Ti ink compositions for printing, such as ink jet printing, are disclosed. The ink compositions comprise a liquid dispersion of Ti hydride powder having a mean particle size of less than 10.0 microns; a liquid carrier; and at least one surfactant. Methods of making and using the disclosed inks are also disclosed. For example, a finished Ti product can be produced by printing the disclosed ink composition, such as by ink jet printing, to form a green article, heating the green article to dehydrogenate it and form a Ti containing part. The method may further comprise sintering the Ti containing part to produce a sintered Ti product. In an embodiment, the method comprises printing one or more support materials for the ink composition, that comprises solid particles of a metal oxide, a metal carbide, a metal nitride, a polymer, or combinations thereof.
B22F 1/107 - Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
B22F 1/145 - Chemical treatment, e.g. passivation or decarburisation
B22F 10/14 - Formation of a green body by jetting of binder onto a bed of metal powder
A system for forming a product with different size particles is disclosed. The system comprises at least one print head region configured to retain a first group of print heads configurable to additively print at least a first portion of the product with a first material and a second group of print heads configurable to additively print at least a second portion of the product with a second material. The described system may also comprise a processor configured to regulate the first group of print heads and the second group of print heads to distribute the first material and the second material. A method of making an object by ink jet printing using the disclosed system is also disclosed.
B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
B22F 12/55 - Two or more means for feeding material
B22F 10/43 - Structures for supporting workpieces or articles during manufacture and removed afterwards characterised by material
B29C 64/40 - Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
B29C 64/165 - Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
B33Y 70/00 - Materials specially adapted for additive manufacturing
B29C 64/393 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
B28B 1/00 - Producing shaped articles from the material
B28B 17/00 - SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER - Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
B22F 10/38 - Process control to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures
B22F 10/62 - Treatment of workpieces or articles after build-up by chemical means
B22F 10/64 - Treatment of workpieces or articles after build-up by thermal means
B22F 10/66 - Treatment of workpieces or articles after build-up by mechanical means
B29K 505/00 - Use of metals, their alloys or their compounds, as filler
3D (three-dimensional) ink-jet printing includes techniques for evaporating a carrier liquid during printing while at least a portion of dispersant remains in the printed layer; evaporating dispersant in a first layer prior to sintering the first layer and/or prior to printing a second layer; leveling an upper-layer of a printed object using a horizontal roller; and printing layers of an object, each layer with both object and support portions, resulting in an object with support, in particular, support for negative angles and molds.
B22F 3/105 - Sintering only by using electric current, laser radiation or plasma
B28B 17/00 - SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER - Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
B28B 1/00 - Producing shaped articles from the material
B29C 64/118 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
4.
Tungsten-carbide/cobalt ink composition for 3D inkjet printing
There is disclosed an ink composition for three dimensional (3D) printing. The ink composition comprises: a liquid dispersion of tungsten carbide (WC) particles and cobalt (Co) particles, and, a carrier vehicle for the dispersion of tungsten carbide particles and the dispersion of cobalt particles. The ink composition is of a viscosity usable with ink jet print heads for 3D printing.
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
B29C 64/40 - Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
B22F 10/00 - Additive manufacturing of workpieces or articles from metallic powder
B28B 1/00 - Producing shaped articles from the material
C09D 11/03 - Printing inks characterised by features other than the chemical nature of the binder
C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
B28B 17/00 - SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER - Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
Ti ink compositions for printing, such as ink jet printing, are disclosed. The ink compositions comprise a liquid dispersion of Ti hydride powder having a mean particle size of less than 10.0 microns; a liquid carrier, and at least one surfactant. Methods of making and using the disclosed inks are also disclosed. For example, a finished Ti product can be produced by printing the disclosed ink composition, such as by ink jet printing, to form a green article, heating the green article to dehydrogenate it and form a Ti containing part. The method may further comprise sintering the Ti containing part to produce a sintered Ti product. In an embodiment, the method comprises printing one or more support materials for the ink composition, that comprises solid particles of a metal oxide, a metal carbide, a metal nitride, a polymer, or combinations thereof.
B22F 1/107 - Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
B22F 1/145 - Chemical treatment, e.g. passivation or decarburisation
B22F 10/14 - Formation of a green body by jetting of binder onto a bed of metal powder
3D (three-dimensional) ink-jet printing includes techniques for evaporating a carrier liquid during printing while at least a portion of dispersant remains in the printed layer; evaporating dispersant in a first layer prior to sintering the first layer and/or prior to printing a second layer; leveling an upper-layer of a printed object using a horizontal roller; and printing layers of an object, each layer with both object and support portions, resulting in an object with support, in particular, support for negative angles and molds.
B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
7.
3D PRINTING OF INORGANIC MATERIAL IN ROUND INKJET PRINTING CONFIGURATION
An apparatus and methods of additive manufacturing are provided. The apparatus may include at least one frame for supporting at least one print head configured to deposit fluidic additive manufacturing material layer by layer, at least one reservoir in communication with the at least one print head, the at least one reservoir being configured to contain the additive manufacturing material, a printing table including at least one printing region for supporting at least one removable substrate for printing at least one three-dimensional object, the at least one removable substrate is made from a material other than the additive manufacturing material, and at least one processor configured to: control a rotational movement between the at least one print head and the printing table; and control vertical movement between the at least one print head and the printing table.
B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
B22F 3/00 - Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor
B28B 1/00 - Producing shaped articles from the material
B28B 17/00 - SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER - Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
B29C 64/188 - Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control
An ink composition for use as a support ink in three dimensional (3D) printing processes comprises a dispersion of solid particles in liquid carder, compatible with an inkjet print head, wherein after removing the liquid carder, the solid particles serve as support material for a Three Dimensional (3D) printed object, wherein the support material is separable from the 3D printed object.
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
B29C 64/40 - Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
B22F 10/00 - Additive manufacturing of workpieces or articles from metallic powder
B33Y 40/20 - Post-treatment, e.g. curing, coating or polishing
B28B 1/00 - Producing shaped articles from the material
C09D 11/03 - Printing inks characterised by features other than the chemical nature of the binder
C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
B28B 17/00 - SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER - Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
Inkjet head cleaning and storage includes cleaning an orifice plate by inserting a tip of a shaped wiper into a slit of a printing mask, such that one or more shoulders of a handling end of the shaped wiper are in contact with respectively one or more edges of the slit. The shoulders of the shaped wiper facilitate the tip applying a predetermined pressure to an orifice surface during wiping. Preventing sediment buildup during extended periods of non-printing includes placing at least the orifice plate of the printing head in a protecting liquid that avoids evaporation of the volatile liquid from the nozzles. An innovative “night plate” can be used to seal the slit of a printing mask and ink purged from the printing head used to fill a gap between the printing head and the mask, thereby covering at least the orifice plate with purged ink.
A system for forming a product with different size particles is disclosed. The system comprises at least one print head region configured to retain a first group of print heads configurable to additively print at least a first portion of the product with a first material and a second group of print heads configurable to additively print at least a second portion of the product with a second material. The described system may also comprise a processor configured to regulate the first group of print heads and the second group of print heads to distribute the first material and the second material. A method of making an object by ink jet printing using the disclosed system is also disclosed.
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
B33Y 70/00 - Materials specially adapted for additive manufacturing
B29C 64/393 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
B29C 64/165 - Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
B28B 1/00 - Producing shaped articles from the material
B28B 17/00 - SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER - Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
B29K 505/00 - Use of metals, their alloys or their compounds, as filler
A printing head assembly with integrated purge mechanism is disclosed. The printing head assembly comprises: (a) a liquid dispensing head comprising one or more dispensing nozzles enclosed in a nozzle plate, driven by at least first and second pressures, and (b) a shielding mask including an opening in front of the one or more nozzles, wherein the opening being configured such that when printing liquid is dispensed from the head driven by the first pressure, the liquid being dispensed in pulses through the opening in the shielding mask, and (ii) when purge printing liquid is dispensed from the head driven by the second pressure, the liquid being drawn to a capillary gap formed between the shielding mask and the nozzle plate thereby removing the purge printing liquid from the nearby nozzles.
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
B41J 2/165 - Prevention of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
A printing device for dispending material on a heated substrate is provided. The device may include a printing head having one or more nozzles and a heat shield that partially masks a side of the printing head that faces the heated substrate when printing so as to reduce heat transfer from the substrate to the printing head. The shield includes a slot aligned with the one or more nozzles to enable passage of material from the one or more nozzles to the heated substrate.
Ti ink compositions for printing, such as ink jet printing, are disclosed. The ink compositions comprise a liquid dispersion of Ti hydride powder having a mean particle size of less than 10.0 microns; a liquid carrier; and at least one surfactant. Methods of making and using the disclosed inks are also disclosed. For example, a finished Ti product can be produced by printing the disclosed ink composition, such as by ink jet printing, to form a green article, heating the green article to dehydrogenate it and form a Ti containing part. The method may further comprise sintering the Ti containing part to produce a sintered Ti product. In an embodiment, the method comprises printing one or more support materials for the ink composition, that comprises solid particles of a metal oxide, a metal carbide, a metal nitride, a polymer, or combinations thereof.
C09D 1/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
A printing head assembly with integrated purge mechanism is disclosed. The printing head assembly comprises: (a) a liquid dispensing head comprising one or more dispensing nozzles enclosed in a nozzle plate, driven by at least first and second pressures, and (b) a shielding mask including an opening in front of the one or more nozzles, wherein the opening being configured such that when printing liquid is dispensed from the head driven by the first pressure, the liquid being dispensed in pulses through the opening in the shielding mask, and (ii) when purge printing liquid is dispensed from the head driven by the second pressure, the liquid being drawn to a capillary gap formed between the shielding mask and the nozzle plate thereby removing the purge printing liquid from the nearby nozzles.
B41J 2/165 - Prevention of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
B29C 64/20 - Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering - Details thereof or accessories therefor
Embodiments of the invention are directed to a method of printing lines. A method may include positioning a plurality of print units according to a predefined spacing parameter. A method may include depositing material on a substrate by a plurality of print units to form a respective plurality of parallel lines according to a predefined spacing parameter. A printing unit may be positioned at an angle with respect to a predefined scan direction such that a predefined width of a printed line is achieved. A substrate may be rotated between scans such that a plurality of lines in a respective plurality of directions is printed in a scan direction.
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
B41J 3/54 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed with two or more sets of type or printing elements
B41J 25/00 - Actions or mechanisms not otherwise provided for
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
C23C 4/01 - Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated
B41J 2/155 - Arrangement thereof for line printing
B41M 1/22 - Metallic printing; Printing with powdered inks
B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
16.
TITANIUM INKS, METHODS OF MAKING AND USING THE SAME TO MAKE TITANIUM ARTICLES
Ti ink compositions for printing, such as ink jet printing, are disclosed. The ink compositions comprise a liquid dispersion of Ti hydride powder having a mean particle size of less than 10.0 microns; a liquid carrier; and at least one surfactant. Methods of making and using the disclosed inks are also disclosed. For example, a finished Ti product can be produced by printing the disclosed ink composition, such as by ink jet printing, to form a green article, heating the green article to dehydrogenate it and form a Ti containing part. The method may further comprise sintering the Ti containing part to produce a sintered Ti product. In an embodiment, the method comprises printing one or more support materials for the ink composition, that comprises solid particles of a metal oxide, a metal carbide, a metal nitride, a polymer, or combinations thereof.
B22F 1/02 - Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition comprising coating of the powder
H05K 1/09 - Use of materials for the metallic pattern
17.
Tungsten-Carbide/Cobalt ink composition for 3D inkjet printing
There is disclosed an ink composition for three dimensional (3D) printing. The ink composition comprises: a liquid dispersion of tungsten carbide (WC) particles and cobalt (Co) particles, and, a carrier vehicle for the dispersion of tungsten carbide particles and the dispersion of cobalt particles. The ink composition is of a viscosity usable with ink jet print heads for 3D printing.
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
B29C 64/40 - Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
C09D 11/03 - Printing inks characterised by features other than the chemical nature of the binder
C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
B28B 17/00 - SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER - Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
B33Y 70/00 - Materials specially adapted for additive manufacturing
B33Y 80/00 - Products made by additive manufacturing
B33Y 40/00 - Auxiliary operations or equipment, e.g. for material handling
B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
18.
Method and device for printing on heated substrates
A printing device for dispending material on a heated substrate is provided. The device may include a printing head having one or more nozzles and a heat shield that partially masks a side of the printing head that faces the heated substrate when printing so as to reduce heat transfer from the substrate to the printing head. The shield includes a slot aligned with the one or more nozzles to enable passage of material from the one or more nozzles to the heated substrate.
A method of printing is provided where printing is using a first printing unit having redundant nozzles. Then, the method may include stopping the printing with the first printing unit while continuing the printing with active nozzles of a second printing unit. The method may include inspecting the first printing unit and identifying faulty nozzles, then designating the faulty nozzles as inactive and designating inactive nozzles of the first printing unit as a new active nozzle. According to some embodiments the method may include moving the first printing unit to an inspection zone prior to inspecting while continuing the printing with active nozzles of a second printing unit and moving the first printing unit back to the printing zone after inspection and continuing the printing with the first printing unit.
Printing systems are disclosed for preventing sediment buildup. In one implementation, a printing system is provided. The printing system includes a print area and a print head housing configured to enclose a print head spaced from the print area. The print head has a plurality of nozzles for expelling a printing liquid therefrom. The printing system further includes a pipe for interconnecting the print head with a reservoir, a pump for circulating the printing liquid from the reservoir to the print head and through the plurality of nozzles, and a processor. The processor may cause the pump to circulate the printing liquid to the print head and through the plurality of nozzles during a period of non-printing. In one embodiment, circulating the printing liquid includes flowing the printing liquid from the reservoir to the print head and from a retainer located below the plurality of nozzles back to the reservoir.
3D (three-dimensional) ink-jet printing includes techniques for evaporating a carrier liquid during printing while at least a portion of dispersant remains in the printed layer; evaporating dispersant in a first layer prior to sintering the first layer and/or prior to printing a second layer; leveling an upper-layer of a printed object using a horizontal roller; and printing layers of an object, each layer with both object and support portions, resulting in an object with support, in particular, support for negative angles and molds.
C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
An ink composition for use as a support ink in three dimensional (3D) printing processes comprises a dispersion of solid particles in liquid carrier, compatible with an inkjet print head, wherein after removing the liquid carrier, the solid particles serve as support material for a Three Dimensional (3D) printed object, wherein the support material is separable from the 3D printed object.
There is disclosed an ink composition for three dimensional (3D) printing. The ink composition comprises: a liquid dispersion of tungsten carbide (WC) particles and cobalt (Co) particles, and, a carrier vehicle for the dispersion of tungsten carbide particles and the dispersion of cobalt particles. The ink composition is of a viscosity usable with ink jet print heads for 3D printing.
B33Y 80/00 - Products made by additive manufacturing
B29C 64/112 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
C22C 29/08 - Alloys based on carbides, oxides, borides, nitrides or silicides, e.g. cermets, or other metal compounds, e. g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds based on tungsten carbide
24.
TUNGSTEN-CARBIDE/COBALT INK COMPOSITION FOR 3D INKJET PRINTING
There is disclosed an ink composition for three dimensional (3D) printing. The ink composition comprises: a liquid dispersion of tungsten carbide (WC) particles and cobalt (Co) particles, and, a carrier vehicle for the dispersion of tungsten carbide particles and the dispersion of cobalt particles. The ink composition is of a viscosity usable with ink jet print heads for 3D printing.
C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
C22C 29/08 - Alloys based on carbides, oxides, borides, nitrides or silicides, e.g. cermets, or other metal compounds, e. g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds based on tungsten carbide
A printing head assembly with integrated purge mechanism is disclosed. The printing head assembly comprises: (a) a liquid dispensing head comprising one or more dispensing nozzles enclosed in a nozzle plate, driven by at least first and second pressures, and (b) a shielding mask including an opening in front of the one or more nozzles, wherein the opening being configured such that when printing liquid is dispensed from the head driven by the first pressure, the liquid being dispensed in pulses through the opening in the shielding mask, and (ii) when purge printing liquid is dispensed from the head driven by the second pressure, the liquid being drawn to a capillary gap formed between the shielding mask and the nozzle plate thereby removing the purge printing liquid from the nearby nozzles.
B41J 2/165 - Prevention of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
Inkjet head cleaning and storage includes cleaning an orifice plate by inserting a tip of a shaped wiper into a slit of a printing mask, such that one or more shoulders of a handling end of the shaped wiper are in contact with respectively one or more edges of the slit. The shoulders of the shaped wiper facilitate the tip applying a predetermined pressure to an orifice surface during wiping. Preventing sediment buildup during extended periods of non-printing includes placing at least the orifice plate of the printing head in a protecting liquid that avoids evaporation of the volatile liquid from the nozzles. An innovative “night plate” can be used to seal the slit of a printing mask and ink purged from the printing head used to fill a gap between the printing head and the mask, thereby covering at least the orifice plate with the purged ink.
Some aspects of the invention are related to a solar cell, for producing electricity from solar radiation. The solar cell may include a substrate, for example, polycrystalline silicon and an electrically conductive structure disposed on the substrate. The electrically conductive structure may include a bus bar and one or more finger electrodes positioned such that at least a portion of a finger electrode overlaps the bus bar.
Inkjet head cleaning and storage includes cleaning an orifice plate by inserting a tip of a shaped wiper into a slit of a printing mask, such that one or more shoulders of a handling end of the shaped wiper are in contact with respectively one or more edges of the slit. The shoulders of the shape wiper facilitate the tip applying a predetermined pressure to an orifice surface during wiping. Preventing sediment buildup during extended periods of non-printing includes placing at least the orifice plate of the printing head in a protecting liquid that avoids evaporation of the volatile liquid from the nozzles. An innovative “night plate” can be used to seal the slit of a printing mask and ink purged from the printing head used to fill a gap between the printing head and the mask, thereby covering at least the orifice plate with the purged ink.
A method for evaluating performance of a plurality of nozzles of a printing head includes repeatedly operating each of the nozzles to print test marks on a surface of a substrate, each of the test marks printed by that nozzle being printed at a different time. At least once during the repeated operation of each of the nozzles, at least some of the test marks are erased from the surface. The test marks that were printed by that nozzle are inspected for a feature that is indicative of the performance of that nozzle.
A printing head assembly with integrated purge mechanism is disclosed. The printing head assembly comprises: (a) a liquid dispensing head comprising one or more dispensing nozzles enclosed in a nozzle plate, driven by at least first and second pressures, and (b) a shielding mask including an opening in front of the one or more nozzles, wherein the opening being configured such that when printing liquid is dispensed from the head driven by the first pressure, the liquid being dispensed in pulses through the opening in the shielding mask, and (ii) when purge printing liquid is dispensed from the head driven by the second pressure the liquid being drawn to a capillary gap formed between the shielding mask and the nozzle plate thereby removing the purge printing liquid from the nearby nozzles.
Inkjet head cleaning and storage includes cleaning an orifice plate by inserting a tip of a shaped wiper into a slit of a printing mask, such that one or more shoulders of a handling end of the shaped wiper are in contact with respectively one or more edges of the slit. The shoulders of the shaped wiper facilitate the tip applying a predetermined pressure to an orifice surface during wiping. Preventing sediment buildup during extended periods of non-printing includes placing at least the orifice plate of the printing head in a protecting liquid that avoids evaporation of the volatile liquid from the nozzles. An innovative "night plate" can be used to seal the slit of a printing mask and ink purged from the printing head used to fill a gap between the printing head and the mask, thereby covering at least the orifice plate with the purged ink.
A printing device for dispending material on a heated substrate is provided. The device may include a printing head having one or more nozzles and a heat shield that partially masks a side of the printing head that faces the heated substrate when printing so as to reduce heat transfer from the substrate to the printing head. The shield includes a slot aligned with the one or more nozzles to enable passage of material from the one or more nozzles to the heated substrate.
A method for evaluating performance of a plurality of nozzles of a printing head includes repeatedly operating each of the nozzles to print test marks on a surface of a substrate, each of the test marks printed by that nozzle being printed at a different time. At least once during the repeated operation of each of the nozzles, at least some of the test marks are erased from the surface. The test marks that were printed by that nozzle are inspected for a feature that is indicative of the performance of that nozzle.
Embodiments of the invention are directed to a method of printing lines. A method may include positioning a plurality of print units according to a predefined spacing parameter. A method may include depositing material on a substrate by a plurality of print units to form a respective plurality of parallel lines according to a predefined spacing parameter. A printing unit may be positioned at an angle with respect to a predefined scan direction such that a predefined width of a printed line is achieved. A substrate may be rotated between scans such that a plurality of lines in a respective plurality of directions is printed in a scan direction.
B41J 25/00 - Actions or mechanisms not otherwise provided for
B41J 3/54 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed with two or more sets of type or printing elements
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
35.
PRINTING SYSTEM WITH SELF-PURGE, SEDIMENT PREVENTION AND FUMES REMOVAL ARRANGEMENTS
A printing head assembly with integrated purge mechanism is disclosed. The printing head assembly comprises: (a) a liquid dispensing head comprising one or more dispensing nozzles enclosed in a nozzle plate, driven by at least first and second pressures, and (b) a shielding mask including an opening in front of the one or more nozzles, wherein the opening being configured such that when printing liquid is dispensed from the head driven by the first pressure, the liquid being dispensed in pulses through the opening in the shielding mask, and (ii) when purge printing liquid is dispensed from the head driven by the second pressure, the liquid being drawn to a capillary gap formed between the shielding mask and the nozzle plate thereby removing the purge printing liquid from the nearby nozzles.
A method for fabricating electric contacts for a semiconductor substrate includes depositing a first line of a first conducting material on the semiconductor substrate and depositing a second line of a second conducting material on the substrate, so as to cross the first line. The first conducting material and the second conducting material may differ from one another in that the first conducting material and the second conducting material penetrate into the substrate to different depths when subjected to a heat treatment. Furthermore, materials may differ from one another in that an electrical connection formed between the substrate and the first conducting material when subjected to the heat treatment differs in its contact resistivity from an electrical connection formed between the substrate and the second conducting material when subjected to the heat treatment. Alternatively, the method may include depositing a first line of a conducting material on the substrate, the first line including a zone of reduced thickness, and depositing a second line of a conducting material on the substrate, so as to cross the first line at the zone of the reduced thickness.
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
37.
ALIGNMENT OF MATERIAL DEPOSITION SYSTEM WITH SUBSTRATE
A method for depositing material in a predetermined pattern on a moving substrate includes sensing an orientation and a velocity of the moving substrate. The method further includes rotating a material deposition unit in accordance with the orientation of the moving substrate and translating the material deposition unit in accordance with the orientation and location of the moving substrate. Concurrently with the rotating and translating the material deposition unit, the material deposition unit deposits the material in the predetermined pattern on the moving substrate so as to align the predetermined pattern with the substrate.
A printing device for dispending material on a heated substrate is provided. The device may include a printing head having one or more nozzles and a heat shield that partially masks a side of the printing head that faces the heated substrate when printing so as to reduce heat transfer from the substrate to the printing head. The shield includes a slot aligned with the one or more nozzles to enable passage of material from the one or more nozzles to the heated substrate.
B41J 2/05 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers produced by the application of heat
39.
METHOD AND APPARATUS FOR PRINT UNIT INSPECTION AND CALIBRATION
A system and method for inspecting a printing system is provided. A first part of a pattern and a test pattern may be printed on a substrate. In some embodiments, the substrate may be rotated. An image of the test pattern may be acquired. An acquired image of the test pattern may be analyzed. An action may be performed based on an analysis of an image of the test pattern. A second part of a pattern may be deposited and may cover some or all of the test pattern.
Embodiments of the invention are directed to a system and method of depositing material on a polycrystalline semiconductor substrate. The method may comprise detecting characteristics of polycrystalline semiconductor substrate, generating image data of a customized pattern of lines based on the characteristics of the substrate and depositing material from one or more nozzles on the substrate according to the image data of the customized pattern. The the characteristics may include grain boundaries of the substrate and spatial variations in sheet resistance and/or the minority carrier lifetime of the substrate.
Embodiments of the invention are directed to a method of printing lines. A method may include positioning a plurality of print units according to a predefined spacing parameter. A method may include depositing material on a substrate by a plurality of print units to form a respective plurality of parallel lines according to a predefined spacing parameter. A printing unit may be positioned at an angle with respect to a predefined scan direction such that a predefined width of a printed line is achieved. A substrate may be rotated between scans such that a plurality of lines in a respective plurality of directions is printed in a scan direction.
A system and method of translating substrates is provided. A plurality of substrates may be translated according to a respective plurality of routes. In some embodiments, a plurality of routes may be associated with a common segment in a processing zone. A plurality of routes may enable translating a plurality of items through a common processing zone. A route may be associated with a plurality of spatial precisions. A route may comprise a first segment from a starting point to an ending point of an operational track and a second segment from an ending point to a starting point of the operational track.
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
Embodiments of the invention are directed to a method of printing lines. The method may include depositing material on a substrate from a plurality of nozzles to form a multi-layered line of a desired cross section area or a desired height by dispensing the material in at least two layers in a single scan. Each layer may be printed by different nozzles and the number of layers in the line is determined based on the desired cross section area or height.
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
B41J 2/155 - Arrangement thereof for line printing
44.
METHOD AND SYSTEM FOR NOZZLE COMPENSATION IN NON-CONTACT MATERIAL DEPOSITION
A method of printing is provided where printing is using a first printing unit (220) having redundant nozzles (221, 222, 223). Then, the method may include stopping the printing with the first printing unit while continuing the printing with active nozzles of a second printing unit (210, 230). The method may include inspecting the first printing unit and identifying faulty nozzles, then designating the faulty nozzles (225) as inactive and designating inactive nozzles (221, 222, 223) of the first printing unit as a new active nozzle. According to some embodiments the method may include moving the first printing unit to an inspection zone prior to inspecting while continuing the printing with active nozzles of a second printing unit and moving the first printing unit back to the printing zone after inspection and continuing the printing with the first printing unit.
Embodiments of the invention are directed to a deposition printing system which includes two or more print units capable of moving with respect to each other during printing, each of the print units having one or more print heads together forming a head arrangement; and a controller to control movement of the print units to dynamically change the head arrangement during the printing.
Embodiments of the invention art directed to an inkjet printing system (200) which, includes two or more print units (250) capable of moving with respect to each other during printing, each of the print unite having one or more print heads (220) together forming a head arrangement; and a controller (270) to control movement of the print units (250) to dynamically change the head arrangement during the printing.
patents
