A retainer holds reference data for identifying a first AC generated signal corresponding to an output signal output in a reference state from a detection coil. When a film thickness of a conductor is to be measured, an AC signal generator generates the first AC generated signal based on the reference data and outputs it as a reference signal. When a film thickness of a conductor is to be measured, a difference circuitry receives input of an output signal and a reference signal output from the AC signal generator and acquires and outputs a film thickness amplitude that is a difference between the amplitude of the film thickness signal and the amplitude of the reference signal. The data generator in the reference state measures an amplitude of the output signal and generates the reference data.
G01B 7/06 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width, or thickness for measuring thickness
B24B 37/013 - Devices or means for detecting lapping completion
A polishing apparatus 1 includes a control device 90. The control device 90 performs: a cleaning process of causing a cleaning solution to flow in a flow channel 70a and then causing a polishing solution to flow in the flow channel 70a when the number of substrates Wf polished by a polishing machine 10 reaches a predetermined number; and a clogging detecting process of detecting whether clogging has occurred in the flow channel based on a pressure or a flow rate of the cleaning solution detected by sensors 60 and 61 when the cleaning solution flows in the flow channel.
An exhaust-gas treatment apparatus capable of efficiently making a harmful gas containing in an exhaust gas harmless without increasing a size of the apparatus is disclosed. The exhaust-gas treatment apparatus includes a main body in which a flow passage is formed for a liquid to flow, an exhaust-gas supply line to be coupled to the main body, and for supplying the exhaust gas to the flow passage through which the liquid flows, a suction device configured to suck the exhaust gas from the exhaust-gas supply line into the flow passage, a low-temperature plasma generator for generating low-temperature plasma in the flow passage to decompose the harmful gas, and a discharge line for discharging the exhaust gas, which has passed through the low-temperature plasma generator, from the main body.
B01D 53/32 - Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by electrical effects other than those provided for in group
The present invention relates to a polishing apparatus and a polishing method for polishing a flat portion of a substrate, such as a wafer. The polishing apparatus (100) includes: a substrate holder configured to hold a substrate (W) and rotate the substrate W; a polishing-tape feeding mechanism (141) configured to advance a polishing tape (3) in its longitudinal direction; and at least one polishing head (10) arranged near a flat portion of the substrate (W), wherein the polishing head (10) has a fluid pressing structure (12) configured to press the polishing tape (3) with fluid against the flat portion of the substrate, and the fluid pressing structure (12) has a fluid supply port (13) arranged so as to face a back surface of the polishing tape (3).
The present disclosure provides a structure for replenishing a powder material to a material supply device during fabrication using the AM technique. According to one aspect, an AM apparatus is provided. This AM apparatus includes a DED nozzle configured to eject a powder material, a gantry mechanism configured to move the DED nozzle, and a powder supply device configured to supply the powder material to the DED nozzle. The gantry mechanism includes a Y-axis member movable in a horizontal X direction and extending in a horizontal Y direction perpendicular to the X direction. The DED nozzle and the material supply device are mounted on the Y-axis member of the gantry mechanism. The gantry mechanism includes a Y-axis movement mechanism for moving the DED nozzle and the material supply device along the Y direction on the Y-axis member.
B22F 12/55 - Two or more means for feeding material
B22F 12/00 - Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
B22F 12/90 - Means for process control, e.g. cameras or sensors
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
7.
METHOD OF DETECTING ABNORMALITY IN MEASURING OF FILM THICKNESS OF WORKPIECE, OPTICAL FILM-THICKNESS MEASURING APPARATUS, AND STORAGE MEDIUM STORING PROGRAM
A technique of detecting an abnormality in measuring of a film thickness of a workpiece, such as a wafer, is disclosed. A method includes: generating multiple spectra of reflected light from multiple measurement points on a workpiece over a predetermined period of time during polishing of the workpiece; classifying the multiple spectra into a plurality of groups including at least a first group and a second group according to feature of each of the multiple spectra; determining a monitoring index value based on at least the number of spectra included in the first group; and detecting an abnormality in measuring of the film thickness of the at least one workpiece based on comparison of the monitoring index value with a threshold value.
G01B 11/06 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness for measuring thickness
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
B24B 21/00 - Machines or devices using grinding or polishing belts; Accessories therefor
B24B 21/10 - Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a rigid member, e.g. pressure bar, table, pressing or supporting the belt over substantially its whole span
B24B 37/005 - Control means for lapping machines or devices
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 37/30 - Work carriers for single side lapping of plane surfaces
B24B 41/06 - Work supports, e.g. adjustable steadies
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
9.
PROCESSING SYSTEM, PAD TRANSPORTING APPARATUS, LIQUID-RECEIVING APPARATUS, AND POLISHING APPARATUS
An improved apparatus for use in replacing a polishing pad is disclosed. processing system includes: a polishing device configured to polish a workpiece; a pad break-in device configured to perform a pad break-in process of a polishing pad; and a pad transporting device configured to transport a pad structure from the pad break-in device to the polishing device. The pad structure includes at least the polishing pad. The pad transporting device includes a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.
The present disclosure provides a substrate processing apparatus and a protective layer forming method that can protect surfaces of metal regions after a polishing process from oxidation and adhesion of cutting chips and particles caused in a process after polishing. The substrate processing apparatus according to the present disclosure includes a polishing device for polishing a semiconductor substrate, a protective layer forming device for forming a protective layer on a surface of the substrate using a silane coupling agent or a resin protective film agent, and a control device. The control device controls the polishing device and the protective layer forming device such that the protective layer forming device forms the protective layer on the substrate after the polishing device finishes polishing the substrate.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
11.
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
To planarize a substrate having irregularities on its surface. Provided is a method of chemical mechanical polishing of a substrate. The method includes the step of polishing the substrate using a processing solution, and the step of changing concentration of an effective component in the processing solution, which contributes to the polishing of the substrate.
A substrate clamping apparatus includes a substrate holding part which is movable between a closed state in which a substrate is clamped and an open state in which clamping of the substrate is released, a support column part which supports the substrate holding part and is capable of being raised and lowered, and an interlocking mechanism which interlocks a raising and lowering operation of the support column part with an opening and closing operation of the substrate holding part, in which an opening and closing operation range A of the substrate holding part in an up-and-down stroke S of the support column part includes at least a part of an intermediate region M of the up-and-down stroke S.
A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.
A magnetic bearing apparatus capable of correcting inclination of a rotating element with a small magnetic attractive force and capable of stably supporting the rotating element is disclosed. The magnetic bearing apparatus includes: a non-magnetic ring made of non-magnetic material; and at least three axial magnetic poles arranged along a circumferential direction of the non-magnetic ring. Each axial magnetic pole has an arc-shaped coil and a coil housing that accommodates the coil therein. The at least three axial magnetic poles are fixed to the non-magnetic ring.
A substrate cleaning apparatus includes a substrate rotation supporting section that supports and rotates a substrate; a roll holding section that rotatably holds a first roll cleaning member and a second roll cleaning member each having a length almost equal to a radius of the substrate; a roll rotation drive section that rotates the first roll cleaning member and the second roll cleaning member about respective axes of rotation parallel to a front surface of the substrate; and a roll pressing section that brings the first roll cleaning member and the second roll cleaning member that are rotating into sliding contact with the front surface of the substrate. The first roll cleaning member and the second roll cleaning member are disposed so as to cover different radial parts of the front surface of the substrate.
B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
B08B 1/02 - Cleaning travelling work, e.g. a web or articles on a conveyor
B08B 3/04 - Cleaning involving contact with liquid
16.
SURFACE PROPERTY MEASURING APPARATUS FOR POLISHING PAD, SURFACE PROPERTY MEASURING METHOD FOR POLISHING PAD, AND SURFACE PROPERTY JUDGING METHOD FOR POLISHING PAD
The present invention relates to a surface property measuring apparatus for a polishing pad used for polishing a substrate, such as a semiconductor wafer, a surface property measuring method for a polishing pad, and a surface property judging mehod for a polishing pad. The surface property measuring apparatus (30) includes: a light-emitting structure (32) configured to irradiate the polishing pad (2) with light from a plurality of directions as viewed from a polishing surface (2a) of the polishing pad (2); and a light-receiving structure (32) configured to receive reflected light traveling in a plurality of directions from the surface of the polishing pad (2).
An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.
G01B 7/06 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width, or thickness for measuring thickness
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
18.
INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, PROGRAM, SUBSTRATE PROCESSING APPARATUS, CRITERION DATA DETERMINATION APPARATUS, AND CRITERION DATA DETERMINATION METHOD
An information processing apparatus detecting presence or absence of abnormality of a vacuum pump derived from a product produced within a target vacuum pump, including: a determination unit configured to determine a normal variation range or a normal time variation behavior of a target state quantity which is a state quantity varying depending on a load of gas flowing into the vacuum pump, based on at least one of past target state quantities of the target vacuum pump or another vacuum pump; and a comparison unit configured to compare a current target state quantity of the target vacuum pump with the normal variation range or the normal time variation behavior and output the comparison result.
A surface property measuring system capable of accurately measuring a surface property of a polishing pad without damaging the polishing pad and without reducing throughput of the entire polishing process is disclosed. The surface property measuring system includes: an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface; a cover member disposed between the optical measuring device and the polishing pad; and a transparent-liquid supply line coupled to an inlet port provided in the cover member and configured to supply a transparent liquid onto the polishing pad through the inlet port. The cover member has a light transmissive portion on an optical path of the light and the reflected light.
B24B 37/013 - Devices or means for detecting lapping completion
B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
B24B 49/08 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
There is provided a gas solution supply apparatus capable of preventing bubbles from being generated in use at a point-of-use even if gas solution to be provided to a point-of-use has a high concentration. The gas solution supply apparatus 1 includes: a gas dissolving unit 4 that dissolves a source gas in a source liquid to produce a first gas solution; a first gas-liquid separator 10 that stores the first gas solution produced and produces a second gas solution through gas-liquid separation of the first gas solution; a pressure reducer 17 that depressurizes the second gas solution produced in the first gas-liquid separator 10; and a second gas-liquid separator 12 that stores the depressurized second gas solution and produces a third gas solution through gas-liquid separation of the second gas solution. The third gas solution is supplied to a point-of-use.
A polishing-head system capable of precisely controlling a polishing rate for a substrate, such as a wafer, and more particularly a polishing rate at an edge portion is disclosed. The polishing-head system includes a polishing head, a head shaft, a head rotating mechanism, a multi-path rotary joint, a fluid supply line, and a pressure regulator, wherein the polishing head has a substrate pressing surface, a retainer ring, and pressure chambers arranged along a circumferential direction of the retainer ring, the head shaft has shaft flow-passages communicating with the pressure chambers, respectively, and the multi-path rotary joint is configured to sequentially provide a communication between the fluid supply line and the shall flow-passages each time the head shaft makes one revolution.
An information processing apparatus includes: an information acquisition part, acquiring recipe information indicating processing content of polishing processing and finishing processing, and transfer time information indicating a transfer time required for each transfer processing; and a schedule creation part, based on the recipe information and the transfer time information, creating a substrate processing schedule by determining a start timing of each processing so that a final processing end time during which a final substrate after the finishing processing is carried out to a substrate carry-out position is shortest.
To suppress damage to a surface to be polished of a substrate and improve a polishing rate. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100, a nozzle 228 for supplying a polishing liquid around the pad holder 226, and a pad rotation mechanism for rotating the pad holder 226. The pad holder 226 includes a discharge hole 221-2a formed in the center of a holding surface 221-2c configured to hold the polishing pad 222 and a discharge passage 221-2b communicated with an outside of the pad holder 226 from the discharge hole 221-2a.
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
24.
CLEANING APPARATUS FOR CLEANING MEMBER, CLEANING METHOD FOR CLEANING MEMBER, AND SUBSTRATE CLEANING METHOD
A cleaning apparatus for cleaning member has a member cleaning part 30 that cleans a cleaning member 10 that cleans a substrate W; and a measurement part 20 that measures a degree of cleanliness of the cleaning member 10 cleaned by the member cleaning part 30.
B08B 1/00 - Cleaning by methods involving the use of tools, brushes, or analogous members
B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning
B08B 1/02 - Cleaning travelling work, e.g. a web or articles on a conveyor
B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
B08B 3/04 - Cleaning involving contact with liquid
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
25.
PRE-WET MODULE, DEAERATED LIQUID CIRCULATION SYSTEM, AND PRE-WET METHOD
A preprocess is efficiently performed on a substrate. A pre-wet module 200 includes a deaeration tank 210, a processing device 258, a substrate holder 220, and a drive mechanism 230. The deaeration tank 210 is configured to house a deaerated liquid. The processing device 258 includes a nozzle 268 configured to supply a cleaning liquid to a surface to be processed of a substrate having the surface to be processed facing upward. The substrate holder 220 is disposed between the deaeration tank 210 and the processing device 258. The substrate holder 220 includes a first holding member 222 configured to hold a first substrate and a second holding member 224 configured to hold a second substrate. The drive mechanism 230 is configured to rotate and move up and down the substrate holder 220. The drive mechanism 230 includes a rotation mechanism 240 and an elevating mechanism 248. The rotation mechanism 240 is configured to rotate the substrate holder 220 between a first state where a surface to be processed of the first substrate is opposed to a deaerated liquid in the deaeration tank 210 and a second state where a surface to be processed of the second substrate is opposed to the deaerated liquid in the deaeration tank. The elevating mechanism 248 is configured to move up and down the substrate holder 220.
B08B 3/02 - Cleaning by the force of jets or sprays
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, i.e. electroless plating
C23C 18/18 - Pretreatment of the material to be coated
Efficiency of a cleaning process and a degassing process for a surface to be processed of a substrate is improved.
Efficiency of a cleaning process and a degassing process for a surface to be processed of a substrate is improved.
A pre-wet module 200 includes a stage 220, a rotation mechanism 224, a pre-wet chamber 260, an elevating mechanism 230, a degassing liquid supply member 204, a nozzle 268, and a cleaning liquid supply member 202. The stage 220 is configured to hold a back surface of a substrate WF with a surface to be processed WF-a facing upward. The rotation mechanism 224 is configured to rotate the stage 220. The pre-wet chamber 260 includes a lid member 262 and a tubular member 264. The lid member 262 has an opposed surface 262a opposed to the surface to be processed WF-a of the substrate WF. The tubular member 264 is installed on an outer edge portion of the opposed surface 262a of the lid member 262. The elevating mechanism 230 is configured to move up and down the pre-wet chamber 260. The degassing liquid supply member 204 is configured to supply a degassing liquid to a pre-wet space 269 formed between the pre-wet chamber 260 and the surface to be processed WF-a of the substrate WF. The nozzle 268 is installed on the opposed surface 262a of the lid member 262. The cleaning liquid supply member 202 is configured to supply a cleaning liquid to the surface to be processed WF-a of the substrate WF via the nozzle 268.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The present disclosure provides a technique for carrying out fabrication on a powder material bedded in advance using a DED nozzle. According to one aspect, a DED nozzle for use with an AM apparatus is provided. This DED nozzle includes a DED nozzle main body, a laser port provided at a distal end of the DED nozzle main body and configured to emit laser light, a laser passage provided in communication with the laser port and configured to allow the laser light to pass through inside the DED nozzle main body, a powder port provided at the distal end of the DED nozzle main body and configured to eject a powder material, and a powder passage provided in communication with the powder port and configured to allow the powder material to pass through inside the DED nozzle main body. Directions of the powder passage and the powder port are determined based on a distance from the powder port to a fabrication point, a velocity of the powder material ejected from the powder port, and a gravitational acceleration.
A control device of a substrate processing apparatus is configured to execute: calculating patterns for changing an order of loading to the substrate processing apparatus for multiple substrates loaded to the substrate processing apparatus; generating, for each obtained pattern, a time table in which process end times in the polishing device, the cleaning device, and the transport device are associated, so that an idling state does not occur from a time when the substrates are loaded to the substrate processing apparatus until a cleaning process ends; selecting a time table with a shortest time from a time when a process of a substrate initially loaded to the substrate processing apparatus starts until a process of a lastly loaded substrate ends in the obtained time tables; and controlling timings of loading the substrates to the substrate processing apparatus based on the selected time table.
G05B 19/4155 - Numerical control (NC), i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
A polishing apparatus is disclosed, which is capable of heating and maintaining a temperature distribution of a polishing pad at a predetermined temperature distribution with a simple structure. The polishing apparatus has a pad-temperature regulating apparatus for regulating a temperature of a polishing surface, and the pad-temperature regulating apparatus includes a heating-fluid nozzle arranged above and spaced apart from the polishing surface. The heating-fluid nozzle includes: a nozzle body; a slit formed along a longitudinal direction of the nozzle body for ejecting a heating fluid toward the polishing surface; a header tube which is formed within the nozzle body and into which the heating fluid is supplied; a buffer tube which is formed within the nozzle body and communicates with the slit, and a plurality of branch tubes for coupling the header tube to the buffer tube.
One object of the present disclosure is to suppress or prevent a plating solution from entering a sealed space of a substrate holder and to detect entry of the plating solution promptly. There is provided a substrate holder configured to hold a substrate and cause the substrate to come into contact with a plating solution and to be plated. The substrate holder comprises an internal space configured to place an outer circumferential portion of the substrate therein such as to be sealed from outside of the substrate holder, in a state that the substrate is held by the substrate holder; a first passage configured to connect the outside of the substrate holder with the internal space and to introduce a liquid into the internal space; and a detector placed in the internal space and configured to monitor an electric current flowing in the liquid or an electric resistance of the liquid during plating in a state that the liquid is introduced into the internal space and thereby detect a leakage of the plating solution to the internal space.
An object of the invention is to provide a bearing apparatus which is superior in corrosion resistance against a fluorine gas, and superior in dimensional accuracy and durability. For achieving the object, a bearing apparatus for use in an environment where a fluorine gas exists is provided. The bearing apparatus comprises: a magnetic bearing comprising a magnetic member and an electromagnetic coil; and a touchdown bearing for protecting the magnetic bearing, wherein the touchdown bearing comprises an inner ring, an outer ring, and plural rolling members arranged between the inner ring and the outer ring, wherein the inner ring and the outer ring in the touchdown bearing are constructed by using a NiCrAl alloy.
F16C 32/04 - Bearings not otherwise provided for using magnetic or electric supporting means
H01S 3/036 - Means for obtaining or maintaining the desired gas pressure within the tube, e.g. by gettering or replenishing; Means for circulating the gas, e.g. for equalising the pressure within the tube
A surface property judging method and a surface property judging system for a polishing pad capable of appropriately judging a surface property of the polishing pad are disclosed. The surface property judging method includes: rotating a polishing table together with a polishing pad which is supported by the polishing table; generating surface data by a surface data generator, the surface data containing a plurality of shape index values representing a surface property of the polishing pad; producing a histogram indicating a distribution of the plurality of shape index values based on the surface data; and judging the surface property of the polishing pad based on the histogram.
G01B 21/30 - Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
34.
METHOD AND APPARATUS FOR CLEANING WASHING TOOL, SUBSTRATE WASHING DEVICE, AND METHOD FOR MANUFACTURING WASHING TOOL
A cleaning apparatus performing cleaning treatment for a washing tool used for substrate washing by causing the washing tool to contact with a cleaning member while supplying a washing liquid to the washing tool includes a liquid extraction unit that extracts the washing liquid remaining in the washing tool or the washing liquid flowing out from the washing tool in the cleaning treatment, a color reaction unit that applies an iodine color reaction to the washing liquid extracted by the liquid extraction unit, and a determination unit that detects a coloration degree of the washing liquid subjected to the iodine color reaction and determines whether or not cleaning of the washing tool is completed based on the detected coloration degree.
A polishing method for a wafer using a polishing head having a plurality of pressure chambers formed by an elastic membrane is disclosed. The polishing method includes: forming a positive pressure in a first pressure chamber and forming a negative pressure in a second chamber to move fluid present between an upper surface of the wafer and the first pressure chamber outward; then forming a positive pressure in the second chamber and forming a negative pressure in a third pressure chamber to move the fluid present between the upper surface of the wafer and the second pressure chamber outward; then forming a positive pressure in outermost pressure chamber of the plurality of pressure chambers to move the fluid present between the upper surface of the wafer and the outermost pressure chamber outward to thereby cause the fluid to flow out from the upper surface of the wafer; and then pressing a lower surface of the wafer against a polishing surface with the elastic membrane to polish the lower surface of the wafer.
To provide a technique that allows accurately measuring a polishing state of a substrate.
To provide a technique that allows accurately measuring a polishing state of a substrate.
A polishing apparatus 100 includes: a sensor head 40 that includes a projector configured to project incident light, a condenser configured to condense the incident light projected from the projector and cause the incident light to be incident on a substrate Wf, and an optical receiver configured to receive reflected light reflected by the substrate; a displacement mechanism 60 configured to relatively displace the condenser with respect to the substrate to change a distance between the condenser and the substrate; an abrade amount measurement device 70 configured to measure an abrade amount of a polishing pad 90; and a control device 80. The control device is configured to measure a polishing state of the substrate based on a light amount parameter of the reflected light received by the optical receiver and control the displacement mechanism based on the abrade amount of the polishing pad measured by the abrade amount measurement device such that the distance between the condenser and the substrate is maintained at a preliminarily set reference distance.
B24B 37/013 - Devices or means for detecting lapping completion
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
37.
FLUID-PATH SWITCHING APPARATUS AND METHOD OF PREVENTING IDLING ROTATION OF SUBMERSIBLE PUMP
The present invention relates to a technique of preventing idling rotation of a submersible pump used for delivering liquefied gas, such as liquefied ammonia, liquid hydrogen, liquid nitrogen, liquefied natural gas, liquefied ethylene gas, or liquefied petroleum gas. A fluid-path switching apparatus (5) includes: a flow-passage structure (45) having a first flow passage (41), a second flow passage (42), and a third flow passage (43); and a valve element (47) for allowing the third flow passage (43) to selectively communicate with the first flow passage (41) or the second flow passage (42). The first flow passage (41) communicates with a discharge outlet (1b) of the submersible pump (1), the second flow passage (42) communicates with an interior of the suction vessel (2), and the third flow passage (43) communicates with a discharge port (8) of the suction vessel (2).
A machine learning apparatus (4) generates a learning model (6) to be used in a sliding-surface diagnosis apparatus (1A) for diagnosing a condition of sliding surfaces of a fixed-side sliding member and a rotation-side sliding member. The machine learning apparatus (4) includes: a learning-data memory (41) configured to store learning data including input data containing at least data on motor current value in a predetermined period, data on contact electric resistance in the predetermined period, and data on vibration (AE wave or acceleration) in the predetermined period; a machine learning section (42) configured to input the learning data to the learning model (6) to cause the learning model (6) to learn a correlation between the input data and diagnostic information of the sliding surfaces; and a learned-model memory (43) configured to store the learning model (6) that has learned by the machine learning section (42).
F16N 29/04 - Special means in lubricating arrangements or systems providing for the indication or detection of undesired conditions; Use of devices responsive to conditions in lubricating arrangements or systems enabling moving parts to be stopped
F16C 17/24 - Sliding-contact bearings for exclusively rotary movement characterised by features not related to the direction of the load with devices affected by abnormal or undesired conditions, e.g. for preventing overheating, for safety
39.
TRANSFER APPARATUS, CLEANING MODULE, AND SUBSTRATE PROCESSING APPARATUS
To achieve a cleaning module and a substrate processing apparatus that can improve the cleaning capability for a substrate with a simple structure.
To achieve a cleaning module and a substrate processing apparatus that can improve the cleaning capability for a substrate with a simple structure.
A cleaning module includes a first transfer mechanism 210-1, an ultrasonic cleaning tank 440, a transfer machine 420, and a second transfer mechanism 210-2. The first transfer mechanism 210-1 is for transferring a substrate WF with a surface to be polished facing downward up to a substrate grip or release position 418 on a downstream side along a transfer passage 405. The ultrasonic cleaning tank 440 is disposed at a position spaced apart from the transfer passage 405 and is for cleaning a substrate WF with the surface to be polished facing downward. The transfer machine 420 is for transferring the substrate WF between the substrate grip or release position 418 of the transfer passage 405 and the ultrasonic cleaning tank 440. The second transfer mechanism 210-2 is for transferring the substrate WF transferred to the substrate grip or release position 418 from the ultrasonic cleaning tank 440 by the transfer machine 420 to further downstream along the transfer passage 405.
B08B 1/02 - Cleaning travelling work, e.g. a web or articles on a conveyor
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
There is provided a substrate holder configured to hold a substrate such that the substrate is exposed to and is brought into contact with a plating solution to be plated. The substrate holder comprises a contact that comes into contact with a seed layer formed on a surface of the substrate to feed electricity; a protective electrode that is biased to a higher potential side relative to the contact or that comprises a material having a lower spontaneous potential than a spontaneous potential of the seed layer and that is electrically connected with the seed layer directly or via an electrical conductor; and a holder main body provided with an internal space being configured to place therein an outer circumferential portion of the substrate, the contact and the protective electrode such as to be sealed from outside of the substrate holder in a state that the substrate is held by the substrate holder and configured to store therein a liquid that covers at least part of the protective electrode and at least a contact location between the seed layer and the contact.
The present invention constructs, in an AM system, such an environment that fine particles are prevented from scattering from an area where the fine particles such as a powder material can be present to another area. According to one aspect, an AM system configured to manufacture a fabrication object is provided. This AM system includes a fabrication chamber in which an AM apparatus is disposed, and a buffer chamber in communication with the fabrication chamber. The buffer chamber includes an entrance in communication with a surrounding environment, an exit in communication with the fabrication chamber, a grating floor, and an exhaust port. The AM system further includes a first gate configured to be able to open and close the entrance of the buffer chamber, and a second gate configured to be able to open and close the exit of the buffer chamber.
B22F 12/00 - Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
B22F 10/28 - Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
B22F 10/322 - Process control of the atmosphere, e.g. composition or pressure in a building chamber of the gas flow, e.g. rate or direction
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
42.
RETAINER, TOP RING, AND SUBSTRATE PROCESSING APPARATUS
A retainer is disposed around a holding region 39 of a polygonal substrate WF in a top ring for holding the polygonal substrate WF with a surface to be polished facing downward. The retainer 30 includes a plurality of retainer main bodies 3 disposed around the holding region 39 independently along respective sides of the polygonal substrate WF. At least one of the plurality of retainer main bodies 3 includes a first securing surface (first surface 3a), a first opposed surface (second surface 3b), a second securing surface (third surface 3c), and a second opposed surface (fourth surface 3d). The first securing surface is securable to a retainer holding member 37 of the top ring, the first opposed surface is opposed to the holding region 39 in a first state where the first securing surface is secured to the retainer holding member 37, the second securing surface is securable to the retainer holding member 37 in a second state where the retainer main body 3 is rotated by 180 degrees from the first state, and the second opposed surface is opposed to the holding region 39 in a state where the second securing surface is secured to the retainer holding member 37.
Provided is a structure that reduces a risk of affecting a mounting mechanism of a retainer member when a substrate collides with the retainer member.
Provided is a structure that reduces a risk of affecting a mounting mechanism of a retainer member when a substrate collides with the retainer member.
According to one embodiment, a head for holding a polygonal substrate is provided. The head includes a substrate support surface, a retainer member, and a retainer guide. The substrate support surface has a shape corresponding to a shape of the polygonal substrate. The retainer member is disposed outside each side of the substrate support surface. The retainer guide is configured to support the retainer member. The retainer member has an engaging surface extending in a direction perpendicular to the substrate support surface, and the engaging surface of the retainer member engages with the retainer guide.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A method is provided and includes making a polishing table and a dummy disk rotate; bringing the dummy disk into contact with a table surface of the polishing table while a liquid is supplied to the table surface; measuring heights of the table surface at a plurality of measurement points while the dummy disk is moved on the table surface; and creating a table profile showing tilt of the table surface from measurement values of the heights of the table surface.
B24B 37/16 - Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
B24B 1/04 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
B24B 17/08 - Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor involving fluid transmission means only
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 37/26 - Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
46.
POWDER SUPPLY APPARATUS AND AM APPARATUS USING A POWDER SUPPLY APPARATUS
The present invention provides a powder supply apparatus. According to one aspect, a powder supply apparatus is provided. The powder supply apparatus includes a container configured to store powder therein, a supply passage configured to supply the powder to the container therethrough, and a valve mechanism configured to open and close the supply passage thereby. The valve mechanism includes a valve main body movable between a first position, at which the valve main body closes the supply passage, and a second position, at which the valve main body opens the supply passage, and further includes a valve seat configured in such a manner that the valve main body is seated thereon. The valve main body includes a first seal portion and a second seal portion. The valve seat includes a first seat portion on which the first seal portion is seated, and a second seat portion on which the second seal portion is seated. The valve mechanism defines a space sealingly closed when the first seal portion is seated on the first seat portion and the second seal portion is seated on the second seat portion. The valve mechanism includes an exhaust passage configured to exhaust gas from the sealingly closed space therethrough and a pressure monitoring passage configured to be used to monitor a pressure in the sealingly closed space.
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
Provided are a plating apparatus and a plating method for preventing or mitigating electric field diversion irrespective of the physical or mechanical structure. According to one embodiment, provided is a plating apparatus comprising: a substrate holder configured so as to hold a substrate; a plating bath configured so as to accommodate the substrate holder which holds the substrate, and provided with a first tank on a first surface side of the substrate and a second tank on a second surface side of the substrate, the first tank and the second tank communicating with each other with a gap therebetween; a first anode electrode arranged in the first tank of the plating bath; a first power source configured so as to supply a plating current between the substrate and the first anode electrode; an auxiliary anode electrode arranged on the first tank side of the gap; an auxiliary cathode electrode arranged on the second tank side of the gap; and an auxiliary power source configured so as to supply an auxiliary current between the auxiliary anode electrode and the auxiliary cathode electrode.
Provided is a method of evaluating a deviation of a trajectory of a primary electron beam in a primary optical system in an electron beam observation device including the primary optical system that irradiates a sample with the primary electron beam including a plurality of primary electrons and a secondary optical system that detects, by a detector, a secondary electron beam including a plurality of secondary electrons emitted from the sample irradiated with the primary electron beam.
G01N 23/2251 - Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups , or by measuring secondary emission from the material using electron or ion microprobes using incident electron beams, e.g. scanning electron microscopy [SEM]
49.
SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND METHOD OF MANUFACTURING APPARATUS FOR PLATING
There is provided a substrate holder configured to hold a substrate in an apparatus for plating. The substrate holder comprises a seal configured to seal an outer peripheral part of the substrate and provided with a first opening which a surface to be plated or a plating surface of the substrate is exposed on; and a seal ring holder configured to hold the seal and provided with a second opening which the plating surface of the substrate is exposed on, wherein an opening diameter ratio that is a ratio of an opening diameter of the second opening to an opening diameter of the first opening is in a range of not lower than 99.32% and not higher than 99.80%.
A substrate polishing method capable of reducing an influence of variation in spectrum of reflected light from a substrate, such as a wafer, and determining an accurate film thickness is disclosed. The method includes: polishing a surface of a substrate by pressing the substrate against a polishing pad on a rotating polishing table; producing a spectrum of reflected light from the surface of the substrate each time the polishing table makes one rotation; creating a three-dimensional data containing a plurality of spectra arranged along polishing time; and determining a film thickness of the substrate based on the three-dimensional data.
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
B24B 37/013 - Devices or means for detecting lapping completion
One object is to suppress a substrate from being dried in the course of releasing the substrate from a substrate holding member in an apparatus for polishing. There is provided the apparatus for polishing, comprising: a polishing table configured to support a polishing pad; a substrate holding member having a substrate holding surface and a pressure chamber, which are made of an elastic membrane, wherein the pressure chamber has a plurality of areas arranged concentrically and a substrate is pressed against the polishing pad by a pressure in the pressure chamber; a pressure regulator configured to regulate a pressure of a gas that is supplied to the pressure chamber of the substrate holding member; one or a plurality of release nozzles configured to inject a pressurized fluid; and a control device configured to perform a substrate release process of releasing the substrate from the elastic membrane, the substrate release process controlling the pressure regulator to pressurize entirety of the elastic membrane by pressurizing all the areas in the pressure chamber and subsequently pressurize a center portion of the elastic membrane by pressurizing the pressure chamber such as to make a pressure in one or multiple areas on a center side, which include an area at a center of the pressure chamber, higher than pressures in other areas, wherein meanwhile the substrate release process controls the one or plurality of release nozzles to inject the pressurized fluid to a contact location between the elastic membrane and the substrate.
A method for estimating a life of a polishing pad includes: polishing a workpiece by pressing the workpiece against a polishing surface of a polishing pad with an elastic membrane forming a pressure chamber provided in a polishing head; controlling a pressure in the pressure chamber on the basis of a measured value of a film thickness of the workpiece while measuring the film thickness during the polishing of the workpiece; inputting time-series pressure data representing a change in the pressure in the pressure chamber during the polishing of the workpiece into a learned model; and outputting a life index of the polishing pad from the learned model.
An objective of the present invention is to provide a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a first potential sensor disposed at a first position in a region between a substrate held by a substrate holder and an anode, a second potential sensor disposed at a second position outside the region between the substrate held by the substrate holder and the anode, and a third potential sensor disposed at a third position different from the second position and outside the region between the substrate held by the substrate holder and the anode. The plating apparatus measures a first potential difference that is a potential difference between the first position and the second position, and a second potential difference that is a potential difference between the second position and the third position and measures a film thickness of the plating film based on a difference between the first potential difference and the second potential difference.
An information processing device includes: an information acquiring part configured to acquire plating process information including operational motion information including target paddle motion information indicating an agitating motion of a target paddle corresponding to a paddle to be processed, plating solution motion information indicating a motion of supplying a plating solution to a plating tank, and carrier machine motion information indicating a motion of carrying a substrate and operational-motion paddle vibration information indicating vibration characteristics of the target paddle when an operational motion is performed, the motions being operational motions performed by a substrate plating device; and an information generating part configured to generate agitating-motion paddle vibration information in response to the plating process information by inputting the plating process information acquired by the information acquiring part to a learning model which has learned a correlation between the plating process information and the agitating-motion paddle vibration information using machine learning.
The present invention relates to a technique of determining a time to replace a polishing pad used in a polishing apparatus for polishing a workpiece, such as wafer, substrate, or panel. A polishing apparatus (1) includes: a polishing table (5) configured to support a polishing pad (2); a polishing head (7) configured to press a workpiece (W) against a polishing surface (2a) of the polishing pad (2); a dresser (40) configured to dress the polishing surface (2a) of the polishing pad (2); a detection sensor (60) configured to detect friction between the dresser (40) and the polishing pad (2), the detection sensor (60) being fixed to the dresser (40); and a wear monitoring device (63) configured to determine a wear index value from a plurality of output values of the detection sensor (60) and generate an alarm signal when the wear index value is smaller than a predetermined lower limit.
In one embodiment of the present invention, a cleaning member 90 is attached to the surface of a cleaning member attaching part 10. The cleaning member attaching part 10 has a main body 20, a cleaning liquid introduction part 30 extending inside the main body 20, and a plurality of cleaning liquid supply holes 40 communicating with the cleaning liquid introduction part 30. The cleaning liquid introduction part 30 is configured such that cleaning liquid flows in from a first end part 11 side, and an area proportion of the cleaning liquid supply holes 40 in a second region located on a second end part 12 side opposite to the first end part 11 to a surface of the main body 20 is larger than the area proportion of the cleaning liquid supply holes 40 in a first region located on the first end part 11 side to the surface of the main body 20.
B08B 3/04 - Cleaning involving contact with liquid
B08B 1/00 - Cleaning by methods involving the use of tools, brushes, or analogous members
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
58.
SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD
A polishing apparatus is provided. The polishing apparatus includes:
a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B24B 37/10 - Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 49/14 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
A plating apparatus 1000 includes a plating tank, a substrate holder 20, a rotation mechanism, an elevating mechanism, a contact member 40, and a cleaning device 50 configured to clean the contact member 40. The cleaning device 50 includes a pivot shaft 51, a first arm 53, a second arm 54, and a nozzle 55 that includes at least one discharge port. Applying a cleaning fluid discharged from the discharge port to the contact member 40 cleans the contact member 40.
An object is to precisely grasping, in real time, film thickness of a plated film during a plating process. A plating apparatus comprises: a plating tank for storing plating liquid; a substrate holder for holding a substrate; an anode arranged in the plating tank in such a manner that it faces the substrate held by the substrate holder; an electric potential sensor constructed in such a manner that it is arranged in a position close to the substrate held by the substrate holder, and measures electric potential of the plating liquid; and a state space model constructed to estimate current density of current flowing through an outer edge part of the substrate, based on a measured value of electric potential of the plating liquid obtained by the electric potential sensor and by using a state equation and an observation equation.
A sensor authentication registration system includes: sensors for detecting a state quantity of a sensing target device; and setting device that stores installation information for each of the sensors. A radio wave intensity measurement unit that measures intensity of a radio wave in wireless communication is provided to at least one of the sensors or the setting device. The setting device can perform an authentication operation to store the installation information when the presence of a sensor, the installation information of which is not stored, is detected and the radio wave intensity is equal to or higher than a threshold value. A data collection system includes: sensors; and data collection device that stores installation information for each of the sensors and receives state quantities detected by the sensors via wireless communication. In the device and a method for data collection, the state quantity is automatically received when the data collection device approaches to within a range where the wireless communication with the sensor, whose installation information is stored, can be received.
G01D 5/48 - Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using wave or particle radiation means
A substrate processing system capable of supplying a processing liquid containing fine bubbles at a high concentration without generating large sized bubbles in a middle of a supply line of the processing liquid is disclosed. There is provided a substrate processing system comprising: a gas dissolved water generation tank; a chemical liquid dilution module; and a substrate processing module. The substrate processing module comprises a processing liquid supply nozzle configured to supply the processing liquid onto a substrate. The processing liquid supply nozzle has a decompression release portion configured to generate fine bubbles of a gas from a diluted chemical liquid. The processing liquid supply nozzle is configured to supply the diluted chemical liquid containing fine bubbles in a process scrubbing the substrate.
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
B08B 1/00 - Cleaning by methods involving the use of tools, brushes, or analogous members
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 5/02 - Cleaning by the force of jets, e.g. blowing-out cavities
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
63.
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
The present application relates to a substrate processing method for suppressing cracking and chipping of a laminated substrate manufactured by bonding a plurality of substrates. Further, the present application relates to a substrate processing apparatus capable of performing such a substrate processing method. The present method includes: rotating a laminated substrate manufactured by bonding a first substrate and a second substrate; applying a filler, having thermosetting property, to a gap between a peripheral portion of the first substrate and a peripheral portion of the second substrate; and curing the filler. Applying the filler and curing the filler are continuously performed in a same processing chamber.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/18 - Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
64.
SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD
A substrate cleaning device includes: a pressing member that cleans a substrate by contacting the substrate; a load measurement unit that measures a pressing load of the cleaning member; and a control unit that repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value decreases, when the difference value is larger than the second threshold value, until the difference value becomes equal to or smaller than the first threshold value.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A temperature regulating apparatus includes: a heating section configured to produce a heating liquid; a cooling section configured to produce a cooling liquid; a heating-liquid delivery pipe for delivering the heating liquid to the semiconductor-device manufacturing equipment; a cooling-liquid delivery pipe for delivering the cooling liquid to the semiconductor-device manufacturing equipment; a heating-side return pipe for returning a liquid mixture of the heating liquid and the cooling liquid that have passed through the semiconductor-device manufacturing equipment to the heating section; a cooling-side return pipe for returning the liquid mixture that has passed through the semiconductor-device manufacturing equipment to the cooling section; and at least one of a heating-side heat exchanger configured to exchange heat between the heating liquid and the liquid mixture and a cooling-side heat exchanger configured to exchange heat between the cooling liquid and the liquid mixture.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G05D 23/19 - Control of temperature characterised by the use of electric means
The present invention relates to a tape sticking system for sticking a protective tape for protecting a peripheral portion of a substrate, such as a wafer. The tape sticking apparatus (10) includes a substrate holder (21) for sticking, a side roller (43), a first roller (46), a second roller (47), a roller-driving motor (49) coupled to the second roller (47), and a nipping mechanism (60) for nipping the peripheral portion of the substrate (W) with the first roller (46) and the second roller (47). The tape sticking apparatus (10) is configured to cause the second roller (47) to be rotated by use of the roller-driving motor (49) while nipping the peripheral portion of the substrate, held to the substrate holder (21) for sticking, with the first roller (46) and the second roller (47), to thereby rotate the substrate.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
67.
POLISHING METHOD AND POLISHING APPARATUS FOR WORKPIECE
A polishing method that can reduce influence of polishing liquid (e.g., slurry) on measuring of a film thickness of a workpiece and can achieve accurate measuring of the film thickness is disclosed. The polishing method includes pressing the workpiece against a polishing pad by a polishing head while polishing liquid is present on the polishing pad to polish the workpiece; during polishing of the workpiece, directing light from an optical sensor head onto the workpiece and receiving reflected light from the workpiece by the optical sensor head, the optical sensor head being disposed in the polishing table; determining a film thickness of the workpiece based on a spectrum of the reflected light; and during polishing of the workpiece, supplying cleaning liquid from a cleaning nozzle to a target position which is located just above the optical sensor head.
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
68.
SUBSTRATE POLISHING APPARATUS AND POLISHING LIQUID DISCHARGE METHOD IN SUBSTRATE POLISHING APPARATUS
In a substrate polishing apparatus where a polishing liquid passes through inside a rotary joint, the rotary joint requires maintenance. There is provided a substrate polishing apparatus that includes: a polishing head for holding a substrate; a rotary table that has a surface to which a first opening portion is provided; a polishing liquid discharge mechanism disposed to the rotary table; and a controller configured to control at least the polishing liquid discharge mechanism. The polishing liquid discharge mechanism includes a first cylinder, a first piston, and a driving mechanism that drives the first piston. The first opening portion is communicated with a liquid holding space defined by the first cylinder and the first piston. The controller controls the driving of the first piston by the driving mechanism to increase and decrease a volume of the liquid holding space.
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
69.
SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD
A substrate cleaning device includes: a pressing member that cleans a substrate by contacting the substrate; a load measurement unit that measures a pressing load of the cleaning member; and a control unit that repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value decreases, when the difference value is larger than the second threshold value, until the difference value becomes equal to or smaller than the first threshold value.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
B08B 1/00 - Cleaning by methods involving the use of tools, brushes, or analogous members
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
Provided is a technique that ensures the suppressed deterioration of plating quality of a substrate due to air bubbles that remain on a surface to be plated of the substrate.
Provided is a technique that ensures the suppressed deterioration of plating quality of a substrate due to air bubbles that remain on a surface to be plated of the substrate.
A plating apparatus 1000 includes a plating tank 10, a substrate holder 30, a rotation mechanism 40, and an elevating mechanism 50. The plating tank 10 is configured to accumulate a plating solution and include an anode 11 arranged inside the plating tank. The substrate holder 30 is arranged above the anode and configured to hold a substrate as a cathode such that a surface to be plated of the substrate faces downward. The substrate holder includes a ring 31 projecting below an outer peripheral edge of the surface to be plated of the substrate. The rotation mechanism 40 is configured to rotate the substrate holder. The elevating mechanism 50 is configured to elevate the substrate holder. The ring has a lower surface, and at least one protrusion 35 projecting toward a lower side is arranged on a part of the lower surface.
A polishing method capable of stabilizing a polishing process of a substrate is disclosed. In the polishing method, a fine bubble liquid is supplied onto a polishing pad after finishing polishing the substrate.
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
B24B 37/005 - Control means for lapping machines or devices
B24B 37/04 - Lapping machines or devices; Accessories designed for working plane surfaces
The present invention relates to a pump casing and a pump apparatus. The pump casing (5) includes a suction nozzle (100) with formed a suction port (12). The suction nozzle (100) slopes downward toward the suction port (12).
F04D 29/42 - Casings; Connections for working fluid for radial or helico-centrifugal pumps
F04D 13/06 - Units comprising pumps and their driving means the pump being electrically driven
73.
METAL-SUPPORTING NONWOVEN FABRIC AND PRODUCTION METHOD THEREOF, CATALYST, UNSATURATED COMPOUND HYDROGENATION METHOD, AND CARBON-CARBON BOND FORMING METHOD
A metal-supported nonwoven fabric is provided which enables effective synthesis of a target product when used as a catalyst in a flow reaction. The metal-supported nonwoven fabric comprises a nonwoven fabric containing polyolefin fibers or PET fibers, and metal particles. The nonwoven fabric has grafted side chains bound thereto formed of polyvinylpyrrolidone, polyacrylic acid, or a polymer containing functional groups with unshared electron pairs. The metal particles are supported by the grafted side chains via pyrrolidone groups of the polyvinylpyrrolidone, carboxy groups of the polyacrylic acid, or the functional groups with unshared electron pairs.
C07C 5/03 - Preparation of hydrocarbons from hydrocarbons containing the same number of carbon atoms by hydrogenation of non-aromatic carbon-to-carbon double bonds
D06M 14/28 - Graft polymerisation of monomers containing carbon-to-carbon unsaturated bonds on to fibres, threads, yarns, fabrics or fibrous goods made from such materials using wave energy or particle radiation on to materials of synthetic origin of macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
D06M 11/83 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
D06M 23/08 - Processes in which the treating agent is applied in powder or granular form
Provided is a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder that holds a substrate, and an anode disposed in the plating tank to oppose the substrate held by the substrate holder. The plating apparatus also includes a conduit having a first portion including an opening end disposed in a region between the substrate held by the substrate holder and the anode, and a second portion apart from the region between the substrate held by the substrate holder and the anode, the conduit having at least a part filled with a plating solution, and a potential sensor that is disposed in the second portion of the conduit and that is configured to measure a potential of the plating solution.
One object of this application is to provide an advanced substrate holder including a clamper. A substrate holder for holding a substrate by interposing the substrate between frames is disclosed. The substrate holder includes a front frame, a rear frame, and one or a plurality of clampers. Each of the clampers includes a hook portion including a hook base and a hook main body, and a plate including at least one claw. At least one of the clampers includes the plate including a first claw for a lock and a second claw for a semi-lock.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
C25D 17/06 - Suspending or supporting devices for articles to be coated
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
76.
SUBSTRATE PROCESSING APPARATUS, AND WATERPROOFING DEVICE FOR ACOUSTIC SENSOR
A substrate processing apparatus for polishing a substrate by pressing the substrate against a polishing pad, comprises: an acoustic sensor having a sensor body that detects polishing sound of the substrate and outputs the polishing sound as an acoustic signal, and a cover member that houses the sensor body; an end point detection unit that detects an end point of polishing of the substrate from the acoustic signal; and a gas supply device that supplies a gas into the cover member so as to prevent adhesion of moisture (water droplets and water vapor) to the sensor body. The gas supply device is connected to the sensor body on an opposite side of a detection surface for the polishing sound, a groove for passing the gas from the gas supply device is formed in the cover member, and a plurality of micro openings for passing the gas from the gas supply device are formed on a waterproof sheet.
H01L 21/461 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01R 13/52 - Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
Provided is a thermal spraying apparatus that forms a film on a target by thermally spraying a conductive powder by plasma, the thermal spraying apparatus including: a first electrode provided with a first cavity through which the conductive powder from a powder supplier passes; and a second electrode provided with a second cavity through which the conductive powder from the first electrode passes, in which the plasma is generated between the first electrode and the second electrode.
B05B 5/06 - Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means using electric arc
B05B 5/08 - Plant for applying liquids or other fluent materials to objects
B05B 12/00 - Arrangements for controlling delivery; Arrangements for controlling the spray area
78.
CHEMICAL SUPPLY APPARATUS, CLEANING SYSTEM, AND CHEMICAL SUPPLY METHOD
The present disclosure provides a chemical supply apparatus, a cleaning system, and a chemical supply method that can supply a cleaning chemical to two nozzles and also supply the cleaning chemical at a set flow rate to one of the nozzles.
The present disclosure provides a chemical supply apparatus, a cleaning system, and a chemical supply method that can supply a cleaning chemical to two nozzles and also supply the cleaning chemical at a set flow rate to one of the nozzles.
A chemical supply apparatus according to the present disclosure includes: a first cleaning chemical supply pipe; a first mixer that mixes a first chemical and water to generate a first cleaning chemical; and a first supply controller, wherein the first cleaning chemical supply pipe includes an upstream pipe forming a channel from the first mixer to a first junction, a first pipe forming a channel from the first junction to a first nozzle, and a second pipe forming a channel from the first junction to a second nozzle, and the first supply controller is configured to execute a feedback control on the basis of the flow rate of the first cleaning chemical inside the first pipe of the first cleaning chemical supply pipe so that the flow rate of the first cleaning chemical flowing through the first pipe of the first cleaning chemical supply pipe is a set flow rate.
A substrate cleaning method and a substrate cleaning apparatus are provided. The substrate cleaning method includes a first step of applying a chemical solution to a lower surface of a substrate, and a second step of subsequently applying a bubble-containing liquid to the lower surface of the substrate.
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
B08B 1/00 - Cleaning by methods involving the use of tools, brushes, or analogous members
B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
B01F 23/23 - Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
B01F 23/2373 - Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media for obtaining fine bubbles, i.e. bubbles with a size below 100 µm
B01F 23/237 - Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media
80.
SUBSTRATE CONVEYANCE METHOD, SUBSTRATE PROCESSING DEVICE, AND RECORDING MEDIUM
A substrate conveyance method, a substrate processing device, and a recording medium are provided. The substrate conveyance method includes: conveying a substrate into a receiving unit and confirming that the substrate is present in the receiving unit by detecting that light irradiated from an optical sensor is blocked by the substrate conveyed to the receiving unit; and stopping light irradiation from the optical sensor before the substrate is conveyed out from the receiving unit.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
81.
PUSHER, TRANSFER DEVICE, AND SUBSTRATE PROCESSING APPARATUS
A pusher that holds a substrate includes: a pusher body, and a plurality of seating members that is attached to the pusher body and on which a substrate is seated. Each of the plurality of seating members includes: a pedestal member including a seating portion on which the substrate is seated and a magnet disposed at a position different from the seating portion, and supported by the pusher body such that the position of the magnet is moved according to seating or leaving of the substrate; a seating sensor configured to detect movement of the magnet; and a magnetic member disposed to shield a portion between a movable region of the magnet and the seating sensor.
B24B 41/00 - Component parts of grinding machines or devices, such as frames, beds, carriages or headstocks
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
82.
METHOD OF MANUFACTURING BARRIER-METAL-FREE METAL INTERCONNECT STRUCTURE, AND BARRIER-METAL-FREE METAL INTERCONNECT STRUCTURE
The present invention relates to a metal interconnect structure containing no barrier metal and a method of manufacturing the metal interconnect structure. The method includes: filling at least a first interconnect trench with an intermetallic compound by depositing the intermetallic compound on an insulating layer having the first interconnect trench and a second interconnect trench formed in the insulating layer, the second interconnect trench being wider than the first interconnect trench; performing a planarization process of polishing the intermetallic compound until the insulating layer is exposed; and then performing a height adjustment process of polishing the intermetallic compound and the insulating layer until a height of the intermetallic compound in the first interconnect trench reaches a predetermined height.
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
83.
SUBSTRATE PROCESSING APPARATUS, COMPUTER-READABLE STORAGE MEDIUM STORING A PROGRAM, AND SUBSTRATE PROCESSING METHOD
The present invention relates to a substrate processing apparatus for processing a substrate. The substrate processing apparatus (1) includes a controller (90). The controller (90) rotates the substrate (W) at a second speed, after rotating the substrate (W) at a first speed. The controller (90) supplies a dry fluid from a dry fluid nozzle (30) onto the substrate (W) for predetermined time after rotating the substrate (W) at the second speed, and while rotating the substrate (W) at a third speed. The controller (90) moves a dry fluid nozzle (30) from a center of the substrate (W) toward a peripheral portion of the substrate (W) while continuing to supply the dry fluid from the dry fluid nozzle (30).
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
84.
Top ring for holding a substrate and substrate processing apparatus
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A display system is provided that includes: a rotary machine device including a rotary machine and a drive machine causing the rotary machine to rotate; a display device capable of displaying a state of the rotary machine device; a detection section acquiring plural state quantities indicating the state of the rotary machine device; and a display control section displaying a chart on the display device on the basis of the plural state quantities acquired by the detection section, the chart being configured as a multidimensional chart in which the plural state quantities of the rotary machine device at specific time are plotted and the plural state quantities are set as values, each of which corresponds to each axis.
Provided is a technique for fabricating a powder material bedded in advance using a DED nozzle. According to one embodiment, there is provided an AM apparatus for manufacturing a fabricated object. The AM apparatus includes a DED nozzle. The DED nozzle includes: a DED nozzle main body; a laser port disposed at a distal end of the DED nozzle main body and for emitting a laser beam, and a laser passage configured to communicate with the laser port and for allowing the laser beam to pass through the DED nozzle main body; and a powder port disposed at the distal end of the DED nozzle main body and for emitting a powder material, and a powder passage configured to communicate with the powder port and for allowing the powder material to pass through the DED nozzle main body. The AM apparatus further includes a cover configured to surround a peripheral area of the laser port and the powder port of the DED nozzle. The cover is configured to have an opened downstream side in an emission direction of the laser beam. The cover includes a gas supply passage for supplying a gas inside the cover. The gas supply passage is configured to be oriented so as to guide the gas toward the DED nozzle main body.
A polishing method capable of terminating polishing of a substrate, such as a wafer, at a preset polishing time is disclosed. The polishing method includes: polishing a substrate by pressing the substrate against a polishing surface of a polishing pad, while regulating a temperature of the polishing surface by a heat exchanger; calculating a target polishing rate required for an actual polishing time to coincide with a target polishing time, the actual polishing time being a time duration from start of polishing the substrate until a film thickness of the substrate reaches a target thickness; determining a target temperature of the polishing surface that can achieve the target polishing rate; and during polishing of the substrate, changing a temperature of the polishing surface to the target temperature by the heat exchanger.
The present disclosure provides a plating apparatus that can determine an acceleration at the time of an inappropriate deceleration of a transfer device that may cause contact between a substrate holder and a processing tank, a control method for a plating apparatus, and a storage medium storing a program. The plating apparatus according to the present disclosure includes a transfer device including an imaging device, the processing tank having an opening, a reference mark, and a control device, the control device is configured to be able to execute a test at a test acceleration, and the test includes: controlling, by the control device, the imaging device to capture a reference image when the transfer device is located at a determination position directly above the processing tank; moving the transfer device from a reference position to the determination position; controlling the imaging device to capture a comparison video when and after the transfer device stops; and determining, based on the reference image and the comparison video, whether the lower end portion of the substrate holder protrudes outside a region where the opening is extended in a vertical direction, to determine that the test acceleration has an inappropriate value when the lower end portion protrudes outside the region.
A polishing apparatus capable of preventing condensation on an inner surface of a transparent window provided in a polishing pad and capable of achieving accurate measuring of a film thickness is disclosed. The polishing apparatus includes: a polishing pad having a polishing surface; a polishing head configured to press a workpiece against the polishing surface; a transparent window disposed in the polishing pad; a polishing table configured to support the polishing pad; an optical sensor head located below the transparent window and configured to direct light to the workpiece through the transparent window and receive reflected light from the workpiece through the transparent window; and a cooling device configured to cool a space between the transparent window and the optical sensor head.
Uniformity in plated film thickness in a plating apparatus is improved. A plating apparatus for plating a substrate by making electric current flow from an anode to the substrate is provided. The plating apparatus comprises: plural anode-side electric wires which are electrically connected to the anode via plural electric contacts on the anode; plural substrate-side electric wires which are electrically connected to the substrate via plural electric contacts on the substrate; plural variable resistors positioned, in at least one of the anode side and the substrate side, in middle positions in the plural anode-side electric wires or the plural substrate-side electric wires; and a controller constructed to adjust each of resistance values of the plural variable resistors.
An abatement apparatus capable of treating exhaust gas with less wet treatment devices than a conventional abatement apparatus is disclosed. The abatement apparatus includes: a pre-wet treatment device; a combustion treatment device; gas introduction lines coupled to process chambers of a film forming device; first flow-path switching devices coupled to the plurality of gas it lines, respectively; a first gas delivery line extending from the first flow-path switching devices to the pre-wet treatment device; a second gas delivery line extending from the first flow-path switching devices to the combustion treatment device; and an operation controller configured to control operations of the first flow-path switching devices to deliver the process gas to the pre-wet treatment device and deliver the cleaning gas to the combustion treatment device.
A film-thickness measuring method capable of substantially extending a wavelength range of a spectrum of reflected light from a workpiece, and accurately measuring a film thickness is disclosed. The film-thickness measuring method includes: pressing a workpiece against a polishing pad, while rotating a polishing table that supports the polishing pad, to polish the workpiece; during the polishing of the workpiece, directing light to the workpiece from a liquid-seal sensor and a transparent-window sensor disposed in the polishing table and receiving reflected light from the workpiece by the liquid-seal sensor and the transparent-window sensor; and determining a film thickness of the workpiece based on a spectrum of the reflected light from the workpiece.
An element which limits throughput of a plating apparatus is identified. A method for identifying an element which limits throughput of a plating apparatus is provided. The method comprises: a step for creating a time chart which represents process schedules of plural processing units and one or plural transfer apparatuses; a step for calculating, based on the time chart, at least one of an operation rate and a degree of freedom of taking-out with respect to each of elements comprising the plural processing units and the one or plural transfer apparatuses, wherein the degree of freedom of taking-out represents a degree of freedom with respect to timing when the substrate which has been processed can be taken out of one of the processing units; and a step for displaying, with respect to each of the elements comprising the plural processing units and the one or plural transfer apparatuses, at least one of the calculated operation rate and the calculated degree of freedom of taking-out.
G05B 19/4155 - Numerical control (NC), i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
A substrate processing apparatus includes: a first module used in a substrate processing process; a second module used in a substrate processing process after the first module; a nozzle provided in the second module and configured to supply a target treatment liquid; a temperature detector that detects a temperature of a treatment liquid inside the nozzle or a temperature of the nozzle; a substrate detection sensor that detects a position of a substrate; and a controller that controls discharge of the target treatment liquid from the nozzle performed before the substrate is conveyed to the second module according to the temperature of the treatment liquid detected by the temperature detector and the position of the substrate.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning
B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
A cleaning device includes: a substrate rotation mechanism that holds and rotates a substrate around center axis thereof; a first single-tube nozzle that discharges first cleaning liquid toward a top surface of the substrate; and a second single-tube nozzle that discharges second cleaning liquid toward the top surface of the substrate. The first single-tube nozzle and the second single-tube nozzle are disposed such that the second single-tube nozzle discharges the second cleaning liquid in a forward direction of a rotation direction of the substrate at a position farther away from the center of the substrate than a landing position of the first cleaning liquid, and a part is generated in which liquid flow on the top surface of the substrate after landing of the first cleaning liquid and liquid flow on the top surface of the substrate after landing of the second cleaning liquid are combined.
To improve uniformity of a plating film-thickness formed on a substrate.
To improve uniformity of a plating film-thickness formed on a substrate.
A plating module 400 includes a plating tank 410 for housing a plating solution, a substrate holder 440 for holding a substrate Wf, an anode 430 housed within the plating tank 410, an anode mask 460 arranged between the substrate Wf held by the substrate holder 440 and the anode 430 and provided with an opening 466 in a center, and an ionically resistive element 450 arranged at an interval from the anode mask 460 between the substrate Wf held by the substrate holder 440 and the anode mask 460 and provided with a plurality of holes.
A method in which an acoustic sensor disposed in a polishing apparatus can be accurately calibrated is disclosed. In this method, polishing sounds of a substrate are acquired using an acoustic sensor; and then at least two distinctive sounds, having distinctive frequencies respectively, are selected from the acquired polishing sounds. Further, the at least two distinctive sounds are output from a sound source coupled to any of a polishing table, the acoustic sensor, and a substrate holder to cause the at least two distinctive sounds to be input to the acoustic sensor. Next, output values of the acoustic sensor are calibrated, such that the output values of the acoustic sensor relative to the at least two distinctive sounds come within an allowable range.
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
99.
METHOD OF RAISING POLISHING HEAD AFTER POLISHING OF WORKPIECE, POLISHING APPARATUS FOR WORKPIECE, AND COMPUTER-READABLE STORAGE MEDIUM STORING PROGRAM
A method of raising a polishing head capable of preventing a workpiece from bending and preventing an excessive stress from generating in the workpiece by avoiding contact between the workpiece and a retainer ring when the polishing head is raised from a polishing pad after polishing of the workpiece is disclosed. The method includes: polishing the workpiece by pressing the workpiece against the polishing pad while rotating the polishing head and the polishing pad; stopping the rotations of the polishing pad and the polishing head; raising the retainer ring of the polishing head relative to the workpiece to separate the retainer ring from the polishing pad and moving the retainer ring to a position higher than the workpiece; and then raising the polishing head with the workpiece held on the polishing head.
A substrate cleaning device and a substrate polishing device are provided. The substrate cleaning device is provided in a substrate polishing device, which includes a polishing table having a polishing surface for polishing a substrate and a top ring holding the substrate with a membrane while surrounding an outer peripheral part of the substrate with a retainer ring, and cleaning the surface after polishing. The top ring is freely movable between a substrate polishing position above the table and a substrate handover position at a side of the table. The substrate cleaning device is provided corresponding to a cleaning position between the polishing and handover positions, and includes a first spray unit including cleaning nozzles for spraying cleaning liquid on the substrate, membrane, and retainer ring at the cleaning position; and a second spray unit including a substrate rinse nozzle spraying rinse liquid onto the substrate at the cleaning position.
patents
