the container.

IPC Classes  ?

  • H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
  • H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
  • H05B 3/10 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
  • B25J 15/00 - Gripping heads

38.

MOVEABLE GRIPPER FOR GRIPPING A CONTAINER AND HEATING CONTENTS OF THE CONTAINER THROUGH DYNAMICALLY CONTROLLED THERMAL CONTACT AND HEAT SETTINGS

      
Application Number US2022027592
Publication Number 2022/235740
Status In Force
Filing Date 2022-05-04
Publication Date 2022-11-10
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Tremel, James Daniel
  • Manelis, Matthew James
  • Wong, Chun Keung
  • Wu, Wei
  • Strubhar, Todd Mahlon

Abstract

Embodiments of the invention are directed to an apparatus that includes a moveable gripper element including a flexible inner sleeve. A mechanical energy source mechanism is communicatively coupled to the moveable gripper element, and a sensor network is communicatively coupled to the moveable gripper. A controller is communicatively coupled to the mechanical energy source mechanism and the sensor network. The flexible inner sleeve defines an adjustable opening. The controller controls the mechanical energy source mechanism to transfer to the moveable gripper element a gripping force configured to move the moveable outer sleeve, reduce a size of the adjustable opening, and bring the flexible inner sleeve into an initial level of thermal contact with a container positioned within the adjustable opening. The controller is configured to, subsequent to establishing the initial level of thermal contact, control the mechanical energy source mechanism to make adjustments to the gripping force.

IPC Classes  ?

  • H05B 3/34 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
  • B25J 15/00 - Gripping heads
  • B25J 15/02 - Gripping heads servo-actuated

39.

MOVEABLE GRIPPER FOR GRIPPING A CONTAINER AND HEATING CONTENTS OF THE CONTAINER THROUGH DYNAMICALLY CONTROLLED THERMAL CONTACT AND HEAT SETTINGS

      
Application Number US2022027594
Publication Number 2022/235742
Status In Force
Filing Date 2022-05-04
Publication Date 2022-11-10
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Tremel, James Daniel
  • Manelis, Matthew James
  • Wong, Chun Keung
  • Wu, Wei
  • Strubhar, Todd Mahlon

Abstract

Embodiments of the invention are directed to an apparatus that includes a moveable gripper element that includes a flexible inner sleeve. A mechanical energy source mechanism is communicatively coupled to the moveable gripper element, and the flexible sleeve defines an opening. The mechanical energy source mechanism transfers to the moveable gripper element a gripping force configured to move the moveable outer sleeve, reduce a size of the adjustable opening, and bring the flexible inner sleeve into an initial level of thermal contact with a container positioned within the adjustable opening. The mechanical energy source mechanism is configured to, subsequent to establishing the initial level of thermal contact, make adjustments to the gripping force, wherein the adjustments to gripping force increase thermal contact points at an interface between the flexible inner sleeve and the container; and displace air from the interface between the flexible inner sleeve and the container.

IPC Classes  ?

  • H05B 3/34 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
  • B25J 15/00 - Gripping heads
  • B25J 15/02 - Gripping heads servo-actuated

40.

Polyimide films and electronic devices

      
Application Number 17471080
Grant Number 11643514
Status In Force
Filing Date 2021-09-09
First Publication Date 2022-10-27
Grant Date 2023-05-09
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor Hsiao, Ming-Siao

Abstract

g of 400° C. or higher, a tensile modulus of 6.0 GPa or more, and a coefficient of thermal expansion of 15 ppm/° C. or less over a temperature range of 50 to 500° C. In a second aspect, an electronic device includes the polyimide film of the first aspect.

IPC Classes  ?

  • C08J 5/18 - Manufacture of films or sheets
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
  • H05K 1/03 - Use of materials for the substrate

41.

INK FLUID SET FOR PRINTING ON TEXTILE

      
Application Number 17753647
Status Pending
Filing Date 2020-09-18
First Publication Date 2022-10-20
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Ellis, Scott W.
  • Li, Xiaoqing
  • Liang, Jue

Abstract

The present disclosure provides an ink fluid set containing an aqueous pre-treatment composition, a clear ink, and colored aqueous inkjet inks. This ink fluid set is particularly suitable for printing on polyester, cotton, and blends of cotton and synthetic textiles.

IPC Classes  ?

  • D06P 5/30 - Ink jet printing
  • D06P 5/00 - Other features in dyeing or printing textiles or dyeing leather, furs or solid macromolecular substances in any form
  • D06P 1/00 - General processes of dyeing or printing textiles or general processes of dyeing leather, furs or solid macromolecular substances in any form, classified according to the dyes, pigments or auxiliary substances employed
  • D06P 1/673 - Inorganic compounds
  • D06P 1/52 - General processes of dyeing or printing textiles or general processes of dyeing leather, furs or solid macromolecular substances in any form, classified according to the dyes, pigments or auxiliary substances employed using insoluble pigments or auxiliary substances, e.g. binders using compositions containing synthetic macromolecular substances
  • D06P 1/54 - Substances with reactive groups together with crosslinking agents
  • C09D 11/40 - Ink-sets specially adapted for multi-colour inkjet printing
  • C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
  • C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
  • C09D 11/54 - Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
  • B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
  • B41J 2/21 - Ink jet for multi-colour printing

42.

POLYMERS FOR USE IN ELECTRONIC DEVICES

      
Application Number 17594424
Status Pending
Filing Date 2020-04-21
First Publication Date 2022-10-13
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Diev, Viacheslav V
  • Radu, Nora Sabina
  • Howard, Jr., Michael Henry
  • Nambiar, Rakesh

Abstract

Disclosed is a polyamic acid having Formula I Disclosed is a polyamic acid having Formula I Disclosed is a polyamic acid having Formula I In Formula I: Ra represents one or more different tetracarboxylic acid component residues; Rb represents one or more different aromatic diamine residues or aromatic diisocyanate residues; and 5-100 mol % of Rb has Formula II Disclosed is a polyamic acid having Formula I In Formula I: Ra represents one or more different tetracarboxylic acid component residues; Rb represents one or more different aromatic diamine residues or aromatic diisocyanate residues; and 5-100 mol % of Rb has Formula II Disclosed is a polyamic acid having Formula I In Formula I: Ra represents one or more different tetracarboxylic acid component residues; Rb represents one or more different aromatic diamine residues or aromatic diisocyanate residues; and 5-100 mol % of Rb has Formula II In Formula II: R1 through R6 are the same or different and are haloalkyl or haloalkoxy; R7 is the same or different at each occurrence and is deuterium, halogen, cyano, hydroxyl, alkyl, deuterated alkyl, heteroalkyl, alkoxy, heteroalkoxy, haloalkyl, haloalkoxy, silyl, siloxy, hydrocarbon aryl, substituted hydrocarbon aryl, heteroaryl, substituted heteroaryl, vinyl, or allyl; n is an integer from 0-10; x1 and x4 are the same or different and are an integer from 0-3; x2 and x3 are the same or different and are an integer from 0-2; and * indicates a point of attachment.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08J 5/18 - Manufacture of films or sheets

43.

COATING SOLUTIONS AND CROSSLINKED POLYMER FILMS

      
Application Number 17686242
Status Pending
Filing Date 2022-03-03
First Publication Date 2022-09-08
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Kwasny, Michael Thomas
  • Hernandez, Kenneth
  • Howard Jr, Michael Henry
  • Johnson, Joseph Casey
  • Kourtakis, Kostantinos

Abstract

In a first aspect, a coating solution includes a soluble polymer and a crosslinking precursor. The soluble polymer includes an imide group. The crosslinking precursor includes a first amine group that is either reactive or passivated towards crosslinking and one or more additional amine groups, wherein the one or more additional amine groups has been passivated towards crosslinking such that the crosslinking precursor can be chemically converted, thermally converted, photo-converted or dissociated to form at least two reactive amines. In a second aspect, a process for forming a polymer film includes: (a) casting a coating solution, (b) activating the crosslinking precursor using an external stimulus to form at least two reactive amines and crosslink the polymer, and (c) drying the polymer film. The coating solution includes a soluble polymer, including an imide group, and a crosslinking precursor.

IPC Classes  ?

  • C09D 179/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

44.

REMOVAL OF CONTAMINANTS FROM EUV MASKS

      
Application Number 17666867
Status Pending
Filing Date 2022-02-08
First Publication Date 2022-09-08
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor Liao, Pen-Nan

Abstract

An aqueous cleaning composition containing sulfonic acids and a source of chloride ions is used to clean contaminants from EUV masks used in the manufacture of semiconductors. Optionally, the aqueous cleaning composition can include oxidizing agents and surfactants. The aqueous cleaning composition removes tin as well as other contaminants from the mask. Such other contaminants include, but are not limited to, aluminum oxide, etch and photoresist residues.

IPC Classes  ?

  • G03F 1/82 - Auxiliary processes, e.g. cleaning
  • G03F 1/24 - Reflection masks; Preparation thereof

45.

THIN FLEXIBLE GLASS COVER WITH A FRAGMENT RETENTION HARD COATING

      
Application Number 17631527
Status Pending
Filing Date 2020-08-07
First Publication Date 2022-08-25
Owner
  • CORNING INCORPORATED (USA)
  • DuPont Electronics, Inc. (USA)
  • Rohm and Haas Electronic Materials LLC (USA)
Inventor
  • Bu, Lujia
  • Deng, Huayun
  • Deshpande, Suraj S
  • Johnson, Ross Stefan
  • Zhang, Ying

Abstract

Glass articles having a thin glass layer and atop optically transparent polymeric hard-coat layer disposed on atop surface of the thin glass layer. The top optically transparent polymeric hard-coat layer may have a thickness in a range of 0.1 microns to 200 microns and a pencil hardness of 6H or more, when the pencil hardness is measured with the optically transparent polymeric hard-coat layer disposed on the top surface of the glass layer. The glass articles avoid ejection of glass shard particles from the glass article upon bending to a failure during a static two-point bend test.

IPC Classes  ?

  • C03C 17/32 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins

46.

Polyimide compositions and polyimide solutions

      
Application Number 17739548
Grant Number 11643515
Status In Force
Filing Date 2022-05-09
First Publication Date 2022-08-18
Grant Date 2023-05-09
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Johnson, Joseph Casey
  • Kourtakis, Kostantinos

Abstract

In a first aspect, a polyimide corn position has a glass transition temperature of less than 300° C. and includes a polyimide derived from a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine. A polyimide film made from the polyimide composition has a b* of less than one for a film thickness of at least 30 microns.

IPC Classes  ?

  • B32B 7/02 - Physical, chemical or physicochemical properties
  • C08J 5/18 - Manufacture of films or sheets
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

47.

PHOTOSENSITIVE COMPOSITION AND PHOTORESIST DRY FILM MADE

      
Application Number US2022070460
Publication Number 2022/174211
Status In Force
Filing Date 2022-02-01
Publication Date 2022-08-18
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Tsai, Tsung-Han
  • Lin, Liyen

Abstract

The present invention provides photosensitive compositions comprising: (a) a novel polymeric binder; (b) a polymerizable compound; (c) a photoinitiator; and (d) a photosensitizer. The photosensitive compositions having improved developing and/or stripping performance with comparable adhesion and resolution.

IPC Classes  ?

  • G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
  • G03F 7/031 - Organic compounds not covered by group
  • G03F 7/20 - Exposure; Apparatus therefor
  • C08F 212/08 - Styrene
  • C08F 220/06 - Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
  • C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety

48.

PHOTOSENSITIVE COMPOSITION AND PHOTORESIST DRY FILM MADE THEREFROM

      
Application Number 17590026
Status Pending
Filing Date 2022-02-01
First Publication Date 2022-08-11
Owner DUPONT ELECTRONICS, INC (USA)
Inventor
  • Tsai, Tsung-Han
  • Lin, Liyen

Abstract

The present invention provides photosensitive compositions comprising: (a) a novel polymeric binder; (b) a polymerizable compound; (c) a photoinitiator; and (d) a photosensitizer. The photosensitive compositions having improved developing and/or stripping performance with comparable adhesion and resolution.

IPC Classes  ?

  • G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
  • C08F 212/08 - Styrene
  • H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
  • H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
  • H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups

49.

PHOTORESIST TOPCOAT COMPOSITIONS AND PATTERN FORMATION METHODS

      
Application Number 17564462
Status Pending
Filing Date 2021-12-29
First Publication Date 2022-07-07
Owner
  • ROHM AND HAAS ELECTRONIC MATERIALS LLC (USA)
  • DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Kaitz, Joshua
  • Malbrecht, Brian
  • Wang, Deyan
  • Howard, Jr., Michael Henry

Abstract

A topcoat composition, comprising a polymer comprising a repeating unit derived from one or more monomers of formula (1); and a solvent, A topcoat composition, comprising a polymer comprising a repeating unit derived from one or more monomers of formula (1); and a solvent, A topcoat composition, comprising a polymer comprising a repeating unit derived from one or more monomers of formula (1); and a solvent, wherein Z1, Z2, R1, R2, and L are as described herein, and P is a polymerizable group.

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • G03F 7/32 - Liquid compositions therefor, e.g. developers
  • G03F 7/40 - Treatment after imagewise removal, e.g. baking
  • G03F 7/20 - Exposure; Apparatus therefor
  • G03F 7/004 - Photosensitive materials

50.

PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS

      
Application Number 17564476
Status Pending
Filing Date 2021-12-29
First Publication Date 2022-07-07
Owner
  • ROHM AND HAAS ELECTRONIC MATERIALS LLC (USA)
  • DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Kaitz, Joshua
  • Malbrecht, Brian
  • Wang, Deyan
  • Howard, Jr., Michael Henry

Abstract

A photoresist composition, comprising a first polymer comprising a first repeating unit comprising an acid-labile group, and a second polymer comprising a repeating unit derived from one or more monomers of formula (4); a photoacid generator; and a solvent, A photoresist composition, comprising a first polymer comprising a first repeating unit comprising an acid-labile group, and a second polymer comprising a repeating unit derived from one or more monomers of formula (4); a photoacid generator; and a solvent, A photoresist composition, comprising a first polymer comprising a first repeating unit comprising an acid-labile group, and a second polymer comprising a repeating unit derived from one or more monomers of formula (4); a photoacid generator; and a solvent, wherein Z1, Z2, R1, R2, and L are as described herein, and P is a polymerizable group.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C08F 20/58 - Amides containing oxygen in addition to the carbonamido oxygen

51.

COMPOSITE PARTICULATE MATERIAL, PROCESS AND USE THEREOF

      
Application Number CN2020140638
Publication Number 2022/141019
Status In Force
Filing Date 2020-12-29
Publication Date 2022-07-07
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Mu, Minfang
  • Wu, Qiuju

Abstract

Disclosed is a composite particulate material comprising a fluoropolymer particle and an inorganic nanoparticle. Also disclosed is a process for making the composite particulate. A dielectric film comprising the fluoropolymer composite particulate and use of the composite particulate in electronic devices are also disclosed.

IPC Classes  ?

  • C08L 27/18 - Homopolymers or copolymers of tetrafluoroethene
  • B29B 7/74 - Mixing; Kneading using other mixers or combinations of dissimilar mixers
  • B32B 25/16 - Layered products essentially comprising natural or synthetic rubber comprising polydienes or poly-halodienes

52.

ELECTROACTIVE COMPOUNDS

      
Application Number 17594459
Status Pending
Filing Date 2020-05-05
First Publication Date 2022-06-30
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Diev, Viacheslav V
  • Kondakov, Denis Yurievich
  • Zou, Yunlong

Abstract

There is provided a compound having Formula I There is provided a compound having Formula I There is provided a compound having Formula I In Formula I: Ar1 is a hydrocarbon aryl group, a heteroaryl group, or a substituted derivative thereof; and Are has Formula IA, IB, IC, IAa, IBb, or ICc There is provided a compound having Formula I In Formula I: Ar1 is a hydrocarbon aryl group, a heteroaryl group, or a substituted derivative thereof; and Are has Formula IA, IB, IC, IAa, IBb, or ICc There is provided a compound having Formula I In Formula I: Ar1 is a hydrocarbon aryl group, a heteroaryl group, or a substituted derivative thereof; and Are has Formula IA, IB, IC, IAa, IBb, or ICc The variables are described in detail herein.

IPC Classes  ?

  • C07D 493/04 - Ortho-condensed systems
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • C07D 495/04 - Ortho-condensed systems
  • C07D 493/14 - Ortho-condensed systems
  • C07D 497/04 - Ortho-condensed systems

53.

PANEL HAVING INTEGRATED ANTENNAS FOR ENHANCING RANGE OF TELECOMMUNICATION SIGNAL TRANSMISSIONS INSIDE BUILDINGS

      
Application Number US2021061527
Publication Number 2022/120001
Status In Force
Filing Date 2021-12-02
Publication Date 2022-06-09
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor Wu, Wei

Abstract

A construction panel having integrated antennas for enhancing the range of telecommunication signal transmissions inside buildings includes multiple layers, including a first layer and a second layer. The construction panel further includes a first antenna on the first layer. The first antenna transfers a telecommunication signal that is incident on the first layer. The construction panel further includes a second antenna on the second layer. The first antenna transmits the telecommunication signal to the second antenna through the first layer using near field coupling. A wavelength of the telecommunication signal is more than a distance between the first antenna and the second antenna. The second antenna causes the telecommunication signal to radiate on the opposite side of the first layer. One or more methods to manufacture the construction panel are also described.

IPC Classes  ?

  • H01Q 1/00 - ANTENNAS, i.e. RADIO AERIALS - Details of, or arrangements associated with, antennas
  • H01Q 1/12 - Supports; Mounting means
  • H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles
  • H01Q 25/00 - Antennas or antenna systems providing at least two radiating patterns
  • H04B 7/15 - Active relay systems

54.

TELECOMMUNICATION SIGNAL RANGE ENHANCEMENT USING PANEL REFLECTANCE

      
Application Number US2021061528
Publication Number 2022/120002
Status In Force
Filing Date 2021-12-02
Publication Date 2022-06-09
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Wu, Wei
  • Blackman, Gregory Scott
  • Weldon, Jonathan Andrew

Abstract

A panel to enhance telecommunication signal range includes a base sheet. A reflector on a side of the base sheet reflects a telecommunication signal that is of a predetermined wavelength and that is incident on the base sheet. A reflected telecommunication signal is reflected in a predetermined direction, and the attenuation loss in the reflected telecommunication signal is less than a predetermined threshold. Methods to manufacture such panels are also described.

IPC Classes  ?

  • H01Q 1/00 - ANTENNAS, i.e. RADIO AERIALS - Details of, or arrangements associated with, antennas
  • H01Q 15/14 - Reflecting surfaces; Equivalent structures
  • H01Q 19/10 - Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
  • H04B 7/145 - Passive relay systems

55.

Panel having integrated antennas for enhancing range of telecommunication signal transmissions inside buildings

      
Application Number 17109273
Grant Number 11394429
Status In Force
Filing Date 2020-12-02
First Publication Date 2022-06-02
Grant Date 2022-07-19
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor Wu, Wei

Abstract

A construction panel having integrated antennas for enhancing the range of telecommunication signal transmissions inside buildings includes multiple layers, including a first layer and a second layer. The construction panel further includes a first antenna on the first layer. The first antenna transfers a telecommunication signal that is incident on the first layer. The construction panel further includes a second antenna on the second layer. The first antenna transmits the telecommunication signal to the second antenna through the first layer using near field coupling. A wavelength of the telecommunication signal is more than a distance between the first antenna and the second antenna. The second antenna causes the telecommunication signal to radiate on the opposite side of the first layer. One or more methods to manufacture the construction panel are also described.

IPC Classes  ?

  • H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
  • H04B 5/00 - Near-field transmission systems, e.g. inductive loop type
  • H04B 7/155 - Ground-based stations

56.

TELECOMMUNICATION SIGNAL RANGE ENHANCEMENT USING PANEL REFLECTANCE

      
Application Number 17109271
Status Pending
Filing Date 2020-12-02
First Publication Date 2022-06-02
Owner DuPont Electronics, Inc. (USA)
Inventor
  • Wu, Wei
  • Blackman, Gregory Scott
  • Weldon, Jonathan Andrew

Abstract

A panel to enhance telecommunication signal range includes a base sheet. A reflector on a side of the base sheet reflects a telecommunication signal that is of a predetermined wavelength and that is incident on the base sheet. A reflected telecommunication signal is reflected in a predetermined direction, and the attenuation loss in the reflected telecommunication signal is less than a predetermined threshold. Methods to manufacture such panels are also described.

IPC Classes  ?

  • H01Q 15/14 - Reflecting surfaces; Equivalent structures
  • H01B 11/18 - Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
  • H01Q 3/46 - Active lenses or reflecting arrays

57.

ELECTROACTIVE COMPOUNDS

      
Application Number 17597443
Status Pending
Filing Date 2020-07-29
First Publication Date 2022-05-26
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Vo, Giang Dong
  • Diev, Viacheslav V
  • Kondakov, Denis Yurievich
  • Zou, Yunlong

Abstract

There is provided a compound having Formula I There is provided a compound having Formula I There is provided a compound having Formula I In Formula I=Ar1 is a hydrocarbon aryl group, a heteroaryl group, or a substituted derivative thereof; and Q has Formula Q1, Q2, or Q3 There is provided a compound having Formula I In Formula I=Ar1 is a hydrocarbon aryl group, a heteroaryl group, or a substituted derivative thereof; and Q has Formula Q1, Q2, or Q3 There is provided a compound having Formula I In Formula I=Ar1 is a hydrocarbon aryl group, a heteroaryl group, or a substituted derivative thereof; and Q has Formula Q1, Q2, or Q3 The variables are described in detail herein.

IPC Classes  ?

  • C07D 491/048 - Ortho-condensed systems with only one oxygen atom as ring hetero atom in the oxygen-containing ring the oxygen-containing ring being five-membered
  • C07D 519/00 - Heterocyclic compounds containing more than one system of two or more relevant hetero rings condensed among themselves or condensed with a common carbocyclic ring system not provided for in groups or
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof

58.

MULTIFUNCTIONAL SHEETS AND LAMINATES, ARTICLES, AND METHODS

      
Application Number CN2020123116
Publication Number 2022/082702
Status In Force
Filing Date 2020-10-23
Publication Date 2022-04-28
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Wang, Ping
  • Wang, Chong Yang
  • Yang, Zheyue

Abstract

Providing a multifunctional laminate and a portable electronic device comprising an ultrahigh molecular weight polyethylene (UHMWPE) sheet, and methods for making and using the multifunctional laminate in a portable electronic device.

IPC Classes  ?

  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • B32B 27/00 - Layered products essentially comprising synthetic resin
  • B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 17/02 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like in the form of fibres or filaments
  • B32B 7/028 - Heat-shrinkability
  • C08L 23/06 - Polyethene

59.

HIGH REFRACTIVE INDEX MATERIALS

      
Application Number 17411708
Status Pending
Filing Date 2021-08-25
First Publication Date 2022-04-14
Owner
  • Rohm and Haas Electronic Materials LLC (USA)
  • Dupont Electronics, Inc. (USA)
  • Rohm and Haas Electronic Materials Korea Ltd. (Republic of Korea)
Inventor
  • Patterson, Anastasia
  • Wang, Deyan
  • Seckman, Bethany L.
  • Gilmore, Christopher D.
  • Yoon, Hee Jae
  • Chavez, Anton D.
  • Mulzer, Catherine
  • Howard, Jr., Michael Henry
  • Meth, Jeffrey Scott
  • Jung, Ju-Young
  • Lee, Eun-Young

Abstract

Disclosed is a formulation comprising a copolymer comprising one or more high refractive index first monomers and one or more second monomers comprising a reactive side chain and one or more solvents. The formulation may optionally contain additional components. Further disclosed are methods for forming optical thin films from the formulation and optical devices containing the optical thin films.

IPC Classes  ?

  • C08F 226/12 - N-Vinyl-carbazole
  • G02B 1/04 - Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
  • G02B 1/115 - Multilayers
  • C08F 220/20 - Esters of polyhydric alcohols or phenols
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
  • C08F 2/06 - Organic solvent

60.

SKYTON

      
Application Number 018687462
Status Registered
Filing Date 2022-04-13
Registration Date 2022-08-19
Owner DuPont Electronics, Inc. (USA)
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

Adhesives for use in industry; adhesives used in the electronics industry.

61.

CONSOLIDATED POLYMER FILM

      
Application Number 17493319
Status Pending
Filing Date 2021-10-04
First Publication Date 2022-04-07
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Carbajal, Leopoldo Alejandro
  • Lamontia, Mark Allan
  • Johnson, Ross S.
  • Kourtakis, Kostantinos
  • Samadidooki, Aref
  • Yahyazadehfar, Mobin
  • Burch, Heidi Elizabeth

Abstract

In a first aspect, a consolidated polymer film includes a first polymer layer having a first elastic modulus, wherein the first polymer layer comprises a non-melt-processible polymer comprising a polyimide, a poly(amide-imide), a block copolymer of a polyimide or a poly(amide-imide) or a mixture thereof, and a second polymer layer having a second elastic modulus, wherein the second polymer layer comprises a polyimide, a poly(amide-imide), a block copolymer of a polyimide or a poly(amide-imide) or a mixture thereof. A minor surface of the first polymer layer is in contact with a minor surface of the second polymer layer. The first elastic modulus is different from the second elastic modulus. The first and second polymer layers are bonded by consolidation.

IPC Classes  ?

62.

Self-sanitizing structure for automatically neutralizing infectious agents on the structure's commonly touched surfaces

      
Application Number 17009938
Grant Number 11938235
Status In Force
Filing Date 2020-09-02
First Publication Date 2022-03-03
Grant Date 2024-03-26
Owner DuPont Electronics, Inc. (USA)
Inventor
  • Wu, Wei
  • Blackman, Gregory Scott
  • Olson, Barry D.
  • Wyant, Timothy S.
  • Zare Bidoky, Fazel
  • Moseley, Michael R.

Abstract

Embodiments of the invention are directed to a self-sanitizing structure that includes a body region having a contact surface that can be contacted by a person during an intended use of the self-sanitizing structure. The self-sanitizing structure further includes an energy source configured to generate electromagnetic radiation and direct the electromagnetic radiation through the body region to the contact surface. The body region is configured to scatter the electromagnetic radiation and pass the scattered electromagnetic radiation to the contact surface in a manner that maintains the scattered electromagnetic radiation that reaches the contact surface as sanitizing electromagnetic radiation. The sanitizing electromagnetic radiation is electromagnetic radiation that is at or above a minimum irradiance level that neutralizes infectious agents.

IPC Classes  ?

63.

SELF-SANITIZING STRUCTURE FOR IMPLEMENTING SANITIZATION PATTERNS THAT NEUTRALIZE INFECTIOUS AGENTS ON THE STRUCTURE'S SURFACES

      
Application Number 17061668
Status Pending
Filing Date 2020-10-02
First Publication Date 2022-03-03
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Wu, Wei
  • Blackman, Gregory Scott
  • Olson, Barry D.
  • Wyant, Timothy S.
  • Zare Bidoky, Fazel
  • Moseley, Michael R.

Abstract

Embodiments of the invention are directed to a self-sanitizing structure that includes a body having a contact surface that can be contacted by a person, along with an energy source formed as an array of addressable energy sources. The energy source generates electromagnetic radiation and direct the electromagnetic radiation through the body to the contact surface. A sensor system is coupled to the contact surface, and a controller is coupled to the energy source and the sensor system. The body scatters the electromagnetic radiation and passes it through the body to the contact surface in a manner that maintains the scattered electromagnetic radiation that reaches the contact surface as sanitizing electromagnetic radiation at or above a minimum irradiance level that neutralizes infectious agents. The sensor system generates touch data in response to the contact surface being touched, and the controller uses the touch data to control the addressable energy sources.

IPC Classes  ?

64.

A TEXTILE PRINTING FLUID SET CONTAINING A PRETREATMENT AND A MIXTURE OF PIGMENT AND DISPERSE DYE

      
Application Number 17414524
Status Pending
Filing Date 2019-12-17
First Publication Date 2022-03-03
Owner DuPont Electronics, Inc. (USA)
Inventor
  • Ellis, Scott W.
  • Li, Xiaoqing
  • Liang, Jue

Abstract

The present disclosure provides a fluid set for printing on textile. The fluid set contains a pretreatment composition, and a mixture of a pigment and a disperse dye as the colorant. The blending of a pigment with a disperse dye as the colorant together with a suitable pretreatment composition provides better image quality.

IPC Classes  ?

  • C09D 11/54 - Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
  • C09D 11/322 - Pigment inks
  • C09D 11/328 - Inkjet printing inks characterised by colouring agents characterised by dyes
  • C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
  • C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
  • C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
  • D06P 5/30 - Ink jet printing
  • D06P 5/00 - Other features in dyeing or printing textiles or dyeing leather, furs or solid macromolecular substances in any form
  • D06P 1/52 - General processes of dyeing or printing textiles or general processes of dyeing leather, furs or solid macromolecular substances in any form, classified according to the dyes, pigments or auxiliary substances employed using insoluble pigments or auxiliary substances, e.g. binders using compositions containing synthetic macromolecular substances
  • B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
  • B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material

65.

Cover windows for displays

      
Application Number 17520091
Grant Number 11504944
Status In Force
Filing Date 2021-11-05
First Publication Date 2022-02-24
Grant Date 2022-11-22
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Kourtakis, Kostantinos
  • Rossi, Gene M
  • Carbajal, Leopoldo Alejandro
  • Lamontia, Mark Allan
  • Yahyazadehfar, Mobin

Abstract

A cover window for a display includes a multilayer polymer film. The multilayer polymer film includes a first transparent, colorless polymer layer having a first elastic modulus and a second transparent, colorless polymer layer having a second elastic modulus. Each of the first and second transparent, colorless polymer layers include a polyimide, a polyamide imide, or a block copolymer of a polyimide. The polymers of both the first and second transparent, colorless polymer layers are cross-linked. The first elastic modulus is different from the second elastic modulus. The first and second transparent, colorless polymer layers are bonded by consolidation and cross-linking. The first transparent, colorless layer of the multilayer polymer film is the layer farthest from the display.

IPC Classes  ?

  • B32B 7/022 - Mechanical properties
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
  • B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
  • B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
  • B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides

66.

PLURALITY OF LIGHT-EMITTING MATERIALS, ORGANIC ELECTROLUMINESCENT COMPOUND, AND ORGANIC ELECTROLUMINESCENT DEVICE COMPRISING THE SAME

      
Application Number 17347249
Status Pending
Filing Date 2021-06-14
First Publication Date 2022-02-03
Owner
  • ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (Republic of Korea)
  • DuPont Electronics, Inc. (USA)
Inventor
  • Doh, Yoo-Jin
  • Kim, Chi-Sik
  • Lee, Soo-Yong
  • Yoo, Seung-Hoon
  • Diev, Viacheslav V
  • Mclaren, Charles D
  • Zou, Yunlong
  • Seo, Mi-Ran
  • Kondakov, Denis Yurievich

Abstract

The present disclosure relates to a plurality of light-emitting materials, an organic electroluminescent compound, and an organic electroluminescent device comprising the same. By comprising the organic electroluminescent compound or a specific combination of compounds according to the present disclosure as a host material and/or a dopant material, it is possible to provide an organic electroluminescent device having improved driving voltage, luminous efficiency and/or lifetime properties compared to conventional organic electroluminescent devices.

IPC Classes  ?

  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • C07D 307/77 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom ortho- or peri-condensed with carbocyclic rings or ring systems
  • C09K 11/06 - Luminescent, e.g. electroluminescent, chemiluminescent, materials containing organic luminescent materials

67.

Heat sink for electronic devices

      
Application Number 17348350
Grant Number 11558979
Status In Force
Filing Date 2021-06-15
First Publication Date 2022-01-27
Grant Date 2023-01-17
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Yang, Tao
  • Wang, Ping
  • Wang, Chong Yang
  • Ju, Da Liang
  • Yang, Zheyue

Abstract

The present invention discloses heat sinks comprising a base and a plurality of fins protruding from one surface of the base, wherein the base and the fins are independently composed of one or more anisotropic thermal conductive films. Said anisotropic thermal conductive film is electric insulative with low Dk and Df values. Also disclosed are methods for manufacturing the heat sinks and methods for dissipating heat of electronic devices having at least one heat generating component.

IPC Classes  ?

  • H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

68.

FLEXOGRAPHIC PRINTING FORM PRECURSOR AND A METHOD FOR MAKING THE PRECURSOR

      
Application Number 17413339
Status Pending
Filing Date 2019-12-11
First Publication Date 2022-01-20
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Blomquist, Robert M.
  • Lungu, Adrian

Abstract

The invention pertains to a photosensitive element, particularly a photopolymerizable printing form precursor; and, a process of making the photosensitive element. The printing form precursor includes a cover sheet, a layer of a photosensitive composition, and a digital layer, or infrared ablation layer, that is adjacent to a side of the photosensitive layer. A microcell patterned is embossed onto the infrared ablation layer or an overcoat/barrier layer on the infrared ablation layer. Since the microcell pattern layer is integral with the printing form precursor, digital imaging can occur rapidly with relatively low resolution optics to form a mask without needing to also form a microcell pattern of the digital layer. The printing form precursor having the integrated microcell pattern layer facilitates the preparation of relief printing forms to have a print surface suitable for printing solids with uniform, dense coverage of ink.

IPC Classes  ?

  • B41C 1/08 - Forme preparation by embossing, e.g. with a typewriter

69.

Composite and copper clad laminate made therefrom

      
Application Number 17326870
Grant Number 11839024
Status In Force
Filing Date 2021-05-21
First Publication Date 2022-01-20
Grant Date 2023-12-05
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Chen, Yu-Cheng
  • Chi, Mu-Huan
  • Lin, Shih-Ching
  • Liu, Wei-Guang

Abstract

Disclosed are composites comprising copper foils having at least one smooth surface and an adhesive layer with low Dk and Df properties. Also disclosed are copper clad laminates made by laminating the present composites with flexible or rigid substrates that exhibit heat resistance and good to excellent bonding strength. The PCBs made therefrom exhibit low insertion loss and may be assembled with other components to form various electrical devices utilizing high speed of at least 1 Gps or high frequency signals of at least 1 GHz.

IPC Classes  ?

  • H05K 1/03 - Use of materials for the substrate
  • B32B 7/02 - Physical, chemical or physicochemical properties
  • B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
  • B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
  • B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
  • B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
  • B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments

70.

Single layer polymer films and electronic devices

      
Application Number 17197887
Grant Number 11535710
Status In Force
Filing Date 2021-03-10
First Publication Date 2021-09-30
Grant Date 2022-12-27
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Alidedeoglu, Husnu Alp
  • Carney, Thomas Edward
  • Johnson, Joseph Casey
  • Ju, Lin
  • Kwasny, Michael Thomas
  • Maclaughlin, Laila
  • Slawinski, Grzegorz

Abstract

pv) of 6 μm or more, an L* color of 30 or less and a 60° gloss of 15 or less. In a second aspect, a coverlay for a printed circuit board includes the single layer polymer film of the first aspect. In third and fourth aspects, processes are disclosed for forming a single layer polymer film including a crosslinked polyimide film including a dianhydride and a diamine.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08K 3/04 - Carbon
  • C08K 5/00 - Use of organic ingredients
  • C08K 5/17 - Amines; Quaternary ammonium compounds
  • C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08J 5/18 - Manufacture of films or sheets

71.

Polymers for use in electronic devices

      
Application Number 17169926
Grant Number 11898011
Status In Force
Filing Date 2021-02-08
First Publication Date 2021-08-26
Grant Date 2024-02-13
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Diev, Viacheslav V
  • Radu, Nora Sabina

Abstract

Disclosed is a dianhydride having Formula I, and diamines having Formula IV and Formula VII 3 is alkyl or unsubstituted or substituted carbocyclic aryl; a and b are the same or different and are an integer from 0-5; and c is 0 or 1.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C07D 221/14 - Aza-phenalenes, e.g. 1,8-naphthalimide
  • C07D 311/80 - Dibenzopyrans; Hydrogenated dibenzopyrans
  • C08G 69/00 - Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule

72.

SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME

      
Application Number US2021017318
Publication Number 2021/167818
Status In Force
Filing Date 2021-02-10
Publication Date 2021-08-26
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Lee, Chu-Yi
  • Matsuura, Yumi
  • Shih, Che-Hsiu
  • Chang, Wei Hsuan

Abstract

A solar cell, comprising: a silicon substrate, wherein the silicon substrate has a front side and a rear side; a finger electrode formed on the front side of the silicon substrate, wherein the finger electrode is in electric contact with the silicon substrate, wherein the finger electrode comprises a silver component and a glass binder, and wherein the finger electrode is substantively free of other conductive metals than the silver component; and a busbar electrode formed on the front side of the silicon substrate, wherein the busbar electrode is in electric contact with the finger electrode and wherein the busbar electrode comprises a silver component, a second metal selected from the group consisting of nickel, copper, alloy thereof and mixture thereof and a glass binder.

IPC Classes  ?

73.

REPAIR TAPE AND METHOD OF REPAIRING A DAMAGED BACKSHEET OF SOLAR CELL MODULE USING THE SAME

      
Application Number 17121557
Status Pending
Filing Date 2020-12-14
First Publication Date 2021-08-12
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor Hu, Yichen

Abstract

A repair tape for solar cell backsheets, comprising a rubber adhesive layer; a substrate film; and a protective layer, laminated in this order, wherein thickness of the rubber adhesive layer is more than 200 μm.

IPC Classes  ?

74.

Plated copper conductor structures for wireless charging system and manufacture thereof

      
Application Number 17084556
Grant Number 11437851
Status In Force
Filing Date 2020-10-29
First Publication Date 2021-08-12
Grant Date 2022-09-06
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Blackman, Gregory Scott
  • Wu, Wei

Abstract

A conductive structure is fabricated on a substrate (either flexible or rigid) by first printing a precursor seed layer of a conductive ink, then electroplating a highly conductive metal such as Cu or Ag onto the precursor. The plated layer has a conductivity approaching that of the bulk metal. To improve the uniformity of plating, an intervening layer of electroless metal may be deposited onto the precursor prior to electroplating. The structure may be used for applications such as coils used in a wireless power transfer system.

IPC Classes  ?

  • H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
  • H01F 41/26 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents
  • H01F 5/00 - Coils
  • H02J 50/00 - Circuit arrangements or systems for wireless supply or distribution of electric power

75.

PALLADURE

      
Application Number 018531055
Status Registered
Filing Date 2021-08-11
Registration Date 2021-12-17
Owner DuPont Electronics, Inc. (USA)
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

Chemicals used for electrolytic and electroless metal plating.

76.

PALLAMET

      
Application Number 018531508
Status Registered
Filing Date 2021-08-11
Registration Date 2021-12-17
Owner DuPont Electronics, Inc. (USA)
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

Chemicals used for electrolytic and electroless metal plating.

77.

PALLAMET

      
Serial Number 90876391
Status Registered
Filing Date 2021-08-11
Registration Date 2023-10-10
Owner DUPONT ELECTRONICS, INC. ()
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

CHEMICALS USED FOR ELECTROLYTIC AND ELECTROLESS METAL PLATING

78.

PALLADURE

      
Serial Number 90876396
Status Registered
Filing Date 2021-08-11
Registration Date 2023-10-10
Owner DUPONT ELECTRONICS, INC. ()
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

CHEMICALS USED FOR ELECTROLYTIC AND ELECTROLESS METAL PLATING

79.

Flexographic printing form having microcell patterns on surface

      
Application Number 17056160
Grant Number 11446947
Status In Force
Filing Date 2019-05-22
First Publication Date 2021-07-15
Grant Date 2022-09-20
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Taylor, Bradley K.
  • Rickard, Scott W.

Abstract

The present invention relates to a printing form for flexographic printing. The printing form contains microcell patterns on its relief printing surface. The presence of these microcell patterns allows for printing with a higher anilox roll volume. Also disclosed are five specific microcell patterns.

IPC Classes  ?

  • B41N 1/12 - Printing plates or foils; Materials therefor non-metallic other than stone
  • B41M 1/04 - Flexographic printing

80.

REPAIR TAPE AND METHOD OF REPAIRING A DAMAGED BACKSHEET OF SOLAR CELL MODULE USING THE SAME

      
Application Number US2021012440
Publication Number 2021/142077
Status In Force
Filing Date 2021-01-07
Publication Date 2021-07-15
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor Hu, Yichen

Abstract

A repair tape for solar cell backsheets, comprising a rubber adhesive layer; a substrate film; and a protective layer, laminated in this order, wherein thickness of the rubber adhesive layer is more than 200 µm.

IPC Classes  ?

  • C09J 7/25 - Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
  • C09J 7/38 - Pressure-sensitive adhesives [PSA]
  • C09J 123/22 - Copolymers of isobutene; Butyl rubber
  • H01L 31/049 - Protective back sheets

81.

POLYMERS FOR USE IN ELECTRONIC DEVICES

      
Application Number 17265916
Status Pending
Filing Date 2019-08-07
First Publication Date 2021-07-01
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor Diev, Viacheslav V.

Abstract

Disclosed is a polyanhydride having Formula I Disclosed is a polyanhydride having Formula I Disclosed is a polyanhydride having Formula I where A is In Formula I: R1 and R2 are the same or different at each occurrence and are F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, siloxy, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, or unsubstituted or substituted aryloxy; R3 and R4 are the same or different and are A3, A4, H, F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, siloxy, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, or unsubstituted or substituted aryloxy; R5 and R6 are the same or different and are H, F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, siloxy, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, and unsubstituted or substituted aryloxy; R8 is selected from the group consisting of alkyl, silyl, unsubstituted or substituted hydrocarbon aryl, or unsubstituted or substituted heteroaryl; c and d are the same or different and are an integer from 0 to the maximum available; m and n are the same or different and are 0 or 1; A1 to A4 are the same or different and have the formula Disclosed is a polyanhydride having Formula I where A is In Formula I: R1 and R2 are the same or different at each occurrence and are F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, siloxy, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, or unsubstituted or substituted aryloxy; R3 and R4 are the same or different and are A3, A4, H, F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, siloxy, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, or unsubstituted or substituted aryloxy; R5 and R6 are the same or different and are H, F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, siloxy, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, and unsubstituted or substituted aryloxy; R8 is selected from the group consisting of alkyl, silyl, unsubstituted or substituted hydrocarbon aryl, or unsubstituted or substituted heteroaryl; c and d are the same or different and are an integer from 0 to the maximum available; m and n are the same or different and are 0 or 1; A1 to A4 are the same or different and have the formula Disclosed is a polyanhydride having Formula I where A is In Formula I: R1 and R2 are the same or different at each occurrence and are F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, siloxy, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, or unsubstituted or substituted aryloxy; R3 and R4 are the same or different and are A3, A4, H, F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, siloxy, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, or unsubstituted or substituted aryloxy; R5 and R6 are the same or different and are H, F, CN, alkyl, fluoroalkyl, alkoxy, fluoroalkoxy, silyl, siloxy, unsubstituted or substituted hydrocarbon aryl, unsubstituted or substituted heteroaryl, and unsubstituted or substituted aryloxy; R8 is selected from the group consisting of alkyl, silyl, unsubstituted or substituted hydrocarbon aryl, or unsubstituted or substituted heteroaryl; c and d are the same or different and are an integer from 0 to the maximum available; m and n are the same or different and are 0 or 1; A1 to A4 are the same or different and have the formula single dashed lines between two rings indicate that the rings are joined by a single bond or fused together at any available position; L is a bond or a hydrocarbon aryl; and at least two A groups are present.

IPC Classes  ?

  • C07D 405/14 - Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids

82.

INKJET INK AND PRIMER FLUID SET

      
Application Number US2020063873
Publication Number 2021/126611
Status In Force
Filing Date 2020-12-09
Publication Date 2021-06-24
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Li, Xiaoqing
  • Huh, Ji Yeon
  • Kirkpatrick, Cullen

Abstract

The present disclosure provides an inkjet ink and primer fluid set containing an aqueous primer composition, an aqueous white inkjet ink, and aqueous non-white colored inkjet inks. The aqueous primer composition forms a coating on a print substrate. This fluid set is particularly suitable for printing on non-porous plastic substrate.

IPC Classes  ?

  • C09D 11/54 - Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
  • C09D 11/40 - Ink-sets specially adapted for multi-colour inkjet printing
  • C09D 11/322 - Pigment inks
  • C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
  • C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
  • C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09D 11/107 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof

83.

INKJET INK AND PRIMER FLUID SET

      
Application Number US2020063875
Publication Number 2021/126612
Status In Force
Filing Date 2020-12-09
Publication Date 2021-06-24
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Li, Xiaoqing
  • Huh, Ji Yeon
  • Kirkpatrick, Cullen

Abstract

The present disclosure provides an inkjet ink and primer fluid set containing an aqueous primer composition and aqueous inkjet inks. At least one of the inks contains a first pigment dispersion and a second pigment dispersion. The first pigment dispersion forms an aggregation with the primer composition whereas the second pigment dispersion does not form an aggregation with the primer composition.

IPC Classes  ?

  • C09D 11/54 - Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
  • C09D 11/40 - Ink-sets specially adapted for multi-colour inkjet printing
  • C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
  • C09D 11/322 - Pigment inks
  • C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
  • C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09D 11/107 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof

84.

ELECTROACTIVE COMPOUNDS

      
Application Number US2020063766
Publication Number 2021/126593
Status In Force
Filing Date 2020-12-08
Publication Date 2021-06-24
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Diev, Viacheslav V
  • Kondakov, Denis Yurievich
  • Zou, Yunlong

Abstract

There is provided a polycyclic aromatic compound having a single boron-nitrogen bond and including a core structure of Core A, Core B, or Core C In the formulas: Q1and Q2are the same or different and are a single bond, O, S, NR12, BR12, CR13R14, or SiR13R14; and R12- R14 are the same or different and are alkyl, carbocyclic aryl, heteroaryl, or substituted derivatives thereof.

IPC Classes  ?

  • C07F 5/02 - Boron compounds
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • C09K 11/06 - Luminescent, e.g. electroluminescent, chemiluminescent, materials containing organic luminescent materials
  • H01L 51/50 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof

85.

INKJET INK AND PRIMER FLUID SET

      
Application Number US2020063893
Publication Number 2021/126614
Status In Force
Filing Date 2020-12-09
Publication Date 2021-06-24
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Li, Xiaoqing
  • Huh, Ji Yeon
  • Kirkpatrick, Cullen

Abstract

The present disclosure provides an inkjet ink and primer fluid set containing an aqueous primer composition and aqueous inkjet inks. The aqueous primer composition forms a coating on a print substrate. The inkjet inks contain a polymeric binder that interacts with the primer composition. This fluid set is particularly suitable for printing on non-porous plastic substrate.

IPC Classes  ?

  • C09D 11/54 - Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
  • C09D 11/40 - Ink-sets specially adapted for multi-colour inkjet printing
  • C09D 11/322 - Pigment inks
  • C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
  • C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
  • C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09D 11/107 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof

86.

POLYMERS FOR USE IN ELECTRONIC DEVICES

      
Application Number 17265905
Status Pending
Filing Date 2019-08-07
First Publication Date 2021-06-03
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Auman, Brian C.
  • Howard, Jr., Michael Henry

Abstract

Disclosed is a polyimide having a repeat unit structure of Formula IV Disclosed is a polyimide having a repeat unit structure of Formula IV Disclosed is a polyimide having a repeat unit structure of Formula IV In Formula IV: Ra is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues; and Rb is the same or different at each occurrence and represents one or more aromatic diamine residues. 30-100 mol % of Rb has Formula II Disclosed is a polyimide having a repeat unit structure of Formula IV In Formula IV: Ra is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues; and Rb is the same or different at each occurrence and represents one or more aromatic diamine residues. 30-100 mol % of Rb has Formula II Disclosed is a polyimide having a repeat unit structure of Formula IV In Formula IV: Ra is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues; and Rb is the same or different at each occurrence and represents one or more aromatic diamine residues. 30-100 mol % of Rb has Formula II In Formula II: R1 and R2 are the same or different at each occurrence and are halogen, alkyl, fluoroalkyl, silyl, alkoxy, fluoroalkoxy, or siloxy; a and b are the same or different and are an integer from 0-4; c and d are the same or different and are 1 or 2; and * indicates a point of attachment.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

87.

COVER WINDOW ASSEMBLY, RELATED ARTICLES AND METHODS

      
Application Number US2020060964
Publication Number 2021/108174
Status In Force
Filing Date 2020-11-18
Publication Date 2021-06-03
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Carbajal, Leopoldo Alejandro
  • Lamontia, Mark Allan
  • Yahyazadehfar, Mobin
  • Samadidooki, Aref

Abstract

The present invention is directed to a cover window assembly comprising a multi-layer films of polymeric and inorganic materials for a variety of articles, and the related articles and methods. The cover window assembly exhibits high resistance to strain and impact damage for the articles including display devices, particularly flexible display devices.

IPC Classes  ?

  • B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
  • B32B 25/08 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 25/12 - Layered products essentially comprising natural or synthetic rubber comprising natural rubber
  • B32B 25/14 - Layered products essentially comprising natural or synthetic rubber comprising copolymers in which synthetic rubber constituents predominate
  • B32B 25/20 - Layered products essentially comprising natural or synthetic rubber comprising silicone rubber
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/26 - Layered products essentially comprising synthetic resin characterised by the use of special additives using curing agents
  • B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
  • B32B 27/38 - Layered products essentially comprising synthetic resin comprising epoxy resins
  • B32B 27/40 - Layered products essentially comprising synthetic resin comprising polyurethanes

88.

Single layer polymer films and electronic devices

      
Application Number 17088249
Grant Number 11718728
Status In Force
Filing Date 2020-11-03
First Publication Date 2021-05-27
Grant Date 2023-08-08
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Maclaughlin, Laila
  • Alidedeoglu, Husnu Alp
  • Becks, Christopher Robert
  • Carney, Thomas Edward
  • Herrmann, Scott John
  • Johnson, Joseph Casey

Abstract

pv) of 7 μm or more, an L* of 33 or less and a 60° gloss of 10 or less.

IPC Classes  ?

89.

KAPTON

      
Application Number 018475994
Status Registered
Filing Date 2021-05-20
Registration Date 2021-09-18
Owner DuPont Electronics, Inc. (USA)
NICE Classes  ? 17 - Rubber and plastic; packing and insulating materials

Goods & Services

Plastic film, other than for wrapping; flexible plastic film, other than for wrapping; plastic films for electrical insulation; plastic material in the form of film for industrial use; insulating material for electrical purposes.

90.

CONDUCTIVE PASTE FOR N-TYPE SOLAR CELL, METHOD FOR MANUFACTURING N-TYPE SOLAR CELL AND N-TYPE SOLAR CELL

      
Application Number US2020055675
Publication Number 2021/080839
Status In Force
Filing Date 2020-10-15
Publication Date 2021-04-29
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor Shih, Che-Shih

Abstract

A conductive paste for N-type solar cells, comprising (a) 70 to 99.75 wt% of a silver power; (b) 0.1 to 3.0 wt% of an aluminum powder, wherein D50 of the aluminum powder is not larger than 3μm; (c) 5 to 10 wt% of a glass frit; and (d) 3 to 30 wt% of an organic medium; wherein wt% is based on the total weight of the paste composition.

IPC Classes  ?

  • H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
  • C03C 8/16 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions with vehicle or suspending agents, e.g. slip
  • C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals
  • C09D 5/24 - Electrically-conducting paints
  • C09D 11/52 - Electrically conductive inks
  • H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
  • H01L 31/0224 - Electrodes
  • H05K 1/09 - Use of materials for the metallic pattern

91.

THERMAL SUBSTRATES

      
Application Number 16597298
Status Pending
Filing Date 2019-10-09
First Publication Date 2021-04-15
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Becks, Christopher Robert
  • Gonzalez, Rosa Irene
  • Lantzer, Thomas D
  • Tripathi, Rajesh

Abstract

A thermal substrate includes a multilayer film, a first conductive layer adhered to the first outer layer of the multilayer film and a second conductive layer adhered to the second outer layer of the multilayer film. The multilayer film includes a first outer layer including a first thermoplastic polyimide, a core layer including a polyimide and a second outer layer including a second thermoplastic polyimide. The multilayer film has a total thickness in a range of from 5 to 150 μm, and the first outer layer, the core layer and the second outer layer each include a thermally conductive filler. The first conductive layer and the second conductive layer each have a thickness in a range of from 250 to 3000 μm.

IPC Classes  ?

  • H01L 23/373 - Cooling facilitated by selection of materials for the device
  • H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

92.

INK FLUID SET FOR PRINTING ON TEXTILE

      
Application Number US2020051423
Publication Number 2021/055700
Status In Force
Filing Date 2020-09-18
Publication Date 2021-03-25
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Ellis, Scott W.
  • Li, Xiaoqing
  • Liang, Jue

Abstract

The present disclosure provides an ink fluid set containing an aqueous pre-treatment composition, a clear ink, and colored aqueous inkjet inks. This ink fluid set is particularly suitable for printing on polyester, cotton, and blends of cotton and synthetic textiles.

IPC Classes  ?

  • C09D 11/10 - Printing inks based on artificial resins
  • C09D 11/40 - Ink-sets specially adapted for multi-colour inkjet printing
  • C09D 11/54 - Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
  • D06P 5/00 - Other features in dyeing or printing textiles or dyeing leather, furs or solid macromolecular substances in any form

93.

Ink fluid set for printing on offset media

      
Application Number 16954326
Grant Number 11597850
Status In Force
Filing Date 2018-12-17
First Publication Date 2021-03-18
Grant Date 2023-03-07
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Li, Xiaoqing
  • Jackson, Christian
  • Roberts, C Chad

Abstract

The present disclosure provides an ink fluid set containing an aqueous pretreatment composition and an aqueous inkjet ink. This ink fluid set is particularly suitable for printing on offset coated media.

IPC Classes  ?

  • C09D 11/40 - Ink-sets specially adapted for multi-colour inkjet printing
  • C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
  • C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
  • C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
  • C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09D 11/322 - Pigment inks
  • C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
  • C09D 11/54 - Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
  • D21H 19/12 - Coatings without pigments applied as a solution using water as the only solvent, e.g. in the presence of acid or alkaline compounds
  • D21H 19/42 - Coatings with pigments characterised by the pigments at least partly organic
  • D21H 19/82 - Paper comprising more than one coating superposed

94.

Polyimide films and electronic devices

      
Application Number 16912654
Grant Number 11603440
Status In Force
Filing Date 2020-06-25
First Publication Date 2021-03-18
Grant Date 2023-03-14
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Kourtakis, Kostantinos
  • Rossi, Gene M
  • Johnson, Joseph Casey
  • Kwasny, Michael Thomas

Abstract

In a first aspect, a polyimide film includes a dianhydride and a diamine. The dianhydride, the diamine or both the dianhydride and the diamine include an alicyclic monomer, an aliphatic monomer or both an alicyclic monomer and an aliphatic monomer. The polyimide film has a b* of 1.25 or less and a yellowness index of 2.25 or less for a film thickness of 50 μm. The polyimide film is formed by: (a) polymerizing the dianhydride and the diamine in the presence of a first solvent to obtain a polyamic acid solution; (b) imidizing the polyamic acid solution to form a substantially imidized solution; (c) casting the substantially imidized solution to form a film; and (d) drying the film.

IPC Classes  ?

  • C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08J 5/18 - Manufacture of films or sheets
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08K 3/36 - Silica
  • C08K 3/22 - Oxides; Hydroxides of metals

95.

ARTISTRI

      
Application Number 208992400
Status Registered
Filing Date 2021-03-08
Registration Date 2023-03-15
Owner DUPONT ELECTRONICS INC. (USA)
NICE Classes  ? 02 - Paints, varnishes, lacquers

Goods & Services

(1) Ink for inkjet printers; inks for colouring textiles; printing ink;

96.

Multilayer polymer film

      
Application Number 17080668
Grant Number 11254094
Status In Force
Filing Date 2020-10-26
First Publication Date 2021-02-25
Grant Date 2022-02-22
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Kourtakis, Kostantinos
  • Rossi, Gene M
  • Carbajal, Leopoldo Alejandro
  • Lamontia, Mark Allan
  • Yahyazadehfar, Mobin
  • Johnson, Ross S
  • Gao, Weiying
  • Samadidooki, Aref

Abstract

In a first aspect, a multilayer polymer film includes a first polymer layer having a first elastic modulus and a second polymer layer having a second elastic modulus. The first polymer layer includes a polyimide, a polyamide imide, a block copolymer of a polyimide or a polyamide imide or a mixture thereof. The second polymer layer includes a polyimide, a polyamide imide, a block copolymer of a polyimide or a polyamide imide or a mixture thereof. The first elastic modulus is different from the second elastic modulus. The first and second polymer layers are bonded by consolidation. In a second aspect, a cover window for a display includes a hard coat layer and the multilayer polymer film of the first aspect. The first polymer layer of the multilayer polymer film is the layer farthest from the display and is adhered to the hard coat layer.

IPC Classes  ?

  • B32B 7/022 - Mechanical properties
  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
  • B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
  • B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives

97.

THIN FLEXIBLE GLASS COVER WITH A FRAGMENT RETENTION HARD COATING

      
Application Number US2020045306
Publication Number 2021/026408
Status In Force
Filing Date 2020-08-07
Publication Date 2021-02-11
Owner
  • CORNING INCORPORATED (USA)
  • DUPONT ELECTRONICS, INC. (USA)
  • ROHM AND HAAS ELECTRONIC MATERIALS LLC (USA)
Inventor
  • Bu, Lujia
  • Deng, Huayun
  • Deshpande, Suraj S.
  • Johnson, Ross, Stefan
  • Zhang, Ying

Abstract

Glass articles having a thin glass layer and a top optically transparent polymeric hard-coat layer disposed on a top surface of the thin glass layer. The top optically transparent polymeric hard-coat layer may have a thickness in a range of 0.1 microns to 200 microns and a pencil hardness of 6H or more, when the pencil hardness is measured with the optically transparent polymeric hard-coat layer disposed on the top surface of the glass layer. The glass articles avoid ejection of glass shard particles from the glass article upon bending to a failure during a static two-point bend test.

IPC Classes  ?

  • C03C 17/32 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins

98.

ELECTROACTIVE COMPOUNDS

      
Application Number US2020043927
Publication Number 2021/021840
Status In Force
Filing Date 2020-07-29
Publication Date 2021-02-04
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Vo, Giang Dong
  • Diev, Viacheslav V
  • Kondakov, Denis Yurievich
  • Zou, Yunlong

Abstract

There is provided a compound having Formula (I) In Formula I = Ar1 is a hydrocarbon aryl group, a heteroaryl group, or a substituted derivative thereof; and Q has Formula (Q1), (Q2), or (Q3) The variables are described in detail herein.

IPC Classes  ?

  • C07D 307/79 - Benzo [b] furans; Hydrogenated benzo [b] furans with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to carbon atoms of the hetero ring
  • C07D 405/10 - Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings linked by a carbon chain containing aromatic rings
  • C07D 493/04 - Ortho-condensed systems
  • C07D 307/92 - Naphthofurans; Hydrogenated naphthofurans
  • C09K 11/06 - Luminescent, e.g. electroluminescent, chemiluminescent, materials containing organic luminescent materials
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof

99.

Polymers For Use In Electronic Devices

      
Application Number 17042493
Status Pending
Filing Date 2019-04-01
First Publication Date 2021-01-21
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Howard, Jr., Michael Henry
  • Radu, Nora Sabina
  • Hostetler, Greg A.
  • Ngai, Chai Kit
  • Auman, Brian C.
  • Summers, John Donald

Abstract

Disclosed is a polyimide having a repeat unit structure of Formula III Disclosed is a polyimide having a repeat unit structure of Formula III Disclosed is a polyimide having a repeat unit structure of Formula III In Formula III: Ra represents one or more different tetracarboxylic acid component residues; and Rb represents one or more different aromatic diamine residues or aromatic diisocyanate residues. 5-100 mol % of Ra has Formula II Disclosed is a polyimide having a repeat unit structure of Formula III In Formula III: Ra represents one or more different tetracarboxylic acid component residues; and Rb represents one or more different aromatic diamine residues or aromatic diisocyanate residues. 5-100 mol % of Ra has Formula II Disclosed is a polyimide having a repeat unit structure of Formula III In Formula III: Ra represents one or more different tetracarboxylic acid component residues; and Rb represents one or more different aromatic diamine residues or aromatic diisocyanate residues. 5-100 mol % of Ra has Formula II In Formula II: R is H, halogen, cyano, hydroxyl, alkyl, heteroalkyl, alkoxy, heteroalkoxy, fluoroalkyl, silyl, hydrocarbon aryl, substituted hydrocarbon aryl, heteroaryl, substituted heteroaryl, ally, or vinyl; R2 is halogen, cyano, hydroxyl, alkyl, heteroalkyl, alkoxy, heteroalkoxy, fluoroalkyl, silyl, hydrocarbon aryl, substituted hydrocarbon aryl, heteroaryl, substituted heteroaryl, ally, or vinyl; R3 and R4 are the same or different and are alkyl, fluoroalkyl, or silyl; x and y are the same or different and are an integer from 0-2; and * indicates a point of attachment.

IPC Classes  ?

  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C09D 179/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08J 5/18 - Manufacture of films or sheets

100.

Polymer films and electronic devices

      
Application Number 16899504
Grant Number 11700687
Status In Force
Filing Date 2020-06-11
First Publication Date 2020-12-17
Grant Date 2023-07-11
Owner DUPONT ELECTRONICS, INC. (USA)
Inventor
  • Johnson, Joseph Casey
  • Losey, Delanie J
  • Scott, Peggy
  • Simone, Christopher Dennis

Abstract

2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.

IPC Classes  ?

  • H05K 1/03 - Use of materials for the substrate
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
  • C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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