Abstract

An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding the first solder bond pad.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H03H 9/46 - Filters

Abstract

A system includes at least one processor and at least one memory storing program instructions that, when executed by the at least one processor, cause the system to send an acoustic ranging transmitter signal between a plurality of calibration reference positions and at least one anchor point, receive an acoustic ranging receiver signal associated with the acoustic ranging transmitter signal and with distances between the plurality of calibration reference positions and the at least one anchor point, and estimate a speed of sound based on the acoustic ranging receiver signal.

IPC Classes  ?

• G01S 5/30 - Determining absolute distances from a plurality of spaced points of known location
• G01S 15/02 - Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems using reflection of acoustic waves