A radiation-sensitive resin composition includes: a resin containing a structural unit A represented by formula (1); at least one radiation-sensitive acid generator selected from the group consisting of a radiation-sensitive acid generator represented by formula (2-1) and a radiation-sensitive acid generator represented formula (2-2); and a solvent. At least one R3 is an acid-dissociable group; and R41 is a hydrogen atom or a protective group to be deprotected by action of an acid. At least one of Rf1 and Rf2 is a fluorine atom or a fluoroalkyl group; R5a is a monovalent organic group having a cyclic structure; X1+ is a monovalent onium cation; R5b is a monovalent organic group, and X2+ is a monovalent onium cation whose atom having a positive charge is not an atom forming a cyclic structure.
A radiation-sensitive resin composition includes: a resin containing a structural unit A represented by formula (1); at least one radiation-sensitive acid generator selected from the group consisting of a radiation-sensitive acid generator represented by formula (2-1) and a radiation-sensitive acid generator represented formula (2-2); and a solvent. At least one R3 is an acid-dissociable group; and R41 is a hydrogen atom or a protective group to be deprotected by action of an acid. At least one of Rf1 and Rf2 is a fluorine atom or a fluoroalkyl group; R5a is a monovalent organic group having a cyclic structure; X1+ is a monovalent onium cation; R5b is a monovalent organic group, and X2+ is a monovalent onium cation whose atom having a positive charge is not an atom forming a cyclic structure.
C08F 212/00 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
2.
RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD
Provided is a radiation-sensitive resin composition capable of exhibiting sensitivity and CDU performance at a sufficient level when a next-generation technology is applied, and a pattern formation method. A radiation-sensitive resin composition containing: a radiation-sensitive acid generating resin comprising a repeating unit A having an acid-dissociable group represented by the following formula (1) and a repeating unit B including an organic acid anion moiety and a sulfonium cation moiety containing an aromatic ring structure having a fluorine atom; and a solvent; in the formula (1), RT is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; RX is a monovalent hydrocarbon group having 2 to 20 carbon atoms; and Cy represents an alicyclic structure having 3 to 20 ring members and formed together with a carbon atom to which this is bonded.
Provided is a radiation-sensitive resin composition capable of exhibiting sensitivity and CDU performance at a sufficient level when a next-generation technology is applied, and a pattern formation method. A radiation-sensitive resin composition containing: a radiation-sensitive acid generating resin comprising a repeating unit A having an acid-dissociable group represented by the following formula (1) and a repeating unit B including an organic acid anion moiety and a sulfonium cation moiety containing an aromatic ring structure having a fluorine atom; and a solvent; in the formula (1), RT is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; RX is a monovalent hydrocarbon group having 2 to 20 carbon atoms; and Cy represents an alicyclic structure having 3 to 20 ring members and formed together with a carbon atom to which this is bonded.
A method of culturing human induced pluripotent stem cells includes inoculating human induced pluripotent stem cells in a culture medium at an inoculation density of 1.0×104 to 1.0×106 cells/cm2 in a culture vessel and subjecting the human induced pluripotent stem cells to two-dimensional culturing. A method of producing cerebral organoids includes culturing a culture of the human induced pluripotent stem cells obtained by the method of culturing human induced pluripotent stem cells in a culture medium containing a BMP inhibitor and a transforming growth factor β (TGFβ) inhibitor to form cell aggregates, culturing the cell aggregates in a culture medium containing a Wnt signal transduction pathway potentiator and an extracellular matrix, and subjecting the culturing obtained in the culturing the cell aggregates to spinner culturing.
C12P 19/32 - Nucleotides having a condensed ring system containing a six-membered ring having two nitrogen atoms in the same-ring, e.g. purine nucleotides, nicotineamide-adenine dinucleotide
4.
COMPOSITION, UNDERLAYER FILM, AND DIRECTED SELF-ASSEMBLY LITHOGRAPHY PROCESS
A composition includes: at least one polymer represented by formula (1), formula (2), or both; and a solvent. A1 and A2 are each independently a structural unit having 2 or more carbon atoms; a plurality of A's are the same or different and a plurality of A2s are the same or different; n1 and n2 are each independently an integer of 2 to 500; R1, R2, and R3 are each independently an organic group having 1 or more carbon atoms, or R1 and R2 taken together represent a ring together with X1, Y1, and P; R1 and R2 are the same or different; X1, Y1, and Y2 are each independently a single bond, —O—, or —NR4—; R4 is an organic group having 1 or more carbon atoms; and Z1 and Z2 are each independently hydrogen or an organic group having 1 to 15 carbon atoms.
A composition includes: at least one polymer represented by formula (1), formula (2), or both; and a solvent. A1 and A2 are each independently a structural unit having 2 or more carbon atoms; a plurality of A's are the same or different and a plurality of A2s are the same or different; n1 and n2 are each independently an integer of 2 to 500; R1, R2, and R3 are each independently an organic group having 1 or more carbon atoms, or R1 and R2 taken together represent a ring together with X1, Y1, and P; R1 and R2 are the same or different; X1, Y1, and Y2 are each independently a single bond, —O—, or —NR4—; R4 is an organic group having 1 or more carbon atoms; and Z1 and Z2 are each independently hydrogen or an organic group having 1 to 15 carbon atoms.
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
A silicon-containing composition includes a polysiloxane compound and solvent. The polysiloxane compound includes a fluorine atom and a group including an ester bond. The polysiloxane compound preferably includes a first structural unit represented by formula (1), and a second structural unit represented by formula (2). X represents a monovalent organic group having 1 to 20 carbon atoms and comprising a fluorine atom; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms; Y represents a monovalent organic group having 1 to 20 carbon atoms and comprising an ester bond; and R2 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms.
A silicon-containing composition includes a polysiloxane compound and solvent. The polysiloxane compound includes a fluorine atom and a group including an ester bond. The polysiloxane compound preferably includes a first structural unit represented by formula (1), and a second structural unit represented by formula (2). X represents a monovalent organic group having 1 to 20 carbon atoms and comprising a fluorine atom; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms; Y represents a monovalent organic group having 1 to 20 carbon atoms and comprising an ester bond; and R2 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms.
C08G 77/24 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen halogen-containing groups
A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A− represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.
A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A− represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.
A method for forming a protective film includes directly or indirectly coating only a periphery of a substrate with a composition. The composition includes a compound having an aromatic ring, and a solvent. The solvent includes a first solvent having a normal boiling point of 156° C. or higher and lower than 300° C. A content of the first solvent in the solvent is preferably 20 mass % or more and 100 mass % or less. The first solvent is preferably an ester, an alcohol, an ether, a carbonate, or a combination of two or more of an ester, an alcohol, an ether, and a carbonate.
A radiation-sensitive resin composition includes: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; a radiation-sensitive acid generator; and a compound represented by formula (1). Ar1 represents a group obtained by removing (a+b+2) hydrogen atoms from an aromatic hydrocarbon ring having 6 to 30 ring atoms; R1 represents a halogen atom or a monovalent organic group having 1 to 20 carbon atoms; L1 represents a divalent linking group; R2 represents a substituted or unsubstituted monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms; a is an integer of 0 to 10, b is an integer of 1 to 10, wherein a sum of a and b is no greater than 10; and X+ represents a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; a radiation-sensitive acid generator; and a compound represented by formula (1). Ar1 represents a group obtained by removing (a+b+2) hydrogen atoms from an aromatic hydrocarbon ring having 6 to 30 ring atoms; R1 represents a halogen atom or a monovalent organic group having 1 to 20 carbon atoms; L1 represents a divalent linking group; R2 represents a substituted or unsubstituted monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms; a is an integer of 0 to 10, b is an integer of 1 to 10, wherein a sum of a and b is no greater than 10; and X+ represents a monovalent radiation-sensitive onium cation.
C07C 65/24 - Compounds having carboxyl groups bound to carbon atoms of six-membered aromatic rings and containing any of the groups OH, O-metal, —CHO, keto, ether, groups, groups, or groups containing ether groups, groups, groups, or groups polycyclic
C07C 323/62 - Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atom of at least one of the thio groups bound to a carbon atom of a six-membered aromatic ring of the carbon skeleton
C07D 327/08 - [b, e]-condensed with two six-membered carbocyclic rings
C07C 69/92 - Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a six-membered aromatic ring of monocyclic hydroxy carboxylic acids, the hydroxy groups and the carboxyl groups of which are bound to carbon atoms of a six-membered aromatic ring with etherified hydroxyl groups
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
9.
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN
A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R1 represents a monovalent organic group having 1 to 30 carbon atoms; and X+ represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000.
A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R1 represents a monovalent organic group having 1 to 30 carbon atoms; and X+ represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000.
R1—COO−X+ (1)
A radiation-sensitive resin composition includes: a polymer which has a first structural unit including a phenolic hydroxyl group, and a second structural unit represented by formula (1); and a radiation-sensitive acid generating agent which has a compound represented by formula (2). R1 represents a hydrogen atom, or the like; R2 represents a hydrogen atom or the like; and R3 represents a divalent monocyclic alicyclic hydrocarbon group having 3 to 12 ring atoms. Ar1 represents a group obtained by removing (q+1) hydrogen atoms on an aromatic ring from an arene formed by condensation of at least two benzene rings; R4 represents a monovalent organic group having 1 to 20 carbon atoms; q is an integer of 0 to 7; and R5 represents a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms, or the like.
A radiation-sensitive resin composition includes: a polymer which has a first structural unit including a phenolic hydroxyl group, and a second structural unit represented by formula (1); and a radiation-sensitive acid generating agent which has a compound represented by formula (2). R1 represents a hydrogen atom, or the like; R2 represents a hydrogen atom or the like; and R3 represents a divalent monocyclic alicyclic hydrocarbon group having 3 to 12 ring atoms. Ar1 represents a group obtained by removing (q+1) hydrogen atoms on an aromatic ring from an arene formed by condensation of at least two benzene rings; R4 represents a monovalent organic group having 1 to 20 carbon atoms; q is an integer of 0 to 7; and R5 represents a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms, or the like.
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
C07C 309/06 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing halogen atoms, or nitro or nitroso groups bound to the carbon skeleton
C07D 317/72 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 spiro-condensed with carbocyclic rings
Provided are abrasive grains and a composition for chemical mechanical polishing which are for selectively polishing a silicon nitride film, and which are applicable not only to silicon oxide films but also to amorphous silicon films and polysilicon films. This method for manufacturing abrasive grains includes: a first step of heating a mixture which contains particles having a sulfanyl group (—SH) fixed to the surface thereof via covalent bonds, and which contains a compound having carbon-carbon unsaturated double bonds; and a second step, which is performed after the first step, of further adding a peroxide and carrying out heating.
A method is provided for producing oligodendrocyte-like cells, including (A) increasing abundances of oligodendrocyte transcription factor 2 (OLIG2) mutant and SRY-box transcription factor 10 (SOX10) in human pluripotent stein cells and (B) culturing the human pluripotent stem cells in which the abundances of the OLIG2 mutant and the SOX10 are increased and consequently differentiating the human pluripotent stem cells into oligodendrocyte-like cells, in which the OLIG2 mutant lacks a serine residue of wild-type OLIG2 at position 147, or the serine residue of the wild-type OLIG2 at position 147 is substituted with an amino acid other than serine.
A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X),
A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X),
A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X),
where Ar1 is a group obtained by removing (a+b) hydrogen atoms from an unsubstituted aryl group, RXA is a monovalent iodine atom, an iodinated alkyl group or an iodinated alkoxy group, RXB is a monovalent organic group, a is an integer of 1 to 10, and b is an integer of 1 to 10.
A method for predicting efficacy of treatment of a lung cancer patient using an immune checkpoint inhibitor includes isolating exosomes from a biological sample derived from the lung cancer patient, and determining an expression level of a protein present in the exosomes by a mass spectrometry method, in which the protein is one or more proteins selected from the group of proteins shown in Table 1-1 to Table 1-6.
A composition for chemical mechanical polishing and a polishing method allow a semiconductor substrate containing at least one of a polysilicon film and a silicon nitride film to be polished at a high speed, while being capable of reducing the incidence of surface defects in the polished surface. The composition for chemical mechanical polishing contains (A) abrasive grains having plural protrusions on their surfaces and (B) a liquid medium, wherein the absolute value of the zeta-potential of the component (A) in the composition for chemical mechanical polishing is 10 mV or more.
A molded article of polyolefin-based resin expanded beads having excellent appearance and further suppressed color unevenness is provided.
A molded article of polyolefin-based resin expanded beads having excellent appearance and further suppressed color unevenness is provided.
Polyolefin-based resin expanded beads obtained by expanding polyolefin-based resin particles including one or two or more metal borates selected from zinc borate and magnesium borate, wherein the particles of the metal borate has an arithmetic average particle diameter based on the number of 1 μm or more, and a number rate of the particles of the metal borate having a particle diameter of 5 μm or more is 20% or less. A method for producing polyolefin-based resin expanded beads by releasing expandable polyolefin-based resin particles containing one or two or more metal borates selected from zinc borate and magnesium borate and a physical blowing agent dispersed in an aqueous medium in a closed vessel together with the aqueous medium from the closed vessel to a low pressure region than an inside of the closed vessel to expand the expandable polyolefin-based resin particles, the method comprising: using a metal borate having an arithmetic average particle diameter based on the number of 1 μm or more and a number rate of the particles having a particle diameter of 5 μm or more of 20% or less as the metal borate.
C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
A composition includes a polymer (1) having a partial structure represented by formula (1), and a solvent. X is a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group having 1 to 5 carbon atoms, a hydroxyalkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms. Y is a monovalent organic group having 1 to 12 carbon atoms and containing a hetero atom or a monovalent inorganic acid group. Z is a linking group represented by —O—, —S—, or —NR—, where R is an organic group having 1 to 20 carbon atoms. R1 and R2 are each independently a hydrogen atom, a halogen atom, or an organic group having 1 to 20 carbon atoms, or the like.
A composition includes a polymer (1) having a partial structure represented by formula (1), and a solvent. X is a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group having 1 to 5 carbon atoms, a hydroxyalkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms. Y is a monovalent organic group having 1 to 12 carbon atoms and containing a hetero atom or a monovalent inorganic acid group. Z is a linking group represented by —O—, —S—, or —NR—, where R is an organic group having 1 to 20 carbon atoms. R1 and R2 are each independently a hydrogen atom, a halogen atom, or an organic group having 1 to 20 carbon atoms, or the like.
C08F 297/02 - Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
A method is provided for producing astrocyte-like cells, including (A) upregulating transcription factors including SRY-box transcription factor 9 (SOX9), nuclear factor IA (NFIA), and nuclear factor IB (NFIB) in human pluripotent stein cells and (B) culturing the human pluripotent stem cells, in which the transcription factors are upregulated, and consequently differentiating the human pluripotent stern cells into astrocyte-like cells.
COMPOSITION FOR ALLEVIATING PULMONARY HYPERTENSION, METHOD FOR PREDICTING PROGNOSIS OF PULMONARY HYPERTENSION, METHOD FOR ASSISTING IN DETERMINING SEVERITY OF PULMONARY HYPERTENSION, AND METHOD FOR ASSISTING IN DIAGNOSING PULMONARY HYPERTENSION
The present invention provides (1) a composition for improving pulmonary hypertension, comprising at least one substance capable of normalizing gut microbiota in a patient with pulmonary hypertension as an active ingredient; (2) a method for predicting the prognosis of a patient with pulmonary hypertension, or a method for assisting the determination of the severity of a patient with pulmonary hypertension, the method comprising detecting one or more types of bacteria selected from bacteria belonging to the family Micrococcaceae, Streptococcaceae, Pasteurellaceae, Veillonellaceae or Lactobacillaceae in gut microbiota in the patient with pulmonary hypertension; and (3) a method for assisting the diagnosis of pulmonary hypertension, the method comprising comparing the IgA level in feces of a subject to that of a healthy subject.
A vehicle seat core material includes a molded article that includes thermoplastic resin expanded beads. The molded article has a substantially rectangular shape in a top view, and has a front side and a rear side opposite the front side. The molded article has an average density (Z) of 20 kg/m3 to 50 kg/m3. The molded article includes, on the rear side of the molded article, a rear thin portion having a thickness of 10 mm to 40 mm, the thickness of the rear thin portion being smaller than an average thickness of the molded article. A ratio (Y/Z) of a density (Y) of the rear thin portion to the average density (Z) of the molded article is 1.05 to 3. The rear thin portion of the molded article has a fusion rate of 70% or more.
A crosslinked olefin-based thermoplastic elastomer expanded bead including a base polymer having an olefin-based thermoplastic elastomer and a brominated bisphenol-based flame retardant having a chemical structure represented by formula (1). A difference TmTPO-TFR is −5° C. to 40° C., where TmTPO is a melting point of the olefin-based thermoplastic elastomer and TFR is the lower of a glass transition temperature TgFR and a melting point TmFR of the brominated bisphenol-based flame retardant. A xylene insoluble content is 5 mass % to 80 mass %. R1 and R3 in the formula (1) are monovalent substituents, R2 is a divalent substituent, and n is an integer from 1 to 6:
A crosslinked olefin-based thermoplastic elastomer expanded bead including a base polymer having an olefin-based thermoplastic elastomer and a brominated bisphenol-based flame retardant having a chemical structure represented by formula (1). A difference TmTPO-TFR is −5° C. to 40° C., where TmTPO is a melting point of the olefin-based thermoplastic elastomer and TFR is the lower of a glass transition temperature TgFR and a melting point TmFR of the brominated bisphenol-based flame retardant. A xylene insoluble content is 5 mass % to 80 mass %. R1 and R3 in the formula (1) are monovalent substituents, R2 is a divalent substituent, and n is an integer from 1 to 6:
The kidney regeneration accelerator that contains a component obtained by decellularizing a mammalian organ. The production method for a kidney regeneration accelerator that involves decellularizing a mammalian organ to obtain a component that includes an extracellular matrix, freeze drying and then pulverizing the component to obtain a powder, and performing a sterilization treatment on the powder. A pharmaceutical composition for use in treating kidney disease that contains a component obtained by decellularizing a mammalian organ. A treatment method for kidney disease that involves applying a pharmaceutical composition that contains a component obtained by decellularizing a mammalian organ to a site to be treated of the kidney of a human or animal kidney disease patient.
A molded article of polypropylene-based resin expanded beads, obtained by in-mold molding of the polypropylene-based resin expanded beads, each bead including: a core layer, in a foamed state, having a polypropylene-based resin; and a covering layer, which covers the core layer, having a polyethylene-based resin. A molded article magnification X [times] of the molded article is 55 times to 90 times, a value of a product X·σ50 of a 50% compressive stress σ50 [kPa] and the molded article magnification X is 6500 or more, and a 5% compressive stress σ5 of the expanded beads molded article is 5 kPa to 25 kPa.
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
A radiation-sensitive resin composition includes a resin, a radiation-sensitive acid generator, and a solvent. The resin includes a structural unit A represented by formula (1) and a structural unit B having an acid-dissociable group. The structural unit represented by the formula (1) is excluded from the structural unit B. In the formula (1), A is a monovalent aromatic hydrocarbon group in which —ORY is bonded to a carbon atom adjacent to a carbon atom to which Lα is bonded, and hydrogen atoms on other carbon atoms are unsubstituted, or a part or all of the hydrogen atoms are substituted with a cyano group, a nitro group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, an alkoxycarbonyloxy group, an acyl group, or an acyloxy group.
A radiation-sensitive resin composition includes a resin, a radiation-sensitive acid generator, and a solvent. The resin includes a structural unit A represented by formula (1) and a structural unit B having an acid-dissociable group. The structural unit represented by the formula (1) is excluded from the structural unit B. In the formula (1), A is a monovalent aromatic hydrocarbon group in which —ORY is bonded to a carbon atom adjacent to a carbon atom to which Lα is bonded, and hydrogen atoms on other carbon atoms are unsubstituted, or a part or all of the hydrogen atoms are substituted with a cyano group, a nitro group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, an alkoxycarbonyloxy group, an acyl group, or an acyloxy group.
A thermoplastic olefinic elastomer expanded bead, which is an expanded bead including a thermoplastic olefinic elastomer as a main component, wherein the expanded bead has an average particle diameter of 0.5 to 5 mm, the expanded bead has a heat of fusion of 60 to 80 J/g, and a difference [Tm−Tc] between a melting point (Tm) and a crystallization temperature (Tc) of the expanded bead is 20° C. or lower.
A radiation-sensitive resin composition includes a solvent and an onium salt compound having a structure represented by formula (1). Rf1 and Rf2 each independently represent a fluorine atom or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. R1 represents a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a fluorine atom, or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. R2, R3, R4, R5, R6, and R7 each independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms. n1+n2 is an integer of 2 to 8. n3 represents an integer of 0 to 5. X1 and X2 each independently represent an oxygen atom or a sulfur atom. Each * represents a bond with another structure. Z+ represents a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes a solvent and an onium salt compound having a structure represented by formula (1). Rf1 and Rf2 each independently represent a fluorine atom or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. R1 represents a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a fluorine atom, or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. R2, R3, R4, R5, R6, and R7 each independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms. n1+n2 is an integer of 2 to 8. n3 represents an integer of 0 to 5. X1 and X2 each independently represent an oxygen atom or a sulfur atom. Each * represents a bond with another structure. Z+ represents a monovalent radiation-sensitive onium cation.
Provided are a method for forming a resist pattern that demonstrates excellent performance in sensitivity, resolution, etc. in an exposure step when a next-generation exposure technique is applied, and a radiation-sensitive resin composition. The method for forming a resist pattern includes step (1) of forming a resist film in which a content of a radiation-sensitive acid generator (C) is 0.1% by mass or less, step (2) of exposing the resist film to EUV or an electron beam (EB), and step (3) of developing the resist film exposed in the step (2).
A wearable device according to an embodiment includes a detection unit, a first layer, a second layer, and a third layer. The detection unit detects the living body information. The first layer is flexible and disposed in a first direction relative to the detection unit and includes a conductor electrically connected to the detection unit. The second layer is disposed in the first direction relative to the first layer and is harder than the first layer. The third layer is disposed in the first direction relative to the second layer and includes an electronic component electrically connected to the conductor.
A61B 5/259 - Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes using conductive adhesive means, e.g. gels
A61B 5/28 - Bioelectric electrodes therefor specially adapted for particular uses for electrocardiography [ECG]
A silicon-containing composition includes: a first polysiloxane; a second polysiloxane different from the first polysiloxane; and a solvent. The first polysiloxane includes a group which includes at least one selected from the group consisting of an ester bond, a carbonate structure, and a cyano group. The second polysiloxane includes a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms.
H01L 21/308 - Chemical or electrical treatment, e.g. electrolytic etching using masks
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
A composite molded article in which thermoplastic resin expanded beads are bonded via a thermosetting resin binder, wherein the composite molded article has a density of 0.05 to 0.5 g/cm3, and when heated at 100° C. for 20 minutes, the composite molded article has a volume expansion rate of 15 to 200%.
C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08L 67/03 - Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
An expanded bead having a through hole and including a foamed core layer which defines the through hole therein and which is constituted of a resin composition containing two kinds of polypropylene-based resins having different melting points, and a cover layer covering the foamed core layer and constituted of a polyolefin-based resin. The expanded bead gives a DSC curve in which an endothermic peak intrinsic to the resin composition and another endothermic peak on a higher temperature side thereof appear in a specific heat of fusion ratio. Molded articles include a multiplicity of the expanded beads.
B32B 1/00 - Layered products essentially having a general shape other than plane
B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
A HIPE foam may including a vinyl-based crosslinked polymer as a base material resin. The vinyl-based crosslinked polymer may be formed by crosslinking a polymer of a styrene-based monomer and/or an acryl-based monomer. An apparent density ρ of the HIPE foam may be 35 kg/m3 or more and 500 kg/m3 or less. A molecular weight between crosslinking points of the vinyl-based crosslinked polymer forming the HIPE foam may be 2×103 or more and 2×105 or less. The HIPE foam may be used as, for example, a machinable material or an impact absorbing material.
C08J 9/22 - After-treatment of expandable particles; Forming foamed products
33.
COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, METHOD FOR CHEMICAL MECHANICAL POLISHING, AND METHOD FOR MANUFACTURING CHEMICAL MECHANICAL POLISHING PARTICLES
Provided are a composition for chemical mechanical polishing and a method for chemical mechanical polishing, whereby a tungsten film as a wiring material can be polished at high speed, and the occurrence of surface defects in a polished surface can be reduced. A composition for chemical mechanical polishing pertaining contains (A) alumina particles, at least a portion of the surface of which is coated with a coating film of silica alumina, and (B) a liquid medium.
A composition for resist underlayer film formation, includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents an organic group comprising at least one structure selected from the group consisting of a hydroxy group, a carbonyl group, and an ether bond; a is an integer of 1 to 3, wherein in a case in which a is no less than 2, a plurality of Xs are identical or different from each other; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms, wherein is a group other than X; and b is an integer of 0 to 2, wherein in a case in which b is 2, two R1s are identical or different from each other, and wherein a sum of a and b is no greater than 3.
A composition for resist underlayer film formation, includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents an organic group comprising at least one structure selected from the group consisting of a hydroxy group, a carbonyl group, and an ether bond; a is an integer of 1 to 3, wherein in a case in which a is no less than 2, a plurality of Xs are identical or different from each other; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms, wherein is a group other than X; and b is an integer of 0 to 2, wherein in a case in which b is 2, two R1s are identical or different from each other, and wherein a sum of a and b is no greater than 3.
Polyamide-based resin expanded beads contain a polyamide-based resin as a base material resin. The beads have a crystal structure, an intrinsic peak of the polyamide-based resin and a high-temperature peak having a peak top temperature on a higher temperature side than a peak top temperature of the intrinsic peak appear in a DSC curve obtained under a predetermined condition; an amount of heat of fusion of the high-temperature peak is within 5 J/g or more and 50 J/g or less; and a coefficient of variation of the amount of heat of fusion of the high-temperature peak is 20% or less. The beads are produced by in-mold molding. A method for producing the beads includes: impregnating a polyamide-based resin; and releasing expandable polyamide-based resin beads from a sealed container, a temperature in the sealed container is raised at a rate of 0.3° C. or higher and 1.5° C. or lower per 10 minutes.
A device configuration designed to mitigate display defects resulting from voltage drops in current supply lines offers a display with better display quality. The display includes: a plurality of VOLETs arranged in arrays along a first direction and a second direction; a data line supplying a voltage for controlling gate electrodes of the plurality of VOLETs; TFTs each connected between a gate electrode of each of the VOLET and the data line and controlling voltage supply to the gate electrodes of the VOLETs; a gate line connected to gate electrodes of the TFTs and transmitting a signal that controls the TFTs; a plurality of current supply lines extending along the first direction and supplying a current to each of a group of VOLETs aligned along the first direction; and an auxiliary line extending along the second direction and connecting at least two of the plurality of current supply lines.
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
37.
RESIST UNDERLAYER FILM-FORMING COMPOSITION, RESIST UNDERLAYER FILM, AND METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE
A resist underlayer film-forming composition includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents a group represented by formula (2); a is an integer of 1 to 3; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms; and b is an integer of 0 to 2; and a sum of a and b is no greater than 3. R2 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; n is 1 or 2; R3 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; L represents a single bond or a divalent linking group; and * denotes a site bonding to the silicon atom in the formula (1). The composition is suitable for lithography with an electron beam or extreme ultraviolet ray.
A resist underlayer film-forming composition includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents a group represented by formula (2); a is an integer of 1 to 3; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms; and b is an integer of 0 to 2; and a sum of a and b is no greater than 3. R2 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; n is 1 or 2; R3 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; L represents a single bond or a divalent linking group; and * denotes a site bonding to the silicon atom in the formula (1). The composition is suitable for lithography with an electron beam or extreme ultraviolet ray.
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C09D 183/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
C08G 77/26 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen nitrogen-containing groups
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
38.
COMPOSITION, METHOD OF FORMING RESIST UNDERLAYER FILM, AND METHOD OF FORMING RESIST PATTERN
A composition includes: a compound including an aromatic ring; and a first polymer including a first structural unit represented by formula (1) and a second structural unit represented by formula (2). A content of the first polymer with respect to 100 parts by mass of the compound is no less than 0.1 parts by mass and no greater than 200 parts by mass. R1 represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group; and R2 represents a substituted or unsubstituted monovalent hydrocarbon group. R3 represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group; L represents a single bond or a divalent linking group; Ar represents a group obtained by removing (n+1) hydrogen atoms from a substituted or unsubstituted aromatic ring; R4 represents a hydroxy group or a monovalent hydroxyalkyl group; and n is an integer of 1 to 8.
A composition includes: a compound including an aromatic ring; and a first polymer including a first structural unit represented by formula (1) and a second structural unit represented by formula (2). A content of the first polymer with respect to 100 parts by mass of the compound is no less than 0.1 parts by mass and no greater than 200 parts by mass. R1 represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group; and R2 represents a substituted or unsubstituted monovalent hydrocarbon group. R3 represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group; L represents a single bond or a divalent linking group; Ar represents a group obtained by removing (n+1) hydrogen atoms from a substituted or unsubstituted aromatic ring; R4 represents a hydroxy group or a monovalent hydroxyalkyl group; and n is an integer of 1 to 8.
C08G 8/12 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with monohydric phenols having only one hydrocarbon substituent ortho or para to the OH group, e.g. p-tert.-butyl phenol
C08F 216/02 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical by an alcohol radical
C08G 8/24 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with mixtures of two or more phenols which are not covered by only one of the groups
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
39.
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, METHOD FOR PRODUCING PLATED FORMED PRODUCT, AND METHOD FOR PRODUCING TIN-SILVER PLATED-FORMED PRODUCT
A photosensitive resin composition contains polymer (A) having an acid dissociative group, photoacid generator (B), and solvent (C), the solvent (C) containing 80 to 95% by mass of propylene glycol monomethyl ether acetate (C1) and 5 to 18% by mass of 3-methoxybutyl acetate (C2), a content ratio of other solvent (C3) in the solvent (C) being 0 to 10% by mass, and a content ratio of the solvent (C) contained in the photosensitive resin composition being less than 60% by mass.
G03F 7/40 - Treatment after imagewise removal, e.g. baking
G03F 7/32 - Liquid compositions therefor, e.g. developers
40.
COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND METHOD FOR MANUFACTURING PARTICLES FOR CHEMICAL MECHANICAL POLISHING
Provided are a composition for chemical mechanical polishing and a chemical mechanical polishing method, which enable reduction in occurrence of surface defects in a polished surface and which enable high speed polishing of a tungsten film which is a wiring material. The composition for chemical mechanical polishing contains: (A) particles containing alumina and having a functional group represented by general formula (1); and (B) a liquid medium. (1): —SO3−M+ (In the formula, M+ represents a monovalent cation.)
The present invention provides a prophylactic or therapeutic composition for graft-versus-host disease (GVHD).
The present invention provides a prophylactic or therapeutic composition for graft-versus-host disease (GVHD).
There is provided a prophylactic or therapeutic composition for GVHD, which comprises bacteria belonging to any genus selected from the group consisting of the following genera: Blautia, Clostridium, unclassified Clostridiales, Actinomyces, Parabacteroides, Lachnoclostridium, Bacteroides, Faecalibacterium, unclassified Lachnospiraceae, Roseburia, Ruminococcus, unclassified Firmicutes, Dorea, Phascolarctobacterium, Sutterella, Megamonas, Collinsella, Eubacterium, and Coprococcus, etc., or any combination of bacteria belonging to these genera.
1 is a hydrogen atom, a monovalent hydrocarbon group, a monovalent halogenated hydrocarbon group, or a monovalent group having a heterocyclic structure.
B05D 1/00 - Processes for applying liquids or other fluent materials
B05D 1/32 - Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
C08F 297/02 - Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
43.
METHOD FOR PRODUCING CELL-CONTAINING EXTRACELLULAR MATRIX, CELL CULTURE METHOD, DEVICE FOR PRODUCING CELL-CONTAINING EXTRACELLULAR MATRIX AND CONTROL PROGRAM
A method for producing a cell-containing extracellular matrix is provided, the method including preparing an extracellular matrix solution which contains (i) an extracellular matrix precursor and (ii) cells or a cell mass inside a pipette having a tip opening portion; discharging the extracellular matrix solution to form a drop of the extracellular matrix solution at the tip opening portion of the pipette; bringing the tip opening portion of the pipette close to a culture surface of a cell culture container to place the drop on the culture surface while avoiding bringing the tip opening portion of the pipette into contact with the culture surface; moving the tip opening portion of the pipette away from the culture surface to separate the drop from the tip opening portion of the pipette; and gelating the extracellular matrix solution to form a cell-containing extracellular matrix.
Provided are a composition for chemical mechanical polishing and a method for polishing allowing a tungsten film- or silicon nitride film-containing semiconductor substrate to be polished at a high speed, while also enabling a reduction in the occurrence of a surface defect in the polished face after polishing. A composition for chemical mechanical polishing according to the present invention comprises (A) abrasive grains containing titanium nitride and (B) a liquid medium, wherein the absolute value of the zeta-potential of said (A) component in the composition for chemical mechanical polishing is 8 mV or higher.
A production method for an organoid, the production method including a step of culturing adult stem cells or a cell tissue piece including adult stem cells in a medium containing a chimeric Fibroblast Growth Factor (FGF) that includes a partial region of FGF1 and a partial region of FGF2; an organoid produced by the production method; a medium including a chimeric FGF and having a content of chimeric FGF of 50 ng/mL or less; and an evaluation method for a test substance are provided, and according to the chimeric FGF, a content of growth factors included in a medium can be reduced.
C07K 14/47 - Peptides having more than 20 amino acids; Gastrins; Somatostatins; Melanotropins; Derivatives thereof from humans from vertebrates from mammals
46.
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN
The radiation-sensitive resin composition contains: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid, and which has a structural unit represented by the following formula (1); and a radiation-sensitive acid generating agent. L represents a single bond, —COO—, —O—, or —CONH—. X represents a single bond, —O—, -G-O—, —CH2—, —S—, —SO2—, —NRA—, or —CONH—, wherein G represents a divalent aliphatic hydrocarbon group having 1 to 20 carbon atoms, and RA represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. R2 and R3 each independently represent a halogen atom, a hydroxy group, a sulfanyl group, or an organic group having 1 to 20 carbon atoms.
The radiation-sensitive resin composition contains: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid, and which has a structural unit represented by the following formula (1); and a radiation-sensitive acid generating agent. L represents a single bond, —COO—, —O—, or —CONH—. X represents a single bond, —O—, -G-O—, —CH2—, —S—, —SO2—, —NRA—, or —CONH—, wherein G represents a divalent aliphatic hydrocarbon group having 1 to 20 carbon atoms, and RA represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. R2 and R3 each independently represent a halogen atom, a hydroxy group, a sulfanyl group, or an organic group having 1 to 20 carbon atoms.
Provided are a chemical-mechanical polishing composition and a chemical-mechanical polishing method capable of polishing a semiconductor substrate containing a conductive metal such as tungsten or cobalt flatly and at high speed as well as reducing surface defects after polishing. The composition for chemical-mechanical polishing contains (A) silica particles having a functional group represented by general formula (1) and (B) a silane compound. —COO-M+ . . . (1) (M+ represents a monovalent cation.)
Provided are a chemical mechanical polishing composition and a chemical mechanical polishing method that can polish a semiconductor substrate containing an electric conductor metal, such as tungsten or cobalt, flat and at high speed, and reduce post-polishing surface defects. The chemical mechanical polishing composition contains (A) silica particles having the functional group represented by general formula (1), and (B) at least one selected from the group consisting of a carboxylic acid having an unsaturated bond and a salt thereof. (1): —COO-M+ (M+ represents a monovalent cation.)
Provided are an additive and a surface treatment agent capable of suppressing agglutination of latex particles contained in a reagent for a latex agglutination reaction during storage of the reagent although a synthetic polymer is contained as an active component.
Provided are an additive and a surface treatment agent capable of suppressing agglutination of latex particles contained in a reagent for a latex agglutination reaction during storage of the reagent although a synthetic polymer is contained as an active component.
An additive is to be added to latex particles used in a reagent for a latex agglutination reaction. The latex particles have not been subjected to blocking treatment. The additive includes a polymer containing more than 60% by mass and 99% by mass or less of hydrophilic repeating units (A) relative to all repeating units and 1% by mass or more and less than 40% by mass of hydrophobic repeating units (B) relative to all repeating units, and having a weight average molecular weight of 3,000 or more.
According to a production method for a brain organoid, comprising a step 1 of carrying out suspension culture of human pluripotent stem cells having a mutation in at least one or more base sequences in an exon selected from the group consisting of an exon 9, an exon 10, an exon 11, an exon 12, and an exon 13 of a microtubule-associated protein tau (MAPT) gene, and having a mutation in at least one or more base sequences in an intron 10 of the MAPT gene, it is possible to produce a brain organoid having a phosphorylated 3-repeat tau protein and a phosphorylated 4-repeat tau protein.
A method for separation and detection of exosomes may include: bringing a biological sample into contact with a capture molecule, the capture molecule including a specific binding substance for an antigen expressed on a cancer cell surface, to form a complex of an exosome and the capture molecule; and a bringing the complex into contact with a detector molecule, the detector molecule including a specific binding substance for an antigen expressed on a cancer cell surface and a labeling substance, to detect the complex by using the detector molecule, in which the antigen expressed on a cancer cell surface for at least one of the capture molecule and the detector molecule is cell-surface vimentin.
A radiation-sensitive resin composition includes: a resin including a structural unit (A) represented by formula (1) and a structural unit (B) having an acid-dissociable group; a radiation-sensitive acid generator; and a solvent. R1 is a halogen atom-substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; X is —O— or —S—; La1 is a halogen atom-substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms, and RP is a monovalent organic group having at least one structure selected from the group consisting of a lactone structure, a cyclic carbonate structure, and a sultone structure.
A radiation-sensitive resin composition includes: a resin including a structural unit (A) represented by formula (1) and a structural unit (B) having an acid-dissociable group; a radiation-sensitive acid generator; and a solvent. R1 is a halogen atom-substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; X is —O— or —S—; La1 is a halogen atom-substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms, and RP is a monovalent organic group having at least one structure selected from the group consisting of a lactone structure, a cyclic carbonate structure, and a sultone structure.
A radiation-sensitive resin composition includes: an onium salt compound represented by formula (1′); a resin including a structural unit having an acid-dissociable group; and a solvent. EA is a substituted or unsubstituted (α+β)-valent organic group having 1 to 40 carbon atoms; Z+ is a monovalent radiation-sensitive onium cation; and α and β are each independently 1 or 2.
A radiation-sensitive resin composition includes: an onium salt compound represented by formula (1′); a resin including a structural unit having an acid-dissociable group; and a solvent. EA is a substituted or unsubstituted (α+β)-valent organic group having 1 to 40 carbon atoms; Z+ is a monovalent radiation-sensitive onium cation; and α and β are each independently 1 or 2.
A modified expanded bead that includes an expanded bead which includes a specific base polymer (β) and a coating layer which includes a specific base polymer (α). The coating layer covers at least part of an outer surface of the expanded bead. The melting point Tα of the base polymer (α) and the melting point Tβ of the base polymer (β) satisfy a relationship of 0≤Tα−Tβ≤20. When the modified expanded bead is cut into two halves along a cutting plane to form two half portions and thereafter one of the two half portions is cut along planes perpendicular to the cutting plane to form ten small pieces, outermost pieces among the ten small pieces have a xylene-insoluble content (B) which is less than a xylene-insoluble content (A) in the half portion and the xylene-insoluble content (A) is 10-80% by mass.
A method is implemented to select a calculator for performing given processing using a quantum algorithm or a combined algorithm of a classical algorithm and the quantum algorithm. The method comprises a calculation operation, a selection operation, and a control operation. The calculation operation calculates a quantum bit or a quantum volume for performing the given processing using the quantum algorithm, or for a portion of the quantum algorithm when performing the given processing using the combined algorithm. The selection operation selects a calculator for performing the given processing based on the quantum bit or the quantum volume. The control operation generates a control signal to be transmitted to the quantum calculator when the selected calculator includes a quantum calculator. The control signal may correspond to an instruction that initiates the quantum calculator to start the quantum algorithm.
G16C 10/00 - Computational theoretical chemistry, i.e. ICT specially adapted for theoretical aspects of quantum chemistry, molecular mechanics, molecular dynamics or the like
G06N 10/60 - Quantum algorithms, e.g. based on quantum optimisation, or quantum Fourier or Hadamard transforms
56.
RADIATION-SENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMING PATTERN
A radiation-sensitive resin composition includes: a resin including a structural unit represented by formula (1); and a solvent containing propylene glycol monomethyl ether and alkyl lactate. The solvent does not contain propylene glycol monomethyl ether acetate or contains propylene glycol monomethyl ether acetate in a content of 5% by mass or less in the solvent. The radiation-sensitive resin composition further includes a radiation-sensitive acid generator, or the resin further includes a structural unit having a radiation-sensitive acid generating structure. In the formula (1), RT is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group. RX is a monovalent hydrocarbon group having 1 to 20 carbon atoms. Cy represents an alicyclic structure having 3 to 20 ring members formed together with the carbon atom to which Cy is bonded.
A radiation-sensitive resin composition includes: a resin including a structural unit represented by formula (1); and a solvent containing propylene glycol monomethyl ether and alkyl lactate. The solvent does not contain propylene glycol monomethyl ether acetate or contains propylene glycol monomethyl ether acetate in a content of 5% by mass or less in the solvent. The radiation-sensitive resin composition further includes a radiation-sensitive acid generator, or the resin further includes a structural unit having a radiation-sensitive acid generating structure. In the formula (1), RT is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group. RX is a monovalent hydrocarbon group having 1 to 20 carbon atoms. Cy represents an alicyclic structure having 3 to 20 ring members formed together with the carbon atom to which Cy is bonded.
G03F 7/32 - Liquid compositions therefor, e.g. developers
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
G03F 7/38 - Treatment before imagewise removal, e.g. prebaking
G03F 7/40 - Treatment after imagewise removal, e.g. baking
A production method for a proliferative liver organoid includes culturing liver stem cells or a tissue fragment including liver stem cells in a growth medium to obtain a proliferative liver organoid, in which the growth medium contains an interleukin-6 family cytokine. A production method for a metabolically activated liver organoid includes culturing the proliferative liver organoid produced by the production method for a proliferative liver organoid in a differentiation medium to obtain a metabolically activated liver organoid, in which the differentiation medium does not substantially contain an interleukin-6 family cytokine.
A radiation-sensitive resin composition includes: a first polymer including a structural unit including an acid-labile group; a second polymer including a structural unit represented by formula (1); and a radiation-sensitive acid generator. In the formula (1), A represents an oxygen atom or a sulfur atom; a sum of m and n is 2 or 3, wherein m is 1 or 2, and n is 1 or 2; X represents a single bond or a divalent organic group having 1 to 20 carbon atoms; and R1 represents a monovalent organic group including a fluorine atom.
A radiation-sensitive resin composition includes: a first polymer including a structural unit including an acid-labile group; a second polymer including a structural unit represented by formula (1); and a radiation-sensitive acid generator. In the formula (1), A represents an oxygen atom or a sulfur atom; a sum of m and n is 2 or 3, wherein m is 1 or 2, and n is 1 or 2; X represents a single bond or a divalent organic group having 1 to 20 carbon atoms; and R1 represents a monovalent organic group including a fluorine atom.
C07D 307/00 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
C07C 69/736 - Ethers the hydroxy group of the ester being etherified with a hydroxy compound having the hydroxy group bound to a carbon atom of a six-membered aromatic ring
C07C 69/96 - Esters of carbonic or haloformic acids
C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
C08F 220/36 - Esters containing nitrogen containing oxygen in addition to the carboxy oxygen
C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
C08F 220/30 - Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
59.
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
A radiation-sensitive resin composition includes: a resin having a polystyrene-equivalent weight-average molecular weight of 8,000 or less; a radiation-sensitive acid generator; and a solvent. The resin includes: a structural unit A represented by formula (1); a structural unit B having a phenolic hydroxyl group; and a structural unit C having an acid-dissociable group. The structural unit B is other than the structural unit A; and the structural unit C is other than the structural unit A or B. In the formula (1), RX is a hydrogen atom or a methyl group; and Ar is a monovalent aromatic hydrocarbon group having a substituent represented by —ORY. The substituent is bonded to a carbon atom next to a carbon atom bonded to a main chain of the resin. RY is a hydrogen atom or a protective group to be deprotected by action of an acid.
A radiation-sensitive resin composition includes: a resin having a polystyrene-equivalent weight-average molecular weight of 8,000 or less; a radiation-sensitive acid generator; and a solvent. The resin includes: a structural unit A represented by formula (1); a structural unit B having a phenolic hydroxyl group; and a structural unit C having an acid-dissociable group. The structural unit B is other than the structural unit A; and the structural unit C is other than the structural unit A or B. In the formula (1), RX is a hydrogen atom or a methyl group; and Ar is a monovalent aromatic hydrocarbon group having a substituent represented by —ORY. The substituent is bonded to a carbon atom next to a carbon atom bonded to a main chain of the resin. RY is a hydrogen atom or a protective group to be deprotected by action of an acid.
A cushion body for sitting is provided which can offer good feeling of sitting even to many unspecified users of various body shapes and allow them to be seated more comfortably. A cushion body for sitting (1) includes: a base part (2) having a sitting surface (S1) formed of a curved surface that is curved concavely to support, from below, the buttocks of a seated person in a seated posture; and a pair of side supporting portions (3) each having a side supporting surface (S2) formed of a curved surface that is curved continuously from the sitting surface (S1) of the base part (2), where the pair of side supporting portions (3) project from sides of the base part (2) such that the side supporting portions (3) can be bent and deformed by a load applied to the side supporting surfaces (S2), so as to support both the left and right parts of the buttocks of the seated person in the seated posture.
Provided are: a radiation-sensitive resin composition, a method of forming a resist pattern, and a polymer which enable forming a resist pattern with favorable sensitivity to exposure light and superiority in terms of CDU performance and resolution. The radiation-sensitive resin composition contains: a polymer having: a first structural unit represented by formula (1), and a second structural unit derived from a (meth)acrylic acid ester including an acid-labile group; and a radiation-sensitive acid generator.
Provided are: a radiation-sensitive resin composition, a method of forming a resist pattern, and a polymer which enable forming a resist pattern with favorable sensitivity to exposure light and superiority in terms of CDU performance and resolution. The radiation-sensitive resin composition contains: a polymer having: a first structural unit represented by formula (1), and a second structural unit derived from a (meth)acrylic acid ester including an acid-labile group; and a radiation-sensitive acid generator.
An expanded bead having a tubular shape with a through hole and a method for producing the same are provided. The expanded bead includes a foamed core layer and a covering layer. A polyolefin-based resin included in the covering layer has a melting point lower than a melting point of a polypropylene-based resin included in the foamed core layer. An average hole diameter d of the through hole of the expanded bead is less than 1 mm, and a ratio d/D of the average hole diameter d to an average outer diameter D of the expanded bead is 0.4 or less. The polypropylene-based resin for the foamed core layer has a flexural modulus of 1,200 MPa or more and a melting point of 158° C. or lower.
C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
B29C 44/34 - Component parts, details or accessories; Auxiliary operations
63.
COMPOSITION, METHOD OF PRODUCING SUBSTRATE, AND POLYMER
A composition includes a polymer and a solvent. The polymer includes a group (X) which is at least one selected from the group consisting of: a group including at least two cyano groups; a group including —B(OR)2; a group including —PO(OR)2; and a group including —P(OR)2. Each R independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. The polymer preferably includes the group (X) at an end of a main chain thereof or at an end of a side chain thereof.
C23C 18/06 - Coating on selected surface areas, e.g. using masks
C09D 185/02 - Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon; Coating compositions based on derivatives of such polymers containing phosphorus
C09D 185/04 - Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon; Coating compositions based on derivatives of such polymers containing boron
C09D 5/20 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
C23C 18/12 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
C23G 1/02 - Cleaning or pickling metallic material with solutions or molten salts with acid solutions
64.
RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST PATTERN-FORMING METHOD
A radiation-sensitive resin composition includes: a first polymer having a first structural unit which includes a phenolic hydroxyl group, and a second structural unit which includes an acid-labile group and a carboxy group which is protected by the acid-labile group; a second polymer having a third structural unit represented by the following formula (S-1), and a fourth structural unit which is a structural unit other than the third structural unit and is represented by the following formula (S-2); and a radiation-sensitive acid generator, wherein the acid-labile group includes a monocyclic or polycyclic ring structure having no fewer than 3 and no more than 20 ring atoms.
A radiation-sensitive resin composition includes: a first polymer having a first structural unit which includes a phenolic hydroxyl group, and a second structural unit which includes an acid-labile group and a carboxy group which is protected by the acid-labile group; a second polymer having a third structural unit represented by the following formula (S-1), and a fourth structural unit which is a structural unit other than the third structural unit and is represented by the following formula (S-2); and a radiation-sensitive acid generator, wherein the acid-labile group includes a monocyclic or polycyclic ring structure having no fewer than 3 and no more than 20 ring atoms.
In this liquid crystal display device, a plurality of pixels 30 are arranged in a display region. The liquid crystal display device comprises a first substrate 11 in which a pixel electrode 15 having slits 15a is provided, a second substrate disposed face to the first substrate 11, a liquid crystal layer 13 containing liquid crystal molecules that have negative dielectric anisotropy, a first alignment film 22, and a second alignment film 23. The slits 15a are positioned in each alignment region of a plurality of alignment regions in the pixels 30, and have oblique slit parts extending in an oblique direction with respect to sides of the pixels 30. The angle γ formed by the direction in which the oblique slit parts extends and a liquid crystal projection direction is 15 degrees or more and 85 degrees or less.
An affinity support having improved binding capacity for target proteins. An immunoglobulin-binding protein including a mutant immunoglobulin-binding domain, an affinity support including a solid-phase support and the immunoglobulin-binding protein immobilized thereto. The mutant immunoglobulin-binding domain consists of an amino acid sequence having at least 85% identity with an amino acid sequence of any of SEQ ID NOs: 1 to 12.
C07K 17/08 - Peptides being immobilised on, or in, an organic carrier the carrier being a synthetic polymer
B01J 20/281 - Sorbents specially adapted for preparative, analytical or investigative chromatography
C07K 1/22 - Affinity chromatography or related techniques based upon selective absorption processes
C07K 16/06 - Immunoglobulins, e.g. monoclonal or polyclonal antibodies from serum
C07K 14/31 - Peptides having more than 20 amino acids; Gastrins; Somatostatins; Melanotropins; Derivatives thereof from bacteria from Micrococcaceae (F) from Staphylococcus (G)
B01D 15/38 - Selective adsorption, e.g. chromatography characterised by the separation mechanism involving specific interaction not covered by one or more of groups , e.g. affinity, ligand exchange or chiral chromatography
67.
THERMOPLASTIC ELASTOMER FOAM PARTICLES AND MOLDED BODY OF SAME
The present invention relates to cylindrical expanded thermoplastic elastomer beads provided with through-holes, the expanded thermoplastic elastomer beads including a core layer in an foamed state constituted of a base polymer containing a thermoplastic elastomer and a cover layer covering the core layer and constituted of a thermoplastic polymer, wherein a coefficient of dynamic friction of the thermoplastic polymer is 0.8 or less, and a difference between a melting point (Tmc) of the base polymer and a melting point (Tms) of the thermoplastic polymer is −20° C. or more and 20° C. or less. The present invention also relates to an expanded thermoplastic elastomer beads molded article formed by subjecting expanded thermoplastic elastomer beads provided with through-holes to in-mold molding, the molded article including a core layer in a foamed state and a cover layer covering the core layer, wherein a voidage is 15% or more, a density is 10 kg/m3 or more and 200 kg/m3 or less, and the product of a tensile strength (MPa) and a tensile elongation (%) is 5 or more.
C08L 53/00 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
68.
POLYMER, COMPOSITION, MOLDED ARTICLE, CURED PRODUCT AND LAMINATE
A novel polymer having high glass transition temperature and an excellent balance between heat resistance, high refractive index and mechanical properties, and a composition and molded article containing the polymer are provided. The polymer according to the invention has a first structural unit represented by at least one of formulae (1-1), (1-2) and (1-3) below and a second structural unit having either a secondary amino structure or a tertiary amino structure at two or more terminals.
A novel polymer having high glass transition temperature and an excellent balance between heat resistance, high refractive index and mechanical properties, and a composition and molded article containing the polymer are provided. The polymer according to the invention has a first structural unit represented by at least one of formulae (1-1), (1-2) and (1-3) below and a second structural unit having either a secondary amino structure or a tertiary amino structure at two or more terminals.
C08G 65/40 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols and other compounds
C08L 71/10 - Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08L 71/00 - Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
C09D 163/00 - Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
C09D 171/00 - Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
NATIONAL CEREBRAL AND CARDIOVASCULAR CENTER (Japan)
JSR CORPORATION (Japan)
Inventor
Kondo, Teruyuki
Kimura, Yu
Son, Aoi
Matsuda, Tetsuya
Imai, Hirohiko
Koseki, Hirokazu
Aoki, Tomohiro
Takase, Katsuyuki
Miyaji, Masaaki
Tamori, Koji
Masuda, Takeaki
Kai, Hirokazu
Abstract
Composite particles, each of which is obtained by forming, on the surface of a gadolinium oxide-containing particle, a cover film that contains a polymer obtained by polymerizing a monomer component containing a monomer having an ethylenically unsaturated bond; a macrophage imaging agent which contains the composite particles; and a method for producing composite particles, wherein a monomer component containing a monomer having an ethylenically unsaturated bond and gadolinium oxide-containing particles are mixed with each other, and after emulsifying the thus-obtained monomer component-containing mixture in water in the presence of a surfactant and a polymerization initiator in water, the monomer component is polymerized, thereby forming cover films on the surfaces of the gadolinium oxide-containing particles.
A61K 49/08 - Nuclear magnetic resonance (NMR) contrast preparations; Magnetic resonance imaging (MRI) contrast preparations characterised by the carrier
70.
RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMER, AND COMPOUND
A radiation-sensitive resin composition includes: a first polymer including a structural unit which includes an acid-labile group; a second polymer including a structural unit represented by formula (1); and a radiation-sensitive acid generator. R1 represents a monovalent organic group having 1 to 20 carbon atoms; R2 represents a monovalent organic group having 1 to 20 carbon atoms; X represents a divalent organic group having 1 to 20 carbon atoms; and Y represents a divalent hydrocarbon group having 1 to 20 carbon atoms. The divalent organic group represented by X, the monovalent organic group represented by R2, or both has a fluorine atom.
A radiation-sensitive resin composition includes: a first polymer including a structural unit which includes an acid-labile group; a second polymer including a structural unit represented by formula (1); and a radiation-sensitive acid generator. R1 represents a monovalent organic group having 1 to 20 carbon atoms; R2 represents a monovalent organic group having 1 to 20 carbon atoms; X represents a divalent organic group having 1 to 20 carbon atoms; and Y represents a divalent hydrocarbon group having 1 to 20 carbon atoms. The divalent organic group represented by X, the monovalent organic group represented by R2, or both has a fluorine atom.
Provided is a method of compensating brightness of a display using a vertical organic light emitting transistor that suppresses variations in brightness over a long period of time and a display. This method is a method of compensating brightness of a display including a plurality of vertical organic light emitting transistors and a memory that stores characteristic information of the vertical organic light emitting transistor. This method includes a step (A) of applying a voltage for brightness inspection to a gate electrode of the vertical organic light emitting transistor to be corrected, a step (B) of measuring a current flowing through a current supply line through which the current is supplied to a source electrode of the vertical organic light emitting transistor by the application of the voltage for brightness inspection to the gate electrode of the vertical organic light emitting transistor to be corrected, and a step (C) of determining a corrected value of the voltage to be applied to the gate electrode of the vertical organic light emitting transistor based on a value of the current measured in the step (B) and the characteristic information of the vertical organic light emitting transistor stored in the memory.
G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
72.
METHOD OF DRIVING A LIGHT EMITTING DISPLAY AND DISPLAY
Provided is a method of driving a light emitting a display in which variations in image quality and brightness are suppressed despite long-term use, without adding a complicated circuit configuration. The driving a light emitting method includes a step (A) of applying a voltage based on image data to be displayed to a gate electrode of a vertical organic light emitting transistor and a step (B) of, after the step (A), applying a voltage, having a polarity opposite to that of the voltage applied to the gate electrode of the vertical organic light emitting transistor in the step (A), to the gate electrode of the vertical organic light emitting transistor based on a value of a voltage being applied to a source electrode of the vertical organic light emitting transistor.
G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
73.
COMPOSITION, FILM, METHOD OF FORMING FILM, METHOD OF FORMING PATTERN, METHOD OF FORMING ORGANIC-UNDERLAYER-FILM REVERSE PATTERN, AND METHOD OF PRODUCING COMPOSITION
A composition includes: a metal compound including a ligand; and a solvent. The ligand is derived from a compound represented by formula (1). L represents an oxygen atom or a single bond; R1 represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; R2 and R3 each independently represent a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, or R2 and R3 bind with each other and represent an alicyclic structure having 3 to 20 ring atoms together with the carbon atom to which R2 and R3 bond, or le and either R2 or R3 bind with each other and represent a lactone ring structure having 4 to 20 ring atoms or a cyclic ketone structure having 4 to 20 ring atoms together with the atom chain to which le and either R2 or R3 bond.
A composition includes: a metal compound including a ligand; and a solvent. The ligand is derived from a compound represented by formula (1). L represents an oxygen atom or a single bond; R1 represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; R2 and R3 each independently represent a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, or R2 and R3 bind with each other and represent an alicyclic structure having 3 to 20 ring atoms together with the carbon atom to which R2 and R3 bond, or le and either R2 or R3 bind with each other and represent a lactone ring structure having 4 to 20 ring atoms or a cyclic ketone structure having 4 to 20 ring atoms together with the atom chain to which le and either R2 or R3 bond.
A composition includes: a compound including an aromatic hydrocarbon ring structure, and a partial structure represented by formula (1) which bonds to the aromatic hydrocarbon ring structure; and a solvent. The aromatic hydrocarbon ring structure has no fewer than 25 carbon atoms. In the formula (1), X represents a group represented by formula (i), (ii), (iii), or (iv); and *'s denote binding sites to two adjacent carbon atoms constituting the aromatic hydrocarbon ring structure. A method of producing a patterned substrate, includes applying the composition directly or indirectly on a substrate to form a resist underlayer film; forming a resist pattern directly or indirectly on the resist underlayer film; and carrying out etching using the resist pattern as a mask.
A composition includes: a compound including an aromatic hydrocarbon ring structure, and a partial structure represented by formula (1) which bonds to the aromatic hydrocarbon ring structure; and a solvent. The aromatic hydrocarbon ring structure has no fewer than 25 carbon atoms. In the formula (1), X represents a group represented by formula (i), (ii), (iii), or (iv); and *'s denote binding sites to two adjacent carbon atoms constituting the aromatic hydrocarbon ring structure. A method of producing a patterned substrate, includes applying the composition directly or indirectly on a substrate to form a resist underlayer film; forming a resist pattern directly or indirectly on the resist underlayer film; and carrying out etching using the resist pattern as a mask.
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C07C 13/567 - Fluorenes; Completely or partially hydrogenated fluorenes
C07C 13/62 - Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with condensed rings with more than three condensed rings
C07C 13/66 - Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with condensed rings with more than three condensed rings the condensed ring system contains only four rings
C07C 69/616 - Esters of carboxylic acids having a carboxyl group bound to an acyclic carbon atom and having a six-membered aromatic ring in the acid moiety polycyclic
C07D 209/08 - Indoles; Hydrogenated indoles with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, directly attached to carbon atoms of the hetero ring
C07D 317/50 - Methylenedioxybenzenes or hydrogenated methylenedioxybenzenes, unsubstituted on the hetero ring with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to atoms of the carbocyclic ring
The medium for plant cultivation according to the present invention includes a bag body, and a crushed material obtained by crushing a foam body made of an aliphatic polyester-based resin and packed in the bag body in a compressed state, and in the medium a ratio of the bulk density of the crushed material after being packed in the bag body to the bulk density of the crushed material before being packed in the bag body is larger than 1 and 2 or less.
A radiation-sensitive resin composition contains: an onium salt compound represented by formula (1); a resin containing a structural unit having an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent organic group having a cyclic structure, or a chain hydrocarbon group having 2 or more carbon atoms. X is an oxygen atom, a sulfur atom, or —NRα—. Rα is a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. Z+ is a monovalent onium cation.
A radiation-sensitive resin composition contains: an onium salt compound represented by formula (1); a resin containing a structural unit having an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent organic group having a cyclic structure, or a chain hydrocarbon group having 2 or more carbon atoms. X is an oxygen atom, a sulfur atom, or —NRα—. Rα is a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. Z+ is a monovalent onium cation.
A chemical structure generating device according to the present invention includes a generator and a controller. The generator produces a product list including one or more compounds, based on a reactant list including one or more compounds and a chemical reaction list. The controller applies the product list as a new reactant list to the generator, updates a database having at least one list of the reactant list and the product list, and allows the generator to produce a new product list based on the new reactant list and the chemical reaction list.
The present invention is a photosensitive resin composition including an alkali-soluble resin (A), a polymerizable compound (B), a photoradical polymerization initiator (C), and a solvent (D), in which the polymerizable compound (B) contains at least one kind (B1) selected from a compound represented by the following formula (1) and a compound represented by the following formula (3), having specific Rs, and a content ratio of the compound (B1) contained in the photosensitive resin composition is 15 to 50% by mass. The photosensitive resin composition of the present invention can form a thick-film resist pattern having excellent sensitivity and resolution, and by using the thick-film resist pattern, a plated formed product can be miniaturized.
The present invention is a photosensitive resin composition including an alkali-soluble resin (A), a polymerizable compound (B), a photoradical polymerization initiator (C), and a solvent (D), in which the polymerizable compound (B) contains at least one kind (B1) selected from a compound represented by the following formula (1) and a compound represented by the following formula (3), having specific Rs, and a content ratio of the compound (B1) contained in the photosensitive resin composition is 15 to 50% by mass. The photosensitive resin composition of the present invention can form a thick-film resist pattern having excellent sensitivity and resolution, and by using the thick-film resist pattern, a plated formed product can be miniaturized.
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
79.
COMPOSITION, SILICON-CONTAINING FILM, METHOD OF FORMING SILICON-CONTAINING FILM, AND METHOD OF TREATING SEMICONDUCTOR SUBSTRATE
A composition includes a solvent and at least one compound selected from the group consisting of: a first compound which comprises a first structural unit comprising a Si—H bond, and a second structural unit represented by formula (2), and a second compound which comprises the second structural unit represented by the formula (2). X represents a monovalent organic group having 1 to 20 carbon atoms which comprises a nitrogen atom; e is an integer of 1 to 3; R4 represents a monovalent organic group having 1 to 20 carbon atoms, or a hydroxy group, a hydrogen atom, or a halogen atom; and f is an integer of 0 to 2. A sum of e and f is no greater than 3. In the case where the at least one compound is the second compound, f is 1 or 2, and at least one R4 represents a hydrogen atom.
A composition includes a solvent and at least one compound selected from the group consisting of: a first compound which comprises a first structural unit comprising a Si—H bond, and a second structural unit represented by formula (2), and a second compound which comprises the second structural unit represented by the formula (2). X represents a monovalent organic group having 1 to 20 carbon atoms which comprises a nitrogen atom; e is an integer of 1 to 3; R4 represents a monovalent organic group having 1 to 20 carbon atoms, or a hydroxy group, a hydrogen atom, or a halogen atom; and f is an integer of 0 to 2. A sum of e and f is no greater than 3. In the case where the at least one compound is the second compound, f is 1 or 2, and at least one R4 represents a hydrogen atom.
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C08G 77/50 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
C08G 77/26 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen nitrogen-containing groups
C09D 183/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
A pattern-forming method includes applying a first composition on a surface layer of a substrate to form a first coating film. The surface layer includes a first region which includes a metal atom, and a second region which includes a silicon atom. The first coating film is heated. A portion other than a portion formed on the first region or a portion other than a portion formed on the second region of the first coating film heated is removed, thereby forming a first lamination portion. A second composition is applied on the substrate on which the first lamination portion is formed to form a second coating film. The second coating film is heated or exposed. A portion other than a portion formed on the first lamination portion of the second coating film heated or exposed is removed, thereby forming a second lamination portion.
An object of the present invention is to provide a novel fluorine-containing polymer, a radiation-sensitive resin composition for liquid immersion lithography which contains the fluorine-containing polymer, which leads to a pattern having an excellent shape and excellent depth of focus, wherein the amount of an eluted component in a liquid for liquid immersion lithography such as water that comes in contact with the resist during exposure in liquid immersion lithography is little, and which provides a larger receding contact angle between the resist film and the liquid for liquid immersion lithography such as water, and a method for purifying the fluorine-containing polymer. The present resin composition comprises a novel fluorine-containing polymer (A) containing repeating units represented by the general formulae (1) and (2) and having Mw of 1,000-50,000, a resin (B) having an acid-unstable group, a radiation-sensitive acid generator (C), a nitrogen-containing compound (D) and a solvent (E).
This method for producing a cell cluster group comprises: a step for putting, into a well, a cell suspension obtained by suspending dispersed cells in a medium, using a cell incubator which includes the well and two or more recesses formed in the bottom of the well and in which the area of an opening of each recess in plan view is at most 1 mm2; a step for centrifuging the cell incubator; and a step for culturing the dispersed cells in the recesses.
A composition includes a polymer and a solvent. The polymer includes: a structural unit including a ring structure; and a functional group capable of bonding to a metal atom. An atom chain constituting the ring structure constitutes a part of a main chain of the polymer. The polymer preferably includes at an end of the main chain or at an end of a side chain, a group including the functional group. The functional group is preferably a cyano group, a phosphono group, or a dihydroxyboryl group. The ring structure preferably includes an alicyclic structure.
C08G 61/02 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
C09D 165/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
84.
RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND COMPOUND
A radiation-sensitive resin composition contains: a polymer that includes a structural unit including an acid-labile group; a radiation-sensitive acid generator; and a compound represented by the following formula (1). In the following formula (1), R1 represents a hydrogen atom or a monovalent organic group having 1 to 30 carbon atoms; and Xn+ represents a radiation-sensitive onium cation having a valency of n, wherein n is an integer of 1 to 3. It is preferable that R1 in the following formula (1) represents an organic group, and that the organic group has a ring structure. It is preferable that R1 in the following formula (1) represents an organic group, and that the organic group is an acid-labile group. Xn+ in the following formula (1) preferably represents a sulfonium cation, an iodonium cation, or a combination thereof.
A radiation-sensitive resin composition contains: a polymer that includes a structural unit including an acid-labile group; a radiation-sensitive acid generator; and a compound represented by the following formula (1). In the following formula (1), R1 represents a hydrogen atom or a monovalent organic group having 1 to 30 carbon atoms; and Xn+ represents a radiation-sensitive onium cation having a valency of n, wherein n is an integer of 1 to 3. It is preferable that R1 in the following formula (1) represents an organic group, and that the organic group has a ring structure. It is preferable that R1 in the following formula (1) represents an organic group, and that the organic group is an acid-labile group. Xn+ in the following formula (1) preferably represents a sulfonium cation, an iodonium cation, or a combination thereof.
Systems and methods that facilitate motion formalism utilizing quantum computing, to compute matrix operators in terms of commutators between qubit operators and measurements on the quantum hardware, wherein the commutators are computed utilizing symbolic calculus. Embodiments reduce computational cost of generalized eigenvalue synthesis relying on symbolic calculus and parallelization. Embodiments disclosed herein can also develop estimators of excited-states properties, considering constants of motion (e.g. spin) and non-constants of motions (e.g. dipoles, density matrices).
FILM-FORMING COMPOSITION, RESIST UNDERLAYER FILM, METHOD OF FORMING FILM, METHOD OF FORMING RESIST PATTERN, METHOD OF FORMING ORGANIC-UNDERLAYER-FILM REVERSE PATTERN, METHOD OF PRODUCING FILM-FORMING COMPOSITION, AND METHOD OF FORMING METAL-CONTAINING FILM PATTERN
A film-forming composition includes: a metal compound; a nitrogen-containing organic compound; and a solvent. The nitrogen-containing organic compound is: a first compound including a nitrogen atom, an aliphatic hydrocarbon group, and at least two hydroxy groups; a second compound including a nitrogen-containing aromatic heterocycle and at least one hydroxy group; or a mixture thereof. A method of forming a resist pattern includes applying the film-forming composition directly or indirectly on a substrate to form a resist underlayer film. An organic-resist-film-forming composition is applied directly or indirectly on the resist underlayer film to form an organic resist film. The organic resist film is exposed to a radioactive ray. The organic resist film exposed is developed.
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
A photosensitive resin composition contains at least one compound selected from the group consisting of compound (C1) represented by formula (C1), compound (C2) represented by formula (C2), and a multimer of the compound (C2). Z each independently represents an oxygen atom or a sulfur atom. R31 each independently represents a monovalent hydrocarbon group or a group obtained by substituting at least one hydrogen atom in the monovalent hydrocarbon group with a mercapto group, and at least one R31 is a group obtained by substituting at least one hydrogen atom in the monovalent hydrocarbon group with a mercapto group when p is 1 and when p is an integer of 2 or more and all of Z is an oxygen atom. R32 and R33 each independently represent a divalent hydrocarbon group, and R34 represents a glycoluril ring structure or an isocyanul ring structure.
A photosensitive resin composition contains at least one compound selected from the group consisting of compound (C1) represented by formula (C1), compound (C2) represented by formula (C2), and a multimer of the compound (C2). Z each independently represents an oxygen atom or a sulfur atom. R31 each independently represents a monovalent hydrocarbon group or a group obtained by substituting at least one hydrogen atom in the monovalent hydrocarbon group with a mercapto group, and at least one R31 is a group obtained by substituting at least one hydrogen atom in the monovalent hydrocarbon group with a mercapto group when p is 1 and when p is an integer of 2 or more and all of Z is an oxygen atom. R32 and R33 each independently represent a divalent hydrocarbon group, and R34 represents a glycoluril ring structure or an isocyanul ring structure.
This liquid crystal display device has a plurality of pixels. Each pixel in the plurality of pixels includes first to fourth alignment regions; these first to fourth alignment regions are arranged in the longitudinal direction of the pixels, and the difference between any two alignment orientations in the first to fourth alignment regions is approximately equal to an integer multiple of 90 degrees. Of the pre-tilt angles defined by a first alignment film and a second alignment film in each of the first to fourth alignment regions, one pre-tilt angle is less than 90 degrees and the other pre-tilt angle is substantially 90 degrees. The optical alignment film is formed using a polymer having an optical alignment group in the side chain, and the content of the optical alignment group in the side chain of the polymer is less than 1.1 mmol/g.
An object of the present invention is to provide a photosensitive resin composition that can form an insulating film having low dielectric constant and low dielectric loss tangent and undergoing small changes in elongation properties in response to changes in environmental temperature. The photosensitive resin composition of the present invention contains: a polymer (A) having a structural unit (a1) represented by Formula (a1); a crosslinking agent (B); and a photocation generator (C).
An object of the present invention is to provide a photosensitive resin composition that can form an insulating film having low dielectric constant and low dielectric loss tangent and undergoing small changes in elongation properties in response to changes in environmental temperature. The photosensitive resin composition of the present invention contains: a polymer (A) having a structural unit (a1) represented by Formula (a1); a crosslinking agent (B); and a photocation generator (C).
An object of the present invention is to provide a photosensitive resin composition that can form an insulating film having low dielectric constant and low dielectric loss tangent and undergoing small changes in elongation properties in response to changes in environmental temperature. The photosensitive resin composition of the present invention contains: a polymer (A) having a structural unit (a1) represented by Formula (a1); a crosslinking agent (B); and a photocation generator (C).
[R1 is an unsubstituted or substituted nitrogen-containing heteroaromatic ring or an unsubstituted or substituted aromatic hydrocarbon ring; R2 and R3 are each independently an unsubstituted or substituted aromatic hydrocarbon ring; R4 is an unsubstituted or substituted alkyl group having 2 to 20 carbon atoms; R5 is an unsubstituted or substituted alkyl group having 1 to 20 carbon atoms; and X's are each independently an oxygen atom, a sulfur atom, an ester bond, an amide bond, or —SO2—.]
An object of the present invention is to provide a photosensitive resin composition that can form an insulating film having low dielectric constant and low dielectric loss tangent and undergoing small changes in elongation properties in response to changes in environmental temperature. The photosensitive resin composition of the present invention contains: a polymer (A) having a structural unit (a1) represented by Formula (a1); a crosslinking agent (B); a photocation generator (C); and a compound (D) represented by Formula (D).
An object of the present invention is to provide a photosensitive resin composition that can form an insulating film having low dielectric constant and low dielectric loss tangent and undergoing small changes in elongation properties in response to changes in environmental temperature. The photosensitive resin composition of the present invention contains: a polymer (A) having a structural unit (a1) represented by Formula (a1); a crosslinking agent (B); a photocation generator (C); and a compound (D) represented by Formula (D).
A radiation-sensitive resin composition includes a resin having a partial structure represented by formula (1). R1 and R2 each independently represent a substituted or unsubstituted chain aliphatic hydrocarbon group having 1 to 6 carbon atoms or a substituted or unsubstituted alicyclic hydrocarbon group having 3 to 6 carbon atoms, or R1 and R2 are bonded to each other to form a part of a 3- to 6-membered cyclic structure together with the carbon atom to which R1 and R2 are bonded; R3 represents a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms and containing a fluorine atom. No fluorine atom is bonded to carbon atoms located at α-, β- and γ-positions of the carbon atom to which R1 and R2 are bonded; and No fluorine atom is bonded to carbon atoms located at α- and β-positions of the carbon atom to which R3 is bonded.
A radiation-sensitive resin composition includes a resin having a partial structure represented by formula (1). R1 and R2 each independently represent a substituted or unsubstituted chain aliphatic hydrocarbon group having 1 to 6 carbon atoms or a substituted or unsubstituted alicyclic hydrocarbon group having 3 to 6 carbon atoms, or R1 and R2 are bonded to each other to form a part of a 3- to 6-membered cyclic structure together with the carbon atom to which R1 and R2 are bonded; R3 represents a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms and containing a fluorine atom. No fluorine atom is bonded to carbon atoms located at α-, β- and γ-positions of the carbon atom to which R1 and R2 are bonded; and No fluorine atom is bonded to carbon atoms located at α- and β-positions of the carbon atom to which R3 is bonded.
A method for producing a plated formed product includes: a step (1) of forming on a substrate of the substrate having a metal film a resin film of a photosensitive resin composition containing a sulfur-containing compound having at least one selected from a mercapto group, a sulfide bond, and a polysulfide bond; a step (2) of exposing the resin film; a step (3) of developing the exposed resin film to form a resist pattern film; a step (4) of performing plasma treatment of a substrate having the resist pattern film on the metal film with oxygen-containing gas; and a step (5) of performing, after the plasma treatment, plating treatment with the resist pattern film as a mold.
An object of the present invention is to provide a photosensitive resin composition for suppressing standing wave traces and forming a resist pattern film having a rectangular cross section. The photosensitive resin composition of the present invention contains polymer (A) having an acid dissociative group; photoacid generator (B); carbamic acid ester (C) having a hydroxyl group; and solvent (D), the solvent (D) containing at least one solvent (D1) selected from, for example, propylene glycol monomethyl ether acetate and at least one solvent (D2) selected from, for example, dipropylene glycol dimethyl ether.
A laminated foam sheet having a polyethylene resin foam layer and an antistatic polyethylene layer laminated on one or both sides thereof is produced by coextruding melts for respective layers, wherein the melt for the antistatic layer contains a polyethylene resin, an ionomer resin antistatic agent and a specific amount of volatile plasticizer blend containing an alcohol and a saturated hydrocarbon or a dialkyl ether. The antistatic layer of the obtained laminated foam sheet has specific morphology.
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
B29C 48/00 - Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
B29C 48/21 - Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces
B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
Provided is a structure having both fire resistance and heat insulation properties and capable of retaining its shape without being collapsed or deformed even when exposed to a flame. The present invention provides a fire-resistant heat-insulation composition comprising 70 to 250 parts by mass of gypsum based on 100 parts by mass of calcium aluminate having a CaO content of 34% or more, and 0.1 to 20 parts by mass of a fibrous inorganic clay mineral having a crystallization water ratio of 5% or more, based on 100 parts by mass of the total of the calcium aluminate and the gypsum.
C04B 28/14 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing calcium sulfate cements
A method for producing a brain organoid is provided, including a step of culturing a neuroectoderm marker-positive cell aggregate in a medium containing an extracellular matrix with a concentration of more than 10% by volume.
The composition contains: a compound which has a group represented by formula (1); and a solvent. In the formula (1), R1 and R2 each independently represent a substituted or unsubstituted aryl group having 6 to 30 ring atoms or a substituted or unsubstituted heteroaryl group having 5 to 30 ring atoms; R3 represents a hydrogen atom or a substituted or unsubstituted monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms; and * denotes a bonding site to a part other than the group represented by the following formula (1) in the compound.
The composition contains: a compound which has a group represented by formula (1); and a solvent. In the formula (1), R1 and R2 each independently represent a substituted or unsubstituted aryl group having 6 to 30 ring atoms or a substituted or unsubstituted heteroaryl group having 5 to 30 ring atoms; R3 represents a hydrogen atom or a substituted or unsubstituted monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms; and * denotes a bonding site to a part other than the group represented by the following formula (1) in the compound.
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C08G 8/10 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
C09D 161/06 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
C07C 211/54 - Compounds containing amino groups bound to a carbon skeleton having amino groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton having amino groups bound to two or three six-membered aromatic rings
C07C 39/225 - Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic, containing only six-membered aromatic rings as cyclic part, with unsaturation outside the rings with at least one hydroxy group on a condensed ring system
C07D 307/36 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, directly attached to ring carbon atoms
C07D 207/323 - Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to the ring nitrogen atoms
C07C 39/21 - Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic, containing only six-membered aromatic rings as cyclic part, with unsaturation outside the rings with at least one hydroxy group on a non-condensed ring
98.
METHOD FOR PRODUCING ORGANIC SULFUR COMPOUND, CARRIER, METHOD FOR PRODUCING SAID CARRIER, LIGAND-IMMOBILIZING CARRIER, CHROMATOGRAPHY COLUMN, AND METHOD FOR DETECTING OR ISOLATING TARGET SUBSTANCE
Provided is a carrier which has excellent pressure resistance, and even when a protein ligand is not immobilized thereon, has a high dynamic binding capacity to a target substance, and has a high performance of separating a target substance from a biological sample.
Provided is a carrier which has excellent pressure resistance, and even when a protein ligand is not immobilized thereon, has a high dynamic binding capacity to a target substance, and has a high performance of separating a target substance from a biological sample.
The carrier includes a polymer having a crosslinked structure containing a divalent group represented by the following Formula (1):
Provided is a carrier which has excellent pressure resistance, and even when a protein ligand is not immobilized thereon, has a high dynamic binding capacity to a target substance, and has a high performance of separating a target substance from a biological sample.
The carrier includes a polymer having a crosslinked structure containing a divalent group represented by the following Formula (1):
wherein
R1 to R4 independently represent a single bond or a divalent hydrocarbon group,
R5 and R6 independently represent a hydrogen atom or a hydrocarbon group,
X represents a thio group, a sulfinyl group, a sulfonyl group, an oxy group, >N(—R31), >Si(—R32)2, >P(—R33), >P(═O)(—R34), >B(—R35), or >C(—R36)2 (R31 to R36 independently represent a hydrogen atom or hydrocarbon group), and
* represents a bond,
with a proviso that when both R1 and R3 are a divalent hydrocarbon group, R1 and R3 may form a ring together with an adjacent carbon atom, and
when both R2 and R4 are a divalent hydrocarbon group, R2 and R4 may form a ring together with an adjacent carbon atom.
B01J 20/30 - Processes for preparing, regenerating or reactivating
C08F 8/34 - Introducing sulfur atoms or sulfur-containing groups
B01J 20/281 - Sorbents specially adapted for preparative, analytical or investigative chromatography
C07C 323/12 - Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and singly-bound oxygen atoms bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton the carbon skeleton being acyclic and saturated
C07D 327/00 - Heterocyclic compounds containing rings having oxygen and sulfur atoms as the only ring hetero atoms
C07K 16/32 - Immunoglobulins, e.g. monoclonal or polyclonal antibodies against material from animals or humans against translation products from oncogenes
C07K 1/22 - Affinity chromatography or related techniques based upon selective absorption processes
C12N 9/36 - Hydrolases (3.) acting on glycosyl compounds (3.2) acting on beta-1, 4 bonds between N-acetylmuramic acid and 2-acetylamino 2-deoxy-D-glucose, e.g. lysozyme
B01D 15/38 - Selective adsorption, e.g. chromatography characterised by the separation mechanism involving specific interaction not covered by one or more of groups , e.g. affinity, ligand exchange or chiral chromatography
B01D 15/20 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the conditioning of the sorbent material
Expanded beads are those including a mixture of an olefin-based thermoplastic elastomer and a polyethylene-based resin, wherein a melt flow rate MFR(I) of the olefin-based thermoplastic elastomer is 2-10 g/10 min; a difference ((MFR(II))−(MFR(I))) between a melt flow rate MFR(II) of the polyethylene-based resin and the melt flow rate MFR(I) of the olefin-based thermoplastic elastomer is 1-35 g/10 min; and a content of the polyethylene-based resin in the mixture is 3-40% by weight.
C08L 53/00 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
100.
Resin composition and method of forming resist pattern
A resin composition includes a resin A, a resin C, and a solvent. The resin A includes a sulfonic-acid-group-containing structural unit in an amount exceeding 5 mol % with respect to total structural units included in the resin A. The resin A has a content of a fluorine atom of 30 mass % or less with respect to a total mass of the resin A. The resin C includes a fluorine atom in a larger content per unit mass than the content of a fluorine atom per unit mass in the resin A. A content of the resin A in the resin composition is lower than a content of the resin C in the resin composition in terms of mass.
C08L 41/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic ring containing s; Compositions of derivatives of such polymers
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C08L 101/04 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing halogen atoms
patents
