This data processing device comprises: an arithmetic operation unit that repeatedly acquires the physical quantity to be measured, as physical quantity data, and performs a prescribed arithmetic operation on the physical quantity data so as to generate process data; and a communication processing unit that sequentially transmits process data each time process data is generated. The arithmetic operation unit executes a first arithmetic operation on the physical quantity data of a prescribed number of data points and generates first process data when a prescribed start condition is satisfied, and executes a second arithmetic operation until an end condition is satisfied, on physical quantity data for a number of data points comprising physical quantity data at the most recent time and physical quantity data at a past time and generates second process data after the elapse of a prescribed wait time when a prescribed end condition is not satisfied after executing the first arithmetic operation.
H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
G08C 15/06 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division
This detection device (1) comprises: a detection unit (2) attached to an apparatus (100) to be measured; a power supply unit (3) that supplies power to the detection unit (2); and a cable (4) that connects the detection unit (2) and the power supply unit (3). The detection unit (2) has a detection part (10) that detects the state of the apparatus (100) to be measured, a communication part (11) that transmits a detection result of the detection part (10), and a substrate (12) on which the detection part (10) and the communication part (11) are both mounted.
The present invention enables data of interest to be found quickly from among multiple sets of measured data in a polishing device. Provided is a method for displaying measured data relating to a polishing device as a graph. The method includes: a step for acquiring, from the polishing device, a plurality of series of measured data measured in the polishing device; a step for creating graphs corresponding to each of the plurality of series of measured data; a step for classifying the plurality of created graphs into a plurality of groups on the basis of a similarity of the graph shapes; and a step for displaying the plurality of graphs in an overlaid manner, using a different display mode for each group.
This threshold value setting device comprises: an input unit for inputting a period of data to be extracted from acquired data; a data extraction unit for extracting data for the period inputted by the input unit; a reference value determination unit for determining a reference value from the data extracted by the data extraction unit; and a threshold value calculation unit for calculating a threshold value from the reference value determined by the reference value determination unit.
This data processing device comprises: a data acquisition unit which acquires a sequence of physical quantity data individually measured at a prescribed sampling frequency and the number of sampling points; a first data generation unit which generates a first time data sequence by extracting physical quantity data of a first analysis point number continuously measured at the first analysis point of a number smaller than the number of sampling points; a first frequency analysis unit which converts the first time data sequence into a first frequency data sequence through a frequency analysis; a second data generation unit which generates a second time data sequence by thinning the physical quantity sequence into physical quantity data of a second analysis point number smaller than the number of sampling points; and a second frequency analysis unit which converts the second time data sequence into a second frequency data sequence through the frequency analysis.
[Problem] To provide an information processing device that enables the appropriate prediction of the effect of electromagnetic waves generated from an AC power line when substrate treatment is performed. [Solution] An information processing device 5 includes: a current value information generation unit 501 that generates current value information of AC current supplied to an AC device when substrate treatment is performed by a substrate treatment device which is provided with the AC device connected to an AC power supply via an AC power line, and which is provided with a control board that controls the AC device in order to perform substrate treatment for supplying a treatment fluid to a substrate or a treatment member while bringing the treatment member into contact with the substrate; and an electromagnetic wave effect information generation unit 502 that generates, on the basis of the current value information generated by the current value information generation unit 501, electromagnetic wave effect information indicating an effect of electromagnetic waves generated from the AC power line.
To measure the state of a substrate serving as an object subject to plating. This substrate state measurement device comprises: a stage constituted so as to support a substrate having a seed layer and a resist layer formed on the seed layer, and rotate; at least one white confocal sensor for measuring the plate surface of the substrate supported by the stage; and a state measurement module for measuring the state of a power supply member contact region, which is a region of the substrate that comes into contact with a power supply member, on the basis of detection, by the white confocal sensor, of the power supply member contact region.
This hearth component is provided with an in-incinerator exposed surface that is exposed to the inside of an incinerator. The in-incinerator exposed surface comprises a front surface and an upper surface, and at least the front surface is provided with a protective layer having grooves formed on the surface thereof.
A plating device comprising: a plating tank configured so as to accommodate a plating solution; a substrate holder configured so as to hold a substrate to be plated; a rotating mechanism which rotates the substrate holder; a raising/lowering mechanism which raises/lowers the substrate holder; and a control unit. The substrate holder is equipped with: a contact member configured so as to come into contact with the substrate to enable power supply; a seal member configured so as to fill the gap between the substrate holder and the substrate; a liquid-holding part having the contact member inside and configured so as to hold a liquid when the gap between the substrate holder and the substrate is filled by the seal member; and an ejection port which is open to the liquid-holding part or to a space lying inside the substrate holder and communicating with the liquid-holding part or can be disposed on a lateral side of the substrate holder and which has been configured so that the liquid is ejected.
The present disclosure provides a substrate holder having a centering pin that does not push the substrate any farther toward the center than the design position even if a first holding member deviates from the design position with respect to a second holding member when positioning the substrate. The substrate holder according to the present disclosure has a first holding member and a second holding member. The second holding member has a positioning member for positioning the substrate at a predetermined position and a stopper. The positioning member has a centering pin that can move between a first position and a second position. The centering pin is configured so that, when the centering pin moves from the second position to the first position, the centering pin contacts the periphery of the substrate and positions the substrate at the predetermined position. The first holding member has a drive member configured to bias the centering pin to the first position when the substrate is held by the first holding member and second holding member. The stopper is configured to contact the centering pin and stop the centering pin at the first position.
The present invention achieves a small pre-wet module that is capable of performing different pre-processes. This pre-wet module 200 includes: a stage 220 configured so as to hold a rear surface of a substrate WF having a surface WF-a to be processed that faces upward; a rotating mechanism 224 configured so as to rotate the stage 220; a cleaning liquid supply member 260 that has nozzles 262 disposed above the stage 220 and is configured so as to supply a cleaning liquid in the direction of the stage 220 via the nozzles 262; and a degassed liquid supply member 250 that is configured so as to supply a degassed liquid to the surface WF-a to be processed of the base plate WF held on the stage 220, wherein the degassed liquid supply member 250 is configured so as to be able to move between a supply position between the nozzles 262 and the surface WF-a to be processed of the substrate WF and a retreat position to which to retreat between the nozzles 262 and the surface WF-a to be processed of the substrate WF.
A plating method for performing a plating process on a substrate by means of a plating apparatus provided with a substrate holder including a contact member that comes into contact with the substrate so as to enable electrical conduction, the plating method including: a step for rotating the substrate holder at a first rotation speed in a state in which the substrate holder is inclined; a step for discharging a liquid towards the substrate holder rotating at the first rotation speed so that the liquid is fed to the contact member; a step for stopping the discharging of the liquid; a step for beginning, before or within a prescribed time after the discharging of the liquid is stopped, to reduce the incline of the substrate holder towards a horizontal position; a step for rotating the substrate holder at a second rotation speed higher than the first rotation speed, in a state in which the substrate holder is in the horizontal position; and a step for performing the plating process on the substrate after the substrate has been mounted on the substrate holder.
[Problem] To provide an information processing device that makes it possible to appropriately predict reliability information of a polishing end-point detection function, the reliability information indicating the reliability of an end-point detection function for detecting that a chemical mechanical polishing process has reached the end point. [Solution] An information processing device 5 comprises: an information acquisition unit 500 that acquires reliability decrease cause state information during a chemical mechanical polishing process being performed on a substrate by a substrate processing device 2, the reliability decrease cause state information including at least one of wear state information indicating the state of wear of a constituent element of the substrate processing device 2, and processing state information indicating processing state during the polishing process; and a state prediction unit 501 that inputs the reliability decrease cause state information acquired by the information acquisition unit 500 into a learning model that has learned, by machine learning, the correlation between the reliability decrease cause state information and reliability information of a polishing end-point detection function indicating the reliability of an end-point detection function for detecting that the chemical mechanical polishing process has reached an end point, thereby predicting the reliability information of the polishing end-point detection function with respect to the reliability decrease cause state information.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B24B 37/013 - Devices or means for detecting lapping completion
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
The present invention relates to a filler application device that applies a filler to a gap formed between the edge parts of a plurality of boards that constitute a laminated board. This filler application device (100) comprises: a board holding unit (33) that holds and rotates a laminated board (Ws) manufactured by joining a first board (W1) and a second board (W2); an application device (39) that is disposed away from the laminated board (Ws) held by the board holding unit (33), and discharges a filler (F) toward a gap (G) formed between the peripheral edge of the first board (W1) and the peripheral edge of the second board (W2); and a protector (12) that prevents the attachment of liquid splash (Fs) of the filler (F) that occurs when the filler (F) discharged from the application device (39) collides with the gap (G) on the top surface and/or the bottom surface of the laminated board (Ws).
The present invention relates to an information processing device, a machine learning device, an information processing method, and a machine learning method. An information processing device (5) comprises: a fluid supply information acquisition unit (500) for, in a substrate process performed by a substrate processing device provided with a processing member which is to be brought into contact with a substrate and which performs a prescribed substrate process thereon and a processing fluid supply unit for supplying a processing fluid to the substrate or to the processing member, acquiring fluid supply information that includes processing fluid state information indicating the supply state of the processing fluid to be supplied from the processing fluid supply unit; and a fluid distribution information generation unit (501) for generating, on the basis of the fluid supply information acquired by the fluid supply information acquisition unit (500), fluid distribution information indicating the distribution state when the processing fluid supplied from the processing fluid supply unit is distributed while passing through a position of contact between the substrate and the processing member.
The present invention relates to a substrate production method and a substrate production apparatus. A substrate production method according to the present invention comprises: a step in which a filler (F) is applied to a space between a bevel part of a first substrate (W1) and a bevel part of a second substrate (W2); and a step in which air bubbles are removed from the filler (F) that has been applied to the space.
The present invention relates to a substrate holding device, a substrate manufacturing device, and a substrate manufacturing method. A substrate holding device (1) comprises a holding roller (51) and a fluid blowing device (60) that blows pressurized fluid out to a bevel section (B) held by the holding roller (51).
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
The present invention improves the in-plane uniformity of a plating film that is formed on a polygonal substrate. A plating apparatus according to the present invention is provided with: a plating bath; a substrate holder which is configured so as to hold a polygonal substrate; an anode which is arranged within the plating bath so as to face the substrate that is held by the substrate holder; and an anode mask which delimits an opening that corresponds to the outer shape of the polygonal substrate. The anode mask comprises: a first mask member that delimits a first projection, which protrudes toward the center of the opening, at the central part of a first opening side of the opening, the first opening side corresponding to a first side of the polygonal substrate; and a second mask member that delimits a second projection, which protrudes toward the center of the opening, at the central part of a second opening side of the opening, the second opening side corresponding to a second side of the polygonal substrate. Meanwhile, the anode mask is configured such that the distance between the first mask member and the second mask member is able to be adjusted.
This water detecting device, for detecting a state of generation of water present on a surface of a target object which is installed in an ambient environment and through the interior of which water flows, comprises: a target object temperature and humidity sensor for detecting a temperature and humidity of the target object; an environmental temperature and humidity sensor for detecting a temperature and humidity of the ambient environment; and a determining unit for determining whether or not water has been generated, and the cause of generation of the water, on the basis of target object temperature and humidity information indicating a change over time in the temperature and humidity detected by the target object temperature and humidity sensor, and ambient environment temperature and humidity information indicating a change over time in the temperature and humidity detected by the environmental temperature and humidity sensor.
An anode chamber liquid management method comprising: a step for preparing a plating tank in which an anode and a diaphragm in contact with or attached firmly to the upper surface of the anode are arranged, and which is provided with a cathode chamber and an anode chamber partitioned above and below by the diaphragm, and an exhaust passage that is connected to the anode chamber and that is for discharging air bubbles from the anode chamber to the outside of the plating tank; a step for holding a plating liquid in the anode chamber and the cathode chamber such that the liquid level that is of the plating liquid in the exhaust passage and that is equal to the liquid level of the plating liquid in the anode chamber becomes lower than the liquid level of the plating liquid in the cathode chamber; a step for determining whether the height of the liquid level of the plating liquid in the exhaust passage is lower than a prescribed height, on the basis of an output of a liquid level sensor disposed in the exhaust passage; and a step for feeding pure water or an electrolytic solution to the anode chamber when the height of the liquid level of the plating liquid in the exhaust passage is determined as being lower than the prescribed height.
With the present invention, a pre-treatment of a substrate is efficiently performed, and also adhesion of air bubbles to a surface to be treated of the substrate is suppressed. This pre-wetting module 200 includes a deaeration tank 210 which is configured to accommodate a deaeration liquid, a cleaning device 260 which is disposed above the deaeration tank 210 and configured to supply a cleaning liquid downward, a substrate holder 220 which is disposed between the deaeration tank 210 and the cleaning device 260 and has a first holding member 222 configured to hold a first substrate WF-1 and a second holding member 224 configured to hold a second substrate WF-2, and a drive mechanism 230 which is configured to rotate and raise/lower the substrate holder 220, wherein the first holding member 222 and the second holding member 224 are configured to be able to hold the first substrate WF-1 and the second substrate WF-2 in such a manner that when a surface to be treated WF-1a of the first substrate WF-1 is tilted with respect to a horizontal plane to face the surface of the deaeration liquid in the deaeration tank 210, a surface to be treated WF-2a of the second substrate WF-2 horizontally faces the cleaning device 260 at the same time.
C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Provided is a plating device with which it is possible to clean a contact cleaning member. The plating device includes: a plating tank configured to contain a plating solution; a substrate holder configured to hold a substrate in which the surface to be plated is facing downwards, the substrate holder having a contact member for supplying power to the substrate; a contact cleaning member 482 for discharging a cleaning solution towards the contact member when at a cleaning position between the plating tank and the substrate holder; a drive mechanism 476 configured to move the contact cleaning member 482 between a cleaning position and a retracted position retracted from between the plating tank and the substrate holder; and a nozzle cleaning cover 489 configured to cover the upper part of the contact cleaning member 482 when the contact cleaning member 482 is at the retracted position.
Provided is a technique for determining the presence or absence of a plating liquid leak to a region where a contact member is disposed. The leakage determination method comprises: a discharge step 120 for discharging a washing liquid to a contact member of a substrate holder, after a substrate held by the substrate holder is immersed in a plating liquid to perform plating; a measuring step 122 for measuring the electrical conductivity of the washing liquid after the contact member is washed; and a determination step 128 for determining the presence or absence of a plating liquid leak to the region where the contact member is disposed, on the basis of a comparison between a first electrical conductivity of the washing liquid, measured in advance for a reference substrate holder, and a second electrical conductivity of the washing liquid, measured in the measurement step 122.
The present invention pertains to a pump operation assistance method and a pump operation assistance device. This pump operation assistance method comprises: a performance characteristic acquisition step for acquiring a flowrate-total head representative performance curve and a rated rotational speed during a rated operation as performance characteristics of a device to be assisted and identified by a model number of a pump device; an installation state acquisition step for acquiring a real head as an installation state of the device to be assisted; an operation state acquisition step for acquiring an operation frequency, suction pressure, and discharge pressure as an operation state of the device to be assisted; and a first operation assistance step for calculating an operation condition during a reference operation when the device to be assisted is operated in the installation state and the operation state. In the first operation assistance step, the flowrate and the total head during the reference operation are calculated on the basis of the performance characteristics, the installation state, and the operation state.
The present invention pertains to a pump device for raising the pressure of liquid hydrogen, and particularly, to a pump device comprising a thrust balance mechanism for canceling axial thrust applied to an impeller. This pump device comprises: a rotary shaft (1); a plurality of impellers (2a-2h) fixed to the rotary shaft (1); bearings (5, 6) which rotatably support the rotary shaft (1); a pump casing (7) which accommodates the plurality of impellers (2a-2h); and a first thrust balance mechanism (20) and a second thrust balance mechanism (40) which cancel the own weight of a rotary body including the rotary shaft (1) and the plurality of impellers (2a-2h), and the axial thrust acting on the plurality of impellers (2a-2h).
To provide a technology with which it is possible to suppress uneven film thickness of the outer edge of a substrate. This plating device 1 comprises a plating tank, an anode, a substrate holder, at least one auxiliary anode 60a-60d, a bus bar 61 having a power supply portion 62 to which electricity is supplied and a plurality of connection portions 63 connected to the at least one auxiliary anode and arranged in the extending direction of the auxiliary anode, and at least one ion resistor 80a-80d. The ion resistor is configured such that the resistivity of the ion resistor increases with proximity to the power supply portion in the extending direction of the ion resistor.
The present invention relates to a polishing device. This polishing device comprises a triaxial sensor that is disposed adjoining a head arm (20) and that detects information relating to triaxial-direction force applied to a polishing head (1).
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
28.
RESISTOR FOR PLATING APPARATUSES, AND PLATING APPARATUS
The present invention provides: a resistor which makes it possible to improve the uniformity of a plating film that is formed on a substrate; and the like. The present invention provides a resistor for plating apparatuses for electric field control, the resistor being arranged between an anode and a holder, which holds an object to be plated, in a plating apparatus. This resistor for plating apparatuses comprises: a first resistive member which has a first surface and a plurality of first through holes that open to the first surface; and a second resistive member which has a second surface and a plurality of second through holes that open to the second surface. The first resistive member and the second resistive member are arranged such that the first surface and the second surface face each other; and this resistor for plating apparatuses is configured such that the size of overlappings of the plurality of first through holes and the plurality of second through holes is variable.
This machine learning method includes performing: dataset splitting processing for dividing a period into a learning period and a validation period, and splitting a dataset into learning data and validation data; learning candidate period division processing for dividing a learning candidate period into a plurality of split learning periods; learning period evaluation processing for generating a learning period evaluation model for each split learning period, using a learning model corresponding to the split learning period, and using the verification data to calculate an evaluation index of the learning period evaluation model for each split learning period; learning period selection processing for repeating the learning candidate period division processing and the learning period evaluation processing until a predetermined end condition is satisfied, and when the end condition is satisfied, selecting a split learning period having a high evaluation index as a learning target period; and model output processing for outputting a learning model obtained by performing machine learning employing the learning data corresponding to the learning target period.
This dry-up method introduces a purge gas into a suction container (2A) of a pump device (100A), causes the purge gas to pass through a flow path switching device (5A) within the suction container (2A) while causing the purge gas to bypass a submerged pump (1A) within the suction container (2A), introduces, into a suction container (2B) of a pump device (100B), the purge gas that has been passed through the flow path switching device (5A), and causes the purge gas to pass through a flow path switching device (5B) within the suction container (2B) while causing the purge gas to bypass a submerged pump (1B) within the suction container (2B).
F04D 13/08 - Units comprising pumps and their driving means the pump being electrically driven for submerged use
F04D 7/02 - Pumps adapted for handling specific fluids, e.g. by selection of specific materials for pumps or pump parts of centrifugal type
F04D 13/14 - Combinations of two or more pumps the pumps being all of centrifugal type
F17C 13/00 - VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES - Details of vessels or of the filling or discharging of vessels
31.
START-UP METHOD AND STOPPING METHOD FOR PUMP DEVICES CONNECTED IN SERIES
The present invention relates to a start-up method for submerged pumps used for transferring liquefied gas. In the present method, a submerged pump (1A) disposed in an intake container (2A) of a pump device (100A) is started up, liquefied gas is transferred to an intake container (2B) of a pump device (100B) via a flow path switching device (5A) in the intake container (2A), the liquefied gas is made to bypass a submerged pump (1B) disposed in the intake container (2B) and to pass through a flow path switching device (5B) in the intake container (2B), and thereafter, the submerged pump (1B) is started up.
Provided are a substrate polishing method, etc., for performing polishing accommodating substrates having various dimensions. Proposed is a substrate polishing method employing a polishing device comprising: a polishing table having a polishing surface; a top ring for holding a substrate and pressing the substrate against the polishing surface; and a vertical movement mechanism for vertically moving the top ring. The method includes: an acquisition step for acquiring information relating to a thickness of the substrate; a position adjustment step for adjusting a height position of the top ring relative to the polishing table on the basis of the acquired information relating to the thickness of the substrate; and a polishing step for polishing the substrate by supplying a pressurized fluid to a pressure chamber of the top ring to press the substrate against the polishing surface.
B24B 37/005 - Control means for lapping machines or devices
B24B 37/013 - Devices or means for detecting lapping completion
B24B 37/30 - Work carriers for single side lapping of plane surfaces
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 47/22 - Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention makes it possible to clean the bottom surface of a substrate. Provided is a substrate cleaning device comprising: a first scrub-cleaning member that scrub-cleans the bottom surface of a substrate to be cleaned; a first single-tube nozzle that supplies a cleaning liquid to the vicinity of the center of the bottom surface of the substrate; and a first spray nozzle that supplies the cleaning liquid to the bottom surface of the substrate.
The present invention pertains to a stator and a canned motor. Provided is a stator (4) comprising a stator core (15), windings (26), potting members (27), and spacers (32) for closing slot opening parts (25). The spacers (32) are made from an insulating material and have a lower linear expansion coefficient than the potting members (27).
H02K 3/34 - Windings characterised by the shape, form or construction of the insulation between conductors or between conductor and core, e.g. slot insulation
H02K 5/128 - Casings or enclosures characterised by the shape, form or construction thereof specially adapted for operating in liquid or gas using air-gap sleeves or air-gap discs
The present invention relates to a pump for transferring liquid, and particularly relates to a pump for transferring liquid containing foreign substances that are stringy, fibrous, cloth-like, etc. The pump comprises an impeller (1) and an impeller casing (5) that houses the impeller (1), and the impeller (1) has a hub (13), a single swept vane (2) connected to the hub (13), and a shroud (25) to which the hub (13) and the swept vane (2) are connected.
The present invention relates to a device for initializing an elastic film, a polishing device, a method for initializing an elastic film, and a method for assessing the service life of an elastic film. This device (50) for initializing an elastic film (10) comprises: a pressurizing device (55); an expansion amount detection device (58); and a control device (40) for comparing the expansion amount detected by the expansion amount detection device (58) and a prescribed target expansion amount and, if the expansion amount has reached the target expansion amount, determining that initialization of the elastic film (10) is complete.
B24B 37/005 - Control means for lapping machines or devices
B24B 37/30 - Work carriers for single side lapping of plane surfaces
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
37.
PUMP INSTALLATION DEVICE, PUMP INSTALLATION METHOD, AND PUMP EXTRACTION METHOD
This pump installation device comprises: a working chamber (1) which forms a closed working space (15); an actuator-driven door (12) which covers a top opening (3a) of a pump column (3); a suspension cable (23) for suspending a submersible pump (2) in the pump column (3); and a crane (40) for lifting and lowering the suspension cable (23). The top opening (3a) of the pump column (3), the actuator-driven door (12) and the crane (40) are arranged in the working space (15).
F17C 13/00 - VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES - Details of vessels or of the filling or discharging of vessels
The present invention provides a technology that makes it possible to prevent the deterioration in plating quality of a substrate due to the formation of air bubbles coming from an anode. A plating module 400 includes: a plating tank 10 that is so configured as to accommodate a plating solution therein; an anode 13 that is placed in the plating tank 10; a substrate holder 20 that is so configured as to hold a substrate Wf of which a surface to be plated is directed downward so as to face the anode 13; a membrane module 40 that has a first membrane 41 partitioning the inside of the plating tank 10 into an anode chamber 11 and a cathode chamber 12 and a second membrane 42 arranged between the first membrane 41 and the anode 13; and a tube member 31 that communicates a first region R1 positioned below the anode 13 in the plating tank 10 with a second region R2 positioned between the first membrane 41 and the second membrane 42.
This substrate cleaning device comprises: a cleaning module which includes a transfer mechanism for transferring a substrate in a first direction, and which performs cleaning by causing a cleaning member rotating around a rotation axis extending in a second direction not perpendicular to the first direction to abut on the substrate being transferred in the first direction; and a control device which, on the basis of information regarding at least one of the substrate and the cleaning module, changes a cleaning condition including at least one of the direction of the rotation axis, the rotational speed of the cleaning member, and the transfer speed of the substrate.
According to the present invention, a plating device comprises a plating tank for holding a plating liquid, an anode that is arranged inside the plating tank and has a plurality of through holes, a substrate holder that holds a substrate opposite the anode, a diaphragm that is arranged against a first surface of the anode that is on the substrate side, and a back surface plate that is arranged opposite a second surface of the anode that is on the reverse side from the first surface at a prescribed gap from the second surface and regulates the amount of bubbles that arise from the anode and accumulate on the second surface.
An information processing device (5) comprises: an information acquisition unit (500) that acquires operating status information including top ring status information, polishing table status information, polishing fluid supply nozzle status information, dresser status information, and atomizer status information as operating states when a substrate processing device that performs a chemical-mechanical polishing treatment on a substrate is operated; and a status prediction unit (501) that predicts polishing pad status information for the operating status information by inputting the operating status information acquired by the information acquisition unit (500) into a learning model (10A) that has been trained by machine learning to learn correlations between the operating status information and the polishing pad status information.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B24B 37/12 - Lapping plates for working plane surfaces
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
42.
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE-LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
This information processing device (5) comprises: an information acquisition unit (500) which acquires operation state information including substrate maintenance unit state information, cleaning fluid supplying unit state information, substrate cleaning unit state information, and cleaning tool cleaning unit state information as an operation state at the time of operation of a substrate processing device including a substrate maintenance unit that maintains a substrate, a cleaning fluid supplying unit that supplies a substrate cleaning fluid to a substrate, a substrate cleaning unit that supports the cleaning tool to be rotatable, brings the cleaning tool into contact with the substrate, and cleans the substrate, and a cleaning tool cleaning unit that cleans the cleaning tool with the cleaning tool cleaning fluid; and a state prediction unit (501) which predicts cleaning tool state information for the operation state information by inputting the operation state information acquired by the information acquisition unit (500) to a learning model which is trained through machine-learning with the correlation between the operation state information and the cleaning tool state information.
The present invention relates to a coupling device for coupling a rotating body such as such as a polishing head and dresser to a rotating shaft. The present invention further relates to a device for attaching and detaching the rotating body coupled to the rotating shaft via this coupling device. A coupling device (40) is used to couple a rotating body (7) to a rotating shaft (23). The coupling device (40) comprises: a flange (45) which is attached to the rotating body (7) and has a coupling shaft (45a); and a fastening structure (50) which fastens the rotating body (7) to the rotating shaft (23) via the coupling shaft (45a).
F16D 1/00 - Couplings for rigidly connecting two coaxial shafts or other movable machine elements
F16D 1/04 - Couplings for rigidly connecting two coaxial shafts or other movable machine elements for connecting two abutting shafts or the like with hub and longitudinal key
F16D 1/06 - Couplings for rigidly connecting two coaxial shafts or other movable machine elements for attachment of a member on a shaft or on a shaft-end
F16D 1/092 - Couplings for rigidly connecting two coaxial shafts or other movable machine elements for attachment of a member on a shaft or on a shaft-end with hub and longitudinal key with radial clamping due to axial loading of at least one pair of conical surfaces the pair of conical mating surfaces being provided on the coupled hub and shaft
F16D 1/093 - Couplings for rigidly connecting two coaxial shafts or other movable machine elements for attachment of a member on a shaft or on a shaft-end with hub and longitudinal key with radial clamping due to axial loading of at least one pair of conical surfaces using one or more elastic or segmented conical rings forming at least one of the conical surfaces, the rings being expanded or contracted to effect clamping
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention pertains to a polishing method and a polishing device for polishing a peripheral portion of a substrate such as a wafer. The polishing method includes: holding a substrate (W) and rotating the substrate (W) by means of a substrate-holding unit (5); and polishing a second polishing area in a peripheral portion of the substrate (W) by moving or tilting a second polishing head (10B) in a second direction (D2) in a state where a second polishing tape (2B) is pressed against the peripheral portion of the substrate (W) by the second polishing head (10B) while polishing a first polishing area in the peripheral portion of the substrate (W) by moving or tilting a first polishing head (10A) in a first direction (D1) in a state where a first polishing tape (2A) is pressed against the peripheral portion of the substrate (W) by the first polishing head (10A), wherein the first direction (D1) and the second direction (D2) are opposite directions.
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
This substrate polishing device performs a polishing process on a processing surface of a substrate and comprises a grinding module in which a first grinding member and a second grinding member that has a larger maximum diameter than the first grinding member are disposed, a polishing module including a polishing member, and a control device that controls the grinding module and the polishing module. The control device controls the grinding module so as to perform first grinding on a part of the processing surface by the first grinding member and second grinding on the processing surface by the second grinding member, and controls the polishing module so as to polish the processing surface that has been subjected to the first grinding and the second grinding.
B24B 37/005 - Control means for lapping machines or devices
B24B 7/00 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 37/013 - Devices or means for detecting lapping completion
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention relates to a method for polishing a substrate such as a wafer. This method for polishing a substrate involves rotating a substrate (W) about the axis while moving the substrate(W) and a polishing head (10C) in a relative circular motion, pressing, with the polishing head (10C), a polishing tape (2B) against a surface (5a) to be polished while feeding the polishing tape (2B) in the longitudinal direction, and polishing a center region including a center (O1) of the substrate (W) and an outer region adjacent to the center region. The step for polishing the center region and the outer region includes at least two polishing steps that are performed under different polishing conditions. The at least two polishing steps include a low polishing rate step that is performed under polishing conditions in which the polishing rate of the center region is lower than that of the outer region, and a high polishing rate step that is performed under polishing conditions in which the polishing rate of the center region is higher than that of the outer region.
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 21/06 - Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention relates to a pump system and an engine system. Provided is a pump system (PS) appliable to an engine system (ES) mounted in a space navigation body. The pump system (PS) is provided with: a motor (M); a first pump (P1) that includes a first impeller (IM1) fixed to a rotational shaft (RS) and supplies an oxidizing agent; and a second pump (P2) that includes a second impeller (IM2) fixed to the rotational shaft (RS) and supplies a fuel material.
Provided is a technique capable of improving the throughput of pre-wet processing. This substrate pre-wet processing method comprises: a step for placing a substrate Wf, in which a recess Wfb for wiring formation is formed on a surface Wfa, inside a chamber 10, and supplying a gas Ga having a higher solubility in water than air into the chamber 10 to replace the air inside the chamber with the gas; and a step for supplying a processing liquid PL containing water as a main component to the surface Wfa of the substrate after replacing the air inside the chamber with the gas to wet the surface with the processing liquid.
The present invention pertains to a filter structure and a liquid circulation system. This filter structure (10) comprises a filtering unit (11). The filtering unit (11) comprises a fine mesh filter (15), a coarse mesh filter (16), and a block frame (17). The block frame (17) comprises a first foreign substance reservoir (20) and a second foreign substance reservoir (21).
B01D 35/02 - Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks
B01D 29/50 - Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups ; Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition
The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. A polishing head (10) comprises a pressing member (12) that presses a polishing tape (2) against a substrate (W), an actuator (15) that moves the pressing member (12) in a predetermined pressing direction (CL) and applies a pressing force to the pressing member (12), and a tilt adjusting mechanism (40) that adjusts the tilt of the pressing member (12) with respect to the pressing direction (CL). The tilt adjusting mechanism (40) is configured to tilt the pressing member (12) with respect to the pressing direction (CL) and keep the angle of the tilted pressing member (12).
An information processing device (5) comprises: an information acquisition unit (500) for acquiring a finishing process condition including substrate holding unit state information indicating the state of a substrate holding unit for holding a substrate as well as finishing fluid supply unit state information indicating the state of a finishing fluid supply unit for supplying a substrate finishing fluid to the substrate in a substrate finishing process performed by a substrate processing device provided with the substrate holding unit and the finishing fluid supply unit; and a state prediction unit (501) for inputting the finishing process condition acquired by the information acquisition unit (500) into learning models (10A, 10B) that have been trained by machine learning with a correlation between the finishing process condition and substrate state information indicating a state of the substrate having been subjected to the finishing process under the finishing process condition, so as to predict substrate state information for the substrate having been subjected to the finishing process under the finishing process condition.
The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. The polishing head (10) for polishing the substrate (W) comprises: a pressing member (12) for pressing the polishing tape (2) against the substrate (W); a pressing member holder (30) for holding the pressing member (12); and an actuator (15) connected to the pressing member holder (30) and imparting a pressing force to the pressing member (12). The pressing member (12) is formed in a rod-shape having both ends (12a), and the pressing member (12) is fitted to a groove (50) formed in a pressing surface (30a) of the pressing member holder (30).
The present invention accurately detects the end point of polishing. This polishing device comprises: a polishing table for holding a polishing pad; a holder for holding an object to be polished so as to face the polishing pad; at least one of a motor for rotationally driving the polishing table, a motor for rotating the holder holding the object, and a motor for rocking the holder holding the object; one or more drivers that are configured so as to supply drive current to the at least one motor and further output a digital signal according to the load of the at least one motor; and an end point detection unit that detects a polishing end point, which indicates the end of polishing of the object, on the basis of the digital signal output from the drivers.
B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
54.
POLISHING ENDPOINT DETECTION METHOD, POLISHING ENDPOINT DETECTION SYSTEM, POLISHING DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM
The present invention pertains to a method and system for detecting the polishing endpoint of a workpiece which is used in the production of a semiconductor device such as a wafer, a substrate or a panel. This method involves: obtaining a polishing monitoring value which expresses the degree of workpiece (W) polishing progress when polishing a workpiece (W); generating time-series data which expresses a change in the polishing monitoring value which corresponds to the workpiece (W) polishing time; inputting polishing monitoring values (VF1, VF2) and polishing times (TF1, TF2), which constitute characteristic data points (FP1, FP2) included in the time-series data, into a trained model (34); and outputting a polishing endpoint prediction time from the trained model (34).
B24B 37/013 - Devices or means for detecting lapping completion
B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention pertains to a substrate polishing device for polishing a substrate such as a wafer, and particularly to a substrate polishing device for polishing a notch section of the substrate, a bevel section of the substrate, a device surface of the substrate, and the back surface of the substrate. This substrate polishing device includes a first polishing module, a second polishing module, and a third polishing module, and the first polishing module, the second polishing module, and the third polishing module are polishing modules respectively polishing different areas of the substrate.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
The present invention proposes a plating apparatus and the like that can improve uniformity of plated films formed on substrates. The plating apparatus comprises: a plating tank; a substrate holder for holding a substrate; and an anode holder that is disposed in the plating tank so as to face the substrate held on the substrate holder, and that is configured to hold a soluble anode; an anode mask that is attached to the anode holder and that has an opening through which electric current flowing between the anode and the substrate passes; an adjustment mechanism configured so as to adjust the dimension of the opening of the anode mask; and a controller for controlling the adjustment mechanism on the basis of the electrolyzed amount of the anode while the anode is being used.
Provided is a technology for uniformly supplying powder as a material to a DED nozzle. An embodiment provides an AM device for manufacturing a molded product, the AM device comprising a DED nozzle. The DED nozzle includes: a powder opening for injecting a powder material, provided in a fore end of a DED nozzle body; and a powder channel for letting the powder material through the DED nozzle body, communicatively connected to the powder opening. The AM device further comprises: a first pipe; a separator wall extending from an end of the first pipe to an upstream side inside the first pipe; and a plurality of second pipes coupled to the end of the first pipe. The separator wall partitions the end of the first pipe into a plurality of regions. The plurality of second pipes are coupled respectively to the plurality of regions of the first pipe. The second pipes are coupled to the powder channel of the DED nozzle.
B22F 10/25 - Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
58.
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD
An information processing device (5) includes: an information acquisition unit (500) that in a chemical mechanical polishing process of a substrate performed by a substrate processing apparatus including a polishing table rotatably supporting a polishing pad and a top ring for pushing the polishing pad against the substrate, acquires polishing process state information including top-ring vibration information indicating vibration of the top ring during polishing and top-ring sound information indicating sound generated from the top ring during polishing: and a state prediction unit (501) that inputs the polishing process state information acquired by the information acquisition unit (500) to a learning model (10A) that has learned, through machine learning, correlation between the polishing process state information and substrate slipping-out information indicating occurrence of slipping out of the substrate subjected to the chemical mechanical polishing process, to predict the substrate slipping-out information relative to the polishing process state information.
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 37/30 - Work carriers for single side lapping of plane surfaces
The present invention relates to a pump unit. A pump unit (PU) is provided with a connector (400) that connects a plurality of motor pumps (MP). The connector (400) connects a front-stage-side ejection casing (22) and a rear-stage-side suction casing (21).
The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. The polishing head (10) comprises: a pressing mechanism (12) which presses a polishing tape (2) against a substrate W; and a tape hook (40) which restricts the movement of an edge of the polishing tape (2) in a direction toward the substrate (W). The tape hook (40) has a tape-positioning surface (47) that faces the polishing surface of the edge of the polishing tape (2).
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 21/06 - Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
The present invention provides a plating apparatus having a shielding member, wherein the uniformity of the plating film thickness distribution is improved by arranging a resistor close to a surface to be plated of a substrate. A plating apparatus according to the present invention comprises: a plating bath 410 which is configured so as to contain a plating solution; a substrate holder 440 which holds a substrate Wf, with a surface Wf-a to be plated facing down; an anode 430 which is arranged within the plating bath 410; a resistor 450 which is arranged between the substrate Wf and the anode 430 and has a facing surface 450-a that faces the surface Wf-a to be plated, wherein the facing surface 450-a has a first facing surface 450-a1 and a second facing surface 450-a2 that is more distant from the surface Wf-a to be plated than the first facing surface 450-a1; and a shielding member 481 which is arranged in a recessed region β of the resistor 450 and is used for the purpose of shielding an electric field, the recessed region β being formed by the second facing surface 450-a2.
The present invention relates to a motor pump and a motor pump assembly. The motor pump (MP) has a rotation-side grip structure (100) by which an impeller (1) can grip a rotation-side bearing structure (11).
An information processing device (5) comprises: an information acquisition unit (500) that acquires substrate processing fluid supply information including substrate processing fluid supply state information which indicates the state of supply of a substrate processing fluid that is supplied from a substrate processing fluid supply unit (222, 242a, 245a), in processing of a substrate (W) which is performed by a substrate processing device (2); and a state prediction unit (501) that predicts substrate processing fluid supply position information corresponding to the substrate processing fluid supply information by inputting the substrate processing fluid supply information to a learning model which has learned, by machine learning, correlations between substrate processing fluid supply information and substrate processing fluid supply position information, said substrate processing fluid supply position information indicating the supply position of the fluid that is supplied by the substrate processing fluid supply unit when the substrate processing device operates.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B24B 37/00 - Lapping machines or devices; Accessories
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
The present disclosure provides a plating device and a drying method that make it possible to keep an electrical contact dry. This plating device comprises a blow module and a substrate holder that holds a substrate and has an electrical contact for supplying power to the substrate. The blow module has a substrate holder stage for supporting the substrate holder, a drying nozzle assembly that has a nozzle for spraying a gas at the substrate and the substrate holder, and an actuator for moving the drying nozzle assembly such that the nozzle moves in a plane along the surface of the substrate.
This information processing device (5) comprises: an information acquisition unit (500) which acquires operation state information including an operation state when a substrate processing device (2) including a substrate holding unit (241) operates; and a state prediction unit (501) which predicts substrate holding mechanism part state information for the operation state information by inputting the operation state information to a training model for which a correlation between the operation state information and the substrate holding mechanism part state information is trained through machine learning, the substrate holding mechanism part state information indicating the states of substrate holding mechanism parts (241a, 241c, 241e) when the substrate processing device (2) operates in the operation state indicated by the operation state information.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B24B 37/30 - Work carriers for single side lapping of plane surfaces
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
The present invention enables specific parts of a substrate to be shielded at a desired timing and improves uniformity in plating film thickness. In this invention, a plating module includes: a plating bath 410 for accommodating a plating solution; an anode 430 disposed inside the plating bath 410; a substrate holder 440 for holding a substrate Wf with a surface Wf-a to be plated facing downward; a rotating mechanism 447 configured to cause the substrate holder 440 to rotate in a first direction and in a second direction which is opposite to the first direction; and a shielding mechanism 485 for causing a shielding member 481 to move to a position between the anode 430 and the substrate Wf in accordance with a rotation angle of the substrate holder 440.
The present invention relates to a power cable for supplying power to a submersible pump for raising the pressure of a liquefied gas such as liquefied ammonia, liquefied natural gas (LNG), or liquid hydrogen. The present invention further relates to: a method for carrying a submersible pump into a pump column by using such a power cable; and to a method for pulling up the submersible pump from the pump column. A power cable (36) is for supplying power to a submersible pump (2) disposed inside a pump column (3) in order to transfer liquefied gas, the power cable comprising: a plurality of split power cables (36A); and a plurality of cable connectors (36B) electrically connecting the plurality of split power cables (36A).
The present invention provides a container capable of increasing the temperature of a liquid hydrogen pump during maintenance and a system including such a container. Provided is a maintenance system used for the maintenance of the liquid hydrogen pump, the maintenance system comprising: a hollow container main body which allows the liquid hydrogen pump to pass therethrough during maintenance and which has one or more inlets and one outlet; a circulation flow path connecting the outlet and the one or more inlets; a blower which is provided on the circulation flow path and which guides helium gas from the outlet into the one or more inlets to thereby circulate the helium gas in the circulation flow path; and a heat exchanger which increases, by the atmosphere, the temperature of the helium gas passing through the circulation flow path.
F17C 9/00 - Methods or apparatus for discharging liquefied or solidified gases from vessels not under pressure
F17C 13/00 - VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES - Details of vessels or of the filling or discharging of vessels
Provided is a container capable of preventing gas from leaking from a cable penetration hole. Hollow containers 3, 4 are provided above a hollow column 2 provided around a liquefied gas pump P. The center parts of the containers 3, 4 are penetrated from the bottom toward the top by a cable 8 for installing and pulling out the liquefied gas pump P. The containers 3, 4 comprise: lower plate members 5, 6 having, in center parts, cable through holes 9, 10 that can be penetrated by the cable 8; and stuffing box members 12 provided around the cable through holes 9, 10 in the center parts of the lower plate members 5, 6 and having center parts with cable insertion holes 13 through which the cable 8 is inserted. The stuffing box members 12 comprise opening diameter adjustment mechanisms 14, 20 that adjust the sizes of the opening diameters of the cable insertion holes 13.
The present invention relates to a substrate processing method and a substrate processing device for processing a substrate such as a wafer. In this substrate processing method, a substrate (W) having a notch (Nw) is rotated and moved in a circular motion by bringing rollers (11a, 11b), which are fixed to eccentric shafts (13a, 13b) including a reference shaft (13a) and a movable shaft (13b), into contact with a peripheral edge of the substrate (W) and moving the rollers (11a, 11b) in a circular motion, and a processing tool (201) is brought into contact with the substrate (W) to process the substrate (W). During the processing of the substrate (W), a rotation speed of the substrate (W) is calculated on the basis of a measured value of a notch detection sensor (77) for detecting passage of the notch (Nw) through the movable shaft (13b), and, if the rotation speed of the substrate (W) deviates from an allowable range set for a theoretical rotation speed of the substrate (W), an alert is given.
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
Provided is a technology with which it is possible to inhibit deformation of a film disposed inside of a plating tank. This maintenance method for a plating device includes: returning an anolyte in an anodic chamber to an anolyte tank and then circulating the anolyte between the anolyte tank and the anodic chamber (step S10e); and returning a catholyte in a cathodic chamber to a catholyte tank and then circulating the catholyte between the catholyte tank and the cathodic chamber after the circulation of the anolyte between the anolyte tank and the anodic chamber has been initiated (step S10f).
This hollow container (13) is provided above a hollow column (11) which surrounds a liquefied gas pump (P). The container (13) is equipped with: a lower plate member (22a, b) capable of opening and closing the lower section of the container (13); a manual opening/closing device (34a, b) operated in order to open and close the lower plate member (22a, b) inside the container (13); a glovebox (35a, b) configured in a manner such that a user can insert a hand therein from outside the container (13) in order to operate the manual opening/closing device (34a, b) inside the container (13); and an operation window (33a, b) positioned near the glovebox (35a, b) and the manual opening/closing device (34a, b) in a manner such that the glovebox (35a, b) and the manual opening/closing device (34a, b) are visible from outside the container (13).
F17C 13/00 - VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES - Details of vessels or of the filling or discharging of vessels
73.
METHOD FOR POLISHING SUBSTRATE, SUBSTRATE POLISHING DEVICE, AND COMPUTER-READABLE RECORDING MEDIUM IN WHICH PROGRAM IS RECORDED
The present invention relates to a method for polishing a substrate by pressing an abrasive tape against a substrate such as a wafer. This method for polishing a substrate: stores in a database (21a) an actual polishing condition for a substrate previously polished and an actual used amount of the abrasive tape in the actual polishing condition in association with each other; prior to polishing a substrate to be polished, searches from the database (21a) the actual polishing condition corresponding to a preset polishing condition for the substrate to be polished; determines the actual used amount of the abrasive tape associated with the actual polishing condition corresponding to the preset polishing condition as an estimated used amount of the abrasive tape necessary for polishing of the substrate to be polished; and compares a remaining amount of the abrasive tape used for polishing of the substrate to be polished and the determined estimated used amount, and polishes the substrate to be polished with polishing modules (4A, 4B) when the remaining amount of the abrasive tape is at least the estimated used amount.
This substrate processing device comprises: a substrate holding portion (5) with a suction holding face (5a) for holding a first face (2a) of a substrate (W); a processing head (7) arranged to process an outer peripheral portion of the substrate (W); a static pressure plate (9) with a fluid supporting face (9a) opposed to the suction holding face (5a); and a fluid feeding line (10) connected to the static pressure plate (9) and feeding a fluid to a space between the fluid supporting face (9a) and a second face (2b) of the substrate (W). The second face (2b) is opposite to the first face (2a) of the substrate (W). The fluid supporting face (9a) is larger than the suction holding face (5a).
An information processing device (5) comprises: an information acquisition unit (500) that acquires a polishing process condition including top ring state information, polishing table state information, and polishing fluid supply nozzle state information in a chemical mechanical polishing process carried out for a substrate by a substrate processing device comprising a polishing table that rotatably supports a polishing pad, a top ring that presses the substrate against the polishing pad, and a polishing fluid supply nozzle that supplies polishing fluid to the polishing pad; and a state prediction unit (501) that inputs the polishing process condition acquired by the information acquisition unit (500) into a learning model (10A) that has been trained by machine learning with a correlation between the polishing process condition and substrate state information indicating a state of the substrate having been subjected to the chemical mechanical polishing process under the polishing process condition, to thereby predict substrate state information for the substrate having been subjected to the chemical mechanical polishing process under the polishing process condition.
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
B24B 49/14 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
B24B 55/03 - Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
76.
DRAINAGE PUMP DEVICE, DRAINAGE PUMP MANAGEMENT SYSTEM, DRAINAGE PUMP SUPPORT PLAN CREATION DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, DRAINAGE PUMP SUPPORT PLAN CREATION METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD
A drainage pump device (2) comprises a pump control unit (20) that controls operation of a pump unit (25) on the basis of the water level detected by a water level detection unit (24). The pump control unit (20) comprises: a weather information acquisition unit (201) that acquires weather information of a monitoring location; an anomaly determination unit (202) that determines whether or not an anomaly has occurred in the water level detection unit (24) or the pump unit (25); a water level detection unit anomaly processing unit (203) that controls operation of the pump unit (25) on the basis of the weather information when it is determined that the anomaly has occurred in the water level detection unit (24); and a pump unit anomaly processing unit (204) that, when it is determined that the anomaly has occurred in the pump unit (25), outputs, on the basis of the water level detected by the water level detection unit (24) and/or the weather information, support request information for requesting support for drainage work performed by a drainage pump vehicle and a worker.
Provided is a technology that enables the removal of air bubbles that have adhered to holes of an ion resistor. A plating method comprises: stirring a plating liquid by driving a paddle disposed above an ion resistor in a state in which the ion resistor and an anode are immersed in the plating liquid (step S20); immersing a substrate, which serves as a cathode, into the plating liquid in a state in which the stirring of the plating liquid by the paddle is stopped (step S40); restarting, in a state in which the substrate is immersed in the plating liquid, the stirring of the plating liquid by the paddle which is disposed above the ion resistor and below the substrate (step S50); and performing a plating process on the substrate by flowing electricity between the substrate and the anode in a state in which the stirring of the plating liquid by the paddle has been restarted (step S60).
The present invention relates to a volute pump that does not have a rotating shaft coupled to an impeller. A casing (6) of a pump (1) comprises: at least three tongue portions (21A, 21B, 21C) arranged at equal intervals around an impeller (7); and at least three side walls (22A, 22B, 22C) connected respectively to the tongue portions (21A, 21B, 21C). The side walls (22A, 22B, 22C) form at least three flow passages (23A, 23B, 23C) for a fluid. Each of the side walls (22A, 22B, 22C) has a volute side surface (30A, 30B, 30C) which extends from one of the tongue portions (21A, 21B, 21C) to a position beyond another adjacent tongue portion. The pump (1) is not provided with a radial bearing for supporting the impeller (7).
A substrate polishing device comprising an optical sensor for detecting the state of a substrate surface, wherein the accuracy of detection by the optical sensor is improved. Proposed is a polishing pad for a substrate polishing device comprising an optical sensor. This polishing pad comprises: a pad body of which the surface constitutes a polishing surface, the pad body having a through-hole formed therein; and a window member for allowing passage of sensing light from the optical sensor, the window member being accommodated in the through-hole. The pad body has a surrounding recess that surrounds an edge section defining the through-hole, the surrounding recess being recessed into the polishing surface from the edge section. The surrounding recess communicates with a groove extending in the outer peripheral surface of the polishing pad.
B24B 37/20 - Lapping pads for working plane surfaces
B24B 37/12 - Lapping plates for working plane surfaces
B24B 37/26 - Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
80.
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
The present invention pertains to a substrate processing device for processing substrates such as a wafer, and particularly to a substrate processing method and a substrate processing device which polish a bevel section of a substrate and perform a CMP process on a flat surface section of the substrate. The substrate processing method involves: polishing, with a polishing tool, bevel sections (B) of a plurality of substrates (W) so that the tilt angles (α) of tilt surfaces (S) of bevel sections (B) of the plurality of substrates (W) are equal to each other; and performing a CMP process on planar sections (P) of the plurality of substrates (W) in which the bevel sections (B) have been polished.
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 49/02 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The purpose of the present invention is to suppress the adhesion of a wafer to a back plate assembly. This plating apparatus comprises: a plating bath configured so as to accommodate a plating solution; a wafer holder configured so as to hold a wafer Wf such that a surface to be plated Wf-a thereof is oriented downward; and a raising/lowering mechanism configured so as to raise and lower the wafer holder. The wafer holder comprises: a support mechanism 460 configured so as to support the outer periphery of the surface to be plated Wf-a of the substrate Wf; a back plate assembly 470 that is disposed on the reverse surface side of the wafer Wf from the surface to be plated Wf-a, and is configured so as to sandwich the wafer Wf together with the support mechanism 460; and a separation mechanism 471 configured so as to apply force for separating the wafer Wf from the back plate assembly 470 to the reverse surface of the wafer Wf from the surface to be plated Wf-a.
This load adjustment system comprises: a bevel polishing device having a polishing head that polishes a bevel portion of a substrate; and a control device. The control device acquires, from a load measuring device that measures a pressing load from the polishing head, measurement data obtained by the measurement, calculates an adjustment value for adjusting the pressing load, on the basis of the measurement data and a setting parameter set for the polishing head, and controls a pressing operation of the polishing head on the basis of the adjustment value.
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention relates to a substrate processing device that processes a substrate. A substrate processing device (10) that comprises: at least one first processing module (21a, 21b) that uses a fluid and processes a substrate W; at least one second processing module (31) that treats the substrate processed by the first processing module (21a, 21b); a conveying robot (22) that is disposed in a conveying area (28) and conveys the substrate W from the first processing module (21a, 21b) to the second processing module (31); a pair of gutters (53, 54) that are disposed above the floor (51) of the conveying area (28) and are connected to a drain line (58); and at least one inclined plate (56) that spans the pair of gutters (53, 54). The upper surface of the inclined plate (56) extends at an angle relative to the horizontal direction, from one of the gutters (53, 54) in the pair to the other.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
84.
PLATING DEVICE, AND PLATING DEVICE PRODUCTION METHOD
The present invention facilitates maintenance of a component disposed at the bottom of a face-down type plating device. The plating device is equipped with: a plating tank for holding a plating solution; a substrate holder that holds a substrate with a surface to be plated facing downward; a drawer unit that is attached to the plating tank so as to be capable of being freely pulled out in a horizontal direction, and that has an anode disposed so as to face the substrate in the plating tank, and a variable anode mask which has an opening exposing the anode and which is capable of adjusting the opening dimension of the opening.
The purpose of the present invention is to efficiently clean a substrate. This plating module 400 includes a plating tank 410 configured to accommodate a plating solution, a substrate holder 440 configured to hold a substrate Wf in which a surface Wf-a to be plated is facing downwards, a rotation mechanism 446 configured to rotate the substrate holder 440, a tilting mechanism 447 configured to tilt the substrate holder 440, and a substrate-cleaning member 472 for cleaning the surface Wf-a to be plated of the substrate Wf held by the substrate holder 440. The substrate-cleaning member 472 is configured to discharge a cleaning solution onto the surface Wf-a to be plated of the substrate Wf rotated by the rotation mechanism 446, from a position corresponding to the lower edge towards a position corresponding to the upper edge of the substrate Wf tilted by the tilting mechanism 447.
Provided is a technique for achieving both of the cleaning of a substrate and the prevention of the release of a plating solution atmosphere in a plating vessel into a plating module. The plating module includes: a plating vessel 410 that is so configured as to accommodate a plating solution therein; a substrate holder that is so configured as to hold a substrate Wf with the plating surface of the substrate Wf downward; a lifting and lowering mechanism that is so configured as to lift and lower the substrate holder; a cover member 460 that is positioned above the plating vessel 410 and has a side wall 461 surrounding a lifting and lowering route for the substrate holder; an opening and closing mechanism that is so configured as to open and close an opening 461a formed in the side wall 461 of the cover member 460; a substrate cleaning member 472 for ejecting a cleaning solution toward the plating surface of the substrate Wf held by the substrate holder; and a driving mechanism 476 that is so configured as to move the substrate cleaning member 472 between a cleaning position located between the plating vessel 410 and the substrate holder and an evacuation position evacuated from an area between the plating vessel 410 and the substrate holder via the opening 461a.
Provided is a plating module comprising: a plating vessel which is so configured as to accommodate a plating solution therein; a substrate holder which is so configured as to hold a substrate with a plating surface of the substrate downward; a rotation mechanism which is so configured as to rotate the substrate holder; a contact member 494-4 which has a substrate contacting point 494-4a that comes into contact with the outer peripheral part of the plating surface of the substrate held by the substrate holder and a main body part 494-4b that extends upward relative to the substrate contacting point 494-4a and which is attached to the substrate holder; and a contact cleaning member 482 for ejecting a cleaning solution toward the main body part 494-4b of the contact member 494-4 from under the substrate holder.
The present invention provides a technology that is capable of suppressing the degradation in substrate plating quality caused by air bubbles that remain on the entire lower surface of a membrane. A plating device 1000 equipped with a plating tank 10, a substrate holder 20, and a membrane module 40, wherein the membrane module is equipped with a first membrane 41 and a second membrane 42, and the second membrane includes an inflow port 42c for allowing plating liquid in a first region R1 below the second membrane to flow into a second region R2 above the second membrane and below the first membrane, and an inclined part 42b that is inclined with respect to the horizontal direction, and that is inclined so as to be upwards from the center-side of an anode chamber towards the outer edge of the anode chamber.
The purpose of the present invention is to suppress variations in the supply of power to a contact member. In the present invention, a wafer holder comprises: a frame-shaped support mechanism that is suspended and held by a plurality of support columns, and is configured so as to support the outer periphery of a surface to be plated of a wafer; a back plate assembly that is disposed on the reverse surface side of the wafer from the surface to be plated, and is configured so as to sandwich the wafer together with the support mechanism; a contact member 468 that is disposed on the support mechanism; and a plurality of power source line members 461. The contact member 468 has a power supply contact that contacts the outer periphery of the surface to be plated of the wafer, and a plurality of power source connection parts 469b that are connected to a power source. The plurality of power source line members 461 are respectively connected from the power source to the plurality of power source connection parts 469b through the plurality of support columns, and are arranged such that the distances from from the power source to the respective power source connection parts 469b are equal.
The present invention relates to a fixed bearing structure and a motor pump. The fixed bearing structure (12) comprises a fixed bearing body (40) and a blocking body (41) of a size that enables a circulation flow path (R2) of a motor casing (30) to be blocked.
The present invention relates to a polishing device and a polishing method. This polishing device comprises a holding stage (4), a polishing head (14), and a control device (1). The control device (1) comprises a determination unit (1d) that determines the removal of a film (F). The determination unit (1d) decides to remove the film (F) when the rotational torque value is stable at a set torque value.
B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
92.
HYDROGEN PRODUCTION METHOD AND HYDROGEN PRODUCTION DEVICE
C01B 3/40 - Production of hydrogen or of gaseous mixtures containing hydrogen by reaction of gaseous or liquid organic compounds with gasifying agents, e.g. water, carbon dioxide, air by reaction of hydrocarbons with gasifying agents using catalysts characterised by the catalyst
C01B 3/56 - Separation of hydrogen or hydrogen containing gases from gaseous mixtures, e.g. purification by contacting with solids; Regeneration of used solids
H01M 8/04 - Auxiliary arrangements, e.g. for control of pressure or for circulation of fluids
H01M 8/0612 - Combination of fuel cells with means for production of reactants or for treatment of residues with means for production of gaseous reactants from carbon-containing material
B01J 23/83 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group of the iron group metals or copper combined with metals, oxides or hydroxides provided for in groups with rare earths or actinides
One purpose of the present invention is to provide technology for suppressing the degradation of a seed layer of a substrate. Provided is a plating method comprising: a step in which a substrate is held by a substrate holder, and, in a state where the substrate holder is holding the substrate, a sealing space is formed that protects a contact for supplying electricity to the substrate from a plating solution, and in the sealing space, sites where the substrate and the contact make contact are locally covered with a liquid; a step in which the substrate held by the substrate holder is immersed in the plating solution and made to face an anode; and a step in which, in a state where the sites where the substrate and the contact make contact are locally covered with the liquid, a current is supplied between the substrate and the anode so as to plate the substrate.
The present invention relates to a substrate processing apparatus for processing a substrate such as a wafer, in particular to a substrate processing apparatus that presses a processing tool against a surface of the substrate while holding the peripheral edge of the substrate with a rotary roller, to process the surface of the substrate. This substrate processing apparatus comprises: a plurality of rollers (11A-11D) arranged around a reference center point (CP) and disposed in contact with the peripheral edge of a substrate W; a pressing member (21A) that presses a processing tool (3) against an outer peripheral portion of the surface of the substrate W; and an actuator (22A) that provides the pressing member (21A) with a pressing force. Two (11A, 11B) of the plurality of rollers (11A-11D) are disposed adjacent to the pressing member (21A) on both sides of the pressing member (21A).
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 41/06 - Work supports, e.g. adjustable steadies
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
The present invention provides a technique that is capable of preventing the degradation in the plating quality of a substrate caused by air bubbles that remain on the entire area of a lower surface of a film. The plating method comprises: a step for guiding an anode solution to a second region R2 that is positioned below a film 40 and above a first region R1 to reduce the concentration of air bubbles contained in the anode solution at the second region to a value smaller than the concentration of air bubbles contained in the anode solution at the first region; a step of discharging the anode solution from the first region; a step for discharging the anode solution from the second region; a step for supplying a cathode solution to a cathode chamber 12 in which a substrate Wf is placed; and a step for applying an electric current between the substrate Wf and an anode 13 to electrically plate the substrate with a metal.
The present invention pertains to an impeller and a pump. Impeller (2) comprises: a shaft insertion hole (50); a fastening hole (51) having a smaller diameter than the shaft insertion hole (50); and a sleeve insertion hole (52) having a greater diameter than the shaft insertion hole (51).
Proposed is a pre-wet treatment method whereby a pre-wet treatment can be applied to a substrate effectively without affecting through-put. Also proposed is a pre-wet treatment method for subjecting a substrate to a pre-wet treatment that is to be performed before a plating treatment of the substrate in a plating apparatus. The pre-wet treatment method comprises: a step for calculating a maximum treatment time in a pre-wet module on the basis of a rate-control process for rate-controlling treatments in the whole plating apparatus; a step for calculating a minimum moving rate of a nozzle head in the pre-wet module on the basis of the calculated maximum treatment time; and a step for moving the nozzle head at a rate equal to or higher than the calculated minimum moving rate to supply the pre-wet solution to the surface of the substrate.
This fluid machine system comprises: an acquisition unit an acquisition unit that acquires a discharge flow rate of a target pump in addition to model identification information for the target pump, or acquires a set including discharge pressure, suction pressure, and cage height in addition to the model identification information of the target pump; and a determination unit that, when a discharge flow rate of the target pump has been acquired, refers to characteristic data corresponding to the model identification information for the target pump to identify a total pump head corresponding to the discharge flow rate, and compares the total pump head and the characteristic data for the discharge flow rate at each operating frequency when the pump is operated by a synchronous motor to determine an operating frequency such that the discharge flow rate and the pump head will be achieved, or that, when the set including discharge pressure, suction pressure, and cage height has been acquired, determines a total pump head using the discharge pressure, suction pressure, and cage height, identifies a discharge flow rate corresponding to the total pump head in characteristic data for the total pump head and the discharge flow rate when the pump is operated by an induction motor, and compares the total pump head when the pump is operated by a synchronous motor and characteristic data for the discharge flow rate at each operating frequency to determine an operating frequency of the inverter such that the discharge flow rate and the pump head will be achieved.
An information processing device (5) comprises: an information acquisition part (500) for acquiring crack generation state information that includes crack state information indicating a crack state at a time when crack has been generated on a substrate and device state information indicating the state of a polishing unit at a time when a substrate treatment process has been performed on the substrate; and a crack generation step identification part (501) for identifying a step that is the cause of the generation of crack on the substrate, by inputting the crack generation state information acquired by the information acquisition part (500) in accordance with the generation of crack on the substrate to a learning model (11) trained by machine learning of correlations each between crack generation state information and crack generation step information indicating a step that is among the steps included in the substrate treatment process and that is a cause of the generation of crack on the substrate.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B24B 37/005 - Control means for lapping machines or devices
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
100.
SUBSTRATE SUCTION MEMBER, ELASTIC SEAL ASSEMBLY, TOP RING, AND SUBSTRATE PROCESSING DEVICE
The present invention reliably suctions a substrate regardless of the flatness of a surface to be suctioned of the substrate. A substrate suction member 330 includes: a porous member 334 having a substrate suction surface 334a for suctioning a substrate WF, and a decompression part 334b communicating with a decompression means; a shield member 332 having a first shield member 332-1 for shielding a surface 334c on the opposite side to the substrate suction surface 334a of the porous member 334, and a frame-shaped second shield member 332-2 for shielding at least a portion of a side surface 334d of the porous member 334; and a frame-shaped elastic seal member 336 attached to the second shield member 332-2 so as to surround the porous member 334, and having a contact surface 336a contacting the substrate WF.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping