JSR Corporation

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G03F 7/004 - Photosensitive materials 194
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists 160
G03F 7/20 - Exposure; Apparatus therefor 154
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers 104
G03F 7/32 - Liquid compositions therefor, e.g. developers 80
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1.

METHOD FOR EVALUATING EXCRETION OF SUBSTANCE OF INTEREST BY HUMAN HEPATOCYTE-LIKE CELL

      
Application Number 18141555
Status Pending
Filing Date 2021-11-24
First Publication Date 2024-06-06
Owner
  • JSR Corporation (Japan)
  • Kendai Translational Research Center (Japan)
Inventor
  • Masuda, Norio
  • Ogihara, Takuo

Abstract

A method is provided for evaluating excretion of a substance of interest by a human hepatocyte-like cell, the method including: preparing a sac-like-material-containing solution that contains a sac-like material which is produced in vitro and has a membrane of a human hepatocyte-like cell and 0% to 10% by volume of a suspended extracellular matrix; placing the substance of interest in the sac-like-material-containing solution to bring the substance of interest into contact with the sac-like material; and extracting the sac-like material from the sac-like-material-containing solution and measuring a concentration of the substance of interest or a metabolite thereof excreted into an inner cavity of the sac-like material.

IPC Classes  ?

  • G01N 33/50 - Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
  • C12N 5/071 - Vertebrate cells or tissues, e.g. human cells or tissues

2.

COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR FORMING RESIST UNDERLAYER FILM

      
Application Number 18422098
Status Pending
Filing Date 2024-01-25
First Publication Date 2024-06-06
Owner JSR CORPORATION (Japan)
Inventor
  • Ozaki, Yuki
  • Serizawa, Ryuichi
  • Hirasawa, Kengo
  • Hirabayashi, Hiroki

Abstract

A composition includes a metal compound, a polymer including a first structural unit represented by formula (1) and a second structural unit represented by formula (2), and a solvent. R1 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; and R2 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms. R3 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; L is a single bond or a divalent linking group; Ar is a group obtained by removing (n+1) hydrogen atoms from a substituted or unsubstituted aromatic ring having 6 to 20 ring members; R4 is a monovalent hydroxyalkyl group having 1 to 10 carbon atoms or a hydroxy group; and n is an integer of 0 to 8. A composition includes a metal compound, a polymer including a first structural unit represented by formula (1) and a second structural unit represented by formula (2), and a solvent. R1 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; and R2 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms. R3 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; L is a single bond or a divalent linking group; Ar is a group obtained by removing (n+1) hydrogen atoms from a substituted or unsubstituted aromatic ring having 6 to 20 ring members; R4 is a monovalent hydroxyalkyl group having 1 to 10 carbon atoms or a hydroxy group; and n is an integer of 0 to 8.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F 7/004 - Photosensitive materials
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable

3.

METHOD FOR PRODUCING CARRIER FOR CHROMATOGRAPHIC USE, METHOD FOR PRODUCING CHROMATOGRAPHY COLUMN, AND CARRIER FOR CHROMATOGRAPHIC USE

      
Application Number 18551116
Status Pending
Filing Date 2022-03-15
First Publication Date 2024-05-23
Owner JSR CORPORATION (Japan)
Inventor
  • Kobayashi, Kunihiko
  • Akiyama, Minato
  • Inoue, Yukiya
  • Kikuchi, Masahiro

Abstract

A method for producing a chromatography carrier, including providing a solid phase support, where the solid phase support provided is formed of porous particles on which a ligand has or has not been immobilized, and subjecting the solid phase support to sieve classification. A coefficient of variation of a volume particle size distribution of the porous particles when a ligand has been immobilized is adjusted to 1% to 22%, and a ratio (d1/d50) of volume cumulative 1% particle size d1 to volume cumulative 50% particle size d50 in terms of the porous particles is adjusted to 0.55 to 1.0.

IPC Classes  ?

  • B01J 20/286 - Phases chemically bonded to a substrate, e.g. to silica or to polymers
  • B01D 15/20 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the conditioning of the sorbent material
  • B01D 15/38 - Selective adsorption, e.g. chromatography characterised by the separation mechanism involving specific interaction not covered by one or more of groups , e.g. affinity, ligand exchange or chiral chromatography
  • B01J 20/26 - Synthetic macromolecular compounds
  • B01J 20/28 - Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
  • B01J 20/30 - Processes for preparing, regenerating or reactivating
  • B01J 20/32 - Impregnating or coating

4.

METHOD FOR PRODUCING POLYAMIDE RESIN FOAM PARTICLES

      
Application Number 18553026
Status Pending
Filing Date 2022-03-01
First Publication Date 2024-05-23
Owner JSP Corporation (Japan)
Inventor Hayashi, Tatsuya

Abstract

A method for producing a polyamide-based resin expanded bead, the method comprising expanding a polyamide-based resin bead using a physical blowing agent, wherein the polyamide-based resin bead comprises a coloring pigment and a higher fatty acid metal salt having 12 to 24 carbon atoms; a metal in the higher fatty acid metal salt is one or more metals selected from the group consisting of magnesium, aluminum, and zinc; and a content of the higher fatty acid metal salt in the polyamide-based resin bead is 500 to 5000 mass ppm.

IPC Classes  ?

  • C08J 9/16 - Making expandable particles
  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof

5.

POLYPROPYLENE-BASED RESIN EXPANDED BEADS AND METHOD FOR PRODUCING POLYPROPYLENE-BASED RESIN EXPANDED BEADS

      
Application Number 18278657
Status Pending
Filing Date 2021-12-21
First Publication Date 2024-05-16
Owner JSP CORPORATION (Japan)
Inventor
  • Nohara, Tokunobu
  • Ode, Yasutaka

Abstract

A polypropylene-based resin expanded beads configured to include an NOR type hindered amine and has a surface on which a thermoplastic polymer layer is located, in which a blending ratio of the amine in the expanded beads is 0.03 wt % or more and 0.5 wt % or less, and a blending ratio of the amine in the thermoplastic polymer layer is less than the blending ratio of the amine in the expanded beads. Further, the method for producing the expanded beads includes a covering and foaming step, in which in the resin beads to be obtained in the covering step, a blending ratio of the amine in the resin beads is adjusted to be 0.03 wt % or more and 0.5 wt % or less, and a blending ratio of the amine in a thermoplastic polymer layer is adjusted to be lower than the blending ratio of the amine in the resin beads.

IPC Classes  ?

  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08J 9/224 - Surface treatment
  • C08J 9/232 - Forming foamed products by sintering expandable particles
  • C08K 5/3492 - Triazines

6.

RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD

      
Application Number 18277113
Status Pending
Filing Date 2021-12-20
First Publication Date 2024-05-09
Owner JSR CORPORATION (Japan)
Inventor Maruyama, Ken

Abstract

A radiation-sensitive resin composition includes: a resin including a structural unit represented by formula (1); at least one onium salt each including an organic acid anion moiety and an onium cation moiety; and a solvent. At least part of the organic acid anion moiety in the at least one onium salt includes an iodine-substituted aromatic ring structure. R is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, Y1 is a divalent linking group, and X1 is an acid-dissociable group, and n is 0 or 1. When n is 0, X1 is represented by formula (s1) or (s2). A radiation-sensitive resin composition includes: a resin including a structural unit represented by formula (1); at least one onium salt each including an organic acid anion moiety and an onium cation moiety; and a solvent. At least part of the organic acid anion moiety in the at least one onium salt includes an iodine-substituted aromatic ring structure. R is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, Y1 is a divalent linking group, and X1 is an acid-dissociable group, and n is 0 or 1. When n is 0, X1 is represented by formula (s1) or (s2).

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 25/18 - Polycyclic aromatic halogenated hydrocarbons
  • C07C 309/10 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing etherified hydroxy groups bound to the carbon skeleton with the oxygen atom of at least one of the etherified hydroxy groups further bound to an acyclic carbon atom
  • C07C 309/39 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing halogen atoms bound to the carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C07D 327/04 - Five-membered rings
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
  • C08F 220/38 - Esters containing sulfur
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

7.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION

      
Application Number 18391906
Status Pending
Filing Date 2023-12-21
First Publication Date 2024-05-09
Owner JSR CORPORATION (Japan)
Inventor
  • Nakatsu, Hiroki
  • Abe, Shinya
  • Yamada, Shuhei
  • Tsuji, Takashi
  • Wakayama, Hiroki
  • Mayumi, Kosuke
  • Miyauchi, Hiroyuki

Abstract

A method for manufacturing a semiconductor substrate, including: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film directly or indirectly on the substrate; forming a resist pattern directly or indirectly on the resist underlayer film; and performing etching using the resist pattern as a mask. The composition for forming a resist underlayer film contains: a polymer having a repeating unit represented by formula (1) and a solvent. Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a monovalent group including an aromatic ring having 5 to 40 ring atoms and includes at least one group selected from the group consisting of groups represented by formula (2-1) and groups represented by formula (2-2). A method for manufacturing a semiconductor substrate, including: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film directly or indirectly on the substrate; forming a resist pattern directly or indirectly on the resist underlayer film; and performing etching using the resist pattern as a mask. The composition for forming a resist underlayer film contains: a polymer having a repeating unit represented by formula (1) and a solvent. Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a monovalent group including an aromatic ring having 5 to 40 ring atoms and includes at least one group selected from the group consisting of groups represented by formula (2-1) and groups represented by formula (2-2).

IPC Classes  ?

  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • G03F 7/075 - Silicon-containing compounds
  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/311 - Etching the insulating layers

8.

COMPOSITION FOR SEMICONDUCTOR PROCESSING AND PROCESSING METHOD

      
Application Number 18457365
Status Pending
Filing Date 2023-08-29
First Publication Date 2024-05-09
Owner JSR Corporation (Japan)
Inventor Tano, Hiroyuki

Abstract

A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof (excluding a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×106. A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof (excluding a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×106. RO(CH2)2O(CH2)2OH  (1) A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof (excluding a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×106. RO(CH2)2O(CH2)2OH  (1) ROH  (2) A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof (excluding a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×106. RO(CH2)2O(CH2)2OH  (1) ROH  (2) (In the formula (1) and the formula (2), R's represent the same hydrocarbon group.)

IPC Classes  ?

  • C11D 3/37 - Polymers
  • C11D 3/20 - Organic compounds containing oxygen
  • C11D 3/28 - Heterocyclic compounds containing nitrogen in the ring
  • C11D 11/00 - Special methods for preparing compositions containing mixtures of detergents
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

9.

RADIATION-SENSITIVE COMPOSITION AND RESIST PATTERN-FORMING METHOD

      
Application Number 18504594
Status Pending
Filing Date 2023-11-08
First Publication Date 2024-05-09
Owner JSR CORPORATION (Japan)
Inventor Maruyama, Ken

Abstract

A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X), A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X), where Ar1 is a group obtained by removing (a+b) hydrogen atoms from an unsubstituted aryl group, RXA is a monovalent iodine atom, an iodinated alkyl group or an iodinated alkoxy group, RXB is a monovalent organic group, a is an integer of 1 to 10, and b is an integer of 1 to 10.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

10.

COMPOSITION FOR SEMICONDUCTOR PROCESSING AND PROCESSING METHOD

      
Application Number 18460625
Status Pending
Filing Date 2023-09-04
First Publication Date 2024-05-09
Owner JSR CORPORATION (Japan)
Inventor Tano, Hiroyuki

Abstract

A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof and a hydroxyl group (excluding the compound represented by the following general formula (1), a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×104. A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof and a hydroxyl group (excluding the compound represented by the following general formula (1), a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×104. R2N(OH)  (1) A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof and a hydroxyl group (excluding the compound represented by the following general formula (1), a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×104. R2N(OH)  (1) R2NH  (2) (In the formula (1) and the formula (2), R's each independently represent an alkyl group having 1 to 4 carbon atoms.)

IPC Classes  ?

  • C11D 11/00 - Special methods for preparing compositions containing mixtures of detergents
  • C11D 7/26 - Organic compounds containing oxygen
  • C11D 7/32 - Organic compounds containing nitrogen
  • C11D 7/50 - Solvents
  • G03F 7/42 - Stripping or agents therefor
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

11.

SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND COMPOSITION

      
Application Number 18528951
Status Pending
Filing Date 2023-12-05
First Publication Date 2024-05-02
Owner JSR CORPORATION (Japan)
Inventor
  • Miyauchi, Hiroyuki
  • Dei, Satoshi
  • Tanaka, Ryotaro
  • Yoneda, Eiji
  • Yoshinaka, Sho

Abstract

A method for manufacturing a semiconductor substrate, includes: directly or indirectly applying a composition for forming a resist underlayer film to a substrate to form a resist under film directly or indirectly on the substrate; applying a composition for forming a resist film to the resist underlayer film to form a resist film on the resist underlayer film; exposing the resist film to radiation; and developing the exposed resist film by a developer. The composition for forming a resist underlayer film includes: a polymer; an onium salt that is capable of generating at least one polar group selected from the group consisting of a carboxy group and a hydroxy group by radiation or heat; and a solvent.

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • G03F 7/029 - Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
  • G03F 7/20 - Exposure; Apparatus therefor
  • G03F 7/32 - Liquid compositions therefor, e.g. developers
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

12.

MOLDED ARTICLE OF POLYPROPYLENE-BASED RESIN EXPANDED BEADS AND METHOD FOR PRODUCING SAME

      
Application Number 18392071
Status Pending
Filing Date 2023-12-21
First Publication Date 2024-04-18
Owner JSP CORPORATION (Japan)
Inventor
  • Sakamura, Takumi
  • Ohta, Hajime

Abstract

A method for producing a molded article of expanded beads includes filling tubular polypropylene-based resin expanded beads each having a through-hole in a mold, and supplying a heating medium to fusion-bond the expanded beads to each other. The expanded beads have a foamed layer constituted by polypropylene-based resin. A closed cell of the expanded beads is 90% or more. An average hole diameter (d) of through-holes of the expanded beads is less than 1 mm. A ratio [d/D] of the average hole diameter (d) to an average outer diameter (D) of the expanded beads is 0.4 or less. An open cell content of the molded article of expanded beads is 2.5% or more and 12% or less.

IPC Classes  ?

13.

RADIATION-SENSITIVE COMPOSITION AND METHOD OF FORMING RESIST PATTERN

      
Application Number 18270256
Status Pending
Filing Date 2021-11-15
First Publication Date 2024-04-18
Owner JSR CORPORATION (Japan)
Inventor Maruyama, Ken

Abstract

A radiation-sensitive composition includes: a polymer (A) including a structural unit represented by formula (i); and an acid-generating compound including a radiation-sensitive onium cation and an organic anion (provided that the polymer (A) is excluded), while satisfying at least one of requirements [K1] and [K2]. In [K1], the polymer (A) includes a radiation-sensitive onium cation [X] including two or more of substituents β each of which is at least one type selected from the group consisting of a fluoroalkyl group and a fluoro group (provided that the fluoro group in the fluoroalkyl group is excluded). In [K2], the acid-generating compound includes a compound including a radiation-sensitive onium cation [X]. A radiation-sensitive composition includes: a polymer (A) including a structural unit represented by formula (i); and an acid-generating compound including a radiation-sensitive onium cation and an organic anion (provided that the polymer (A) is excluded), while satisfying at least one of requirements [K1] and [K2]. In [K1], the polymer (A) includes a radiation-sensitive onium cation [X] including two or more of substituents β each of which is at least one type selected from the group consisting of a fluoroalkyl group and a fluoro group (provided that the fluoro group in the fluoroalkyl group is excluded). In [K2], the acid-generating compound includes a compound including a radiation-sensitive onium cation [X].

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

14.

METHOD FOR PRODUCING CHROMATOGRAPHY CARRIER, METHOD FOR PRODUCING CHROMATOGRAPHY COLUMN, AND CHROMATOGRAPHY CARRIER

      
Application Number 18551755
Status Pending
Filing Date 2022-03-15
First Publication Date 2024-04-11
Owner JSR CORPORATION (Japan)
Inventor
  • Kobayashi, Kunihiko
  • Akiyama, Minato
  • Inoue, Yukiya
  • Kikuchi, Masahiro

Abstract

A chromatography carrier may exhibit high liquid permeability and an excellent pressure-resistant characteristic during liquid passage. A chromatography carrier production method may include: (1) providing a solid phase support, the solid phase support being formed of porous particles on which a ligand has or has not been immobilized; and (2) subjecting the solid phase support to sieve classification, the coefficient of variation of the volume particle size distribution of the porous particles when a ligand has been immobilized being adjusted to 1% to 22%. The skewness of the volume particle size distribution of the porous particles when a ligand has been immobilized may be adjusted to −0.1 to 5.

IPC Classes  ?

  • B01J 20/285 - Porous sorbents based on polymers
  • B01D 15/20 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the conditioning of the sorbent material
  • B01D 15/22 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the construction of the column
  • B01J 20/30 - Processes for preparing, regenerating or reactivating

15.

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING RESIST PATTERN FILM, AND METHOD FOR MANUFACTURING PLATED SHAPED ARTICLE

      
Application Number 18372176
Status Pending
Filing Date 2023-09-25
First Publication Date 2024-04-11
Owner JSR CORPORATION (Japan)
Inventor
  • Satou, Keiichi
  • Ishii, Akira
  • Tomita, Takuya
  • Koumura, Kazuhiko

Abstract

An embodiment of the present invention relates to a photosensitive resin composition, a method for manufacturing a resist pattern film, and a method for manufacturing a plated shaped article; the photosensitive resin composition comprises (A) an alkali-soluble resin, (B1) a polymerizable compound having at least two (meth)acryloyl groups and at least two hydroxy groups in one molecule and having a ring structure, (C) a photoradical polymerization initiator, (D) at least one compound selected from the group consisting of a nitrogen-containing heterocyclic compound (d1) containing two or more nitrogen atoms, a thiol compound (d2), and a polymerization inhibitor (d3), and (F) a solvent.

IPC Classes  ?

  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/004 - Photosensitive materials
  • G03F 7/031 - Organic compounds not covered by group

16.

CORE MEMBER

      
Application Number 18285420
Status Pending
Filing Date 2022-03-29
First Publication Date 2024-04-04
Owner JSP CORPORATION (Japan)
Inventor
  • Hisamatsu, Katsunori
  • Hashimoto, Keiichi

Abstract

A core member used for a laminate in which polyurethane foam is laminated on the core member made of a thermoplastic resin expanded beads molded article, such that the molded article in which expanded beads having through holes are mutually fused, an average porosity of the expanded beads molded article is between 10% and 25%, and on a surface of the expanded beads molded article, a ratio of a total opening area of the through hole portions of the expanded beads to a surface area of the expanded beads molded article is between 2% and 5%, an average opening area of the through hole portions of the expanded beads is between 5 mm2 and 20 mm2, and the ratio of the number of through hole portions having an opening area of 2 mm2 or more to the number of through hole portions of the expanded beads is 60% or less.

IPC Classes  ?

  • B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
  • B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • B32B 27/40 - Layered products essentially comprising synthetic resin comprising polyurethanes
  • C08J 9/228 - Forming foamed products

17.

SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND COMPOSITION

      
Application Number 18509611
Status Pending
Filing Date 2023-11-15
First Publication Date 2024-03-28
Owner JSR CORPORATION (Japan)
Inventor
  • Yoneda, Eiji
  • Abe, Takayoshi
  • Miyauchi, Hiroyuki

Abstract

A method for manufacturing a semiconductor substrate, includes: directly or indirectly applying a composition for forming a resist underlayer film to a substrate to form a resist underlayer film; applying a composition for forming a resist film to the resist underlayer film to form a resist film; exposing the resist film to radiation; and developing the exposed resist film. The composition for forming a resist underlayer film includes: a polymer; an acid generating agent; and a solvent. The resist underlayer film has a film thickness of 6 nm or less.

IPC Classes  ?

  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • G03F 7/20 - Exposure; Apparatus therefor
  • G03F 7/32 - Liquid compositions therefor, e.g. developers

18.

RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN

      
Application Number 18235924
Status Pending
Filing Date 2023-08-21
First Publication Date 2024-03-21
Owner JSR CORPORATION (Japan)
Inventor
  • Nishikori, Katsuaki
  • Kawai, Takahiro

Abstract

A radiation-sensitive resin composition contains: a first polymer having a first structural unit including a partial structure obtained by substituting a hydrogen atom of a carboxy group or of a phenolic hydroxy group with an acid-labile group represented by formula (1); and a compound including: a monovalent radiation-sensitive onium cation moiety including an aromatic ring structure which includes a fluorine atom or a fluorine atom-containing group; and a monovalent organic acid anion moiety. Ar1 represents a group obtained by removing one hydrogen atom from a substituted or unsubstituted aromatic ring structure having 5 to 30 ring atoms; R 1 and R2 each independently represent a substituted or unsubstituted monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms; and * denotes a site bonding to an ethereal oxygen atom in the carboxy group or an oxygen atom in the phenolic hydroxy group. A radiation-sensitive resin composition contains: a first polymer having a first structural unit including a partial structure obtained by substituting a hydrogen atom of a carboxy group or of a phenolic hydroxy group with an acid-labile group represented by formula (1); and a compound including: a monovalent radiation-sensitive onium cation moiety including an aromatic ring structure which includes a fluorine atom or a fluorine atom-containing group; and a monovalent organic acid anion moiety. Ar1 represents a group obtained by removing one hydrogen atom from a substituted or unsubstituted aromatic ring structure having 5 to 30 ring atoms; R 1 and R2 each independently represent a substituted or unsubstituted monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms; and * denotes a site bonding to an ethereal oxygen atom in the carboxy group or an oxygen atom in the phenolic hydroxy group.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/004 - Photosensitive materials

19.

EXPANDED POLYPROPYLENE RESIN BEADS AND EXPANDED POLYPROPYLENE RESIN BEADS MOLDED ARTICLE

      
Application Number 18240196
Status Pending
Filing Date 2023-08-30
First Publication Date 2024-03-14
Owner JSP Corporation (Japan)
Inventor
  • Yamasaki, Shobu
  • Ito, Yosuke

Abstract

An expanded polypropylene resin bead contains an inorganic pigment, a hindered amine compound, and an ultraviolet light absorber. The ultraviolet light absorber contains an ultraviolet light absorber A having a molecular weight of 360 or more, and a content of the ultraviolet light absorber A in the expanded polypropylene resin bead is 0.010% by mass or more and 2% by mass or less. An expanded polypropylene resin beads molded article is produced by in-mold molding of the expanded polypropylene resin bead.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
  • C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
  • C08J 9/232 - Forming foamed products by sintering expandable particles
  • C08K 13/02 - Organic and inorganic ingredients

20.

MANUFACTURING METHOD OF DISPLAY AND DISPLAY

      
Application Number 18275741
Status Pending
Filing Date 2022-01-31
First Publication Date 2024-03-14
Owner
  • JSR CORPORATION (Japan)
  • Mattrix Technologies, Inc (USA)
Inventor
  • Katsui, Hiromitsu
  • Liu, Bo
  • Lemaitre, Maxime

Abstract

Provided is a manufacturing method of a display including a vertical organic light-emitting transistor in which a wider light-emitting area is secured while manufacturing time and manufacturing cost are suppressed. In the manufacturing method of the display including the vertical organic light-emitting transistor, a gate electrode layer of the vertical organic light-emitting transistor and one of current-carrying electrode layers of a thin-film transistor connected to the gate electrode layer of the vertical organic light-emitting transistor are formed integrally in the same layer.

IPC Classes  ?

  • H10K 59/121 - Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
  • H10K 59/12 - Active-matrix OLED [AMOLED] displays

21.

ADDITIVES FOR METAL OXIDE PHOTORESISTS, POSITIVE TONE DEVELOPMENT WITH ADDITIVES, AND DOUBLE BAKE DOUBLE DEVELOP PROCESSING

      
Application Number 18233932
Status Pending
Filing Date 2023-08-15
First Publication Date 2024-03-14
Owner
  • Inpria Corporation (USA)
  • JSR Corporation (Japan)
Inventor
  • Kasahara, Kazuki
  • Cardineau, Brian J.
  • Jiang, Kai
  • Meyers, Stephen T.
  • Narasimhan, Amrit N.
  • Voss, Matthew

Abstract

A method for patterning a radiation sensitive material on a substrate involves the development of a material on a substrate based on a latent image in the material with irradiated regions and non-irradiated regions to form a physically patterned material on the substrate, in which the material comprises an organotin radiation sensitive patterning material and an additive. The additive is a photoacid generator, a quencher or a mixture thereof. Patterning improvements can be achieved using a series of a baking and development step followed by a second baking at a higher temperature and a second development step following the second baking step. A precursor solution for forming an organometallic radiation patterning material can comprise an organic solvent, a dissolved organotin composition having C—Sn bonds that can cleave in response to EUV radiation, and a quencher. The additive can comprise an onium cation.

IPC Classes  ?

22.

Polyethylene Resin Foamed Particle, and Method for Producing Same

      
Application Number 18549026
Status Pending
Filing Date 2022-03-03
First Publication Date 2024-03-07
Owner JSP CORPORATION (Japan)
Inventor
  • Hayashi, Tatsuya
  • Hira, Akinobu

Abstract

Polyethylene resin foamed particles according to the present invention are obtained by using, as a base material resin, a non-crosslinked linear low density polyethylene. The linear low density polyethylene is a copolymer of ethylene and an α-olefin having 8 carbon atoms, and has a melt flow rate and a density in specified ranges. The foamed particle has an average foam size within a specified range, and has a crystal structure that causes an intrinsic peak and a high temperature peak to appear in the first round of a DSC curve obtained under a specific condition. The total fusion heat quantity (ΔH1) determined from the sum total of a fusion heat quantity (ΔHi) of the intrinsic peak and the fusion heat quantity (ΔHh) of the high temperature peak is within a specified range.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • B29C 44/34 - Component parts, details or accessories; Auxiliary operations

23.

POLYETHYLENE-BASED RESIN MULTILAYER FOAM SHEET AND METHOD FOR PRODUCING SAME

      
Application Number 18258874
Status Pending
Filing Date 2021-10-01
First Publication Date 2024-02-08
Owner JSP CORPORATION (Japan)
Inventor
  • Kakuta, Hirotoshi
  • Fujita, Mikidai
  • Katsuyama, Naoya

Abstract

A polyethylene-based resin multilayer foam sheet may include a polyethylene-based resin foam layer containing a polyethylene-based resin (A) as a base resin, and a conductive layer laminated on at least one side of the foam layer. The conductive layer contains: a mixed resin of one or more polyethylenes (B) of low-density polyethylenes and/or linear low-density polyethylenes and an ethylene-based copolymer (C) having a structural unit derived from ethylene and a structural unit derived from a monomer having a polar group; and conductive carbon. The conductive carbon blended in the conductive layer may be in a range of from 3 to 15 wt. %. The difference, TmB−TmC, between the melting point TmB of the polyethylene (B) and the melting point TmC of the ethylene-based copolymer (C) each contained in the conductive layer may be in a range of from 30 to 80° C.

IPC Classes  ?

  • B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • B32B 27/30 - Layered products essentially comprising synthetic resin comprising acrylic resin
  • B32B 37/15 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
  • B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material

24.

POLYPROPYLENE-BASED RESIN EXPANDED BEADS AND MOLDED ARTICLE THEREOF

      
Application Number 18217651
Status Pending
Filing Date 2023-07-03
First Publication Date 2024-01-25
Owner JSP CORPORATION (Japan)
Inventor Masumoto, Hisashi

Abstract

An expanded bead of polypropylene-based resin formed with a through hole that is defined by an inner peripheral surface and that has an average hole diameter of 1 mm or less. The expanded bead has a closed cell content of 85% or more, an average cell diameter of 50 to 300 μm and an inner surface portion that extends along the inner peripheral surface that has an average cell diameter of 5 to 150 μm which is smaller than the average cell diameter of the expanded bead.

IPC Classes  ?

  • B29C 44/44 - Feeding the material to be shaped into a closed space, i.e. to make articles of definite length in the form of expandable particles or beads

25.

POLYMER, COMPOSITION, CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT

      
Application Number 18373415
Status Pending
Filing Date 2023-09-27
First Publication Date 2024-01-25
Owner JSR CORPORATION (Japan)
Inventor
  • Kawashima, Naoyuki
  • Yamashita, Yuutoku
  • Anabuki, Shoma
  • Kameyama, Takeru
  • Nishino, Kenta
  • Shinohara, Arata
  • Fujitomi, Shintarou

Abstract

One embodiment of the present invention relates to a polymer, a composition, a cured product, a laminate, or an electronic component, and the polymer has a repeating structural unit represented by Formula (1) and has a group Y represented by Formula (a) at a terminal: One embodiment of the present invention relates to a polymer, a composition, a cured product, a laminate, or an electronic component, and the polymer has a repeating structural unit represented by Formula (1) and has a group Y represented by Formula (a) at a terminal: wherein X's are each independently —O—, —S—, or —N(R3)—, R3 is a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 20 carbon atoms, or a group obtained by substituting a part of the hydrocarbon group or the halogenated hydrocarbon group with at least one selected from an oxygen atom and a sulfur atom, R1 is a divalent organic group, and R2 is a divalent unsubstituted or substituted nitrogen-containing heteroaromatic ring; One embodiment of the present invention relates to a polymer, a composition, a cured product, a laminate, or an electronic component, and the polymer has a repeating structural unit represented by Formula (1) and has a group Y represented by Formula (a) at a terminal: wherein X's are each independently —O—, —S—, or —N(R3)—, R3 is a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 20 carbon atoms, or a group obtained by substituting a part of the hydrocarbon group or the halogenated hydrocarbon group with at least one selected from an oxygen atom and a sulfur atom, R1 is a divalent organic group, and R2 is a divalent unsubstituted or substituted nitrogen-containing heteroaromatic ring; —Y  (a) wherein Y is a group containing an ethylenically unsaturated double bond and having 3 to 50 carbon atoms, an unsubstituted or substituted aromatic hydrocarbon group having 6 to 50 carbon atoms, an unsubstituted or substituted aliphatic hydrocarbon group having 3 to 50 carbon atoms, or an unsubstituted nitrogen-containing heteroaromatic ring, and when the aromatic hydrocarbon group or the aliphatic hydrocarbon group has a substituent, the substituent is a group other than a hydroxy group.

IPC Classes  ?

  • C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
  • C08G 65/48 - Polymers modified by chemical after-treatment
  • C08K 5/3415 - Five-membered rings
  • C08K 5/14 - Peroxides
  • C08K 3/36 - Silica
  • H05K 1/03 - Use of materials for the substrate

26.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION

      
Application Number 18374041
Status Pending
Filing Date 2023-09-28
First Publication Date 2024-01-25
Owner JSR CORPORATION (Japan)
Inventor
  • Maruyama, Ken
  • Abe, Takayoshi
  • Sakai, Kazunori

Abstract

A method for manufacturing a semiconductor substrate includes forming a resist underlayer film directly or indirectly on a substrate by applying a composition for forming a resist underlayer film. A metal-containing resist film is formed on the resist underlayer film. The metal-containing resist film is exposed. A part of the exposed metal-containing resist film is volatilized to form a resist pattern.

IPC Classes  ?

  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • G03F 7/004 - Photosensitive materials

27.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION

      
Application Number 18372163
Status Pending
Filing Date 2023-09-25
First Publication Date 2024-01-18
Owner JSR CORPORATION (Japan)
Inventor
  • Maruyama, Ken
  • Abe, Takayoshi
  • Sakai, Kazunori

Abstract

A method for manufacturing a semiconductor substrate includes forming a resist underlayer film directly or indirectly on a substrate by applying a composition for forming a resist underlayer film. A metal-containing resist film is formed on the resist underlayer film. The metal-containing resist film is exposed. An exposed portion of the exposed metal-containing resist film is dissolved with a developer to form a resist pattern.

IPC Classes  ?

  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • H01L 21/311 - Etching the insulating layers
  • G03F 7/16 - Coating processes; Apparatus therefor
  • G03F 7/004 - Photosensitive materials
  • G03F 7/20 - Exposure; Apparatus therefor

28.

METHOD FOR MANUFACTURING LAMINATE

      
Application Number 18033741
Status Pending
Filing Date 2021-10-08
First Publication Date 2024-01-18
Owner JSP Corporation (Japan)
Inventor
  • Hisamatsu, Katsunori
  • Hashimoto, Keiichi

Abstract

The present invention relates to a method for producing a laminate, wherein the laminate is obtained by integrally laminating an expanded beads molded article (a) composed of expanded beads A and having interconnected voids and an expanded beads molded article (b) composed of expanded particles B and having interconnected voids, the difference [Pb−Pa] between the voidage (Pa) of the expanded beads molded article (a) and the voidage (Pb) of the expanded beads molded article (b) is 5% or more, and the expanded beads A and the expanded beads B satisfy the following (1) to (3): (1) a difference [dB−dA] between an average hole diameter (dA) of the through-holes of the expanded beads (A) and an average hole diameter (dB) of the through-holes of the expanded beads (B) is 0.3 mm or more and 2 mm or less; (2) the expanded beads (B) have an average outer diameter DB of 3.5 mm or more and 5 mm or less; (3) a difference [DB−DA] between an average outer diameter DA of the expanded beads (A) and an average outer diameter DB of the expanded beads (B) is −0.3 mm or more and 2 mm or less.

IPC Classes  ?

  • B29C 44/20 - Shaping by internal pressure generated in the material, e.g. swelling or foaming for articles of indefinite length
  • B29K 23/00 - Use of polyalkenes as moulding material
  • B29K 105/04 - Condition, form or state of moulded material cellular or porous

29.

THERMOPLASTIC RESIN EXPANDED BEAD AND MOLDED ARTICLE OF THERMOPLASTIC RESIN EXPANDED BEADS

      
Application Number 18349308
Status Pending
Filing Date 2023-07-10
First Publication Date 2024-01-18
Owner JSP CORPORATION (Japan)
Inventor
  • Sakamura, Takumi
  • Ohta, Hajime

Abstract

A thermoplastic resin expanded bead and a molded article composed of the thermoplastic resin expanded beads are provided. The expanded bead includes a foam layer containing a thermoplastic resin. The expanded bead has a columnar shape, and has two or more and eight or less through-holes penetrating in the axial direction thereof. A ratio Ct/A of a total cross-sectional area Ct of the through-holes to a cross-sectional area A of the expanded bead in a cut surface obtained by cutting the expanded bead along a plane perpendicular to the axial direction at the center in the axial direction is 0.02 or more and 0.15 or less.

IPC Classes  ?

30.

METHOD FOR PRODUCING TWO-DIMENSIONAL SMALL INTESTINAL ORGANOIDS HAVING VILLUS STRUCTURE

      
Application Number 18039534
Status Pending
Filing Date 2021-12-03
First Publication Date 2024-01-11
Owner
  • KEIO UNIVERSITY (Japan)
  • JSR CORPORATION (Japan)
Inventor
  • Sato, Toshiro
  • Sugimoto, Shinya
  • Arai, Kazuya

Abstract

A method for producing a two-dimensional small intestinal organoid having a villus structure, the method including a step 1 of culturing a cell derived from a small intestinal epithelium in an extracellular matrix to obtain a three-dimensional small intestinal organoid, a step 2 of dispersing the three-dimensional small intestinal organoid and monolayer culturing on the extracellular matrix to obtain a two-dimensional small intestinal organoid, and a step 3 of further culturing the two-dimensional small intestinal organoid while letting a culture medium of the two-dimensional small intestinal organoid to flow so that the two-dimensional small intestinal organoid forms a villus structure.

IPC Classes  ?

  • G01N 33/50 - Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
  • C12N 5/071 - Vertebrate cells or tissues, e.g. human cells or tissues

31.

FOAM PARTICLE MOULDED ARTICLE, SOLE CUSHION, AND METHOD FOR PRODUCING FOAM PARTICLES

      
Application Number 18368441
Status Pending
Filing Date 2023-09-14
First Publication Date 2024-01-04
Owner JSP Corporation (Japan)
Inventor
  • Takagi, Shota
  • Oikawa, Masaharu

Abstract

The present invention relates to an in-mold expanded beads molded article of expanded beads of an olefin thermoplastic elastomer, a cushion for shoe sole, and a method of producing expanded beads provided with through-holes and composed of a block copolymer of a polyethylene block and an ethylene/α-olefin copolymer block, and with respect to the in-mold expanded beads molded article of expanded beads of an olefin thermoplastic elastomer, a voidage of the expanded beads molded article is 5 to 40%; a density of the expanded beads molded article is 30 to 150 g/L; and a flexural modulus of the olefin thermoplastic elastomer that constitutes the expanded beads molded article is 10 to 100 MPa.

IPC Classes  ?

  • C08J 9/232 - Forming foamed products by sintering expandable particles
  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08L 53/00 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
  • C08J 9/228 - Forming foamed products

32.

COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Application Number 18218193
Status Pending
Filing Date 2023-07-05
First Publication Date 2024-01-04
Owner JSR CORPORATION (Japan)
Inventor
  • Kasai, Tatsuya
  • Furusawa, Ayaka
  • Sakai, Kazunori
  • Serizawa, Ryuichi

Abstract

A composition includes: a solvent; and a compound including: at least one structural unit selected from the group consisting of a structural unit represented by formula (1-1) and a structural unit represented by formula (1-2); and a structural unit represented by formula (2-1). X is a monovalent organic group other than an alkoxy group, the monovalent organic group having 1 to 20 carbon atoms and having at least one fluorine atom; Y is a monovalent organic group having 1 to 20 carbon atoms, a hydroxy group, or a halogen atom; R0 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms; R1 is a monovalent organic group having 1 to 20 carbon atoms and having no fluorine atom, a hydroxy group, a hydrogen atom, or a halogen atom; and R2 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms. A composition includes: a solvent; and a compound including: at least one structural unit selected from the group consisting of a structural unit represented by formula (1-1) and a structural unit represented by formula (1-2); and a structural unit represented by formula (2-1). X is a monovalent organic group other than an alkoxy group, the monovalent organic group having 1 to 20 carbon atoms and having at least one fluorine atom; Y is a monovalent organic group having 1 to 20 carbon atoms, a hydroxy group, or a halogen atom; R0 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms; R1 is a monovalent organic group having 1 to 20 carbon atoms and having no fluorine atom, a hydroxy group, a hydrogen atom, or a halogen atom; and R2 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms.

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C08G 77/04 - Polysiloxanes
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

33.

RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERN

      
Application Number 18025989
Status Pending
Filing Date 2021-08-03
First Publication Date 2024-01-04
Owner JSR CORPORATION (Japan)
Inventor Maruyama, Ken

Abstract

Provided is a radiation-sensitive resin composition capable of exhibiting sensitivity and CDU performance at a sufficient level when a next-generation technology is applied, and a method for forming a pattern. A radiation-sensitive resin composition contains one or two or more onium salts containing an organic acid anion moiety and an onium cation moiety, a compound having a structure in which an alkoxycarbonyl group is bonded to a nitrogen atom, and a solvent, wherein at least part of the organic acid anion moiety in the onium salt contains an iodine-substituted aromatic ring structure, and at least part of the onium cation moiety contains a fluorine-substituted aromatic ring structure.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable

34.

COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, POLYMER, AND METHOD FOR MANUFACTURING POLYMER

      
Application Number 18244460
Status Pending
Filing Date 2023-09-11
First Publication Date 2023-12-28
Owner JSR CORPORATION (Japan)
Inventor
  • Nakatsu, Hiroki
  • Yamada, Shuhei
  • Abe, Shinya
  • Tsuji, Takashi
  • Ueda, Kanako
  • Miyauchi, Hiroyuki

Abstract

A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. In the formula (1), Ar1 is a divalent group including an aromatic ring having 10 to 40 ring atoms; and R0 is a monovalent group including a heteroaromatic ring which includes a sulfur atom as a ring-forming atom. A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. In the formula (1), Ar1 is a divalent group including an aromatic ring having 10 to 40 ring atoms; and R0 is a monovalent group including a heteroaromatic ring which includes a sulfur atom as a ring-forming atom.

IPC Classes  ?

  • C08F 28/06 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic ring containing sulfur by a heterocyclic ring containing sulfur
  • C08F 24/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen

35.

COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, POLYMER, AND METHOD FOR MANUFACTURING POLYMER

      
Application Number 18239373
Status Pending
Filing Date 2023-08-29
First Publication Date 2023-12-28
Owner JSR CORPORATION (Japan)
Inventor
  • Yamada, Shuhei
  • Abe, Shinya
  • Tsuji, Takashi
  • Ueda, Kanako
  • Nakatsu, Hiroki
  • Miyauchi, Hiroyuki

Abstract

A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. In the formula (1), Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a group represented by formula (1-1) or (1-2). In the formulas (1-1) and (1-2), X1 and X2 are each independently a group represented by formula (i), (ii), (iii) or (iv); * is a bond with the carbon atom in the formula (1); and Ar2, Ar3 and Ar4 are each independently a substituted or unsubstituted aromatic ring having 6 to 20 ring atoms that forms a fused ring structure together with the two adjacent carbon atoms in the formulas (1-1) and (1-2). A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. In the formula (1), Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a group represented by formula (1-1) or (1-2). In the formulas (1-1) and (1-2), X1 and X2 are each independently a group represented by formula (i), (ii), (iii) or (iv); * is a bond with the carbon atom in the formula (1); and Ar2, Ar3 and Ar4 are each independently a substituted or unsubstituted aromatic ring having 6 to 20 ring atoms that forms a fused ring structure together with the two adjacent carbon atoms in the formulas (1-1) and (1-2).

IPC Classes  ?

  • C08G 61/02 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
  • G03F 7/004 - Photosensitive materials
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable

36.

METHOD FOR PRODUCING POLYAMIDE-BASED RESIN MULTI-STAGE-EXPANDED BEADS

      
Application Number 18030561
Status Pending
Filing Date 2021-10-13
First Publication Date 2023-12-21
Owner JSP CORPORATION (Japan)
Inventor Otsuka, Tetsu

Abstract

A method for producing polyamide-based resin multi-stage expanded beads includes an internal pressure applying step of placing polyamide-based resin expanded beads in a pressure-resistant container, impregnating the polyamide-based resin expanded beads with a physical blowing agent in the pressure-resistant container to apply internal pressure higher than atmospheric pressure; and a heating and foaming step of heating and expanding the polyamide-based resin expanded beads to which internal pressure is applied obtained in the internal pressure applying step to obtain polyamide-based resin multi-stage expanded beads having apparent density lower than that of polyamide-based resin expanded beads used in the internal pressure applying step, in the internal pressure applying step, polyamide-based resin expanded beads in a wet state having a water content of 1% or more being impregnated with the physical blowing agent at a temperature higher than change-point temperature of storage modulus of the polyamide-based resin expanded beads in a wet state.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
  • C08J 9/228 - Forming foamed products

37.

RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ONIUM SALT COMPOUND

      
Application Number 18198971
Status Pending
Filing Date 2023-05-18
First Publication Date 2023-12-14
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Sakano, Nozomi

Abstract

A radiation-sensitive resin composition includes: an onium salt compound represented by formula (1). R1 is a monovalent hydrocarbon group having 1 to 20 carbon atoms; R2 and R3 are each independently a monovalent hydrocarbon group having 1 to 20 carbon atoms, or R2 and R3 taken together represent a cyclic structure having 3 to 20 ring atoms; R4 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms and L1 is a divalent linking group having 1 to 40 carbon atoms, or R4 and L1 taken together represent a group including a heterocyclic structure having 3 to 20 ring atoms; Rf1 and Rf2 are each independently a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or a monovalent fluorinated hydrocarbon group having 1 to 10 carbon atoms. A radiation-sensitive resin composition includes: an onium salt compound represented by formula (1). R1 is a monovalent hydrocarbon group having 1 to 20 carbon atoms; R2 and R3 are each independently a monovalent hydrocarbon group having 1 to 20 carbon atoms, or R2 and R3 taken together represent a cyclic structure having 3 to 20 ring atoms; R4 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms and L1 is a divalent linking group having 1 to 40 carbon atoms, or R4 and L1 taken together represent a group including a heterocyclic structure having 3 to 20 ring atoms; Rf1 and Rf2 are each independently a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or a monovalent fluorinated hydrocarbon group having 1 to 10 carbon atoms.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
  • C08F 220/36 - Esters containing nitrogen containing oxygen in addition to the carboxy oxygen
  • C08F 220/38 - Esters containing sulfur
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C07C 381/12 - Sulfonium compounds
  • C07D 211/62 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals attached in position 4
  • C07D 211/60 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
  • C07D 207/16 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
  • C07D 327/06 - Six-membered rings
  • C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
  • C07D 405/12 - Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings linked by a chain containing hetero atoms as chain links
  • C07D 493/10 - Spiro-condensed systems

38.

RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMER, AND COMPOUND

      
Application Number 18239399
Status Pending
Filing Date 2023-08-29
First Publication Date 2023-12-14
Owner JSR CORPORATION (Japan)
Inventor
  • Omiya, Takuya
  • Nishikori, Katsuaki
  • Kiriyama, Kazuya
  • Kinoshita, Natsuko
  • Kaneko, Tetsurou

Abstract

A radiation-sensitive resin composition includes: a polymer including a first structural unit represented by formula (1); and a radiation-sensitive acid generator. In the formula (1), R1 represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; R2, R3, and R4 each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; R5 represents a monovalent organic group having 1 to 20 carbon atoms; and L represents a single bond or a divalent organic group having 1 to 20 carbon atoms. A radiation-sensitive resin composition includes: a polymer including a first structural unit represented by formula (1); and a radiation-sensitive acid generator. In the formula (1), R1 represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; R2, R3, and R4 each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; R5 represents a monovalent organic group having 1 to 20 carbon atoms; and L represents a single bond or a divalent organic group having 1 to 20 carbon atoms.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/004 - Photosensitive materials
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C07C 69/54 - Acrylic acid esters; Methacrylic acid esters
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F 220/24 - Esters containing halogen containing perhaloalkyl radicals
  • C08F 220/22 - Esters containing halogen
  • C08F 220/30 - Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
  • C08F 220/34 - Esters containing nitrogen

39.

RADIATION-SENSITIVE COMPOSITION AND METHOD OF FORMING RESIST PATTERN

      
Application Number 18266061
Status Pending
Filing Date 2021-11-15
First Publication Date 2023-12-14
Owner JSR CORPORATION (Japan)
Inventor Maruyama, Ken

Abstract

A radiation-sensitive composition includes: a polymer (A) including a structural unit having a hydroxyl group bonded to an aromatic ring; and an acid-generating compound including a radiation-sensitive onium cation and an organic anion (provided that the polymer (A) is excluded), in which, at least one compound selected from the group consisting of the polymer (A) and the acid-generating compound includes a radiation-sensitive onium cation structure [X] having two or more of at least one substituent β selected from the group consisting of a fluoroalkyl group and a fluoro group (provided that the fluoro group in the fluoroalkyl group is excluded); and an organic anion structure [Y] having an iodo group, in the same compound or different compounds.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/004 - Photosensitive materials
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/30 - Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable

40.

METHOD FOR PRODUCING VERTICAL ORGANIC LIGHT-EMITTING TRANSISTOR DEVICE, DISPLAY

      
Application Number 17836389
Status Pending
Filing Date 2022-06-09
First Publication Date 2023-12-14
Owner
  • JSR CORPORATION (Japan)
  • Mattrix Technologies, Inc (USA)
Inventor
  • Katsui, Hiromitsu
  • Liu, Bo
  • Lemaitre, Maxime
  • Yasuda, Hiroyuki

Abstract

The method for producing a vertical organic light-emitting transistor device includes: a step (A) in which a substrate having a main surface, on which the vertical organic light-emitting transistor device is to be formed, is prepared; a step (B) in which an organic material containing a polymer having a hydrocarbon group is applied onto the main surface of the substrate; a step (C) in which a dispersion liquid containing a dispersant and a carbon material is applied onto an organic material layer formed in the step (B); a step (D) in which a coating film formed in the step (C) is dried; and a step (E) in which after the step (D) is performed, a cleaning fluid is applied to remove the dispersant.

IPC Classes  ?

  • H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices

41.

RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYMER, AND COMPOUND

      
Application Number 18235420
Status Pending
Filing Date 2023-08-18
First Publication Date 2023-12-07
Owner JSR CORPORATION (Japan)
Inventor
  • Sakano, Nozomi
  • Nemoto, Ryuichi

Abstract

A radiation-sensitive resin composition includes a resin including a structural unit represented by formula (1), a radiation-sensitive acid generator, and a solvent. R1 is a hydrogen atom, a fluorine atom, or the like. R2 and R3 each independently represent a monovalent hydrocarbon group having 1 to 10 carbon atoms, or the like. R4 is a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or the like. R5 and R6 each independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or the like. R7 and R8 each independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or the like. R9 and R10 each independently represent a monovalent organic group having 1 to 10 carbon atoms, or the like. A radiation-sensitive resin composition includes a resin including a structural unit represented by formula (1), a radiation-sensitive acid generator, and a solvent. R1 is a hydrogen atom, a fluorine atom, or the like. R2 and R3 each independently represent a monovalent hydrocarbon group having 1 to 10 carbon atoms, or the like. R4 is a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or the like. R5 and R6 each independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or the like. R7 and R8 each independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or the like. R9 and R10 each independently represent a monovalent organic group having 1 to 10 carbon atoms, or the like.

IPC Classes  ?

  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C07D 317/72 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 spiro-condensed with carbocyclic rings
  • C07D 493/10 - Spiro-condensed systems
  • C07D 317/24 - Radicals substituted by singly bound oxygen or sulfur atoms esterified
  • C08F 220/30 - Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
  • C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

42.

RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING PATTERN, POLYMER, AND COMPOUND

      
Application Number 18135838
Status Pending
Filing Date 2023-04-18
First Publication Date 2023-11-30
Owner JSR CORPORATION (Japan)
Inventor
  • Omiya, Takuya
  • Nishikori, Katsuaki
  • Kiriyama, Kazuya
  • Matsumura, Yuushi
  • Kinoshita, Natsuko

Abstract

A radiation-sensitive resin composition includes: a resin including a structural unit represented by formula (1); a radiation-sensitive acid generator; and a solvent. R1 is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; L1 represents a single bond or —COO-L-; L represents a substituted or unsubstituted alkanediyl group; R2 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; L2 represents a single bond or a divalent linking group; and Ar represents a group obtained by removing (n+1) hydrogen atoms from an aromatic ring. R3 is independently a halogen atom, a halogenated hydrocarbon group, a hydroxy group, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or a monovalent alkyl ether group having 1 to 10 carbon atoms, and at least one R3 is a halogen atom or a halogenated hydrocarbon group. A radiation-sensitive resin composition includes: a resin including a structural unit represented by formula (1); a radiation-sensitive acid generator; and a solvent. R1 is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; L1 represents a single bond or —COO-L-; L represents a substituted or unsubstituted alkanediyl group; R2 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; L2 represents a single bond or a divalent linking group; and Ar represents a group obtained by removing (n+1) hydrogen atoms from an aromatic ring. R3 is independently a halogen atom, a halogenated hydrocarbon group, a hydroxy group, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or a monovalent alkyl ether group having 1 to 10 carbon atoms, and at least one R3 is a halogen atom or a halogenated hydrocarbon group.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C08F 136/16 - Homopolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds conjugated containing elements other than carbon and hydrogen containing halogen
  • C07C 69/653 - Acrylic acid esters; Methacrylic acid esters; Haloacrylic acid esters; Halomethacrylic acid esters

43.

POLYOLEFIN RESIN FOAM PARTICLES, METHOD FOR PRODUCING SAME, AND MOLDED ARTICLE OF POLYOLEFIN RESIN FOAM PARTICLES

      
Application Number 18040853
Status Pending
Filing Date 2021-05-25
First Publication Date 2023-11-02
Owner JSP CORPORATION (Japan)
Inventor Yamasaki, Shobu

Abstract

A polyolefin-based resin expanded bead contains a base resin containing a polyolefin-based resin as a main component, carbon black, and a flame-retardant. A bulk density of the polyolefin-based resin expanded beads is 10 to 100 kg/m3. A blending amount of the carbon black is 0.5 to 10 parts by mass based on 100 parts by mass of the base resin. The flame-retardant contains a hindered amine-based compound represented by the following general formula (I), and a blending amount of the hindered amine-based compound is 0.01 to 1 parts by mass based on 100 parts by mass of the base resin. A polyolefin-based resin expanded bead contains a base resin containing a polyolefin-based resin as a main component, carbon black, and a flame-retardant. A bulk density of the polyolefin-based resin expanded beads is 10 to 100 kg/m3. A blending amount of the carbon black is 0.5 to 10 parts by mass based on 100 parts by mass of the base resin. The flame-retardant contains a hindered amine-based compound represented by the following general formula (I), and a blending amount of the hindered amine-based compound is 0.01 to 1 parts by mass based on 100 parts by mass of the base resin.

IPC Classes  ?

44.

RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Application Number 18215863
Status Pending
Filing Date 2023-06-29
First Publication Date 2023-10-26
Owner JSR CORPORATION (Japan)
Inventor Maruyama, Ken

Abstract

A radiation-sensitive resin composition includes: a base resin comprising a structure unit having an acid-dissociable group; and a radiation-sensitive acid generator which comprises compounds represented by formula (2) and formula (3), and optionally a compound represented by formula (1). R1-R3 are each independently a group having a cyclic structure. X11-X32 are each independently a hydrogen atom, a fluorine atom, or a fluorinated hydrocarbon group. At least one of X11 or X12, at least one of X21 or X22, and at least one of X31 or X32 are not a hydrogen atom, respectively. A11-A32 are each independently a hydrogen atom, or a hydrocarbon group having a carbon number of 1 to 20. The radiation-sensitive resin composition does not comprise a ketone-based solvent. The the radiation-sensitive resin composition does not comprise a monovalent onium cation other than an onium cation represented by formulas (X-1), (X-3), (X-4), or (X-5). A radiation-sensitive resin composition includes: a base resin comprising a structure unit having an acid-dissociable group; and a radiation-sensitive acid generator which comprises compounds represented by formula (2) and formula (3), and optionally a compound represented by formula (1). R1-R3 are each independently a group having a cyclic structure. X11-X32 are each independently a hydrogen atom, a fluorine atom, or a fluorinated hydrocarbon group. At least one of X11 or X12, at least one of X21 or X22, and at least one of X31 or X32 are not a hydrogen atom, respectively. A11-A32 are each independently a hydrogen atom, or a hydrocarbon group having a carbon number of 1 to 20. The radiation-sensitive resin composition does not comprise a ketone-based solvent. The the radiation-sensitive resin composition does not comprise a monovalent onium cation other than an onium cation represented by formulas (X-1), (X-3), (X-4), or (X-5).

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/16 - Coating processes; Apparatus therefor
  • G03F 7/40 - Treatment after imagewise removal, e.g. baking
  • G03F 7/20 - Exposure; Apparatus therefor
  • G03F 7/38 - Treatment before imagewise removal, e.g. prebaking
  • G03F 7/32 - Liquid compositions therefor, e.g. developers
  • C07C 309/24 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of a carbon skeleton containing six-membered aromatic rings
  • C07C 309/06 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing halogen atoms, or nitro or nitroso groups bound to the carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
  • C07C 309/19 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of a saturated carbon skeleton containing rings
  • C07C 303/32 - Preparation of esters or amides of sulfuric acids; Preparation of sulfonic acids or of their esters, halides, anhydrides or amides of salts of sulfonic acids
  • G03F 7/30 - Imagewise removal using liquid means

45.

PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

      
Application Number 18023760
Status Pending
Filing Date 2021-08-19
First Publication Date 2023-10-26
Owner JSR CORPORATION (Japan)
Inventor
  • Miyaki, Nobuyuki
  • Kawashima, Naoyuki
  • Yamashita, Yuutoku
  • Anabuki, Shouma
  • Nishino, Kenta
  • Kameyama, Takeru

Abstract

Provided is a prepreg for producing a multilayer printed wiring board having high reliability and being excellent in adhesiveness with respect to a base material or the like. The prepreg includes: a base material; and a polymer having a structural unit represented by at least one kind of the following formulae (1-1), (1-2), and (1-3). Provided is a prepreg for producing a multilayer printed wiring board having high reliability and being excellent in adhesiveness with respect to a base material or the like. The prepreg includes: a base material; and a polymer having a structural unit represented by at least one kind of the following formulae (1-1), (1-2), and (1-3).

IPC Classes  ?

  • H05K 1/03 - Use of materials for the substrate
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
  • H05K 3/46 - Manufacturing multi-layer circuits

46.

SILICON-CONTAINING COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Application Number 18198954
Status Pending
Filing Date 2023-05-18
First Publication Date 2023-10-26
Owner JSR CORPORATION (Japan)
Inventor
  • Seko, Tomoaki
  • Anno, Yusuke
  • Nii, Akitaka
  • Nemoto, Ryuichi
  • Nishimura, Souta

Abstract

A silicon-containing composition includes: a polysiloxane including a first structural unit represented by formula (1); and a solvent. X is an alkali-dissociable group; a is an integer of 1 to 3; and when a is 2 or more, a plurality of Xs are the same or different from each other. R1 is a monovalent organic group having 1 to 20 carbon atoms, a hydroxy group, or a halogen atom; b is an integer of 0 to 2; and when b is 2, two R1s are the same or different from each other. a + b is 3 or less. A silicon-containing composition includes: a polysiloxane including a first structural unit represented by formula (1); and a solvent. X is an alkali-dissociable group; a is an integer of 1 to 3; and when a is 2 or more, a plurality of Xs are the same or different from each other. R1 is a monovalent organic group having 1 to 20 carbon atoms, a hydroxy group, or a halogen atom; b is an integer of 0 to 2; and when b is 2, two R1s are the same or different from each other. a + b is 3 or less.

IPC Classes  ?

  • G03F 7/32 - Liquid compositions therefor, e.g. developers
  • C08L 83/04 - Polysiloxanes
  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • G03F 7/20 - Exposure; Apparatus therefor

47.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION

      
Application Number 18209751
Status Pending
Filing Date 2023-06-14
First Publication Date 2023-10-26
Owner JSR CORPORATION (Japan)
Inventor
  • Nosaka, Naoya
  • Ehara, Kengo
  • Nakatsu, Hiroki
  • Dobashi, Masato
  • Miyauchi, Hiroyuki

Abstract

A method for manufacturing a semiconductor substrate includes forming a resist underlayer film directly or indirectly on a substrate by applying a composition. The composition includes a compound and a solvent. The compound includes: at least one nitrogen-containing ring structure selected from the group consisting of a pyridine ring structure and a pyrimidine ring structure; and a partial structure represented by formula (1-1) or (1-2). X1 and X2 are each independently a group represented by formula (i), (ii), (iii), or (iv); * is a bond with a moiety of the compound other than the partial structure represented by formula (1-1) or (1-2); and Ar11 and Ar12 are each independently a substituted or unsubstituted aromatic ring having 5 to 20 ring members that forms a fused ring structure together with the two adjacent carbon atoms in the formulas (1-1) and (1-2). A method for manufacturing a semiconductor substrate includes forming a resist underlayer film directly or indirectly on a substrate by applying a composition. The composition includes a compound and a solvent. The compound includes: at least one nitrogen-containing ring structure selected from the group consisting of a pyridine ring structure and a pyrimidine ring structure; and a partial structure represented by formula (1-1) or (1-2). X1 and X2 are each independently a group represented by formula (i), (ii), (iii), or (iv); * is a bond with a moiety of the compound other than the partial structure represented by formula (1-1) or (1-2); and Ar11 and Ar12 are each independently a substituted or unsubstituted aromatic ring having 5 to 20 ring members that forms a fused ring structure together with the two adjacent carbon atoms in the formulas (1-1) and (1-2).

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • G03F 7/09 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers
  • G03F 7/38 - Treatment before imagewise removal, e.g. prebaking
  • H01L 21/311 - Etching the insulating layers

48.

CONJUGATE AND PHOTOIMMUNOTHERAPY

      
Application Number 18044728
Status Pending
Filing Date 2021-09-07
First Publication Date 2023-10-19
Owner
  • JSR CORPORATION (Japan)
  • NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (Japan)
Inventor
  • Sato, Kazuhide
  • Yukawa, Hiroshi
  • Matsuoka, Kohei
  • Ueya, Yuuichi
  • Shimada, Mibuko
  • Ono, Kenichiro

Abstract

Provided is a drug useful for photoimmunotherapy. Specifically, provided is a conjugate including an antibody molecule, a particle having an average particle diameter of 100 nm or less, and a photosensitive portion. In the conjugate, the particle having an average particle diameter of 100 nm or less is linked to the antibody molecule, and at least one of the antibody molecule or the particle is bound to the photosensitive portion. The photosensitive portion is a portion showing increase of hydrophobicity when irradiated with a light beam having a wavelength of from 500 nm to 900 nm or a portion containing a phthalocyanine skeleton.

IPC Classes  ?

  • A61K 47/68 - Medicinal preparations characterised by the non-active ingredients used, e.g. carriers or inert additives; Targeting or modifying agents chemically bound to the active ingredient the non-active ingredient being chemically bound to the active ingredient, e.g. polymer-drug conjugates the non-active ingredient being a modifying agent the modifying agent being an antibody, an immunoglobulin or a fragment thereof, e.g. an Fc-fragment
  • A61K 41/00 - Medicinal preparations obtained by treating materials with wave energy or particle radiation
  • A61K 49/18 - Nuclear magnetic resonance (NMR) contrast preparations; Magnetic resonance imaging (MRI) contrast preparations characterised by a special physical form, e.g. emulsions, microcapsules, liposomes

49.

Display

      
Application Number 18022223
Grant Number 11963413
Status In Force
Filing Date 2021-08-12
First Publication Date 2023-10-05
Grant Date 2024-04-16
Owner
  • JSR CORPORATION (Japan)
  • MATTRIX TECHNOLOGIES, INC. (USA)
Inventor
  • Katsui, Hiromitsu
  • Liu, Bo
  • Lemaitre, Maxime

Abstract

A liquid crystal display device includes: a substrate; a plurality of vertical organic light-emitting transistors; a data line that supplies a voltage to a gate electrode of the vertical organic light-emitting transistor; a thin-film transistor that is connected between the gate electrode of each of the vertical organic light-emitting transistors and the data line and controls supply of the voltage to the gate electrode of the vertical organic light-emitting transistor; a gate line that is connected to the gate electrode of the thin-film transistor and transmits a signal for switching the thin-film transistor; and a plurality of current supply lines that are wired in a first direction outside a formation region of the vertical organic light-emitting transistor, the current supply lines being in contact with a source electrode of the vertical organic light-emitting transistor to supply a current to the vertical organic light-emitting transistor.

IPC Classes  ?

  • H10K 59/131 - Interconnections, e.g. wiring lines or terminals
  • G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
  • H10K 50/30 - Organic light-emitting transistors
  • H10K 59/12 - Active-matrix OLED [AMOLED] displays

50.

RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING MONOMERIC COMPOUND

      
Application Number 18197225
Status Pending
Filing Date 2023-05-15
First Publication Date 2023-09-07
Owner JSR CORPORATION (Japan)
Inventor Kinoshita, Natsuko

Abstract

A radiation-sensitive resin composition includes: a resin containing a structural unit A represented by formula (1); at least one radiation-sensitive acid generator selected from the group consisting of a radiation-sensitive acid generator represented by formula (2-1) and a radiation-sensitive acid generator represented formula (2-2); and a solvent. At least one R3 is an acid-dissociable group; and R41 is a hydrogen atom or a protective group to be deprotected by action of an acid. At least one of Rf1 and Rf2 is a fluorine atom or a fluoroalkyl group; R5a is a monovalent organic group having a cyclic structure; X1+ is a monovalent onium cation; R5b is a monovalent organic group, and X2+ is a monovalent onium cation whose atom having a positive charge is not an atom forming a cyclic structure. A radiation-sensitive resin composition includes: a resin containing a structural unit A represented by formula (1); at least one radiation-sensitive acid generator selected from the group consisting of a radiation-sensitive acid generator represented by formula (2-1) and a radiation-sensitive acid generator represented formula (2-2); and a solvent. At least one R3 is an acid-dissociable group; and R41 is a hydrogen atom or a protective group to be deprotected by action of an acid. At least one of Rf1 and Rf2 is a fluorine atom or a fluoroalkyl group; R5a is a monovalent organic group having a cyclic structure; X1+ is a monovalent onium cation; R5b is a monovalent organic group, and X2+ is a monovalent onium cation whose atom having a positive charge is not an atom forming a cyclic structure.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C08F 220/14 - Methyl esters
  • G03F 7/004 - Photosensitive materials
  • C08F 220/22 - Esters containing halogen
  • C08F 220/16 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
  • G03F 7/30 - Imagewise removal using liquid means
  • C08F 212/00 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring

51.

RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD

      
Application Number 18024309
Status Pending
Filing Date 2021-08-17
First Publication Date 2023-08-31
Owner JSR CORPORATION (Japan)
Inventor Maruyama, Ken

Abstract

Provided is a radiation-sensitive resin composition capable of exhibiting sensitivity and CDU performance at a sufficient level when a next-generation technology is applied, and a pattern formation method. A radiation-sensitive resin composition containing: a radiation-sensitive acid generating resin comprising a repeating unit A having an acid-dissociable group represented by the following formula (1) and a repeating unit B including an organic acid anion moiety and a sulfonium cation moiety containing an aromatic ring structure having a fluorine atom; and a solvent; in the formula (1), RT is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; RX is a monovalent hydrocarbon group having 2 to 20 carbon atoms; and Cy represents an alicyclic structure having 3 to 20 ring members and formed together with a carbon atom to which this is bonded. Provided is a radiation-sensitive resin composition capable of exhibiting sensitivity and CDU performance at a sufficient level when a next-generation technology is applied, and a pattern formation method. A radiation-sensitive resin composition containing: a radiation-sensitive acid generating resin comprising a repeating unit A having an acid-dissociable group represented by the following formula (1) and a repeating unit B including an organic acid anion moiety and a sulfonium cation moiety containing an aromatic ring structure having a fluorine atom; and a solvent; in the formula (1), RT is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; RX is a monovalent hydrocarbon group having 2 to 20 carbon atoms; and Cy represents an alicyclic structure having 3 to 20 ring members and formed together with a carbon atom to which this is bonded.

IPC Classes  ?

  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

52.

METHOD OF CULTURING HUMAN INDUCED PLURIPOTENT STEM CELLS, CULTURE OF HUMAN INDUCED PLURIPOTENT STEM CELLS, AND METHOD OF PRODUCING CEREBRAL ORGANOIDS

      
Application Number 18107597
Status Pending
Filing Date 2023-02-09
First Publication Date 2023-08-17
Owner
  • JSR CORPORATION (Japan)
  • KEIO UNIVERSITY (Japan)
Inventor
  • Hiramine, Hayato
  • Shiozawa, Seiji
  • Okano, Hideyuki
  • Ishikawa, Mitsuru

Abstract

A method of culturing human induced pluripotent stem cells includes inoculating human induced pluripotent stem cells in a culture medium at an inoculation density of 1.0×104 to 1.0×106 cells/cm2 in a culture vessel and subjecting the human induced pluripotent stem cells to two-dimensional culturing. A method of producing cerebral organoids includes culturing a culture of the human induced pluripotent stem cells obtained by the method of culturing human induced pluripotent stem cells in a culture medium containing a BMP inhibitor and a transforming growth factor β (TGFβ) inhibitor to form cell aggregates, culturing the cell aggregates in a culture medium containing a Wnt signal transduction pathway potentiator and an extracellular matrix, and subjecting the culturing obtained in the culturing the cell aggregates to spinner culturing.

IPC Classes  ?

  • C12N 5/0797 - Stem cells; Progenitor cells
  • C12N 5/074 - Adult stem cells
  • C12P 19/32 - Nucleotides having a condensed ring system containing a six-membered ring having two nitrogen atoms in the same-ring, e.g. purine nucleotides, nicotineamide-adenine dinucleotide

53.

COMPOSITION, UNDERLAYER FILM, AND DIRECTED SELF-ASSEMBLY LITHOGRAPHY PROCESS

      
Application Number 18138873
Status Pending
Filing Date 2023-04-25
First Publication Date 2023-08-17
Owner JSR CORPORATION (Japan)
Inventor
  • Tamada, Miki
  • Kumegawa, Ryo
  • Komatsu, Hiroyuki
  • Shiratani, Motohiro
  • Maruyama, Ken
  • Osawa, Sosuke

Abstract

A composition includes: at least one polymer represented by formula (1), formula (2), or both; and a solvent. A1 and A2 are each independently a structural unit having 2 or more carbon atoms; a plurality of A's are the same or different and a plurality of A2s are the same or different; n1 and n2 are each independently an integer of 2 to 500; R1, R2, and R3 are each independently an organic group having 1 or more carbon atoms, or R1 and R2 taken together represent a ring together with X1, Y1, and P; R1 and R2 are the same or different; X1, Y1, and Y2 are each independently a single bond, —O—, or —NR4—; R4 is an organic group having 1 or more carbon atoms; and Z1 and Z2 are each independently hydrogen or an organic group having 1 to 15 carbon atoms. A composition includes: at least one polymer represented by formula (1), formula (2), or both; and a solvent. A1 and A2 are each independently a structural unit having 2 or more carbon atoms; a plurality of A's are the same or different and a plurality of A2s are the same or different; n1 and n2 are each independently an integer of 2 to 500; R1, R2, and R3 are each independently an organic group having 1 or more carbon atoms, or R1 and R2 taken together represent a ring together with X1, Y1, and P; R1 and R2 are the same or different; X1, Y1, and Y2 are each independently a single bond, —O—, or —NR4—; R4 is an organic group having 1 or more carbon atoms; and Z1 and Z2 are each independently hydrogen or an organic group having 1 to 15 carbon atoms.

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C08F 112/08 - Styrene
  • C08F 120/14 - Methyl esters
  • C09D 125/06 - Polystyrene
  • C09D 133/12 - Homopolymers or copolymers of methyl methacrylate

54.

SILICON-CONTAINING COMPOSITION AND METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE

      
Application Number 17887670
Status Pending
Filing Date 2022-08-15
First Publication Date 2023-08-10
Owner JSR CORPORATION (Japan)
Inventor
  • Serizawa, Ryuichi
  • Hirasawa, Kengo

Abstract

A silicon-containing composition includes a polysiloxane compound and solvent. The polysiloxane compound includes a fluorine atom and a group including an ester bond. The polysiloxane compound preferably includes a first structural unit represented by formula (1), and a second structural unit represented by formula (2). X represents a monovalent organic group having 1 to 20 carbon atoms and comprising a fluorine atom; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms; Y represents a monovalent organic group having 1 to 20 carbon atoms and comprising an ester bond; and R2 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms. A silicon-containing composition includes a polysiloxane compound and solvent. The polysiloxane compound includes a fluorine atom and a group including an ester bond. The polysiloxane compound preferably includes a first structural unit represented by formula (1), and a second structural unit represented by formula (2). X represents a monovalent organic group having 1 to 20 carbon atoms and comprising a fluorine atom; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms; Y represents a monovalent organic group having 1 to 20 carbon atoms and comprising an ester bond; and R2 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms.

IPC Classes  ?

  • C08G 77/24 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen halogen-containing groups
  • G03F 7/075 - Silicon-containing compounds
  • G03F 7/32 - Liquid compositions therefor, e.g. developers
  • G03F 7/20 - Exposure; Apparatus therefor

55.

Radiation-sensitive resin composition, method of forming resist pattern, and compound

      
Application Number 17854048
Grant Number 11966161
Status In Force
Filing Date 2022-06-30
First Publication Date 2023-08-03
Grant Date 2024-04-23
Owner JSR CORPORATION (Japan)
Inventor
  • Taniguchi, Takuhiro
  • Nishikori, Katsuaki
  • Namai, Hayato
  • Kiriyama, Kazuya
  • Maruyama, Ken

Abstract

7)CO—.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 303/32 - Preparation of esters or amides of sulfuric acids; Preparation of sulfonic acids or of their esters, halides, anhydrides or amides of salts of sulfonic acids
  • C07C 381/12 - Sulfonium compounds
  • C08G 75/20 - Polysulfones
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

56.

METHOD FOR FORMING PROTECTIVE FILM, METHOD FOR MANUFACTURING PATTERNED SUBSTRATE, AND COMPOSITION

      
Application Number 18127066
Status Pending
Filing Date 2023-03-28
First Publication Date 2023-08-03
Owner JSR CORPORATION (Japan)
Inventor
  • Takanashi, Kazunori
  • Miyauchi, Hiroyuki
  • Okumura, Nao
  • Kawazu, Tomoharu
  • Dei, Satoshi

Abstract

A method for forming a protective film includes directly or indirectly coating only a periphery of a substrate with a composition. The composition includes a compound having an aromatic ring, and a solvent. The solvent includes a first solvent having a normal boiling point of 156° C. or higher and lower than 300° C. A content of the first solvent in the solvent is preferably 20 mass % or more and 100 mass % or less. The first solvent is preferably an ester, an alcohol, an ether, a carbonate, or a combination of two or more of an ester, an alcohol, an ether, and a carbonate.

IPC Classes  ?

  • C09D 165/02 - Polyphenylenes
  • C09D 7/20 - Diluents or solvents
  • H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
  • H01L 21/311 - Etching the insulating layers
  • H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
  • C09D 5/16 - Anti-fouling paints; Underwater paints

57.

RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN

      
Application Number 17867739
Status Pending
Filing Date 2022-07-19
First Publication Date 2023-07-27
Owner JSR CORPORATION (Japan)
Inventor
  • Nishikori, Katsuaki
  • Kiriyama, Kazuya
  • Taniguchi, Takuhiro
  • Maruyama, Ken

Abstract

A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R1 represents a monovalent organic group having 1 to 30 carbon atoms; and X+ represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000. A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R1 represents a monovalent organic group having 1 to 30 carbon atoms; and X+ represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000. R1—COO−X+  (1)

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/029 - Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur

58.

RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND COMPOUND

      
Application Number 18100031
Status Pending
Filing Date 2023-01-23
First Publication Date 2023-07-27
Owner JSR CORPORATION (Japan)
Inventor
  • Kinoshita, Natsuko
  • Taniguchi, Takuhiro
  • Nishikori, Katsuaki
  • Kiriyama, Kazuya

Abstract

A radiation-sensitive resin composition includes: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; a radiation-sensitive acid generator; and a compound represented by formula (1). Ar1 represents a group obtained by removing (a+b+2) hydrogen atoms from an aromatic hydrocarbon ring having 6 to 30 ring atoms; R1 represents a halogen atom or a monovalent organic group having 1 to 20 carbon atoms; L1 represents a divalent linking group; R2 represents a substituted or unsubstituted monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms; a is an integer of 0 to 10, b is an integer of 1 to 10, wherein a sum of a and b is no greater than 10; and X+ represents a monovalent radiation-sensitive onium cation. A radiation-sensitive resin composition includes: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; a radiation-sensitive acid generator; and a compound represented by formula (1). Ar1 represents a group obtained by removing (a+b+2) hydrogen atoms from an aromatic hydrocarbon ring having 6 to 30 ring atoms; R1 represents a halogen atom or a monovalent organic group having 1 to 20 carbon atoms; L1 represents a divalent linking group; R2 represents a substituted or unsubstituted monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms; a is an integer of 0 to 10, b is an integer of 1 to 10, wherein a sum of a and b is no greater than 10; and X+ represents a monovalent radiation-sensitive onium cation.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 381/12 - Sulfonium compounds
  • C07C 65/24 - Compounds having carboxyl groups bound to carbon atoms of six-membered aromatic rings and containing any of the groups OH, O-metal, —CHO, keto, ether, groups, groups, or groups containing ether groups, groups, groups, or groups polycyclic
  • C07C 323/62 - Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atom of at least one of the thio groups bound to a carbon atom of a six-membered aromatic ring of the carbon skeleton
  • C07D 333/76 - Dibenzothiophenes
  • C07D 327/08 - [b, e]-condensed with two six-membered carbocyclic rings
  • C07C 69/92 - Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a six-membered aromatic ring of monocyclic hydroxy carboxylic acids, the hydroxy groups and the carboxyl groups of which are bound to carbon atoms of a six-membered aromatic ring with etherified hydroxyl groups
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms

59.

RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN

      
Application Number 17543789
Status Pending
Filing Date 2021-12-07
First Publication Date 2023-07-20
Owner JSR CORPORATION (Japan)
Inventor Nishikori, Katsuaki

Abstract

A radiation-sensitive resin composition includes: a polymer which has a first structural unit including a phenolic hydroxyl group, and a second structural unit represented by formula (1); and a radiation-sensitive acid generating agent which has a compound represented by formula (2). R1 represents a hydrogen atom, or the like; R2 represents a hydrogen atom or the like; and R3 represents a divalent monocyclic alicyclic hydrocarbon group having 3 to 12 ring atoms. Ar1 represents a group obtained by removing (q+1) hydrogen atoms on an aromatic ring from an arene formed by condensation of at least two benzene rings; R4 represents a monovalent organic group having 1 to 20 carbon atoms; q is an integer of 0 to 7; and R5 represents a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms, or the like. A radiation-sensitive resin composition includes: a polymer which has a first structural unit including a phenolic hydroxyl group, and a second structural unit represented by formula (1); and a radiation-sensitive acid generating agent which has a compound represented by formula (2). R1 represents a hydrogen atom, or the like; R2 represents a hydrogen atom or the like; and R3 represents a divalent monocyclic alicyclic hydrocarbon group having 3 to 12 ring atoms. Ar1 represents a group obtained by removing (q+1) hydrogen atoms on an aromatic ring from an arene formed by condensation of at least two benzene rings; R4 represents a monovalent organic group having 1 to 20 carbon atoms; q is an integer of 0 to 7; and R5 represents a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms, or the like.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C07D 327/04 - Five-membered rings
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
  • C07C 309/06 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing halogen atoms, or nitro or nitroso groups bound to the carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C07D 317/72 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 spiro-condensed with carbocyclic rings
  • G03F 7/004 - Photosensitive materials

60.

METHOD FOR MANUFACTURING ABRASIVE GRAINS, COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, AND METHOD FOR CHEMICAL MECHANICAL POLISHING

      
Application Number 17928279
Status Pending
Filing Date 2021-05-25
First Publication Date 2023-07-13
Owner JSR CORPORATION (Japan)
Inventor
  • Yanagi, Takanori
  • Wang, Pengyu
  • Nakanishi, Kouji
  • Yamada, Yuuya
  • Baba, Atsushi

Abstract

Provided are abrasive grains and a composition for chemical mechanical polishing which are for selectively polishing a silicon nitride film, and which are applicable not only to silicon oxide films but also to amorphous silicon films and polysilicon films. This method for manufacturing abrasive grains includes: a first step of heating a mixture which contains particles having a sulfanyl group (—SH) fixed to the surface thereof via covalent bonds, and which contains a compound having carbon-carbon unsaturated double bonds; and a second step, which is performed after the first step, of further adding a peroxide and carrying out heating.

IPC Classes  ?

  • C09G 1/02 - Polishing compositions containing abrasives or grinding agents
  • H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
  • C09K 3/14 - Anti-slip materials; Abrasives

61.

COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND METHOD FOR POLISHING

      
Application Number 17927899
Status Pending
Filing Date 2021-05-21
First Publication Date 2023-06-29
Owner JSR CORPORATION (Japan)
Inventor
  • Yamada, Yuuya
  • Yoshio, Kouhei

Abstract

A composition for chemical mechanical polishing and a polishing method allow a semiconductor substrate containing at least one of a polysilicon film and a silicon nitride film to be polished at a high speed, while being capable of reducing the incidence of surface defects in the polished surface. The composition for chemical mechanical polishing contains (A) abrasive grains having plural protrusions on their surfaces and (B) a liquid medium, wherein the absolute value of the zeta-potential of the component (A) in the composition for chemical mechanical polishing is 10 mV or more.

IPC Classes  ?

  • C09G 1/02 - Polishing compositions containing abrasives or grinding agents
  • H01L 21/3105 - After-treatment
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

62.

METHOD FOR PRODUCING OLIGODENDROCYTE-LIKE CELLS

      
Application Number 18116415
Status Pending
Filing Date 2023-03-02
First Publication Date 2023-06-29
Owner
  • JSR Corporation (Japan)
  • KEIO UNIVERSITY (Japan)
Inventor
  • Ishikawa, Mitsuru
  • Okano, Hideyuki

Abstract

A method is provided for producing oligodendrocyte-like cells, including (A) increasing abundances of oligodendrocyte transcription factor 2 (OLIG2) mutant and SRY-box transcription factor 10 (SOX10) in human pluripotent stein cells and (B) culturing the human pluripotent stem cells in which the abundances of the OLIG2 mutant and the SOX10 are increased and consequently differentiating the human pluripotent stem cells into oligodendrocyte-like cells, in which the OLIG2 mutant lacks a serine residue of wild-type OLIG2 at position 147, or the serine residue of the wild-type OLIG2 at position 147 is substituted with an amino acid other than serine.

IPC Classes  ?

63.

POLYOLEFIN-BASED RESIN EXPANDED BEADS, MOLDED ARTICLE OF POLYOLEFIN-BASED RESIN EXPANDED BEADS AND METHOD FOR PRODUCING POLYOLEFIN-BASED RESIN EXPANDED BEADS

      
Application Number 17439258
Status Pending
Filing Date 2020-03-09
First Publication Date 2023-06-29
Owner JSP CORPORATION (Japan)
Inventor
  • Sakamura, Takumi
  • Mochida, Naoki
  • Hira, Akinobu

Abstract

A molded article of polyolefin-based resin expanded beads having excellent appearance and further suppressed color unevenness is provided. A molded article of polyolefin-based resin expanded beads having excellent appearance and further suppressed color unevenness is provided. Polyolefin-based resin expanded beads obtained by expanding polyolefin-based resin particles including one or two or more metal borates selected from zinc borate and magnesium borate, wherein the particles of the metal borate has an arithmetic average particle diameter based on the number of 1 μm or more, and a number rate of the particles of the metal borate having a particle diameter of 5 μm or more is 20% or less. A method for producing polyolefin-based resin expanded beads by releasing expandable polyolefin-based resin particles containing one or two or more metal borates selected from zinc borate and magnesium borate and a physical blowing agent dispersed in an aqueous medium in a closed vessel together with the aqueous medium from the closed vessel to a low pressure region than an inside of the closed vessel to expand the expandable polyolefin-based resin particles, the method comprising: using a metal borate having an arithmetic average particle diameter based on the number of 1 μm or more and a number rate of the particles having a particle diameter of 5 μm or more of 20% or less as the metal borate.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
  • C08J 9/228 - Forming foamed products
  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
  • C08J 3/22 - Compounding polymers with additives, e.g. colouring using masterbatch techniques
  • C08K 3/38 - Boron-containing compounds

64.

METHOD FOR PREDICTING EFFICACY OF TREATMENT OF LUNG CANCER PATIENT USING IMMUNE CHECKPOINT INHIBITOR

      
Application Number 17759135
Status Pending
Filing Date 2021-03-25
First Publication Date 2023-06-29
Owner
  • JSR Corporation (Japan)
  • KEIO UNIVERSITY (Japan)
Inventor
  • Ueno, Masaru
  • Wakui, Seiki
  • Mizuuchi, Motoaki
  • Wakiuchi, Araki
  • Kawakami, Yutaka
  • Ohta, Shigeki

Abstract

A method for predicting efficacy of treatment of a lung cancer patient using an immune checkpoint inhibitor includes isolating exosomes from a biological sample derived from the lung cancer patient, and determining an expression level of a protein present in the exosomes by a mass spectrometry method, in which the protein is one or more proteins selected from the group of proteins shown in Table 1-1 to Table 1-6.

IPC Classes  ?

  • G01N 33/574 - Immunoassay; Biospecific binding assay; Materials therefor for cancer
  • G01N 33/68 - Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing involving proteins, peptides or amino acids

65.

COMPOSITION, UNDERLAYER FILM, AND DIRECTED SELF-ASSEMBLY LITHOGRAPHY PROCESS

      
Application Number 18108108
Status Pending
Filing Date 2023-02-10
First Publication Date 2023-06-29
Owner JSR CORPORATION (Japan)
Inventor
  • Tamada, Miki
  • Kumegawa, Ryo
  • Shiratani, Motohiro
  • Komatsu, Hiroyuki
  • Maruyama, Ken
  • Osawa, Sosuke

Abstract

A composition includes a polymer (1) having a partial structure represented by formula (1), and a solvent. X is a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group having 1 to 5 carbon atoms, a hydroxyalkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms. Y is a monovalent organic group having 1 to 12 carbon atoms and containing a hetero atom or a monovalent inorganic acid group. Z is a linking group represented by —O—, —S—, or —NR—, where R is an organic group having 1 to 20 carbon atoms. R1 and R2 are each independently a hydrogen atom, a halogen atom, or an organic group having 1 to 20 carbon atoms, or the like. A composition includes a polymer (1) having a partial structure represented by formula (1), and a solvent. X is a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group having 1 to 5 carbon atoms, a hydroxyalkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms. Y is a monovalent organic group having 1 to 12 carbon atoms and containing a hetero atom or a monovalent inorganic acid group. Z is a linking group represented by —O—, —S—, or —NR—, where R is an organic group having 1 to 20 carbon atoms. R1 and R2 are each independently a hydrogen atom, a halogen atom, or an organic group having 1 to 20 carbon atoms, or the like.

IPC Classes  ?

  • C08F 297/02 - Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F 7/075 - Silicon-containing compounds

66.

METHOD FOR PRODUCING ASTROCYTE-LIKE CELLS

      
Application Number 18116349
Status Pending
Filing Date 2023-03-02
First Publication Date 2023-06-29
Owner
  • JSR Corporation (Japan)
  • KEIO UNIVERSITY (Japan)
Inventor
  • Ishikawa, Mitsuru
  • Okano, Hideyuki

Abstract

A method is provided for producing astrocyte-like cells, including (A) upregulating transcription factors including SRY-box transcription factor 9 (SOX9), nuclear factor IA (NFIA), and nuclear factor IB (NFIB) in human pluripotent stein cells and (B) culturing the human pluripotent stem cells, in which the transcription factors are upregulated, and consequently differentiating the human pluripotent stern cells into astrocyte-like cells.

IPC Classes  ?

67.

COMPOSITION FOR ALLEVIATING PULMONARY HYPERTENSION, METHOD FOR PREDICTING PROGNOSIS OF PULMONARY HYPERTENSION, METHOD FOR ASSISTING IN DETERMINING SEVERITY OF PULMONARY HYPERTENSION, AND METHOD FOR ASSISTING IN DIAGNOSING PULMONARY HYPERTENSION

      
Application Number 17800784
Status Pending
Filing Date 2021-02-19
First Publication Date 2023-06-08
Owner JSR Corporation (Japan)
Inventor
  • Nakaoka, Yoshikazu
  • Asano, Ryotaro
  • Ogo, Takeshi

Abstract

The present invention provides (1) a composition for improving pulmonary hypertension, comprising at least one substance capable of normalizing gut microbiota in a patient with pulmonary hypertension as an active ingredient; (2) a method for predicting the prognosis of a patient with pulmonary hypertension, or a method for assisting the determination of the severity of a patient with pulmonary hypertension, the method comprising detecting one or more types of bacteria selected from bacteria belonging to the family Micrococcaceae, Streptococcaceae, Pasteurellaceae, Veillonellaceae or Lactobacillaceae in gut microbiota in the patient with pulmonary hypertension; and (3) a method for assisting the diagnosis of pulmonary hypertension, the method comprising comparing the IgA level in feces of a subject to that of a healthy subject.

IPC Classes  ?

  • A61K 35/74 - Bacteria
  • A61P 9/12 - Antihypertensives
  • A61K 31/19 - Carboxylic acids, e.g. valproic acid
  • G01N 33/569 - Immunoassay; Biospecific binding assay; Materials therefor for microorganisms, e.g. protozoa, bacteria, viruses

68.

VEHICLE SEAT CORE MATERIAL

      
Application Number 17995082
Status Pending
Filing Date 2021-03-26
First Publication Date 2023-06-01
Owner JSP Corporation (Japan)
Inventor
  • Hashimoto, Keiichi
  • Hisamatsu, Katsunori
  • Iwasaki, Shogo

Abstract

A vehicle seat core material includes a molded article that includes thermoplastic resin expanded beads. The molded article has a substantially rectangular shape in a top view, and has a front side and a rear side opposite the front side. The molded article has an average density (Z) of 20 kg/m3 to 50 kg/m3. The molded article includes, on the rear side of the molded article, a rear thin portion having a thickness of 10 mm to 40 mm, the thickness of the rear thin portion being smaller than an average thickness of the molded article. A ratio (Y/Z) of a density (Y) of the rear thin portion to the average density (Z) of the molded article is 1.05 to 3. The rear thin portion of the molded article has a fusion rate of 70% or more.

IPC Classes  ?

  • C08J 9/228 - Forming foamed products
  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
  • C08J 9/224 - Surface treatment
  • B60N 2/70 - Upholstery springs

69.

CROSSLINKED OLEFIN-BASED THERMOPLASTIC ELASTOMER EXPANDED BEAD AND METHOD FOR PRODUCING SAME

      
Application Number 17906033
Status Pending
Filing Date 2021-03-11
First Publication Date 2023-05-18
Owner JSP CORPORATION (Japan)
Inventor Mochida, Naoki

Abstract

A crosslinked olefin-based thermoplastic elastomer expanded bead including a base polymer having an olefin-based thermoplastic elastomer and a brominated bisphenol-based flame retardant having a chemical structure represented by formula (1). A difference TmTPO-TFR is −5° C. to 40° C., where TmTPO is a melting point of the olefin-based thermoplastic elastomer and TFR is the lower of a glass transition temperature TgFR and a melting point TmFR of the brominated bisphenol-based flame retardant. A xylene insoluble content is 5 mass % to 80 mass %. R1 and R3 in the formula (1) are monovalent substituents, R2 is a divalent substituent, and n is an integer from 1 to 6: A crosslinked olefin-based thermoplastic elastomer expanded bead including a base polymer having an olefin-based thermoplastic elastomer and a brominated bisphenol-based flame retardant having a chemical structure represented by formula (1). A difference TmTPO-TFR is −5° C. to 40° C., where TmTPO is a melting point of the olefin-based thermoplastic elastomer and TFR is the lower of a glass transition temperature TgFR and a melting point TmFR of the brominated bisphenol-based flame retardant. A xylene insoluble content is 5 mass % to 80 mass %. R1 and R3 in the formula (1) are monovalent substituents, R2 is a divalent substituent, and n is an integer from 1 to 6:

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08J 3/00 - Processes of treating or compounding macromolecular substances
  • C08J 3/24 - Crosslinking, e.g. vulcanising, of macromolecules
  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof

70.

Molded article of polypropylene-based resin foamed particle molded body, polypropylene-based resin foamed particle, and method for producing same

      
Application Number 17905890
Grant Number 11904579
Status In Force
Filing Date 2021-02-12
First Publication Date 2023-04-20
Grant Date 2024-02-20
Owner JSP CORPORATION (Japan)
Inventor
  • Oi, Takashi
  • Ohta, Hajime

Abstract

5 of the expanded beads molded article is 5 kPa to 25 kPa.

IPC Classes  ?

  • B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins

71.

KIDNEY REGENERATION ACCELERATOR AND PRODUCTION METHOD FOR SAME

      
Application Number 17792348
Status Pending
Filing Date 2021-01-15
First Publication Date 2023-04-20
Owner
  • KEIO UNIVERSITY (Japan)
  • JSR Corporation (Japan)
Inventor
  • Yagi, Hiroshi
  • Kushige, Hiroko
  • Kuroda, Kohei
  • Sato, Akiko
  • Hamada, Kenichi
  • Amano, Yuki

Abstract

The kidney regeneration accelerator that contains a component obtained by decellularizing a mammalian organ. The production method for a kidney regeneration accelerator that involves decellularizing a mammalian organ to obtain a component that includes an extracellular matrix, freeze drying and then pulverizing the component to obtain a powder, and performing a sterilization treatment on the powder. A pharmaceutical composition for use in treating kidney disease that contains a component obtained by decellularizing a mammalian organ. A treatment method for kidney disease that involves applying a pharmaceutical composition that contains a component obtained by decellularizing a mammalian organ to a site to be treated of the kidney of a human or animal kidney disease patient.

IPC Classes  ?

  • A61L 27/36 - Materials for prostheses or for coating prostheses containing ingredients of undetermined constitution or reaction products thereof

72.

OLEFIN-BASED THERMOPLASTIC ELASTOMER FOAMED PARTICLE AND OLEFIN-BASED THERMOPLASTIC ELASTOMER FOAMED PARTICLE MOLDED BODY

      
Application Number 17909919
Status Pending
Filing Date 2021-02-01
First Publication Date 2023-04-06
Owner JSP Corporation (Japan)
Inventor Takagi, Shota

Abstract

A thermoplastic olefinic elastomer expanded bead, which is an expanded bead including a thermoplastic olefinic elastomer as a main component, wherein the expanded bead has an average particle diameter of 0.5 to 5 mm, the expanded bead has a heat of fusion of 60 to 80 J/g, and a difference [Tm−Tc] between a melting point (Tm) and a crystallization temperature (Tc) of the expanded bead is 20° C. or lower.

IPC Classes  ?

73.

RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERN

      
Application Number 17994515
Status Pending
Filing Date 2022-11-28
First Publication Date 2023-04-06
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Miyao, Kensuke

Abstract

A radiation-sensitive resin composition includes a solvent and an onium salt compound having a structure represented by formula (1). Rf1 and Rf2 each independently represent a fluorine atom or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. R1 represents a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a fluorine atom, or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. R2, R3, R4, R5, R6, and R7 each independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms. n1+n2 is an integer of 2 to 8. n3 represents an integer of 0 to 5. X1 and X2 each independently represent an oxygen atom or a sulfur atom. Each * represents a bond with another structure. Z+ represents a monovalent radiation-sensitive onium cation. A radiation-sensitive resin composition includes a solvent and an onium salt compound having a structure represented by formula (1). Rf1 and Rf2 each independently represent a fluorine atom or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. R1 represents a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a fluorine atom, or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. R2, R3, R4, R5, R6, and R7 each independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms. n1+n2 is an integer of 2 to 8. n3 represents an integer of 0 to 5. X1 and X2 each independently represent an oxygen atom or a sulfur atom. Each * represents a bond with another structure. Z+ represents a monovalent radiation-sensitive onium cation.

IPC Classes  ?

  • G03F 7/029 - Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
  • G03F 7/004 - Photosensitive materials
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

74.

RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Application Number 17795967
Status Pending
Filing Date 2021-01-20
First Publication Date 2023-04-06
Owner JSR CORPORATION (Japan)
Inventor
  • Omiya, Takuya
  • Nishikori, Katsuaki
  • Kiriyama, Kazuya
  • Kinoshita, Natsuko

Abstract

A radiation-sensitive resin composition includes a resin, a radiation-sensitive acid generator, and a solvent. The resin includes a structural unit A represented by formula (1) and a structural unit B having an acid-dissociable group. The structural unit represented by the formula (1) is excluded from the structural unit B. In the formula (1), A is a monovalent aromatic hydrocarbon group in which —ORY is bonded to a carbon atom adjacent to a carbon atom to which Lα is bonded, and hydrogen atoms on other carbon atoms are unsubstituted, or a part or all of the hydrogen atoms are substituted with a cyano group, a nitro group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, an alkoxycarbonyloxy group, an acyl group, or an acyloxy group. A radiation-sensitive resin composition includes a resin, a radiation-sensitive acid generator, and a solvent. The resin includes a structural unit A represented by formula (1) and a structural unit B having an acid-dissociable group. The structural unit represented by the formula (1) is excluded from the structural unit B. In the formula (1), A is a monovalent aromatic hydrocarbon group in which —ORY is bonded to a carbon atom adjacent to a carbon atom to which Lα is bonded, and hydrogen atoms on other carbon atoms are unsubstituted, or a part or all of the hydrogen atoms are substituted with a cyano group, a nitro group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, an alkoxycarbonyloxy group, an acyl group, or an acyloxy group.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/004 - Photosensitive materials
  • G03F 7/029 - Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
  • G03F 7/20 - Exposure; Apparatus therefor

75.

METHOD FOR FORMING RESIST PATTERN AND RADIATION-SENSITIVE RESIN COMPOSITION

      
Application Number 17798128
Status Pending
Filing Date 2021-01-12
First Publication Date 2023-04-06
Owner JSR CORPORATION (Japan)
Inventor
  • Kasahara, Kazuki
  • Nishikori, Katsuaki
  • Osawa, Sosuke
  • Tamada, Miki
  • Shiratani, Motohiro

Abstract

Provided are a method for forming a resist pattern that demonstrates excellent performance in sensitivity, resolution, etc. in an exposure step when a next-generation exposure technique is applied, and a radiation-sensitive resin composition. The method for forming a resist pattern includes step (1) of forming a resist film in which a content of a radiation-sensitive acid generator (C) is 0.1% by mass or less, step (2) of exposing the resist film to EUV or an electron beam (EB), and step (3) of developing the resist film exposed in the step (2).

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/20 - Exposure; Apparatus therefor
  • G03F 7/004 - Photosensitive materials
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids

76.

WEARABLE DEVICE AND DETECTION METHOD

      
Application Number 18058783
Status Pending
Filing Date 2022-11-25
First Publication Date 2023-03-23
Owner JSR CORPORATION (Japan)
Inventor
  • Sawada, Katsutoshi
  • Fujioka, Masayasu
  • Aoki, Shun
  • Takahashi, Shouadnas
  • Kobayashi, Nobutoshi

Abstract

A wearable device according to an embodiment includes a detection unit, a first layer, a second layer, and a third layer. The detection unit detects the living body information. The first layer is flexible and disposed in a first direction relative to the detection unit and includes a conductor electrically connected to the detection unit. The second layer is disposed in the first direction relative to the first layer and is harder than the first layer. The third layer is disposed in the first direction relative to the second layer and includes an electronic component electrically connected to the conductor.

IPC Classes  ?

  • A61B 5/259 - Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes using conductive adhesive means, e.g. gels
  • A61B 5/28 - Bioelectric electrodes therefor specially adapted for particular uses for electrocardiography [ECG]
  • A61B 5/332 - Portable devices specially adapted therefor

77.

SILICON-CONTAINING COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Application Number 17974618
Status Pending
Filing Date 2022-10-27
First Publication Date 2023-03-23
Owner JSR Corporation (Japan)
Inventor
  • Serizawa, Ryuichi
  • Hirasawa, Kengo
  • Nii, Akitaka

Abstract

A silicon-containing composition includes: a first polysiloxane; a second polysiloxane different from the first polysiloxane; and a solvent. The first polysiloxane includes a group which includes at least one selected from the group consisting of an ester bond, a carbonate structure, and a cyano group. The second polysiloxane includes a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms.

IPC Classes  ?

  • H01L 21/308 - Chemical or electrical treatment, e.g. electrolytic etching using masks
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
  • H01L 21/3065 - Plasma etching; Reactive-ion etching
  • H01L 21/311 - Etching the insulating layers

78.

COMPOSITE MOLDED ARTICLE

      
Application Number 17797648
Status Pending
Filing Date 2021-02-02
First Publication Date 2023-03-16
Owner JSP Corporation (Japan)
Inventor
  • Sasaki, Hidehiro
  • Morita, Toshio

Abstract

A composite molded article in which thermoplastic resin expanded beads are bonded via a thermosetting resin binder, wherein the composite molded article has a density of 0.05 to 0.5 g/cm3, and when heated at 100° C. for 20 minutes, the composite molded article has a volume expansion rate of 15 to 200%.

IPC Classes  ?

  • C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
  • C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
  • C08L 67/03 - Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings

79.

Polypropylene-based resin expanded beads and polypropylene-based resin expanded beads molded article

      
Application Number 17790997
Grant Number 11732101
Status In Force
Filing Date 2021-01-21
First Publication Date 2023-03-09
Grant Date 2023-08-22
Owner JSP CORPORATION (Japan)
Inventor
  • Shimada, Tomohito
  • Ohta, Hajime

Abstract

An expanded bead having a through hole and including a foamed core layer which defines the through hole therein and which is constituted of a resin composition containing two kinds of polypropylene-based resins having different melting points, and a cover layer covering the foamed core layer and constituted of a polyolefin-based resin. The expanded bead gives a DSC curve in which an endothermic peak intrinsic to the resin composition and another endothermic peak on a higher temperature side thereof appear in a specific heat of fusion ratio. Molded articles include a multiplicity of the expanded beads.

IPC Classes  ?

  • B32B 27/16 - Layered products essentially comprising synthetic resin specially treated, e.g. irradiated
  • C08J 9/224 - Surface treatment
  • C08J 9/16 - Making expandable particles
  • B32B 1/00 - Layered products essentially having a general shape other than plane
  • B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
  • B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
  • B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
  • C08J 9/228 - Forming foamed products

80.

HIPE FOAM AND METHOD FOR PRODUCING SAME

      
Application Number 17760410
Status Pending
Filing Date 2021-02-17
First Publication Date 2023-03-09
Owner JSP CORPORATION (Japan)
Inventor
  • Kaneko, Yohei
  • Haraguchi, Kenji

Abstract

A HIPE foam may including a vinyl-based crosslinked polymer as a base material resin. The vinyl-based crosslinked polymer may be formed by crosslinking a polymer of a styrene-based monomer and/or an acryl-based monomer. An apparent density ρ of the HIPE foam may be 35 kg/m3 or more and 500 kg/m3 or less. A molecular weight between crosslinking points of the vinyl-based crosslinked polymer forming the HIPE foam may be 2×103 or more and 2×105 or less. The HIPE foam may be used as, for example, a machinable material or an impact absorbing material.

IPC Classes  ?

  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F 212/08 - Styrene
  • C08F 2/32 - Polymerisation in water-in-oil emulsions
  • C08F 218/04 - Vinyl esters
  • C08J 9/22 - After-treatment of expandable particles; Forming foamed products

81.

COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, METHOD FOR CHEMICAL MECHANICAL POLISHING, AND METHOD FOR MANUFACTURING CHEMICAL MECHANICAL POLISHING PARTICLES

      
Application Number 17781379
Status Pending
Filing Date 2020-11-18
First Publication Date 2023-03-02
Owner JSR CORPORATION (Japan)
Inventor
  • Wang, Pengyu
  • Nakanishi, Kouji
  • Yamanaka, Tatsuya

Abstract

Provided are a composition for chemical mechanical polishing and a method for chemical mechanical polishing, whereby a tungsten film as a wiring material can be polished at high speed, and the occurrence of surface defects in a polished surface can be reduced. A composition for chemical mechanical polishing pertaining contains (A) alumina particles, at least a portion of the surface of which is coated with a coating film of silica alumina, and (B) a liquid medium.

IPC Classes  ?

  • C09G 1/02 - Polishing compositions containing abrasives or grinding agents
  • H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching

82.

COMPOSITION FOR RESIST UNDERLAYER FILM FORMATION, AND METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE

      
Application Number 17961611
Status Pending
Filing Date 2022-10-07
First Publication Date 2023-03-02
Owner JSR CORPORATION (Japan)
Inventor
  • Seko, Tomoaki
  • Sakai, Tatsuya
  • Sakai, Kazunori
  • Anno, Yusuke

Abstract

A composition for resist underlayer film formation, includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents an organic group comprising at least one structure selected from the group consisting of a hydroxy group, a carbonyl group, and an ether bond; a is an integer of 1 to 3, wherein in a case in which a is no less than 2, a plurality of Xs are identical or different from each other; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms, wherein is a group other than X; and b is an integer of 0 to 2, wherein in a case in which b is 2, two R1s are identical or different from each other, and wherein a sum of a and b is no greater than 3. A composition for resist underlayer film formation, includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents an organic group comprising at least one structure selected from the group consisting of a hydroxy group, a carbonyl group, and an ether bond; a is an integer of 1 to 3, wherein in a case in which a is no less than 2, a plurality of Xs are identical or different from each other; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms, wherein is a group other than X; and b is an integer of 0 to 2, wherein in a case in which b is 2, two R1s are identical or different from each other, and wherein a sum of a and b is no greater than 3.

IPC Classes  ?

  • G03F 7/075 - Silicon-containing compounds
  • G03F 7/20 - Exposure; Apparatus therefor
  • G03F 7/32 - Liquid compositions therefor, e.g. developers

83.

POLYAMIDE-BASED RESIN EXPANDED BEADS, MOLDED ARTICLE OF POLYAMIDE-BASED RESIN EXPANDED BEADS, AND METHOD FOR PRODUCING POLYAMIDE-BASED RESIN EXPANDED BEADS

      
Application Number 17794760
Status Pending
Filing Date 2021-02-01
First Publication Date 2023-02-23
Owner JSP CORPORATION (Japan)
Inventor Hayashi, Tatsuya

Abstract

Polyamide-based resin expanded beads contain a polyamide-based resin as a base material resin. The beads have a crystal structure, an intrinsic peak of the polyamide-based resin and a high-temperature peak having a peak top temperature on a higher temperature side than a peak top temperature of the intrinsic peak appear in a DSC curve obtained under a predetermined condition; an amount of heat of fusion of the high-temperature peak is within 5 J/g or more and 50 J/g or less; and a coefficient of variation of the amount of heat of fusion of the high-temperature peak is 20% or less. The beads are produced by in-mold molding. A method for producing the beads includes: impregnating a polyamide-based resin; and releasing expandable polyamide-based resin beads from a sealed container, a temperature in the sealed container is raised at a rate of 0.3° C. or higher and 1.5° C. or lower per 10 minutes.

IPC Classes  ?

84.

DISPLAY

      
Application Number 17797352
Status Pending
Filing Date 2021-02-02
First Publication Date 2023-02-23
Owner
  • JSR CORPORATION (Japan)
  • Mattrix Technologies, Inc (USA)
Inventor
  • Katsui, Hiromitsu
  • Liu, Bo
  • Lemaitre, Maxime

Abstract

A device configuration designed to mitigate display defects resulting from voltage drops in current supply lines offers a display with better display quality. The display includes: a plurality of VOLETs arranged in arrays along a first direction and a second direction; a data line supplying a voltage for controlling gate electrodes of the plurality of VOLETs; TFTs each connected between a gate electrode of each of the VOLET and the data line and controlling voltage supply to the gate electrodes of the VOLETs; a gate line connected to gate electrodes of the TFTs and transmitting a signal that controls the TFTs; a plurality of current supply lines extending along the first direction and supplying a current to each of a group of VOLETs aligned along the first direction; and an auxiliary line extending along the second direction and connecting at least two of the plurality of current supply lines.

IPC Classes  ?

  • H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
  • H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices

85.

RESIST UNDERLAYER FILM-FORMING COMPOSITION, RESIST UNDERLAYER FILM, AND METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE

      
Application Number 17950251
Status Pending
Filing Date 2022-09-22
First Publication Date 2023-02-16
Owner JSR Corporation (Japan)
Inventor
  • Seko, Tomoaki
  • Anno, Yusuke
  • Nii, Akitaka

Abstract

A resist underlayer film-forming composition includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents a group represented by formula (2); a is an integer of 1 to 3; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms; and b is an integer of 0 to 2; and a sum of a and b is no greater than 3. R2 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; n is 1 or 2; R3 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; L represents a single bond or a divalent linking group; and * denotes a site bonding to the silicon atom in the formula (1). The composition is suitable for lithography with an electron beam or extreme ultraviolet ray. A resist underlayer film-forming composition includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents a group represented by formula (2); a is an integer of 1 to 3; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms; and b is an integer of 0 to 2; and a sum of a and b is no greater than 3. R2 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; n is 1 or 2; R3 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; L represents a single bond or a divalent linking group; and * denotes a site bonding to the silicon atom in the formula (1). The composition is suitable for lithography with an electron beam or extreme ultraviolet ray.

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C09D 183/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
  • C08G 77/26 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen nitrogen-containing groups
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

86.

COMPOSITION, METHOD OF FORMING RESIST UNDERLAYER FILM, AND METHOD OF FORMING RESIST PATTERN

      
Application Number 17942332
Status Pending
Filing Date 2022-09-12
First Publication Date 2023-02-09
Owner JSR CORPORATION (Japan)
Inventor
  • Takagi, Yugaku
  • Abe, Tsubasa
  • Katagiri, Takashi
  • Dei, Satoshi
  • Takanashi, Kazunori
  • Hayashi, Yuya

Abstract

A composition includes: a compound including an aromatic ring; and a first polymer including a first structural unit represented by formula (1) and a second structural unit represented by formula (2). A content of the first polymer with respect to 100 parts by mass of the compound is no less than 0.1 parts by mass and no greater than 200 parts by mass. R1 represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group; and R2 represents a substituted or unsubstituted monovalent hydrocarbon group. R3 represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group; L represents a single bond or a divalent linking group; Ar represents a group obtained by removing (n+1) hydrogen atoms from a substituted or unsubstituted aromatic ring; R4 represents a hydroxy group or a monovalent hydroxyalkyl group; and n is an integer of 1 to 8. A composition includes: a compound including an aromatic ring; and a first polymer including a first structural unit represented by formula (1) and a second structural unit represented by formula (2). A content of the first polymer with respect to 100 parts by mass of the compound is no less than 0.1 parts by mass and no greater than 200 parts by mass. R1 represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group; and R2 represents a substituted or unsubstituted monovalent hydrocarbon group. R3 represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group; L represents a single bond or a divalent linking group; Ar represents a group obtained by removing (n+1) hydrogen atoms from a substituted or unsubstituted aromatic ring; R4 represents a hydroxy group or a monovalent hydroxyalkyl group; and n is an integer of 1 to 8.

IPC Classes  ?

  • C08G 8/12 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with monohydric phenols having only one hydrocarbon substituent ortho or para to the OH group, e.g. p-tert.-butyl phenol
  • C08F 220/22 - Esters containing halogen
  • C08F 216/02 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical by an alcohol radical
  • C08G 8/24 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with mixtures of two or more phenols which are not covered by only one of the groups
  • G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

87.

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, METHOD FOR PRODUCING PLATED FORMED PRODUCT, AND METHOD FOR PRODUCING TIN-SILVER PLATED-FORMED PRODUCT

      
Application Number 17435408
Status Pending
Filing Date 2020-03-19
First Publication Date 2023-02-02
Owner JSR CORPORATION (Japan)
Inventor
  • Nishiguchi, Naoki
  • Matsumoto, Tomoyuki
  • Endo, Ayako

Abstract

A photosensitive resin composition contains polymer (A) having an acid dissociative group, photoacid generator (B), and solvent (C), the solvent (C) containing 80 to 95% by mass of propylene glycol monomethyl ether acetate (C1) and 5 to 18% by mass of 3-methoxybutyl acetate (C2), a content ratio of other solvent (C3) in the solvent (C) being 0 to 10% by mass, and a content ratio of the solvent (C) contained in the photosensitive resin composition being less than 60% by mass.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - Exposure; Apparatus therefor
  • G03F 7/40 - Treatment after imagewise removal, e.g. baking
  • G03F 7/32 - Liquid compositions therefor, e.g. developers

88.

COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND METHOD FOR MANUFACTURING PARTICLES FOR CHEMICAL MECHANICAL POLISHING

      
Application Number 17781376
Status Pending
Filing Date 2020-11-18
First Publication Date 2023-02-02
Owner JSR CORPORATION (Japan)
Inventor
  • Wang, Pengyu
  • Nakanishi, Kouji
  • Yamanaka, Tatsuya

Abstract

Provided are a composition for chemical mechanical polishing and a chemical mechanical polishing method, which enable reduction in occurrence of surface defects in a polished surface and which enable high speed polishing of a tungsten film which is a wiring material. The composition for chemical mechanical polishing contains: (A) particles containing alumina and having a functional group represented by general formula (1); and (B) a liquid medium. (1): —SO3−M+ (In the formula, M+ represents a monovalent cation.)

IPC Classes  ?

  • C09G 1/02 - Polishing compositions containing abrasives or grinding agents

89.

PROPHYLACTIC OR THERAPEUTIC COMPOSITION FOR GRAFT-VERSUS-HOST DISEASE

      
Application Number 17779286
Status Pending
Filing Date 2020-11-25
First Publication Date 2023-01-26
Owner
  • JSR CORPORATION (Japan)
  • KEIO UNIVERSITY (Japan)
Inventor
  • Kakihana, Kazuhiko
  • Inamoto, Kyoko
  • Honda, Kenya
  • Takeshita, Kozue
  • Kiridooshi, Yuuko

Abstract

The present invention provides a prophylactic or therapeutic composition for graft-versus-host disease (GVHD). The present invention provides a prophylactic or therapeutic composition for graft-versus-host disease (GVHD). There is provided a prophylactic or therapeutic composition for GVHD, which comprises bacteria belonging to any genus selected from the group consisting of the following genera: Blautia, Clostridium, unclassified Clostridiales, Actinomyces, Parabacteroides, Lachnoclostridium, Bacteroides, Faecalibacterium, unclassified Lachnospiraceae, Roseburia, Ruminococcus, unclassified Firmicutes, Dorea, Phascolarctobacterium, Sutterella, Megamonas, Collinsella, Eubacterium, and Coprococcus, etc., or any combination of bacteria belonging to these genera.

IPC Classes  ?

  • A61K 35/74 - Bacteria
  • A61K 9/48 - Preparations in capsules, e.g. of gelatin, of chocolate
  • A61P 37/06 - Immunosuppressants, e.g. drugs for graft rejection

90.

Method for producing film

      
Application Number 17847228
Grant Number 11745216
Status In Force
Filing Date 2022-06-23
First Publication Date 2023-01-26
Grant Date 2023-09-05
Owner JSR CORPORATION (Japan)
Inventor
  • Kumegawa, Ryo
  • Osawa, Sosuke
  • Tamada, Miki
  • Maruyama, Ken
  • Shiratani, Motohiro

Abstract

1 is a hydrogen atom, a monovalent hydrocarbon group, a monovalent halogenated hydrocarbon group, or a monovalent group having a heterocyclic structure.

IPC Classes  ?

  • B05D 1/00 - Processes for applying liquids or other fluent materials
  • B05D 1/32 - Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
  • C08J 5/18 - Manufacture of films or sheets
  • C08F 297/02 - Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type

91.

METHOD FOR PRODUCING CELL-CONTAINING EXTRACELLULAR MATRIX, CELL CULTURE METHOD, DEVICE FOR PRODUCING CELL-CONTAINING EXTRACELLULAR MATRIX AND CONTROL PROGRAM

      
Application Number 17946106
Status Pending
Filing Date 2022-09-16
First Publication Date 2023-01-19
Owner JSR CORPORATION (Japan)
Inventor
  • Suemasa, Daichi
  • Hayashi, Eiji

Abstract

A method for producing a cell-containing extracellular matrix is provided, the method including preparing an extracellular matrix solution which contains (i) an extracellular matrix precursor and (ii) cells or a cell mass inside a pipette having a tip opening portion; discharging the extracellular matrix solution to form a drop of the extracellular matrix solution at the tip opening portion of the pipette; bringing the tip opening portion of the pipette close to a culture surface of a cell culture container to place the drop on the culture surface while avoiding bringing the tip opening portion of the pipette into contact with the culture surface; moving the tip opening portion of the pipette away from the culture surface to separate the drop from the tip opening portion of the pipette; and gelating the extracellular matrix solution to form a cell-containing extracellular matrix.

IPC Classes  ?

  • C12N 5/00 - Undifferentiated human, animal or plant cells, e.g. cell lines; Tissues; Cultivation or maintenance thereof; Culture media therefor
  • C12M 1/32 - Inoculator or sampler multiple field or continuous type

92.

COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND METHOD FOR POLISHING

      
Application Number 17781712
Status Pending
Filing Date 2020-11-17
First Publication Date 2023-01-05
Owner JSR CORPORATION (Japan)
Inventor
  • Nishimura, Kouhei
  • Yamada, Yuuya
  • Nakamura, Shuuhei
  • Wang, Pengyu

Abstract

Provided are a composition for chemical mechanical polishing and a method for polishing allowing a tungsten film- or silicon nitride film-containing semiconductor substrate to be polished at a high speed, while also enabling a reduction in the occurrence of a surface defect in the polished face after polishing. A composition for chemical mechanical polishing according to the present invention comprises (A) abrasive grains containing titanium nitride and (B) a liquid medium, wherein the absolute value of the zeta-potential of said (A) component in the composition for chemical mechanical polishing is 8 mV or higher.

IPC Classes  ?

93.

PRODUCTION METHOD FOR ORGANOID

      
Application Number 17783598
Status Pending
Filing Date 2020-12-15
First Publication Date 2023-01-05
Owner
  • JSR Corporation (Japan)
  • KEIO UNIVERSITY (Japan)
Inventor
  • Shoji, Kentaro
  • Sato, Toshiro

Abstract

A production method for an organoid, the production method including a step of culturing adult stem cells or a cell tissue piece including adult stem cells in a medium containing a chimeric Fibroblast Growth Factor (FGF) that includes a partial region of FGF1 and a partial region of FGF2; an organoid produced by the production method; a medium including a chimeric FGF and having a content of chimeric FGF of 50 ng/mL or less; and an evaluation method for a test substance are provided, and according to the chimeric FGF, a content of growth factors included in a medium can be reduced.

IPC Classes  ?

  • C12N 5/07 - Animal cells or tissues
  • C07K 14/50 - Fibroblast growth factor (FGF)
  • C07K 14/485 - Epidermal growth factor (EGF) (urogastrone)
  • C07K 14/47 - Peptides having more than 20 amino acids; Gastrins; Somatostatins; Melanotropins; Derivatives thereof from humans from vertebrates from mammals

94.

RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN

      
Application Number 17829432
Status Pending
Filing Date 2022-06-01
First Publication Date 2022-12-29
Owner JSR CORPORATION (Japan)
Inventor
  • Kiriyama, Kazuya
  • Taniguchi, Takuhiro
  • Nishikori, Katsuaki
  • Kinoshita, Natsuko

Abstract

The radiation-sensitive resin composition contains: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid, and which has a structural unit represented by the following formula (1); and a radiation-sensitive acid generating agent. L represents a single bond, —COO—, —O—, or —CONH—. X represents a single bond, —O—, -G-O—, —CH2—, —S—, —SO2—, —NRA—, or —CONH—, wherein G represents a divalent aliphatic hydrocarbon group having 1 to 20 carbon atoms, and RA represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. R2 and R3 each independently represent a halogen atom, a hydroxy group, a sulfanyl group, or an organic group having 1 to 20 carbon atoms. The radiation-sensitive resin composition contains: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid, and which has a structural unit represented by the following formula (1); and a radiation-sensitive acid generating agent. L represents a single bond, —COO—, —O—, or —CONH—. X represents a single bond, —O—, -G-O—, —CH2—, —S—, —SO2—, —NRA—, or —CONH—, wherein G represents a divalent aliphatic hydrocarbon group having 1 to 20 carbon atoms, and RA represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. R2 and R3 each independently represent a halogen atom, a hydroxy group, a sulfanyl group, or an organic group having 1 to 20 carbon atoms.

IPC Classes  ?

  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/20 - Exposure; Apparatus therefor
  • G03F 7/32 - Liquid compositions therefor, e.g. developers

95.

COMPOSITION FOR CHEMICAL-MECHANICAL POLISHING AND CHEMICAL-MECHANICAL POLISHING METHOD

      
Application Number 17775887
Status Pending
Filing Date 2020-10-12
First Publication Date 2022-12-08
Owner JSR CORPORATION (Japan)
Inventor
  • Yamada, Yuuya
  • Wang, Pengyu
  • Sugie, Norihiko
  • Kamei, Yasutaka

Abstract

Provided are a chemical-mechanical polishing composition and a chemical-mechanical polishing method capable of polishing a semiconductor substrate containing a conductive metal such as tungsten or cobalt flatly and at high speed as well as reducing surface defects after polishing. The composition for chemical-mechanical polishing contains (A) silica particles having a functional group represented by general formula (1) and (B) a silane compound. —COO-M+ . . . (1) (M+ represents a monovalent cation.)

IPC Classes  ?

  • C09G 1/02 - Polishing compositions containing abrasives or grinding agents
  • C09K 13/00 - Etching, surface-brightening or pickling compositions
  • C09K 3/14 - Anti-slip materials; Abrasives

96.

CHEMICAL MECHANICAL POLISHING COMPOSITION AND CHEMICAL MECHANICAL POLISHING METHOD

      
Application Number 17776227
Status Pending
Filing Date 2020-10-12
First Publication Date 2022-12-08
Owner JSR CORPORATION (Japan)
Inventor
  • Yamada, Yuuya
  • Wang, Pengyu
  • Sugie, Norihiko
  • Kamei, Yasutaka

Abstract

Provided are a chemical mechanical polishing composition and a chemical mechanical polishing method that can polish a semiconductor substrate containing an electric conductor metal, such as tungsten or cobalt, flat and at high speed, and reduce post-polishing surface defects. The chemical mechanical polishing composition contains (A) silica particles having the functional group represented by general formula (1), and (B) at least one selected from the group consisting of a carboxylic acid having an unsaturated bond and a salt thereof. (1): —COO-M+ (M+ represents a monovalent cation.)

IPC Classes  ?

  • C09G 1/02 - Polishing compositions containing abrasives or grinding agents
  • H01L 21/321 - After-treatment
  • H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
  • H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device

97.

ADDITIVE, SURFACE TREATMENT AGENT, SURFACE-MODIFIED LATEX PARTICLES, METHOD FOR PRODUCING SURFACE-MODIFIED LATEX PARTICLES, REAGENT FOR LATEX AGGLUTINATION REACTION, KIT, AND METHOD FOR DETECTING TARGET SUBSTANCE

      
Application Number 17817684
Status Pending
Filing Date 2022-08-05
First Publication Date 2022-12-01
Owner
  • JSR CORPORATION (Japan)
  • JSR LIFE SCIENCES CORPORATION (Japan)
Inventor
  • Xu, Yingjia
  • Miyaji, Masaaki
  • Tamori, Kouji
  • Sawai, Tokio
  • Honma, Hiroyuki
  • Hayashi, Naoki
  • Omote, Shin-Ya

Abstract

Provided are an additive and a surface treatment agent capable of suppressing agglutination of latex particles contained in a reagent for a latex agglutination reaction during storage of the reagent although a synthetic polymer is contained as an active component. Provided are an additive and a surface treatment agent capable of suppressing agglutination of latex particles contained in a reagent for a latex agglutination reaction during storage of the reagent although a synthetic polymer is contained as an active component. An additive is to be added to latex particles used in a reagent for a latex agglutination reaction. The latex particles have not been subjected to blocking treatment. The additive includes a polymer containing more than 60% by mass and 99% by mass or less of hydrophilic repeating units (A) relative to all repeating units and 1% by mass or more and less than 40% by mass of hydrophobic repeating units (B) relative to all repeating units, and having a weight average molecular weight of 3,000 or more.

IPC Classes  ?

  • C08F 220/56 - Acrylamide; Methacrylamide
  • G01N 33/543 - Immunoassay; Biospecific binding assay; Materials therefor with an insoluble carrier for immobilising immunochemicals

98.

BRAIN ORGANOID AND USE THEREOF

      
Application Number 17773784
Status Pending
Filing Date 2020-11-05
First Publication Date 2022-12-01
Owner
  • JSR Corporation (Japan)
  • KEIO UNIVERSITY (Japan)
Inventor
  • Hiramine, Hayato
  • Okano, Hideyuki
  • Shiozawa, Seiji
  • Ishikawa, Mitsuru

Abstract

According to a production method for a brain organoid, comprising a step 1 of carrying out suspension culture of human pluripotent stem cells having a mutation in at least one or more base sequences in an exon selected from the group consisting of an exon 9, an exon 10, an exon 11, an exon 12, and an exon 13 of a microtubule-associated protein tau (MAPT) gene, and having a mutation in at least one or more base sequences in an intron 10 of the MAPT gene, it is possible to produce a brain organoid having a phosphorylated 3-repeat tau protein and a phosphorylated 4-repeat tau protein.

IPC Classes  ?

  • C12N 5/079 - Neural cells
  • G01N 33/50 - Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing

99.

METHOD FOR SEPARATING AND DETECTING EXOSOMES, AND KIT FOR SEPARATION AND DETECTION THEREOF

      
Application Number 17770447
Status Pending
Filing Date 2020-10-02
First Publication Date 2022-11-24
Owner
  • JSR Corporation (Japan)
  • KEIO UNIVERSITY (Japan)
Inventor
  • Wakui, Seiki
  • Kawakami, Yutaka
  • Yaguchi, Tomonori

Abstract

A method for separation and detection of exosomes may include: bringing a biological sample into contact with a capture molecule, the capture molecule including a specific binding substance for an antigen expressed on a cancer cell surface, to form a complex of an exosome and the capture molecule; and a bringing the complex into contact with a detector molecule, the detector molecule including a specific binding substance for an antigen expressed on a cancer cell surface and a labeling substance, to detect the complex by using the detector molecule, in which the antigen expressed on a cancer cell surface for at least one of the capture molecule and the detector molecule is cell-surface vimentin.

IPC Classes  ?

  • G01N 33/574 - Immunoassay; Biospecific binding assay; Materials therefor for cancer
  • G01N 33/543 - Immunoassay; Biospecific binding assay; Materials therefor with an insoluble carrier for immobilising immunochemicals

100.

RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Application Number 17854012
Status Pending
Filing Date 2022-06-30
First Publication Date 2022-10-27
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Furuich, Kota
  • Inami, Hajime

Abstract

A radiation-sensitive resin composition includes: a resin including a structural unit (A) represented by formula (1) and a structural unit (B) having an acid-dissociable group; a radiation-sensitive acid generator; and a solvent. R1 is a halogen atom-substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; X is —O— or —S—; La1 is a halogen atom-substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms, and RP is a monovalent organic group having at least one structure selected from the group consisting of a lactone structure, a cyclic carbonate structure, and a sultone structure. A radiation-sensitive resin composition includes: a resin including a structural unit (A) represented by formula (1) and a structural unit (B) having an acid-dissociable group; a radiation-sensitive acid generator; and a solvent. R1 is a halogen atom-substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; X is —O— or —S—; La1 is a halogen atom-substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms, and RP is a monovalent organic group having at least one structure selected from the group consisting of a lactone structure, a cyclic carbonate structure, and a sultone structure.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/004 - Photosensitive materials
  • G03F 7/20 - Exposure; Apparatus therefor
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