A dual interface transaction card includes a metal card body having first and second surfaces. A contact-only transaction module is secured in the card body, the contact-only transaction module including contact pads disposed on the first surface of the card body and including a first transaction circuit. A contactless transaction module is secured in a void in the metal card body. The contactless transaction module includes a second transaction circuit and an antenna. Also disclosed is a process for manufacturing the dual interface transaction card. The process includes the steps of constructing a metal card body having the first and second surfaces, securing the contact-only transaction module in the metal card body, forming the void in the metal card body, and securing the contactless transaction module in the void.
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
Metal transaction cards and methods of making metal transaction cards are disclosed. One metal transaction card includes at least one metal layer and an inlay layer comprising a biometric sensor and one or more payment interface components configured to interface with a card reader, a secure element configured to exchange information with the card reader pursuant to processing a financial transaction, and at least one logic component connected to the biometric sensor. The logic component is configured to compare information detected by the biometric sensor to stored information and to enable processing of the financial transaction only upon a detected match between the detected and stored information.
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06Q 20/40 - Authorisation, e.g. identification of payer or payee, verification of customer or shop credentials; Review and approval of payers, e.g. check of credit lines or negative lists
A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and disposing a non-conductive material about the electronic component. A transaction card includes a molded electronic component.
Systems, methods, transaction cards, mobile devices, processors, and computer memory programmed with machine-readable instructions, for providing a dynamic Card Verification Value (dCVV) to a user of a transaction card. A mobile device associated with the user and with the transaction card initiates a non-payment near field communication (NFC) with the transaction card, receives a message from the transaction card in the non-payment NFC communication, transmits a prompt to an IP address or web address over a global computer information network, and receives a secure communication from containing the dCVV from a server accessible from the IP address or web address in response to the prompt. The dCVV code is then provided to the user. In embodiments, the non-payment NFC may be initiated via a card tap, a user interface, or a communication from a website.
G06Q 20/40 - Authorisation, e.g. identification of payer or payee, verification of customer or shop credentials; Review and approval of payers, e.g. check of credit lines or negative lists
G06Q 20/34 - Payment architectures, schemes or protocols characterised by the use of specific devices using cards, e.g. integrated circuit [IC] cards or magnetic cards
G06Q 20/32 - Payment architectures, schemes or protocols characterised by the use of specific devices using wireless devices
G06Q 20/02 - Payment architectures, schemes or protocols involving a neutral third party, e.g. certification authority, notary or trusted third party [TTP]
A transaction card having a partial glass layer including an interior glass member connected to a non-glass frame. The frame defines opposite planar surfaces, has an outer periphery coextensive with the outer periphery of the card, and has a frame inner periphery spaced radially inward from the frame outer periphery. The frame inner periphery defines an interior area occupied by the glass member. The transaction card further includes at least one additional layer having a periphery coextensive with the periphery of the card, and a payment module configured for contactless operation or dual interface contact/contactless operation.
A transaction card having a metal layer, an opening in the metal layer for a transponder chip, and at least one discontinuity extending from an origin on the card periphery to a terminus in the opening. The card has a greater flex resistance than a card having a comparative discontinuity with the terminus and the origin the same distance from a line defined by a first long side of the card periphery in an absence of one or more strengthening features. Strengthening features include a discontinuity wherein one of the terminus or the origin are located relatively closer to the first long side of the card periphery than the other, a plurality of discontinuities wherein fewer than all extend from the card periphery to the opening, a self-supporting, non-metal layer disposed on at least one surface of the card, or one or more ceramic reinforcing tabs surrounding the opening.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
7.
METAL, CERAMIC, OR CERAMIC-COATED TRANSACTION CARD WITH WINDOW OR WINDOW PATTERN AND OPTIONAL BACKLIGHTING
A transaction card includes at least one metal layer having one or more apertures therein. A light guide is disposed beneath the metal layer. The light guide has a light output and a light input. The light output is positioned to transmit light through at least the one or more apertures of the metal layer. At least one LED is positioned to transmit light into the light input of the light guide.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
A transaction card having a discontinuous metal stratum with a desired degree of electrical eddy current disruption disposed on a surface of a first layer, such as a glass or other transparent layer. A transaction module disposed in the first layer is electrically isolated from the discontinuous metal stratum. The discontinuous metal stratum may include a plurality of isolated metal features that form a halftone pattern, such as a pattern that is visibly opaque to the naked eye.
B42D 25/351 - Translucent or partly translucent parts, e.g. windows
G06K 19/04 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and disposing a non-conductive material about the electronic component. A transaction card includes a molded electronic component.
A transaction card having a metal layer, an opening in the metal layer for a transponder chip, and at least one discontinuity extending from an origin on the card periphery to a terminus in the opening. The card has a greater flex resistance than a card having a comparative discontinuity with the terminus and the origin the same distance from a line defined by a first long side of the card periphery in an absence of one or more strengthening features. Strengthening features include a discontinuity wherein one of the terminus or the origin are located relatively closer to the first long side of the card periphery than the other, a plurality of discontinuities wherein fewer than all extend from the card periphery to the opening, a self-supporting, non-metal layer disposed on at least one surface of the card, or one or more ceramic reinforcing tabs surrounding the opening.
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
A transaction card includes at least one metal layer having one or more apertures therein. A light guide is disposed beneath the metal layer. The light guide has a light output and a light input. The light output is positioned to transmit light through at least the one or more apertures of the metal layer. At least one LED is positioned to transmit light into the light guide light input
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
B42D 25/22 - Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose for use in combination with accessories specially adapted for information-bearing cards
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
B32B 38/00 - Ancillary operations in connection with laminating processes
F21V 23/06 - Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices
F21V 33/00 - Structural combinations of lighting devices with other articles, not otherwise provided for
A transaction card, and processes for the manufacture thereof, having a core layer, optionally, one or more layers or coatings over the core layer, and at least one of a magnetic stripe, a machine readable code, and a payment module chip disposed in or on the card and suitable for rendering the card operable for conducting a transaction. The core layer comprises a metal-doped cured epoxy comprised of metal particles distributed in a binder consisting essentially of a cured, polymerized epoxy resin, the core comprising greater than 50%, preferably greater than 75%, and more preferably greater than 90%, of the weight and/or volume of the card. In some embodiments, the core includes a metal insert enveloped with the metal-doped curable epoxy, wherein the periphery of the epoxy extends beyond the periphery of the metal insert and has material properties more conducive to cutting or punching than the metal insert.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
B29C 35/02 - Heating or curing, e.g. crosslinking or vulcanising
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
B29K 63/00 - Use of epoxy resins as moulding material
B29K 503/06 - Metal powders, metal carbides or the like
A dual interface transaction card includes a metal card body having first and second surfaces. A contact-only transaction module is secured in the card body, the contact-only transaction module including contact pads disposed on the first surface of the card body and including a first transaction circuit. A contactless transaction module is secured in a void in the metal card body. The contactless transaction module includes a second transaction circuit and an antenna. Also disclosed is a process for manufacturing the dual interface transaction card. The process includes the steps of constructing a metal card body having the first and second surfaces, securing the contact-only transaction module in the metal card body, forming the void in the metal card body, and securing the contactless transaction module in the void.
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
19.
Card with dynamic shape memory alloy tactile feature
A transaction or identification card has a width, a length, and at least one planar surface extending across the width and length. The card includes a dynamic feature including an actuator having an inactivated position and an activated position, wherein the inactivated position has at least one reversible difference from the activated position relative to the planar surface of the card.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
20.
Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
A transaction card includes at least one metal layer having one or more apertures therein. A light guide is disposed beneath the metal layer. The light guide has a light output and a light input. The light output is positioned to transmit light through at least the one or more apertures of the metal layer. At least one LED is positioned to transmit light into the light input of the light guide.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
21.
TRANSACTION AND ID CARDS HAVING SELECTED TEXTURE AND COLORING
Cards made in accordance with the invention include a specially treated thin decorative layer attached to a thick core layer of metal or ceramic material, where the thin decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. Decorative layers for use in practicing the invention include: (a) an anodized metal layer; or (b) a layer of material derived from plant or animal matter (e.g., wood, leather); or (c) an assortment of aggregate binder material (e.g., cement, mortar, epoxies) mixed with laser reactive materials (e.g., finely divided carbon); or (d) a ceramic layer; and (e) a layer of crystal fabric material. The cards may be dual interface smart cards which can be read in a contactless manner and/or via contacts.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
B32B 13/04 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance
B32B 13/06 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of metal
B32B 13/12 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/10 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of wood
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 21/08 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance of fibre-reinforced resin
B32B 21/14 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood board or veneer
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
B32B 3/04 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by a layer folded at the edge, e.g. over another layer
B32B 3/08 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
C25D 5/02 - Electroplating of selected surface areas
C25D 11/04 - Anodisation of aluminium or alloys based thereon
C25D 11/26 - Anodisation of refractory metals or alloys based thereon
C25D 11/34 - Anodisation of metals or alloys not provided for in groups
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 21/04 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance
B32B 3/14 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a face layer formed of separate pieces of material
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 9/02 - Layered products essentially comprising a particular substance not covered by groups comprising animal or vegetable substances
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B42D 25/00 - Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
B44D 5/00 - Surface treatment to obtain special artistic surface effects or finishes
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
B32B 15/00 - Layered products essentially comprising metal
B44C 1/14 - Metallic leaves or foils, e.g. gold leaf
A transaction card includes at least one metal layer having one or more apertures therein. A light guide is disposed beneath the metal layer. The light guide has a light output and a light input. The light output is positioned to transmit light through at least the one or more apertures of the metal layer. At least one LED is positioned to transmit light into the light guide light input.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
B42D 25/22 - Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose for use in combination with accessories specially adapted for information-bearing cards
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
B32B 38/00 - Ancillary operations in connection with laminating processes
F21V 23/06 - Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices
F21V 33/00 - Structural combinations of lighting devices with other articles, not otherwise provided for
F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
G06Q 20/34 - Payment architectures, schemes or protocols characterised by the use of specific devices using cards, e.g. integrated circuit [IC] cards or magnetic cards
24.
DI metal transaction devices and processes for the manufacture thereof
A transaction device includes a metal layer with one or more discontinuities in the metal layer. Each discontinuity comprises a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity that defines a path from the device periphery to the opening. A transponder chip module is disposed in the opening. A booster antenna is in communication with the transponder chip module. The device may include at least one fiber-reinforced epoxy laminate material layer. The transponder chip module and the booster antenna may comprise components in a payment circuit, with the metal layer electrically isolated from the payment circuit. The booster antenna may be formed on or embedded in the fiber-reinforced epoxy laminate material layer. Processes for manufacturing transaction devices including a metal layer with one or more fiber-reinforced epoxy laminate material layers are also disclosed.
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
A transaction card having an opening in a metal card body, a booster antenna in the opening, and a molding material about the booster antenna. A process for manufacturing the transaction card includes forming an opening in a card body, inserting a booster antenna into the opening, and molding a molding material about the booster antenna.
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and disposing a non-conductive material about the electronic component. A transaction card includes a molded electronic component.
A transaction card is described. The transaction card includes a non-plastic layer, one or more embedded electronics, a fill layer, and one or more additional layers. The non-plastic layer has first and second faces and a thickness therebetween, and at least a first opening in the first face. The one or more embedded electronic components are disposed in or adjacent the first opening. The fill layer is in contact with the embedded electronic components, disposed in portions of the first opening not occupied by the embedded electronics. The one or more additional layers are disposed over the fill layer.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
28.
Transaction card with embedded electronic components and process for manufacture
A process for making a transaction card defined by a plurality of layers is described. The process includes providing a first portion of the card, the first portion comprising a non-plastic layer having first and second faces and a thickness therebetween; forming an opening in the non-plastic layer, the opening defined through the first face; disposing embedded electronics in the opening; providing a second portion of the card; and providing a fill disposed in portions of the opening not occupied by the embedded electronics and attaching the first portion of the card to the second portion of the card.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
29.
Card with dynamic shape memory alloy tactile feature
A transaction or identification card has a width, a length, and at least one planar surface extending across the width and length. The card includes a dynamic feature including an actuator having an inactivated position and an activated position, wherein the inactivated position has at least one reversible difference from the inactivated position relative to the planar surface of the card.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
A transaction card comprising a metal layer. A first cut out region in a first surface of said metal layer has a depth less than the thickness of the metal layer, and a first portion of an integrated circuit (IC) module is secured therein. A second cut out region extends from the first cut out region to the second surface of said metal layer and defines a non-RF-impeding volume having a perimeter greater than the perimeter of the first cut out region. One or more additional layers are stacked on the second surface of the metal layer, and a channel extends between one of the stacked layers and the IC module.
A transaction card having a metal layer, an opening in the metal layer for a transponder chip, and at least one discontinuity extending from an origin on the card periphery to a terminus in the opening. The card has a greater flex resistance than a card having a comparative discontinuity with the terminus and the origin the same distance from a line defined by a first long side of the card periphery in an absence of one or more strengthening features. Strengthening features include a discontinuity wherein one of the terminus or the origin are located relatively closer to the first long side of the card periphery than the other, a plurality of discontinuities wherein fewer than all extend from the card periphery to the opening, a self-supporting, non-metal layer disposed on at least one surface of the card, or one or more ceramic reinforcing tabs surrounding the opening.
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
32.
Ceramic-containing and ceramic composite transaction cards
A process for making a card includes the steps of forming a core layer having a first surface and a second surface, disposing an uncured decorative ceramic layer of ceramic particles disposed in a resin binder over the first surface of the core layer, such as by spray coating, and curing the uncured decorative ceramic layer to form a cured decorative ceramic layer. Card products of the process may have a core layer of metal, ceramic, or a combination thereof that form a bulk of the card.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
B32B 13/04 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 21/14 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood board or veneer
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
C25D 5/02 - Electroplating of selected surface areas
C25D 11/34 - Anodisation of metals or alloys not provided for in groups
B32B 21/08 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance of fibre-reinforced resin
C25D 11/26 - Anodisation of refractory metals or alloys based thereon
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
C25D 11/04 - Anodisation of aluminium or alloys based thereon
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
B32B 13/06 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of metal
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
B32B 13/12 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 38/00 - Ancillary operations in connection with laminating processes
B32B 3/26 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids
B32B 3/08 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
B32B 3/04 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by a layer folded at the edge, e.g. over another layer
B32B 21/04 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
B32B 3/06 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions for attaching the product to another member, e.g. to a support
B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 15/10 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of wood
B32B 17/00 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like
B32B 15/18 - Layered products essentially comprising metal comprising iron or steel
B32B 15/09 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyesters
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
33.
Overmolded electronic components for transaction cards and methods of making thereof
A transaction card having an opening in a metal card body, a booster antenna in the opening, and a molding material about the booster antenna. A process for manufacturing the transaction card includes forming an opening in a card body, inserting a booster antenna into the opening, and molding a molding material about the booster antenna.
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
A transaction card includes at least one metal layer having one or more apertures therein. A light guide is disposed beneath the metal layer. The light guide has a light output and a light input. The light output is positioned to transmit light through at least the one or more apertures of the metal layer. At least one LED is positioned to transmit light into the light guide light input.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
A smart card having a metal layer, an opening in the metal layer and a dual interface integrated circuit (IC) module and a plug non-RF-impeding material mounted in the opening, with at least one at least one additional layer stacked relative to the plug.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
A card includes a layer of deformable material embossed with a three dimensional (3-D) pattern. A first layer is in direct contact with and overlies the embossed deformable layer. A second layer is in direct contact with and underlies the embossed deformable layer. The first layer is of conformable material and extends within the embossed pattern for filling, setting and maintaining the embossed pattern in a fixed condition. The second layer is of conformable material and conforms to the embossed pattern set in the deformable layer.
B42D 25/46 - Associating two or more layers using pressure
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B42D 25/425 - Marking by deformation, e.g. embossing
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
Composite cards formed include a security layer comprising a hologram or diffraction grating formed at, or in, the center, or core layer, of the card. The hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and depositing a thin layer of metal on the embossed layer. Additional layers may be selectively and symmetrically attached to the top and bottom surfaces of the core layer. A laser may be used to remove selected portions of the metal formed on the embossed layer, at selected stages of forming the card, to impart a selected pattern or information to the holographic region. The cards may be ‘lasered’ when the cards being processed are attached to, and part of, a large sheet of material, whereby the “lasering” of all the cards on the sheet can be done at the same time and relatively inexpensively.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B42D 25/425 - Marking by deformation, e.g. embossing
B42D 25/435 - Marking by removal of material using electromagnetic radiation, e.g. laser
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
A dual interface transaction card includes a metal card body having first and second surfaces. A contact-only transaction module is secured in the card body, the contact-only transaction module including contact pads disposed on the first surface of the card body and including a first transaction circuit. A contactless transaction module is secured in a void in the metal card body. The contactless transaction module includes a second transaction circuit and an antenna. Also disclosed is a process for manufacturing the dual interface transaction card. The process includes the steps of constructing a metal card body having the first and second surfaces, securing the contact-only transaction module in the metal card body, forming the void in the metal card body, and securing the contactless transaction module in the void.
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
40.
Laser-personalized card having a hard coat subassembly and a core subassembly having non-metal layers with carbon particles
Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
B32B 37/00 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and disposing a non-conductive material about the electronic component. A transaction card includes a molded electronic component.
A transaction card having a metal layer, an opening in the metal layer for a transponder chip, and at least one discontinuity extending from an origin on the card periphery to a terminus in the opening. The card has a greater flex resistance than a card having a comparative discontinuity with the terminus and the origin the same distance from a line defined by a first long side of the card periphery in an absence of one or more strengthening features. Strengthening features include a discontinuity wherein one of the terminus or the origin are located relatively closer to the first long side of the card periphery than the other, a plurality of discontinuities wherein fewer than all extend from the card periphery to the opening, a self-supporting, non-metal layer disposed on at least one surface of the card, or one or more ceramic reinforcing tabs surrounding the opening.
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
A dual interface smart card, and methods for the manufacture thereof, having a metal layer, an IC module, with contacts and RF capability, and a plug formed of non RF impeding material, disposed in the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. Embodiments of the card include at least one additional layer.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
46.
Overmolded electronic components for transaction cards and methods of making thereof
A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
A transaction card and a process of making the transaction card are described. The transaction card includes a core having first and second faces, a core thickness therebetween, and an opening, and embedded electronics disposed in the opening.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
48.
Overmolded electronic components for transaction cards and methods of making thereof
A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.
B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
A multi layered card embodying the invention includes an outer layer of an amorphous laser reactive copolymer material which is embossed with a selected pattern at a selected temperature which is above the glass transition temperature, Tg, of the copolymer and below its melting temperature, Tm. So embossed, the selected pattern is set in the copolymer layer, and its external shape cannot be changed from the embossed form to which it was set at the selected temperature, without destroying the selected pattern. The outer layer may be laminated with the other layers of the card and laser engraved before or after lamination.
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 38/00 - Ancillary operations in connection with laminating processes
B29C 59/02 - Surface shaping, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 3/08 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
B42D 25/41 - Marking using electromagnetic radiation
B42D 25/425 - Marking by deformation, e.g. embossing
B42D 25/455 - Associating two or more layers using heat
B42D 25/46 - Associating two or more layers using pressure
B42D 25/435 - Marking by removal of material using electromagnetic radiation, e.g. laser
B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins
B32B 15/09 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyesters
A card having a metal layer and an opening or cut-out region in the metal layer, with a dual-interface integrated circuit (IC) module disposed in the opening or cut-out region. A ferrite layer is disposed below the metal layer and a booster antenna is attached to the ferrite layer. A vertical hole extends beneath the IC module through the ferrite layer. The booster antenna may be physically connected to the IC module or may be configured to inductively couple to the IC module. In some embodiments, the IC may be disposed in or on a non-conductive plug disposed within the opening or cut-out region, or the vertical hole may have a non-conductive lining, or a connector may be disposed between the booster antenna and the IC module in the vertical hole.
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B42D 25/00 - Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
B44D 5/00 - Surface treatment to obtain special artistic surface effects or finishes
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
B32B 15/00 - Layered products essentially comprising metal
B44C 1/14 - Metallic leaves or foils, e.g. gold leaf
A dual interface smart card having a metal layer includes an SC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
53.
Transaction and ID cards having selected texture and coloring
Cards made in accordance with the invention include a decorative layer attached to a core layer, where the decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. At least one of the decorative layers is a layer derived from plant matter (e.g., wood). The cards may be dual interface smart cards that can be read in a contactless manner and/or via contacts.
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
B32B 13/04 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance
B32B 13/06 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of metal
B32B 13/12 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/10 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of wood
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 21/08 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance of fibre-reinforced resin
B32B 21/14 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood board or veneer
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
B32B 3/04 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by a layer folded at the edge, e.g. over another layer
B32B 3/08 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
C25D 5/02 - Electroplating of selected surface areas
C25D 11/04 - Anodisation of aluminium or alloys based thereon
C25D 11/26 - Anodisation of refractory metals or alloys based thereon
C25D 11/34 - Anodisation of metals or alloys not provided for in groups
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 21/04 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance
B32B 3/14 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a face layer formed of separate pieces of material
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 9/02 - Layered products essentially comprising a particular substance not covered by groups comprising animal or vegetable substances
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
RF shielding material utilized in a smart metal card as a shield between a metal layer and an antenna does not occupy a complete layer. Instead, only sufficient RF shielding material is utilized to track and conform to the antenna.
G06F 19/00 - Digital computing or data processing equipment or methods, specially adapted for specific applications (specially adapted for specific functions G06F 17/00;data processing systems or methods specially adapted for administrative, commercial, financial, managerial, supervisory or forecasting purposes G06Q;healthcare informatics G16H)
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles
H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
55.
Transaction and ID cards having selected texture and coloring
Cards made in accordance with the invention include a decorative layer attached to a core layer, where the decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. At least one of the decorative layers is a layer derived from animal matter (e.g. leather). The cards may be dual interface smart cards configured to be read in a contactless manner and/or via contacts.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
B32B 13/06 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of metal
B32B 13/12 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 3/08 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
C25D 5/02 - Electroplating of selected surface areas
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 13/04 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/10 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of wood
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 21/08 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance of fibre-reinforced resin
B32B 21/14 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood board or veneer
B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
B32B 3/04 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by a layer folded at the edge, e.g. over another layer
C25D 11/04 - Anodisation of aluminium or alloys based thereon
C25D 11/26 - Anodisation of refractory metals or alloys based thereon
C25D 11/34 - Anodisation of metals or alloys not provided for in groups
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 21/04 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance
B32B 3/14 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a face layer formed of separate pieces of material
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 9/02 - Layered products essentially comprising a particular substance not covered by groups comprising animal or vegetable substances
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
A transaction card includes a monolithic ceramic card body having one or more pockets, and at least one of a magnetic stripe, a barcode, and a laser signature portion. The one or more pockets may be configured to receive at least one of the magnetic stripe, the barcode, a contact chip module, a contactless chip module, a dual interface chip module, a booster antenna, a hologram or commercial indicia. A transaction card may also include a substrate layer having a first side and a second side. A first ceramic layer is connected to the first side of the substrate layer.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
B32B 13/04 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 21/14 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood board or veneer
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
C25D 5/02 - Electroplating of selected surface areas
C25D 11/34 - Anodisation of metals or alloys not provided for in groups
B32B 21/08 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance of fibre-reinforced resin
C25D 11/26 - Anodisation of refractory metals or alloys based thereon
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
C25D 11/04 - Anodisation of aluminium or alloys based thereon
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
B32B 13/06 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of metal
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
B32B 13/12 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 38/00 - Ancillary operations in connection with laminating processes
C25D 7/00 - Electroplating characterised by the article coated
B32B 3/26 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids
B32B 3/08 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
B32B 3/04 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by a layer folded at the edge, e.g. over another layer
B32B 21/04 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
B32B 3/06 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions for attaching the product to another member, e.g. to a support
B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 15/10 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of wood
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 17/00 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like
B32B 15/18 - Layered products essentially comprising metal comprising iron or steel
B32B 15/09 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyesters
B32B 7/08 - Interconnection of layers by mechanical means
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
B32B 37/00 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
In a smart card having an antenna structure and a metal layer, an insulator layer is formed between the antenna structure and the metal layer to compensate for the attenuation due to the metal layer. The thickness of the insulator layer affects the capacitive coupling between the antenna structure and the metal layer and is selected to have a value which optimizes the transmission/reception of signals between the card and a card reader.
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G01B 7/06 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width, or thickness for measuring thickness
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles
H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
59.
Transaction and ID cards having selected texture and coloring
Cards made in accordance with the invention include a specially treated thin decorative layer attached to a thick core layer of metal or ceramic material, where the thin decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. Decorative layers for use in practicing the invention include: (a) an anodized metal layer; or (b) a layer of material derived from plant or animal matter (e.g., wood, leather); or (c) an assortment of aggregate binder material (e.g., cement, mortar, epoxies) mixed with laser reactive materials (e.g., finely divided carbon); or (d) a ceramic layer; and (e) a layer of crystal fabric material. The cards may be dual interface smart cards which can be read in a contactless manner and/or via contacts.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 13/04 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance
B32B 13/06 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of metal
B32B 13/12 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/10 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of wood
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 21/08 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance of fibre-reinforced resin
B32B 21/14 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood board or veneer
B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
B32B 3/04 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by a layer folded at the edge, e.g. over another layer
B32B 3/08 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
C25D 5/02 - Electroplating of selected surface areas
C25D 11/04 - Anodisation of aluminium or alloys based thereon
C25D 11/26 - Anodisation of refractory metals or alloys based thereon
C25D 11/34 - Anodisation of metals or alloys not provided for in groups
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 21/04 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance
B32B 3/14 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a face layer formed of separate pieces of material
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 9/02 - Layered products essentially comprising a particular substance not covered by groups comprising animal or vegetable substances
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
Composite cards formed in accordance with the invention include a security layer comprising a hologram or diffraction grating formed at or in the center, or core layer of the card. The hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and depositing a thin layer of metal on the embossed layer. Additional layers may be selectively and symmetrically attached to the top and bottom surfaces of the core layer. A laser may be used to remove selected portions of the metal formed on the embossed layer, at selected stages of forming the card, to impart a selected pattern or information to the holographic region. The cards may be “lasered’ when the cards being processed are attached to, and part of, a large sheet of material, or after the sheets are die-cut into cards.
B42D 25/425 - Marking by deformation, e.g. embossing
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
A multi layered card embodying the invention includes an outer layer of an amorphous laser reactive copolymer material which is embossed with a selected pattern at a selected temperature which is above the glass transition temperature, Tg, of the copolymer and below its melting temperature, Tm. So embossed, the selected pattern is set in the copolymer layer, and its external shape cannot be changed from the embossed form to which it was set at the selected temperature, without destroying the selected pattern. The outer layer may be laminated with the other layers of the card and laser engraved before or after lamination.
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
B29C 65/48 - Joining of preformed parts; Apparatus therefor using adhesives
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 38/00 - Ancillary operations in connection with laminating processes
B29C 65/00 - Joining of preformed parts; Apparatus therefor
B29C 59/02 - Surface shaping, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
B44C 1/00 - Processes, not specifically provided for elsewhere, for producing decorative surface effects
B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
B29K 667/00 - Use of polyesters for preformed parts, e.g. for inserts
A dual interface smart card having a metal layer includes an IC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
63.
Smart metal card with radio frequency (RF) transmission capability
Ferrite material utilized in a smart metal card as a shield between a metal layer and an antenna does not occupy a complete layer. Instead, only sufficient ferrite material is utilized to track and conform to the antenna.
G06F 19/00 - Digital computing or data processing equipment or methods, specially adapted for specific applications (specially adapted for specific functions G06F 17/00;data processing systems or methods specially adapted for administrative, commercial, financial, managerial, supervisory or forecasting purposes G06Q;healthcare informatics G16H)
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
H01Q 1/22 - Supports; Mounting means by structural association with other equipment or articles
H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
64.
Transaction and ID cards having selected texture and coloring
Cards made in accordance with the invention include a specially treated thin decorative layer attached to a thick core layer of metal or ceramic material, where the thin decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. Decorative layers for use in practicing the invention include: (a) an anodized metal layer; or (b) a layer of material derived from plant or animal matter (e.g., wood, leather); or (c) an assortment of aggregate binder material (e.g., cement, mortar, epoxies) mixed with laser reactive materials (e.g., finely divided carbon); or (d) a ceramic layer; and (e) a layer of crystal fabric material. The cards may be dual interface smart cards which can be read in a contactless manner and/or via contacts.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
B32B 13/04 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance
B32B 13/06 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of metal
B32B 13/12 - Layered products essentially comprising a water-setting substance, e.g. concrete, plaster, asbestos cement, or like builders' material comprising such substances as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/10 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of wood
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 21/08 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance of fibre-reinforced resin
B32B 21/14 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood board or veneer
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/12 - Layered products essentially comprising synthetic resin next to a fibrous or filamentary layer
B32B 3/04 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by a layer folded at the edge, e.g. over another layer
B32B 3/08 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
C25D 5/02 - Electroplating of selected surface areas
C25D 11/04 - Anodisation of aluminium or alloys based thereon
C25D 11/26 - Anodisation of refractory metals or alloys based thereon
C25D 11/34 - Anodisation of metals or alloys not provided for in groups
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
B32B 21/04 - Layered products essentially comprising wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, next to another layer of a specific substance
B32B 3/14 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by a face layer formed of separate pieces of material
B32B 3/30 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 9/02 - Layered products essentially comprising a particular substance not covered by groups comprising animal or vegetable substances
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
B32B 37/00 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
G06K 17/00 - Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups , e.g. automatic card files incorporating conveying and reading operations
Composite cards formed in accordance with the invention include a security layer comprising a hologram or diffraction grating formed at, or in, the center, or core layer, of the card. The hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and depositing a thin layer of metal on the embossed layer. Additional layers may be selectively and symmetrically attached to the top and bottom surfaces of the core layer. A laser may be used to remove selected portions of the metal formed on the embossed layer, at selected stages of forming the card, to impart a selected pattern or information to the holographic region. The cards may be ‘lasered’ when the cards being processed are attached to, and part of, a large sheet of material, whereby the “lasering” of all the cards on the sheet can be done at the same time and relatively inexpensively. Alternatively, each card may be individually “lasered” to produce desired alpha numeric information, bar codes information or a graphic image, after the sheets are die-cut into cards.
B42D 25/425 - Marking by deformation, e.g. embossing
B42D 25/435 - Marking by removal of material using electromagnetic radiation, e.g. laser
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
patents
