Unimicron Technology Corp.

Taiwan, Province of China

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LID, FABRICATING METHOD THEREOF, AND MEMS PACKAGE MADE THEREBY

      
Application Number IT2009000527
Publication Number 2011/061771
Status In Force
Filing Date 2009-11-20
Publication Date 2011-05-26
Owner
  • UNIMICRON TECHNOLOGY CORP. (Taiwan, Province of China)
  • STMICROELECTRONICS S.R.L. (Italy)
Inventor
  • Cortese, Mario, Francesco
  • Azzopardi, Mark, A.
  • Hsu, Shih-Ping
  • Tsai, Kun-Chen
  • Micallef, Ivan

Abstract

A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board (20) with opposite first and second surfaces (20a, 20b) having first and second metal layers (21a, 21b) disposed thereon, respectively, wherein a through cavity (200) extends through the first board and the first and second metal layers; a second board (23) with opposite third and fourth surfaces (23a, 23b); an adhesive layer (22) sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess (200); and a first conductor layer (25a) coating the bottom and the side surfaces (201a, 201b) of the recess. The lid enhances the shielding effect upon the MEMS device.

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