Abstract

In a component feeding method in a surface mounting machine, a component fed from a tape feeder (15) equipped in a feeder installation region (13) is taken out by a head (19) and mounted on a substrate (P). A rank to be the capability index of the feeder (15) is determined for every feeder, the rank of the feeder (15) requested for production of the substrate (P) is predetermined as a requested rank, and the component is fed by equipping the feeder (15) conforming to the requested rank of the substrate in the feeder installation region (13) at the time of producing the substrate.

IPC Classes  ?

• H05K 13/02 - Feeding of components
• H05K 13/04 - Mounting of components

Abstract

In the method for sucking a component by means of a nozzle (21) of a surface mounting machine having a movable mounting head (20) equipped with the nozzle (21) for sucking a component, sucking a component from a component feeding section by negative pressure supplied to the nozzle (21), carrying the component above a substrate and mounting the component thereon, the time elapsing before the nozzle (21) arrives at the position for sucking the component is calculated, and negative pressure supply is started at the time retroacted from the arriving time by the settling time of negative pressure, i.e. the time (actual measurement value measured beforehand) required for settling the negative pressure after starting negative pressure supply to the nozzle (21).

IPC Classes  ?

• H05K 13/04 - Mounting of components

Abstract

[PROBLEMS] To provide a component placing apparatus which correctly adjusts a shift of coordinate system of a placing head and that of an imaging means and effectively prevents erroneous suction of a component, while efficiently confirming a suction position by the imaging means which can move independently from the placing head. [MEANS FOR SOLVING PROBLEMS] A component mounting apparatus (1) is provided with a placing head (4) which sucks and transfers a chip component (6) supplied from a component supplying section (5); and a suction position recognition camera (32), which is arranged to be independently movable from the placing head (4), and picks up the image of the chip component (6) before the placing head (4) sucks the chip component (6) from the component supplying section (5). A control unit (40) for controlling operation of the component mounting apparatus (1) checks correlative relationship of the coordinate system of the mounting head (4) and that of the suction position recognition camera (32) in prescribed timing. Based on the correlative relationship, a moving quantity of the placing head (4) at the time of accessing the chip component (6) in the component supplying section (5) is corrected.

IPC Classes  ?

• H01L 21/52 - Mounting semiconductor bodies in containers
• G06T 1/00 - General purpose image data processing
• H05K 13/04 - Mounting of components

Abstract

[PROBLEMS] To recognize an image of a component stably and accurately over a long period of time in a component recognizing device for imaging a component by moving a scan unit having an imaging means by a linear motor and in a surface mounting machine and a component testing machine both of which are equipped with the component recognizing device. [MEANS FOR SOLVING PROBLEMS] A permanent magnet (732) is fixed on the head unit (6) side, with a face (732a) opposite to a coil portion (733) and facing downwards. The coil portion (733) is arranged immediately below the permanent magnet (732). Due to this structure, attraction force (Fm) generated between the coil portion (733) and the permanent magnet (732) acts on a linear guide (72) upwards (in the +Z direction) via a bottom frame (731). Meanwhile, the own weight (Fg) of the scan unit (71), etc. acts downwards, reducing the effect of the attraction force (Fm) applied to the linear guide (72) by the deadweight (Fg).

IPC Classes  ?

• H05K 13/08 - Monitoring manufacture of assemblages
• H05K 13/04 - Mounting of components

Abstract

A mounting apparatus mounts a component (A) on a substrate (W). The mounting apparatus is provided with a head unit (40) wherein a plurality of heads (41) for picking up the component (A) are arranged in a prescribed direction; a head unit transfer means (4) for moving the head unit (40); a substrate imaging camera (21) (substrate imaging means) arranged on the head unit (40), for picking up an image of the substrate (W); and a camera moving means (25) (imaging moving means) which moves the substrate imaging camera (21) to the head unit (40) in the arrangement direction of the heads (41).

IPC Classes  ?

• H05K 13/04 - Mounting of components
• H05K 13/08 - Monitoring manufacture of assemblages

Abstract

A component recognizing apparatus is provided for recognizing a suction status of an electronic component sucked by a suction nozzle by image, by scanning the lower section of the electronic component. An optical path directed downward from the suction nozzle is refracted in a horizontal direction by a first optical path changing section to permit the suction nozzle to approach the upper surface of a base and perform transfer operation, and the optical path is further refracted in other direction by a second optical path changing section. Then, the lower surface of the suction nozzle is imaged by an imaging means, and the electronic component, which is sucked by the suction nozzle along the horizontal direction optical path changed by the first optical path changing section, is illuminated.

IPC Classes  ?

• H05K 13/08 - Monitoring manufacture of assemblages
• H05K 13/04 - Mounting of components

Abstract

To make it possible to efficiently perform a feeder replacement operation. A feeder (50) has a shape elongated in one direction. The feeder replacement operation is performed by inserting and extracting the feeder (50) into and from a feeder-mounting part (150) along the longitudinal direction. The rear end (111) of the longitudinal both ends of respective feeders (50A, 50B, ...), which is positioned on a rear side in the assembling direction, is provided with a guide part for guiding the mounting of other tape feeder (50C) to be installed adjacent to the afore-said feeders. The guide part can be formed by, for example, rounding the corner part of the rear end (111) of the feeder (50).

IPC Classes  ?

• H05K 13/02 - Feeding of components

Abstract

A parts feeding device constructed such that a tape receiving box of the device has a high degree of freedom in the size that can be set depending on use conditions. The parts feeding device (50) has a feeding device (80) for feeding a parts feeding tape TP toward a predetermined part take-out position, the parts feeding tape TP having a carrier tape CA and cover tape CV receiving parts at constant intervals, and also has a separation device (90) for separating the cover tape CV from the carrier tape CA by pulling the cover tape CV in a direction different from the feeding direction of the feeding device (80). Further, the parts feeding device (50) has a tape receiving box (200) for receiving the cover tape CV separated by the separation device (90). The receiving volume of the tape receiving box (200) is changeable.

IPC Classes  ?

• H05K 13/02 - Feeding of components

Abstract

To make it possible to easily perform a cover tape setting operation. An opening surface (128) opening to one side and continuous with the tape feeding direction is formed in the front guide part (120) of a tape guide (110) for guiding a part-feeding tape (35). A cover tape (37) is fed into and out from the front guide part (120) through the opening surface (128). Through predetermined operation steps, the operation for setting the cover tape (37) can be performed in a state that the tape guide (110) is fixed to a part feeder (40).

IPC Classes  ?

• H05K 13/02 - Feeding of components

Abstract

The position of a component supplying apparatus is controlled even in vertical directions with a relatively simple configuration. A pin (125) is arranged on an attaching section (110) of a carriage (Ds), and a receiving section (141) having a positioning groove (145) is arranged on the front side of the component supplying apparatus (50). The axial line (L1) of the pin (125) and the axial line (L2) of the positioning groove (145) are diagonally tilted. Thus, as a result of having the receiving section (141) pressed downward along the axial line (L1) of the pin, floating of the front end of the component supplying apparatus is controlled.

IPC Classes  ?

• H05K 13/02 - Feeding of components

Abstract

A component supplying apparatus and a reel can be easily and integrally managed when supplying components, and the component supplying apparatus can be reduced in sizes when the component supplying apparatus and the reel are not integrally managed. The component supplying apparatus (50) has an apparatus main body section (53). The apparatus main body section is provided with a feeding apparatus (52) for pulling out a tape (TP), which holds components at prescribed intervals, from a reel (80) toward a prescribed component supplying position, and a main body frame (500) whereupon the feeding apparatus (52) is mounted. The component supplying apparatus is removably mounted on a surface mounting apparatus (10). The component supplying apparatus (50) is provided with an engaging section (100) as a reel holding means, which is mounted on the apparatus main body section (53) and is displaced between a holding position where the reel (80) is held and a storing position where the reel is not held.

IPC Classes  ?

• H05K 13/02 - Feeding of components

Abstract

A plurality of previously marked reference electronic components (M1, M2) are identified and recognized, and the position of an electronic component (2a) to be taken out is calculated, based on the positions of the reference electronic components (M1, M2) positioned close to the electronic component (2a) to be taken out and the component arrangement information of a wafer mapping file (MF) stored in a storage means (11f).

IPC Classes  ?

• H05K 13/02 - Feeding of components
• H01L 21/52 - Mounting semiconductor bodies in containers
• H05K 13/04 - Mounting of components
• H05K 13/08 - Monitoring manufacture of assemblages

Abstract

When suction operation is not performed to a component (X) due to various reasons even when the component is fed to a pickup position (53), reverse transfer operation is performed for returning the component (X), which is fed to the pickup position (53), from the pickup position (53) to the upstream in the tape feeding direction. Thus, waste of component is reduced by preventing the component (X) prom being discarded, by resupplying the same component to the pickup position (53) by the subsequent pickup.

IPC Classes  ?

• H05K 13/02 - Feeding of components
• H05K 13/08 - Monitoring manufacture of assemblages

Abstract

A mounter detects the feeding amount of a motor sequentially when respective electronic components held on a tape arrive at a pickup position by rotating the sprocket (52) of a tape feeder (50) by one or more revolutions, and stores the feeding amount in association with each pin (54) which is driving tape feed. Consequently, a state where an electronic component arrives at the pickup position is reproduced surely based on the feeding amount of the motor itself when the electronic component just arrives at the pickup position.

IPC Classes  ?

• H05K 13/02 - Feeding of components
• H05K 13/08 - Monitoring manufacture of assemblages

Abstract

A printing device includes a mask sheet (25), a movable printing stage (3), a camera head (40) having a mask recognition camera (41) and a substrate recognition camera (42), and a controller for controlling them. The controller executes mark recognition of the substrate (W) by using the substrate recognition camera (42). The camera head (40) is driven/controlled so as to execute mask recognition of the mask sheet (25) periodically by using the recognition camera (41) while the same mask sheet is used. Moreover, according to the latest mask position information acquired by the mark recognition of the mask sheet (25) and the substrate position information, the controller obtains a correction amount based on the position shift between the mask sheet (25) and the substrate (W) and drives/controls the printing state (3) according to the correction amount so as to mount the substrate (W) on the mask sheet (25).

IPC Classes  ?

• B41F 15/26 - Supports for workpieces for articles with flat surfaces
• B41F 33/14 - Automatic control of tripping devices by feelers, photoelectric devices, pneumatic devices, or other detectors
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

[PROBLEMS] To provide a printing device in which the position of a stencil is prevented from being displaced, and thereby, the printing accuracy can be enhanced. [MEANS FOR SOLVING THE PROBLEMS] In this printing device, a paste on a stencil (51) is spread and applied onto a substrate (W) by sliding a squeegee (61) along the surface of the stencil (51) disposed on the substrate (W). An outer adsorption means for adsorbing and holding the lower surface of the stencil (51) is provided on the outside of a squeegee sliding area in which the squeegee (61) is slid relatively to the stencil (51).

IPC Classes  ?

• B41F 15/36 - Screens; Frames; Holders therefor flat
• B41F 15/08 - Machines
• B41F 15/26 - Supports for workpieces for articles with flat surfaces
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

[PROBLEMS] To provide a squeegee for a printing device, which has an excellent scraping property and can be easily manufactured at a low cost. [MEANS FOR SOLVING THE PROBLEMS] In this squeegee for a printing device, a paste on a stencil (7) is spread and applied onto a substrate (W) by sliding the tip end (22a) of the squeegee along the surface of the stencil (7) disposed on the substrate (W). The squeegee is made of an expanded steel material. Only one side surface of the tip end (22a) is machined, and thereby, the thickness of the squeegee at the tip end can be reduced. The thickness (Ta) of the squeegee at the thinned tip end (22a) is set to 40 - 120 &mgr;m, and the length (La) thereof is set to 0.5 mm or longer.

IPC Classes  ?

• B41F 15/44 - Squeegees or doctors
• B41F 15/08 - Machines
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

[PROBLEMS] To provide a surface mounting apparatus wherein an abutting member does not abut to a printed wiring board when the abutting member is brought down. [MEANS FOR SOLVING PROBLEMS] A surface mounting apparatus is provided with conveyers (34, 53) for movably bearing a printed wiring board (2) in a transfer direction, and a substrate moving apparatus (14) which brings down a pair of tab members (71, 71) at separated positions in upstream and downstream in the transfer direction of the printed wiring board (2) and moves the tab member (71) in the transfer direction. The substrate moving apparatus (14) is provided with an interval changing apparatus for changing an interval between the pair of tab members (71, 71), and a sensor for detecting the position of the printed wiring board (2) on the conveyer. The substrate moving apparatus (14) is also provided with an interference judging means for judging whether there is the printed wiring board (2) at the position where the both tab members (71) are to be brought down, based on the position of the printed wiring board (2) detected by the sensor, and an interval setting means for moving the tab members (71) by driving them by the interval changing apparatus, based on the detection results obtained from the interference judging means.

IPC Classes  ?

• H05K 13/02 - Feeding of components
• H05K 13/04 - Mounting of components

Abstract

A print inspection device is provided with a camera (52) for picking-up an image of a substrate to be processed after a paste is printed on the substrate through a mask sheet by a printer, a measured value calculating means (62) for calculating a measured value of a printed paste area based on the picked-up image of the substrate, a setting means for setting a standard range for working state judgment of the area, and a comparing and judging means (65) for comparing the measured value with the standard range and for judging whether the printer is in a normal working state or not depending on whether the measured value is in the standard range or not. The setting means (64) sets the standard range to a less paste amount side for a predetermined period of time after the mark sheet is cleaned up than for other periods of time.

IPC Classes  ?

• G01N 21/956 - Inspecting patterns on the surface of objects
• G01B 11/00 - Measuring arrangements characterised by the use of optical techniques
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering