JSR Corporation

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[Owner] JSR Corporation 2,478
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IPC Class
G03F 7/004 - Photosensitive materials 496
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists 458
G03F 7/20 - Exposure; Apparatus therefor 341
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or 304
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers 231
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01 - Chemical and biological materials for industrial, scientific and agricultural use 99
17 - Rubber and plastic; packing and insulating materials 32
05 - Pharmaceutical, veterinary and sanitary products 14
09 - Scientific and electric apparatus and instruments 13
42 - Scientific, technological and industrial services, research and design 12
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1.

POLYETHYLENE-BASED RESIN MULTILAYER FOAM SHEET, INTERLEAF SHEET FOR GLASS PLATES, AND METHOD FOR MANUFACTURING POLYETHYLENE-BASED RESIN MULTILAYER FOAM SHEET

      
Application Number 17927935
Status Pending
Filing Date 2021-05-28
First Publication Date 2024-07-18
Owner JSP CORPORATION (Japan)
Inventor
  • Takeuchi, Ryohei
  • Nishimoto, Takashi

Abstract

The multilayer foam sheet has a surface resistivity of 1×1013Ω or less and has a foam layer and resin layers that are laminated on both surfaces of the foam layer. The resin layers each have a multilayer structure formed from a surface layer and an intermediate layer that is positioned between the surface layer and the foam layer. The foam layer includes a polyethylene-based resin PE2. The intermediate layers are configured from an antistatic mixture containing a polyethylene-based resin PE3 and a polymeric antistatic agent. The surface layers are configured from a mixed resin containing a polyethylene-based resin PE4 and a polystyrene-based resin, and substantially do not contain the polymeric antistatic agent. The polystyrene-based resin content of the mixed resin is 3-35 wt %.

IPC Classes  ?

  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B29C 48/00 - Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
  • B29C 48/21 - Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces
  • B29K 23/00 - Use of polyalkenes as moulding material
  • B29K 25/00 - Use of polymers of vinyl-aromatic compounds as moulding material
  • B29K 105/00 - Condition, form or state of moulded material
  • B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
  • B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • B32B 37/14 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
  • B32B 37/15 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
  • B32B 38/00 - Ancillary operations in connection with laminating processes

2.

RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND COMPOUND

      
Application Number JP2023042975
Publication Number 2024/150553
Status In Force
Filing Date 2023-11-30
Publication Date 2024-07-18
Owner JSR CORPORATION (Japan)
Inventor
  • Nishikori Katsuaki
  • Ohtagaki Yasuhiro

Abstract

Provided is a radiation-sensitive composition having excellent sensitivity, CDU and preservation stability. The radiation-sensitive composition comprises: a polymer, the solubility of which in a developing solution changes due to the action of an acid; an anion represented by formula (1); and a radiation-sensitive onium cation which includes an aromatic ring that has at least one hydrogen atom substituted with a fluorine atom or a fluorine atom-containing group.

IPC Classes  ?

3.

ELPAC HC-G

      
Application Number 1798945
Status Registered
Filing Date 2024-05-02
Registration Date 2024-05-02
Owner JSR CORPORATION (Japan)
NICE Classes  ?
  • 01 - Chemical and biological materials for industrial, scientific and agricultural use
  • 17 - Rubber and plastic; packing and insulating materials

Goods & Services

Unprocessed artificial resins as raw materials in the form of powders, liquids or pastes; unprocessed synthetic resins; thermally curable unprocessed synthetic resins; thermoplastic resins, unprocessed; unprocessed artificial resins for use in manufacture; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in industry; synthetic resin adhesives for industrial purposes; contact adhesives for use with laminates; adhesives for industrial purposes. Semi-processed synthetic resins; semi-processed thermoplastic polymer resins for use in manufacture; semi-processed plastic substances made of thermally curable resins; semi-processed plastics.

4.

METHOD FOR FORMING RESIST UNDERLAYER FILM, METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE, COMPOSITION, AND RESIST UNDERLAYER FILM

      
Application Number 18440124
Status Pending
Filing Date 2024-02-13
First Publication Date 2024-07-11
Owner JSR CORPORATION (Japan)
Inventor
  • Tatsubo, Daiki
  • Kawazu, Tomoharu
  • Miyauchi, Hiroyuki
  • Hayashi, Yuya
  • Katagiri, Takashi
  • Tanaka, Ryotaro

Abstract

A method for forming a resist underlayer film includes applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a coating film. The coating film is heated at a heating temperature of higher than 450° C. and 600° C. or lower in an atmosphere having an oxygen concentration of less than 0.01% by volume. The composition for forming a resist underlayer film includes: a compound including an aromatic ring; a polymer which thermally decomposes at the heating temperature in heating the coating film, and which is other than the compound; and a solvent. The compound has a molecular weight of 400 or more. A content of the polymer is less than a content of the compound in the composition for forming a resist underlayer film.

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C09D 161/06 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
  • C09D 161/12 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
  • H01L 21/308 - Chemical or electrical treatment, e.g. electrolytic etching using masks
  • H01L 21/311 - Etching the insulating layers

5.

PHOTOSENSITIVE COMPOSITION

      
Application Number 18554029
Status Pending
Filing Date 2022-04-06
First Publication Date 2024-07-04
Owner JSR CORPORATION (Japan)
Inventor
  • Matsumoto, Tomoyuki
  • Matsumoto, Ryuu
  • Ito, Atsushi

Abstract

An object of the present invention is to provide a photosensitive composition capable of producing a pattern having a precise shape without causing curing defects of a coating film even when the time is required from exposure of the coating film to the next step. A photosensitive composition of the present invention contains a polymer (A), a polymerizable compound (B), a photoacid generator (C), and a solvent (D), in which the polymerizable compound (B) includes an epoxy compound (B-1) containing two or more groups represented by the following Formula (1) and a specific epoxy compound (B-2) other than the epoxy compound (B-1), and an epoxy compound containing an epoxy group fused to an alicyclic group is contained in an amount of 50 mass % or more with respect to a total of 100 mass % of the polymerizable compound (B). An object of the present invention is to provide a photosensitive composition capable of producing a pattern having a precise shape without causing curing defects of a coating film even when the time is required from exposure of the coating film to the next step. A photosensitive composition of the present invention contains a polymer (A), a polymerizable compound (B), a photoacid generator (C), and a solvent (D), in which the polymerizable compound (B) includes an epoxy compound (B-1) containing two or more groups represented by the following Formula (1) and a specific epoxy compound (B-2) other than the epoxy compound (B-1), and an epoxy compound containing an epoxy group fused to an alicyclic group is contained in an amount of 50 mass % or more with respect to a total of 100 mass % of the polymerizable compound (B). - L - Ep ( 1 )

IPC Classes  ?

  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

6.

RADIATION-SENSITIVE COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Application Number JP2023041890
Publication Number 2024/142681
Status In Force
Filing Date 2023-11-21
Publication Date 2024-07-04
Owner JSR CORPORATION (Japan)
Inventor
  • Nishikori Katsuaki
  • Omiya Takuya
  • Shiratani Motohiro
  • Hachiya Asuka

Abstract

This radiation-sensitive composition contains: a polymer which has a first structural unit containing a partial structure in which a hydrogen atom of a carboxy group or a phenolic hydroxyl group is substituted with an acid dissociation group represented by formula (1); and a compound which has an anion section including one anion group and an aromatic ring in which one or more hydrogen atoms are substituted with an iodine atom, and also has a radiation-sensitive onium cation section.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor

7.

SEMICONDUCTOR SUBSTRATE PRODUCTION METHOD, COMPOSITION, AND POLYMER

      
Application Number JP2023044550
Publication Number 2024/142925
Status In Force
Filing Date 2023-12-13
Publication Date 2024-07-04
Owner JSR CORPORATION (Japan)
Inventor
  • Yamada,shuhei
  • Tsuji,takashi
  • Nakatsu,hiroki
  • Katagiri,takashi
  • Abe,shinya

Abstract

Provided are: a semiconductor substrate production method using a composition which is capable of forming a film that has excellent heat resistance and bending resistance; the composition; and a polymer. This semiconductor substrate production method comprises: a step for applying a resist underlayer film-forming composition directly or indirectly to a substrate; a step for forming a resist pattern directly or indirectly on a resist underlayer film formed in the application step; and a step for performing etching using the resist pattern as a mask, the resist underlayer film-forming composition containing a solvent and a polymer having a repeating unit represented by formula (1). [Formula 1] (In formula (1), Ar1is a divalent group having a 5- to 40-membered aromatic ring structure. Z is a divalent group having an alicyclic structure with 3 to 20 carbons. Either Ar1and/or Z includes at least one group having at least one group selected from the group consisting of a group represented by formula (2-1) and a group represented by formula (2-2).) [Formula 2] (In formulae (2-1) and (2-2), R7 is, independently, a single bond or a divalent organic group with 1 to 20 carbons, and * is a bond with another structure in the polymer.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

8.

POLYPROPYLENE-BASED RESIN FOAM PARTICLE, AND POLYPROPYLENE-BASED RESIN FOAM PARTICLE MOLDED ARTICLE

      
Application Number JP2023046466
Publication Number 2024/143286
Status In Force
Filing Date 2023-12-25
Publication Date 2024-07-04
Owner JSP CORPORATION (Japan)
Inventor Masumoto Hisashi

Abstract

Provided are: a polypropylene-based resin foam particle which contains a biomass-derived polypropylene-based resin and can provide a superior polypropylene-based resin foam particle molded article; and a polypropylene-based resin foam particle molded article which is produced using the polypropylene-based resin foam particle. In the polypropylene-based resin foam particle, a base resin for the foam particle comprises a biomass-derived polypropylene-based resin A having a biomass-derived monomer component in a molecule chain thereof and a fossil fuel-derived polypropylene-based resin B, in which the base resin comprises 3% by weight to 60% by weight inclusive of the biomass-derived polypropylene-based resin A and 40% by weight to 97% by weight inclusive of the fossil fuel-derived polypropylene-based resin B (in which the total of the amounts of both of the components is 100% by weight). The foam particle molded article is formed by molding the polypropylene-based resin foam particle in a mold.

IPC Classes  ?

9.

RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD

      
Application Number JP2023037498
Publication Number 2024/142556
Status In Force
Filing Date 2023-10-17
Publication Date 2024-07-04
Owner JSR CORPORATION (Japan)
Inventor Maruyama,ken

Abstract

Provided are: a radiation-sensitive resin composition which can be formed into a resist film capable of providing satisfactory levels of sensitivity and CDU performance when a next-generation technology is applied; and a pattern formation method. This radiation-sensitive resin composition comprises: a radiation-sensitive acid-generating resin including a structural unit (I) and a structural unit (II), wherein the structural unit (I) has an acid dissociable group, the structural unit (II) has an organic acid anionic moiety and an onium cationic moiety, and each of the acid dissociable group and the organic acid anionic moiety has an iodine-substituted aromatic ring structure; and a solvent.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/30 - Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor

10.

EXPANDED PARTICLES OF POLYPROPYLENE-BASED RESIN, METHOD FOR PRODUCING SAME, AND MOLDED OBJECT FORMED FROM EXPANDED PARTICLES OF POLYPROPYLENE-BASED RESIN

      
Application Number JP2023043154
Publication Number 2024/142761
Status In Force
Filing Date 2023-12-01
Publication Date 2024-07-04
Owner JSP CORPORATION (Japan)
Inventor
  • Ito Yosuke
  • Chiba Takuya

Abstract

Expanded particles of a polypropylene-based resin, which contain an inorganic phosphinic acid salt and a melamine-compound flame retardant. In the expanded particles, the amount of the inorganic phosphinic acid salt incorporated therein is 0.5 mass% or more, the amount of the melamine-compound flame retardant incorporated therein is 0.05 mass% or more, and the sum of the amount of the inorganic phosphinic acid salt incorporated therein and the amount of the melamine-compound flame retardant incorporated therein is 5 mass% or less. The expanded particles further contain a first antioxidant which comprises a phenolic antioxidant and a second antioxidant which comprises a phosphorus-compound antioxidant and/or a sulfur-compound antioxidant. In the expanded particles, the sum of the amount of the first antioxidant incorporated therein and the amount of the second antioxidant incorporated therein is 0.05-0.6 mass%, and the ratio of the amount of the second antioxidant incorporated therein to the amount of the first antioxidant incorporated therein is 0.5-10.

IPC Classes  ?

11.

METHOD FOR PRODUCING CELLULAR POLYOLEFIN-BASED PLASTIC PARTICLES

      
Application Number 18558025
Status Pending
Filing Date 2022-04-27
First Publication Date 2024-06-27
Owner JSP Corporation (Japan)
Inventor
  • Dzikowski, Pascal
  • Janoušek, Jan

Abstract

The invention relates to a method for producing cellular plastic particles, including the steps of: —providing a plastic material in the form of pre-expanded plastic material particles, —loading the pre-expanded plastic material particles with a blowing agent under the influence of pressure, —expanding the pre-expanded plastic material particles loaded with blowing agent in order to produce cellular plastic particles, more particularly, cellular plastic particles having lower density, under the influence of temperature, in which the expanding of the plastic material particles loaded with blowing agent is carried out under the influence of temperature by irradiation of the plastic material particles loaded with blowing agent with high-energy thermal radiation, more particularly, infrared radiation.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08J 9/228 - Forming foamed products

12.

FIREPROOF HEAT INSULATING BOARD AND FIREPROOF HEAT INSULATING STRUCTURE

      
Application Number 17909098
Status Pending
Filing Date 2021-03-03
First Publication Date 2024-06-27
Owner
  • JSP CORPORATION (Japan)
  • DENKA COMPANY LIMITED (Japan)
Inventor
  • Tabara, Kazuto
  • Nagasaki, Hironori
  • Mizuta, Kohei
  • Mitsumoto, Masanori
  • Shimojo, Yoshinori
  • Kikkawa, Hironobu

Abstract

A fireproof heat insulating board including a foamed resin molded body filled with a slurry, the foamed resin molded body having continuous voids, wherein the filled slurry forms a hydrate containing water of crystallization in an amount of 50 kg/m3 or more through hydration reaction after the filling, and at least a part of the surface of the board is reinforced with one or more inorganic fibers selected from the group consisting of a basalt fiber and a ceramic fiber.

IPC Classes  ?

  • E04B 1/94 - Protection against other undesired influences or dangers against fire
  • B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
  • B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
  • B32B 5/24 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer
  • C04B 14/42 - Glass
  • C04B 14/46 - Rock wool
  • C04B 16/06 - Macromolecular compounds fibrous
  • C04B 16/08 - Macromolecular compounds porous, e.g. expanded polystyrene beads
  • C04B 28/06 - Aluminous cements
  • C04B 28/14 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing calcium sulfate cements
  • C04B 28/16 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing calcium sulfate cements containing anhydrite
  • C04B 111/00 - Function, property or use of the mortars, concrete or artificial stone
  • C04B 111/28 - Fire resistance

13.

COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE

      
Application Number JP2023043257
Publication Number 2024/135316
Status In Force
Filing Date 2023-12-04
Publication Date 2024-06-27
Owner JSR CORPORATION (Japan)
Inventor
  • Suzuki,ayaka
  • Nii,akitaka
  • Kasai,tatsuya

Abstract

The purpose of the present invention is to provide: a composition which can form a silicon-containing film with which it is possible to suppress resist pattern collapsing and improve film removability; and a method for producing a semiconductor substrate. Provided is a composition which comprises: a compound having at least one structural unit selected from the group consisting of a structural unit represented by formula (1-1) and a structural unit represented by formula (1-2) (in which, when the compound has a structural unit represented by formula (1-1), the compound has at least one structural unit selected from the group consisting of a structural unit represented by formula (1-2) and a structural unit represented by formula (2-1)); and a solvent. (In formula (1-1), X represents a monovalent organic group having 2 to 20 carbon atoms and having a heteroaromatic ring; a represents an integer of 1 to 3; when a is 2 or more, a plurality of X's are the same as or different from each other; Y represents a monovalent organic group having 1 to 20 carbon atoms, a hydroxy group or a halogen atom; b represents an integer of 0 to 2; when b is 2, the two Y's are the same as or different from each other; and a+b is 3 or less. In formula (1-2), X represents a monovalent organic group having 2 to 20 carbon atoms and having a heteroaromatc ring; c represents an integer of 1 to 3; when c is 2 or more, a plurality of X's are the same as or different from each other; Y represents a monovalent organic group having 1 to 20 carbon atoms, a hydroxy group or a halogen atom; d represents an integer of 0 to 2; when d is 2, the two Y's are the same as or different from each other; R0represents a substituted or unsubstituted bivalent hydrocarbon group having 1 to 20 carbon atoms and bound to two silicon atoms; p represents an integer of 1 to 3; when p is 2 or more, a plurality of R0's are the same as or different from each other; and c+d+p is 4 or less.) (In formula (2-1), R1represents a monovalent organic group having 1 to 20 carbon atoms (excluding a heteroaromatic ring), a hydroxy group, a hydrogen atom or a halogen atom; h represents 1 or 2; when h is 2, the two R1's are the same as or different from each other; R2represents a substituted or unsubstituted bivalent hydrocarbon group having 1 to 20 carbon atoms and bound to two silicon atoms; q represents an integer of 1 to 3; when q is 2 or more, a plurality of R2's are the same as or different from each other; and h+q is 4 or less.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C08G 77/28 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen sulfur-containing groups
  • C08L 83/14 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
  • G03F 7/20 - Exposure; Apparatus therefor

14.

POLYETHYLENE RESIN FOAM PARTICLE MOLDED BODY AND METHOD FOR PRODUCING SAME

      
Application Number JP2023044061
Publication Number 2024/135414
Status In Force
Filing Date 2023-12-08
Publication Date 2024-06-27
Owner JSP CORPORATION (Japan)
Inventor
  • Tsuda Yuji
  • Ohta Hajime

Abstract

The present invention provides a method for producing a foam particle molded body, wherein a mold is filled with cylindrical foam particles (1) having through holes, and a heating medium is supplied to fusion bond the foam particles (1) to each other, thereby producing a foam particle molded body. The foam particles (1) each have a foam layer that is configured from a polyethylene resin. The closed cell ratio of the foam particles (1) is 80% or more. The average diameter (d) of the through holes (11) in the foam particles (1) is less than 1 mm. The ratio (d/D) of the average diameter (d) to the average outer diameter (D) of the foam particles is 0.4 or less. The open cell ratio of the foam particle molded body is 8% to 20%.

IPC Classes  ?

15.

CHROMATOGRAPHY APPARATUS, SLURRY FILLING METHOD, AND CHROMATOGRAPHY SYSTEM

      
Application Number JP2023037676
Publication Number 2024/127801
Status In Force
Filing Date 2023-10-18
Publication Date 2024-06-20
Owner JSR CORPORATION (Japan)
Inventor
  • Mizuguchi Yusaku
  • Stroehlein, Guido
  • Pearl, Steven R.

Abstract

[Problem] To provide: a chromatography apparatus and chromatography system that present a uniform chromatography medium and have a robust bed; and a slurry filling method that fills a slurry into said chromatography apparatus. [Solution] The chromatography apparatus has: a housing that contains a fluid inlet and a fluid outlet and has a plurality of side walls that face each other; an inflow frit plate that is disposed within the housing and is configured so as to distribute the flow of a fluid; a chromatography medium that is supported by the housing and is configured to receive, from the inflow frit plate, a fluid to be partitioned; and an outflow frit plate that is disposed within the housing and is configured to receive a fluid that has passed through the chromatography medium. The inlet frit plate, the outflow frit plate, and the plurality of side walls surround the chromatography medium so as to retain the chromatography medium in a prescribed position, and the individual side walls have slurry introduction holes having an opening area that is 0.1% to 10.0% of the area of the single side wall.

IPC Classes  ?

  • B01J 20/281 - Sorbents specially adapted for preparative, analytical or investigative chromatography
  • G01N 30/60 - Construction of the column

16.

COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE, METHOD FOR FORMING RESIST UNDERLAYER FILM AND METHOD FOR PRODUCING METAL COMPOUND

      
Application Number JP2023042920
Publication Number 2024/128013
Status In Force
Filing Date 2023-11-30
Publication Date 2024-06-20
Owner JSR CORPORATION (Japan)
Inventor
  • Hirasawa,kengo
  • Serizawa,ryuichi
  • Ozaki,yuki

Abstract

The present invention provides: a composition for forming a resist underlayer film, the composition having excellent embeddability, while enabling the peripheral edge of a substrate to have good cleansing properties after the formation of a film; a method for producing a semiconductor substrate; a method for forming a resist underlayer film; and a method for producing a metal compound. This composition for forming a resist underlayer film contains a metal compound and a solvent, the metal compound contains a reaction product of a metal amide compound and a carboxylic acid, and a metal atom contained in the metal compound is at least one that is selected from the group consisting of titanium, zirconium, hafnium, niobium, tantalum, aluminum, gallium, indium, germanium, tin and antimony.

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

17.

POROUS BODY AND SOUND-ABSORBING MATERIAL

      
Application Number 18553641
Status Pending
Filing Date 2022-03-15
First Publication Date 2024-06-20
Owner JSP CORPORATION (Japan)
Inventor
  • Kaneko, Yohei
  • Nakamura, Hayato

Abstract

A porous body including, as a base resin, a crosslinked polymer obtained by crosslinking a polymer of an acrylic monomer and/or a styrene-based monomer. A storage modulus of the porous body is 5 kPa or more and 2000 kPa or less at 23° C., an apparent density of the porous body is 10 kg/m3 or more and 250 kg/m3 or less, and a molecular weight between crosslinking points of the crosslinked polymer is 1.0×104 or more.

IPC Classes  ?

  • C08J 9/228 - Forming foamed products
  • C08F 232/06 - Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having no condensed rings having two or more carbon-to-carbon double bonds
  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
  • G10K 11/162 - Selection of materials

18.

RADIATION-SENSITIVE COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Application Number JP2023037922
Publication Number 2024/127808
Status In Force
Filing Date 2023-10-19
Publication Date 2024-06-20
Owner JSR CORPORATION (Japan)
Inventor
  • Omiya, Takuya
  • Ito, Ryo
  • Nakagawa, Atsushi
  • Matsumura, Yuushi
  • Nishikori, Katsuaki

Abstract

This radiation-sensitive composition contains: (A) a polymer having a structural unit represented by formula (1); and (B) an onium salt compound which is formed of an organic anion and a cation, in which the organic anion, the cation, or both thereof have an iodo group, and which generates an acid when being irradiated with radiation. In the formula, B1represents a single bond or a divalent organic group that has at least one carbon atom and that binds to E+at the carbon atom. E+represents a divalent group having an ammonium cation structure or a phosphonium cation structure. B2represents a divalent organic group that has at least one carbon atom and that binds to both E+and D-by the same carbon atom or by different carbon atoms. D- represents a monovalent group having an anion structure.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor

19.

METHOD FOR PRODUCING POLYETHYLENE RESIN FOAM SHEET, AND POLYETHYLENE RESIN FOAM SHEET

      
Application Number JP2023044709
Publication Number 2024/128267
Status In Force
Filing Date 2023-12-13
Publication Date 2024-06-20
Owner JSP CORPORATION (Japan)
Inventor
  • Kayanoki Yusuke
  • Katsuyama Naoya
  • Kakuta Hirotoshi

Abstract

The present invention provides: a method for producing a polyethylene resin foam sheet, the method being capable of producing a good polyethylene resin foam sheet without using an inorganic material or a chemical foaming agent; and a polyethylene resin foam sheet. The present invention relates to a method for producing a polyethylene resin foam sheet by subjecting an expandable resin melt that contains a polyethylene resin and a physical foaming agent to extrusion foaming, wherein: a first means uses, as the physical foaming agent, nitrogen and at least one organic physical foaming agent that is selected from among hydrocarbons having 3 to 5 carbon atoms and dialkyl ethers having an alkyl group with 1 to 3 carbon atoms; the sum (A + B) of the addition amount A of the organic physical foaming agent and the addition amount B of the nitrogen is 0.5 mol to 5 mol per 1 kg of the resin component: the addition amount B of the nitrogen is 0.1 mol to 0.4 mol per 1 kg of the resin component; and the addition amounts are adjusted so that the ratio (A/B) of the addition amount A of the organic physical foaming agent to the addition amount B of the nitrogen is 2 to 18. In addition, a polyethylene resin foam sheet according to the present invention has a density of 20 kg/m3to 100 kg/m3 and an average number of cells in the thickness direction of 0.5 per mm to 5 per mm, the ash content of this foam sheet is less than 0.1% by mass (including 0), and the ratio of sodium in the ash content is 10% by mass or less (including 0).

IPC Classes  ?

  • C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent

20.

PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM HAVING PATTERN, PRODUCTION METHOD FOR SAME, AND SEMICONDUCTOR CIRCUIT BOARD

      
Application Number JP2023043471
Publication Number 2024/122542
Status In Force
Filing Date 2023-12-05
Publication Date 2024-06-13
Owner JSR CORPORATION (Japan)
Inventor
  • Tatara Ryoji
  • Nakafuji Shin-Ya
  • Sakuma Tetsuya
  • Okuda Ryuichi
  • Doi Takashi
  • Ooto Junichi
  • Kato Takahiro

Abstract

One aspect of the present invention relates to a photosensitive resin composition, said photosensitive resin composition comprising: (A) an alkali-soluble polymer, (B) a photosensitizer; (C) a crosslinkable compound having a crosslinkable group that, with heat, reacts with the following component (D); (D) a compound represented by general formula (1); and (E) a solvent. [In general formula (1), X11represents a nitrogen atom or the like, R11represents a hydrogen atom or a group represented by general formula (2) (in general formula (2), L21represents a single bond or the like, R21represents a hydrogen atom or the like, R22represents a monovalent organic group, and n21to n23represent integers of 0 or greater), at least one of the three R11is a group represented by general formula (2), and in at least one group represented by general formula (2), n21is an integer of 1 or greater, and at least one R21 is a hydrogen atom.]

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C08F 12/22 - Oxygen
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G 73/22 - Polybenzoxazoles
  • G03F 7/023 - Macromolecular quinonediazides; Macromolecular additives, e.g. binders

21.

RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND RADIATION-SENSITIVE ACID GENERATOR

      
Application Number JP2023034686
Publication Number 2024/116575
Status In Force
Filing Date 2023-09-25
Publication Date 2024-06-06
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto,ryuichi
  • Miyao,kensuke
  • Inami,hajime
  • Otsuka,noboru

Abstract

Provided are: a radiation-sensitive resin composition from which a resist film capable of exhibiting satisfactory levels of sensitivity, LWR performance, DOF performance, pattern rectangularity, CDU performance, and pattern circularity can be formed even when a resist pattern having a high aspect ratio is formed; a pattern formation method; and a radiation-sensitive acid generator. The radiation-sensitive resin composition contains an onium salt compound represented by formula (1), a resin containing a structural unit having an acid-dissociable group, and a solvent. (In formula (1), R1, R2and R3are each independently a monovalent chain organic group having 1-10 carbon atoms. R4, R5, and R6are each independently a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group, or a monovalent fluorinated hydrocarbon group. When there are a plurality of R4, R5, and R6, the plurality of R4, R5, and R6are the same as or different from each other. Rf1is a fluorine atom or a monovalent fluorinated hydrocarbon group. When there are a plurality of Rf1, the plurality of Rf1122 is an integer of 1-4. Z+ is a monovalent radiation-sensitive onium cation.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C09K 3/00 - Materials not provided for elsewhere
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor

22.

RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND RADIATION-SENSITIVE ACID-GENERATING AGENT

      
Application Number JP2023034692
Publication Number 2024/116576
Status In Force
Filing Date 2023-09-25
Publication Date 2024-06-06
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto,ryuichi
  • Miyao,kensuke
  • Inami,hajime
  • Otsuka,noboru

Abstract

Provided are: a radiation-sensitive resin composition, from which a resist film capable of exhibiting satisfactory levels of sensitivity, LWR performance, DOF performance, pattern rectangularity, CDU performance, and pattern circularity can be formed in formation of a resist pattern having a high aspect ratio; a pattern formation method; and a radiation-sensitive acid-generating agent. This radiation-sensitive resin composition contains: an onium salt compound (1) expressed by formula (1); an onium salt compound (2) that is different from the aforementioned onium salt compound (1); a resin that includes structural units having acid-dissociable groups; and a solvent. (In formula (1), W represents a C1-40 monovalent chain-form organic group, a C5 or lower monovalent cyclic organic group, or a monovalent group obtained by combining a C1-40 monovalent chain-form organic group and a C5 or lower monovalent cyclic organic group. R1and R2each independently represent a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group, or a monovalent fluorinated hydrocarbon group. In cases in which a plurality of R1and R2are present, the plurality of Rf1and Rf2may be the same as, or different from, each other. R3, R4, and R511 is an integer of 1 to 8. Z+ is a monovalent radiation-sensitive onium cation.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C09K 3/00 - Materials not provided for elsewhere
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor

23.

RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND RADIATION-SENSITIVE ACID GENERATOR

      
Application Number JP2023034717
Publication Number 2024/116577
Status In Force
Filing Date 2023-09-25
Publication Date 2024-06-06
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto,ryuichi
  • Miyao,kensuke
  • Inami,hajime
  • Otsuka,noboru

Abstract

Provided are: a radiation-sensitive resin composition, from which a resist film capable of exhibiting satisfactory levels of sensitivity, LWR performance, DOF performance, pattern rectangularity, CDU performance and pattern circularity can be formed in the formation of a resist pattern having a high aspect ratio; a pattern formation method; and a radiation-sensitive acid generator. This radiation-sensitive resin composition comprises: an onium salt compound represented by formula (1); a resin containing a structural unit (I) represented by formula (2); and a solvent. (In formula (1), R1, R2and R3each independently represent a monovalent organic group having 1 to 10 carbon atoms, or two or three of R1, R2and R3are combined with each other to form, together with a carbon atoms to which these residues are bound, a monovalent or bivalent group containing a cyclic structure having 3 to 20 carbon atoms, in which when two of R1, R2and R3form the above-mentioned cyclic structure, the remaining one is an organic group having 1 to 10 carbon atoms; R4and R5each independently represent a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group, or a monovalent fluorinated hydrocarbon group, in which when there are a plurality of R4's and R5's, the plurality of R4's and R5's are the same as or different from each other; R6, R7and R811 represents an integer of 0 to 8; and Z+represents a monovalent radiation-sensitive onium cation.) (In formula (2), R9represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; and R10 represents a monovalent group containing at least one structure selected from the group consisting of a lactone structure, a cyclic polycarbonate structure and a sultone structure.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor
  • C09K 3/00 - Materials not provided for elsewhere

24.

METHOD FOR EVALUATING EXCRETION OF SUBSTANCE OF INTEREST BY HUMAN HEPATOCYTE-LIKE CELL

      
Application Number 18141555
Status Pending
Filing Date 2021-11-24
First Publication Date 2024-06-06
Owner
  • JSR Corporation (Japan)
  • Kendai Translational Research Center (Japan)
Inventor
  • Masuda, Norio
  • Ogihara, Takuo

Abstract

A method is provided for evaluating excretion of a substance of interest by a human hepatocyte-like cell, the method including: preparing a sac-like-material-containing solution that contains a sac-like material which is produced in vitro and has a membrane of a human hepatocyte-like cell and 0% to 10% by volume of a suspended extracellular matrix; placing the substance of interest in the sac-like-material-containing solution to bring the substance of interest into contact with the sac-like material; and extracting the sac-like material from the sac-like-material-containing solution and measuring a concentration of the substance of interest or a metabolite thereof excreted into an inner cavity of the sac-like material.

IPC Classes  ?

  • G01N 33/50 - Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
  • C12N 5/071 - Vertebrate cells or tissues, e.g. human cells or tissues

25.

COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR FORMING RESIST UNDERLAYER FILM

      
Application Number 18422098
Status Pending
Filing Date 2024-01-25
First Publication Date 2024-06-06
Owner JSR CORPORATION (Japan)
Inventor
  • Ozaki, Yuki
  • Serizawa, Ryuichi
  • Hirasawa, Kengo
  • Hirabayashi, Hiroki

Abstract

A composition includes a metal compound, a polymer including a first structural unit represented by formula (1) and a second structural unit represented by formula (2), and a solvent. R1 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; and R2 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms. R3 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; L is a single bond or a divalent linking group; Ar is a group obtained by removing (n+1) hydrogen atoms from a substituted or unsubstituted aromatic ring having 6 to 20 ring members; R4 is a monovalent hydroxyalkyl group having 1 to 10 carbon atoms or a hydroxy group; and n is an integer of 0 to 8. A composition includes a metal compound, a polymer including a first structural unit represented by formula (1) and a second structural unit represented by formula (2), and a solvent. R1 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; and R2 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms. R3 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; L is a single bond or a divalent linking group; Ar is a group obtained by removing (n+1) hydrogen atoms from a substituted or unsubstituted aromatic ring having 6 to 20 ring members; R4 is a monovalent hydroxyalkyl group having 1 to 10 carbon atoms or a hydroxy group; and n is an integer of 0 to 8.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F 7/004 - Photosensitive materials
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable

26.

PROTEIN COLLECTION DETERMINATION SYSTEM, PROTEIN COLLECTION DETERMINATION METHOD, AND RECORDING MEDIUM

      
Application Number JP2023041605
Publication Number 2024/111540
Status In Force
Filing Date 2023-11-20
Publication Date 2024-05-30
Owner
  • JSR CORPORATION (Japan)
  • MEDICAL & BIOLOGICAL LABORATORIES CO., LTD. (Japan)
Inventor Suemasa Daichi

Abstract

This protein collection determination system comprises: a first determination unit that uses first image data obtained by capturing a time series of images of a culture of a cell population infected with a virus as first input data and determines, as first output data, whether a cell population infected with a virus is in a suitable state for collecting a protein; and an acquisition unit that acquires image data obtained by capturing a time series of images of the inside of a culture container. The first determination unit performs determination by means of a first model, and the first model is a trained model obtained by performing deep learning of a first neural network using the actual values of the first input data and the actual values of the first output data as first teacher data.

IPC Classes  ?

  • C12M 1/34 - Measuring or testing with condition measuring or sensing means, e.g. colony counters
  • C12N 5/10 - Cells modified by introduction of foreign genetic material, e.g. virus-transformed cells
  • G06T 7/00 - Image analysis
  • G06V 10/82 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using neural networks
  • G06V 20/69 - Microscopic objects, e.g. biological cells or cellular parts

27.

METHOD FOR PRODUCING CARRIER FOR CHROMATOGRAPHIC USE, METHOD FOR PRODUCING CHROMATOGRAPHY COLUMN, AND CARRIER FOR CHROMATOGRAPHIC USE

      
Application Number 18551116
Status Pending
Filing Date 2022-03-15
First Publication Date 2024-05-23
Owner JSR CORPORATION (Japan)
Inventor
  • Kobayashi, Kunihiko
  • Akiyama, Minato
  • Inoue, Yukiya
  • Kikuchi, Masahiro

Abstract

A method for producing a chromatography carrier, including providing a solid phase support, where the solid phase support provided is formed of porous particles on which a ligand has or has not been immobilized, and subjecting the solid phase support to sieve classification. A coefficient of variation of a volume particle size distribution of the porous particles when a ligand has been immobilized is adjusted to 1% to 22%, and a ratio (d1/d50) of volume cumulative 1% particle size d1 to volume cumulative 50% particle size d50 in terms of the porous particles is adjusted to 0.55 to 1.0.

IPC Classes  ?

  • B01J 20/286 - Phases chemically bonded to a substrate, e.g. to silica or to polymers
  • B01D 15/20 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the conditioning of the sorbent material
  • B01D 15/38 - Selective adsorption, e.g. chromatography characterised by the separation mechanism involving specific interaction not covered by one or more of groups , e.g. affinity, ligand exchange or chiral chromatography
  • B01J 20/26 - Synthetic macromolecular compounds
  • B01J 20/28 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
  • B01J 20/30 - Processes for preparing, regenerating or reactivating
  • B01J 20/32 - Impregnating or coating

28.

METHOD FOR PRODUCING POLYAMIDE RESIN FOAM PARTICLES

      
Application Number 18553026
Status Pending
Filing Date 2022-03-01
First Publication Date 2024-05-23
Owner JSP Corporation (Japan)
Inventor Hayashi, Tatsuya

Abstract

A method for producing a polyamide-based resin expanded bead, the method comprising expanding a polyamide-based resin bead using a physical blowing agent, wherein the polyamide-based resin bead comprises a coloring pigment and a higher fatty acid metal salt having 12 to 24 carbon atoms; a metal in the higher fatty acid metal salt is one or more metals selected from the group consisting of magnesium, aluminum, and zinc; and a content of the higher fatty acid metal salt in the polyamide-based resin bead is 500 to 5000 mass ppm.

IPC Classes  ?

  • C08J 9/16 - Making expandable particles
  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof

29.

RADIOACTIVE-RAY-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD

      
Application Number JP2023030940
Publication Number 2024/105962
Status In Force
Filing Date 2023-08-28
Publication Date 2024-05-23
Owner JSR CORPORATION (Japan)
Inventor
  • Hachiya,asuka
  • Nishikori,katsuaki
  • Shiratani,motohiro

Abstract

Provided are: a radioactive-ray-sensitive resin composition which makes it possible to form a resist film having satisfactory storage stability and also having excellent sensitivity and LWR performance even when a next-generation technology is applied; and a pattern formation method. The radioactive-ray-sensitive resin composition comprises: a radioactive-ray-sensitive onium salt having a cation moiety containing a fluorine atom; a carboxylic acid having a standard boiling point of 90°C to 220°C and having no aromatic ring, or an alcohol having a standard boiling point of 60°C or lower, or both of the carboxylic acid and the alcohol; a resin containing a structural unit having an acid-dissociable group; and a solvent.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor

30.

RADIATION SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD

      
Application Number JP2023035159
Publication Number 2024/106020
Status In Force
Filing Date 2023-09-27
Publication Date 2024-05-23
Owner JSR CORPORATION (Japan)
Inventor
  • Nishikori,katsuaki
  • Kobayashi,atsushi
  • Hachiya,asuka
  • Shiratani,motohiro
  • Nemoto,ryuichi

Abstract

Provided are a radiation sensitive resin composition and a pattern formation method that can form a resist film that has excellent preservation stability and has excellent CDU performance and sensitivity when applied to a next-generation technology. This radiation sensitive resin composition comprises: a radiation sensitive onium salt (A) represented by formula (1) (in the formula (1), Rp1pp11 +represents a monovalent radiation sensitive onium cation); a radiation sensitive onium salt (B) that is different from the radiation sensitive onium salt (A) and that is represented by formula (2) (in the formula (2), Rp222 +11 +22 + is a cation including a fluorine atom.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor

31.

POLYPROPYLENE-BASED RESIN EXPANDED BEADS AND METHOD FOR PRODUCING POLYPROPYLENE-BASED RESIN EXPANDED BEADS

      
Application Number 18278657
Status Pending
Filing Date 2021-12-21
First Publication Date 2024-05-16
Owner JSP CORPORATION (Japan)
Inventor
  • Nohara, Tokunobu
  • Ode, Yasutaka

Abstract

A polypropylene-based resin expanded beads configured to include an NOR type hindered amine and has a surface on which a thermoplastic polymer layer is located, in which a blending ratio of the amine in the expanded beads is 0.03 wt % or more and 0.5 wt % or less, and a blending ratio of the amine in the thermoplastic polymer layer is less than the blending ratio of the amine in the expanded beads. Further, the method for producing the expanded beads includes a covering and foaming step, in which in the resin beads to be obtained in the covering step, a blending ratio of the amine in the resin beads is adjusted to be 0.03 wt % or more and 0.5 wt % or less, and a blending ratio of the amine in a thermoplastic polymer layer is adjusted to be lower than the blending ratio of the amine in the resin beads.

IPC Classes  ?

  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08J 9/224 - Surface treatment
  • C08J 9/232 - Forming foamed products by sintering expandable particles
  • C08K 5/3492 - Triazines

32.

CURABLE COMPOSITION FOR ORGANIC EL ELEMENTS, CURED PRODUCT FOR ORGANIC EL ELEMENTS AND METHOD FOR PRODUCING SAME, ORGANIC EL ELEMENT, AND POLYMER

      
Application Number JP2023040331
Publication Number 2024/101411
Status In Force
Filing Date 2023-11-09
Publication Date 2024-05-16
Owner JSR CORPORATION (Japan)
Inventor
  • Murakami, Yoshitaka
  • Kamiya, Ikuyo

Abstract

Disclosed is a curable composition for organic EL elements, the curable composition containing (A) a polymer that comprises a structural unit derived from a compound having an acidic group, and (B) a photosensitive compound, wherein: the polymer (A) comprises a structural unit (I) that is derived from an aromatic vinyl compound and a structural unit (II) that is derived from a maleimide compound, while containing, as the compound having an acidic group, at least one compound that is selected from the group consisting of an aromatic vinyl compound and a maleimide compound; and the ratio of the sum of the structural unit (I) and the structural unit (II) in the polymer (A) is 70% by mole or more relative to all structural units in the polymer (A).

IPC Classes  ?

  • H10K 50/84 - Passivation; Containers; Encapsulations
  • C08F 212/02 - Monomers containing only one unsaturated aliphatic radical
  • C08F 222/40 - Imides, e.g. cyclic imides
  • G03F 7/004 - Photosensitive materials
  • G03F 7/023 - Macromolecular quinonediazides; Macromolecular additives, e.g. binders
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • H10K 59/122 - Pixel-defining structures or layers, e.g. banks
  • H10K 59/173 - Passive-matrix OLED displays comprising banks or shadow masks
  • H10K 85/10 - Organic polymers or oligomers

33.

RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD

      
Application Number 18277113
Status Pending
Filing Date 2021-12-20
First Publication Date 2024-05-09
Owner JSR CORPORATION (Japan)
Inventor Maruyama, Ken

Abstract

A radiation-sensitive resin composition includes: a resin including a structural unit represented by formula (1); at least one onium salt each including an organic acid anion moiety and an onium cation moiety; and a solvent. At least part of the organic acid anion moiety in the at least one onium salt includes an iodine-substituted aromatic ring structure. R is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, Y1 is a divalent linking group, and X1 is an acid-dissociable group, and n is 0 or 1. When n is 0, X1 is represented by formula (s1) or (s2). A radiation-sensitive resin composition includes: a resin including a structural unit represented by formula (1); at least one onium salt each including an organic acid anion moiety and an onium cation moiety; and a solvent. At least part of the organic acid anion moiety in the at least one onium salt includes an iodine-substituted aromatic ring structure. R is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, Y1 is a divalent linking group, and X1 is an acid-dissociable group, and n is 0 or 1. When n is 0, X1 is represented by formula (s1) or (s2).

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 25/18 - Polycyclic aromatic halogenated hydrocarbons
  • C07C 309/10 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing etherified hydroxy groups bound to the carbon skeleton with the oxygen atom of at least one of the etherified hydroxy groups further bound to an acyclic carbon atom
  • C07C 309/39 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing halogen atoms bound to the carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C07D 327/04 - Five-membered rings
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
  • C08F 220/38 - Esters containing sulfur
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

34.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION

      
Application Number 18391906
Status Pending
Filing Date 2023-12-21
First Publication Date 2024-05-09
Owner JSR CORPORATION (Japan)
Inventor
  • Nakatsu, Hiroki
  • Abe, Shinya
  • Yamada, Shuhei
  • Tsuji, Takashi
  • Wakayama, Hiroki
  • Mayumi, Kosuke
  • Miyauchi, Hiroyuki

Abstract

A method for manufacturing a semiconductor substrate, including: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film directly or indirectly on the substrate; forming a resist pattern directly or indirectly on the resist underlayer film; and performing etching using the resist pattern as a mask. The composition for forming a resist underlayer film contains: a polymer having a repeating unit represented by formula (1) and a solvent. Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a monovalent group including an aromatic ring having 5 to 40 ring atoms and includes at least one group selected from the group consisting of groups represented by formula (2-1) and groups represented by formula (2-2). A method for manufacturing a semiconductor substrate, including: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film directly or indirectly on the substrate; forming a resist pattern directly or indirectly on the resist underlayer film; and performing etching using the resist pattern as a mask. The composition for forming a resist underlayer film contains: a polymer having a repeating unit represented by formula (1) and a solvent. Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a monovalent group including an aromatic ring having 5 to 40 ring atoms and includes at least one group selected from the group consisting of groups represented by formula (2-1) and groups represented by formula (2-2).

IPC Classes  ?

  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • G03F 7/075 - Silicon-containing compounds
  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/311 - Etching the insulating layers

35.

COMPOSITION FOR SEMICONDUCTOR PROCESSING AND PROCESSING METHOD

      
Application Number 18457365
Status Pending
Filing Date 2023-08-29
First Publication Date 2024-05-09
Owner JSR Corporation (Japan)
Inventor Tano, Hiroyuki

Abstract

A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof (excluding a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×106. A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof (excluding a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×106. RO(CH2)2O(CH2)2OH  (1) A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof (excluding a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×106. RO(CH2)2O(CH2)2OH  (1) ROH  (2) A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof (excluding a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×106. RO(CH2)2O(CH2)2OH  (1) ROH  (2) (In the formula (1) and the formula (2), R's represent the same hydrocarbon group.)

IPC Classes  ?

  • C11D 3/37 - Polymers
  • C11D 3/20 - Organic compounds containing oxygen
  • C11D 3/28 - Heterocyclic compounds containing nitrogen in the ring
  • C11D 11/00 - Special methods for preparing compositions containing mixtures of detergents
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

36.

RADIATION-SENSITIVE COMPOSITION AND RESIST PATTERN-FORMING METHOD

      
Application Number 18504594
Status Pending
Filing Date 2023-11-08
First Publication Date 2024-05-09
Owner JSR CORPORATION (Japan)
Inventor Maruyama, Ken

Abstract

A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X), A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X), where Ar1 is a group obtained by removing (a+b) hydrogen atoms from an unsubstituted aryl group, RXA is a monovalent iodine atom, an iodinated alkyl group or an iodinated alkoxy group, RXB is a monovalent organic group, a is an integer of 1 to 10, and b is an integer of 1 to 10.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

37.

COMPOSITION FOR SEMICONDUCTOR PROCESSING AND PROCESSING METHOD

      
Application Number 18460625
Status Pending
Filing Date 2023-09-04
First Publication Date 2024-05-09
Owner JSR CORPORATION (Japan)
Inventor Tano, Hiroyuki

Abstract

A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof and a hydroxyl group (excluding the compound represented by the following general formula (1), a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×104. A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof and a hydroxyl group (excluding the compound represented by the following general formula (1), a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×104. R2N(OH)  (1) A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof and a hydroxyl group (excluding the compound represented by the following general formula (1), a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×104. R2N(OH)  (1) R2NH  (2) (In the formula (1) and the formula (2), R's each independently represent an alkyl group having 1 to 4 carbon atoms.)

IPC Classes  ?

  • C11D 11/00 - Special methods for preparing compositions containing mixtures of detergents
  • C11D 7/26 - Organic compounds containing oxygen
  • C11D 7/32 - Organic compounds containing nitrogen
  • C11D 7/50 - Solvents
  • G03F 7/42 - Stripping or agents therefor
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

38.

ELPAC HC-G

      
Serial Number 79399661
Status Pending
Filing Date 2024-05-02
Owner JSR CORPORATION (Japan)
NICE Classes  ?
  • 01 - Chemical and biological materials for industrial, scientific and agricultural use
  • 17 - Rubber and plastic; packing and insulating materials

Goods & Services

Unprocessed artificial resins as raw materials in the form of powders, liquids or pastes; unprocessed synthetic resins; thermally curable unprocessed synthetic resins; thermoplastic resins, unprocessed; unprocessed artificial resins for use in manufacture; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in industry; synthetic resin adhesives for industrial purposes; contact adhesives for use with laminates; adhesives for industrial purposes. Semi-processed synthetic resins; semi-processed thermoplastic polymer resins for use in manufacture; semi-processed plastic substances made of thermally curable resins; semi-processed plastics.

39.

JSR MOR

      
Application Number 1788074
Status Registered
Filing Date 2024-03-12
Registration Date 2024-03-12
Owner JSR CORPORATION (Japan)
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

Industrial chemicals; chemical preparations for use in photography; photoresists.

40.

SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND COMPOSITION

      
Application Number 18528951
Status Pending
Filing Date 2023-12-05
First Publication Date 2024-05-02
Owner JSR CORPORATION (Japan)
Inventor
  • Miyauchi, Hiroyuki
  • Dei, Satoshi
  • Tanaka, Ryotaro
  • Yoneda, Eiji
  • Yoshinaka, Sho

Abstract

A method for manufacturing a semiconductor substrate, includes: directly or indirectly applying a composition for forming a resist underlayer film to a substrate to form a resist under film directly or indirectly on the substrate; applying a composition for forming a resist film to the resist underlayer film to form a resist film on the resist underlayer film; exposing the resist film to radiation; and developing the exposed resist film by a developer. The composition for forming a resist underlayer film includes: a polymer; an onium salt that is capable of generating at least one polar group selected from the group consisting of a carboxy group and a hydroxy group by radiation or heat; and a solvent.

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • G03F 7/029 - Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
  • G03F 7/20 - Exposure; Apparatus therefor
  • G03F 7/32 - Liquid compositions therefor, e.g. developers
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

41.

RADIOACTIVE-RAY-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD

      
Application Number JP2023032340
Publication Number 2024/090041
Status In Force
Filing Date 2023-09-05
Publication Date 2024-05-02
Owner JSR CORPORATION (Japan)
Inventor
  • Shiratani,motohiro
  • Hachiya,asuka

Abstract

Provided are a radioactive-ray-sensitive resin composition and a pattern formation method that make it possible to form a resist film that has satisfactory storage stability, and also has excellent sensitivity and LWR performance when next-generation technology is applied. The radioactive-ray-sensitive resin composition comprises at least one onium salt having an organic acid anion moiety and an onium cation moiety, a resin containing a structural unit having an acid dissociable group, and a solvent, in which at least a part of the onium cation moiety in the onium salt is a fluorinated onium cation moiety containing a fluorine atom, and at least a part of the organic acid anion moiety in the onium salt is an organic acid anion moiety (1) represented by formula (1). (In formula (1), R1represents an organic group having a valency of (q2+1) or, when there are a plurality of R1's, two of the R1's are bonded to each other to form a 5- to 20-membered cyclic structure in conjunction with a carbon atom bonded to them and located on a benzene ring in formula (1); R2represents a halogen atom, a hydroxy group, an alkyl group, an alkoxy group, a cyano group, a nitro group or an amino group; q1 represents an integer of 1 to 4; when q1 is 2 or more, a plurality of R1's are the same as or different from each other; when q1 is 1, q2 represents an integer of 1 to 4; when q1 is 2 or more, a plurality of q2's each independently represent an integer of 0 to 4, in which at least one of q2's is 1 or more; q3 represents an integer of 0 to 3; when q3 is 2 or more, a plurality of R2's are same as or different from each other; and q1 and q3 satisfy the formula q1+q3 ≤ 4.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 65/105 - Compounds having carboxyl groups bound to carbon atoms of six-membered aromatic rings and containing any of the groups OH, O-metal, —CHO, keto, ether, groups, groups, or groups containing hydroxy or O-metal groups polycyclic
  • C07C 65/24 - Compounds having carboxyl groups bound to carbon atoms of six-membered aromatic rings and containing any of the groups OH, O-metal, —CHO, keto, ether, groups, groups, or groups containing ether groups, groups, groups, or groups polycyclic
  • C07C 65/28 - Compounds having carboxyl groups bound to carbon atoms of six-membered aromatic rings and containing any of the groups OH, O-metal, —CHO, keto, ether, groups, groups, or groups containing ether groups, groups, groups, or groups having unsaturation outside the aromatic rings
  • C07C 233/87 - Carboxylic acid amides having carbon atoms of carboxamide groups bound to carbon atoms of six-membered aromatic rings having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a hydrocarbon radical substituted by carboxyl groups with the substituted hydrocarbon radical bound to the nitrogen atom of the carboxamide group by an acyclic carbon atom of a carbon skeleton containing six-membered aromatic rings
  • C07C 381/12 - Sulfonium compounds
  • C09K 3/00 - Materials not provided for elsewhere
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor

42.

METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE AND COMPOSITION

      
Application Number JP2023036847
Publication Number 2024/085030
Status In Force
Filing Date 2023-10-11
Publication Date 2024-04-25
Owner JSR CORPORATION (Japan)
Inventor
  • Tsuji,takashi
  • Nakatsu,hiroki
  • Katagiri,takashi
  • Abe,shinya
  • Naganawa,atsuko

Abstract

The purpose of the present invention is to provide: a method for producing a semiconductor substrate, the method using a composition which is capable of forming a film that has excellent bending resistance and excellent solubility during liquid discharging; and a composition. The present invention provides a method for producing a semiconductor substrate, the method comprising a step in which a resist underlayer film forming composition is directly or indirectly applied to a substrate, a step in which a resist pattern is directly or indirectly formed on the resist underlayer film that has been formed by the application step, and a step in which etching is performed using the resist pattern as a mask, wherein: the resist underlayer film forming composition contains a solvent and a compound having a nitro group; the compound having a nitro group is a polymer having a repeating unit that comprises a nitro group and an aromatic ring, an aromatic ring-containing compound having a nitro group and a molecular weight of 600 to 3,000, or a combination thereof; the content ratio of the compound having a nitro group in the components of the resist underlayer film forming composition excluding the solvent is 10% by mass or more.

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

43.

RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, AND POLYMER

      
Application Number JP2023036474
Publication Number 2024/084993
Status In Force
Filing Date 2023-10-06
Publication Date 2024-04-25
Owner JSR CORPORATION (Japan)
Inventor
  • Maruyama Ken
  • Nishikori Katsuaki
  • Kiriyama Kazuya

Abstract

A radiation-sensitive composition comprising a polymer having: a side chain including an acid-dissociable group; and a side chain including one or more radiation-sensitive onium cation structures and two or more iodo groups.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C08F 220/10 - Esters
  • G03F 7/20 - Exposure; Apparatus therefor

44.

MOLDED ARTICLE OF POLYPROPYLENE-BASED RESIN EXPANDED BEADS AND METHOD FOR PRODUCING SAME

      
Application Number 18392071
Status Pending
Filing Date 2023-12-21
First Publication Date 2024-04-18
Owner JSP CORPORATION (Japan)
Inventor
  • Sakamura, Takumi
  • Ohta, Hajime

Abstract

A method for producing a molded article of expanded beads includes filling tubular polypropylene-based resin expanded beads each having a through-hole in a mold, and supplying a heating medium to fusion-bond the expanded beads to each other. The expanded beads have a foamed layer constituted by polypropylene-based resin. A closed cell of the expanded beads is 90% or more. An average hole diameter (d) of through-holes of the expanded beads is less than 1 mm. A ratio [d/D] of the average hole diameter (d) to an average outer diameter (D) of the expanded beads is 0.4 or less. An open cell content of the molded article of expanded beads is 2.5% or more and 12% or less.

IPC Classes  ?

45.

ANTIBODY AND USE THEREOF

      
Application Number JP2023036979
Publication Number 2024/080325
Status In Force
Filing Date 2023-10-12
Publication Date 2024-04-18
Owner
  • JSR CORPORATION (Japan)
  • KYOTO UNIVERSITY (Japan)
Inventor
  • Ishikawa Hidefumi
  • Kanahara Masaaki
  • Mizuuchi Motoaki
  • Yamaguchi Tetsuji
  • Matsuzawa Shuichi

Abstract

HLL region) contain respectively the amino acid sequences represented by SEQ ID NOS: 4-6, or a fragment of the antibody.

IPC Classes  ?

  • C07K 16/40 - Immunoglobulins, e.g. monoclonal or polyclonal antibodies against enzymes
  • A61K 39/395 - Antibodies; Immunoglobulins; Immune serum, e.g. antilymphocytic serum
  • A61P 35/00 - Antineoplastic agents

46.

RADIATION-SENSITIVE COMPOSITION AND METHOD OF FORMING RESIST PATTERN

      
Application Number 18270256
Status Pending
Filing Date 2021-11-15
First Publication Date 2024-04-18
Owner JSR CORPORATION (Japan)
Inventor Maruyama, Ken

Abstract

A radiation-sensitive composition includes: a polymer (A) including a structural unit represented by formula (i); and an acid-generating compound including a radiation-sensitive onium cation and an organic anion (provided that the polymer (A) is excluded), while satisfying at least one of requirements [K1] and [K2]. In [K1], the polymer (A) includes a radiation-sensitive onium cation [X] including two or more of substituents β each of which is at least one type selected from the group consisting of a fluoroalkyl group and a fluoro group (provided that the fluoro group in the fluoroalkyl group is excluded). In [K2], the acid-generating compound includes a compound including a radiation-sensitive onium cation [X]. A radiation-sensitive composition includes: a polymer (A) including a structural unit represented by formula (i); and an acid-generating compound including a radiation-sensitive onium cation and an organic anion (provided that the polymer (A) is excluded), while satisfying at least one of requirements [K1] and [K2]. In [K1], the polymer (A) includes a radiation-sensitive onium cation [X] including two or more of substituents β each of which is at least one type selected from the group consisting of a fluoroalkyl group and a fluoro group (provided that the fluoro group in the fluoroalkyl group is excluded). In [K2], the acid-generating compound includes a compound including a radiation-sensitive onium cation [X].

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

47.

METHOD FOR PRODUCING CHROMATOGRAPHY CARRIER, METHOD FOR PRODUCING CHROMATOGRAPHY COLUMN, AND CHROMATOGRAPHY CARRIER

      
Application Number 18551755
Status Pending
Filing Date 2022-03-15
First Publication Date 2024-04-11
Owner JSR CORPORATION (Japan)
Inventor
  • Kobayashi, Kunihiko
  • Akiyama, Minato
  • Inoue, Yukiya
  • Kikuchi, Masahiro

Abstract

A chromatography carrier may exhibit high liquid permeability and an excellent pressure-resistant characteristic during liquid passage. A chromatography carrier production method may include: (1) providing a solid phase support, the solid phase support being formed of porous particles on which a ligand has or has not been immobilized; and (2) subjecting the solid phase support to sieve classification, the coefficient of variation of the volume particle size distribution of the porous particles when a ligand has been immobilized being adjusted to 1% to 22%. The skewness of the volume particle size distribution of the porous particles when a ligand has been immobilized may be adjusted to −0.1 to 5.

IPC Classes  ?

  • B01J 20/285 - Porous sorbents based on polymers
  • B01D 15/20 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the conditioning of the sorbent material
  • B01D 15/22 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the construction of the column
  • B01J 20/30 - Processes for preparing, regenerating or reactivating

48.

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING RESIST PATTERN FILM, AND METHOD FOR MANUFACTURING PLATED SHAPED ARTICLE

      
Application Number 18372176
Status Pending
Filing Date 2023-09-25
First Publication Date 2024-04-11
Owner JSR CORPORATION (Japan)
Inventor
  • Satou, Keiichi
  • Ishii, Akira
  • Tomita, Takuya
  • Koumura, Kazuhiko

Abstract

An embodiment of the present invention relates to a photosensitive resin composition, a method for manufacturing a resist pattern film, and a method for manufacturing a plated shaped article; the photosensitive resin composition comprises (A) an alkali-soluble resin, (B1) a polymerizable compound having at least two (meth)acryloyl groups and at least two hydroxy groups in one molecule and having a ring structure, (C) a photoradical polymerization initiator, (D) at least one compound selected from the group consisting of a nitrogen-containing heterocyclic compound (d1) containing two or more nitrogen atoms, a thiol compound (d2), and a polymerization inhibitor (d3), and (F) a solvent.

IPC Classes  ?

  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/004 - Photosensitive materials
  • G03F 7/031 - Organic compounds not covered by group

49.

POLYPROPYLENE-BASED RESIN FOAMED PARTICLES AND METHOD FOR MANUFACTURING SAME

      
Application Number JP2023036097
Publication Number 2024/075742
Status In Force
Filing Date 2023-10-03
Publication Date 2024-04-11
Owner JSP CORPORATION (Japan)
Inventor
  • Kitahara Taizo
  • Chiba Takuya

Abstract

Polypropylene-based resin foamed particles (1) each include a foamed layer formed of a polypropylene-based resin composition. The polypropylene-based resin composition forming the foamed layer contains a polypropylene-based resin and rubbery bodies (G) containing an ethylene propylene-based rubber. The rubbery bodies are dispersed in the polypropylene-based resin. The foamed particles (1) have a melting point Tm of 130-162°C.

IPC Classes  ?

  • C08J 9/16 - Making expandable particles
  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent

50.

CORE MEMBER

      
Application Number 18285420
Status Pending
Filing Date 2022-03-29
First Publication Date 2024-04-04
Owner JSP CORPORATION (Japan)
Inventor
  • Hisamatsu, Katsunori
  • Hashimoto, Keiichi

Abstract

A core member used for a laminate in which polyurethane foam is laminated on the core member made of a thermoplastic resin expanded beads molded article, such that the molded article in which expanded beads having through holes are mutually fused, an average porosity of the expanded beads molded article is between 10% and 25%, and on a surface of the expanded beads molded article, a ratio of a total opening area of the through hole portions of the expanded beads to a surface area of the expanded beads molded article is between 2% and 5%, an average opening area of the through hole portions of the expanded beads is between 5 mm2 and 20 mm2, and the ratio of the number of through hole portions having an opening area of 2 mm2 or more to the number of through hole portions of the expanded beads is 60% or less.

IPC Classes  ?

  • B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
  • B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • B32B 27/40 - Layered products essentially comprising synthetic resin comprising polyurethanes
  • C08J 9/228 - Forming foamed products

51.

METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE, COMPOSITION AND POLYMER

      
Application Number JP2023033535
Publication Number 2024/070728
Status In Force
Filing Date 2023-09-14
Publication Date 2024-04-04
Owner JSR CORPORATION (Japan)
Inventor
  • Katagiri,takashi
  • Abe,shinya
  • Tsuji,takashi
  • Nakatsu,hiroki
  • Miyauchi,hiroyuki

Abstract

The purpose of the present invention is to provide: a method for producing a semiconductor substrate using a composition which is capable of forming a film that has excellent bending resistance; a composition; and a polymer. This method for producing a semiconductor substrate comprises: a step for applying a resist underlayer film-forming composition directly or indirectly to a substrate; a step for forming a resist pattern directly or indirectly on the resist underlayer film that has been formed in the application step; and a step for performing etching using the resist pattern as a mask. With respect to this method for producing a semiconductor substrate, the resist underlayer film-forming composition contains a solvent and a polymer that has a structural unit represented by formula (1). (In formula (1), Ar1represents a divalent group that has an aromatic ring having 5 to 40 ring members; and X1represents a divalent group represented by formula (i).) (In formula (i), R1and R2 each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms, or these groups combine with each other to form a C3-20 divalent alicyclic hydrocarbon group together with the carbon atom to which these are bonded; and * and ** each denote a bonding hand in formula (1).)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C08G 8/02 - Condensation polymers of aldehydes or ketones with phenols only of ketones

52.

RESIST PATTERN FORMATION METHOD

      
Application Number JP2023032396
Publication Number 2024/070535
Status In Force
Filing Date 2023-09-05
Publication Date 2024-04-04
Owner JSR CORPORATION (Japan)
Inventor Maruyama,ken

Abstract

The purpose of the present invention is to provide a method for forming a resist pattern having excellent pattern rectangularity. Provided is a method for forming a resist pattern, the method comprising: a step for applying a resist underlayer film-forming composition onto a substrate directly or indirectly; a step for forming a metal-containing resist film on the resist underlayer film formed by the resist underlayer film-forming composition application step; a step for exposing the metal-containing resist film to light; a step for preparing a developer solution; and a step for dissolving a light-exposed part in the metal-containing resist film that has been exposed to light using the developer solution to form a resist pattern.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C08F 232/08 - Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • G03F 7/20 - Exposure; Apparatus therefor

53.

RESIST UNDERLAYER FILM-FORMING COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Application Number JP2023033814
Publication Number 2024/070786
Status In Force
Filing Date 2023-09-19
Publication Date 2024-04-04
Owner JSR CORPORATION (Japan)
Inventor
  • Yamada,shuhei
  • Dei,satoshi
  • Hayashi,yuya
  • Akita,shunpei
  • Yoneda,eiji

Abstract

Provided are: a resist underlayer film-forming composition which enables the formation of a resist underlayer film having excellent resist pattern rectangularity when the composition is exposed to extreme ultraviolet ray; and a method for manufacturing a semiconductor substrate using the composition. The resist underlayer film-forming composition is a composition for forming an underlayer film for a resist film which is subjected to the exposure to extreme ultraviolet ray, the composition comprising a compound having a iodine atom and a solvent, in which the compound having a iodine atom is a polymer having a repeating unit represented by formula (1), an aromatic-ring-containing compound having a iodine atom and having a molecular weight of 750 to 3000 inclusive, or a combination thereof, and the content ratio of the compound having a iodine atom in components other than the solvent in the underlayer film-forming composition is 50% by mass or more. (In formula (1), Ar1represents a bivalent group having a 5- to 40-membered aromatic ring; R0represents a hydrogen atom or a monovalent organic group having 1 to 40 carbon atoms; and R1represents a monovalent organic group having 1 to 40 carbon atoms; in which at least one of Ar1, R0and R1 has a iodine atom.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • G03F 7/004 - Photosensitive materials
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

54.

SEARCHING METHOD FOR FUNCTIONAL MOLECULE FOR CAUSING RESPONSE IN CELL

      
Application Number JP2023035799
Publication Number 2024/071424
Status In Force
Filing Date 2023-09-29
Publication Date 2024-04-04
Owner
  • KEIO UNIVERSITY (Japan)
  • JSR CORPORATION (Japan)
Inventor
  • Saya, Hideyuki
  • Kato, Shoichi
  • Ikemoto, Atsushi

Abstract

Provided is a vector or vector set for analyzing the function of a functional molecule, said vector or vector set comprising: a polynucleotide that codes for an expression system of a candidate molecule for the functional molecule; a polynucleotide that codes for a translation control sequence or a transcription control sequence which is activated by a response in a given cell; and a polynucleotide that codes for a reporter system which is operably linked with the translation control sequence or the transcription control sequence. Also provided is a searching method for a functional molecule which causes a response in a cell, said method comprising: introducing the vector or vector set into a cell; and measuring expression in the cell of a reporter system included in the vector or vector set.

IPC Classes  ?

  • C12N 5/10 - Cells modified by introduction of foreign genetic material, e.g. virus-transformed cells
  • C12N 15/09 - Recombinant DNA-technology
  • C12N 15/113 - Non-coding nucleic acids modulating the expression of genes, e.g. antisense oligonucleotides
  • C12N 15/12 - Genes encoding animal proteins
  • C12N 15/55 - Hydrolases (3)
  • C12N 15/63 - Introduction of foreign genetic material using vectors; Vectors; Use of hosts therefor; Regulation of expression
  • C12N 15/86 - Viral vectors

55.

SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND COMPOSITION

      
Application Number 18509611
Status Pending
Filing Date 2023-11-15
First Publication Date 2024-03-28
Owner JSR CORPORATION (Japan)
Inventor
  • Yoneda, Eiji
  • Abe, Takayoshi
  • Miyauchi, Hiroyuki

Abstract

A method for manufacturing a semiconductor substrate, includes: directly or indirectly applying a composition for forming a resist underlayer film to a substrate to form a resist underlayer film; applying a composition for forming a resist film to the resist underlayer film to form a resist film; exposing the resist film to radiation; and developing the exposed resist film. The composition for forming a resist underlayer film includes: a polymer; an acid generating agent; and a solvent. The resist underlayer film has a film thickness of 6 nm or less.

IPC Classes  ?

  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • G03F 7/20 - Exposure; Apparatus therefor
  • G03F 7/32 - Liquid compositions therefor, e.g. developers

56.

ANTIBACTERIAL COMPOSITION AND METHOD FOR DETERMINING ADMINISTRATION OF SAID ANTIBACTERIAL COMPOSITION TO SUBJECT

      
Application Number JP2023034260
Publication Number 2024/063132
Status In Force
Filing Date 2023-09-21
Publication Date 2024-03-28
Owner
  • JSR CORPORATION (Japan)
  • KEIO UNIVERSITY (Japan)
Inventor
  • Masuda Kanae
  • Aoto Yoshimasa
  • Isayama Jun
  • Ishikawa Hidefumi
  • Goji Hiroshi
  • Watanabe Kazuto
  • Kawasaki Hiroshi
  • Ito Yoshihiro
  • Amagai Masayuki

Abstract

Provided are an antibacterial composition containing bacteria that exhibit antibacterial properties against bacteria having a positive correlation with a SCORAD value indicating the severity of atopic dermatitis, and a method for determining the administration of said antibacterial composition to a subject. The present invention comprises an antibacterial composition that contains resident skin bacteria as an active ingredient, the antibacterial composition acting against pro-inflammatory bacteria (excluding the resident skin bacteria).

IPC Classes  ?

  • A61K 35/74 - Bacteria
  • A61P 17/00 - Drugs for dermatological disorders
  • C12Q 1/689 - Nucleic acid products used in the analysis of nucleic acids, e.g. primers or probes for detection or identification of organisms for bacteria

57.

RADIATION-SENSITIVE COMPOSITION, RESIST-PATTERN-FORMING METHOD, RADIATION-SENSITIVE ACID GENERATOR AND POLYMER

      
Application Number JP2023026224
Publication Number 2024/057701
Status In Force
Filing Date 2023-07-18
Publication Date 2024-03-21
Owner JSR CORPORATION (Japan)
Inventor
  • Taniguchi, Takuhiro
  • Kiriyama, Kazuya
  • Kinoshita, Natsuko
  • Nishikori, Katsuaki

Abstract

This radiation-sensitive composition comprises a polymer having an acid-dissociable group and a compound represented by formula (1). In formula (1), R5is a group obtained by removing (m+n+2) hydrogen atoms from a monocyclic or condensed aromatic hydrocarbon ring having r carbon atoms. L−33 −or –COO−. r is an integer of 6 to 14. A1is a single bond, –O–, –S– or –NR3–. R1is a hydrogen atom or a monovalent organic group. X1is a chlorine atom, a bromine atom or an iodine atom. m is an integer of 1 to (r–2). N is an integer of 0 to (r–3). R2is a substituted or unsubstituted monovalent hydrocarbon. M+ is a monovalent cation.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C08F 8/12 - Hydrolysis
  • C08F 20/22 - Esters containing halogen
  • C08F 20/38 - Esters containing sulfur
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/12 - Esters of monohydric alcohols or phenols
  • C09K 3/00 - Materials not provided for elsewhere
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor

58.

RADIOACTIVE-RAY-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD

      
Application Number JP2023028119
Publication Number 2024/057751
Status In Force
Filing Date 2023-08-01
Publication Date 2024-03-21
Owner JSR CORPORATION (Japan)
Inventor
  • Nishikori,katsuaki
  • Kiriyama,kazuya
  • Taniguchi,takuhiro
  • Kinoshita,natsuko

Abstract

Provided are: a radioactive-ray-sensitive resin composition that can exhibit sufficient levels of sensitivity and CDU performance when a next-generation technology is applied to the composition; and a pattern formation method. The radioactive-ray-sensitive resin composition comprises an onium salt compound containing a structure represented by formula (1), a resin containing a structure unit (I) having a phenolic hydroxyl group or a group capable of providing a phenolic hydroxyl group by the action of an acid, and a solvent. (In formula (1), Rf1and Rf2each independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a fluorine atom, or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms; R1, R2and R3122 each independently represent an integer of 0 to 4; X1and X2each independently represent an oxygen atom or a sulfur atom: L represents a substituted or unsubstituted bivalent hydrocarbon group having 1 to 10 carbon atoms; R4and R5each independently represent a hydrogen atom or a monovalent organic group having 1 to 40 carbon atoms; at least one of R4and R5represents a monovalent aromatic-ring-containing organic group containing a 5- to 40-membered aromatic ring; and Z+ represents a monovalent radioactive-ray-sensitive onium cation.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07D 317/24 - Radicals substituted by singly bound oxygen or sulfur atoms esterified
  • C08F 8/12 - Hydrolysis
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/12 - Esters of monohydric alcohols or phenols
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor

59.

RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN

      
Application Number 18235924
Status Pending
Filing Date 2023-08-21
First Publication Date 2024-03-21
Owner JSR CORPORATION (Japan)
Inventor
  • Nishikori, Katsuaki
  • Kawai, Takahiro

Abstract

A radiation-sensitive resin composition contains: a first polymer having a first structural unit including a partial structure obtained by substituting a hydrogen atom of a carboxy group or of a phenolic hydroxy group with an acid-labile group represented by formula (1); and a compound including: a monovalent radiation-sensitive onium cation moiety including an aromatic ring structure which includes a fluorine atom or a fluorine atom-containing group; and a monovalent organic acid anion moiety. Ar1 represents a group obtained by removing one hydrogen atom from a substituted or unsubstituted aromatic ring structure having 5 to 30 ring atoms; R 1 and R2 each independently represent a substituted or unsubstituted monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms; and * denotes a site bonding to an ethereal oxygen atom in the carboxy group or an oxygen atom in the phenolic hydroxy group. A radiation-sensitive resin composition contains: a first polymer having a first structural unit including a partial structure obtained by substituting a hydrogen atom of a carboxy group or of a phenolic hydroxy group with an acid-labile group represented by formula (1); and a compound including: a monovalent radiation-sensitive onium cation moiety including an aromatic ring structure which includes a fluorine atom or a fluorine atom-containing group; and a monovalent organic acid anion moiety. Ar1 represents a group obtained by removing one hydrogen atom from a substituted or unsubstituted aromatic ring structure having 5 to 30 ring atoms; R 1 and R2 each independently represent a substituted or unsubstituted monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms; and * denotes a site bonding to an ethereal oxygen atom in the carboxy group or an oxygen atom in the phenolic hydroxy group.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/004 - Photosensitive materials

60.

FOAMABLE PARTICLE PRODUCTION METHOD

      
Application Number JP2023030797
Publication Number 2024/057883
Status In Force
Filing Date 2023-08-25
Publication Date 2024-03-21
Owner JSP CORPORATION (Japan)
Inventor
  • Inoue Tsubasa
  • Hira Akinobu

Abstract

The present invention pertains to a method for producing foamable particles by using, as a base resin material, a mixture obtained by mixing a polypropylene-based resin A which is not a recovered material and a polypropylene-based resin B which is a recovered object of a post consumption material. Provided is a foamable particle production method that makes it possible to produce foamable particles in which variability in the foam expansion rate and reduction in the closed-cell rate are suppressed, and to have excellent appearance for a foamable particle molded body obtained by molding said foamable particles. In the foamable particle production method: a mixture obtained by mixing a polypropylene-based resin A having a melting point of 130-155°C and a polypropylene-based resin B which is a recovered object of a post consumption material is used as a base resin material; in the mixture, the blended proportion of the polypropylene-based resin A is 40-97 wt% and the blended proportion of the polypropylene-based resin B is 3-60 wt% (the total of the polypropylene-based resin A and the polypropylene-based resin B is 100 wt%); the melting point difference (melting point of the polypropylene-based resin B - melting point of the polypropylene-based resin A) between the polypropylene-based resin A and the polypropylene-based resin B is 10-30°C; the ash content of the polypropylene-based resin B is 5 wt% or less with respect to 100 wt% of the polypropylene-based resin B; and, regarding a melt peak indicated in a DSC curve obtained through thermal flux differential scanning calorimetry of the polypropylene-based resin B, the difference (Tme-Tms) between an extrapolated melting start temperature (Tms) and an extrapolated melting ending temperature (Tme) of the melt peak is 30°C or higher.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • B29C 44/00 - Shaping by internal pressure generated in the material, e.g. swelling or foaming

61.

EXPANDED POLYPROPYLENE RESIN BEADS AND EXPANDED POLYPROPYLENE RESIN BEADS MOLDED ARTICLE

      
Application Number 18240196
Status Pending
Filing Date 2023-08-30
First Publication Date 2024-03-14
Owner JSP Corporation (Japan)
Inventor
  • Yamasaki, Shobu
  • Ito, Yosuke

Abstract

An expanded polypropylene resin bead contains an inorganic pigment, a hindered amine compound, and an ultraviolet light absorber. The ultraviolet light absorber contains an ultraviolet light absorber A having a molecular weight of 360 or more, and a content of the ultraviolet light absorber A in the expanded polypropylene resin bead is 0.010% by mass or more and 2% by mass or less. An expanded polypropylene resin beads molded article is produced by in-mold molding of the expanded polypropylene resin bead.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
  • C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
  • C08J 9/232 - Forming foamed products by sintering expandable particles
  • C08K 13/02 - Organic and inorganic ingredients

62.

MANUFACTURING METHOD OF DISPLAY AND DISPLAY

      
Application Number 18275741
Status Pending
Filing Date 2022-01-31
First Publication Date 2024-03-14
Owner
  • JSR CORPORATION (Japan)
  • Mattrix Technologies, Inc (USA)
Inventor
  • Katsui, Hiromitsu
  • Liu, Bo
  • Lemaitre, Maxime

Abstract

Provided is a manufacturing method of a display including a vertical organic light-emitting transistor in which a wider light-emitting area is secured while manufacturing time and manufacturing cost are suppressed. In the manufacturing method of the display including the vertical organic light-emitting transistor, a gate electrode layer of the vertical organic light-emitting transistor and one of current-carrying electrode layers of a thin-film transistor connected to the gate electrode layer of the vertical organic light-emitting transistor are formed integrally in the same layer.

IPC Classes  ?

  • H10K 59/121 - Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
  • H10K 59/12 - Active-matrix OLED [AMOLED] displays

63.

POLYMER, COMPOSITION, CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT

      
Application Number JP2023027900
Publication Number 2024/053282
Status In Force
Filing Date 2023-07-31
Publication Date 2024-03-14
Owner JSR CORPORATION (Japan)
Inventor
  • Kawashima Naoyuki
  • Satonaka Eri
  • Anabuki Shoma

Abstract

One embodiment of the present invention relates to a polymer, a composition, a cured product, a laminate, and an electronic device. The polymer has a repeating structural unit represented by formula (1). [R11represents a divalent substituted or unsubstituted nitrogen-containing heteroaromatic ring, R12independently represent a divalent substituted or unsubstituted aromatic hydrocarbon group, R13represents a C1-20 hydrocarbon group to which at least one group represented by formula (a1) other than the two R12is bonded, X1independently represent -O-, -S-, or -N(R14)-, * represents a bond to R13, and ** represents a bond with another structural unit in polymer (A).]

IPC Classes  ?

  • C08G 65/34 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • C08F 12/34 - Monomers containing two or more unsaturated aliphatic radicals
  • C08F 290/06 - Polymers provided for in subclass
  • C08K 5/00 - Use of organic ingredients
  • C08L 25/18 - Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
  • C08L 101/02 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups

64.

ADDITIVES FOR METAL OXIDE PHOTORESISTS, POSITIVE TONE DEVELOPMENT WITH ADDITIVES, AND DOUBLE BAKE DOUBLE DEVELOP PROCESSING

      
Application Number 18233932
Status Pending
Filing Date 2023-08-15
First Publication Date 2024-03-14
Owner
  • Inpria Corporation (USA)
  • JSR Corporation (Japan)
Inventor
  • Kasahara, Kazuki
  • Cardineau, Brian J.
  • Jiang, Kai
  • Meyers, Stephen T.
  • Narasimhan, Amrit N.
  • Voss, Matthew

Abstract

A method for patterning a radiation sensitive material on a substrate involves the development of a material on a substrate based on a latent image in the material with irradiated regions and non-irradiated regions to form a physically patterned material on the substrate, in which the material comprises an organotin radiation sensitive patterning material and an additive. The additive is a photoacid generator, a quencher or a mixture thereof. Patterning improvements can be achieved using a series of a baking and development step followed by a second baking at a higher temperature and a second development step following the second baking step. A precursor solution for forming an organometallic radiation patterning material can comprise an organic solvent, a dissolved organotin composition having C—Sn bonds that can cleave in response to EUV radiation, and a quencher. The additive can comprise an onium cation.

IPC Classes  ?

65.

POLYMER, COMPOSITION, CURED PRODUCT, AND DISPLAY ELEMENT

      
Application Number JP2023032771
Publication Number 2024/053722
Status In Force
Filing Date 2023-09-08
Publication Date 2024-03-14
Owner JSR CORPORATION (Japan)
Inventor
  • Murakami Yoshitaka
  • Kashishita Kouji

Abstract

One embodiment of the present invention relates to a polymer, a composition, a cured product, or a display element. The composition comprises a polymer having a structural unit represented by formula (1). [In formula (1), A is a divalent group having an aromatic heterocyclic ring, B is a divalent group having an aromatic ring or an aromatic heterocyclic ring and having an alkali-soluble group, and X is independently -O-, -NH- or -S-.]

IPC Classes  ?

  • C08L 101/02 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups
  • C08G 65/34 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
  • G03F 7/023 - Macromolecular quinonediazides; Macromolecular additives, e.g. binders
  • G03F 7/032 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
  • G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

66.

JSR MOR

      
Serial Number 79394904
Status Pending
Filing Date 2024-03-12
Owner JSR CORPORATION (Japan)
NICE Classes  ? 01 - Chemical and biological materials for industrial, scientific and agricultural use

Goods & Services

Industrial chemicals; chemical preparations for use in photography; photoresists.

67.

COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND POLISHING METHOD

      
Application Number JP2023029521
Publication Number 2024/048271
Status In Force
Filing Date 2023-08-15
Publication Date 2024-03-07
Owner JSR CORPORATION (Japan)
Inventor
  • Yamada, Yuya
  • Kao, Shen-Yuan

Abstract

Provided are: a composition for chemical mechanical polishing; and a polishing method using the same. The composition allows rapid polishing of a polishing surface that contains a silver material for wiring, and makes it possible to obtain a polished surface having a high reflective property. This composition for chemical mechanical polishing comprises (A) abrasive grains, (B) a liquid medium, (C) an oxidizing agent, and (D) a nitrogen-containing hetrocyclic compound. The absolute value of the zeta potential of the (A) component of the composition for chemical mechanical polishing is 10 mV or more. When the content of the (C) component is noted as Mc (mass%) and the content of the (D) component is noted as Md (mass%), Mc/Md is 10 to 200.

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
  • B24B 37/00 - Lapping machines or devices; Accessories
  • C09G 1/02 - Polishing compositions containing abrasives or grinding agents
  • C09K 3/14 - Anti-slip materials; Abrasives

68.

FOAM PARTICLE, AND FOAM PARTICLE MOLDED ARTICLE

      
Application Number JP2023029853
Publication Number 2024/048327
Status In Force
Filing Date 2023-08-18
Publication Date 2024-03-07
Owner JSP CORPORATION (Japan)
Inventor
  • Yamasaki Shobu
  • Ito Yosuke

Abstract

122 each independently represent a hydrocarbon group or a hydrocarbon group bonded via an oxygen atom.)

IPC Classes  ?

69.

MICROBIAL CARRIER FOR FOOD WASTE TREATMENT

      
Application Number JP2023030990
Publication Number 2024/048520
Status In Force
Filing Date 2023-08-28
Publication Date 2024-03-07
Owner JSP CORPORATION (Japan)
Inventor
  • Iwayama Yoshihiro
  • Sunaga Keisuke

Abstract

A microbial carrier for a food waste treatment, wherein: a base resin constituting the microbial carrier contains a thermoplastic starch and/or an aliphatic polyester; the biodegradability of the microbial carrier in a biodegradability test according to JIS K6953 is 60% or more; and the shape of the microbial carrier is columnar.

IPC Classes  ?

  • C08J 9/04 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
  • C12N 1/00 - Microorganisms, e.g. protozoa; Compositions thereof; Processes of propagating, maintaining or preserving microorganisms or compositions thereof; Processes of preparing or isolating a composition containing a microorganism; Culture media therefor

70.

Polyethylene Resin Foamed Particle, and Method for Producing Same

      
Application Number 18549026
Status Pending
Filing Date 2022-03-03
First Publication Date 2024-03-07
Owner JSP CORPORATION (Japan)
Inventor
  • Hayashi, Tatsuya
  • Hira, Akinobu

Abstract

Polyethylene resin foamed particles according to the present invention are obtained by using, as a base material resin, a non-crosslinked linear low density polyethylene. The linear low density polyethylene is a copolymer of ethylene and an α-olefin having 8 carbon atoms, and has a melt flow rate and a density in specified ranges. The foamed particle has an average foam size within a specified range, and has a crystal structure that causes an intrinsic peak and a high temperature peak to appear in the first round of a DSC curve obtained under a specific condition. The total fusion heat quantity (ΔH1) determined from the sum total of a fusion heat quantity (ΔHi) of the intrinsic peak and the fusion heat quantity (ΔHh) of the high temperature peak is within a specified range.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • B29C 44/34 - Component parts, details or accessories; Auxiliary operations

71.

MANUFACTURING METHOD FOR CONDUCTIVE FILM, LIQUID DISPERSION, RADIATION-SENSITIVE RESIN COMPOSITION, AND LIGHT EMITTING ELEMENT

      
Application Number JP2023029520
Publication Number 2024/048270
Status In Force
Filing Date 2023-08-15
Publication Date 2024-03-07
Owner JSR CORPORATION (Japan)
Inventor
  • Ichinohe,daigo
  • Katsui,hiromitsu
  • Yasuda,hiroyuki

Abstract

The present invention provides a manufacturing method for a conductive film that has high conductivity and makes it possible to evenly fix a conductive carbon material over the entirety of a conductive film formation region. The present invention also provides a manufacturing method wherein it is possible to efficiently remove a dispersant that has remained in the conductive film, as well as a polymer that is in a section where a radiation-sensitive resin composition has not been subjected to light exposure. The present invention includes: a step (A) in which a liquid dispersion is applied on a main surface of a substrate and dried to form a first film, said liquid dispersion including a carbon material and a first polymer that has one type of functional group among a carboxyl group, a hydroxyl group, and a phenolic hydroxyl group; a step (B) in which a radiation-sensitive resin composition is applied on the first film to form a second film, said radiation-sensitive resin composition having an acid generating agent and a second polymer that has one type of functional group among a carboxyl group, a hydroxyl group, and a phenolic hydroxyl group; a step (C) in which the second film is exposed to light; and a step (D) in which, after the step (C), the first polymer and the second polymer are removed by developing.

IPC Classes  ?

  • B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
  • B05D 1/36 - Successively applying liquids or other fluent materials, e.g. without intermediate treatment
  • B05D 3/06 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
  • B05D 3/10 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
  • B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
  • C09D 5/24 - Electrically-conducting paints
  • C09D 179/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • H05B 33/28 - Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode of translucent electrodes
  • H10K 50/10 - OLEDs or polymer light-emitting diodes [PLED]

72.

ADDITIVES FOR METAL OXIDE PHOTORESISTS, POSITIVE TONE DEVELOPMENT WITH ADDITIVES, AND DOUBLE BAKE DOUBLE DEVELOP PROCESSING

      
Application Number US2023030198
Publication Number 2024/039626
Status In Force
Filing Date 2023-08-15
Publication Date 2024-02-22
Owner
  • INPRIA CORPORATION (USA)
  • JSR CORPORATION (Japan)
Inventor
  • Kasahara, Kazuki
  • Cardineau, Brian J.
  • Jiang, Kai
  • Meyers, Stephen T.
  • Narasimhan, Amrit K.
  • Voss, Matthew

Abstract

A method for patterning a radiation sensitive material on a substrate involves the development of a material on a substrate based on a latent image in the material with irradiated regions and non-irradiated regions to form a physically patterned material on the substrate, in which the material comprises an organotin radiation sensitive patterning material and an additive. The additive is a photoacid generator, a quencher or a mixture thereof. Patterning improvements can be achieved using a series of a baking and development step followed by a second baking at a higher temperature and a second development step following the second baking step. A precursor solution for forming an organometallic radiation patterning material can comprise an organic solvent, a dissolved organotin composition having C-Sn bonds that can cleave in response to EUV radiation, and a quencher. The additive can comprise an onium cation.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/32 - Liquid compositions therefor, e.g. developers
  • G03F 7/38 - Treatment before imagewise removal, e.g. prebaking
  • G03F 7/42 - Stripping or agents therefor
  • G03F 7/20 - Exposure; Apparatus therefor

73.

SEMICONDUCTOR SUBSTRATE PRODUCTION METHOD AND FILM FORMING COMPOSITION

      
Application Number JP2023025616
Publication Number 2024/034311
Status In Force
Filing Date 2023-07-11
Publication Date 2024-02-15
Owner JSR CORPORATION (Japan)
Inventor
  • Hirasawa,kengo
  • Takada,kazuya
  • Ozaki,yuki
  • Kimata,hironori
  • Serizawa,ryuichi

Abstract

Provided are a semiconductor substrate production method and film forming composition which are capable of forming a film having excellent etching resistance and excellent embedding properties. This semiconductor substrate production method involves a step for applying a film forming composition onto a substrate, wherein the film forming composition contains a metal compound, an aromatic compound, and a solvent; the aromatic compound has an aromatic hydrocarbon ring structure and a partial structure represented by formula (1) below; and the aromatic hydrocarbon ring structure has 6 or more carbon atoms. [Formula 1] (In formula (1), X is a group represented by formula (i), (ii), (iii), or (iv) below; and symbols * are sites binding respectively to adjacent two carbon atoms constituting the aromatic hydrocarbon ring structure.) [Formula 2] (In formula (i), R1is a hydrogen atom or a monovalent organic group having 1-20 carbon atoms, and R2is a monovalent organic group having 1-20 carbon atoms. In formula (ii), R3is a hydrogen atom or a monovalent organic group having 1-20 carbon atoms, and R4is a monovalent organic group having 1-20 carbon atoms. In formula (iii), R5is a monovalent organic group having 1-20 carbon atoms. In formula (iv), R6 is a monovalent organic group having 1-20 carbon atoms.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • H01L 21/3065 - Plasma etching; Reactive-ion etching

74.

COMPOSITION, COMPOUND, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Application Number JP2023025665
Publication Number 2024/029292
Status In Force
Filing Date 2023-07-12
Publication Date 2024-02-08
Owner JSR CORPORATION (Japan)
Inventor
  • Abe,shinya
  • Katagiri,takashi
  • Naganawa,atsuko
  • Yamada,shuhei
  • Nakatsu,hiroki
  • Miyauchi,hiroyuki

Abstract

The purpose of the present invention is to provide a method for manufacturing a semiconductor substrate using a composition capable of forming a film having excellent etching resistance; and to provide said composition. The composition according to the present invention comprises a solvent and a compound having a partial structure represented by formula (1) below, wherein the molecular weight of the compound is greater than or equal to 600. (In formula (1), Ar1is a substituted or unsubstituted monovalent aromatic group having 5-30 ring members. n is an integer of 1-3. Ar2is a portion of a substituted or unsubstituted aromatic ring structure having 5-60 ring members and is formed together with two adjacent carbon atoms in formula (1). X1 represents a single bond or a divalent linking group .Each * is a bonding site with the two adjacent carbon atoms constituting the substituted or unsubstituted aromatic ring having 5-60 ring members. ** is a bonding site with a portion other than the partial structure represented by formula (1) in the abovementioned compound. r is an integer of 0-4.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C07C 13/58 - Completely or partially hydrogenated anthracenes
  • C07C 13/62 - Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with condensed rings with more than three condensed rings
  • C07C 13/66 - Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with condensed rings with more than three condensed rings the condensed ring system contains only four rings
  • C07C 39/17 - Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings containing other rings in addition to the six-membered aromatic rings
  • C07D 487/04 - Ortho-condensed systems
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

75.

METHOD FOR PRODUCING CARRIER FOR CHROMATOGRAPHY, AND CARRIER FOR CHROMATOGRAPHY

      
Application Number JP2023027099
Publication Number 2024/029394
Status In Force
Filing Date 2023-07-25
Publication Date 2024-02-08
Owner JSR CORPORATION (Japan)
Inventor
  • Inoue, Yukiya
  • Miyajima, Ken
  • Kamide, Tomoyuki
  • Noguchi, Hiroshi
  • Nakamura, Satoshi

Abstract

The present invention provides a carrier which is for chromatography, which has a large dynamic binding capacity with respect to an antibody or a fragment thereof, and through which a protein ligand is unlikely to leak even when the carrier is repeatedly used for isolation of an antibody. Provided is a method for producing a carrier for chromatography, said method comprising the following steps A-1 and B. (Step A-1) A step for immobilizing, to porous particles, one or more ligands selected from protein A, protein G, protein L, and analogues thereof. (Step B) A step for reacting the porous particles to which the one or more ligands have been immobilized in the step A-1 and a compound which has at least one ligand reactive group selected from groups represented by -C(=O)-O-C(=O)-, carbodiimide groups, and cyclic ether groups.

IPC Classes  ?

  • C07K 1/22 - Affinity chromatography or related techniques based upon selective absorption processes
  • C07K 16/00 - Immunoglobulins, e.g. monoclonal or polyclonal antibodies
  • B01D 15/38 - Selective adsorption, e.g. chromatography characterised by the separation mechanism involving specific interaction not covered by one or more of groups , e.g. affinity, ligand exchange or chiral chromatography
  • B01J 20/24 - Naturally occurring macromolecular compounds, e.g. humic acids or their derivatives
  • B01J 20/281 - Sorbents specially adapted for preparative, analytical or investigative chromatography
  • B01J 20/30 - Processes for preparing, regenerating or reactivating
  • C07K 14/31 - Peptides having more than 20 amino acids; Gastrins; Somatostatins; Melanotropins; Derivatives thereof from bacteria from Micrococcaceae (F) from Staphylococcus (G)

76.

THERAPEUTIC AGENT FOR OVARIAN CLEAR CELL CARCINOMA

      
Application Number JP2023028482
Publication Number 2024/029608
Status In Force
Filing Date 2023-08-03
Publication Date 2024-02-08
Owner
  • JSR CORPORATION (Japan)
  • KEIO UNIVERSITY (Japan)
Inventor
  • Ookubo Aki
  • Chiyoda Tatsuyuki
  • Yoshimura Takuma

Abstract

Provided is a therapeutic agent that is effective for the treatment of ovarian clear cell carcinoma. The therapeutic agent for ovarian clear cell carcinoma contains a proteasome inhibitor as an active ingredient. Moreover, said proteasome inhibitor is a substance that reversibly or irreversibly binds to the 20s β5 subunit of a proteasome and inhibits chymotrypsin-like activity. Furthermore, said proteasome is 26s proteasome. The content ratio of the proteasome inhibitor in the therapeutic agent for ovarian clear cell carcinoma is 80 mass% or greater, 90 mass% or greater, or 100 mass%.

IPC Classes  ?

  • A61K 45/00 - Medicinal preparations containing active ingredients not provided for in groups
  • A61P 15/00 - Drugs for genital or sexual disorders; Contraceptives
  • A61P 35/00 - Antineoplastic agents
  • A61K 31/69 - Boron compounds

77.

POLYETHYLENE-BASED RESIN MULTILAYER FOAM SHEET AND METHOD FOR PRODUCING SAME

      
Application Number 18258874
Status Pending
Filing Date 2021-10-01
First Publication Date 2024-02-08
Owner JSP CORPORATION (Japan)
Inventor
  • Kakuta, Hirotoshi
  • Fujita, Mikidai
  • Katsuyama, Naoya

Abstract

A polyethylene-based resin multilayer foam sheet may include a polyethylene-based resin foam layer containing a polyethylene-based resin (A) as a base resin, and a conductive layer laminated on at least one side of the foam layer. The conductive layer contains: a mixed resin of one or more polyethylenes (B) of low-density polyethylenes and/or linear low-density polyethylenes and an ethylene-based copolymer (C) having a structural unit derived from ethylene and a structural unit derived from a monomer having a polar group; and conductive carbon. The conductive carbon blended in the conductive layer may be in a range of from 3 to 15 wt. %. The difference, TmB−TmC, between the melting point TmB of the polyethylene (B) and the melting point TmC of the ethylene-based copolymer (C) each contained in the conductive layer may be in a range of from 30 to 80° C.

IPC Classes  ?

  • B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • B32B 37/15 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
  • B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material

78.

POLYAMIDE-BASED RESIN FOAM PARTICLE AND POLYAMIDE-BASED RESIN FOAM PARTICLE MOLDED ARTICLE

      
Application Number JP2023027244
Publication Number 2024/029407
Status In Force
Filing Date 2023-07-25
Publication Date 2024-02-08
Owner JSP CORPORATION (Japan)
Inventor Suenaga Katsuyuki

Abstract

Provided are polyamide-based resin foam particles comprising a polyamide-based resin as a base material resin, the foam particles containing carbon nanotubes, wherein the closed-cell ratio of the foam particles is 70% or more.

IPC Classes  ?

79.

RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND RADIATION-SENSITIVE ACID GENERATOR

      
Application Number JP2023027258
Publication Number 2024/024801
Status In Force
Filing Date 2023-07-25
Publication Date 2024-02-01
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Miyake, Masayuki
  • Mita, Michihiro
  • Miyao, Kensuke
  • Okazaki, Satoshi

Abstract

This radiation-sensitive composition comprises a polymer having an acid-dissociable group and a compound represented by formula (1). L1represents a group having a (thio)acetal ring or the like. W1represents a single bond or a (b+1)-valent organic group having 1 to 40 carbon atoms. R1, R2, and R3each independently represent a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, a fluorine atom, or a fluoroalkyl group. Rfrepresents a fluorine atom, or a fluoroalkyl group. a represents an integer of 0 to 8. b represents an integer of 1 to 4. d represents 1 or 2. When a represents 2 or more, a plurality of R1are same or different, and a plurality of R2are same or different. When d represents 2, a plurality of W1are same or different, and a plurality of b are same or different. M+ represents a monovalent cation.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 381/12 - Sulfonium compounds
  • C09K 3/00 - Materials not provided for elsewhere
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor

80.

POLYAMIDE RESIN FOAM PARTICLES

      
Application Number JP2023026977
Publication Number 2024/024716
Status In Force
Filing Date 2023-07-24
Publication Date 2024-02-01
Owner JSP CORPORATION (Japan)
Inventor Yamanaka Ryo

Abstract

The present invention provides polyamide resin foam particles which use, as a base material resin, a mixed resin of a polyamide resin A and a polyamide resin B, wherein: the polyamide resin A is an aliphatic polyamide; the polyamide resin B is a xylylene group-containing polyamide resin; and the mass ratio ((polyamide resin A):(polyamide resin B)) of the polyamide resin A to the polyamide resin B is 97:3 to 60:40.

IPC Classes  ?

  • C08J 9/16 - Making expandable particles
  • C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

81.

POLYPROPYLENE-BASED RESIN EXPANDED BEADS AND MOLDED ARTICLE THEREOF

      
Application Number 18217651
Status Pending
Filing Date 2023-07-03
First Publication Date 2024-01-25
Owner JSP CORPORATION (Japan)
Inventor Masumoto, Hisashi

Abstract

An expanded bead of polypropylene-based resin formed with a through hole that is defined by an inner peripheral surface and that has an average hole diameter of 1 mm or less. The expanded bead has a closed cell content of 85% or more, an average cell diameter of 50 to 300 μm and an inner surface portion that extends along the inner peripheral surface that has an average cell diameter of 5 to 150 μm which is smaller than the average cell diameter of the expanded bead.

IPC Classes  ?

  • B29C 44/44 - Feeding the material to be shaped into a closed space, i.e. to make articles of definite length in the form of expandable particles or beads

82.

POLYMER, COMPOSITION, CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT

      
Application Number 18373415
Status Pending
Filing Date 2023-09-27
First Publication Date 2024-01-25
Owner JSR CORPORATION (Japan)
Inventor
  • Kawashima, Naoyuki
  • Yamashita, Yuutoku
  • Anabuki, Shoma
  • Kameyama, Takeru
  • Nishino, Kenta
  • Shinohara, Arata
  • Fujitomi, Shintarou

Abstract

One embodiment of the present invention relates to a polymer, a composition, a cured product, a laminate, or an electronic component, and the polymer has a repeating structural unit represented by Formula (1) and has a group Y represented by Formula (a) at a terminal: One embodiment of the present invention relates to a polymer, a composition, a cured product, a laminate, or an electronic component, and the polymer has a repeating structural unit represented by Formula (1) and has a group Y represented by Formula (a) at a terminal: wherein X's are each independently —O—, —S—, or —N(R3)—, R3 is a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 20 carbon atoms, or a group obtained by substituting a part of the hydrocarbon group or the halogenated hydrocarbon group with at least one selected from an oxygen atom and a sulfur atom, R1 is a divalent organic group, and R2 is a divalent unsubstituted or substituted nitrogen-containing heteroaromatic ring; One embodiment of the present invention relates to a polymer, a composition, a cured product, a laminate, or an electronic component, and the polymer has a repeating structural unit represented by Formula (1) and has a group Y represented by Formula (a) at a terminal: wherein X's are each independently —O—, —S—, or —N(R3)—, R3 is a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 20 carbon atoms, or a group obtained by substituting a part of the hydrocarbon group or the halogenated hydrocarbon group with at least one selected from an oxygen atom and a sulfur atom, R1 is a divalent organic group, and R2 is a divalent unsubstituted or substituted nitrogen-containing heteroaromatic ring; —Y  (a) wherein Y is a group containing an ethylenically unsaturated double bond and having 3 to 50 carbon atoms, an unsubstituted or substituted aromatic hydrocarbon group having 6 to 50 carbon atoms, an unsubstituted or substituted aliphatic hydrocarbon group having 3 to 50 carbon atoms, or an unsubstituted nitrogen-containing heteroaromatic ring, and when the aromatic hydrocarbon group or the aliphatic hydrocarbon group has a substituent, the substituent is a group other than a hydroxy group.

IPC Classes  ?

  • C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
  • C08G 65/48 - Polymers modified by chemical after-treatment
  • C08K 5/3415 - Five-membered rings
  • C08K 5/14 - Peroxides
  • C08K 3/36 - Silica
  • H05K 1/03 - Use of materials for the substrate

83.

PHOTOCATALYTIC SYNTHESIS OF ALPHA, BETA UNSATURATED CARBONYL COMPOUNDS AND THEIR INTERMEDIATES

      
Application Number US2022037417
Publication Number 2024/019698
Status In Force
Filing Date 2022-07-18
Publication Date 2024-01-25
Owner
  • JSR CORPORATION (Japan)
  • NEW IRIDIUM INC. (USA)
Inventor
  • Suguri, Takuya
  • Maruyama, Youichirou
  • Lim, Chern-Hooi
  • Qian, Gang
  • Liu, Yue
  • Cope, Elana

Abstract

Described herein is a process of producing α,β unsaturated acids and amides and their intermediates via a photocatalytic reaction in the presence of a photocatalyst, oxygen, and optionally a solvent. The photocatalyst contains a tungstic acid or a salt of a tungstic acid. The process is simple, clean, and energy efficient, and provides good conversion, good selectivity, good turnover, and easy purification of end products.

IPC Classes  ?

  • C07C 51/367 - Preparation of carboxylic acids or their salts, halides, or anhydrides by reactions not involving formation of carboxyl groups by introduction of functional groups containing oxygen only in singly bound form
  • C07C 51/377 - Preparation of carboxylic acids or their salts, halides, or anhydrides by reactions not involving formation of carboxyl groups by hydrogenolysis of functional groups
  • C07C 407/00 - Preparation of peroxy compounds
  • C07C 409/04 - Peroxy compounds the —O—O— group being bound between a carbon atom, not further substituted by oxygen atoms, and hydrogen, i.e. hydroperoxides the carbon atom being acyclic
  • C07C 57/04 - Acrylic acid; Methacrylic acid
  • C07C 59/01 - Saturated compounds having only one carboxyl group and containing hydroxy or O-metal groups

84.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION

      
Application Number 18374041
Status Pending
Filing Date 2023-09-28
First Publication Date 2024-01-25
Owner JSR CORPORATION (Japan)
Inventor
  • Maruyama, Ken
  • Abe, Takayoshi
  • Sakai, Kazunori

Abstract

A method for manufacturing a semiconductor substrate includes forming a resist underlayer film directly or indirectly on a substrate by applying a composition for forming a resist underlayer film. A metal-containing resist film is formed on the resist underlayer film. The metal-containing resist film is exposed. A part of the exposed metal-containing resist film is volatilized to form a resist pattern.

IPC Classes  ?

  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • G03F 7/004 - Photosensitive materials

85.

METHOD FOR PRODUCING FOAM BLOW MOLDED BODY, AND FOAM BLOW MOLDED BODY

      
Application Number JP2023026245
Publication Number 2024/019042
Status In Force
Filing Date 2023-07-18
Publication Date 2024-01-25
Owner JSP CORPORATION (Japan)
Inventor
  • Gomibuchi Masahiro
  • Noro Jinichiro

Abstract

The present invention provides a method for producing a foam blow molded body, the method comprising a step for blow molding a foamed parison that is obtained by foaming a mixed resin of a polyolefin resin (A) and an olefin-based thermoplastic elastomer (B). With respect to this method for producing a foam blow molded body, the polyolefin resin (A) is composed of a branched homopolypropylene (a1) and a linear block polypropylene (a2); the mass ratio ((a1):(a2)) of the branched homopolypropylene (a1) to the linear block polypropylene (a2) is 50:50 to 93:7; the olefin-based thermoplastic elastomer (B) is a hydrogenated product of a triblock copolymer that is composed of a crystalline olefin polymer block and a polymer block of a conjugated diene compound; and the added amount of the olefin-based thermoplastic elastomer (B) relative to 100 parts by mass of the polyolefin resin (A) is 20 parts by mass to 40 parts by mass in the mixed resin.

IPC Classes  ?

  • C08J 9/04 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
  • B29C 44/00 - Shaping by internal pressure generated in the material, e.g. swelling or foaming
  • B29C 49/04 - Extrusion blow-moulding

86.

METHOD FOR MANUFACTURING LAMINATE

      
Application Number 18033741
Status Pending
Filing Date 2021-10-08
First Publication Date 2024-01-18
Owner JSP Corporation (Japan)
Inventor
  • Hisamatsu, Katsunori
  • Hashimoto, Keiichi

Abstract

The present invention relates to a method for producing a laminate, wherein the laminate is obtained by integrally laminating an expanded beads molded article (a) composed of expanded beads A and having interconnected voids and an expanded beads molded article (b) composed of expanded particles B and having interconnected voids, the difference [Pb−Pa] between the voidage (Pa) of the expanded beads molded article (a) and the voidage (Pb) of the expanded beads molded article (b) is 5% or more, and the expanded beads A and the expanded beads B satisfy the following (1) to (3): (1) a difference [dB−dA] between an average hole diameter (dA) of the through-holes of the expanded beads (A) and an average hole diameter (dB) of the through-holes of the expanded beads (B) is 0.3 mm or more and 2 mm or less; (2) the expanded beads (B) have an average outer diameter DB of 3.5 mm or more and 5 mm or less; (3) a difference [DB−DA] between an average outer diameter DA of the expanded beads (A) and an average outer diameter DB of the expanded beads (B) is −0.3 mm or more and 2 mm or less.

IPC Classes  ?

  • B29C 44/20 - Shaping by internal pressure generated in the material, e.g. swelling or foaming for articles of indefinite length
  • B29K 23/00 - Use of polyalkenes as moulding material
  • B29K 105/04 - Condition, form or state of moulded material cellular or porous

87.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION

      
Application Number 18372163
Status Pending
Filing Date 2023-09-25
First Publication Date 2024-01-18
Owner JSR CORPORATION (Japan)
Inventor
  • Maruyama, Ken
  • Abe, Takayoshi
  • Sakai, Kazunori

Abstract

A method for manufacturing a semiconductor substrate includes forming a resist underlayer film directly or indirectly on a substrate by applying a composition for forming a resist underlayer film. A metal-containing resist film is formed on the resist underlayer film. The metal-containing resist film is exposed. An exposed portion of the exposed metal-containing resist film is dissolved with a developer to form a resist pattern.

IPC Classes  ?

  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • H01L 21/311 - Etching the insulating layers
  • G03F 7/16 - Coating processes; Apparatus therefor
  • G03F 7/004 - Photosensitive materials
  • G03F 7/20 - Exposure; Apparatus therefor

88.

THERMOPLASTIC RESIN EXPANDED BEAD AND MOLDED ARTICLE OF THERMOPLASTIC RESIN EXPANDED BEADS

      
Application Number 18349308
Status Pending
Filing Date 2023-07-10
First Publication Date 2024-01-18
Owner JSP CORPORATION (Japan)
Inventor
  • Sakamura, Takumi
  • Ohta, Hajime

Abstract

A thermoplastic resin expanded bead and a molded article composed of the thermoplastic resin expanded beads are provided. The expanded bead includes a foam layer containing a thermoplastic resin. The expanded bead has a columnar shape, and has two or more and eight or less through-holes penetrating in the axial direction thereof. A ratio Ct/A of a total cross-sectional area Ct of the through-holes to a cross-sectional area A of the expanded bead in a cut surface obtained by cutting the expanded bead along a plane perpendicular to the axial direction at the center in the axial direction is 0.02 or more and 0.15 or less.

IPC Classes  ?

89.

COMPOSITION FOR 3D PRINTING SUPPORT OR 3D CELL CULTURE SUPPORT

      
Application Number JP2023024928
Publication Number 2024/014377
Status In Force
Filing Date 2023-07-05
Publication Date 2024-01-18
Owner JSR CORPORATION (Japan)
Inventor
  • Akiyama, Minato
  • Kobayashi, Kunihiko

Abstract

Provided is a composition that has exceptional salt resistance and is useful as a 3D printing support or a 3D cell culture support. A composition for a 3D printing support or a 3D cell culture support, the composition containing component (A) and component (B). (A) A polymer having structural units represented by formula (1). (B) An aqueous medium. [In formula (1), R1and R2each independently represent a hydrogen atom or a C1-10 alkyl group, or R1and R2 may bond to each other to form a C3-10 ring structure.]

IPC Classes  ?

  • C12M 3/00 - Tissue, human, animal or plant cell, or virus culture apparatus
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 70/00 - Materials specially adapted for additive manufacturing
  • B33Y 80/00 - Products made by additive manufacturing
  • C08F 126/00 - Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
  • C08L 39/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocycli; Compositions of derivatives of such polymers
  • C12N 5/071 - Vertebrate cells or tissues, e.g. human cells or tissues

90.

METHOD FOR PRODUCING TWO-DIMENSIONAL SMALL INTESTINAL ORGANOIDS HAVING VILLUS STRUCTURE

      
Application Number 18039534
Status Pending
Filing Date 2021-12-03
First Publication Date 2024-01-11
Owner
  • KEIO UNIVERSITY (Japan)
  • JSR CORPORATION (Japan)
Inventor
  • Sato, Toshiro
  • Sugimoto, Shinya
  • Arai, Kazuya

Abstract

A method for producing a two-dimensional small intestinal organoid having a villus structure, the method including a step 1 of culturing a cell derived from a small intestinal epithelium in an extracellular matrix to obtain a three-dimensional small intestinal organoid, a step 2 of dispersing the three-dimensional small intestinal organoid and monolayer culturing on the extracellular matrix to obtain a two-dimensional small intestinal organoid, and a step 3 of further culturing the two-dimensional small intestinal organoid while letting a culture medium of the two-dimensional small intestinal organoid to flow so that the two-dimensional small intestinal organoid forms a villus structure.

IPC Classes  ?

  • G01N 33/50 - Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
  • C12N 5/071 - Vertebrate cells or tissues, e.g. human cells or tissues

91.

FOAM PARTICLE MOULDED ARTICLE, SOLE CUSHION, AND METHOD FOR PRODUCING FOAM PARTICLES

      
Application Number 18368441
Status Pending
Filing Date 2023-09-14
First Publication Date 2024-01-04
Owner JSP Corporation (Japan)
Inventor
  • Takagi, Shota
  • Oikawa, Masaharu

Abstract

The present invention relates to an in-mold expanded beads molded article of expanded beads of an olefin thermoplastic elastomer, a cushion for shoe sole, and a method of producing expanded beads provided with through-holes and composed of a block copolymer of a polyethylene block and an ethylene/α-olefin copolymer block, and with respect to the in-mold expanded beads molded article of expanded beads of an olefin thermoplastic elastomer, a voidage of the expanded beads molded article is 5 to 40%; a density of the expanded beads molded article is 30 to 150 g/L; and a flexural modulus of the olefin thermoplastic elastomer that constitutes the expanded beads molded article is 10 to 100 MPa.

IPC Classes  ?

  • C08J 9/232 - Forming foamed products by sintering expandable particles
  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08L 53/00 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
  • C08J 9/228 - Forming foamed products

92.

RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERN

      
Application Number 18025989
Status Pending
Filing Date 2021-08-03
First Publication Date 2024-01-04
Owner JSR CORPORATION (Japan)
Inventor Maruyama, Ken

Abstract

Provided is a radiation-sensitive resin composition capable of exhibiting sensitivity and CDU performance at a sufficient level when a next-generation technology is applied, and a method for forming a pattern. A radiation-sensitive resin composition contains one or two or more onium salts containing an organic acid anion moiety and an onium cation moiety, a compound having a structure in which an alkoxycarbonyl group is bonded to a nitrogen atom, and a solvent, wherein at least part of the organic acid anion moiety in the onium salt contains an iodine-substituted aromatic ring structure, and at least part of the onium cation moiety contains a fluorine-substituted aromatic ring structure.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable

93.

COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Application Number 18218193
Status Pending
Filing Date 2023-07-05
First Publication Date 2024-01-04
Owner JSR CORPORATION (Japan)
Inventor
  • Kasai, Tatsuya
  • Furusawa, Ayaka
  • Sakai, Kazunori
  • Serizawa, Ryuichi

Abstract

A composition includes: a solvent; and a compound including: at least one structural unit selected from the group consisting of a structural unit represented by formula (1-1) and a structural unit represented by formula (1-2); and a structural unit represented by formula (2-1). X is a monovalent organic group other than an alkoxy group, the monovalent organic group having 1 to 20 carbon atoms and having at least one fluorine atom; Y is a monovalent organic group having 1 to 20 carbon atoms, a hydroxy group, or a halogen atom; R0 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms; R1 is a monovalent organic group having 1 to 20 carbon atoms and having no fluorine atom, a hydroxy group, a hydrogen atom, or a halogen atom; and R2 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms. A composition includes: a solvent; and a compound including: at least one structural unit selected from the group consisting of a structural unit represented by formula (1-1) and a structural unit represented by formula (1-2); and a structural unit represented by formula (2-1). X is a monovalent organic group other than an alkoxy group, the monovalent organic group having 1 to 20 carbon atoms and having at least one fluorine atom; Y is a monovalent organic group having 1 to 20 carbon atoms, a hydroxy group, or a halogen atom; R0 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms; R1 is a monovalent organic group having 1 to 20 carbon atoms and having no fluorine atom, a hydroxy group, a hydrogen atom, or a halogen atom; and R2 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms.

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C08G 77/04 - Polysiloxanes
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

94.

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR RESIN FILM HAVING PATTERN, RESIN FILM HAVING PATTERN, AND SEMICONDUCTOR CIRCUIT SUBSTRATE

      
Application Number JP2023019497
Publication Number 2024/004462
Status In Force
Filing Date 2023-05-25
Publication Date 2024-01-04
Owner JSR CORPORATION (Japan)
Inventor
  • Ito Hirokazu
  • Ogawa Taku
  • Ando Mitsuka
  • Tatara Ryoji

Abstract

A negative photosensitive resin composition comprising: a polymer (A); a crosslinking agent (B); and a photo-cation generator (C), wherein the polymer (A) has a structural unit represented by formula (a2) and has, at a terminal, a reactive group Y that reacts with the crosslinking agent (B) by the action of cations generated from the photo-cation generator (C) through light irradiation, and the photo-cation generator (C) includes a photo-cation generator (C1) that generates, through light irradiation, an acid having a pKa(1) of at least -3 and at most 3 as calculated using a Gaussian function based on the pKa of methanesulfonic acid in an aqueous solution of 25°C.

IPC Classes  ?

  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • C08G 65/40 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols and other compounds
  • C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • G03F 7/004 - Photosensitive materials
  • G03F 7/20 - Exposure; Apparatus therefor

95.

COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, POLYMER, AND METHOD FOR MANUFACTURING POLYMER

      
Application Number 18244460
Status Pending
Filing Date 2023-09-11
First Publication Date 2023-12-28
Owner JSR CORPORATION (Japan)
Inventor
  • Nakatsu, Hiroki
  • Yamada, Shuhei
  • Abe, Shinya
  • Tsuji, Takashi
  • Ueda, Kanako
  • Miyauchi, Hiroyuki

Abstract

A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. In the formula (1), Ar1 is a divalent group including an aromatic ring having 10 to 40 ring atoms; and R0 is a monovalent group including a heteroaromatic ring which includes a sulfur atom as a ring-forming atom. A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. In the formula (1), Ar1 is a divalent group including an aromatic ring having 10 to 40 ring atoms; and R0 is a monovalent group including a heteroaromatic ring which includes a sulfur atom as a ring-forming atom.

IPC Classes  ?

  • C08F 28/06 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic ring containing sulfur by a heterocyclic ring containing sulfur
  • C08F 24/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen

96.

COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, POLYMER, AND METHOD FOR MANUFACTURING POLYMER

      
Application Number 18239373
Status Pending
Filing Date 2023-08-29
First Publication Date 2023-12-28
Owner JSR CORPORATION (Japan)
Inventor
  • Yamada, Shuhei
  • Abe, Shinya
  • Tsuji, Takashi
  • Ueda, Kanako
  • Nakatsu, Hiroki
  • Miyauchi, Hiroyuki

Abstract

A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. In the formula (1), Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a group represented by formula (1-1) or (1-2). In the formulas (1-1) and (1-2), X1 and X2 are each independently a group represented by formula (i), (ii), (iii) or (iv); * is a bond with the carbon atom in the formula (1); and Ar2, Ar3 and Ar4 are each independently a substituted or unsubstituted aromatic ring having 6 to 20 ring atoms that forms a fused ring structure together with the two adjacent carbon atoms in the formulas (1-1) and (1-2). A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. In the formula (1), Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a group represented by formula (1-1) or (1-2). In the formulas (1-1) and (1-2), X1 and X2 are each independently a group represented by formula (i), (ii), (iii) or (iv); * is a bond with the carbon atom in the formula (1); and Ar2, Ar3 and Ar4 are each independently a substituted or unsubstituted aromatic ring having 6 to 20 ring atoms that forms a fused ring structure together with the two adjacent carbon atoms in the formulas (1-1) and (1-2).

IPC Classes  ?

  • C08G 61/02 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
  • G03F 7/004 - Photosensitive materials
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable

97.

RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST PATTERN FORMATION METHOD

      
Application Number JP2023013354
Publication Number 2023/248569
Status In Force
Filing Date 2023-03-30
Publication Date 2023-12-28
Owner JSR CORPORATION (Japan)
Inventor
  • Omiya Takuya
  • Nishikori Katsuaki
  • Kiriyama Kazuya
  • Matsumura Yuushi
  • Terada Nozomi

Abstract

Provided is a radiation-sensitive resin composition comprising: a polymer which has a first structural unit represented by formula (1) and of which the solubility in a developing solution is changed by the action of an acid; a radiation-sensitive acid generator; and an acid diffusion regulator which has a monovalent radiation-sensitive onium cation and a monovalent organic acid anion.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C08F 20/10 - Esters
  • G03F 7/004 - Photosensitive materials

98.

METHOD FOR PRODUCING POLYAMIDE-BASED RESIN MULTI-STAGE-EXPANDED BEADS

      
Application Number 18030561
Status Pending
Filing Date 2021-10-13
First Publication Date 2023-12-21
Owner JSP CORPORATION (Japan)
Inventor Otsuka, Tetsu

Abstract

A method for producing polyamide-based resin multi-stage expanded beads includes an internal pressure applying step of placing polyamide-based resin expanded beads in a pressure-resistant container, impregnating the polyamide-based resin expanded beads with a physical blowing agent in the pressure-resistant container to apply internal pressure higher than atmospheric pressure; and a heating and foaming step of heating and expanding the polyamide-based resin expanded beads to which internal pressure is applied obtained in the internal pressure applying step to obtain polyamide-based resin multi-stage expanded beads having apparent density lower than that of polyamide-based resin expanded beads used in the internal pressure applying step, in the internal pressure applying step, polyamide-based resin expanded beads in a wet state having a water content of 1% or more being impregnated with the physical blowing agent at a temperature higher than change-point temperature of storage modulus of the polyamide-based resin expanded beads in a wet state.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
  • C08J 9/228 - Forming foamed products

99.

PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED RESIN FILM, METHOD FOR PRODUCING PATTERNED RESIN FILM, AND SEMICONDUCTOR CIRCUIT SUBSTRATE

      
Application Number JP2023014565
Publication Number 2023/243199
Status In Force
Filing Date 2023-04-10
Publication Date 2023-12-21
Owner JSR CORPORATION (Japan)
Inventor
  • Ogawa Taku
  • Nakafuji Shin-Ya
  • Ando Mitsuka
  • Kanno Kimiyuki
  • Tatara Ryoji
  • Ito Hirokazu

Abstract

An embodiment of the present invention relates to a photosensitive resin composition, a patterned resin film, a method for producing a patterned resin film, and a semiconductor circuit substrate. The photosensitive resin composition comprises: a polymer (A) that is at least one selection from the group consisting of polyimides and polyimide precursors, that contains a structural unit (a) containing a structural unit derived from an acid anhydride represented by formula (1) and contains a diamine-derived structural unit (b), and that has, e.g., a maleimide group, at a terminal on the polymer; (B) a photopolymerization initiator; and (D) a solvent. [In formula (1), L represents a single bond, etc.; R1to R3represents a hydrogen atom, etc., or represents an alkylene group formed by the bonding of the R1and R2(or R3) in the same ring with each other; n1and n2represent an integer from 0 to 3; and Y1represents a structure given by (Y1)(-Ar1-), etc.]

IPC Classes  ?

  • G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F 7/20 - Exposure; Apparatus therefor

100.

PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM HAVING PATTERN, METHOD FOR PRODUCING RESIN FILM HAVING PATTERN, AND SEMICONDUCTOR CIRCUIT BOARD

      
Application Number JP2023014564
Publication Number 2023/243198
Status In Force
Filing Date 2023-04-10
Publication Date 2023-12-21
Owner JSR CORPORATION (Japan)
Inventor
  • Okuda Ryuichi
  • Doi Takashi
  • Tatara Ryoji
  • Ito Hirokazu

Abstract

One aspect of the present invention relates to: a photosensitive resin composition; a resin film having a pattern; a method for producing a resin film having a pattern; and a semiconductor circuit board. The photosensitive resin composition contains: (A) a polymer which is at least one type selected from the group consisting of a polyimide and a polyimide precursor and which contains a structural unit (a) including a structural unit derived from an acid anhydride represented by formula (1) and a structural unit (b) derived from a diamine; (B) a naphthoquinonediazide compound; (C1) a crosslinkable compound having a methylol group or an alkoxymethyl group; and (D) a solvent. [In formula (1): L denotes a single bond or the like; R1to R3each denote a hydrogen atom or the like, or denote an alkylene group formed by bonding RR1and R2(or R3) of the same ring; n1to n2each denote an integer between 0 and 3; and Y1denotes a structure represented by a formula such as (Y1)(-Ar1-).]

IPC Classes  ?

  • G03F 7/023 - Macromolecular quinonediazides; Macromolecular additives, e.g. binders
  • G03F 7/004 - Photosensitive materials
  • G03F 7/20 - Exposure; Apparatus therefor
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