A method for producing a thermoplastic resin foam particle molded body according to the present invention comprises a crack filling step and an in-mold molding step. Foam particles (2) to be used in the crack filling step have a columnar shape, while having one or more defective parts of one or more kinds, the defective parts being selected from the group consisting of through holes and grooves. In cut surfaces of the foam particles (2) obtained by cutting each foam particle (2) by a plane that is perpendicular to the axial direction of the foam particle (2) at the center of the axial direction, the ratio Ca/A of the average cross-sectional area Ca of one defective part to the average cross-sectional area A of the foam particles (2) is 0.01 to 0.20, and the ratio Ct/A of the total cross-sectional area Ct of the defective parts to the average cross-sectional area A of the foam particles (2) is 0.02 to 0.20. The filling rate F of the foam particles (2) in a state where a mold (1) is completely closed is 125% to 220%.
B29C 44/44 - Feeding the material to be shaped into a closed space, i.e. to make articles of definite length in the form of expandable particles or beads
B29C 44/00 - Shaping by internal pressure generated in the material, e.g. swelling or foaming
C08J 9/22 - After-treatment of expandable particles; Forming foamed products
2.
PRODUCTION METHOD FOR THERMOPLASTIC RESIN FOAMED PARTICLE MOLDED BODY
B29C 44/00 - Shaping by internal pressure generated in the material, e.g. swelling or foaming
B29C 44/54 - Feeding the material to be shaped into an open space or onto moving surfaces, i.e. to make articles of indefinite length in the form of expandable particles or beads
C08J 9/22 - After-treatment of expandable particles; Forming foamed products
3.
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE
The present invention provides a photosensitive resin composition which contains a polymer (A) that has an acid-cleavable group, a photoacid generator (B) and a solvent (C), wherein: the polymer (A) comprises a structural unit (I) that is represented by formula (1) and a structural unit (III) that has a glass transition temperature Tg of 50°C or less in the form of a homopolymer; and the photoacid generator (B) is a compound which generates an acid that has a van der Waals volume of 200 Å3or more when irradiated with active light or radiation. The present invention also provides: a method for forming a resist pattern film, the method using this photosensitive resin composition; and a method for producing a plated shaped article. The details of R1A and L in formula (1) are as described in the description.
A radiation-sensitive resin composition includes: a resin containing a structural unit A represented by formula (1); at least one radiation-sensitive acid generator selected from the group consisting of a radiation-sensitive acid generator represented by formula (2-1) and a radiation-sensitive acid generator represented formula (2-2); and a solvent. At least one R3 is an acid-dissociable group; and R41 is a hydrogen atom or a protective group to be deprotected by action of an acid. At least one of Rf1 and Rf2 is a fluorine atom or a fluoroalkyl group; R5a is a monovalent organic group having a cyclic structure; X1+ is a monovalent onium cation; R5b is a monovalent organic group, and X2+ is a monovalent onium cation whose atom having a positive charge is not an atom forming a cyclic structure.
A radiation-sensitive resin composition includes: a resin containing a structural unit A represented by formula (1); at least one radiation-sensitive acid generator selected from the group consisting of a radiation-sensitive acid generator represented by formula (2-1) and a radiation-sensitive acid generator represented formula (2-2); and a solvent. At least one R3 is an acid-dissociable group; and R41 is a hydrogen atom or a protective group to be deprotected by action of an acid. At least one of Rf1 and Rf2 is a fluorine atom or a fluoroalkyl group; R5a is a monovalent organic group having a cyclic structure; X1+ is a monovalent onium cation; R5b is a monovalent organic group, and X2+ is a monovalent onium cation whose atom having a positive charge is not an atom forming a cyclic structure.
C08F 212/00 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
5.
RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD
Provided is a radiation-sensitive resin composition capable of exhibiting sensitivity and CDU performance at a sufficient level when a next-generation technology is applied, and a pattern formation method. A radiation-sensitive resin composition containing: a radiation-sensitive acid generating resin comprising a repeating unit A having an acid-dissociable group represented by the following formula (1) and a repeating unit B including an organic acid anion moiety and a sulfonium cation moiety containing an aromatic ring structure having a fluorine atom; and a solvent; in the formula (1), RT is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; RX is a monovalent hydrocarbon group having 2 to 20 carbon atoms; and Cy represents an alicyclic structure having 3 to 20 ring members and formed together with a carbon atom to which this is bonded.
Provided is a radiation-sensitive resin composition capable of exhibiting sensitivity and CDU performance at a sufficient level when a next-generation technology is applied, and a pattern formation method. A radiation-sensitive resin composition containing: a radiation-sensitive acid generating resin comprising a repeating unit A having an acid-dissociable group represented by the following formula (1) and a repeating unit B including an organic acid anion moiety and a sulfonium cation moiety containing an aromatic ring structure having a fluorine atom; and a solvent; in the formula (1), RT is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; RX is a monovalent hydrocarbon group having 2 to 20 carbon atoms; and Cy represents an alicyclic structure having 3 to 20 ring members and formed together with a carbon atom to which this is bonded.
The purpose of the present invention is to provide: a semiconductor substrate production method using a composition from which a film having excellent etching resistance and heat resistance can be formed; and a composition. This semiconductor substrate production method includes a step in which a resist underlayer film-forming composition is directly or indirectly applied to a substrate, a step in which a resist pattern is formed directly or indirectly on the resist underlayer film formed in the application step, and a step in which etching is performed using the resist pattern as a mask. The resist underlayer film-forming composition contains a solvent and a compound including a boron atom.
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
G03F 7/40 - Treatment after imagewise removal, e.g. baking
A radiation-sensitive composition contains: (A) a polymer; and (B) a radiation-sensitive acid generator composed of an onium cation having at least one group Rf1 selected from the group consisting of a fluoroalkyl group and a fluoro group (excluding the fluoro group in the fluoroalkyl group), and an organic anion containing four or more iodine atoms.
A radiation-sensitive composition contains: (A) a polymer including a structural unit (U) represented in formula (1); and (B) a radiation-sensitive acid generator composed of an onium cation having at least one group Rf1selected from the group consisting of a fluoroalkyl group and a fluoro group (excluding the fluoro group in the fluoroalkyl group), and an organic anion containing an iodine atom. In formula (1), R1is a hydrogen atom, a methyl group, or the like. X1is a single bond, an ether bond, an ester bond, or the like. Ar1is a cyclic group bonded to X1via an aromatic ring. A hydroxyl group or a –ORYgroup is bonded to the atom adjacent to the atom bonded to X1among the atoms constituting the aromatic ring in Ar1. RY is an acid-dissociable group.
[Problem] The present invention addresses the problem of providing: a photosensitive resin composition which has excellent volatility regarding a solvent therein and from which it is possible to produce a resist coating film in which the generation of coating bubbles is sufficiently suppressed; a method for producing a resist pattern film using the photosensitive resin composition; and a method for producing a plated shaped article using the resist pattern film. [Solution] A photosensitive resin composition characterized by comprising: a polymer (A) that has a structural unit having a phenolic hydroxyl group and a structural unit derived from a (meth)acrylate having an acid-dissociable group; a specific photoacid generator (B); and an organic solvent (C) that contains 3-ethoxyethyl propionate, wherein the solid content concentration is 30 mass% or more.
This radiation-sensitive resin composition contains a polymer which has a first structural unit represented by the following formula (1) and of which the solubility in a developer changes under the action of an acid, and a compound represented by the following formula (2).
Provided are a radiation-sensitive resin composition that has suitable storage stability and makes it possible to form a resist film with excellent sensitivity, LWR performance, water repellency, and development defect-suppressing performance, and a pattern formation method. The radiation-sensitive resin composition contains: a first resin including a structural unit (I) represented by formula (1), a structural unit (II) represented by formula (2) (excluding the structural unit represented by formula (1)), and a structural unit (III) having an acid-cleavable group; and a solvent. (In formula (1), RK1is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group. L1is an alkanediyl group having 1-5 carbon atoms. Rf1is a monovalent fluorinated hydrocarbon group having 2-10 carbon atoms and 5-7 fluorine atoms. In formula (2), RK2is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group. Lfis a fluorine-substituted or unsubstituted divalent organic group having 1-20 carbon atoms. L2is *-COO- or *-OCO-. * is a bond on the Lfside. p is an integer of 0-2. When a plurality of Lfand L2are present, the plurality of Lfand L2may be the same or different from each other. Rf2is a fluorine-substituted or unsubstituted monovalent organic group having 1-20 carbon atoms. Lfand Rf2 have a total of one or more fluorine atoms.)
Provided are a radiation-sensitive resin composition capable of forming a resist film with excellent sensitivity, LWR performance, water repellency, and suppression of development flaws, and having good storage stability; and a pattern forming method. A radiation-sensitive resin composition comprising a polymer comprising structural units (I) represented by formula (1) and structural units differing from said structural units (I); an onium salt represented by formula (i); and a solvent. (In formula (1), RK1is a hydrogen atom, a fluorine atom, a methyl group, or trifluoromethyl group. L1is a 1-5 carbon alkanediyl group. Rf1is a 2-10 carbon fluorinated hydrocarbon group with 5-7 fluorine atoms.) (In formula (i), Ra1is a substituted or unsubstituted 1-40 carbon monovalent organic group in which the atom adjacent to the sulfur atom is not bound to a fluorine atom or fluorinated hydrocarbon group. X+ is a monovalent onium cation.)
C07D 307/00 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
C07D 317/72 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 spiro-condensed with carbocyclic rings
A method of culturing human induced pluripotent stem cells includes inoculating human induced pluripotent stem cells in a culture medium at an inoculation density of 1.0×104 to 1.0×106 cells/cm2 in a culture vessel and subjecting the human induced pluripotent stem cells to two-dimensional culturing. A method of producing cerebral organoids includes culturing a culture of the human induced pluripotent stem cells obtained by the method of culturing human induced pluripotent stem cells in a culture medium containing a BMP inhibitor and a transforming growth factor β (TGFβ) inhibitor to form cell aggregates, culturing the cell aggregates in a culture medium containing a Wnt signal transduction pathway potentiator and an extracellular matrix, and subjecting the culturing obtained in the culturing the cell aggregates to spinner culturing.
C12P 19/32 - Nucleotides having a condensed ring system containing a six-membered ring having two nitrogen atoms in the same-ring, e.g. purine nucleotides, nicotineamide-adenine dinucleotide
16.
COMPOSITION, UNDERLAYER FILM, AND DIRECTED SELF-ASSEMBLY LITHOGRAPHY PROCESS
A composition includes: at least one polymer represented by formula (1), formula (2), or both; and a solvent. A1 and A2 are each independently a structural unit having 2 or more carbon atoms; a plurality of A's are the same or different and a plurality of A2s are the same or different; n1 and n2 are each independently an integer of 2 to 500; R1, R2, and R3 are each independently an organic group having 1 or more carbon atoms, or R1 and R2 taken together represent a ring together with X1, Y1, and P; R1 and R2 are the same or different; X1, Y1, and Y2 are each independently a single bond, —O—, or —NR4—; R4 is an organic group having 1 or more carbon atoms; and Z1 and Z2 are each independently hydrogen or an organic group having 1 to 15 carbon atoms.
A composition includes: at least one polymer represented by formula (1), formula (2), or both; and a solvent. A1 and A2 are each independently a structural unit having 2 or more carbon atoms; a plurality of A's are the same or different and a plurality of A2s are the same or different; n1 and n2 are each independently an integer of 2 to 500; R1, R2, and R3 are each independently an organic group having 1 or more carbon atoms, or R1 and R2 taken together represent a ring together with X1, Y1, and P; R1 and R2 are the same or different; X1, Y1, and Y2 are each independently a single bond, —O—, or —NR4—; R4 is an organic group having 1 or more carbon atoms; and Z1 and Z2 are each independently hydrogen or an organic group having 1 to 15 carbon atoms.
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
The purpose of the present invention is to provide: a radiation-sensitive resin composition which enables the formation of a resist film having excellent sensitivity, LWR performance, water repellency and development defect reducing properties and has satisfactory storage stability; and a pattern formation method. Provided is a radiation-sensitive resin composition comprising: a polymer containing a structural unit (I) represented by formula (1) and a structural unit different from the structural unit (I); a radiation-sensitive acid generator represented by formula (α); and a solvent. (In formula (1), RK1represents a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group; L1represents an alkanediyl group having 1 to 5 carbon atoms; and Rf1represents a fluorinated hydrocarbon group having 5 to 7 fluorine atoms and also having 2 to 10 carbon atoms.) (In formula (α), RWrepresents a monovalent organic group containing a cyclic structure and having 3 to 40 carbon atoms; Rfaand Rfbeach independently represent a fluorine atom or a fluorinated hydrocarbon group having 1 to 10 carbon atoms; R11and R12each independently represent a hydrogen atom, a fluorine atom, a hydrocarbon group having 1 to 10 carbon atoms, or a fluorinated hydrocarbon group having 1 to 10 carbon atoms; n1 represents an integer of 1 to 4, in which, when n1 is 2 or more, a plurality of Rfa's and Rfb's are the same as or different from each other; n2 represents an integer of 0 to 4, in which, when n2 is 2 or more, a plurality of R11's and R12's are the same as or different from each other; no carbonyl group is interposed between a sulfur atom in a sulfonic acid ion and the cyclic structure in RW; and Z+ represents a monovalent onium cation.)
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
C07D 307/00 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
C07D 317/72 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 spiro-condensed with carbocyclic rings
EXPANDED CRYSTALLINE-THERMOPLASTIC-RESIN PARTICLES, MOLDED OBJECT FROM EXPANDED CRYSTALLINE-THERMOPLASTIC-RESIN PARTICLES, AND PRODUCTION METHOD THEREFOR
A molded object from expanded crystalline-thermoplastic-resin particles which is obtained by mutually fusion-bonding columnar expanded crystalline-thermoplastic-resin particles (1) having no through-hole. The molded object from expanded crystalline-thermoplastic-resin particles has an expansion ratio of 15-90. The molded object from expanded crystalline-thermoplastic-resin particles has a closed-cell content of 90% or higher. The molded object from expanded crystalline-thermoplastic-resin particles has an open-cell content of 2-12%.
B29C 44/00 - Shaping by internal pressure generated in the material, e.g. swelling or foaming
B29C 44/44 - Feeding the material to be shaped into a closed space, i.e. to make articles of definite length in the form of expandable particles or beads
19.
POLYPROPYLENE-BASED RESIN FOAM PARTICLES, METHOD FOR PRODUCING POLYPROPYLENE-BASED RESIN FOAM PARTICLES, AND LOGISTICS PACKAGING MATERIAL
Foam particles which have a mass ratio of foam core layer to coating layer of 97:3-88:12 and a bulking factor of 5-45 times, inclusive, and have a coating layer which comprises PE-LLD, wherein the melting point of the PE-LLD is 105-130°, inclusive, and the bend elastic constant Ms of the PE-LLD is 120-600MPa, inclusive. A logistics packaging material comprising a foam-particle molded body, wherein the scale factor of the molded body is 5-45 times, inclusive, the maximum flexural strength thereof is 0.3MPa or higher, the product of the tensile strength times the tensile elongation is 18MPa·% or higher, the coefficient of dynamic friction against a polyvinyl chloride sheet is at least 0.4 and less than 0.7, and the coefficient of static friction against a polyvinyl chloride sheet is less than 1.0.
NATIONAL UNIVERSITY CORPORATION, IWATE UNIVERSITY (Japan)
Inventor
Oishi Yoshiyuki
Tsukamoto Tadashi
Kadota Toshiaki
Iizuka Shunsuke
Okamoto Koichi
Abstract
This polymer consists of a repeating unit represented by formula (1). [In formula (1), -N(R')-RN(R')- is a structure derived from an unsubstituted or substituted dimer diamine, and R', R1and R2 are each independently a hydrogen atom, a halogen atom, an unsubstituted or substituted hydrocarbon group having 1-20 carbon atoms, or an unsubstituted or substituted heterocyclic aromatic group having 3-20 carbon atoms.]
C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
21.
SILICON-CONTAINING COMPOSITION AND METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE
A silicon-containing composition includes a polysiloxane compound and solvent. The polysiloxane compound includes a fluorine atom and a group including an ester bond. The polysiloxane compound preferably includes a first structural unit represented by formula (1), and a second structural unit represented by formula (2). X represents a monovalent organic group having 1 to 20 carbon atoms and comprising a fluorine atom; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms; Y represents a monovalent organic group having 1 to 20 carbon atoms and comprising an ester bond; and R2 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms.
A silicon-containing composition includes a polysiloxane compound and solvent. The polysiloxane compound includes a fluorine atom and a group including an ester bond. The polysiloxane compound preferably includes a first structural unit represented by formula (1), and a second structural unit represented by formula (2). X represents a monovalent organic group having 1 to 20 carbon atoms and comprising a fluorine atom; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms; Y represents a monovalent organic group having 1 to 20 carbon atoms and comprising an ester bond; and R2 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms.
C08G 77/24 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen halogen-containing groups
One embodiment of the present invention relates to a polymer, a composition, a cured product, a laminated body, or an electronic component, said composition including a polymer containing a repeating unit that is represented by formula (1). [In formula (1): -N(R')-R3-N(R')- is a structure derived from a dimer diamine substituted by an unsubstituted group or a substituted group; R', R1, and R2each independently represent a hydrogen atom, a halogen atom, a C1-20 hydrocarbon group substituted by an unsubstituted or a substituted group, a C3-20 heterocyclic aliphatic group substituted by an unsubstituted or a substituted group, or a C3-20 heterocyclic aromatic group substituted by an unsubstituted or a substituted group; and -NR1R2may be a nitrogen-containing heterocyclic group with 5-20 ring-forming atoms in which R1and R2 are bound to each other.]
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
B32B 27/42 - Layered products essentially comprising synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
23.
RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND COMPOUND
A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A− represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.
A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A− represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.
A method for forming a protective film includes directly or indirectly coating only a periphery of a substrate with a composition. The composition includes a compound having an aromatic ring, and a solvent. The solvent includes a first solvent having a normal boiling point of 156° C. or higher and lower than 300° C. A content of the first solvent in the solvent is preferably 20 mass % or more and 100 mass % or less. The first solvent is preferably an ester, an alcohol, an ether, a carbonate, or a combination of two or more of an ester, an alcohol, an ether, and a carbonate.
METHOD FOR MANUFACTURING INTRAVASCULAR INDWELLING DEVICE, HOLDER FOR MANUFACTURING INTRAVASCULAR INDWELLING DEVICE, AND METHOD FOR EVALUATING INTRAVASCULAR INDWELLING DEVICE
In this method for manufacturing an intravascular indwelling device, there are used a cylindrical holder (1) for holding an intravascular indwelling device (20) in an interior space, and an outer cylindrical body (2) that has an inside diameter larger than the outside diameter of the holder (1). The holder (1) holding the intravascular indwelling device (20) is housed in the outer cylindrical body (2), and a suspension (S) of the target cells is fed into the outer cylindrical body (2). The outer cylindrical body (2) and the holder (1) are operated so that the suspension (S) flows relative to the intravascular indwelling device (20) while in contact with the intravascular indwelling device (20), and the target cells are cultured.
A radiation-sensitive resin composition includes: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; a radiation-sensitive acid generator; and a compound represented by formula (1). Ar1 represents a group obtained by removing (a+b+2) hydrogen atoms from an aromatic hydrocarbon ring having 6 to 30 ring atoms; R1 represents a halogen atom or a monovalent organic group having 1 to 20 carbon atoms; L1 represents a divalent linking group; R2 represents a substituted or unsubstituted monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms; a is an integer of 0 to 10, b is an integer of 1 to 10, wherein a sum of a and b is no greater than 10; and X+ represents a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; a radiation-sensitive acid generator; and a compound represented by formula (1). Ar1 represents a group obtained by removing (a+b+2) hydrogen atoms from an aromatic hydrocarbon ring having 6 to 30 ring atoms; R1 represents a halogen atom or a monovalent organic group having 1 to 20 carbon atoms; L1 represents a divalent linking group; R2 represents a substituted or unsubstituted monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms; a is an integer of 0 to 10, b is an integer of 1 to 10, wherein a sum of a and b is no greater than 10; and X+ represents a monovalent radiation-sensitive onium cation.
C07C 65/24 - Compounds having carboxyl groups bound to carbon atoms of six-membered aromatic rings and containing any of the groups OH, O-metal, —CHO, keto, ether, groups, groups, or groups containing ether groups, groups, groups, or groups polycyclic
C07C 323/62 - Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and carboxyl groups bound to the same carbon skeleton having the sulfur atom of at least one of the thio groups bound to a carbon atom of a six-membered aromatic ring of the carbon skeleton
C07D 327/08 - [b, e]-condensed with two six-membered carbocyclic rings
C07C 69/92 - Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a six-membered aromatic ring of monocyclic hydroxy carboxylic acids, the hydroxy groups and the carboxyl groups of which are bound to carbon atoms of a six-membered aromatic ring with etherified hydroxyl groups
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
27.
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN
A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R1 represents a monovalent organic group having 1 to 30 carbon atoms; and X+ represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000.
A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R1 represents a monovalent organic group having 1 to 30 carbon atoms; and X+ represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000.
R1—COO−X+ (1)
A lens is produced by a method comprising: a step for applying a radiation-sensitive composition onto a base material to form a coating film; a step for irradiating a portion of the coating film with a radioactive ray to generate an acid in an exposed portion; a step for developing the coating film that has been irradiated with the radioactive ray to form a pattern; a step for irradiating the pattern with a radioactive ray; and a step for heating the pattern after the irradiation of the pattern with the radioactive ray to form a lens. The radiation-sensitive composition comprises at least one polymer (A), a radiation-sensitive acid generator (B) and a solvent(C), in which the polymer (A) contains, in a single molecule or different molecules, a structural unit (a1) having a hydroxyl group bound to an aromatic ring and a structural unit (a2) having such a configuration that an acid-dissociating group is detached by the action of an acid to generate a carboxyl group.
A radiation-sensitive resin composition includes: a polymer which has a first structural unit including a phenolic hydroxyl group, and a second structural unit represented by formula (1); and a radiation-sensitive acid generating agent which has a compound represented by formula (2). R1 represents a hydrogen atom, or the like; R2 represents a hydrogen atom or the like; and R3 represents a divalent monocyclic alicyclic hydrocarbon group having 3 to 12 ring atoms. Ar1 represents a group obtained by removing (q+1) hydrogen atoms on an aromatic ring from an arene formed by condensation of at least two benzene rings; R4 represents a monovalent organic group having 1 to 20 carbon atoms; q is an integer of 0 to 7; and R5 represents a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms, or the like.
A radiation-sensitive resin composition includes: a polymer which has a first structural unit including a phenolic hydroxyl group, and a second structural unit represented by formula (1); and a radiation-sensitive acid generating agent which has a compound represented by formula (2). R1 represents a hydrogen atom, or the like; R2 represents a hydrogen atom or the like; and R3 represents a divalent monocyclic alicyclic hydrocarbon group having 3 to 12 ring atoms. Ar1 represents a group obtained by removing (q+1) hydrogen atoms on an aromatic ring from an arene formed by condensation of at least two benzene rings; R4 represents a monovalent organic group having 1 to 20 carbon atoms; q is an integer of 0 to 7; and R5 represents a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms, or the like.
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
C07C 309/06 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing halogen atoms, or nitro or nitroso groups bound to the carbon skeleton
C07D 317/72 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 spiro-condensed with carbocyclic rings
Provided are: a method for producing a semiconductor substrate using a cleaning fluid excellent in terms of the property of cleaning peripheral portions of substrates and waste-liquid stability; a method for forming a resist underlayer film; and the cleaning fluid. This method for producing a semiconductor substrate comprises: a step in which a composition for resist underlayer film formation is applied directly or indirectly to a substrate; a step in which peripheral portions of the substrate are cleaned with a cleaning fluid; and a step in which after the cleaning step, a resist pattern is formed directly on or indirectly over the resist underlayer film formed in the application step. The composition for resist underlayer film formation includes a metal compound and a solvent, and the cleaning fluid includes an organic acid.
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
Provided are abrasive grains and a composition for chemical mechanical polishing which are for selectively polishing a silicon nitride film, and which are applicable not only to silicon oxide films but also to amorphous silicon films and polysilicon films. This method for manufacturing abrasive grains includes: a first step of heating a mixture which contains particles having a sulfanyl group (—SH) fixed to the surface thereof via covalent bonds, and which contains a compound having carbon-carbon unsaturated double bonds; and a second step, which is performed after the first step, of further adding a peroxide and carrying out heating.
Provided is an inorganic foam, a base material of the inorganic foam being an inorganic polymer having a leucite crystal structure. The area of a peak derived from the leucite crystal in an X-ray diffraction spectrum of the inorganic foam is characterized by satisfying Equation (1). (1): D(geo)/D(pur)≧0.5 (D(geo) denotes the area of a peak located at 2θ=27.3° derived from the leucite crystal in the X-ray diffraction spectrum of the inorganic foam, and D(pur) is the area of a peak located at 2θ=27.3° derived from the leucite crystal in an X-ray diffraction spectrum of a pure material of leucite.)
C04B 35/00 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
A method is provided for producing oligodendrocyte-like cells, including (A) increasing abundances of oligodendrocyte transcription factor 2 (OLIG2) mutant and SRY-box transcription factor 10 (SOX10) in human pluripotent stein cells and (B) culturing the human pluripotent stem cells in which the abundances of the OLIG2 mutant and the SOX10 are increased and consequently differentiating the human pluripotent stem cells into oligodendrocyte-like cells, in which the OLIG2 mutant lacks a serine residue of wild-type OLIG2 at position 147, or the serine residue of the wild-type OLIG2 at position 147 is substituted with an amino acid other than serine.
A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X),
A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X),
A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X),
where Ar1 is a group obtained by removing (a+b) hydrogen atoms from an unsubstituted aryl group, RXA is a monovalent iodine atom, an iodinated alkyl group or an iodinated alkoxy group, RXB is a monovalent organic group, a is an integer of 1 to 10, and b is an integer of 1 to 10.
A method for predicting efficacy of treatment of a lung cancer patient using an immune checkpoint inhibitor includes isolating exosomes from a biological sample derived from the lung cancer patient, and determining an expression level of a protein present in the exosomes by a mass spectrometry method, in which the protein is one or more proteins selected from the group of proteins shown in Table 1-1 to Table 1-6.
A composition for chemical mechanical polishing and a polishing method allow a semiconductor substrate containing at least one of a polysilicon film and a silicon nitride film to be polished at a high speed, while being capable of reducing the incidence of surface defects in the polished surface. The composition for chemical mechanical polishing contains (A) abrasive grains having plural protrusions on their surfaces and (B) a liquid medium, wherein the absolute value of the zeta-potential of the component (A) in the composition for chemical mechanical polishing is 10 mV or more.
A molded article of polyolefin-based resin expanded beads having excellent appearance and further suppressed color unevenness is provided.
A molded article of polyolefin-based resin expanded beads having excellent appearance and further suppressed color unevenness is provided.
Polyolefin-based resin expanded beads obtained by expanding polyolefin-based resin particles including one or two or more metal borates selected from zinc borate and magnesium borate, wherein the particles of the metal borate has an arithmetic average particle diameter based on the number of 1 μm or more, and a number rate of the particles of the metal borate having a particle diameter of 5 μm or more is 20% or less. A method for producing polyolefin-based resin expanded beads by releasing expandable polyolefin-based resin particles containing one or two or more metal borates selected from zinc borate and magnesium borate and a physical blowing agent dispersed in an aqueous medium in a closed vessel together with the aqueous medium from the closed vessel to a low pressure region than an inside of the closed vessel to expand the expandable polyolefin-based resin particles, the method comprising: using a metal borate having an arithmetic average particle diameter based on the number of 1 μm or more and a number rate of the particles having a particle diameter of 5 μm or more of 20% or less as the metal borate.
C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
Provided is a radiation-sensitive composition containing: a polymer having an acid dissociable group; and at least one compound (b) selected from the group consisting of a compound represented by formula (1) and a compound represented by formula (2). In formula (1), R1is a 1-20C monovalent organic group. R2is either a single bond, or is a 1-20C bivalent group that bonds to the N- in formula (1) through -CR4R5- or an aromatic ring. Ma+is an a-valent cation. In formula (2), R7is a group having a partial structure in which an iodine atom is bonded to an aromatic ring. Mb+ is a b-valent cation.
C07C 311/09 - Sulfonamides having sulfur atoms of sulfonamide groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton the carbon skeleton being further substituted by at least two halogen atoms
C07C 311/21 - Sulfonamides having sulfur atoms of sulfonamide groups bound to carbon atoms of six-membered aromatic rings having the nitrogen atom of at least one of the sulfonamide groups bound to a carbon atom of a six-membered aromatic ring
Provided is a radiation-sensitive composition comprising a polymer having a structural unit represented by formula (1) and a photodegradable base. In formula (1), R1is a hydrogen atom, a fluorine atom, a methyl group, or the like. X1is an alkanediyl group, an oxygen atom, or a sulfur atom. Y1is a monovalent hydrocarbon group, a monovalent fluorinated hydrocarbon group, or a halogen atom. R2is a monovalent organic group. B1is a single bond or *1−COO−. R3is a substituted or unsubstituted divalent hydrocarbon group. Z1is a single bond, −O−, −COO−, −OCO−, −OCOO−, −CONR4−, −NR4CO−, −OCONR4-, −NR4COO−, or −NR4CONR5−. R4and R5 are hydrogen atoms or monovalent hydrocarbon groups.
A composition includes a polymer (1) having a partial structure represented by formula (1), and a solvent. X is a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group having 1 to 5 carbon atoms, a hydroxyalkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms. Y is a monovalent organic group having 1 to 12 carbon atoms and containing a hetero atom or a monovalent inorganic acid group. Z is a linking group represented by —O—, —S—, or —NR—, where R is an organic group having 1 to 20 carbon atoms. R1 and R2 are each independently a hydrogen atom, a halogen atom, or an organic group having 1 to 20 carbon atoms, or the like.
A composition includes a polymer (1) having a partial structure represented by formula (1), and a solvent. X is a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group having 1 to 5 carbon atoms, a hydroxyalkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms. Y is a monovalent organic group having 1 to 12 carbon atoms and containing a hetero atom or a monovalent inorganic acid group. Z is a linking group represented by —O—, —S—, or —NR—, where R is an organic group having 1 to 20 carbon atoms. R1 and R2 are each independently a hydrogen atom, a halogen atom, or an organic group having 1 to 20 carbon atoms, or the like.
C08F 297/02 - Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
A method is provided for producing astrocyte-like cells, including (A) upregulating transcription factors including SRY-box transcription factor 9 (SOX9), nuclear factor IA (NFIA), and nuclear factor IB (NFIB) in human pluripotent stein cells and (B) culturing the human pluripotent stem cells, in which the transcription factors are upregulated, and consequently differentiating the human pluripotent stern cells into astrocyte-like cells.
The purpose of the present invention is to provide: a method for producing a semiconductor substrate using a composition from which a film having excellent etching resistance and heat resistance can be formed; and a composition. Provided is a method for producing a semiconductor substrate which includes a step for directly or indirectly coating a substrate with a resist underlayer film-forming composition, a step for directly or indirectly forming a resist pattern on the resist underlayer film formed in the coating step, and a step for etching while using the resist pattern as a mask, wherein: the composition for forming the resist underlayer film contains a compound having a partial structure represented by formula (1), and a solvent; and the compound has at least one monovalent group which includes an aromatic heterocycle having a 5- to 20-membered ring. (In formula (1), Ar1and Ar2each independently represent a substituted or unsubstituted aromatic ring which has a 5- to 20-membered ring and forms a condensed ring structure and two adjacent carbon atoms in formula (1). R1 represents one or more groups selected from the group consisting of a monovalent ring including a substituted or unsubstituted aromatic ring having a 5- to 60-membered ring, and a monovalent group including an aromatic heterocycle having a 5- to 20-membered ring. L is a single bond or a divalent linking group. * and ** each represent a position which bonds to a section of said compound other than the partial structure represented by formula (1). m and n each independently represent an integer from 0 to 3. However, m+n is 1 or higher.)
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C07D 209/08 - Indoles; Hydrogenated indoles with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, directly attached to carbon atoms of the hetero ring
C07D 209/14 - Radicals substituted by nitrogen atoms, not forming part of a nitro radical
C08G 61/00 - Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY (Japan)
Inventor
Miyazaki Yuta
Arai Takayuki
Ito Masayoshi
Negishi Hashiru
Harashima Hideyoshi
Sato Yusuke
Abstract
A method for purifying a composition that comprises a step for dissolving the composition containing a compound represented by formula(1) [in formula (1): R1represents -N(R2)-R2(wherein R2represents a C1-C4 alkyl group); R3and R4represent a C3-C8 alkanediyl group; R5represents a hydroxyl group; R6represents -R7-OH (wherein R7represents a C4-C12 alkanediyl group) or a hydrogen atom; and n is an integer of 0 or 1] in an aqueous layer and performing liquid-liquid extraction, wherein an oil layer used in the liquid-liquid extraction contains one or more liquids selected from the group consisting of a ketone liquid, an ester liquid and an ether liquid each having a solubility parameter (SP value) of 14.8-20.5 (MPa1/2).
A61K 31/713 - Double-stranded nucleic acids or oligonucleotides
A61K 47/18 - Amines; Amides; Ureas; Quaternary ammonium compounds; Amino acids; Oligopeptides having up to five amino acids
A61K 47/24 - Organic compounds, e.g. natural or synthetic hydrocarbons, polyolefins, mineral oil, petrolatum or ozokerite containing atoms other than carbon, hydrogen, oxygen, halogen, nitrogen or sulfur, e.g. cyclomethicone or phospholipids
A61K 47/28 - Steroids, e.g. cholesterol, bile acids or glycyrrhetinic acid
A61K 47/34 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. polyesters, polyamino acids, polysiloxanes, polyphosphazines, copolymers of polyalkylene glycol or poloxamers
C07C 219/06 - Compounds containing amino and esterified hydroxy groups bound to the same carbon skeleton having esterified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having the hydroxy groups esterified by carboxylic acids having the esterifying carboxyl groups bound to hydrogen atoms or to acyclic carbon atoms of an acyclic saturated carbon skeleton
C07C 219/08 - Compounds containing amino and esterified hydroxy groups bound to the same carbon skeleton having esterified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having at least one of the hydroxy groups esterified by a carboxylic acid having the esterifying carboxyl group bound to an acyclic carbon atom of an acyclic unsaturated carbon skeleton
C07C 229/12 - Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having only one amino and one carboxyl group bound to the carbon skeleton the nitrogen atom of the amino group being further bound to acyclic carbon atoms or to carbon atoms of rings other than six-membered aromatic rings to carbon atoms of acyclic carbon skeletons
C12N 15/113 - Non-coding nucleic acids modulating the expression of genes, e.g. antisense oligonucleotides
44.
COMPOSITION FOR ALLEVIATING PULMONARY HYPERTENSION, METHOD FOR PREDICTING PROGNOSIS OF PULMONARY HYPERTENSION, METHOD FOR ASSISTING IN DETERMINING SEVERITY OF PULMONARY HYPERTENSION, AND METHOD FOR ASSISTING IN DIAGNOSING PULMONARY HYPERTENSION
The present invention provides (1) a composition for improving pulmonary hypertension, comprising at least one substance capable of normalizing gut microbiota in a patient with pulmonary hypertension as an active ingredient; (2) a method for predicting the prognosis of a patient with pulmonary hypertension, or a method for assisting the determination of the severity of a patient with pulmonary hypertension, the method comprising detecting one or more types of bacteria selected from bacteria belonging to the family Micrococcaceae, Streptococcaceae, Pasteurellaceae, Veillonellaceae or Lactobacillaceae in gut microbiota in the patient with pulmonary hypertension; and (3) a method for assisting the diagnosis of pulmonary hypertension, the method comprising comparing the IgA level in feces of a subject to that of a healthy subject.
Provided are: a radiation-sensitive resin composition that can be formed into a resist film having satisfactory levels of sensitivity and CDU performance even when a next-generation technology is applied; and a pattern formation method. The radiation-sensitive resin composition contains a compound A represented by formula (I). [Chemical 1] (In the formula, R1is a (m+m')-valent organic group and has a cyclopropane ring skeleton, a cyclobutane ring skeleton, or both. X1is a group represented by formula (1-1) or a group represented by formula (1-2). X2is a group represented by formula (2-1) or a group represented by formula (2-2). Y+ is a monovalent onium cation. m is an integer of 1-2. m' is an integer of 0-1.) [Chemical 2] (In the formula, * represents a bond with another group.) The radiation-sensitive resin composition also contains a resin B including a structural unit having an acid-dissociable group, a radiation-sensitive acid generator other than the compound A, and a solvent.
C07C 59/11 - Saturated compounds having only one carboxyl group and containing hydroxy or O-metal groups containing rings
C07C 61/04 - Saturated compounds having a carboxyl group bound to a three- or four-membered ring
C07C 62/08 - Saturated compounds containing ether groups, groups, groups, or groups
C07C 62/24 - Saturated compounds containing keto groups the keto group being part of a ring
C07C 69/34 - Esters of acyclic saturated polycarboxylic acids having an esterified carboxyl group bound to an acyclic carbon atom
C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
Provided are: a radiation-sensitive resin composition that can form a resist film that exhibits satisfactory levels of sensitivity, CDU performance, pattern circularity, LWR performance, and pattern rectangularity even when forming a resist pattern having a high aspect ratio; and a pattern formation method. This radiation-sensitive resin composition comprises: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a resin containing a structural unit having an acid-dissociable group; and a solvent. (In formula (1), R1represents a C1-40 monovalent chain-shaped organic group. R2and R3are each a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group, or a monovalent fluorinated hydrocarbon group. Rf11and RF12are each a fluorine atom or a monovalent fluorinated hydrocarbon group. R4, R5, R6, R7and R8are each a hydrogen atom, a hydroxyl group, a halogen atom, or a C1-20 monovalent organic group. Alternatively, if a plurality of R8are present, two of the plurality of R8mutually combine to form a ring structure having 5-20 ring members and configured by also two carbon atoms of the benzene ring in formula (1) to which these moieties are bonded.) (In formula (2), RBdenotes a C3-40 monovalent organic group including a ring structure. Rf21and Rf22each denote a fluorine atom or a monovalent fluorinated hydrocarbon group. Z+ is a monovalent radiation-sensitive onium cation.)
A vehicle seat core material includes a molded article that includes thermoplastic resin expanded beads. The molded article has a substantially rectangular shape in a top view, and has a front side and a rear side opposite the front side. The molded article has an average density (Z) of 20 kg/m3 to 50 kg/m3. The molded article includes, on the rear side of the molded article, a rear thin portion having a thickness of 10 mm to 40 mm, the thickness of the rear thin portion being smaller than an average thickness of the molded article. A ratio (Y/Z) of a density (Y) of the rear thin portion to the average density (Z) of the molded article is 1.05 to 3. The rear thin portion of the molded article has a fusion rate of 70% or more.
Provided are: a radiation-sensitive resin composition, from which a resist film capable of exhibiting satisfactory levels of sensitivity, CDU performance, pattern circularity, LWR performance and pattern rectangularity can be formed in the formation of a resist pattern having a high aspect ratio; and a pattern formation method. The radiation-sensitive resin composition comprises: an onium salt compound represented by formula (1); a resin containing a first structural unit having an acid-dissociating group and a second structural unit having a polycyclic lactone structure, a polycyclic sultone structure or a polycyclic carbonate structure; and a solvent. (In formula (1), R1represents a monovalent linear organic group having 1 to 40 carbon atoms; R2and R3independently represent a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group, or a monovalent fluorinated hydrocarbon group; Rf11and Rf12122 independently represent an integer of 1 to 4; R4, R5, R6, R7and R8independently represent a hydrogen atom, a hydroxy group, a halogen atom, or a monovalent organic group having 1 to 20 carbon atoms; when there are a plurality of R8's, two of the plurality of R81233 represents an integer of 1 to 5.)
The purpose of the present invention is to provide a production method for semiconductor substrates that makes it possible to achieve sufficient levels of sensitivity, LWR performance, and the like. According to the present invention, a production method for semiconductor substrates includes a step for directly or indirectly vapor depositing a metal or a metal compound on a substrate to form a metal-containing resist film and a step for exposing the resist film, the metal or metal compound including Au atoms, Cr atoms, Ag atoms, In atoms, or any of those.
This radiation-sensitive composition contains: a polymer having an acid dissociative group; and a compound represented by formula (1). In formula (1), R1is a monovalent group having an aromatic ring structure and 5-20 carbons. R1has an aromatic ring structure and is bonded to N-. R2represents a monovalent organic group having 1-20 carbons. Mn+ represents an n-valent cation. n represents 1 or 2.
The present invention provides a chemical-mechanical polishing composition with which it is possible to polish a molybdenum film at a stable polishing rate, and suppress corrosion of the molybdenum film. A chemical-mechanical polishing composition according to the present invention contains abrasive grains (A) and an iron(III) compound (B), wherein the nitric acid ion concentration in the chemical-mechanical polishing composition is 200 ppm or less.
The present invention provides a chemical-mechanical polishing composition with which it is possible to polish a molybdenum film and a silicon dioxide film at a stable polishing rate, and suppress corrosion of the molybdenum film. A chemical-mechanical polishing composition according to the present invention contains abrasive grains (A) and an iron(III) compound (B), wherein the iron(III) compound (B) is a chelate compound.
The present invention provides a chemical-mechanical polishing composition with which it is possible to polish a molybdenum film and a silicon dioxide film at a stable polishing rate, and suppress corrosion of the molybdenum film. A chemical-mechanical polishing composition according to the present invention contains: abrasive grains (A); an iron(III) compound (B); and at least one type of metal atom selected from the group consisting of Al atoms, Mn atoms, and Zn atoms. The total Al, Mn, and Zn atom content is 0.1 ppm to 100 ppm, inclusive.
This method for manufacturing a polypropylene-based resin foamed particle molded article comprises: filling a forming mold with foamed particles (1) compressed by pressurized gas; and then supplying a heated medium in the forming mold to conduct in-mold molding of the foamed particles (1) in the forming mold. Each of the foamed particles (1) has a cylinder shape having a through-hole (11). The through-holes (11) have an average hole diameter d of not less than 0.1 mm but less than 1 mm. The ratio d/D of the average hole diameter d of the through-holes (11) with respect to the average outer diameter D of the foamed particles (1) is 0.4 or less. In a state where the forming mold is filled with the foamed particles (1), the compression percentage P of the foamed particles (1) is 20-80%.
B29C 44/00 - Shaping by internal pressure generated in the material, e.g. swelling or foaming
B29C 44/44 - Feeding the material to be shaped into a closed space, i.e. to make articles of definite length in the form of expandable particles or beads
B29K 23/00 - Use of polyalkenes as moulding material
55.
CROSSLINKED OLEFIN-BASED THERMOPLASTIC ELASTOMER EXPANDED BEAD AND METHOD FOR PRODUCING SAME
A crosslinked olefin-based thermoplastic elastomer expanded bead including a base polymer having an olefin-based thermoplastic elastomer and a brominated bisphenol-based flame retardant having a chemical structure represented by formula (1). A difference TmTPO-TFR is −5° C. to 40° C., where TmTPO is a melting point of the olefin-based thermoplastic elastomer and TFR is the lower of a glass transition temperature TgFR and a melting point TmFR of the brominated bisphenol-based flame retardant. A xylene insoluble content is 5 mass % to 80 mass %. R1 and R3 in the formula (1) are monovalent substituents, R2 is a divalent substituent, and n is an integer from 1 to 6:
A crosslinked olefin-based thermoplastic elastomer expanded bead including a base polymer having an olefin-based thermoplastic elastomer and a brominated bisphenol-based flame retardant having a chemical structure represented by formula (1). A difference TmTPO-TFR is −5° C. to 40° C., where TmTPO is a melting point of the olefin-based thermoplastic elastomer and TFR is the lower of a glass transition temperature TgFR and a melting point TmFR of the brominated bisphenol-based flame retardant. A xylene insoluble content is 5 mass % to 80 mass %. R1 and R3 in the formula (1) are monovalent substituents, R2 is a divalent substituent, and n is an integer from 1 to 6:
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; photoresists; synthetic resins,
unprocessed; artificial resins, unprocessed; chemical
preparations for use in photography; photographic
sensitizers; photographic developers; chemical coatings used
in the manufacture of semiconductors; detergents for use in
manufacturing processes.
57.
CULTURE METHOD, CULTURE PRODUCT, SPHEROID, AND METHOD FOR SCREENING FOR TEST SUBSTANCE
This culture method includes culturing a spheroid of human neural cell-like cells in the presence of a tau protein aggregate and then culturing the culture product in a culture medium containing a lipid in an amount of 5 μg/mL or more, in which the lipid comprises at least one component selected from the group consisting of a glycerolipid, a glycerophospholipid and a sphingolipid. The culture method includes culturing a spheroid of human neural cell-like cells in the presence of a tau protein aggregate and then culturing the culture product in a culture medium containing a neurotrophic factor.
VERTEBRAL BODY ESTIMATION MODEL LEARNING DEVICE, VERTEBRAL BODY ESTIMATING DEVICE, FIXING CONDITION ESTIMATING DEVICE, VERTEBRAL BODY ESTIMATION MODEL LEARNING METHOD, VERTEBRAL BODY ESTIMATING METHOD, FIXING CONDITION ESTIMATING METHOD, AND PROGRAM
This vertebral body estimation model learning device comprises: a vertebral body estimation model executing unit for executing a vertebral body estimation model, which is a mathematical model for estimating, on the basis of image data of a vertebral body two-dimensional image being a two-dimensional image in which a vertebral body appears, positions of each vertex of the vertebral body and vectors at each vertex, the vectors being oriented from the vertices toward a center of the vertebral body, to thereby estimate the positions of the vertices of a vertebral body appearing in image data of a vertebral body two-dimensional image to be estimated, and the vectors at each vertex; and an updating unit for updating the vertebral body estimation model on the basis of the result of the estimation performed by the vertebral body estimation model executing unit.
Provided are a radiation-sensitive resin composition and a pattern formation method that make it possible to form a resist film that has excellent sensitivity, CDU performance, and storage stability, even when next-generation technology is applied. According to the present invention, a radiation-sensitive resin composition contains: a resin that includes a structural unit that is represented by formula (1) (in which R1is a hydrogen atom, a C1–5 alkyl group, or a C1–5 halogenated alkyl group, Rxis a monovalent C1–20 hydrocarbon group, n is an integer that is 0–14, and Ryis a fluorine atom, a C1–5 hydrocarbon group, or a C1–5 fluorinated hydrocarbon group, each Ry being the same or different); at least one type of salt that includes an organic acid anion portion and a cation portion; and a solvent. The salt includes a carboxylate anion in the organic acid anion portion, and at least a portion of the organic acid anion portion of the salt includes an iodine-substituted aromatic ring structure.
Polyethylene resin foam particles using a non-crosslinked linear low-density polyethylene as base resin. The density, the amount of melting heat, the melting point and the melt flow rate under the conditions of a temperature of 190°C and a load of 2.16 kg of the linear low-density polyethylene are within predetermined ranges. The average bubble diameter of the foam particles is from 50 μm to 180 μm.
Polyethylene resin foam particles using a mixed resin of virgin polyethylene (A) and recycled polyethylene (B) as base resin, and a method for producing said particles. The mixed resin contains a prescribed ratio of the virgin polyethylene (A) and the recycled polyethylene (B). The virgin polyethylene (A) is a linear low-density polyethylene (A1) having prescribed physical properties and polymerized using a metallocene polymerization catalyst. The recycled polyethylene (B) is a post-consumer material containing a linear low-density polyethylene (B1) and a low-density polyethylene (B2), the linear low-density polyethylene (B1) being the main component.
The purpose of the present invention is to provide: a method for producing a semiconductor substrate, the method using a resist underlayer film-forming composition from which it is possible to form a resist underlayer film that has excellent solvent resistance and excellent resist pattern rectangularity; and a resist underlayer film-forming composition. The method for producing a semiconductor substrate comprises: a step for directly or indirectly applying a resist underlayer film-forming composition to a substrate; a step for applying a resist film-forming composition to a resist underlayer film that is formed in the step for applying the resist underlayer film-forming composition; a step for exposing, to radiation, a resist film that is formed in the step for applying the resist film-forming composition; and a step for developing at least the exposed resist film. The resist underlayer film-forming composition contains a polymer that has a partial structure represented by formula (i), and a solvent. (In formula (i), Y1represents a divalent group selected from the group consisting of a sulfonyl group, a carbonyl group, and an alkanediyl group. Y2represents a divalent group selected from the group consisting of a sulfonyl group, a carbonyl group, and a single bond. Note that in the case where Y1represents an alkanediyl group, Y2represents a sulfonyl group or a carbonyl group. In the case where Y2represents a single bond, Y1represents a sulfonyl group or a carbonyl group. R1represents a monovalent organic group having 1-20 carbon atoms. X+ represents a monovalent onium cation.* represents a bond between the polymer and another structure.)
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
This biomimetic system includes a container and a film that contains cells similar to human cholangiocytes. The film that contains cells similar to human cholangiocytes includes a permeable substrate and two-dimensional tissue of cells similar to human cholangiocytes layered on one side of the permeable substrate. The film that contains cells similar to human cholangiocytes partitions the container into a first section and a second section; and the one side of the permeable substrate is exposed in the first section, while another side of the permeable substrate is exposed in the second section. The cells similar to human cholangiocytes express P-gp; and the efflux ratio calculated using formula (1) is at least 1.5. (1): Efflux ratio = (permeation speed of rhodamine 123 passing from the second section to the first section) / (permeation speed of rhodamine 123 passing from the first section to the second section)
Provided is a method for forming a metal-containing film, the method comprising a step for coating, on a substrate, a composition for forming a metal-containing film, and a step for heating the coated film formed by the coating step at 200-500°C, wherein: the composition for forming a metal-containing film contains a metal compound, a carbazic acid ester derivative, and a solvent; and the carbazic acid ester derivative comprises at least one compound selected from the group consisting of a compound represented by formula (1) and a compound represented by formula (2). Note that R11and R21are each independently a monovalent organic group having 1-20 carbons, R12, R13, R14, and R22are each independently a hydrogen atom or a substituted or unsubstituted monovalent aliphatic hydrocarbon group having 1-10 carbons, and R23 is a substituted or unsubstituted divalent aliphatic hydrocarbon group having 1-10 carbons.
C23C 18/02 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
H01L 21/3205 - Deposition of non-insulating-, e.g. conductive- or resistive-, layers, on insulating layers; After-treatment of these layers
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
An information processing device (10) according to the present invention comprises a storage unit (201), a reception unit (101), a condition extraction unit (102), and an output control unit (103). The storage unit (201) stores experiment condition information including a plurality of experiment conditions for performance experiments regarding a lithography material to be used in a semiconductor lithography process, the experiment condition information being stored for each performance experiment. The reception unit (101) receives an input of utilization condition information including a plurality of utilization conditions in which the lithography material is to be utilized. The condition extraction unit (102) extracts experiment condition information similar to the inputted utilization condition information from among the plurality of experiment condition information stored in the storage unit (201). The output control unit (103) outputs the extracted experiment condition information.
The kidney regeneration accelerator that contains a component obtained by decellularizing a mammalian organ. The production method for a kidney regeneration accelerator that involves decellularizing a mammalian organ to obtain a component that includes an extracellular matrix, freeze drying and then pulverizing the component to obtain a powder, and performing a sterilization treatment on the powder. A pharmaceutical composition for use in treating kidney disease that contains a component obtained by decellularizing a mammalian organ. A treatment method for kidney disease that involves applying a pharmaceutical composition that contains a component obtained by decellularizing a mammalian organ to a site to be treated of the kidney of a human or animal kidney disease patient.
A molded article of polypropylene-based resin expanded beads, obtained by in-mold molding of the polypropylene-based resin expanded beads, each bead including: a core layer, in a foamed state, having a polypropylene-based resin; and a covering layer, which covers the core layer, having a polyethylene-based resin. A molded article magnification X [times] of the molded article is 55 times to 90 times, a value of a product X·σ50 of a 50% compressive stress σ50 [kPa] and the molded article magnification X is 6500 or more, and a 5% compressive stress σ5 of the expanded beads molded article is 5 kPa to 25 kPa.
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
METAL-CONTAINING FILM FORMATION COMPOSITION, METAL-CONTAINING FILM, METAL-CONTAINING FILM FORMATION METHOD, AND PRODUCTION METHOD OF METAL-CONTAINING FILM FORMATION COMPOSITION
Provided are: a metal-containing film formation composition from which a metal-containing film having excellent electric conductivity can be formed; a metal-containing film; a metal-containing film formation method; and a production method of a metal-containing film formation composition. This metal-containing film formation composition contains a metallic compound, a compound having an oxymethylene structure, and a solvent. The metallic compound is a metal salt or a metal complex. The compound having the oxymethylene structure generates an aldehyde structure when being degraded through heating. Metal atoms included in the metallic compound preferably belong to group 2 to group 14 and in third period to seventh period in the periodic table. The metal atoms are preferably those of copper.
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
72.
RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD
Provided are a radiation-sensitive resin composition and a pattern formation method that make it possible to form a resist film that exhibits an excellent sensitivity, CDU performance, and development defect performance, even when next-generation technology is applied. The radiation-sensitive resin composition comprises a resin A that contains, inter alia, a structural unit given by formula (1) (in the formula, R1 represents a hydrogen atom, C1-C5 alkyl group, C1-C5 halogenated alkyl group, etc.); a resin B that contains a structural unit having an acid-dissociable group; one or two or more salts containing an organic acid anion moiety and a cation moiety; and a solvent. The salt contains a carboxylic acid anion in the organic acid anion moiety, and at least a portion of the organic acid anion moiety in the salt contains an iodine-substituted aromatic ring structure.
Provided are a radiation-sensitive resin composition, a resin, a compound, and a pattern formation method with which it is possible to form a resist film that has excellent sensitivity, CDU performance, and resolution when next-generation technology is applied. A radiation-sensitive resin composition that includes: a resin including a structural unit (I) represented by formula (1); a radiation-sensitive acid generator including an organic acid anion moiety and an onium cation moiety; and a solvent. (In formula (1), Rais a hydrogen atom or a substituted or unsubstituted C1-10 monovalent hydrocarbon group. Ar1is a substituted or unsubstituted C6-20 divalent aromatic hydrocarbon group. m is 0 or 1. L1is -O-, *-COO-, a C1-20 divalent hydrocarbon group, or a combination of two or more thereof or is a single bond. *is a bond on the Ar1side. Ar2is a substituted or unsubstituted C6-20 monovalent aromatic hydrocarbon group. X is a an iodine atom or bromine atom substituting a hydrogen atom in a monovalent aromatic hydrocarbon group represented by Ar211 is an integer of 1 to (the number of hydrogen atoms in a monovalent aromatic hydrocarbon group represented by Ar2).)
[Problem] To provide a technique for suppressing deterioration of liquid permeability and pressure resistance characteristics during liquid passage of a chromatography carrier when a solvent has been substituted with an aqueous solvent that does not contain a buffering agent. [Solution] A method for filling a column with a chromatography carrier, said method comprising step 1 and step 2 below. (Step 1) A substitution step for substituting, with an aqueous solvent that does not contain a buffering agent, a slurry containing a target substance capturing chromatography carrier, a buffering agent having an acid dissociation constant (pKa) within a range of ±1.0 of the isoelectric point of the buffering agent, and an aqueous solvent, the liquid-phase pH having been adjusted to be within a range of ±2.0 of the isoelectric point of the carrier. (Step 2) A filling step for filling a column with the slurry for which the solvent substitution has been carried out in step 1
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; photoresists; synthetic resins, unprocessed; artificial resins, unprocessed; chemical preparations for use in photography; photographic sensitizers; photographic developers; chemical coatings used in the manufacture of semiconductors; detergents for use in manufacturing processes
76.
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
A radiation-sensitive resin composition includes a resin, a radiation-sensitive acid generator, and a solvent. The resin includes a structural unit A represented by formula (1) and a structural unit B having an acid-dissociable group. The structural unit represented by the formula (1) is excluded from the structural unit B. In the formula (1), A is a monovalent aromatic hydrocarbon group in which —ORY is bonded to a carbon atom adjacent to a carbon atom to which Lα is bonded, and hydrogen atoms on other carbon atoms are unsubstituted, or a part or all of the hydrogen atoms are substituted with a cyano group, a nitro group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, an alkoxycarbonyloxy group, an acyl group, or an acyloxy group.
A radiation-sensitive resin composition includes a resin, a radiation-sensitive acid generator, and a solvent. The resin includes a structural unit A represented by formula (1) and a structural unit B having an acid-dissociable group. The structural unit represented by the formula (1) is excluded from the structural unit B. In the formula (1), A is a monovalent aromatic hydrocarbon group in which —ORY is bonded to a carbon atom adjacent to a carbon atom to which Lα is bonded, and hydrogen atoms on other carbon atoms are unsubstituted, or a part or all of the hydrogen atoms are substituted with a cyano group, a nitro group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, an alkoxycarbonyloxy group, an acyl group, or an acyloxy group.
A thermoplastic olefinic elastomer expanded bead, which is an expanded bead including a thermoplastic olefinic elastomer as a main component, wherein the expanded bead has an average particle diameter of 0.5 to 5 mm, the expanded bead has a heat of fusion of 60 to 80 J/g, and a difference [Tm−Tc] between a melting point (Tm) and a crystallization temperature (Tc) of the expanded bead is 20° C. or lower.
A radiation-sensitive resin composition includes a solvent and an onium salt compound having a structure represented by formula (1). Rf1 and Rf2 each independently represent a fluorine atom or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. R1 represents a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a fluorine atom, or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. R2, R3, R4, R5, R6, and R7 each independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms. n1+n2 is an integer of 2 to 8. n3 represents an integer of 0 to 5. X1 and X2 each independently represent an oxygen atom or a sulfur atom. Each * represents a bond with another structure. Z+ represents a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes a solvent and an onium salt compound having a structure represented by formula (1). Rf1 and Rf2 each independently represent a fluorine atom or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. R1 represents a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a fluorine atom, or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. R2, R3, R4, R5, R6, and R7 each independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms. n1+n2 is an integer of 2 to 8. n3 represents an integer of 0 to 5. X1 and X2 each independently represent an oxygen atom or a sulfur atom. Each * represents a bond with another structure. Z+ represents a monovalent radiation-sensitive onium cation.
Provided are a method for forming a resist pattern that demonstrates excellent performance in sensitivity, resolution, etc. in an exposure step when a next-generation exposure technique is applied, and a radiation-sensitive resin composition. The method for forming a resist pattern includes step (1) of forming a resist film in which a content of a radiation-sensitive acid generator (C) is 0.1% by mass or less, step (2) of exposing the resist film to EUV or an electron beam (EB), and step (3) of developing the resist film exposed in the step (2).
To make it possible to provide a black foam-particle molded article that uses post-consumer materials of polypropylene resin foam molded articles containing carbon black and that has an exceptional appearance and properties, there is provided a method for producing polypropylene resin foam particles that include post-consumer materials of polypropylene resin foam molded articles containing carbon black. This method for producing polypropylene resin foam particles includes: a mixing step for melt-mixing polypropylene resin for which the melt flow rate at a temperature of 230°C and a load of 2.16 kg ranges from 1 g/10 min to 15 g/10 min, and recovered polypropylene resin composed of recovered post-consumer materials of polypropylene resin foam molded articles, using an extruder to obtain a mixture; an extrusion step; and a foaming step. The blend ratio of polypropylene resin in the mixture is 30-90 wt%, and the blend ratio of recovered polypropylene resin in the mixture is 10-70 wt% (where the total of the polypropylene resin and recovered polypropylene resin is 100 wt%). The recovered polypropylene resin includes carbon black. The carbon black content of the recovered polypropylene resin is 0.5-5 wt%. The melting point of the recovered polypropylene resin is 135-160°C. The melt flow rate of the recovered polypropylene resin at a temperature of 230°C and a load of 2.16 kg is greater than the melt flow rate of the polypropylene resin at a temperature of 230°C and a load of 2.16 kg, and the difference ((melt flow rate of recovered polypropylene resin)–(melt flow rate of polypropylene resin)) between the melt flow rate of the recovered polypropylene resin and the polypropylene resin ranges from 0.1 g/10 min to 12 g/10 min.
Provided is an organoid production method comprising culturing a human stem cell in a culture medium that contains a cyclic peptide having an amino acid sequence indicated by formula (1), or a pharmaceutically acceptable salt thereof. [In formula (1), X1-X6each indicate a specific modified amino acid, X7 indicates an arbitrary amino acid residue, R either does not exist or indicates a C-terminal modification group, n indicates an integer of 0 or 1, PeG indicates N-(2-phenylethyl)-glycine, and Nal1 indicates β-(1-naphthyl)-L-alanine.] [Formula 1]
A wearable device according to an embodiment includes a detection unit, a first layer, a second layer, and a third layer. The detection unit detects the living body information. The first layer is flexible and disposed in a first direction relative to the detection unit and includes a conductor electrically connected to the detection unit. The second layer is disposed in the first direction relative to the first layer and is harder than the first layer. The third layer is disposed in the first direction relative to the second layer and includes an electronic component electrically connected to the conductor.
A61B 5/259 - Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes using conductive adhesive means, e.g. gels
A61B 5/28 - Bioelectric electrodes therefor specially adapted for particular uses for electrocardiography [ECG]
A silicon-containing composition includes: a first polysiloxane; a second polysiloxane different from the first polysiloxane; and a solvent. The first polysiloxane includes a group which includes at least one selected from the group consisting of an ester bond, a carbonate structure, and a cyano group. The second polysiloxane includes a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms.
H01L 21/308 - Chemical or electrical treatment, e.g. electrolytic etching using masks
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
A composite molded article in which thermoplastic resin expanded beads are bonded via a thermosetting resin binder, wherein the composite molded article has a density of 0.05 to 0.5 g/cm3, and when heated at 100° C. for 20 minutes, the composite molded article has a volume expansion rate of 15 to 200%.
C08L 79/08 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
C08L 63/00 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08L 67/03 - Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
An expanded bead having a through hole and including a foamed core layer which defines the through hole therein and which is constituted of a resin composition containing two kinds of polypropylene-based resins having different melting points, and a cover layer covering the foamed core layer and constituted of a polyolefin-based resin. The expanded bead gives a DSC curve in which an endothermic peak intrinsic to the resin composition and another endothermic peak on a higher temperature side thereof appear in a specific heat of fusion ratio. Molded articles include a multiplicity of the expanded beads.
B32B 1/00 - Layered products essentially having a general shape other than plane
B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
A HIPE foam may including a vinyl-based crosslinked polymer as a base material resin. The vinyl-based crosslinked polymer may be formed by crosslinking a polymer of a styrene-based monomer and/or an acryl-based monomer. An apparent density ρ of the HIPE foam may be 35 kg/m3 or more and 500 kg/m3 or less. A molecular weight between crosslinking points of the vinyl-based crosslinked polymer forming the HIPE foam may be 2×103 or more and 2×105 or less. The HIPE foam may be used as, for example, a machinable material or an impact absorbing material.
Provided are a radiation-sensitive resin composition and a pattern formation method that make it possible to form a resist film that has excellent sensitivity and CDU performance and an excellent residual film ratio, even when next-generation technology is applied. A radiation-sensitive resin composition that contains: a resin that includes a structural unit that has a phenolic hydroxyl group and at least one structural unit from among structural units represented by formula (1) and structural units represented by formula (2); an acid diffusion control agent represented by formula (α); and a solvent (In formula (1), RTis a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group, and RXis a C1–20 monovalent hydrocarbon group.) (In formula (2), Rcis a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group, Lcis a single bond or a divalent linking group, and Rc1, Rc2, and Rc3are each independently a C1–20 monovalent hydrocarbon group.) (In formula (α), Rwis a C1–20 monovalent organic group, a hydroxy group, or an amino group, the Rws being the same or different when there are a plurality of Rws, Lqis a divalent linking group, the Lqs being the same or different when there are a plurality of Lqs, Z+1231233 is 6.)
COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, METHOD FOR CHEMICAL MECHANICAL POLISHING, AND METHOD FOR MANUFACTURING CHEMICAL MECHANICAL POLISHING PARTICLES
Provided are a composition for chemical mechanical polishing and a method for chemical mechanical polishing, whereby a tungsten film as a wiring material can be polished at high speed, and the occurrence of surface defects in a polished surface can be reduced. A composition for chemical mechanical polishing pertaining contains (A) alumina particles, at least a portion of the surface of which is coated with a coating film of silica alumina, and (B) a liquid medium.
44 -), a hypochlorite ion (ClO-22 -) and a hypobromite ion (BrO-), or a salt thereof, and a liquid medium; if MA (% by mass) is the content of the abrasive grains (A) and MB (% by mass) is the content of the acid or a salt thereof (B), MA/MB is 0.2 to 50; and the absolute value of the zeta potential of the abrasive grains (A) in this composition for chemical mechanical polishing is 10 mV or more.
44 -), a hypochlorite ion (ClO-22 -) and a hypobromite ion (BrO-), or a salt thereof; and (D) a compound having at least one type of functional group selected from the group consisting of an amino group and salts thereof and at least one type of functional group selected from the group consisting of a carboxyl group and salts thereof. The value of MB/MD is 0.25-4, where MB (mass%) denotes the content of the acid or salt thereof (B) and MB (mass%) denotes the content of the compound (D).
The present invention provides a composition for chemical mechanical polishing, the composition being capable of chemically mechanically polishing a semiconductor substrate that contains ruthenium or molybdenum, while maintaining a stable polishing rate and suppressing corrosion of ruthenium and molybdenum. A composition for chemical mechanical polishing according to the present invention contains (A) abrasive grains and (D) a compound which has at least one functional group that is selected from the group consisting of an amino group and salts thereof, and at least one functional group that is selected from the group consisting of a carboxy group and salts thereof; and if MA (% by mass) is the content of the abrasive grains (A) and MD (% by mass) is the content of the compound (D), MA/MD is 0.1 to 700.
A first alignment film and/or a second alignment film is a photo-alignment film on which alignment division is performed. Each pixel has a plurality of alignment regions having different alignment directions of liquid crystal molecules of a liquid crystal layer by the alignment division. The number of times of exposure in each region of the plurality of alignment regions for the alignment division is two or more and the same number among the regions; in each time of exposure for the alignment division, exposure is performed on two or more alignment regions along an arrangement direction, the previous numbers of times of exposure in alignment regions to be exposed in each times of exposure are the same among the regions; and the angle formed by the alignment direction of the liquid crystal molecules of the liquid crystal layer in each region of the plurality of alignment regions and a direction in which the polarizing axis of a polarizing plate extends is approximately 45°.
A composition for resist underlayer film formation, includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents an organic group comprising at least one structure selected from the group consisting of a hydroxy group, a carbonyl group, and an ether bond; a is an integer of 1 to 3, wherein in a case in which a is no less than 2, a plurality of Xs are identical or different from each other; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms, wherein is a group other than X; and b is an integer of 0 to 2, wherein in a case in which b is 2, two R1s are identical or different from each other, and wherein a sum of a and b is no greater than 3.
A composition for resist underlayer film formation, includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents an organic group comprising at least one structure selected from the group consisting of a hydroxy group, a carbonyl group, and an ether bond; a is an integer of 1 to 3, wherein in a case in which a is no less than 2, a plurality of Xs are identical or different from each other; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms, wherein is a group other than X; and b is an integer of 0 to 2, wherein in a case in which b is 2, two R1s are identical or different from each other, and wherein a sum of a and b is no greater than 3.
44 –), hypochlorite ions (CIO–22 –) and hypobromite ions (BrO–) or a salt of said acid; and (C) hydrogen peroxide. MB/MC = 0.015 to 11, where MB (mol/L) is the amount of the (B) acid or salt thereof and MC (mol/L) is the amount of hydrogen peroxide (C).
Polyamide-based resin expanded beads contain a polyamide-based resin as a base material resin. The beads have a crystal structure, an intrinsic peak of the polyamide-based resin and a high-temperature peak having a peak top temperature on a higher temperature side than a peak top temperature of the intrinsic peak appear in a DSC curve obtained under a predetermined condition; an amount of heat of fusion of the high-temperature peak is within 5 J/g or more and 50 J/g or less; and a coefficient of variation of the amount of heat of fusion of the high-temperature peak is 20% or less. The beads are produced by in-mold molding. A method for producing the beads includes: impregnating a polyamide-based resin; and releasing expandable polyamide-based resin beads from a sealed container, a temperature in the sealed container is raised at a rate of 0.3° C. or higher and 1.5° C. or lower per 10 minutes.
A device configuration designed to mitigate display defects resulting from voltage drops in current supply lines offers a display with better display quality. The display includes: a plurality of VOLETs arranged in arrays along a first direction and a second direction; a data line supplying a voltage for controlling gate electrodes of the plurality of VOLETs; TFTs each connected between a gate electrode of each of the VOLET and the data line and controlling voltage supply to the gate electrodes of the VOLETs; a gate line connected to gate electrodes of the TFTs and transmitting a signal that controls the TFTs; a plurality of current supply lines extending along the first direction and supplying a current to each of a group of VOLETs aligned along the first direction; and an auxiliary line extending along the second direction and connecting at least two of the plurality of current supply lines.
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
98.
METHOD FOR FORMING RESIST UNDERLAYER FILM, METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE, COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, AND RESIST UNDERLAYER FILM,
The present invention provides: a method for forming a resist underlayer film, the method enabling the formation of a resist underlayer film that has excellent heat resistance and excellent flatness; a method for producing a semiconductor substrate; a composition for forming a resist underlayer film; and a resist underlayer film. A method for forming a resist underlayer film, the method comprising a step in which a substrate is directly or indirectly coated with a composition for forming a resist underlayer film and a heating step in which a coating film obtained by the coating step is heated at a temperature more than 450°C but not more than 600°C in an atmosphere that has an oxygen concentration of less than 0.01% by volume, wherein: the composition for forming a resist underlayer film contains a compound that has an aromatic ring, a polymer (excluding the compound that has an aromatic ring) that is thermally decomposed at least at a heating temperature in the heating step, and a solvent; the molecular weight of the compound that has an aromatic ring is 400 or more; and the content of the polymer is less than the content of the compound that has an aromatic ring in the composition for forming a resist underlayer film.
G03F 7/11 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
Provided is a radiation-sensitive composition comprising a polymer having a structural unit represented by formula (1) and a photodegradable base. In formula (1), R1represents a hydrogen atom, a fluorine atom, a methyl group or the like; A1represents a bivalent hydrocarbon group having 1 to 20 carbon atoms or a bivalent cyclic organic group having 6 to 20 carbon atoms and having a lactone structure, a cyclic carbonate structure or a sultone structure; X1represents -O-, -COO-, -OCO-, -O-CO-O-, -NHCO- or -CONH-; R2to R8 independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms; k represents an integer of 0 to 2; m represents an integer of 1 to 10; and n represents an integer of 1 to 4.
HH of a chromatography bed including the chromatographic bed insert by at least 25% compared to a corresponding chromatography bed which does not include the chromatographic bed insert.
B01D 15/22 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the construction of the column
