A vibrating body according to an embodiment is used for cleaning a substrate. A contact portion of the vibrating body with a liquid on a surface of the substrate has a region which is inclined with respect to an end of the vibrating body that faces the substrate. If the angle between the inclined region and an extension line of the end of the vibrating body is θ, the expression included herein is satisfied. 20°≤θ≤87°
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B06B 1/02 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
Provided is a substrate processing device that makes it possible to synchronize a plurality of clamp pins to stably position a substrate at a center of rotation. A substrate processing device 1 according to an embodiment of the present invention comprises: a clamp lever 12 that, in accordance with rotation about a horizontal axis, moves at least three clamp pins 11 between an open position away from the outer peripheral edge We of a substrate W and a closed position for contacting the outer peripheral edge We and holding the substrate W; a rising/lowering ring 15 that rotates the clamp lever 12 in accordance with rising and lowering; a rotating body 30 that rotates the substrate W held by the clamp pins 11; a rotation mechanism 40 that rotates the rotating body 30 about an axis Ax; a raising/lowering mechanism 50 that raises and lowers the rising/lowering ring 15; a biasing member 56 that biases the clamp lever 12 in a direction for achieving the closed position; a synchronization ring 61 that is provided so as to be rotatable about the axis Ax and incapable of rising and lowering; a conversion mechanism 62 that converts rising and lowering of the rising/lowering ring 15 into rotation of the synchronization ring 61, while maintaining the orientation of the rising/lowering ring 15 in a horizontal state; and a supply unit 70 that supplies a processing liquid to the substrate W.
Provided are a substrate transfer device and a substrate transfer method that make it possible to transport a substrate between processing devices while maintaining the surface of the substrate in a wet state. A substrate transfer device 2 according to one embodiment includes: a carriage accommodating part 210 having an accommodating chamber 211 which receives a substrate conveyance carrier 1 from outside the device and accommodates such carrier, the substrate conveyance carrier having mounted thereon a tank 110 accommodating a plurality of substrates W together with water; and an extraction device 250 that extracts the substrates W from the tank 110 mounted on the substrate conveyance carrier 1 accommodated in the accommodating chamber 211, and delivers the substrates to a cleaning device 3 which is an adjacent treatment device.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
Provided is a substrate transport carriage capable of transporting a substrate between processing apparatuses while maintaining a wet condition of the surface of the substrate. A substrate transport carriage of an embodiment comprises: a tank 110 in which a plurality of substrates W can be stored in a water-immersed state and in a direction allowing for removal from above, the substrates W being spaced apart from each other and stacked and housed in a cassette 4; and a transport unit 120 that can travel with the tank 110 mounted thereon.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
B08B 3/02 - Cleaning by the force of jets or sprays
B62B 3/00 - Hand carts having more than one axis carrying transport wheels; Steering devices therefor; Equipment therefor
B65G 1/00 - Storing articles, individually or in orderly arrangement, in warehouses or magazines
B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
5.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The present invention provides a substrate processing apparatus and a substrate processing method, which are capable of suppressing the occurrence of defective products by protecting a portion, which is exposed after etching, with an oxide film. A substrate processing apparatus 1 according to one embodiment of the present invention is provided with: a rotor 10 which holds and rotates a substrate W; a first processing liquid supply unit 40 which performs etching by supplying a first processing liquid for etching to a surface to be processed of the substrate W that is rotated by the rotor 10; and a second processing liquid supply unit 50 which performs, following the etching by means of the supply of the first processing liquid, an oxide film formation process by supplying a second processing liquid for oxidation to the surface to be processed of the substrate W that is rotated by the rotor 10.
Provided are a film deposition device and a film deposition method by which a GaN film can be deposited with high productivity. A film deposition device 1 according to an embodiment of the present invention has: a GaN film deposition processing unit 40A which has a chamber 20 the interior of which can be evacuated, a rotary table 31 disposed inside the chamber 20, holding workpieces 10, and conveying the workpieces 10 in a circulating manner along a circumferential track, a target made of a GaN-containing film deposition material, and a plasma generator for generating plasma of a sputtering gas G1 introduced between the target and the rotary table, and which causes particles of a film deposition material containing GaN and Ga to be deposited by means of sputtering onto the workpieces 10 being conveyed in the circulating manner by the rotary table 31; and a nitriding processing unit 50 which nitrides the particles of the film deposition material deposited by the GaN film deposition processing unit 40A onto the workpieces 10 being conveyed in the circulating manner by the rotary table 31.
C23C 14/06 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
H01L 21/203 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using physical deposition, e.g. vacuum deposition, sputtering
Provided is a film-forming apparatus that is capable of forming a flat film in which deterioration of optical characteristics is minimized. This film-forming apparatus is for forming films on workpieces 10, and is provided with: a transfer part 30 having a rotary table 31 for circularly transferring the workpieces 10; a film-forming processing part 40 that has a target 42 comprising a film-forming material and a plasma generator for turning a sputtering gas introduced between the target 42 and the rotary table 31 into a plasma and that forms films on the workpieces 10 by subjecting the target 42 to a sputtering process using a plasma; and an ion emission part 60 for emitting ions, wherein the transfer part 30 circularly transfers the workpieces 10 so as to cause the workpieces 10 to pass through the film-forming part 40 and the ion emission part 60, and the ion emission part 60 emits ions on the films that are being formed on the workpieces 10.
The tablet printing device 1A according to the present embodiment comprises: a transport unit 10 that transports tablets T, each having a mark allowing for front-back discrimination; a detection unit 20 detecting the presence or the absence of the mark; an inversion tube 13a that is connected to the transport unit 10 and is an instance of an inversion route through which the front and back of a tablet T is inverted and returned to the transport unit 10; an inversion nozzle 13b that is an instance of a moving unit that causes, in response to the detection result of the detection unit 20, a tablet T being transported by the transport unit 10 to be moved into the inversion tube 13a so as to unify the front-back orientation of the tablets T on the transport unit 10; and a printing unit 40 for performing printing on the tablet T being transported by the transport unit 10, on the downstream side from the inversion tube 13a in the tablet T transport direction A1.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
A tablet printing device 1 according to an embodiment is provided with: an imaging device 23 that images the side surface of a tablet T having a dividing line formed on one surface thereof; a transporting device 21 that transports the tablet T; a print head device 24 that prints information on the tablet T transported by the transporting device 21; and a control device 50 that specifies the angle of the dividing line on the basis of the image captured by the imaging device 23, uses the specified angle to generate print data for printing information along the dividing line, and controls the print head device 24 using the generated print data.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
This organic film formation device according to one embodiment is provided with: a chamber in which an atmosphere that has been depressurized to below atmospheric pressure can be maintained; at least one treatment compartment that is provided to the interior of the chamber and is enclosed by a cover; and an exhaust unit that makes it possible to exhaust air out of the interior of the chamber. Provided to the treatment compartment are: an upper heating unit having at least one first heater; a lower heating unit that has at least one second heater and stands opposite the upper heating unit; and a workpiece support section that can support, between the upper heating unit and the lower heating unit, a workpiece that comprises a substrate and a solution that contains organic material and a solvent and that has been applied to an upper surface of the substrate. The treatment compartment comprises a space communicated with the chamber. The exhaust unit depressurizes the interior of the chamber, and also depressurizes a space between an inner wall of the chamber and the cover.
F26B 9/06 - Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in stationary drums or chambers
F26B 3/30 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
F26B 25/10 - Floors, roofs, or bottoms; False bottoms
F27B 17/00 - Furnaces of a kind not covered by any of groups
F27D 7/06 - Forming or maintaining special atmospheres or vacuum within heating chambers
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
11.
HEATER PIPE GAS LEAK DETECTING DEVICE AND HEATER PIPE GAS LEAK DETECTING METHOD
[Problem] To provide a heater pipe gas leak detecting device and a heater pipe gas leak detecting method with which it is possible for a leak of gas from a heater pipe in which fine holes are formed to be detected reliably. [Solution] According to one mode of embodiment of the present invention, a gas leak detecting device for a heater pipe 10 is provided with an inner pipe 10a accommodating a heater body, and an outer pipe 10b which encloses the inner pipe and is hermetically sealed, wherein a gas pressure in a space between the outer pipe 10b and the inner pipe 10a is regulated via a pipeline 30 to a prescribed pressure value by means of a pressure regulating mechanism 20. The gas leak detecting device comprises: a gas flow resistance portion 21 (213) which is provided in the pipeline 30 and locally makes it difficult for the gas to flow; a pressure detecting unit 23 which detects the gas pressure in the space between the outer pipe 10b and the inner pipe 10a, between the gas flow resistance portion 21 in the pipeline 30 and the heater pipe 10; and a leak determining means 50 for determining whether gas is leaking from the heater pipe 10, on the basis of a detected pressure value obtained by the pressure detecting unit 23.
G01M 3/26 - Investigating fluid tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors
H05B 3/78 - Heating arrangements specially adapted for immersion heating
12.
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
A substrate processing device 10 for cleaning a surface Wa to be cleaned of a semiconductor wafer W, wherein the substrate processing device 10 is provided with: a rotary chuck 21 capable of holding the semiconductor wafer W; a cleaning brush 41a disposed so as to face the surface Wa to be cleaned of the semiconductor wafer W held by the rotary chuck 21, the cleaning brush 41a being such that fibers of a porous fluororesin are formed in the perpendicular direction with respect to the surface of the semiconductor wafer W; a rotary motor 44 for rotationally driving the rotary chuck 21 so that the normal direction of the surface Wa to be cleaned of the substrate is the substrate rotation axis; and a nozzle tube 45 for feeding a cleaning liquid L to the surface Wa to be cleaned of the semiconductor wafer W held by the rotary chuck 21. The particle removal power is thereby increased, making it possible to use a chemical liquid as the cleaning liquid or heat the cleaning liquid, and to perform particle removal over a wide range.
The tablet-printing apparatus 1 according to an embodiment performs printing using an inkjet-type print head 51 on tablets T conveyed by a conveyance device 20. The tablets T are tablets that can be printed without considering directionality. The tablet-printing apparatus 1 according to the embodiment has a control device 90 for changing the printing direction with respect to the tablet T conveyance direction A1 at a predetermined interval by rotating a standard printing pattern to be used for printing the tablets T with respect to the tablet T conveyance direction A1 at a predetermined interval.
A tablet printing device according to a mode of embodiment of the present invention includes: a conveying device which holds by suction and conveys successively supplied tablets; a printing head H which is provided facing the conveying device and which prints onto the conveyed tablets; a detecting device which detects the attitude of each tablet on the upstream side of the printing head H; and a print state verifying device 33 which verifies a print state of each tablet on the downstream side of the printing head H. The tablet printing device causes the suction force acting on the tablets in at least a region from a detecting position to a print state verifying position to be lower than in other regions.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
Provided are a tablet printing device, a tablet, and a tablet manufacturing method, whereby the working efficiency of tablet division and the accuracy verifying equal division of a tablet can be enhanced. The tablet printing device pertaining to an embodiment of the present invention is provided with a conveyance unit for conveying a tablet (T), and a printing unit for printing a figure (B1) on a tablet (T) conveyed by the conveyance unit, the figure (B1) for indicating a region where division is allowed when the tablet (T) is divided. The working efficiency of tablet division can thereby be enhanced, and the accuracy of verifying equal division of a tablet (T) can furthermore be enhanced.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
A61K 9/44 - Pills, lozenges or tablets printed, embossed, grooved, or perforated
A tablet printing apparatus according to an embodiment is provided with: a pulley body 21b that has an internal space; a chamber 21f that is formed so as to be in communication with the internal space of the pulley body 21b; a suction tube that suctions the interior of the chamber 21f; driven pulleys 21c that are provided so as to face the pulley body 21b with the chamber 21f therebetween; a conveyor belt 21a that bridges the pulley body 21b and the driven pulleys 21c; and a print head device 25 that prints on tablets T held upon the conveyor belt 21a. The conveyor belt 21a has multiple suction holes that form a line in the rotation direction of the pulley body 21b and are in communication with the internal spaces of the pulley body 21b and the chamber 21f. The pulley body 21b and the chamber 21f constitute a suction chamber for applying a suction force to the suction holes of the conveyor belt 21a that are located at the outer peripheries of the pulley body 21b and the chamber 21f.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
A tablet printing device 1 according to one embodiment comprises: a conveyance device 20 that conveys tablets T; an ink-jet-type printing device 50 that has a row of nozzles in which a plurality of nozzles are arranged so as to intersect with the conveyance path of the tablets T conveyed by the conveyance device 20; and a control device 90 that controls the printing device 50 such that, in accordance with the density or shape of printing on the pills T, the resolution in one of either the conveyance direction of the tablets T or the row direction of the nozzles when printing is raised above the resolution in the other direction, and printing is executed.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
This tablet printing device (1) comprises a transport belt (21) that transports a tablet (T), a print head (51) that prints on the tablet (T) transported by the transport belt (21), and an imaging device (40) and image processing device (90) that function as a belt position detecting device to detect the position of a tablet (T) on the transport belt (21) in a transverse-direction that intersects the transport direction (A1) in a horizontal plane.
B65H 7/14 - Controlling article feeding, separating, pile-advancing, or associated apparatus, to take account of incorrect feeding, absence of articles, or presence of faulty articles by feelers or detectors by photoelectric feelers or detectors
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
B41J 21/00 - Column, tabular or like printing arrangements; Means for centralising short lines
This mounting device (1) is provided with: a stage unit (20) for moving a stage (21) on which a support substrate (W) is placed so that a plurality of mounting regions of the support substrate (W) are positioned in sequence in fixed mounting positions; a mounting unit (50) for individually moving, to a mounting position, a first and second mounting head for respectively holding and mounting an electronic component in a mounting region; a first recognition unit (22) for recognizing the overall position of the support substrate (W) on the stage (21); and a second recognition unit for recognizing the position of the electronic component held in the first or second mounting head, the movement of the stage (21) and the first and second mounting heads being controlled on the basis of the correction data for the moving position error of the stage (21) caused by the movement mechanism, the support substrate (W) position data, and the electronic component position data.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
Provided are a table printing device and a tablet manufacturing method whereby, when two or more tablets contiguous with each other are conveyed, it is possible to collect a leading tablet and a trailing tablet in distinction from each other. The present invention has a conveyance device 20 for conveying a tablet Tb, a sensor 30 for detecting the tablet Tb conveyed by the conveyance device 20, a printing unit 50 for printing on a tablet Tb by which a change in state occurs from a state in which the sensor 30 does not detect a tablet Tb to a state in which a tablet Tb is detected, and a collecting unit R for collecting a leading tablet Tb and a trailing tablet Tb in distinction from each other from among two or more tablets Tb when the length of time for which the sensor 30 detects a tablet Tb is greater than a predetermined set value due to two or more tablets Tb being conveyed which are contiguous with each other.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
A tablet printing device according to an embodiment of the present invention is provided with: a conveying belt 21 which conveys tablets; a first suction pathway C1 which sucks tablets on the conveying belt 21 to hold the tablets on the conveying belt 21, and also sucks the conveying belt 21 in such a way that the conveying belt 21 can convey the tablets; a second suction pathway C2 which is separate from the first suction pathway C1 and sucks only the conveying belt 21 in such a way that the conveying belt 21 can convey the tablets; and a printing device which prints onto the tablets on the conveying belt 21.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
B65G 15/58 - Belts or like endless load-carriers with means for holding or retaining the loads in fixed position, e.g. magnetic
22.
HEATER CONTROL DEVICE, HEATER CONTROL METHOD, SUBSTRATE PROCESSING DEVICE, AND SUBSTRATE PROCESSING METHOD
The present invention comprises: a heater 80 that heats a quartz plate 50; thermocouples 60 that detect the temperature of the quartz plate 50; and a heater control unit 100 that controls the heater 80 so as to set the temperature of the quartz plate 50 to be a target temperature value Tx on the basis of temperature information values outputted from the thermocouples 60, wherein four thermocouples 60 are provided in the quartz plate 50, the temperature information values are inputted from the four thermocouples 60, a preprocessing unit 110 determines a representative temperature value T by using, of the inputted temperature information value group, the temperature information values that remain after the minimum temperature information value is excluded, and a feed-back control unit 104 controls the heater 80 so that the representative temperature value T becomes equal to the target temperature value Tx.
G05D 23/22 - Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
23.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus for processing a substrate that is provided with at least a nitride film and an oxide film. This substrate processing apparatus comprises: an aqueous phosphoric acid solution retainer part for retaining an aqueous phosphoric acid solution; an aqueous phosphoric acid solution supply part for supplying the aqueous phosphoric acid solution to the aqueous phosphoric acid solution retainer part through an aqueous phosphoric acid solution supply pipe; a silica additive supply part for supplying a silica additive to the aqueous phosphoric acid solution retainer part through a silica additive supply pipe; a water supply part for supplying water to the aqueous phosphoric acid solution retainer part through a water supply pipe; and a processing part in which the substrate is processed by means of the aqueous phosphoric acid solution retained in the aqueous phosphoric acid solution retainer part. In this connection, the silica additive supply pipe is connected to a midway of the water supply pipe, so that processing of a substrate is able to be carried out at an adequate silica concentration in cases where a silica additive is used for the processing.
An imprinting template manufacturing device (1) according to an embodiment is provided with: a supply head (11) which includes a raised portion with an uneven pattern formed thereon, and which supplies a liquid-repelling liquid material to a template W on a stage; a transport unit (20) which causes the supply head (11) and the stage to move relative to one another in a direction along the stage; a control unit (40) which controls the supply head (11) and the transport unit (20) so that the supply head (11) can coat at least a side surface of the raised portion with the liquid-repelling liquid material while avoiding the uneven pattern; and a washing unit (30) which supplies a liquid to the template W coated with the liquid-repelling liquid material. The liquid-repelling liquid material includes a liquid-repelling component and a non-liquid-repelling component which react with the surface of the template W, and a volatile solvent which dissolves the liquid-repelling component. The liquid is a fluorine-based volatile solvent that dissolves the non-liquid-repelling component.
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
B29C 33/42 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
B29C 59/02 - Surface shaping, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
25.
APPARATUS FOR MANUFACTURING TEMPLATE FOR IMPRINT APPLICATIONS AND TEMPLATE MANUFACTURING METHOD
An apparatus for manufacturing a template for imprint applications according to the embodiment is provided with: a stage 13 for supporting a template W on which a pattern of recesses and protrusions is formed, the template W having a protrusion 52; a supply head 11 for supplying a liquid repellent in liquid form to the template W on the stage 13; movement mechanisms 15, 17A, and 17B for relatively moving the supply head 11 and the stage 13 in the direction that tracks the stage 13; and a control unit 40 for controlling the supply head 11 and the movement mechanisms so that the supply head 11 coats the liquid repellent in liquid form on at least the side surface of the protrusion 52 avoiding the pattern of recesses and protrusions. The liquid repellent in liquid form includes a liquid-repellent component and a non-liquid-repellent component that react with the surface of the template W, a volatile solvent for dissolving the liquid-repellent component, and a fluorine-based volatile solvent for dissolving the non-liquid-repellent component
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
B29C 33/38 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the material or the manufacturing process
B29C 59/02 - Surface shaping, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
[Problem] To provide a tablet printing device and a tablet printing method that enable high quality printing by discharging ink droplets from a plurality of nozzles onto tablets formed in various attitudes. [Solution] The present invention is configured to have: an inclined attitude detecting means (23, 100) which detects an inclined attitude of a conveyed tablet on a conveying surface; a printing mechanism having an inkjet head 21 provided with a plurality of nozzles for discharging ink droplets, the printing mechanism discharging ink from the plurality of nozzles onto the conveyed tablet to perform printing on the tablet; and a control unit 100 for adjusting previously set printing data so that prescribed printing can be performed on the tablet in response to the inclined attitude of the tablet detected by the inclined attitude detecting means, wherein the printing mechanism performs printing on the tablet on the basis of printing data adjusted by a printing data adjusting means.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
A tablet printing device S according to an embodiment of the present invention comprises the following: a first conveyance device 1 that holds a second surface of a tablet T to convey the tablet; a second conveyance device 2 that holds a first surface of the tablet passed from the first conveyance device 1 to convey the tablet; a first print head 31 that prints on the first surface of the tablet; a second print head 41 that prints on the second surface of the tablet; a first detection mechanism 32 that detects the first surface of the tablet; a second detection mechanism 33 that detects the second surface of the tablet; and a control unit 5 that issues printing instructions to the first and second print heads 31, 41 using information related to the state of a secant line included in either one of the detection information of the first surface of the tablet and the detection information of the second surface of the tablet which were detected by the first and second detection mechanisms 32, 33.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
[Problem] To provide a tablet printing device which allows tablets printed by an ink-jet printing mechanism to be effectively dried without imposing a great heat load on a conveyor belt that conveys the tablets. [Solution] A tablet printing device includes: a conveyance mechanism 17 which causes a conveyor belt 171 to move in order to convey tablets that are sequentially dispensed; a printing mechanism which has an ink-jet head 21 provided with multiple nozzles that eject ink drops, the ink-jet head 21 being disposed facing a surface of the conveyor belt 171 to perform printing on the tablets at a printing position on the conveyor belt 171 by ejecting the ink drops from the multiple nozzles; and a drying mechanism 22 which outputs energy toward the tablets conveyed by the conveyor belt 171 at a drying position downstream of the tablets at the printing position in the conveyance direction.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 9/14 - Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups , or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
B41M 5/50 - Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
The tablet printing device 1 according to an embodiment of the present invention includes: a conveyance unit 10 that conveys a tablet T; a laser displacement meter 30 that irradiates the tablet T conveyed by the conveyance unit 10 with a laser light and receives the laser light reflected from the tablet T; a determination unit 81 that determines whether or not there is a score line on the top surface of the tablet T conveyed by the conveyance unit 10 on the basis of the output value of the laser displacement meter 30; and a printing unit 50 that performs printing on the tablet T conveyed by the conveyance unit 10 on the basis of the determination result of the determination unit 81.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
30.
TABLET-PRINTING APPARATUS AND TABLET-PRINTING METHOD
A tablet-printing apparatus according to an embodiment is provided with: a conveyance device for conveying successively supplied tablets by sucking and holding same using a suction chamber 14; a print head that is provided facing the conveyance device and is for printing by discharging ink on tablets conveyed by the conveyance device; and partition walls 144, 144 and suction paths 1421, 1422 that function as suction force-adjusting devices for reducing the suction force applied on the tablets at the conveyance position facing the print head so as to be less than the suction force applied on the tablets at conveyance positions before or after same.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
[Problem] To provide a tablet printing device that can prevent ink at each distal end of nozzles of an inkjet type printing mechanism from drying out in a situation in which a tablet does not arrive at a printing position. [Solution] A tablet printing device has: a conveyance mechanism 17 that moves a conveyance belt 171 to convey sequentially supplied tablets; an inkjet type printing mechanism that performs printing on a tablet at a printing position; a suction mechanism 174a that sucks air to cause the tablet to adhere to a surface of the conveyance belt within a predetermined range including at least the printing position; a determination means (S15) that determines whether or not a tablet arrives at the printing position; and a head retraction means (32, S21) that retracts an inkjet head 31 so that the distal end of each nozzle of the inkjet type printing mechanism moves away from the surface of the conveyance belt when it is determined that a tablet does not arrive at the printing position.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
B41J 2/165 - Prevention of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
A template 1 for imprinting according to one embodiment is provided with: a substrate 2 that has a main surface 2a; a protruding portion 3 that is provided on the main surface 2a and has an end surface on the side opposite to the main surface 2a, wherein a recess/protrusion pattern 3a that is pressed into a liquid transfer object is formed on said end surface; and a liquid-repellent layer 4 that is formed on at least a side surface of the protruding portion 3, avoiding the recess/protrusion pattern 3a, and repels the liquid transfer object.
A tablet printing apparatus according to an embodiment comprises: a conveyance device; an inkjet head 311 for printing by discharging ink from a nozzle onto a tablet being conveyed by the conveyor; an ink tank B for supplying ink to the inkjet head 311; a movement device 36 that changes the height L3 of the ink tank B on the basis of the ink usage amount, which is known beforehand, so as to maintain, at a preset value, the water head difference h between the height L2 of the liquid surface of the ink in the ink tank B and the height L1 of the nozzle formation surface 312 at which the nozzle is formed; and a control unit for controlling at least the conveyance device, the inkjet head 311 and the movement device 36.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
A61K 9/44 - Pills, lozenges or tablets printed, embossed, grooved, or perforated
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
An imprinting template production device 1 according to one embodiment is provided with: a support portion 3 that supports a template W equipped with a substrate 11, which has a main surface, and a protruding portion 12, which is provided on the main surface and has an end surface on the opposite side from the main surface and in which a recess/protrusion pattern is formed on said end surface, such that the protruding portion 12 faces downward; a vaporizing portion 5 that is provided on the support portion 3 below the template W and vaporizes a liquid-repellent material; and an adhesion prevention plate 7 that is provided on the support portion 3 below the template W, allows the vaporized liquid-repellent material to adhere to a side surface of the protruding portion 12 of the template W on the support portion 3, and prevents adhesion to the recess/protrusion pattern.
B29C 33/38 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the material or the manufacturing process
B29C 59/02 - Surface shaping, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
An imprinting template production device 1 according to one embodiment is provided with: a stage 3 that supports a template W equipped with a substrate 11, which has a main surface, and a protruding part 12, which is provided on the main surface and has an end surface on the opposite side from the main surface and in which a recess/protrusion pattern is formed on said end surface; a supply head 4 that supplies a liquid liquid-repellent material to the template W on the stage 3; a movement mechanism (a Y-axis movement mechanism 6 or a pair of X-axis movement mechanisms 8A and 8B) that moves the stage 3 and the supply head 4 relative to each other in a direction parallel to the stage 3; and a control part 9 that controls the supply head 4 and the movement mechanism such that the supply head 4 applies the liquid liquid-repellent material to at least a side surface of the protruding part 12, avoiding the recess/protrusion pattern.
Provided are a film-forming apparatus and a film-forming-work manufacturing method with which it is possible, with a simple configuration, to form a film having a uniform thickness on a work having a plurality of surfaces, such as a three-dimensional object or the like. Included are: a target 21 for a film-forming material, which includes a plane SU3; a power source unit 3 that applies power to the target 21; a rotating part 4 that makes a work W, on which a film is to be formed, rotate about a rotation axis AX1; and a revolving part 5 that repeatedly moves the work W close to and away from the target 21 by making the rotating part 4 revolve about a revolution axis AX2, which is different from rotation axis AX1. During rotation and revolution, the rotation axis AX1 is fixed at an angle in which a rotation orbital plane SU1 that is orthogonal to the rotation axis AX1 has a first inclination angle θ1 with respect to a revolution orbital plane SU2 that is orthogonal to the revolution axis AX2, and the target 21 is fixed at an angle at which the plane SU3 has a second inclination angle θ2 with respect to the revolution orbital plane SU2.
This tablet printing device (1) is provided with: a conveyor (3) which conveys tablets in rows; a coating head (5A) which has multiple nozzles arranged in a direction intersecting with the direction of conveyance of the tablets conveyed by the conveyor (3), and which discharges a liquid from the nozzles to print on the tablets; and a control device (9) which controls discharge of the liquid from each nozzle of the coating head (5A). The length of the nozzle row in the arrangement direction of the multiple nozzles which is perpendicular to the conveyance direction is greater than or equal to the length of the tablets in the direction perpendicular to conveyance direction. The control device (9) exercises control such that the nozzles used in tablet printing are switched at multiple predetermined sections.
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
B41J 2/165 - Prevention of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
A substrate processing device according to an embodiment of the present invention comprises: a removal part (D1) that removes liquid droplets which exist in a recess (30); a liquid discharge hole (30a) that is provided in a bottom part of the recess (30) of a nozzle head (32), and that discharges liquid droplets to be removed to the outside of the recess (30); and a control part (8) that controls an ejection state of a gas ejection nozzle (33) so that a period, in which a gas is ejected from the gas ejection nozzle (33) in a flow amount such that the gas does not reach a surface to be treated of a substrate W, exists during a period from completion of a rinse treatment by a treatment liquid on the surface to be treated until initiation of a drying treatment using a gas.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
39.
APPARATUS FOR MANUFACTURING DISPLAY DEVICE MEMBER AND METHOD FOR MANUFACTURING DISPLAY DEVICE MEMBER
The purpose of the present invention is to fill a gap formed between an adhesive end portion and a workpiece. A manufacturing apparatus (100) for a display device member is provided with an adhesive application apparatus (1) for applying an adhesive (R) on a liquid crystal panel (S1) in a planar shape and forming an adhesive layer (R1), an adhesive supplementing unit (6) for supplying a supplementary adhesive (R10) to the liquid crystal panel (S1) or a cover panel (S2), and a bonding apparatus (2) for bonding the liquid crystal panel (S1) and the cover panel (S2) via the adhesive layer (R1). The adhesive supplementing unit (6) provides the supplementary adhesive (R10) so as to fill a gap formed between at least a part of an end portion of the adhesive layer (R1) and the cover panel (S2) when the liquid crystal panel (S1) and the cover panel (S2) are bonded by the bonding apparatus (2).
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
Provided are: an apparatus for cleaning a reflective mask, which is capable of suppressing deterioration of the optical characteristics of a capping layer that is provided on a reflective mask and contains ruthenium; and a method for cleaning a reflective mask. An apparatus for cleaning a reflective mask according to one embodiment of the present invention is provided with: a first supply unit which supplies a first solution containing an organic solvent and/or a surfactant to a capping layer that is provided on a reflective mask and contains ruthenium; and a second supply unit which supplies a reducing solution and/or a solution containing no oxygen to the capping layer. An apparatus for cleaning a reflective mask according to another embodiment of the present invention is provided with: a third supply unit which supplies a plasma product produced from a reducing gas to a capping layer that is provided on a reflective mask and contains ruthenium; and a second supply unit which supplies a reducing solution and/or a solution containing no oxygen to the capping layer.
A substrate treatment device according to an embodiment is provided with: a treatment tank that stores a treatment liquid in which an object to be treated is immersed; a transfer unit that transfers the object to be treated; and a temperature control unit that is provided in the treatment tank and/or a place apart from the treatment tank, and heats and/or cools the object to be treated. The object to be treated is at least any one of a bonded substrate having a device substrate, a support substrate, and an adhesive provided between the device substrate and the support substrate, the device substrate to which the adhesive adheres, and the support substrate to which the adhesive adheres.
A suction stage according to an embodiment is provided with a mounting unit on which a first substrate is mounted, and an evacuation unit which evacuates a space between the first substrate and the mounting unit. The mounting unit comprises a first wall part provided on the outer edge side of one end face of the mounting unit and having a ring shape, and a second wall part provided inside the first wall part and having a ring shape. The evacuation unit comprises a first control valve provided between a first region between the first wall part and the second wall part and the evacuation unit, a second control valve provided between a second region inside the second wall part and the evacuation unit, and a control unit for controlling the first control valve and the second control valve. The control unit controls the first control valve and the second control valve to thereby alternately perform the suction of the first substrate and the release of the suction of the first substrate in the first region and/or the second region. While releasing the suction of the first substrate in either one of the first region and the second region, the control unit performs the suction of the first substrate in the other region.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
G11B 7/26 - Apparatus or processes specially adapted for the manufacture of record carriers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
43.
LIQUID SUPPLY DEVICE AND SUBSTRATE PROCESSING DEVICE
Provided is a liquid supply device for supplying a processing liquid to a processing device, and recovering and resupplying the processing liquid, wherein the liquid supply device is provided with: a plurality of supply tanks for containing the processing liquid, the supply tanks having an exhaust path and an overflow line and being capable of switching between supply mode for supplying the processing liquid and standby mode for standing by while containing the processing liquid; a supply mechanism for supplying the processing liquid to the processing device from the supply tank, from among the plurality of supply tanks, that is in supply mode; a recovery mechanism for recovering the surplus processing liquid in the processing device and returning the recovered processing liquid to the supply tank that is in supply mode; and opening/closing mechanisms provided to each of the supply tanks, each of the opening/closing mechanisms blocking the exhaust path and the overflow line. It is thereby possible to extend the lifespan of the processing liquid contained in the supply tanks in standby state.
A substrate processing device (1) according to the embodiment is provided with: a support unit (4) which supports a substrate (W); a rotary mechanism (5) which rotates the support unit (4), using an axis which intersects the substrate (W), which is supported by the support unit (4), as a rotation axis; a nozzle (6) which supplies processing liquid to the surface of the substrate (W) upon the support unit (4) that is rotating by way of the rotary mechanism (5); a heater (8) which heats the substrate (W) that is supported by the support unit (4) away from the substrate (W); and a movement mechanism (9) which moves the heater (8) towards and away from the substrate (W) that is supported by the support unit (4).
An embodiment of the present invention is a bonding device for bonding a first substrate and a second substrate, said bonding device being provided with: a substrate holding unit that holds a second substrate; an indenter that applies pressure to a back surface of the second substrate by carrying out upward motion; and a substrate holding unit having holding claws for holding the rim portion of the first substrate that can be held so as to face the second substrate with a prescribed space therebetween. The bonding device is characterized in that the indenter applies pressure to a prescribed single point on the second substrate, that point corresponding to a position in which the distance between the bonding surface of the first substrate and the bonding surface of the second substrate is smaller than the distance from the rim portion of the bonding surface of the first substrate to the bonding surface of the second substrate.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
B23K 20/00 - Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
46.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus (1) according to one embodiment of the present invention is provided with: a process liquid supply unit (6) for supplying a process liquid to the surface of a substrate (W); and a heating unit (8) for heating the substrate (W) by irradiating the surface of the substrate (W) with light which is transmitted through the process liquid and is absorbed by the substrate (W). Consequently, the substrate processing efficiency is improved and the amount of the process liquid used is suppressed by heating the surface of the substrate (W) with light which is transmitted through the process liquid and is absorbed by the substrate (W).
A substrate processing device (1) according to an embodiment is provided with: a supporting portion (4) which supports a substrate (W) within a plane; a rotation mechanism (5) which uses an axis intersecting the surface of the substrate (W) supported by the supporting portion (4) as a rotational axis so as to rotate the supporting portion (4); a plurality of nozzles (6a, 6b, 6c) which are disposed so as to be aligned from the center to the perimeter of the substrate (W) that is supported by the supporting portion (4), and which each deliver processing liquid to the surface of the substrate (W) that is upon the supporting portion (4), which is rotating by way of the rotation mechanism (5); and a control unit (9) which delivers the processing liquid at delivery timings that are different for each of the plurality of nozzles (6a, 6b, 6c) in accordance with thickness of a liquid membrane of the processing liquid formed on the surface of the substrate (W) that is upon the supporting portion (4) that is rotating by way of the rotation mechanism (5).
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
Provided is a carrying stand that carries a substrate to be processed at which a process is to be performed by means of a reducing radical, and wherein the carrying stand includes a carrying surface, which is covered by the substrate to be processed when seen in a plan view, and a non-carrying surface, which is adjacent to the carrying surface, and the surface of at least a portion of the non-carrying surface is covered by a material at which a reduction reaction is not caused with the reducing radical.
A substrate processing device (1) according to an embodiment comprises: a table (4) which supports a substrate (W); a solvent supply unit (8) for supplying the surface of a substrate (W) on the table (4) with a volatile solvent; and an irradiation unit (10) which functions as a heater for heating the substrate (W) to change the volatile solvent into liquid droplets with an air layer generated on the surface of the substrate (W) supplied with the volatile solvent by irradiating the substrate (W) supplied with the volatile solvent with light. Thereby, it is possible to favorably dry a substrate while suppressing the collapse of a pattern.
Provided is a substrate bonding apparatus with which high-precision bonding, using adhesive, between a concave substrate having a concave face and a flexible, thin substrate can be achieved. Said apparatus is provided with a central block (41) and separated blocks (42), both sides of which are separated by the central block (41), and the separated blocks (42) have, on the side edge part (20b) of a concave substrate (20) side, a pressing-bending face (42a) which has essentially the same shape as a concave face (20a) portion of said side edge part (20b). The separated blocks (42) move between a first position (A) close to the central block (41) and a second position (B) in contact, by way of the thin substrate (21), with the side edge part (20b) of the concave substrate (20). When the separated blocks (42) move into the first position (A), the central block (41) and the separated blocks (42) are contracted so as to be smaller than the concave face space (20c) of the concave substrate (20), and when the separated blocks (42) move into the second position (B), the separated blocks (42) the central block (41) and the separated blocks (42) expand to lie along the concave face (20a) of the concave substrate (20).
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
The aim of the present invention lies in providing pressure for bonding substrates using a very simple and inexpensive configuration. The substrate forming apparatus has a chamber (1) for housing substrates (S1, S2) to be bonded, a first supporting unit (2) for supporting the substrate (S1) inside the chamber (1), and a second supporting unit (3) for supporting the second substrate (S2) inside the chamber (1) so as to face the substrate (S1). The chamber (1) has a first space (11b) opposite the side on which the substrate (S1) is supported by the first supporting unit (2), and a second space (12b) in which the substrate (S1) and substrate (S2) face each other. The first supporting unit (2) separates the first space (11b) and the second space (12b) and holds the first substrate (S1), and an expandable portion (21) expands to increase the pressure inside the first space (11b) relative to the second space (12b), and press the substrate (S1) against the substrate (S2).
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
52.
DEVICE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
This invention is provided with: a pressure-bonding part (17) for simultaneously mounting electronic components (P) onto two lateral face parts located in the same direction on two substrates (W) provided next to each other on a stage (1); a loading arm (6) for suction-holding a substrate (W) on the upper surface and positioning one lateral face part of the substrate (W) against the pressure-bonding part (17) on the stage (1) to mount the electronic components (P), and then handing over the substrate (W) to the upper surface on one lateral part of the stage (1); a control device (13) for controlling the position of the loading arm (6) and the stage (1) and mounting the components (P) on the other lateral face part of the substrate (W) fed to and placed on one lateral part of the stage (1) and turned 180° together with the stage (1), whereupon the electronic components (P) are simultaneously mounted on one lateral face part of a new substrate (W) suction-held by the loading arm (6) and positioned on the other lateral part of the stage (1); and an unloading arm (35) for removing, from the stage (1), the substrate (W) that has had electronic components (P) mounted on the pair of lateral face parts.
A stage unit (5) which conveys a substrate comprises: a mounting stage (11) which is provided on an upper surface of a base member (6) which is provided such that the base member can drive along the conveyance direction of the substrate; a stage rail (15) which supports both side sections of the substrate in the width direction intersecting the conveyance direction and which is provided such that the stage rail can drive vertically along the base member; a vertical drive means (14) which is provided on the stage rail and which drives the stage rail in the vertical direction; and a clamper (27) which is provided elastically urged in the downward direction and such that travel in the vertical direction of the stage rail is possible, and which, when an electronic component is mounted to the substrate at a mounting position, elastically presses the side section upper surface of the substrate to clamp the substrate to the mounting stage when the stage rail is driven in a downwards direction by the vertical drive means to transfer the substrate supported by the stage rail to the mounting stage.
Disclosed is a substrate treatment device which can heat a treatment solution with higher efficiency and can utilize the treatment solution with high efficiency, thereby treating the surface of a plate-like substrate. Specifically disclosed is a substrate treatment device which is equipped with a treatment solution supply mechanism (50) for supplying a treatment solution (S) onto the surface of a plate-like substrate (100) that is held on a rotatable substrate-holding section (10), and which can treat the surface of the plate-like substrate (100) with the treatment solution (S). The device has a treatment solution-holding plate (15) which is so arranged as to face the surface of the plate-like substrate (100) (which is held on the substrate-holding section (10)) with predetermined spacing and is so adapted that the treatment solution is held between a gap between the surface of the plate-like substrate (100) and the treatment solution-holding plate (15), and also has a heating section (20) which is so arranged as to contact with a predetermined region containing a position corresponding to the rotating axis of the substrate-holding section (10) in the treatment solution-holding plate (15) and which can heat the predetermined region. The treatment solution supply mechanism is so adapted that the treatment solution (S) can be supplied to a gap between the surface of the plate-like substrate (100) that can rotate together with the substrate-holding section (10) and the treatment solution-holding plate (15) that can be heated by means of the heating section (20).
Provided is a lead wire connection device which connects a plurality of semiconductor cells (1a to 1n) in a row with lead wires (2a to 2n) wherein the semiconductor cells are formed, in parallel, with a plurality of finger electrodes (112) in a predetermined direction and at a predetermined interval on one of the surfaces functioning as a light receiving surface, and are provided with conductive metal films (114) on the two ends of the other surface of the semiconductor cells in a direction which intersects the plurality of finger electrodes and in a manner so as to leave exposing sections. One end of the lead wire is connected, via an adhesive conductive tape (3), to one surface of one of the neighboring semiconductor cells constituting a pair in a direction that intersections the plurality of finger electrodes, and the other end of the lead wire is connected, via an adhesive conductive tape, to a position corresponding to the removal section (115), which is formed by removing the abovementioned conductive metal film formed on both ends of the other surface, on the other surface of the other semiconductor cell.
Provided is an application apparatus which makes it possible to suppress splashing which can occur in a discharge confirmation step. An application apparatus (100) for applying a solution (16) onto a substrate (90) by means of an inkjet method is provided with: an inkjet head (11) which includes a nozzle (12) for discharging the solution (16) onto the substrate (90); and a solution receiving section (20) for receiving the solution (16) discharged from the nozzle (12). The solution receiving section (20) comprises: a vessel (21) which has an opening (25) at the upper surface thereof through which the solution (16) is allowed to pass; and an opening-narrowing section (22) for narrowing the opening (25) in the vessel (21).
B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
Disclosed is a coating apparatus which is capable of maintaining good wipe-off properties, while reducing the amount of water absorbent sheets consumed. Specifically disclosed is a coating apparatus (100) for applying a solution to a substrate (90) by an inkjet system, which comprises a head unit (10) that contains a nozzle (12) for ejecting the solution to the substrate (90) and a wiping unit (20) for wiping the nozzle (12) in the head unit (10). The wiping unit (20) has a wipe-off unit (20a) for wiping off the ejection surface (12a) of the nozzle (12), and the wipe-off unit (20a) includes a blade portion (21) for scratching off the solution remaining on the ejection surface (12a) and a water absorbent sheet portion (22) for absorbing the solution remaining on the ejection surface (12a). The height (21t) of the blade portion (21) is lower than the height (22t) of the water absorbent sheet portion (22).
B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B05D 3/12 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
B41J 2/165 - Prevention of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
Disclosed is a coating device that can stably execute a coating step even if an ink tank is exchanged. The coating device (100) that coats a substrate (90) with a solution by means of an inkjet method is provided with a supply tank (25) that supplies the solution to an inkjet head that includes a nozzle (12), and a first ink tank (21) and a second ink tank (22) that replenish the supply tank (25) with the solution. A common ink ductwork (35) connected to the supply tank (25) is connected to the first ink tank (21) with a first ink ductwork (31) therebetween, and is connected to the second ink tank (22) with a second ink ductwork (32) therebetween. When replenishing the supply tank (25) with the solution from the first ink tank (21), a control device (60) controls a second flow rate adjustment valve (34) so as to interrupt the replenishing of the first ink tank (21) with the solution from the second ink tank (22), and when replenishing the first ink tank (21) with the solution from the second ink tank (22), the control device (60) controls a first flow rate adjustment valve (33) so as to interrupt the replenishing of the supply tank (25) with the solution from the first ink tank (21).
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
Disclosed is a coating device that can stably execute a coating step even if an ink tank is exchanged. The coating device (100) coats by means of an inkjet method, and a supply tank (25) that supplies a solution to an inkjet head (11) is connected to a first ink tank (21) with a common ink ductwork (35) and a first ink ductwork (31) therebetween, and is connected to a second ink tank (22) with the common ink ductwork (35) and a second ink ductwork (32) therebetween. When the supply tank (25) is replenished with the solution from the first ink tank (21), a control device (60) connected to a first flow-rate adjustment valve (33) and a second flow-rate adjustment valve (34) temporarily controls the first flow-rate adjustment valve (33) so as to interrupt the replenishing or to control the flow rate of the solution from the first ink tank (21), and the second flow-rate adjustment valve (34) so as to replenish the supply tank (25) with the solution from the second ink tank (22).
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
60.
APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
Disclosed is an apparatus for mounting electronic components, which is provided with: a plurality of mounting tools (61), each of which is provided such that the mounting tool can be driven in the directions horizontal and perpendicular to the horizontal supporting portion of a mount (37) by holding a TCP on a lower end; a transfer table (74) which transfers a substrate to the below of the mounting tool; a plurality of pairs of image pickup cameras (71), which pick up, at one time, an image of the TCP held by means of each mounting tool and an image of a portion positioned below each TCP on the substrate; an arithmetic processing unit (79) which calculates the positional shift quantity between the position of the TCP and the TCP mounting position on the substrate, based on the images picked up by means of the pairs of the image pick up cameras; and a drive control unit (80), which aligns each TCP above the mounting position on the substrate by driving the mounting tools at one time in the horizontal direction, based on the positional shift quantity between the TCP position and the mounting position on the substrate, said positional shift quantity being calculated by means of the arithmetic processing unit, then mounts on the substrate the TCP held on the lower end of each mounting tool by driving downward the mounting tools in the perpendicular direction at one time.
Disclosed is a plasma etching apparatus which is provided with: a processing container which can maintain an atmosphere under lower pressure than atmospheric pressure; a depressurizing section which depressurizes the inside of the processing container to be under predetermined pressure; a placing section, which is provided inside of the processing container and has placed thereon a subject to be processed; an electric discharge tube, which has, inside thereof, a region where plasma is to be generated, and which is provided at a position separated from the processing container; an introducing waveguide, which propagates microwaves radiated from a microwave generating section and introduces the microwaves into the region where plasma is to be generated; a gas supply section which supplies a process gas to the region where plasma is to be generated; a transporting tube which connects the electric discharge tube and the processing container; a detection window which is provided on the wall surface of the processing container and passes through light; an interfering light detecting section which has a plurality of light receiving elements on a light receiving surface which receives interfering light emitted from the surface of the subject placed on the placing section; and a control unit which detects an etching end point, on the basis of output of the interfering light detecting section. The control unit extracts output of the light receiving elements in a portion equivalent to an etching portion from output of the light receiving elements in the detection region of the interfering light detecting section, and detects the etching end point, on the basis of the interfering light intensity obtained from the output of the light receiving elements in the portion equivalent to the etching portion.
The disclosed plasma processing device is characterized by being provided with a processing receptacle that can maintain ambient air that has been depressurized from atmospheric pressure; a depressurization unit that depressurizes the interior of the aforementioned processing receptacle to a predetermined pressure; a carrying unit that carries an object to be processed that is provided within the aforementioned processing receptacle; a discharge tube that has therein a region wherein plasma is generated and that is provided at a location at a distance from the aforementioned processing receptacle; an introducing waveguide tube that propagates microwaves radiated from a microwave generating unit and that introduces microwaves to the aforementioned region wherein plasma is generated; a gas supply unit that supplies process gas to the aforementioned region wherein plasma is generated; a transport tube that connects the aforementioned discharge tube and the aforementioned processing receptacle; and a first heat detection unit that detects the heat of the aforementioned discharge tube.
C23C 16/50 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating using electric discharges
C23C 16/52 - Controlling or regulating the coating process
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/31 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
H05H 1/46 - Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
63.
LEAD WIRE CONNECTION APPARATUS AND CONNECTION METHOD FOR SEMICONDUCTOR CELLS
Disclosed is an apparatus provided with: a tape attaching means (13) to attach pieces of adhesive conductive tape at one time to the upper and lower faces of each of semiconductor cells supplied from a supply unit (12); a conveyance unit (14) to pitch-feed the semiconductor cells having the conductive tape attached thereon; lead wire process means (15a to 15d) to perform a process of forming lead wire; a temporary bonding means (15), provided in a section facing those of the semiconductor cells that are being pitch-fed, to alternately connect the upper face of each semiconductor cell and the lower face of another semiconductor cell adjacent thereto by holding the formed lead wire, and repeating temporary bonding of the lead wire to the conductive tape provided on the upper and lower faces of the semiconductor cells that are being pitch-fed; and a permanent bonding means (16), arranged in the downstream side of the temporary bonding means in a direction in which the semiconductor cells are fed, to permanently bond at one time each pair of upper and lower pieces of lead wire temporarily bonded on the upper and lower faces of the semiconductor cells.
A lead wire connection apparatus is provided with: a conveyer (6) to transport a substrate with one face thereof up, the one face having cells formed thereon; lead wire supply units (11 to 13) arranged sideward in a direction intersecting a transport direction of the substrate positioned by the conveyer for the transport; a feeding chuck (27) to extract lead wire from the lead wire supply units along the direction intersecting the transport direction of the substrate; a tape attaching means (31) to attach, on a lower face of the lead wire extracted from the lead wire supply units, a plurality of tape pieces (28a) obtained by cutting conductive tape (28) made of an adhesive thermosetting resin into pieces of a predetermined length, the lower face facing the upper face of the substrate; and a pressurizing tool (61) to, when the lead wire having the tape pieces attached thereon by the tape attaching means is extracted above the substrate by the feeding chuck in the direction intersecting the transport direction of the substrate, connect the lead wire to the cells with the tape pieces therebetween by pressurizing and heating parts of the upper faces of the lead wire, the parts having the tape pieces attached thereon.
Provided are an apparatus for forming a thin film and a method for forming a thin film, by which a thin film having a uniform thickness can be formed, while preventing dusts from adhering onto works and film materials from adhering onto the side portions of the works. The apparatus for forming a thin film has: a holding section (2) which holds the upper surface of a work (1); a supplying section (3) which supplies a resin (R) to an area below the work (1) held by the holding section (2); a rotating mechanism (22) which rotates the work (1) held by the holding section (2) so that the resin (R) supplied by means of the supplying section (3) spreads to the lower surface of the work (1); a hardening section (4), which hardens the resin (R) spread on the lower surface of the work (1), by irradiating the resin with ultraviolet rays (UV); and a moving mechanism (24) which moves the holding section (2) between the supplying section (3) and the hardening section (4).
The purposes of the present invention are to reduce the cost for a thin film solar cell and the cost for an apparatus for manufacturing the solar cell, to improve the quality of the thin film solar cell, and to improve the power generation efficiency of the thin film solar cell. Specifically disclosed is a method for manufacturing a soar cell, which comprises: a step in which a first electrode film is formed on a substrate in a reduced pressure atmosphere, then a photoelectric conversion layer is formed on the first electrode film in a reduced pressure atmosphere without exposing the first electrode film to the atmosphere, and then a second electrode film is formed on the photoelectric conversion layer in a reduced pressure atmosphere without exposing the photoelectric conversion layer to the atmosphere, thereby forming a multilayer film; a step in which the multilayer film is divided, thereby forming a plurality of solar cell units that are arranged side by side on the substrate; and a step in which the second electrode film and the photoelectric conversion layer of a first solar cell unit among the plurality of solar cell units are selectively removed, thereby exposing the first electrode film, and the second metal film of a second solar cell unit that is adjacent to the first solar cell unit is electrically connected with the exposed first electrode film.
Disclosed is a sputter deposition device provided with a conductive target holder and a conductive substrate holder facing the target holder. The target holder holds a target and the substrate holder holds a substrate. A voltage is applied to both the target holder and the substrate holder, sputtering the target and forming on the substrate an insulating film containing elements that make up the target. The substrate holder has gaps formed facing the discharge space, sized such that, during sputter deposition, insulating particles that are to form the aforementioned insulating film do not reach the inner walls of the gaps, thereby securing a conductive surface open towards the discharge space.
H01L 21/203 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using physical deposition, e.g. vacuum deposition, sputtering
68.
SUBSTRATE TRANSFER DEVICE AND SUBSTRATE TRANSFER METHOD
Provided are a substrate transfer device and a substrate transfer method, in which even if a substrate in a housing part is not held in a normal position, the substrate can be replaced in the normal position and thereafter a normal take-out operation can be performed. Specifically, a substrate transfer device comprises a housing part (1) for housing a substrate (S), a side support part (11) and a back support part (12) for supporting the substrate (S) in the housing part (1), a moving part (2) for drawing out the substrate (S) from the housing part, a drive mechanism (21a) for driving the moving part (2), a sensor (13) for detecting abnormality based on the displacement of the support position of the substrate (S), and a controller (100) for controlling the drive mechanism (21a) such that the substrate (S) is supported in the normal position by moving the moving part (2) in the direction that eliminates the displacement of the substrate (S) and goes away from the substrate (S) when the abnormality is detected by the sensor (13).
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
The disclosed device is provided with a treatment unit (2), to which is supplied a substrate to be treated with a treatment solution, a fluid storage tank (1) in which the treatment fluid is stored, a fluid supply pipe (3) and a recovery pipe (28), by which the treatment fluid in the fluid storage tank is supplied to the treatment unit and returned to the fluid storage tank after the substrate has been treated, and a degassing device (12), which is provided in the fluid supply pipe and removes gases contained in the treatment fluid.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
Provided is a coating applicator (100) which applies a solution droplet jetted from the nozzle of an applying head on a substrate. The coating applicator has a substrate holding/moving means (30) which holds a substrate (K) and circularly moves such that the substrate (K) is sequentially positioned at a jetting position where a solution is jetted by means of an applying head (7), an image pickup position where images are picked up by means of a camera (23), and a cleaning position where a cleaning apparatus (26) performs cleaning.
B05C 13/00 - Means for manipulating or holding work, e.g. for separate articles
B05C 9/12 - Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups , or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
71.
APPARATUS AND METHOD FOR SUPPLYING ELECTRONIC COMPONENT
An apparatus for supplying an electronic component is provided with: a supply reel (2) which supplies a component supply tape (1) having a recessed section (3) wherein a TCP (4) is stored; a tape recovering means (10), which makes the component supply tape (1) from which the TCP (4) is taken out from the recessed section (3) travel and recovers the tape; a peeling means (23) which is provided between a supply reel and the tape recovering means, peels a cover tape (7) covering the opening of the recessed section from the component supply tape and sequentially opens a plurality of the recessed sections; a holding block (16), which sucks and holds a component supply tape portion from which the cover tape is to be peeled and prevents the component supply tape from being deformed by being pulled by the cover tape (7) at the time of peeling the cover tape from the component supply tape by means of the peeling means; and a suction nozzle (31) which receives the TCP from the recessed section opened by having the cover tape peeled by means of the peeling means.
A highly reliable plasma generating apparatus and a highly reliable plasma processing apparatus, by which generation of abnormal electric discharge can be suppressed using an extremely simple configuration without making the processing time long and configuration complicated, and by which plasma can be securely generated in an appropriate space. A microwave blocking plate (14) is arranged below a wafer (6). The microwave blocking plate (14) is composed of an upper plate (14a) and a side plate (14b) attached perpendicular to the upper plate (14a). On the upper plate (14a) of the microwave blocking plate (14), a plurality of hole sections (15) having a diameter smaller than 1/4 of the wavelength of microwaves are formed on the entire circumference.
C23C 16/511 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating using electric discharges using microwave discharges
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/31 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
H05H 1/46 - Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
73.
SUBSTRATE COOLING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
A substrate cooling apparatus (1) cools a substrate which has been already processed. The substrate cooling apparatus is provided with: a case (10) having a space wherein the substrate is stored; a pair of holding sections (3) which are arranged on an inner wall (10a) of the case (10) so as to face each other, and have a groove section (4) that supports a substrate portion close to the end section of the substrate; and a pair of cooling sections (5), which are arranged, with the pair of holding sections (3) therebetween, in the direction orthogonally intersecting the direction wherein the holding sections (3) face each other, and have a cooling means. The time required for cooling the substrate which has been already processed can be shortened.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
H01L 21/205 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
H01L 21/31 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
74.
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method is provided with: a step wherein the inside of a processing chamber (12) is brought under second pressure which is higher than first pressure in substrate processing, in a state where a substrate (W) is spaced apart from an electrostatically attracting surface (23a); a step wherein the substrate (W) is attracted to the electrostatically attracting surface (23a) by moving the substrate (W) with respect to the electrostatically attracting surface (23a) under the second pressure, and a gas existing inside the processing chamber (12) under the second pressure is applied between the substrate (W) and the electrostatically attracting surface (23a); a step wherein heat is transferred between the substrate (W) and an electrostatic chuck table (21) by using the gas as a medium, and the substrate (W) is heated or cooled; and a step wherein the air inside the processing chamber (12) is released so as to have the inside under the first pressure, and the substrate (W) is processed under the first pressure.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/205 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
A substrate processing apparatus processes end sections (61a, 61b) of a film surface (61) of a substrate to be processed (60) having a substrate (62) and the film surface (61) provided on the substrate (62). The substrate processing apparatus is provided with: a sucking/holding section (10) which sucks and holds the substrate to be processed (60) from above in a state where the substrate (62) is positioned above the film surface (61); a laser irradiation apparatus (20) which radiates a laser beam (L); and a laser moving section (22) which moves the laser irradiation apparatus (20) in the horizontal direction. The end sections (61a, 61b) of the film surface (61) of the substrate to be processed (60), which is held by means of the sucking/holding section (10), are processed by moving the laser irradiation apparatus (20), while radiating the laser beam (L) from the laser irradiation apparatus (20).
Provided are a bonding apparatus and a bonding method wherein a constant pressurizing force can be maintained by a simple configuration, even if the position of a driving section is varied. The bonding apparatus has: a pressurizing head (52) which urges one work (S2); a vacuum chamber (51) which hermetically closes a space wherein works (S1, S2) area bonded together by means of the pressurizing head (52); a depressurizing pump (55) which is connected to the vacuum chamber (51) and is capable of bringing the inside of the vacuum chamber into a vacuum state; a driving section (54) which is supported by the vacuum chamber (51) and applies a pressurizing force to the pressurizing head (52); a sensor (56) which detects the position of the pressurizing head (52); and a control apparatus (6) which controls a pressurizing force to be applied by means of the driving section (54) based on the pressurizing head (52) position detected by the sensor (56).
B29C 65/78 - Means for handling the parts to be joined, e.g. for making containers or hollow articles
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G11B 7/26 - Apparatus or processes specially adapted for the manufacture of record carriers
Provided are a bonding apparatus and a bonding method wherein a positional shift of a work can be eliminated by a simple apparatus in a short time without deteriorating optical qualities and production efficiency. The bonding apparatus bonds a pair of works (S1, S2) with each other by having ultraviolet curable resin (T) therebetween, and the work (S2) is a cover panel provided with a view window section (W1) having a high visible light transmissivity, a blocking section (M) having a low visible light transmissivity, and a window section for curing (W2) which transmits ultraviolet rays (UV). The bonding apparatus has a pressing apparatus (5) which bonds the work (S2) to the work (S1) by pressing the work (S2), and partial irradiation apparatuses (54, 55) which apply ultraviolet rays (UV) to the window section for curing (W2) on the work bonded by the pressing apparatus (5).
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
The total application area of a plurality of droplets applied onto a substrate within a predetermined application range from a nozzle of an application head is detected with high accuracy, and the quantity of droplets jetted from the nozzle is adjusted with high accuracy. In the droplet applying method, at the time of jetting a plurality of droplets (E1-E5) within a predetermined application range (A) on a substrate (KA) from a nozzle (11) of an application head (5), a plurality of droplets (E1-E5) jetted from the nozzle (11) are dropped on the same positions within the predetermined application range (A) on the substrate (KA).
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
Provided is an image processing method for obtaining an appropriately processed image of the edge portion of an object surface. The image processing method includes an image obtaining step (S11) of obtaining a to-be-processed image including the surface image of an object and represented by a gray-scale value for each pixel, an edge portion image specifying step (S13) for specifying, as an edge portion image, the image of an area containing the edge line of the object surface image set in the image to be processed and having a predetermined width in the direction perpendicular to the edge line, a conversion step (S14) of converting the edge portion image into a rectangular image having a width corresponding to the predetermined width, an image processing step (S15) of performing a one-dimensional image processing of the rectangular image in which the gray-scale values of the pixels arranged in the direction perpendicular to the width direction are sequentially processed, and an inverse conversion step (S16) of generating a processed edge portion image by inversely converting the rectangular image subjected to the one-dimensional image processing into the image of the original area.
An electronic component mounting device comprises: a backup tool (17) that has a top end surface for supporting a bottom surface of a side edge portion whereon a TCP of a substrate that is placed on the top surface of a mounting stage is to be mounted; a pressing tool (15) for mounting the TCP onto the top surface of the side edge portion of the substrate of which the bottom surface is supported by the top end surface of the backup tool; an imaging camera (51) for imaging the top end surface in a state wherein the substrate has been retracted from the top end surface of the backup tool; a camera driving source for driving the imaging camera in the lengthwise direction of the backup tool, to cause imaging across the entire length of the top end surface; an image processing unit for processing the image signals of the camera driving source; and an evaluating unit for evaluating whether or not there is contamination on the top surface of the backup tool, based on the image signal processed by the image processing unit.
Provided are a peeling apparatus and a peeling method by which an adhesive tape can be used without wasting the tape. The peeling apparatus is provided with: a peeling head (33a), which is arranged such that an adhesive tape (T2) can be brought into contact with or separated from a peeling paper (F) and that the tape can be moved between the peeling start edge and the peeling end edge of the peeling paper (F); a supply section (31) which supplies the adhesive tape (T2); a recovery section (34) which recovers the adhesive tape (T2); a cylinder (33b) for a head, wherein the peeling paper (F) is peeled by moving the pealing head (33a) from the start edge to the end edge by moving the adhesive tape (T2) to the recovery section (34) side in a state where the adhesive tape (T2) is made to abut on the peeling paper (F) by means of the peeling head (33a); a reel lift mechanism (34b) which moves the peeling paper (F) adhered on the adhesive tape (T2) to the supply section side by moving the peeling head (33a) from the end edge to the start edge in a state where supply from the supply section (31) is stopped.
An apparatus for mounting an electronic component is provided with: a punching apparatus (5A, 5B) which is arranged in an apparatus main body (1) and punches out a TCP from a carrier tape; a receiving/transferring means (6A, 6B) which receives and transfers the punched out TCP; an index means (18A, 18B) having a plurality of holding heads which receive and hold the transferred TCPs; an adhering apparatus (31A, 31B) which adheres the adhesive tape on the TCPs which have been transferred to the holding heads; a table apparatus which receives and aligns a substrate; and a mounting head (53) which mounts on the aligned substrate the TCP having the adhesive tape adhered thereon. The adhering apparatus is provided with: a supplying reel (34) which winds thereon the adhesive tape having a release tape adhered thereon and is arranged at a lower section inside the apparatus main body; and a heating/pressurizing means (43) which is arranged above the supplying reel, and pressurizes and adheres on the TCP the adhesive tape, which has been fed out from the supplying reel with the release tape and cut to a predetermined length, while heating the adhesive tape.
A bonded structural body is provided with a first bonding member and a second bonding member, and at least the first bonding member or the second bonding member has a groove section on a bonding interface between the first bonding member and the second bonding member. In a state where the space in the groove section is depressurized and the first bonding member and the second bonding member are adhered, the first bonding member and the second bonding member are bonded. The bonding members or the bonding member and a light absorbing material can be easily adhered to each other when bonding is performed.
An applicator capable of distributing an adhesive agent to the entire surface of a work when the work is bonded and of preventing the adhesive agent from being extruded. The applicator comprises a supply section (S) for supplying the adhesive agent (R) in such a manner that the application ends of the adhesive agent (R) near two corners of the rectangular work (W) are positioned nearer the edges of the work (W) than the application ends of the adhesive agent (R) between the two corners. The supply section (S) comprises a plurality of nozzles (21, 31) for feeding the adhesive agent (R) and a drive section for linearly driving the supply section (S). The supply section (S) further comprises a first supply section (2) for applying the adhesive agent (R) from the portions near the two corners of the work (W) to the portions near two corners opposite to the afore-said two corners and a second supply section (3) for applying the adhesive agent (R) between these two corners.
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
An apparatus for mounting an electronic component is provided with: a punching apparatus (5A, 5B) which is arranged at one end of an apparatus main body (1) and punches out a TCP from a carrier tape (3); a first receiving/transferring means (6A, 6B) which receives the punched out TCP and transfers the TCP to a predetermined position; an index means (18A, 18B) having a plurality of holding heads which receive and hold the transferred TCPs; an adhering apparatus (31A, 31B) which adheres the adhesive tape on the TCPs which have been transferred to the holding heads; a table apparatus which receives and aligns a substrate; a mounting head (53) which mounts the TCP having the adhesive tape adhered thereon on the substrate which has been aligned by the table apparatus; a gas-supplying unit (72) which introduces an external gas into an apparatus main body from above the apparatus main body, and makes the gas flow downward along the punching apparatus; and a gas-releasing unit (77) which ejects, from a bottom section, dusts generated in the apparatus main body due to such flow.
Provided is a low-cost and small bonding apparatus which can efficiently align and bond works by using a turntable. A method for controlling the bonding apparatus is also provided. The bonding apparatus which bonds a pair of works (S1, S2) is provided with: a turntable (1) which intermittently rotates corresponding to a plurality of positions; a plurality of holding apparatuses (2) which are provided on the turntable (1) and hold the works (S1, S2); an aligning section (300) which is provided on the holding apparatuses (2) and aligns the work (S1); and a pressing apparatus (5) which bonds the work (S2) on the work (S1) by urging the work (S2) held by the holding apparatus (2). A driving section (400) which drives the aligning section (300) is provided independently from the turntable (1) and removably from the aligning section (300).
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
A substrate holding member has: a ring-like tray (11) having a substrate supporting section (13) which supports an outer end section of a substrate (W), a mask supporting section (12) which is arranged on the outer circumferential side of the substrate supporting section (13) and protrudes higher than the upper surface of the substrate supporting section (13), and a recessed section (14) arranged between the substrate supporting section (13) and the mask supporting section (12); and a ring-like mask (21) which covers the recessed section (14) and the substrate supporting section (13) of the tray (11) in a state where the mask overlaps the mask supporting section (12) of the tray (11).
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/205 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
A heat treating device is provided with a closed container (1), a processing space (20) provided in the closed container (1) and capable of containing a substrate (5), heaters (21, 22) arranged in the closed container (1) so as to face the processing space (20), and a shower head (10) provided inside the closed container (1) and having a gas introducing hole (15) and gas ejecting holes (31), the gas introducing hole (15) being adapted such that gas inactive to the substrate (5) and heating and cooling the substrate (5) is introduced into the gas introducing hole (15), the gas ejecting holes (31) being arranged facing the substrate (5) and ejecting the gas, which is introduced into the shower head (10) through the gas introducing hole (15), toward the substrate (5). A dispersing plate (17) is provided in the shower head (10), and the dispersing plate (17) partitions the inside of the shower head (10) into an upstream chamber (13) on the gas introducing hole (15) side and a downstream chamber (14) on the gas ejecting hole (31) side. The dispersing plate (17) has formed therein through-holes (32) for interconnecting the upstream chamber (13) and the downstream chamber (14).
C03B 32/00 - Thermal after-treatment of glass products not provided for in groups , e.g. crystallisation, eliminating gas inclusions or other impurities
89.
SPIN PROCESSING APPARATUS AND SPIN PROCESSING METHOD
A spin processing apparatus for processing a substrate by sequentially supplying plural kinds of processing solutions thereto is provided with a cup body (1), a rotary table (8) which is provided in the cup body and is rotationally driven while holding the substrate, a processing solution receiving body (16) which is ring-shaped with the upper surface open, is provided between the inner periphery of the cup body and the outer periphery of the rotary table so as to be able to be vertically driven, and receives the processing solution scattered from the rotating substrate, a linear motor (21) which sets the height of the processing solution receiving body by vertically driving the processing solution receiving body according to the kind of the processing solution supplied to the substrate, and a first to third separation flow paths (27a-27c) which are provided in the cup body and separate and recover the processing solution received by the processing solution receiving body according to the height of the processing solution receiving body set by the linear motor.
A device for joining parts together is provided with a backup tool (6) for supporting a portion at which metal terminals of both a substrate (3) and a TCP (5) are opposed to and superposed on each other, a pressing tool (7) mounted above the backup tool so as to be able to be driven in the vertical direction, receiving ultrasonic vibration from an ultrasonic vibrator (13), and driven downward to press the substrate and the TCP, which are superposed on each other, to join the metal terminals together by the ultrasonic vibration, and a sheet-like member (25) mounted between the pressing tool and the combination of the substrate and the TCP, which are superposed on each other, and consisting of a material for transmitting the ultrasonic vibration, which is applied to the pressing tool when the pressing tool joins together the metal terminals of both the substrate and the TCP, to the substrate and the TCP.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/607 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
A plasma processing apparatus is characterized by being provided with a process container capable of maintaining an atmosphere the pressure of which is reduced below the atmospheric pressure, an evacuation means for reducing the pressure in the process container to a predetermined pressure, a gas introducing means for introducing a process gas into the process container, a microwave introducing means for introducing a microwave into the process container, and a lifter pin for supporting an object to be processed on the end surface thereof, which is ascendably and descendably inserted into a mounting table provided in the process container, wherein when plasma is ignited by introducing the microwave, the object to be processed is supported at a first position near the upper surface of the mounting table by the lifter pin, and after the plasma is ignited, the object to be processed is supported at a second position remoter from the mounting table than the first position by the lifter pin. An improvement in plasma ignition rate can be achieved.
Disclosed is a laser processing apparatus for processing a substrate to be processed which is used for a solar cell. The laser processing apparatus comprises a holding part (65) for holding a substrate (60) to be processed, a laser oscillator (1) which irradiates the substrate (60) with a laser light (L) and processes the substrate (60), and a moving mechanism (5) for moving the irradiation position of the laser light (L) relative to the substrate (60) held by the holding part (65). The laser processing apparatus is also provided with a coating mechanism (10) for sequentially applying a protective material onto portions of the substrate (60) which are processed by the laser light (L).
An electronic component mounting apparatus is provided with a substrate supply stocker (2) arranged on one end side of a guide rail (1) and a collecting stocker (26) arranged on the other end side; a supply chuck (7) which supplies a plurality of substrates from the supply stocker to a supply position (S) on the one end side of the guide rail; a mounting stage (9) which is arranged to be driven to reciprocate between the supply position (S) and a mounting position (B), and receives the substrates at the supply position (S) from the guide rail and transfers the substrates to the mounting position; a plurality of mounting tools (17) which mount electronic components at the same time onto the substrates transferred from the supply position (S) to the mounting position (B); and a plurality of carry-out chucks (21, 22), which transfer the substrates whereupon the electronic components are mounted to an ejecting position (E) and store the substrates in the collecting stocker, while the mounting stage is transferring, at the mounting position, the substrates whereupon the electronic components are mounted to the guide rail, returning to the supply position and transferring new substrates to the mounting position.
A paste applying apparatus (1) is provided with an applying head (3A) for applying a paste to a subject (K) to be applied with the paste; a supporting member (5A) for supporting the applying head (3A); moving mechanisms (6A, 6B) for moving the supporting member (5A) along a surface of the subject (K); a laser distance measuring apparatus (7A) for measuring a distance to the supporting member (5A) in a moving direction of the supporting member (5A) by a laser beam; and a control section (10) for controlling the applying head (3A) and the moving mechanisms (6A, 6B) to draw a paste pattern on the subject (K), based on the measured distance.
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 11/00 - Component parts, details or accessories not specifically provided for in groups
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
G01B 11/00 - Measuring arrangements characterised by the use of optical techniques
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
A magnetron sputtering apparatus is provided with a sputtering chamber wherein a target and a subject whereupon a film is to be formed can be placed to face each other; a gas introducing port arranged to face the sputtering chamber; a magnet which is arranged to face the target outside the sputtering chamber and is rotatable with a position deviated from the center as a rotation center; a sensor for detecting the position of the magnet in the circumference direction within a rotation surface; and a control apparatus which controls to start voltage application to the target to generate electrical discharge in the sputtering chamber, based on the position of the magnet in the circumference direction and gas pressure distribution in the sputtering chamber while the magnet is rotating.
An apparatus for mounting an electronic component is provided with first and second imaging cameras (43, 44) which pick up images of a panel and a TCP (3) at the time of mounting on a panel (1) the TCP transferred to a mounting position by an index table (4); an image processor, which aligns the panel with the TCP based on an imaging signal obtained from the imaging cameras, and at the same time, detects a shift quantity between an adhesive tape, which is cut to a prescribed length and adhered to the TCP, and the TCP; and a controller for controlling panel alignment performed by the panel table based on processing by the image processor, andrelative alignment of the TCP with the adhesive tape cut to the prescribed length.
This aims to provide a cutting device and an applying device for an adhesive tape. These devices comprise a cutter (27) driven in directions to come close to and away from an adhesive tape (2), for cutting the adhesive tape when driven in the direction to come closer, a holding block (38) for blocking the warpage of the adhesive tape together with a release tape (8) by a pushing force received from the cutter, when the adhesive tape is to be cut by the cutter, an applied portion (28) integrated with the cutter for pushing the vicinity of that portion of the adhesive tape which is cut by the cutter when the adhesive tape is cut by the cutter, so that the adhesive tape is applied thereto, and a push member (33) for pushing elastically the vicinity of that portion of the adhesive tape which is pushed and applied to the applied portion, thereby to push the adhesive tape elastically and in an unapplied state, when the adhesive tape is cut by the cutter so that the cutter is driven in the direction away from the adhesive tape, till that portion of the adhesive tape which is applied to the applied portion is peeled from the release tape.
B26D 1/06 - Cutting through work characterised by the nature or movement of the cutting member; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates
98.
SUBSTRATE SURFACE INSPECTING APPARATUS AND SUBSTRATE SURFACE INSPECTING METHOD
[PROBLEMS] To provide a substrate surface inspecting apparatus and method which enables judgment and analysis of the state of even the portions of a substrate supported by supports from captured images. [MEANS FOR SOLVING PROBLEMS] A substrate surface inspecting apparatus comprises a supporting mechanism (20) in which the arrangement of substrate supporting positions along a direction perpendicular to the scanning direction of a plurality of first supports (23a-23d) is set both outside the areas of a substrate (10) to be imaged by imaging units (30a, 30b) disposed in first relative positions and within the common areas to be imaged and the arrangement of substrate supporting positions along a direction perpendicular to the scanning direction of a plurality of second supports (24a-24d) is set both outside the areas of the substrate to be imaged by the imaging units disposed in second relative positions and within the common areas to be imaged. Using this supporting mechanism (20), the surface of the substrate (10) supported by the first supports is scanned and imaged by the imaging units disposed in the first relative position. Then, the imaging units are moved to the second relative positions, and the surface of the substrate (10) supported by the second supports is scanned and imaged by the imaging units disposed in the second relative positions.
[PROBLEMS] A feature analyzing apparatus is provided which allows the features of a subject to be visually determined and which can provide a less limitation of flexibility of a classification based on the features. [MEANS FOR PROBLEMS] There are included a means for acquiring check information of a subject (S1) and an arrangement comprising the steps of analyzing the check information to determine values of feature parameters in respective ones of a plurality of layers (S2-S5); generating, based on each of the feature parameter values and a corresponding direction, a single parameter vector for a respective one of the plurality of layers (S2-S5); converting the parameter vectors to layer vectors that are three-dimensional vectors in a predetermined three-dimensional space (S2-S5); and coupling, in the order of the plurality of layers, the layer vectors obtained for the respective layers to generate, as feature information of the subject, the set of coordinate values, in the three-dimensional space, of a plurality of nodes obtained by the foregoing coupling (S6).
A droplet applying apparatus (2) is provided with an application head (2d) for ejecting a coating liquid as a plurality of droplets toward subjects (K1, K2) to be coated; a moving mechanism (2c) for relatively moving the subjects (K1, K2) and the application head (2d); and a rotating mechanism (2b) for rotating the subjects (K1, K2) within a flat surface intersecting with the ejection direction wherein the droplets are ejected.
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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