AAC Acoustic Technologies (Shenzhen) Co., Ltd.

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H04R 19/04 - Microphones 49
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes 43
H04R 1/02 - Casings; Cabinets; Mountings therein 35
H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details 29
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1.

MOTION-SENSING IN-VEHICLE ALERTING METHOD, SYSTEM AND RELATED DEVICE

      
Application Number 18323402
Status Pending
Filing Date 2023-05-24
First Publication Date 2024-06-13
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Sun, Shuyuan
  • Meng, Yiming
  • Yin, Hao
  • Zhang, Xin
  • Zhang, Henglizi
  • Ge, Huan
  • Huang, Xiang

Abstract

Disclosed are a motion-sensing in-vehicle alerting method, a system, and a related device, which are applied to vehicles. The method includes steps of: obtaining, by a controller, an audio signal from an in-vehicle audio bus; performing an acoustic characteristics analysis on the audio signal, and extracting an acoustic waveform of the audio signal in a time domain waveform; performing an amplitude modulation on a sinusoidal signal of the acoustic waveform to obtain a modulated sinusoidal signal after amplitude modulation; obtaining, by the controller, a control signal indicating operational behavior information from an in-vehicle control bus, matching the control signal with the modulated sinusoidal signal according to a predetermined rule to generate a vibration signal, and transmitting the vibration signal to the excitation oscillator to achieve a vibration alert. The method of the present application not only enhances safety, but also provides the vibration alert, resulting in an improved user experience.

IPC Classes  ?

  • G08B 6/00 - Tactile signalling systems, e.g. personal calling systems
  • B60Q 9/00 - Arrangement or adaptation of signal devices not provided for in one of main groups
  • G06F 3/16 - Sound input; Sound output

2.

SEALED DUAL MEMBRANE STRUCTURE AND DEVICE INCLUDING THE SAME

      
Application Number 17993800
Status Pending
Filing Date 2022-11-23
First Publication Date 2024-05-23
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Jenkins, Colin Robert

Abstract

Provided is a sealed dual membrane (SDM) structure and a device including the same. The SDM structure according to the present invention includes a substrate, a first vibrating membrane and a second vibrating membrane disposed on the substrate, which form a sealed cavity together with the substrate, a first back electrode plate and a second back electrode plate disposed between the vibrating membrane and the second vibrating membrane, and a conductor plate unit disposed between the first back electrode plate and the second back electrode plate. The first vibrating membrane and the second vibrating membrane are mechanically coupled to the conductor plate unit, and the conductor plate unit forms a capacitor structure with each of the first back electrode plate and the second back electrode plate. The present invention reduces the number of pillars required in the SDM structure and increases the sensitivity of the device including the SDM.

IPC Classes  ?

  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • H04R 1/04 - Structural association of microphone with electric circuitry therefor
  • H04R 7/16 - Mounting or tensioning of diaphragms or cones
  • H04R 19/04 - Microphones

3.

OPTICAL MICROPHONE

      
Application Number 17993804
Status Pending
Filing Date 2022-11-23
First Publication Date 2024-05-23
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Kervran, Yannick Pierre

Abstract

Provided is an optical microphone, including a case including an inner cavity and a sound inlet aperture that makes the inner cavity communicate with exterior; a micro-electromechanical module in the inner cavity and including a flexible film and a grating; an optoelectronic module in the rear cavity and including a light source and a light beam detector; and an integrated circuit module in the rear cavity and electrically connected to the micro-electromechanical module and the optoelectronic module. The optoelectronic module and the integrated circuit module are provided on a same chip; a reflective layer is provided at a side of the flexible film facing the light source, and another reflective layer is provided at a side of the grating facing the light source. The microphone has following beneficial effects: connection wires are less and crosstalk noise between wires is reduced, thereby achieving easier package manufacturing and better package miniaturization.

IPC Classes  ?

  • H04R 23/00 - Transducers other than those covered by groups

4.

MICROPHONE

      
Application Number 18323391
Status Pending
Filing Date 2023-05-24
First Publication Date 2024-05-09
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

A microphone is provided. The microphone includes a housing having an accommodating cavity, a circuit board fixed to the accommodating cavity, an interface assembly fixed to an outer side of the housing and electrically connected to the circuit board, and a microphone unit fixed to the circuit board. The housing includes a shell having the accommodating cavity and a cover plate fixed to the housing and covering the accommodating cavity, the interface assembly is fixed to one side of the shell away from the cover plate, an insertion direction of the interface assembly is perpendicular to a surface of the circuit board. The microphone cancels the weak connecting plate, which can enhance the connection strength between interface assembly and the housing, which is conducive to miniaturizing the microphone and allowing it to flexibly adapt to different installation methods.

IPC Classes  ?

  • H04R 1/04 - Structural association of microphone with electric circuitry therefor

5.

MEMS MICROPHONE

      
Application Number 18454042
Status Pending
Filing Date 2023-08-22
First Publication Date 2024-05-09
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Wang, Linlin
  • Wang, Kaijie
  • Zhang, Rui

Abstract

A MEMS microphone includes a substrate, a supporting plate, a capacitor system, a first pad, and a first electrode. The substrate defines a back cavity, the supporting plate is disposed at one side of the substrate and defines an accommodation cavity, and the capacitor system is disposed at the supporting plate. The capacitor system includes a back plate, a fixing component, and a vibrating diaphragm. The vibrating diaphragm is fixed to one side of the fixing component distal from the back plate. The vibrating diaphragm forms a cantilever structure fixing at the middle, and the first electrode is only connected to a central region of the vibrating diaphragm, the first electrode may not interfere with deformation of an edge region of the vibrating diaphragm, thereby improving sensitivity of the MEMS microphone through fully releasing residual stress of the vibrating diaphragm.

IPC Classes  ?

6.

MEMS OPTICAL MICROPHONE

      
Application Number 17952359
Status Pending
Filing Date 2022-09-26
First Publication Date 2024-03-28
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ali, Taimoor

Abstract

An MEMS optical microphone, including: a shell including an inner cavity and a sound inlet that communicates the inner cavity with outside; a MEMS module including a diaphragm suspended in the inner cavity, a light flap is formed in the diaphragm, when an acoustic pressure is applied, an aperture is formed by opening of the light flap, and a size of the aperture increases or decreases with a magnitude of the acoustic pressure applied; an optoelectronic module including an electromagnetic radiation source and a sensor arranged on opposite sides of the diaphragm, and a light beam passes through the aperture to the sensor; and an integrated circuit module electrically connected with the optoelectronic module. Advantages of high sensitivity and flat frequency response are realized.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 23/00 - Transducers other than those covered by groups

7.

MEMS OPTICAL MICROPHONE

      
Application Number 17952340
Status Pending
Filing Date 2022-09-26
First Publication Date 2024-03-28
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ali, Taimoor

Abstract

An MEMS optical microphone, including: a case, a membrane, a waveguide plate, a variable optical waveplate, an optoelectronic module, and an IC module. The case includes a cavity and a sound inlet. The membrane is suspended in the cavity and closes the sound inlet. The waveguide plate is suspended in the cavity and located at a side of the membrane away from the sound inlet. The optoelectronic module includes an electromagnetic radiation source and a sensing part provided at two opposite sides of the waveguide plate, respectively. The variable optical waveplate is configured to convert an input polarization state of the first light path into an output polarization state, which varies as a moving distance of the variable optical waveplate. The IC module is electrically connected to the membrane and the optoelectronic module. It has advantages such as high sensitivity, flat frequency response, thereby further improving the device performance.

IPC Classes  ?

  • H04R 23/00 - Transducers other than those covered by groups
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • G02B 6/12 - Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
  • H04R 3/00 - Circuits for transducers
  • H04R 7/04 - Plane diaphragms
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 19/04 - Microphones

8.

MEMS OPTICAL MICROPHONE

      
Application Number 17952357
Status Pending
Filing Date 2022-09-26
First Publication Date 2024-03-28
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ali, Taimoor

Abstract

An MEMS optical microphone, including a casing including an inner cavity and a sound inlet that communicates the inner cavity with outside; an MEMS module including a diaphragm suspended in the inner cavity, an aperture is provided penetrating through the diaphragm, and a size of the aperture increases or decreases with acoustic pressure applied to the diaphragm; an optoelectronic module including an electromagnetic radiation source and a sensor arranged on opposite sides of the diaphragm, the sensor is configured to receive a light beam emitted by the electromagnetic radiation source, the light beam covers the aperture, and a size of the light beam is larger than a maximum size of the aperture; and an integrated circuit module electrically connected with the MEMS module and the optoelectronic module. Dynamic range of the MEMS optical microphone is improved, wider range of sound signals can be sensed, and higher sensitivity can be realized.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 23/00 - Transducers other than those covered by groups

9.

METHOD AND APPARATUS FOR ELIMINATING SOUND LEAKAGE

      
Application Number 18088641
Status Pending
Filing Date 2022-12-26
First Publication Date 2024-03-14
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Liu, Kejia
  • Jiang, Yuheng
  • He, Wenkai

Abstract

A method for eliminating sound leakage includes: controlling, upon detecting call voice being outputted by a receiver, a collection device to determine a first frequency response curve of first sound wave of the call voice at a first position outside a terminal device; controlling a speaker to generate a second sound wave; controlling the collection device to determine a second frequency response curve of the second sound wave at the first position; and regulating, according to the first frequency response curve, the second frequency response curve to a third frequency response curve. Frequency responses of the first and third frequency response curves at a corresponding frequency are superimposed on and cancel each other. The speaker actively generates second sound wave that is modulated according to a parameter of first sound wave, so as to ensure that second sound wave effectively eliminates leakage of call content caused by first sound wave.

IPC Classes  ?

  • G10K 11/178 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase

10.

METHOD AND APPARATUS FOR EMILINATING SOUND LEAKAGE

      
Application Number 18088640
Status Pending
Filing Date 2022-12-26
First Publication Date 2024-03-14
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Jiang, Yuheng
  • He, Wenkai
  • Liu, Kejia

Abstract

The present application relates to a method and apparatus for eliminating sound leakage which includes: determining a first frequency response curve of a first sound wave generated by the call voice at a first position outside a terminal device; controlling a vibration motor to drive a rear housing of the terminal device to vibrate to generate a second sound wave; determining a second frequency response curve of the second sound wave at the first position; and regulating the second frequency response curve to a third frequency response curve, frequency response of the third frequency response curve being superimposed on and canceling frequency response of the first frequency response curve at a corresponding frequency. The vibration motor drives the rear housing to vibrate to actively generate the second sound wave superimposed on and canceling the first sound wave generated by call sound leakage, so as to eliminate leakage of call content.

IPC Classes  ?

  • H04R 3/04 - Circuits for transducers for correcting frequency response

11.

SOUND-ABSORBING MATERIAL BLOCK, METHOD FOR PREPARING THE SAME AND ITS APPLICATION

      
Application Number 18095000
Status Pending
Filing Date 2023-01-10
First Publication Date 2024-03-07
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Zhongyang
  • Wang, Hezhi
  • Zhang, Jie

Abstract

A sound-absorbing material block, a method for preparing the same and application thereof are provided. The sound-absorbing material block includes three-dimensional open-cell foam, sound-absorbing material powder, a binder, a gel, and a cross-linking agent. The sound-absorbing material powder is bonded to each other and connected to the three-dimensional open-cell foam by means of the gel, the cross-linking agent, and the binder, by mass of the sound-absorbing material powder, the gel accounts for 1 wt % to 5 wt % of the sound-absorbing material powder, and the binder accounts for 1 wt % to 8 wt % of the sound-absorbing material powder, and by mass of the gel, the cross-linking agent accounts for 1 wt % to 10 wt % of the gel. The sound-absorbing material block according to the present disclosure reduces an additive amount of the binder, and significantly improves sound-absorbing performance and strength of the material block.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • C08J 9/42 - Impregnation with macromolecular compounds
  • C09D 5/02 - Emulsion paints
  • C09D 7/20 - Diluents or solvents
  • C09D 7/61 - Additives non-macromolecular inorganic
  • C09D 109/08 - Latex
  • C09D 125/18 - Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
  • C09D 133/04 - Homopolymers or copolymers of esters
  • H04R 1/02 - Casings; Cabinets; Mountings therein

12.

MICROPHONE CHIP AND MICROPHONE

      
Application Number 18072657
Status Pending
Filing Date 2022-11-30
First Publication Date 2024-02-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Kaijie
  • Zhao, Zhuanzhuan
  • Wang, Linlin

Abstract

A microphone chip and a microphone are provided. The microphone chip includes a diaphragm and a back plate. When the sound wave drives the diaphragm to vibrate through the sound hole, a distance between the electrode sheet and the diaphragm changes, and a capacitance value of the capacitance system changes, thereby converting the sound wave signal into an electrical signal. In the direction perpendicular to the back plate, the outer contour of the projection of each protrusion on the diaphragm and an outer contour of a corresponding fold of the plurality of folds do not intersect, so as to prevent the protrusion from contacting and getting stuck with the side wall of the fold in the process of external vibration or excessive blowing, which may lead to adhesion between the diaphragm and the back plate and affection of the normal operation of the microphone chip.

IPC Classes  ?

  • H04R 7/14 - Non-planar diaphragms or cones corrugated, pleated, or ribbed
  • H04R 1/08 - Mouthpieces; Attachments therefor

13.

MICROPHONE CHIP

      
Application Number 18072661
Status Pending
Filing Date 2022-11-30
First Publication Date 2024-02-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Kaijie
  • Zhao, Zhuanzhuan

Abstract

A microphone chip is provided and includes a substrate and a capacitive system. The capacitive system includes a diaphragm and a back plate. The diaphragm includes an inner membrane portion, an outer membrane portion, and at least one supporting portion. The inner membrane portion and the outer membrane portion of the microphone chip are separated by a slit, and the at least one supporting portion is connected with the fixing portion to fix the diaphragm, so that the diaphragm is in a cantilever state. By arranging the sealing element between the back plate and the diaphragm, the inner membrane portion is attracted and adsorbed on the sealing element by electrostatic force, and the sealing element is configured to support the inner membrane portion to reach an operating state, thereby reducing the low attenuation of the microphone.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • H04R 1/04 - Structural association of microphone with electric circuitry therefor
  • H04R 1/06 - Arranging circuit leads; Relieving strain on circuit leads
  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery

14.

MICROPHONE CHIP AND MICROPHONE

      
Application Number 18072669
Status Pending
Filing Date 2022-11-30
First Publication Date 2024-02-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Kaijie
  • Zhao, Zhuanzhuan

Abstract

A microphone chip and a microphone are provided. The microphone chip includes a substrate and a capacitive system disposed on the substrate. The capacitive system includes a diaphragm and a back plate spaced from the diaphragm, and there is an air spacing defined between the diaphragm and the back plate. The diaphragm includes an inner membrane portion, at least one outer membrane portion, and at least one supporting portion. The microphone chip further includes a supporting member. In an operating state, the inner membrane portion is adsorbed on the supporting member, and the supporting member is configured to divide the inner membrane portion into at least two regions. The diaphragm in the operating state is divided by the supporting member into a plurality of floating regions separated from each other, such that the rigidity of the diaphragm can be effectively adjusted and enhanced according to requirements.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • H04R 1/08 - Mouthpieces; Attachments therefor
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

15.

Vibration Transducer

      
Application Number 18073452
Status Pending
Filing Date 2022-12-01
First Publication Date 2024-02-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Meng, Zhenkui

Abstract

The present disclosure discloses a vibration transducer including a circuit board enclosing a receiving cavity, a MEMS chip, a first vibration unit having a first vibration cavity and a second vibration unit having a second vibration cavity. A first through hole provided on the circuit board is configured to connect the receiving cavity with the first vibration cavity; a second through hole provided on the circuit board is configured to connect the receiving cavity with the second vibration cavity. The first vibration unit vibrates to cause pressure change in the first vibration cavity which is transmitted to the MEMS chip through the first through hole; the second vibration unit vibrates to cause pressure change in the second vibration cavity which is transmitted to the MEMS chip through the second through hole. The vibration transducer in the present disclosure has higher sensitivity and SNR.

IPC Classes  ?

16.

MEMS optical microphone

      
Application Number 17952358
Grant Number 11917366
Status In Force
Filing Date 2022-09-26
First Publication Date 2024-02-27
Grant Date 2024-02-27
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ali, Taimoor

Abstract

An MEMS optical microphone, including: a shell including an inner cavity and a sound inlet that communicates the inner cavity with outside; an MEMS module including a diaphragm suspended in the inner cavity, when an acoustic pressure is applied, an aperture is formed in the diaphragm, and the size of the aperture increases or decreases with the magnitude of the acoustic pressure applied to the diaphragm; an optoelectronic module including an electromagnetic radiation source and a sensor, the electromagnetic radiation source and the sensor are arranged on opposite sides of the diaphragm, and a light beam emitted by the electromagnetic radiation source passes through the aperture and reaches the sensor; and an integrated circuit module electrically connected with the MEMS module and the optoelectronic module. Advantages of high sensitivity and flat frequency response can be achieved, which provides the potential to further improve the performance of the device.

IPC Classes  ?

  • H04R 23/00 - Transducers other than those covered by groups
  • H04R 1/08 - Mouthpieces; Attachments therefor
  • G01B 11/06 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness for measuring thickness
  • A61B 5/107 - Measuring physical dimensions, e.g. size of the entire body or parts thereof
  • G01B 11/02 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness

17.

METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE

      
Application Number 18073472
Status Pending
Filing Date 2022-12-01
First Publication Date 2024-02-15
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Chang, Ping-He
  • Lai, Kahkeen

Abstract

A method for manufacturing a MEMS device and the MEMS device are provided. The method includes: depositing a film on at least a part of a surface of a sacrificial layer, defining at least one through hole in the thin film by machining, removing at least a part of a material covered by the thin film in the sacrificial layer, discharging the part of the material removed from the sacrificial layer from the at least one through hole to define a cavity in the sacrificial layer, and depositing a sealing layer on a surface of the thin film facing away from the sacrificial layer to seal the at least one through hole. Compared with the manufacturing method in the related art, the manufacturing method of the disclosure only requires to deposit one layer of thin film, shorten the production period, and has reliable on-site sealing capability.

IPC Classes  ?

  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate

18.

Vibration transducer

      
Application Number 18079004
Status Pending
Filing Date 2022-12-12
First Publication Date 2024-02-15
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

The present disclosure discloses a vibration transducer including a circuit board, a vibration detection assembly and a signal detection assembly arranged on two opposite sides of the circuit board; the vibration detection assembly includes a first vibration detection unit, a second vibration detection unit, and a third vibration detection unit; the signal detection assembly includes a first MEMS microphone, a second MEMS microphone, and a third MEMS microphone. A first membrane of the first vibration detection unit, a second membrane of the second vibration detection unit, and the third membrane of the third vibration detection unit vibrate along three orthogonal directions. The vibration transducer has higher sensitivity and bigger bandwidth.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 19/04 - Microphones

19.

CANTILEVER MICROPHONE

      
Application Number 17883645
Status Pending
Filing Date 2022-08-09
First Publication Date 2024-02-15
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Kervran, Yannick Pierre
  • Cargill, Scott Lyall

Abstract

A cantilever microphone includes: a substrate; a cantilever including a rotor frame and a plate covering the rotor frame, where the cantilever includes a first edge fixed to the substrate and a second end opposite to the first edge, a plurality of rotor comb fingers is attached to the plate at an edge of the plate adjacent to the second edge; and a stator fixed to the substrate or attached to a sub structure to allow some displacement from the substrate, where the stator includes a plurality of stator comb fingers, and the stator comb fingers are interdigitated with the rotor comb fingers. For the cantilever microphone, high mechanical sensitivity of the cantilever and high electrostatic sensitivity of the comb structure can be implemented, so as to increase the performance or signal-to-noise ratio of the cantilever microphone.

IPC Classes  ?

20.

ELECTROSTATIC CLUTCH

      
Application Number 17852255
Status Pending
Filing Date 2022-06-28
First Publication Date 2023-12-28
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Patel, Anup
  • Boyd, Euan James
  • Kervran, Yannick Pierre

Abstract

Provided is an electrostatic clutch. The electrostatic clutch includes: multiple arrays of HIN electrodes, a respective pass-through channel being formed between any two arrays of the multiple arrays of HIN electrodes; and multiple arrays of biased electrodes, each array of the multiple arrays of biased electrodes moving back and forth in the respective pass-through channel such that electrostatic force is generated between the multiple arrays of biased electrodes and the multiple arrays of HIN electrodes. Such configuration allows microphone performance over a wide range of atmospheric pressures which is likely expected by applications. This is achieved electrostatically in a purely passive way having advantages over other designs which require complex electronics and active control. Physically decoupling the membrane and sense structure simplifies design of the sense structure as only small AC perturbations of the rotor is considered with no DC changes in rotor position.

IPC Classes  ?

21.

MEMs condenser microphone

      
Application Number 17852279
Grant Number 11950054
Status In Force
Filing Date 2022-06-28
First Publication Date 2023-12-28
Grant Date 2024-04-02
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Patel, Anup
  • Boyd, Euan James
  • Kervran, Yannick Pierre

Abstract

Provided is a MEMS condenser microphone, including a base plate, a spacer and a membrane. The membrane is supported above the base plate by the spacer. The base plate, the spacer, and the membrane enclose a vacuum cavity. An end of the membrane close to the vacuum cavity is connected, by means of a connecting rod, to an electrostatic clutch. The electrostatic clutch is connected to a capacitive sensing structure. The microphone has the advantage of allowing microphone performance over a wide range of atmospheric pressures which is likely expected by customers. This is achieved electrostatically in a purely passive way which has an advantage over other designs which require complex electronics and active control. Physically decoupling the membrane and sense structure simplifies the design of the sense structure as only small AC perturbations of the rotor need to be considered with no DC changes in rotor position.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • H02N 13/00 - Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

22.

MEMS Speaker

      
Application Number 17969668
Status Pending
Filing Date 2022-10-19
First Publication Date 2023-12-21
Owner
  • AAC Kaitai Technologies (Wuhan) CO., LTD (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Dan, Qiang
  • Shen, Yu
  • Zhou, Yiwei
  • Li, Yang

Abstract

The invention provides a MEMS speaker including a substrate enclosing a cavity, a cantilever beam at least partially suspended above the cavity, a piezoelectric actuator away from the cavity, a polymer layer away from the cavity and attached to the cantilever beam and the piezoelectric actuator for completely covering the cantilever beam, the piezoelectric actuator and the cavity, and a piezoelectric composite vibration structure formed by the polymer layer. The cantilever beam includes a first section fixed to the substrate, a second section extending from the first section to the cavity and suspended above the cavity, and a third section extending from the second section away from the first section, an end of the third section away from the second section being suspended; and the piezoelectric actuator is only fixed with the third section.

IPC Classes  ?

  • H04R 17/00 - Piezoelectric transducers; Electrostrictive transducers

23.

MEMS device

      
Application Number 17826184
Grant Number 11889282
Status In Force
Filing Date 2022-05-27
First Publication Date 2023-11-30
Grant Date 2024-01-30
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Boyd, Euan James
  • Cargill, Scott Lyall
  • Kervran, Yannick Pierre

Abstract

Provided is a MEMS device. The MEMS device includes: substrate having back cavity passing therethrough; diaphragm connected to the substrate and covers the back cavity, the diaphragm comprises first and second membranes, and accommodating space is formed between the first and second membranes; supports arranged in the accommodating space, and opposite ends of the support are connected to the first and second membranes; counter electrode arranged in the accommodating space, the first and second membranes each include conductive and second regions, the second region is formed by semiconductor material without doping conductive ions. Through design of the first and second membranes as the first region and the second region, respectively, the second region is formed by semiconductor material without doping conductive ions, and the first region is formed by doping conductive ions in the semiconductor material, so that the compliance performance is improved and not at risk of delamination.

IPC Classes  ?

  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 19/04 - Microphones

24.

MEMS device

      
Application Number 17826185
Grant Number 11974109
Status In Force
Filing Date 2022-05-27
First Publication Date 2023-11-30
Grant Date 2024-04-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Boyd, Euan James
  • Cargill, Scott Lyall

Abstract

Provided is an MEMS device, including: a base, a rear cavity; a vibrating diaphragm, the vibrating diaphragm including an upper diaphragm and a lower diaphragm, and an accommodation space being formed between the upper and lower diaphragms; a counter electrode arranged in the accommodation space; and supporting members concentrically arranged and spaced apart. The supporting members are arranged between the upper and lower diaphragms and are spaced apart from the counter electrode, two opposite ends of each supporting member are connected to the upper and lower diaphragms, and at least one of the supporting members is provided with first cavities. An upper ventilation hole and a lower ventilation hole are respectively formed at a position of the upper diaphragm and a position of the lower diaphragm corresponding to one of the first cavities; and the upper ventilation hole, the first cavity and the lower ventilation hole communicate with each other.

IPC Classes  ?

  • H04R 7/12 - Non-planar diaphragms or cones
  • H04R 1/08 - Mouthpieces; Attachments therefor
  • H04R 7/16 - Mounting or tensioning of diaphragms or cones

25.

MEMS DEVICE

      
Application Number 17826182
Status Pending
Filing Date 2022-05-27
First Publication Date 2023-11-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Boyd, Euan James
  • Cargill, Scott Lyall
  • Kervran, Yannick Pierre

Abstract

Provided is a MEMS device. The MEMS device includes: substrate having back cavity passing through; diaphragm connected to the substrate and covers the back cavity, the diaphragm comprises first and second membranes, and accommodating space is formed between the first and second membranes; supports arranged in the accommodating space, and opposite ends of the support are connected to the first and second membranes; counter electrode arranged in the accommodating space, the first and second membranes each include conductive and second regions, ventilation slots are annularly spaced on the diaphragm along circumferential direction and penetrate through the first and second membranes, the electrode region extends from center of the first and second membranes toward but does not reach the ventilation slots. Through design of the first and second membranes and the electrode region, sensitivity of the microphone is increased.

IPC Classes  ?

  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • H04R 19/04 - Microphones
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

26.

Diaphragm and MEMS Sensor Using Same

      
Application Number 17970585
Status Pending
Filing Date 2022-10-21
First Publication Date 2023-11-02
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Linlin
  • Zhao, Zhuanzhuan
  • Wang, Kaijie
  • Shi, Zhengyu
  • Nguyen, Minh Ngoc
  • Zhang, Rui

Abstract

The present invention provides a diaphragm and a MEMS sensor using the diaphragm. The diaphragm is a rectangular diaphragm, and the diaphragm includes a main body of the diaphragm and fixed parts arranged outside the main body of the diaphragm and located at the four corners of the diaphragm. The four corners of the rectangular diaphragm are depressed parts formed by concave in the direction of the diaphragm main body. The fixed part includes at least two fixed anchor points arranged along the edge of the diaphragm forming the depressed part. The present invention improves the effective sensing area of the diaphragm and the acoustic performance of the MEMS sensor.

IPC Classes  ?

  • H04R 19/00 - Electrostatic transducers
  • H04R 19/04 - Microphones
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

27.

Gas Sensor

      
Application Number 18095003
Status Pending
Filing Date 2023-01-10
First Publication Date 2023-11-02
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

The present disclosure provides a gas sensor, including a substrate, a first housing fixed on the substrate and enclosed with the substrate to form a first chamber, and a first infrared transmitter and a first acoustic sensor connected to the substrate. The first acoustic sensor and the first infrared transmitter are housed in the first chamber, and the first housing is provided with a first venthole. The gas sensor also includes an environmental detection assembly connected to the substrate and located outside the first housing, and a differential processor connected to the substrate. The differential processor of the present disclosure can eliminate the ambient sound signal and the vibration signal in the first detection signal according to the second detection signal. Eliminate the strong interference of noise and vibration in the external environment, and improve the accuracy of the gas concentration detection of the gas sensor.

IPC Classes  ?

  • G01N 29/02 - Analysing fluids
  • G01N 21/17 - Systems in which incident light is modified in accordance with the properties of the material investigated
  • G01N 21/01 - Arrangements or apparatus for facilitating the optical investigation
  • G01N 29/24 - Probes

28.

Method for audio peak reduction using all-pass filter

      
Application Number 17732417
Grant Number 11881829
Status In Force
Filing Date 2022-04-28
First Publication Date 2023-11-02
Grant Date 2024-01-23
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Schlecht, Sebastian
  • Fierro, Leonardo
  • Valimaki, Vesa
  • Backman, Juha

Abstract

Provided is a method for audio peak reduction using an all-pass filter, including: determining a delay parameter m and a gain parameter g based on a formula (1): absolute peak map s is calculated based on formula (3): This method is widely used in the reproduction, storage and broadcasting of sound, and the computational complexity is small, which is a supplement to the traditional nonlinear compression algorithm.

IPC Classes  ?

  • H03G 7/00 - Volume compression or expansion in amplifiers

29.

MEMS Microphone

      
Application Number 17994026
Status Pending
Filing Date 2022-11-25
First Publication Date 2023-10-26
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Tan, Siewseong
  • Chang, Yangmeng
  • Chua, Tiongkee
  • Pu, Jingxin
  • Zhang, Rui

Abstract

The present invention provides a MEMS microphone, including a housing body with a containment space, a sound hole penetrating the housing body, a MEMS microphone chip, an ASIC chip and a subtractor accommodated in the containment space. The MEMS microphone chip includes at least a first MEMS microphone chip and a second MEMS microphone chip. the first MEMS microphone chip is different from the frequency response droop characteristic of the second MEMS microphone chip. the first MEMS microphone chip and the output signal of the second MEMS microphone chip are output to the subtractor, and are output to the ASIC chip after the subtractor performs subtraction processing. Compared with the related art, the MEMS microphone of the present invention has good anti-interference performance and good sensitivity.

IPC Classes  ?

  • H04R 1/04 - Structural association of microphone with electric circuitry therefor
  • H04R 19/04 - Microphones

30.

Microphone

      
Application Number 17994024
Status Pending
Filing Date 2022-11-25
First Publication Date 2023-10-26
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Tan, Siewseong
  • Chang, Yangmeng
  • Chua, Tiongkee
  • Pu, Jingxin
  • Zhang, Rui

Abstract

The present invention provides a microphone, including a protection structure with a containment space, and an ASIC chip and a MEMS microphone chip accommodated in the containment space. The microphone also includes a low pass filter circuit. The low pass filter circuit is connected between the ASIC chip and the MEMS microphone chip, or the low pass filter circuit is integrated in the ASIC chip. The high frequency cutoff frequency of the low pass filter circuit is greater than 20 khz, so that by setting the low pass filter circuit, the interference of the ultrasonic frequency band can be filtered, the noise can be reduced, and the audio quality can be improved.

IPC Classes  ?

  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

31.

MEMS DEVICE AND ELECTRO-ACOUSTIC TRANSDUCER

      
Application Number 17723458
Status Pending
Filing Date 2022-04-18
First Publication Date 2023-10-19
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Kervran, Yannick Pierre
  • Boyd, Euan James
  • Jenkins, Colin Robert
  • Chung, Colin Wei Hong
  • Cargill, Scott Lyall

Abstract

Provided is a MEMS device and an electro-acoustic transducer. The MEMS device includes: a substrate having a cavity passing through the substrate; a diaphragm connected to the substrate and covers the cavity. The diaphragm includes oppositely arranged first and second membranes. The first membrane is on one side of the second membrane facing away from the cavity and includes a first protrusion extending away from the second membrane, the first protrusion has a first groove opening towards the second membrane. The second membrane includes a second protrusion extending away from the first membrane and opposite to the first protrusion, the second protrusion has a second groove opening towards the first membrane. By providing first and second protrusions on first and second diaphragms to form a corrugated diaphragm, the internal stress and stiffness of the diaphragm decreases, which effectively increases the mechanical sensitivity of the MEMS device.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

32.

Speaker Box

      
Application Number 17965838
Status Pending
Filing Date 2022-10-14
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Haijuan
  • Wu, Lifeng

Abstract

The present invention provides a speaker box. The speaker box includes a housing, a speaker unit, and an air-permeable spacer assembly accommodated in the housing. The air-permeable spacer assembly includes a bracket and an air-permeable spacer fixed to the bracket. The housing includes a bottom wall and a side wall. The bracket includes an annular main body and a leg. The air-permeable spacer is attached to the annual main body. The annular main body is fixed to the side wall. The leg is fixed to the bottom wall. At the same time, the bracket can be easily and conveniently adapted to various complex shapes of the housing through the annular main body and the leg. In addition, the filling amount of the sound absorbing powder can be increased.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 1/02 - Casings; Cabinets; Mountings therein

33.

Sounding Unit

      
Application Number 17974508
Status Pending
Filing Date 2022-10-26
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

The sounding unit provided by the present invention includes a frame, a vibration system and a magnetic circuit system. The vibration system includes a diaphragm, a voice coil and an FPC. The diaphragm consists of a dome with a protruded platform and a suspension. The FPC includes an internal fixed part, an external fixed part, and an elastic part. The internal fixed part includes a first fixed part, a second fixed part, and a third fixed part. The voice coil includes an upper end surface and a lower end surface. The upper end surface is fixed to the protruded platform. The lower end surface is fixed to the third fixed part. The bonding strength between the FPC and the voice coil in the sounding unit is improved, and the vibration stability of the sounding unit is enhanced.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 7/12 - Non-planar diaphragms or cones
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details

34.

MULTIFUNCTIONAL SOUNDING DEVICE AND ELECTRIONIC DEVICE

      
Application Number 17975582
Status Pending
Filing Date 2022-10-27
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Xiao, Bo
  • Kong, Chenliang
  • Zhang, Tong
  • Linghu, Ronglin

Abstract

Provided is a multifunctional sounding device and an electronic device. The multifunctional sounding device includes a casing, a sounding body accommodated in the casing, a vibrator assembly and an elastic supporting member for suspending the vibrator assembly in the accommodating space and providing elastic restoring force. The sounding body includes a vibration system and a magnetic circuit system for driving the vibration system to sound. The elastic supporting member includes a first supporting arm fixed to the vibrator assembly, bent portions bent and extended from both ends of the first supporting arm, and second supporting arms extended away from the first supporting arm and both fixed to the casing. A thickening member is arranged on each bent portion, and a sum of a thicknesses of each bent portion and the thickening member is greater than a thicknesses of the first supporting arm and the second supporting arm.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 1/02 - Casings; Cabinets; Mountings therein

35.

Speaker Module

      
Application Number 18094993
Status Pending
Filing Date 2023-01-10
First Publication Date 2023-10-12
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC Microtech (Changzhou) Co., Ltd. (China)
Inventor
  • Yang, Haijuan
  • Wang, Lei
  • Wu, Shuwen

Abstract

The present disclosure provides a speaker module. The speaker module includes a housing body, a vibration system, and a magnetic circuit system. The housing body includes a support frame having a through cavity, a front cover mounted on the through cavity opening side of the support frame, and a back cover mounted on the side of the support frame away from the front cover. The vibration system, the support frame and the back cover are enclosed to form a back cavity. The support frame includes an integrally injection-molded conductive element. This configuration of the present disclosure can simplify the manufacturing process of the speaker module, and reduce the application cost.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 7/20 - Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands

36.

Sounding Device

      
Application Number 18095001
Status Pending
Filing Date 2023-01-10
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

The present disclosure provides a sounding device. The sounding device includes a vibration system, a magnetic circuit system, a conductive element and a fixed element. The vibration system includes a diaphragm and a voice coil fixed to the diaphragm. The sounding device further includes a reinforcement element having a first reinforcement part fixed to the upper surface of the connection part or the lower surface of the connection part, a second reinforcement part fixed to the outer side surface of the voice coil, and a third reinforcement part fixed with the upper surface of the voice coil. Compared with the related art, the sounding device provided by the present disclosure has a simple structure and good reliability.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 1/06 - Arranging circuit leads; Relieving strain on circuit leads
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 7/04 - Plane diaphragms
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 3/00 - Circuits for transducers

37.

Sounding Device

      
Application Number 18095535
Status Pending
Filing Date 2023-01-11
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

The present disclosure provides a sounding device. The sounding device includes a vibration system, a magnetic circuit system, a conductive element and a fixed element. The vibration system includes a diaphragm and a voice coil fixed to the diaphragm. The diaphragm consists of a dome part and a suspension around the dome part. The dome part includes a dome body and a protruded platform of the dome extending from the dome body to the voice coil and fixed to the voice coil. The dome part also includes dome reinforcement elements. Compared with the related art, the sounding device provided by the present disclosure has a simple structure and good reliability.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 7/12 - Non-planar diaphragms or cones

38.

Sounding Device

      
Application Number 18095537
Status Pending
Filing Date 2023-01-11
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

The present disclosure provides a sounding device. The sounding device includes a vibration system, a magnetic circuit system, a conductive element and a fixed element. The vibration system includes a diaphragm and a voice coil fixed to the diaphragm. The sounding device also includes a reinforcement element for fixing the voice coil and the connection part. The reinforcement element includes a first reinforcement part fixed to the upper surface of the connection part or the lower surface of the connection part, and a second reinforcement part fixed to the outer side surface of the voice coil. Compared with the related art, the sounding device provided by the present disclosure has a simple structure and good reliability

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 7/12 - Non-planar diaphragms or cones

39.

Multifunctional Acoustic Device

      
Application Number 17949233
Status Pending
Filing Date 2022-09-21
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Jin, Xin
  • Zhang, Fan
  • Linghu, Ronglin
  • Xiao, Bo
  • Song, Wei

Abstract

The present invention provides a multifunctional acoustic device includes a cover enclosing an accommodating cavity and an acoustic member. The cover has a sound hole. The acoustic member includes a housing, a vibration system having a diaphragm, and a magnetic circuit system driving the diaphragm. The diaphragm divides a space of the housing into a front acoustic cavity and a rear acoustic cavity. The multifunctional acoustic device includes a sound channel communicating the sound hole with the front acoustic cavity and a sealing element located between the sound hole and the sound channel. The sealing element is arranged on a peripheral side of the sound channel so that the acoustic member communicates with an outside only through the sound channel.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 1/02 - Casings; Cabinets; Mountings therein

40.

Multifunctional Acoustic Device

      
Application Number 17949234
Status Pending
Filing Date 2022-09-21
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Jin, Xin
  • Zhang, Fan
  • Linghu, Ronglin
  • Xiao, Bo
  • Song, Wei

Abstract

The present invention provides a multifunctional acoustic device includes a cover enclosing an accommodating cavity and an acoustic member. The cover has a sound hole. The acoustic member includes a housing, a vibration system having a diaphragm, and a magnetic circuit system driving the diaphragm. The diaphragm divides a space of the housing into a front acoustic cavity and a rear acoustic cavity. The multifunctional acoustic device includes a sound channel communicating the front acoustic cavity to an outside of the sound hole and a sealing element located on an outer side of the cover. The sealing element is arranged covering a peripheral side of the sound hole and the sound channel so that the acoustic member communicates with the outside only through the sound channel.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 1/02 - Casings; Cabinets; Mountings therein

41.

Multifunctional Sounding Device

      
Application Number 17949236
Status Pending
Filing Date 2022-09-21
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Jin, Xin
  • Xiao, Bo
  • Linghu, Ronglin
  • Zhang, Fan
  • Song, Wei

Abstract

Disclosed is a multifunctional sounding device which combines functions of emitting sounds and providing vibrations and includes a speaker unit including a vibration assembly including a first ring and a diaphragm vibrating along a first direction and a magnetic assembly including a main magnet and an auxiliary magnet; an elastic member suspending the speaker unit; a second ring surrounding the first ring; a flexible sealing membrane connected between the two rings; and a driving coil driving the speaker unit for vibrating in a second direction. The two directions are perpendicular. The driving coil includes two sides respectively facing the main magnet and the auxiliary magnet in the first direction. The diaphragm, the first ring, the flexible sealing membrane and the second ring are integrally formed, thereby ensuring concentricity of them four and avoiding glue width requirements so as to release spaces.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 1/02 - Casings; Cabinets; Mountings therein

42.

Multifunctional Sounding Device

      
Application Number 17949237
Status Pending
Filing Date 2022-09-21
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Jin, Xin
  • Zhang, Fan
  • Xiao, Bo
  • Linghu, Ronglin
  • Song, Wei

Abstract

Disclosed is a multifunctional sounding device which combines functions of emitting sounds and providing vibrations and includes a housing; a speaker unit including a vibration assembly vibrating along a first direction and a magnetic assembly including a main magnet and an auxiliary magnet; an elastic member suspending the speaker unit in the housing; a flexible sealing membrane assembly connected between the housing and the speaker unit including an outer ring, an inner ring, and a flexible sealing membrane connected between the two rings; and a driving coil driving the speaker unit for vibrating in a second direction including two sides respectively facing the main magnet and the auxiliary magnet in the first direction. The two directions are perpendicular. The outer ring, the flexible sealing membrane and the inner ring are integrally formed, thereby achieving a high structural consistency and avoiding glue width requirements so as to release spaces.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 1/02 - Casings; Cabinets; Mountings therein
  • H04R 9/06 - Loudspeakers
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 7/04 - Plane diaphragms

43.

SPEAKER

      
Application Number 17981494
Status Pending
Filing Date 2022-11-07
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

A speaker includes: a frame, a vibration system, including a diaphragm, a voice coil, and a flexible circuit board, and a magnetic circuit system, wherein the voice coil includes a first lead wire and a second lead wire, the flexible circuit board includes a first surface facing the diaphragm and a second surface opposite to the first surface, the first lead wire and the first surface are located at one side of the flexible circuit board, the second lead wire and the second surface are located at another side of the flexible circuit board, the flexible circuit board includes a first pad on the first surface and a second pad on the second surface, the first lead wire is connected to the first pad, the second lead wire is connected to the second pad. Compared with the related art, the speaker disclosed by the present disclosure has better acoustic performance.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 1/06 - Arranging circuit leads; Relieving strain on circuit leads
  • H04R 3/00 - Circuits for transducers
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 7/12 - Non-planar diaphragms or cones

44.

SPEAKER

      
Application Number 17981495
Status Pending
Filing Date 2022-11-07
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

A speaker includes a diaphragm, a voice coil with a lead wire, and a flexible circuit board assembly. The flexible circuit board assembly includes at least two flexible circuit boards and a soldering sheet. Each flexible circuit board includes an inner fixing portion including an upper surface close to the diaphragm, the upper surface of a first flexible circuit board is provided with a first pad, the upper surface of a second flexible circuit board is provided with a second pad. The lead wire is arranged on a side of the first flexible circuit board close to the diaphragm and is electrically connected to the first pad. The soldering sheet includes a first fixing portion electrically connected to the second pad, a second fixing portion and a third fixing portion electrically connected to a bottom surface of the voice coil. The speaker has a better acoustic performance.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 1/06 - Arranging circuit leads; Relieving strain on circuit leads
  • H04R 3/00 - Circuits for transducers
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 9/04 - Construction, mounting, or centering of coil
  • H04R 7/12 - Non-planar diaphragms or cones

45.

SPEAKER

      
Application Number 17981496
Status Pending
Filing Date 2022-11-07
First Publication Date 2023-10-12
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Huhu
  • Wei, Wei
  • Yin, Zhaoyu
  • Chen, Zhizhu

Abstract

A speaker includes: a frame, a vibration system including a diaphragm, a voice coil, and a flexible circuit board, and a magnetic circuit system, wherein the flexible circuit board includes an outer fixing portion, an inner fixing portion, and an elastic connecting arm, the inner fixing portion includes a first fixing portion electrically connected with the elastic connecting arm, a second fixing portion bent and extended from the first fixing portion in a direction away from the diaphragm, and a third fixing portion bent and extended from an end of the second fixing portion away from the first fixing portion in a direction of the voice coil, the third fixing portion is provided with a pad which is electrically connected with a bottom surface of the voice coil. Compared with the related art, the speaker disclosed by the present disclosure has better acoustic performance.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details

46.

Vibration Motor

      
Application Number 17946069
Status Pending
Filing Date 2022-09-16
First Publication Date 2023-10-05
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Ma, Jie
  • Cui, Zhiyong
  • Wang, Yao

Abstract

The present disclosure discloses a linear motor having a housing with an receiving space, a vibration unit and a stator unit received in the receiving space. The vibrator unit includes a weight and an elastic member fixed to the weight. The elastic member includes a first fixation portion fixed to the weight and a second fixation portion fixed to the housing. At least one soldering plate fixed to at least one of the first fixation portion and the second fixation portion. The soldering plate includes a rectangle portion and the extending portion having a smaller width than the rectangle portion. The vibration motor has higher fatigue life and high reliability.

IPC Classes  ?

  • H02K 33/16 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with polarised armatures moving in alternate directions by reversal or energisation of a single coil system

47.

Vibration Motor

      
Application Number 17947194
Status Pending
Filing Date 2022-09-19
First Publication Date 2023-10-05
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ma, Jie

Abstract

The present disclosure discloses a linear motor having a housing with an receiving space, a vibration unit and a stator unit received in the receiving space. The vibrator unit includes a weight and an elastic member fixed to the weight. The elastic member includes a first fixation portion fixed to the housing and a second fixation portion fixed to the weight and an elastic portion. An elastic member having a groove penetrating thereon is sandwiched between the elastic portion and the weight. The elastic member includes a first damping portion and a second damping portion arranged on two opposite side f the groove along a vibration direction. The groove can effectively avoid the detachment of the elastic member from the elastic member and the weight, thus improving the vibration stability of the vibration motor.

IPC Classes  ?

  • G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
  • H02K 7/06 - Means for converting reciprocating motion into rotary motion or vice versa

48.

MEMS device and electro-acoustic transducer

      
Application Number 17826179
Grant Number 11765509
Status In Force
Filing Date 2022-05-27
First Publication Date 2023-09-19
Grant Date 2023-09-19
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor Boyd, Euan James

Abstract

Provided is an MEMS device, including: a substrate having back cavity passing thererthrough; a diaphragm connected to the substrate and covers the back cavity, the diaphragm includes first and second membranes, and accommodating space formed therebetween; a counter electrode; and support loop members arranged concentrically. Opposite ends of the support loop member are connected to the first and second membranes. The support loop members are arranged at intervals. Each support loop member has first sections concentrically arranged as a loop member at intervals. A first notch is formed between two adjacent first sections. In at least one support loop member, the first section has second sections concentrically arranged as a loop member at intervals. A second notch is formed between two adjacent second sections. By a larger first section, distance between adjacent first sections is larger, the technical problem that large number of slots required for counter electrode is solved.

IPC Classes  ?

  • H04R 1/08 - Mouthpieces; Attachments therefor
  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • H04R 7/16 - Mounting or tensioning of diaphragms or cones

49.

MEMS Microphone

      
Application Number 17827817
Status Pending
Filing Date 2022-05-30
First Publication Date 2023-07-27
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Shi, Zhengyu
  • Wang, Linlin
  • Zhang, Rui

Abstract

The present invention provides a MEMS microphone including a substrate with a back cavity and a capacitive system disposed on the substrate. The capacitive system includes a back plate and a vibration diaphragm arranged opposite to the back plate. The back plate includes a middle part and a fixed part surrounding the middle part and fixed to the substrate. The fixed part is arranged with a thickness greater than that of the middle part, and the fixed part includes a first surface away from the substrate and a second surface opposite to the first surface. The first surface includes a first arc connected to the middle part, and the first arc protrudes away from the substrate. Compared with related technologies, the MEMS microphone provided by the present invention can improve the reliability of the back plate.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

50.

MEMS Microphone

      
Application Number 17879788
Status Pending
Filing Date 2022-08-03
First Publication Date 2023-07-06
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Zhang, Rui

Abstract

The present invention discloses a MEMS microphone, which includes a substrate with a back cavity, a connection part, and a capacitive system arranged in the connection part. The capacitive system includes a first electrode connected to the inner wall of connection part, and a second electrode disposed on the substrate near the first electrode and spaced from the first electrode. The second electrode has two shape separation gaps. The shape separation gap includes a splitting gap in the second electrode, and two end gaps. The second electrode is divided into an effective vibration area and an auxiliary area by adopting a cracking gap structure. While improving the sensitivity of the first electrode, the stress concentration point of the second electrode is directed to the edge of the second electrode, so as to disperse the stress under the action of loud pressure.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

51.

Microphone and method for manufacturing the same

      
Application Number 17743482
Grant Number 11832043
Status In Force
Filing Date 2022-05-13
First Publication Date 2023-07-06
Grant Date 2023-11-28
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Tu, Lanlan
  • Goh, Wooicheang
  • Lai, Kahkeen

Abstract

Provided is a microphone, including a base having a back cavity, a diaphragm, a backplate electrode, and a backplate spaced from the diaphragm and defining an inner cavity jointly with the diaphragm. The diaphragm includes a vibration portion, a fixing portion, and a leak hole. The back cavity is communicated with the inner cavity through the leak hole. The backplate is provided with a first through hole. The inner cavity is communicated with outside through the first through hole. The backplate includes a backplate body and a backplate extension portion. The inner cavity includes a first inner cavity and a second inner cavity. The backplate extension portion is provided with a second through hole, and the second inner cavity is communicated with outside through the second through hole. A method for manufacturing the microphone is further provided. The technical solution has better drop performance.

IPC Classes  ?

  • H04R 1/08 - Mouthpieces; Attachments therefor
  • H04R 1/32 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only

52.

MICRO-ELECTRO-MECHANICAL SYSTEM AND ELECTRO-ACOUSTIC CONVERSION DEVICE HAVING THE MICRO-ELECTRO-MECHANICAL SYSTEM

      
Application Number 17561736
Status Pending
Filing Date 2021-12-24
First Publication Date 2023-06-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Patel, Anup Hasmukh
  • Boyd, Euan James
  • Cargill, Scott Lyall

Abstract

Provided is a micro-electro-mechanical system and an electro-acoustic conversion device having the micro-electro-mechanical system. The micro-electro-mechanical system includes: first and second membranes arranged opposite to each other; support members arranged between the first and second membranes; and an opening provided on the first and/or second membranes. Each support member includes support walls, and opposite ends of each of the support walls are connected to the first and second membranes. The first and second membranes, and two adjacent support walls in one support member are enclosed to form a first chamber. The opening is configured to link the first chamber with the outside. By arranging a supporting member composed of support walls and providing an opening on the first and/or second membranes, the compliance of the first or second membrane is increased, and the inter-plate capacitance therebetween is reduced.

IPC Classes  ?

  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

53.

Bone conduction microphone

      
Application Number 17827815
Grant Number 11895452
Status In Force
Filing Date 2022-05-30
First Publication Date 2023-06-29
Grant Date 2024-02-06
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Meng, Zhenkui
  • Hong, Tingting
  • Wang, Kai

Abstract

The present invention provides a bone conduction microphone including a housing and a circuit board connected with the housing. The circuit board has an acoustic channel. The microphone further includes a vibration assembly forming a first conduction cavity and a second conduction cavity. The vibration assembly includes a vibration member and a frame. The frame, the vibration member and the circuit board form a first conduction cavity. The frame, the vibration member and the circuit board form a second conduction cavity. The vibration of the vibration member is conducted to one side of the vibration diaphragm, and is also conducted to the other side of the vibration diaphragm. Compared with the related art, the bone conduction microphone of the present invention can effectively improve the sensitivity and the signal to noise ratio.

IPC Classes  ?

  • H04R 1/08 - Mouthpieces; Attachments therefor
  • H04R 1/02 - Casings; Cabinets; Mountings therein
  • H04R 1/04 - Structural association of microphone with electric circuitry therefor

54.

Differential condenser microphone

      
Application Number 17553814
Grant Number 11765520
Status In Force
Filing Date 2021-12-17
First Publication Date 2023-06-22
Grant Date 2023-09-19
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor Kervran, Yannick Pierre

Abstract

A differential condenser microphone is provided, including: a base having a cavity passing through the base; a diaphragm connected to the base and covering the cavity; a mounting portion connected to the diaphragm through a connector, movable electrodes protruding from an outer edge of the mounting portion; first fixed electrodes connected to the base, the first fixed electrodes and the movable electrodes are spatially separated from and cross each other; second fixed electrodes connected to the base, the second fixed electrodes and the movable electrodes are separated from and cross each other, and the first fixed and second fixed electrodes are arranged opposite to and spaced from each other along vibration direction of the diaphragm. Compared to the related art, the microphone can achieve higher sensitivity, higher signal-to-noise ratio, better capacity in suppressing linear distortion, and improve anti-interference capacity, thereby achieving longer signal transmission distance and better audio performance.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 1/04 - Structural association of microphone with electric circuitry therefor

55.

MEMS chip

      
Application Number 17739202
Grant Number 11950053
Status In Force
Filing Date 2022-05-09
First Publication Date 2023-06-22
Grant Date 2024-04-02
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Shi, Zhengyu
  • Wang, Linlin
  • Zhang, Rui

Abstract

The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate; the protruding portion comprises an annular first protruding portion and an annular second protruding portion surrounding the first protruding portion. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 7/04 - Plane diaphragms
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery

56.

MEMS chip

      
Application Number 17739203
Grant Number 11968497
Status In Force
Filing Date 2022-05-09
First Publication Date 2023-06-22
Grant Date 2024-04-23
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Shi, Zhengyu
  • Wang, Linlin
  • Zhang, Rui

Abstract

The present invention discloses a Micro-Electro-Mechanical System MEMS) chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a reinforce portion fixed to the membrane, having an area smaller than that of the membrane; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 7/04 - Plane diaphragms
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery

57.

SEALED CAVITY STRUCTURE AND METHOD FOR MANUFACTURING SEALED CAVITY STRUCTURE

      
Application Number 17742425
Status Pending
Filing Date 2022-05-12
First Publication Date 2023-06-08
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Goh, Wooicheang
  • Lai, Kahkeen

Abstract

Provided is a sealed cavity structure, including a base; an upper cover fixed to the base in a covering manner and defining a cavity jointly with the base; a leak hole that passes through the upper cover and communicates the cavity with outside; a sealing cover plate attached and fixed to an outer surface of the upper cover and completely covering the leak hole to seal the leak hole; and a sealing cap including a cap wall pressed on a side of the sealing cover plate away from the leak hole and a cap sidewall extending from the cap wall toward a direction close to the upper cover and fixed, in an abutting manner, to the upper cover. A method for manufacturing a sealed cavity structure is further provided. In this technical solution, better sealing reliability can be achieved.

IPC Classes  ?

  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • B81B 7/00 - Microstructural systems

58.

PIEZOELECTRIC FILM ACOUSTIC RESONATOR

      
Application Number 17566711
Status Pending
Filing Date 2021-12-31
First Publication Date 2023-06-01
Owner
  • AAC Technologies (Nanjing) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Shuai
  • Zhang, Lirong
  • Wu, Ke
  • Zhuang, Zhiqiang
  • Wang, Chao

Abstract

The present invention provides a piezoelectric film acoustic resonator, which comprises a substrate, a first electrode disposed over the substrate, a piezoelectric film disposed over the substrate and covering at least a portion of the first electrode and a second electrode disposed on a surface of the piezoelectric film away from the first electrode, one end of the first electrode extends in the direction away from the piezoelectric film to form a first extended pad, one end of the second electrode extends in the direction away from the first extended pad to form a second extended pad, the first extended pad comprises a first protruding reflection grating on the surface away from the substrate, the second extended pad comprises a second protruding reflection grating on the surface away from the substrate. The configuration can reduce the impact on acoustic performance while improving the quality factor.

IPC Classes  ?

  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator

59.

MEMS microphone

      
Application Number 17566700
Grant Number 11838725
Status In Force
Filing Date 2021-12-31
First Publication Date 2023-06-01
Grant Date 2023-12-05
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Shi, Zhengyu
  • Zhao, Zhuanzhuan
  • Zhang, Rui

Abstract

The present disclosure discloses a MEMS microphone including a substrate with a back cavity, and an electric capacitance system arranged on the substrate. The electric capacitance system includes a back plate and a diaphragm opposite to the back plate. The back plate includes a body part, a fixing portion connected to the substrate, and a connecting portion connecting the body part and the fixing portion. The diaphragm is fixed to the substrate and located at a side of the back plate close to the substrate. The fixing portion includes a first surface away from the substrate, the first surface includes a first arc surface connected with the body part, the first arc surface protrudes toward a direction away from the substrate. Compared with the related art, MEMS microphone disclosed by the present disclosure has a better reliability.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • H04R 7/04 - Plane diaphragms
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

60.

Electronic Cigarette

      
Application Number 17562007
Status Pending
Filing Date 2021-12-27
First Publication Date 2023-05-25
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Jinyang
  • Zhang, Rui

Abstract

The present disclosure provides an electronic cigarette includes a housing, an atomizer spaced apart from the smoking port, an e-liquid chamber located between the atomizer and the smoking port, and a MEMS sensor located in the housing. The housing includes a smoking port passing through an upper end thereof, a through hole passing through a lower end thereof, and an air passage communicating with the smoking port. The MEMS sensor includes a cover having a first opening, a printed circuit board, and a MEMS chip received in the accommodating room formed by the cover and the printed circuit board. The printed circuit board includes a second opening communicating to an outside by the through hole.

IPC Classes  ?

61.

MEMS chip

      
Application Number 17562017
Grant Number 11805373
Status In Force
Filing Date 2021-12-27
First Publication Date 2023-05-25
Grant Date 2023-10-31
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Wang, Linlin
  • Zhang, Rui

Abstract

The present disclosure discloses a MEMS chip which includes a substrate, a back plate fixed on the substrate, and a membrane fixed on the substrate and located above the back plate. A sealed space is formed between the membrane and the back plate. A support pillar is received in the sealed space. Two ends of the support pillar along a vibration direction of the membrane are separately fixed on the membrane and the back plate. As a result, when decreasing the volume of the back cavity, the resonance frequency of the MEMS chip has been effectively improved and the SNR is simultaneously high. Furthermore, the support pillar can effectively improve the reliability and crack resistance of the membrane.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 7/04 - Plane diaphragms
  • H04R 7/08 - Plane diaphragms comprising a plurality of sections or layers comprising superposed layers separated by air or other fluid
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery

62.

MEMS chip

      
Application Number 17562011
Grant Number 11805372
Status In Force
Filing Date 2021-12-27
First Publication Date 2023-05-25
Grant Date 2023-10-31
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Wang, Linlin
  • Zhang, Rui

Abstract

The present disclosure discloses a MEMS chip including a capacitance system and a substrate with a back cavity. The capacitance system includes a back plate and a membrane; the substrate is located on one side of the membrane away from the back plate, including a first surface opposite to the membrane, a second surface opposite to the first surface, and an inner wall connecting the first surface and the second surface and enclosing the back cavity; the inner wall includes a first opening close to the membrane, having a first width along a first direction perpendicular with a vibration direction of the membrane, and a second opening away from the membrane, having a second width smaller than the first width along the first direction. The resonance frequency of the MEMS chip has been effectively improved and the SNR is simultaneously high.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 7/04 - Plane diaphragms
  • H04R 7/08 - Plane diaphragms comprising a plurality of sections or layers comprising superposed layers separated by air or other fluid
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery

63.

Thermally Conductive Composite and Method of Making the Same

      
Application Number 17565329
Status Pending
Filing Date 2021-12-29
First Publication Date 2023-05-18
Owner
  • AAC Technologies (Nanjing) Co., Ltd. (China)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Xia, Keqiang
  • Zhang, Bo

Abstract

The present disclosure discloses a thermally conductive composite including a thermally conductive film, having a thickness in a range from 10 um to 50 um, and a thermal phase-change layer disposed on the thermally conductive film, being composed of 6-13 wt% binder, 6-13 wt% thermal phase-change material, and 74-88 wt% coated microcapsule. The thermally conductive composite has dual functions of heat storage and thermal conduction.

IPC Classes  ?

  • C09K 5/06 - Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice-versa
  • C09J 7/29 - Laminated material

64.

Sounding device

      
Application Number 17562035
Grant Number 11665471
Status In Force
Filing Date 2021-12-27
First Publication Date 2023-05-11
Grant Date 2023-05-30
Owner
  • AAC Microtech (Changzhou) Co., Ltd. (China)
  • AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Ren, Zhang
  • Zhong, Zhiwei

Abstract

The present disclosure discloses a sounding device including a frame, a vibration system, a magnetic circuit system, and an air-permeable mesh in a ring shape. The vibration system includes a diaphragm and a voice coil. The magnetic circuit system includes a yoke, a first magnet, and a second magnet in a ring shape around and spaced apart from the first magnet for forming a magnetic gap. One end of the air-permeable mesh is fixed to the second magnet, and another end of the air-permeable mesh is fixed to the frame. A rear cavity is formed jointly by the frame, the yoke, the second magnet and the air-permeable mesh. Compared with the related art, the sounding device disclosed by the present disclosure has a better low-frequency acoustic performance.

IPC Classes  ?

  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details

65.

MEMS gyroscope and electronic device using same

      
Application Number 17566733
Grant Number 11674804
Status In Force
Filing Date 2021-12-31
First Publication Date 2023-04-27
Grant Date 2023-06-13
Owner
  • AAC KAITAI TECHNOLOGIES (WUHAN) CO., LTD (China)
  • AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Yang, Shan
  • Zhan, Zhan
  • Peng, Hongtao
  • Ma, Zhao
  • Kan, Xiao
  • Li, Yang
  • Lai, Kahkeen
  • Hong, Yan
  • Tan, Veronica

Abstract

The present invention provides a MEMS gyroscope having internal coupling beam, an external coupling beam, a drive structure and a detection structure. The drive structure includes multiple driving weights, and the detection structure includes multiple testing weights. The drive structure further includes a first decoupling structure and a first transducer. The first decoupling structure is arranged on the side of the driving weight far away from the internal coupling beam, and the first transducer excites the driving weight to vibrate. The MEMS gyroscope of the present invention can fully increase the layout area of the first transducer, thereby realizing a larger vibration amplitude under a small driving voltage, thereby increasing the sensitivity.

IPC Classes  ?

  • G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure

66.

Micromachined gyroscope

      
Application Number 17566677
Grant Number 11662206
Status In Force
Filing Date 2021-12-30
First Publication Date 2023-04-13
Grant Date 2023-05-30
Owner
  • AAC KAITAI TECHNOLOGIES (WUHAN) CO., LTD (China)
  • AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Kan, Xiao
  • Ma, Zhao
  • Yang, Shan
  • Zhan, Zhan
  • Peng, Hongtao
  • Li, Yang
  • Tan, Veronica
  • Hong, Yan
  • Lai, Kahkeen

Abstract

The present invention provides a micromachined gyroscope, including: a base; an anchor point fixed to the base; a number of vibration structures; and a drive structure used for driving the vibration structure to vibrate in a x-y plane along a ring direction. The drive structure includes at least four groups arranged at intervals along the ring direction and symmetrical about an x axis and a y axis. The micromachined gyroscope works in two vibration modes interchanging with each other, including a driving mode status working in a first mode status and a testing mode status working in a second mode status. By virtue of the configuration described in the invention, the micromachined gyroscope can realize three-axis detection at the same time, and greatly improves the quality utilization rate of the vibration structure.

IPC Classes  ?

  • G01C 19/5762 - Structural details or topology the devices having a single sensing mass the sensing mass being connected to a driving mass, e.g. driving frames

67.

MICROPHONE BACK PANEL AND MICROPHONE

      
Application Number 17407194
Status Pending
Filing Date 2021-08-20
First Publication Date 2023-02-23
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Cargill, Scott Lyall
  • Boyd, Euan James

Abstract

A microphone back panel and a microphone are provided. The microphone back panel is used for a microphone, the microphone includes a diaphragm, and the microphone back panel includes a main body. A side of the main body is provided with a thinned area not in contact with the diaphragm, and a hole is formed in the main body. The main body is provided with a thinned area, thereby increasing flexibility of the microphone back panel. When the microphone back panel is bent, the increased flexibility can reduce the stress load on the microphone back panel, thereby reducing possibility of damage to the microphone back panel. In addition, the main body is provided with a hole, thereby further increasing flexibility of the microphone back panel, and reducing stress load on the microphone back panel and reducing possibility of damage to the microphone back panel.

IPC Classes  ?

  • H04R 1/08 - Mouthpieces; Attachments therefor
  • H04R 1/02 - Casings; Cabinets; Mountings therein

68.

Comb drive for microelectromechanical system

      
Application Number 17401350
Grant Number 11677337
Status In Force
Filing Date 2021-08-13
First Publication Date 2023-02-16
Grant Date 2023-06-13
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Patel, Anup
  • Kervran, Yannick Pierre
  • Boyd, Euan James

Abstract

A comb drive for MEMS device includes a stator and a rotor displaceable relative to the stator in a first direction. The stator includes stator comb fingers and the rotor includes rotor comb fingers. The stator comb fingers are coupled to two high impedance nodes to form high impedance node domains arranged in the first direction. The rotor comb fingers are coupled to two oppositely biased electrodes to form oppositely biased domains. Pairs of capacitors with opposite acoustic polarity are respectively formed between the high impedance node domains and the oppositely biased domains. The comb drive of the present invention has increased electrostatic sensitivity for a given unit cell cross-sectional area whilst maintaining an acceptable capacitance and linearity of voltage signal vs displacement. Extra force shim unit cells may be used, which allows for the stiffness between the rotor and stator to be controlled and reduced to zero for a particular displacement range, without impacting sensitivity.

IPC Classes  ?

  • H02N 1/00 - Electrostatic generators or motors using a solid moving electrostatic charge carrier
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

69.

MEMS microphone

      
Application Number 17566637
Grant Number 11838724
Status In Force
Filing Date 2021-12-30
First Publication Date 2023-01-12
Grant Date 2023-12-05
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Li, Jinyang
  • Wang, Kai
  • Chen, Zhiyuan
  • Zhang, Rui

Abstract

The present disclosure discloses a MEMS microphone including a printed circuit board, a shell assembled with the printed circuit board for forming a receiving space and provided with a sound hole communicating with the receiving space, a MEMS Die with a cavity accommodated in the receiving space and mounted on the shell for covering the sound hole, and an ASIC chip accommodated in the receiving space and mounted on the shell through a substrate. The cavity of the MEMS Die communicates with the sound hole. The MEMS Die electrically connects with the ASIC chip. The ASIC chip electrically connects with the substrate. The substrate electrically connects with the printed circuit board.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 1/04 - Structural association of microphone with electric circuitry therefor

70.

MEMS Acoustic Sensor

      
Application Number 17717166
Status Pending
Filing Date 2022-04-11
First Publication Date 2023-01-05
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Cargill, Scott Lyall
  • Zhang, Rui
  • Meng, Zhenkui

Abstract

The invention provides a MEMS acoustic sensor, including: a base with a back cavity; a capacitance system fixed to the base, including a diaphragm that reciprocates in a vibration direction, a back plate spaced from the diaphragm; a first capacitor and a second capacitor formed cooperatively by the diaphragm and the back plate; and a number of through holes in the back plate facing the back cavity. The diaphragm includes a main body part opposite to the back plate for forming the first capacitor, and a plurality of combining parts recessed from the main body part. A projection of the combining part along the vibration direction completely falls into the through hole. The combining part is spaced from an inner wall of the through hole for forming the second capacitor. Due to the configuration of the invention, the acoustic sensor has improved capacitor value.

IPC Classes  ?

  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)

71.

Bone-conduction sensor assembly

      
Application Number 17541290
Grant Number 11697587
Status In Force
Filing Date 2021-12-03
First Publication Date 2022-12-22
Grant Date 2023-07-11
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Hong, Tingting
  • Meng, Zhenkui
  • Wang, Kai

Abstract

The present disclosure provides a bone-conduction sensor assembly. The bone-conduction sensor assembly includes a housing, a printed circuit board assembly forming a first receiving cavity together with the housing, a diaphragm accommodated in the first receiving cavity, a MEMS die and an ASIC chip mounted on the printed circuit board assembly. The MEMS die electrically connects to the ASIC chip through a bonding wire. A first weight is located on a surface of the diaphragm facing to the printed circuit board assembly. A position of the first weight has an avoiding portion corresponding to the bonding wire.

IPC Classes  ?

  • H04R 25/00 - Deaf-aid sets
  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

72.

Optical microphone with a dual light source

      
Application Number 17407197
Grant Number 11533569
Status In Force
Filing Date 2021-08-20
First Publication Date 2022-12-20
Grant Date 2022-12-20
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor Kervran, Yannick Pierre

Abstract

An optical microphone with a dual light source is provided. The optical microphone includes: a housing including an inner cavity and a sound inlet communicating the inner cavity with the outside; a MEMS module disposed in the inner cavity and including a flexible membrane and two gratings; two photoelectric modules, one being disposed in a front cavity and the other in a rear cavity, and each of the photoelectric modules including a light source and a light detector; and an ASIC module disposed in the rear cavity and electrically connected to the photoelectric modules. The optical microphone provides differential measurement, such that the output signal change on one of the two sides of the flexible membrane is positive and the output signal change on another side of the flexible membrane is negative. Therefore, a differential measurement structure is formed to improve the performance of the microphone.

IPC Classes  ?

  • H04R 23/00 - Transducers other than those covered by groups

73.

Microphone with additional piezoelectric component for energy harvesting

      
Application Number 17337434
Grant Number 11540058
Status In Force
Filing Date 2021-06-03
First Publication Date 2022-12-08
Grant Date 2022-12-27
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor Kervran, Yannick Pierre

Abstract

A microphone with an additional piezoelectric component for energy harvesting is provided, and includes a substrate penetrated through by a cavity, a diaphragm, and a piezoelectric conversion. The diaphragm includes a vibration portion and at least one connecting arm, and two ends of each of the at least one connecting arm are connected to the vibration portion and the substrate, respectively. The piezoelectric conversion component is disposed on one of the at least one connecting arm and configured to convert mechanical energy collected from a displacement of the diaphragm by sound to electrical energy. The piezoelectric conversion component is mounted on the diaphragm, so as to convert the mechanical energy collected from the diaphragm by the sound to the electrical energy, thereby effectively recycling the mechanical energy and avoiding a waste of energy.

IPC Classes  ?

  • H04R 17/02 - Microphones
  • H04R 7/02 - Diaphragms for electromechanical transducers; Cones characterised by the construction
  • H01L 41/113 - Piezo-electric or electrostrictive elements with mechanical input and electrical output

74.

Comb-like capacitive microphone

      
Application Number 17341412
Grant Number 11622202
Status In Force
Filing Date 2021-06-08
First Publication Date 2022-12-08
Grant Date 2023-04-04
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Kervran, Yannick Pierre
  • Zhang, Rui

Abstract

A comb-like capacitive microphone includes a substrate penetrated by a cavity having an upper part provided with a step, stationary electrodes equally spaced on the step, and a diaphragm received in the step and including a vibrating portion and a connecting portion connected to the vibrating portion. Movable electrodes protrude from a periphery of the vibrating portion, and an end of the connecting portion away from the vibrating portion is connected to the substrate. The stationary electrodes are arranged in a comb shape and directly etched on the substrate, and the movable electrodes are arranged in a comb shape. The stationary electrodes are spatially separated from the movable electrodes, each stationary electrode is corresponding to each movable electrode. Such structure of the comb-like capacitive microphone offers a relatively large displacement, to decrease the acoustic noise and to offer a high sensitivity, and eventually a sound transducer with high performances.

IPC Classes  ?

75.

Capacitive microphone

      
Application Number 17342510
Grant Number 11516569
Status In Force
Filing Date 2021-06-08
First Publication Date 2022-11-29
Grant Date 2022-11-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Kervran, Yannick Pierre

Abstract

A capacitive microphone includes a substrate, a plurality of stationary electrodes, a diaphragm, and a backplate. The substrate includes a cavity and a step disposed in the cavity, and the plurality of stationary electrodes is equally spaced on the step. A diaphragm is received in the step and includes a vibration portion and a connecting portion connected to the vibration portion. A plurality of movable electrodes protrudes from a periphery of the vibration portion, and one end of the connecting portion away from the vibration portion is connected to the substrate. The backplate is provided with a plurality of sound transmission holes, and a gap is formed between the backplate and the diaphragm to form electrode plates of a variable capacitor. The capacitive microphone can get a higher signal-to-noise ratio, improve the capability of suppressing linear distortion, and improve the anti-interference capability of the microphone.

IPC Classes  ?

  • H04R 1/08 - Mouthpieces; Attachments therefor
  • H04R 7/16 - Mounting or tensioning of diaphragms or cones

76.

Bone conduction microphone

      
Application Number 17542524
Grant Number 11665494
Status In Force
Filing Date 2021-12-06
First Publication Date 2022-11-24
Grant Date 2023-05-30
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Hong, Tingting
  • Yu, Xing
  • Chen, Xingfu

Abstract

One of the main objects of the present invention is to provide a bone conduction microphone with simplified structure and easier manufacturing process. To achieve the above-mentioned objects, the present invention provides a bone conduction microphone, including: a housing; a circuit board opposite to the housing; and a vibration assembly locating between the housing and the circuit board. The vibration assembly includes a vibration membrane made of high temperature resistant dustproof breathable material, a weight fixed to the vibration membrane, and a first cavity formed between the vibration membrane and the circuit board. The bone conduction microphone further includes a pressure assembly locating between the vibration assembly and the circuit board for detecting a pressure change generated in the first cavity and converting the pressure change into an electrical signal.

IPC Classes  ?

  • H04R 25/00 - Deaf-aid sets
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
  • H04R 1/46 - Special adaptations for use as contact microphones, e.g. on musical instrument, on stethoscope

77.

MEMS microphone

      
Application Number 17325242
Grant Number 11743634
Status In Force
Filing Date 2021-05-20
First Publication Date 2022-11-24
Grant Date 2023-08-29
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Boyd, Euan James
  • Patel, Anup
  • Chung, Colin Wei Hong

Abstract

An MEMS microphone includes a substrate including a back volume provided inside the substrate and an opening provided at an upper surface of the substrate to communicate the back volume; a sensing device provided at an inner side wall of the back volume; a first cantilever provided inside the back volume and including end portions coupling with the sensing device; a first membrane provided at the opening; a second membrane provided inside the back volume; and second cantilevers, each of which includes a first end mechanically supporting the first cantilever, and a second end connected to the second membrane. By suspending the first cantilever on the second cantilevers, the end portions of the first cantilever always couple with a preset position of the sensing device. Thus, the DC offset of the displacement of the membrane can be prevented.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 1/28 - Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means

78.

MICROELECTROMECHANICAL SYSTEM

      
Application Number 17320250
Status Pending
Filing Date 2021-05-14
First Publication Date 2022-11-17
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Cargill, Scott Lyall

Abstract

A microelectromechanical system includes a backplate and a diaphragm. The backplate includes spaced stator elements with voids formed therebetween. The stator element includes a first conductive element. The diaphragm includes a plurality of corrugations facing the voids respectively. Each corrugation includes a groove formed at a surface thereof away from the backplate. The corrugation includes a second conductive element. The diaphragm is moveable with respect to the backplate in response to a pressure exerted thereon to cause the corrugations to be moved into or out of the corresponding voids, thereby changing the capacitance formed between the first and second conductive elements. The corrugations are defined by grooves formed at surfaces away from the backplate, which facilitate to control the compliance of the diaphragm and reduce stiffness of the diaphragm. The corrugation can be formed with lower aspect ratios, which allows it to be formed using standard front side processes.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

79.

MICROELECTROMECHANICAL SYSTEM AND PROCESS OF MAKING IT

      
Application Number 17214954
Status Pending
Filing Date 2021-03-29
First Publication Date 2022-09-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Boyd, Euan James
  • Jenkins, Colin Robert

Abstract

A microelectromechanical system includes a lower membrane including a plurality of troughs and crests arranged alternately, an upper membrane including a plurality of troughs and crests arranged alternately, and a spacer layer disposed between the lower membrane and the upper membrane. The spacer layer includes counter electrode walls and support walls made of nitride, the counter electrode walls being provided with conductive elements. Chambers are formed between the troughs of the lower membrane and the crest of the upper membrane and the counter electrode walls are suspended in the chambers respectively. The support walls are sandwiched between the crests of the lower membrane and the troughs of the upper membrane with a space formed between adjacent support walls. The spaces between adjacent support walls may be empty or filled with oxide. Unwanted capacitance between the upper and lower membranes is reduced significantly.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • H04R 19/04 - Microphones
  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers

80.

COMB-DRIVE DEVICE USED IN MICRO ELECTRO MECHANICAL SYSTEM

      
Application Number 17202366
Status Pending
Filing Date 2021-03-16
First Publication Date 2022-09-22
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Cargill, Scott Lyall

Abstract

A comb-drive device used in Micro Electro Mechanical System is provided, and the comb-drive device includes: a rotor comprising a rotor body and a plurality of rotor combs provided on the rotor body; and a stator comprising one or more stator bodies and a plurality of stator combs provided on the one or more stator bodies. The rotor is spaced from the stator by a distance, the rotor and the stator are arranged along a direction in which the rotor is movable, and the plurality of rotor combs and the plurality of stator combs are alternately arranged in a direction particular to the direction in which the rotor is movable; and the rotor body is made of an insulating material, and each of the plurality of rotor combs is made of a conductive material or coated with a conductive material. The present invention can increase sensitivity and capacitance efficiency of the comb-drive device.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H02N 1/00 - Electrostatic generators or motors using a solid moving electrostatic charge carrier
  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)

81.

Microelectromechanical system

      
Application Number 17168192
Grant Number 11750973
Status In Force
Filing Date 2021-02-05
First Publication Date 2022-08-11
Grant Date 2023-09-05
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Patel, Anup
  • Boyd, Euan James
  • Cargill, Scott Lyall

Abstract

A microelectromechanical system includes an enclosure defining a cavity and an opening communicating with the cavity; a membrane mounted at the opening; a cantilever located within the cavity, the at least one cantilever comprising a first end, a second end and a fulcrum located between the first end and the second end; a plunger positioned between the membrane and the cantilever and configured to transfer displacement of the membrane to the first end of the cantilever; and a sensing member connected to the second end of the cantilever. The distance between the first end and the fulcrum is less than that between the second end and the fulcrum. The microelectromechanical system has the advantages of high SNR, small package size and high sensitivity. The membrane has a stiffness order of magnitude higher than a conventional membrane, which avoids mechanical collapse and large DC deformation under 1 atm.

IPC Classes  ?

  • H04R 25/00 - Deaf-aid sets
  • H04R 3/02 - Circuits for transducers for preventing acoustic reaction
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

82.

Microelectromechanical system

      
Application Number 17214953
Grant Number 11405731
Status In Force
Filing Date 2021-03-29
First Publication Date 2022-08-02
Grant Date 2022-08-02
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor Boyd, Euan James

Abstract

A microelectromechanical system includes a spacer layer, a first corrugated conductive diaphragm, and a second corrugated conductive diaphragm. The spacer layer includes counter electrode walls, slots and support walls extending along a first direction. The counter electrode walls, slots and support walls are arranged alternately in a second direction. The first corrugated conductive diaphragm includes first crests and first troughs arranged alternately in the second direction. The second corrugated conductive diaphragm includes second crests and second troughs arranged alternately in the second direction. The spacer layer is received in a cavity formed by the first and second corrugated conductive diaphragms. The support walls are respectively sandwiched between the aligned first troughs and second crests. The counter electrode walls are respectively suspended in the corresponding chambers formed between the aligned first crests and second troughs. The microelectromechanical system of the present disclosure has a high level of acoustic compliance and sensitivity.

IPC Classes  ?

  • H04R 19/00 - Electrostatic transducers
  • H04R 19/04 - Microphones
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

83.

Mobile device including improved electro-acoustic conversion chip

      
Application Number 17563015
Grant Number 11879758
Status In Force
Filing Date 2021-12-27
First Publication Date 2022-06-30
Grant Date 2024-01-23
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Bai, Yang
  • Chen, Yanxin
  • Zhang, Rui

Abstract

The present disclosure provides a linear motor including: a housing body with a containment space; a vibrator assembly suspended in the containment space by an elastic member for vibrating along a vibration direction; a stator assembly fixedly connected to the housing body and having a magnetic axis along the vibration direction; and two magnets located on both sides of the magnetic axis and spaced from the stator assembly, including a first magnet section and a second magnet section located on both sides of the first magnet section. A magnetic field strength of the first magnet section along the magnetic axis is greater than a magnetic field strength of the second magnet section along the magnetic axis. The configuration of the invention can effectively reduce the static attraction force of the magnetic circuit, and increase the overall rigidity of the linear motor.

IPC Classes  ?

  • G01F 1/05 - Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects
  • H02K 41/02 - Linear motors; Sectional motors

84.

Sound transducer and electronic device

      
Application Number 17137400
Grant Number 11368792
Status In Force
Filing Date 2020-12-30
First Publication Date 2022-06-21
Grant Date 2022-06-21
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor Kervran, Yannick

Abstract

A sound transducer, including: a substrate including a cavity and a first surface oriented to the cavity; a fixed part extending from the first surface into the cavity, and including a fixed end disposed on the first surface and a free end opposite to the fixed end; a moving part fixed on the substrate and disposed over the cavity, partially covering the cavity, and including a second surface oriented to the cavity; a first electrode, fixed on the free end; and a second electrode fixed on the second surface. The first electrode is laterally adjacent to the second electrode. The sound transducer has higher sensitivity and the first electrode has stronger stability, thereby improving the performance of the sound transducer.

IPC Classes  ?

  • H04R 19/00 - Electrostatic transducers
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type - Details
  • H04R 1/02 - Casings; Cabinets; Mountings therein

85.

Method for preparing silicon wafer with rough surface and silicon wafer

      
Application Number 17009765
Grant Number 11305988
Status In Force
Filing Date 2020-09-01
First Publication Date 2022-03-03
Grant Date 2022-04-19
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Goh, Wooicheang
  • Loo, Lieng
  • Lai, Kahkeen

Abstract

Provided are a method for preparing a silicon wafer with a rough surface and a silicon wafer, which solves the problem in the prior art that viscous force is likely to be generated. The method includes: depositing a first film layer having a large surface roughness on a surface of a silicon wafer that has been subjected to planar planarization, and then blanket etching the first film layer to remove the first film layer. Then, the surface of the first silicon layer facing away from the substrate is further etched to form grooves and protrusions, which provide roughness, thereby forming a silicon wafer with a rough surface. When the silicon wafer approaches to another film layer, the viscous force generated therebetween is reduced, and thus the sensitivity of the MEMS device is improved and the probability of out-of-work MEMS device is reduced.

IPC Classes  ?

  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

86.

MEMS CONDUCTIVE MEMBER AND PREPARATION METHOD OF CONDUCTIVE COATING LAYERS

      
Application Number 17138901
Status Pending
Filing Date 2020-12-31
First Publication Date 2022-01-06
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Tu, Lanlan
  • Goh, Wooicheang
  • Lai, Kahkeen
  • Tao, Ze

Abstract

The invention provides a method for preparing a MEMS conductive part and a conductive coating. A conductive unit includes a fixed member, a moving member which can reciprocate relative to the fixed member, and a plurality of groups of conductive electroplating layers which are electrically connected with the moving member and the fixed member, the moving member includes a first wall and a second wall connected with the first wall, and the fixed member includes a first wall connected with the first wall. The end components (fixed and moving components) displace relatively freely and transmit electric signals at the same time.

IPC Classes  ?

  • B81B 7/00 - Microstructural systems
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

87.

Sound transducer and electronic device

      
Application Number 17066450
Grant Number 11212601
Status In Force
Filing Date 2020-10-08
First Publication Date 2021-12-28
Grant Date 2021-12-28
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Kervran, Yannick

Abstract

A sound transducer includes a substrate including a first surface, a second surface, and a cavity, a support structure disposed on the first surface and including an inner peripheral edge and a third surface, a fixing structure disposed on the third surface, a moving structure including an exterior peripheral edge and a fourth surface, a first set of comb fingers fixed to the inner peripheral edge, extending toward the moving structure, and being electrically isolated from the fixing structure and the moving structure, a second set of comb fingers fixed to the exterior peripheral edge, extending toward the support structure, and interdigitated with the first set of comb fingers, and an elastic connecting structure including a first connecting part connected to the fourth surface, a second connecting part connected to the fixing structure, and an elastic body; the moving structure is disposed above the cavity.

IPC Classes  ?

88.

Piezoelectric MEMS microphone

      
Application Number 17137352
Grant Number 11337009
Status In Force
Filing Date 2020-12-30
First Publication Date 2021-12-16
Grant Date 2022-05-17
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Duan, Lian
  • Zhang, Rui

Abstract

A piezoelectric MEMS microphone is disclosed. The microphone includes a base having a cavity; a piezoelectric diaphragm; a fixation beam connecting with the piezoelectric diaphragm; and a support beam connecting with the base and the fixation beam. The piezoelectric diaphragm has a number of diaphragm sheets fixed by the fixation beam, each diaphragm sheet having a fixed end and a free end. The fixed end is connected with the fixation beam, and the free end extends from the fixed end to two sides and is suspended above the cavity. Compared with the related art, mechanical strength of the diaphragm sheet is improved, and the output intensity of the signal is improved.

IPC Classes  ?

  • H04R 17/02 - Microphones
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

89.

Method for preparing silicon wafer with rough surface and silicon wafer

      
Application Number 17009753
Grant Number 11192782
Status In Force
Filing Date 2020-09-01
First Publication Date 2021-12-07
Grant Date 2021-12-07
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Goh, Wooicheang
  • Loo, Lieng
  • Lai, Kahkeen

Abstract

2 gas passes through the porous oxide film layer to etch the first silicon planar layer in an irregular way. Therefore, the first silicon planar layer has a greater surface roughness. When the silicon wafer approaches to another film layer, the viscous force generated therebetween is reduced, improving the sensitivity of the MEMS device and reducing the probability of out-of-work MEMS devices.

IPC Classes  ?

  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

90.

Planarization method

      
Application Number 17136049
Grant Number 11569791
Status In Force
Filing Date 2020-12-29
First Publication Date 2021-10-28
Grant Date 2023-01-31
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Loo, Lieng
  • Lai, Kahkeen
  • Wu, Yilei

Abstract

The invention provides a planarization method, which can make the local flatness of the product to be processed more uniform. The product has a cavity filled with oxide and includes a first electrode layer, a piezoelectric layer and a second electrode layer superposed on the cavity. The first electrode layer covers the cavity and includes a first inclined face around the first electrode layer, and the piezoelectric layer covers the first electrode layer and is arranged on the first electrode layer. The planarization method includes: depositing a passivation layer on the second electrode layer and etching the passivation layer completely until the thickness of the passivation layer is reduced to the required thickness.

IPC Classes  ?

  • H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
  • H03H 9/56 - Monolithic crystal filters
  • H01L 41/22 - Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof

91.

Planarization method

      
Application Number 17136051
Grant Number 11482664
Status In Force
Filing Date 2020-12-29
First Publication Date 2021-10-28
Grant Date 2022-10-25
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Loo, Lieng
  • Lai, Kahkeen
  • Wu, Yilei

Abstract

The invention provides a planarization method, which can make the local flatness of the product to be processed more uniform. The product has a cavity filled with oxide and includes a first electrode layer, a piezoelectric layer and a second electrode layer superposed on the cavity. The first electrode layer covers the cavity and includes a first inclined face around the first electrode layer, and the piezoelectric layer covers the first electrode layer and is arranged on the first electrode layer. The planarization method includes: depositing a passivation layer on the second electrode layer and etching the passivation layer completely until the thickness of the passivation layer is reduced to the required thickness.

IPC Classes  ?

  • H01L 41/332 - Shaping or machining of piezo-electric or electrostrictive bodies by etching, e.g. lithography
  • H01L 41/297 - Individual layer electrodes of multilayered piezo-electric or electrostrictive parts
  • H01L 41/23 - Forming enclosures or casings
  • H01L 41/25 - Assembling devices that include piezo-electric or electrostrictive parts
  • H01L 41/47 - Processes or apparatus specially adapted for the assembly, manufacture or treatment of magnetostrictive devices or of parts thereof

92.

MEMS sound transducer

      
Application Number 16934015
Grant Number 11159893
Status In Force
Filing Date 2020-07-21
First Publication Date 2021-10-26
Grant Date 2021-10-26
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Kervran, Yannick

Abstract

The present invention discloses a MEMS sound transducer. The sound transducer includes: a substrate having a back cavity; a stator, the stator having a central portion suspending on the back cavity and at least two fixed arms extending from the center portion to the substrate and fixed on the substrate; a movable cantilever, mounted to the substrate, at least partially facing the back cavity and disposed between two adjacent fixed arms; wherein, the movable cantilever has a fixed end mounted to the substrate and a free edge facing the fixed arms with space; the free edge has a plurality of moving comb-fingers formed thereon; the stator has a plurality of fixed comb-fingers formed on the fixed arms; the moving comb-fingers and the fixed comb-fingers fit to each other to form a capacitor with an overlap area.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 19/04 - Microphones
  • H04R 19/00 - Electrostatic transducers
  • H02N 1/00 - Electrostatic generators or motors using a solid moving electrostatic charge carrier

93.

MEMS microphone

      
Application Number 16827673
Grant Number 11159894
Status In Force
Filing Date 2020-03-23
First Publication Date 2021-07-01
Grant Date 2021-10-26
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Wang, Linlin
  • Zhong, Xiaohui
  • Zhang, Rui
  • Meng, Zhenkui

Abstract

The present invention provides a MEMS microphone, having a base and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate. The MEMS microphone is further provided with a supporting frame located between the back plate and the diaphragm. One end of the supporting frame is connected with the back plate, and the other end is connected with the diaphragm. The supporting frame divides the cavity into a first cavity body and a second cavity body. The supporting frame is provided with a connection channel. During the production process of the MEMS microphone, the etchant enters the first cavity body, and then enters the second cavity body, which prevents oxides from remaining in the microphone product and affecting the use of MEMS microphone.

IPC Classes  ?

  • H04R 19/00 - Electrostatic transducers
  • H04R 19/04 - Microphones
  • H04R 1/04 - Structural association of microphone with electric circuitry therefor
  • H04R 7/04 - Plane diaphragms
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate

94.

Microphone

      
Application Number 16703910
Grant Number 11057693
Status In Force
Filing Date 2019-12-05
First Publication Date 2021-06-10
Grant Date 2021-07-06
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zeng, Peng
  • Wang, Tianjiao

Abstract

A microphone is provided. The microphone includes a shell with an accommodating cavity, as well as a micro-electro-mechanical system chip and a control circuit chip accommodated in the accommodating cavity, where the shell is provided with a sound hole penetrating through a thickness of the shell and communicated with the accommodating cavity; the microphone further includes an electric anti-dust device at least completely covering the sound hole, the electric anti-dust device is electrically connected with the control circuit chip, and can open the sound hole when receiving a power-on signal of the control circuit chip and close the sound hole when not receiving the power-on signal of the control circuit chip, thus effectively improving a pollution problem of the microphone during such process as transportation, assembly, SMT or unused state that dust is fed most easily without affecting an acoustic performance.

IPC Classes  ?

95.

Piezoelectric MEMS microphone

      
Application Number 16988733
Grant Number 11212617
Status In Force
Filing Date 2020-08-10
First Publication Date 2021-02-18
Grant Date 2021-12-28
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Duan, Lian
  • Zhang, Rui
  • Chen, Zhiyuan

Abstract

The present invention provides a piezoelectric MEMS microphone having a base with a cavity, a piezoelectric diaphragm, and a restraining element. The base has a ring base circumferentially forming a cavity, a support column. The piezoelectric diaphragm includes diaphragm sheets each having a fixing end connected to a support column and a free end suspended over the cavity. The restraining element has one end fixedly connected to the free end, the other end connected to the part on the base that is not connected to the fixing end. The piezoelectric MEMS microphone of the invention can constrain the deformation of the diaphragm sheet, thereby improving the resonant frequency of the piezoelectric diaphragm, reducing the noise of the whole piezoelectric MEMS microphone.

IPC Classes  ?

  • H04R 7/04 - Plane diaphragms
  • H04R 7/24 - Tensioning by means acting directly on free portion of diaphragm or cone
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 17/02 - Microphones

96.

Piezoelectric MEMS microphone

      
Application Number 16987421
Grant Number 11265657
Status In Force
Filing Date 2020-08-07
First Publication Date 2021-02-18
Grant Date 2022-03-01
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Duan, Lian
  • Zhang, Rui
  • Chen, Zhiyuan

Abstract

The invention provides a piezoelectric micro-electromechanical system (MEMS) microphone includes a base with a cavity and a piezoelectric diaphragm arranged on the base. The base has a ring base and a support column. The piezoelectric diaphragm includes a plurality of diaphragm sheets. Each diaphragm sheet has a fixing end connected with the support column and a free end suspended above the cavity. The widths of the diaphragm sheets are gradually increased from the fixing ends to the free ends. According to the piezoelectric MEMS microphone provided by the invention, under sound pressure, the free ends vibrate, wide free ends drive short fixing ends, and the diaphragm sheets close the fixing ends generate greater deformation to generate more charge. Therefore, the sensitivity can be further improved.

IPC Classes  ?

  • H04R 17/02 - Microphones
  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery

97.

Piezoelectric MEMS microphone

      
Application Number 16988738
Grant Number 11212623
Status In Force
Filing Date 2020-08-10
First Publication Date 2021-02-18
Grant Date 2021-12-28
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Duan, Lian
  • Zhang, Rui
  • Chen, Zhiyuan

Abstract

The invention provides a piezoelectric micro-electromechanical systems (MEMS) microphone having a base with a cavity, a piezoelectric diaphragm, and a limit element. The base has a ring base, and a support column. The piezoelectric diaphragm includes diaphragm sheets. Each diaphragm sheet have a fixing end connected with the support column and a free end suspended above the cavity. The limit element includes a limit part arranged apart from the piezoelectric diaphragm to limit the free ends in vibration directions of the diaphragm sheets, and an edge fixing plate connected with the outer edge of the limit part and arranged on the ring base. When the diaphragm sheets greatly deform upwards under impact force, deformation of the diaphragm sheets can be controlled, and the diaphragm sheets are protected to prevent the diaphragm sheets from breaking, thereby improving the stability of the piezoelectric MEMS microphone.

IPC Classes  ?

  • H04R 17/02 - Microphones
  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery

98.

Motion control structure and actuator

      
Application Number 16995791
Grant Number 11891297
Status In Force
Filing Date 2020-08-17
First Publication Date 2021-01-07
Grant Date 2024-02-06
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Tao, Ze
  • Goh, Wooicheang
  • Zhan, Zhan
  • Lai, Kahkeen
  • Li, Yang

Abstract

The present invention provides a motion control structure and a actuator. The motion control structure includes a motion platform, a first actuator having a first execution unit arranged on opposite sides of the motion platform along an X-axis direction and a second execution unit arranged on opposite sides of the motion platform along a Y-axis direction. The first execution unit includes a first actuating element displaced along the X-axis direction. The second execution unit includes a second actuating element displaced along the Y-axis direction. A second actuator surrounds an inner periphery of the motion platform and includes a third execution unit having an assembly portion displaced along the Z-axis direction. The motion control structure of the invention has the advantages that the motion platform can be driven to realize motion in six degrees of freedom.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

99.

Vibration Sensor, Audio Device, and Method For Assembling Vibration Sensor

      
Application Number 16986208
Status Pending
Filing Date 2020-08-05
First Publication Date 2020-12-31
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

The present disclosure provides a vibration sensor, an audio device, and a method for assembling the vibration sensor. The vibration sensor includes a housing having an inner wall and an inner chamber, a gasket, an elastic film, and a MEMS chip having a back cavity; the gasket, the elastic film, and the MEMS chip received in the chamber; the gasket attached onto the inner wall, the elastic film attached onto one side of the gasket opposite to the inner wall, and the MEMS chip attached onto one side of the elastic film opposite to the gasket; a concave hole being defined in one side of the gasket facing the elastic film, the elastic film covering the concave hole, a through hole being defined in the elastic film and passing through the elastic film, and the through hole communicating the concave hole with the back cavity.

IPC Classes  ?

  • G01H 11/06 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
  • H04R 19/04 - Microphones
  • B81B 7/00 - Microstructural systems
  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)

100.

Differential resonator and MEMS sensor

      
Application Number 16986306
Grant Number 11784624
Status In Force
Filing Date 2020-08-06
First Publication Date 2020-12-31
Grant Date 2023-10-10
Owner AAC Acoustic Technologies (Shenzhen) Co., Ltd. (China)
Inventor
  • Zhan, Zhan
  • Li, Yang
  • Liu, Yuwei
  • Tan, Qiuyu
  • Zhang, Rui

Abstract

The present disclosure provides a differential resonator and a MEMS sensor. The differential resonator includes a substrate, a first resonator, a second resonator and a coupling mechanism. The first resonator is connected with the second resonator, and the first resonator and the second resonator are movably connected with the substrate. The coupling mechanism includes a first guide beam, a second guide beam, a first coupling beam, a second coupling beam, a first connecting piece and a second connecting piece. The first guide beam and the second guide beam are arranged on two opposite sides of a direction perpendicular to a vibration direction of the first resonator or the second resonator. The first coupling beam is connected with the first guide beam, the second guide beam and the first resonator. The second coupling beam is connected with the first guide beam, the second guide beam and the second resonator.

IPC Classes  ?

  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators - Details
  • H03H 9/09 - Elastic or damping supports
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