According to one embodiment of the present disclosure, a cleaning apparatus includes a plurality of rollers that rotates a substrate in contact with an outer periphery of the substrate; a rotation mechanism including a motor that rotates the rollers about the rotation shaft; a cover interposed between the rollers and the rotation mechanism to cover the rotation mechanism; an ejection port provided in the cover and that ejects gas between the cover and the rollers; a negative pressure region provided in the cover on a side of the rotation mechanism and having a negative pressure lower than an atmospheric pressure outside the cover through exhaust; a liquid ejector that ejects a cleaning liquid onto the substrate; and a cleaning unit that brings the brush into contact with at least one surface of the substrate that is being rotated, thereby cleaning the surface of the substrate.
B08B 7/04 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
B08B 1/00 - Cleaning by methods involving the use of tools, brushes, or analogous members
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
B08B 11/02 - Devices for holding articles during cleaning
According to an embodiment of the present disclosure, the cleaning apparatus includes a cleaning tank body having a body opening and a cleaning space; a lid provided to be openable and closable with respect to the body opening; a mounting stage provided in the cleaning space placing a shell of a wafer storage container; a first ejector that ejects a cleaning liquid into a storage space of the shell; a second ejector that ejects the cleaning liquid into an outer portion of the shell; a first discharge port that discharges the cleaning liquid ejected into the storage space of the shell; a second discharge port that discharges the cleaning liquid that has passed through the outer portion of the shell; and a particle counter that measures particles in the cleaning liquid discharged by the first discharge port.
According to one embodiment a substrate treatment apparatus incorporates, into a frozen film, a contaminant adhered to a substrate surface by freezing a liquid film on the surface. The apparatus includes a placement part configured to rotate the substrate, a liquid supply part configured to supply a liquid via a nozzle to the frozen film including the contaminant, a moving part configured to move the nozzle parallel to the substrate surface, and a controller configured to control a rotation of the substrate by the placement part, a supply of the liquid by the liquid supply part, and a movement of the nozzle by the moving part. The controller rotates the substrate by controlling the placement part, supplies the liquid to the frozen film by controlling the liquid supply part, and moves the nozzle from a perimeter edge vicinity to a rotation center vicinity of the substrate by controlling the moving part.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
According to one embodiment, a substrate processing apparatus includes a rotating table configured to rotate a substrate and a plurality of fixing members configured to fix the substrate on the rotating table by grasping the substrate while abutting an outer periphery of the substrate, wherein each fixing member includes a curved surface on a side that abuts the substrate, a reduced portion formed to be connected to an end of the curved surface and having a width which is continuously reduced in the first direction from a boundary with the curved surface, a first sloping surface formed on a top portion to slope downwards in the first direction, and a support portion formed on the curved surface and configured to support the substrate such that a top surface of the top portion is flush with an upper surface of the substrate in a state where the substrate is grasped.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A film formation apparatus includes: a chamber which an interior thereof can be made vacuum; a rotary table provided inside the chamber, holding a workpiece, and circulating and transporting the workpiece in a circular trajectory; a film formation unit including a target formed of film formation material and a plasma generator which turns sputtering gas introduced between the target and the rotary table into plasma, the film formation unit depositing by sputtering film formation material on the workpiece; a film processing unit processing the film deposited by the film formation unit on the workpiece; holding regions each holding the workpiece and provided in a circular film formation region facing the film formation unit and the film processing unit that is a region other than the rotation axis in the rotary table; and a heater provided in the holding regions.
According to an embodiment, a film formation apparatus and a film formation method that can form GaN film with high productivity are provided. The film formation apparatus includes: the chamber which an interior thereof can be made vacuum; the rotary table provided inside the chamber, holding a workpiece, and circulating and transporting the workpiece in a circular trajectory, a GaN film formation processing unit including a target formed of film formation material containing GaN and a plasma generator which turns sputtering gas introduced between the target and the rotary table into plasma, the GaN film formation processing unit depositing by sputtering particles of the film formation material containing GaN on the workpiece circulated and transported by the rotary table; and a nitriding processing unit nitriding particles of the film formation material deposited on the workpiece circulated and transported by the rotary table in the GaN film formation processing unit.
According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.
H01L 23/552 - Protection against radiation, e.g. light
H01F 10/26 - Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
H01F 10/30 - Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of intermediate layers
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
8.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
According to one embodiment, a substrate processing apparatus includes: a holding unit that holds a substrate; a driving unit that is provided in the holder and rotates the substrate together with the holder; a supply unit that supplies a processing liquid to a target surface of the substrate; a first cup provided to surround the substrate; a second cup provided to surround the first cup and having an inner wall surface having a property different from a property of an inner wall surface of the first cup; and a movement controller that moves the first cup and the second cup such that the processing liquid scattered from the substrate is received either on the inner wall surface of the first cup or on the inner wall surface of the second cup.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
9.
PROCESSING LIQUID SUPPLY DEVICE, SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR INSPECTING PROCESSING LIQUID SUPPLY DEVICE
According to one embodiment, a processing liquid supply device includes: a tank that stores the processing liquid; a supply path that supplies the processing liquid to the processing device; a heater that heats the processing liquid; a thermometer that measures a temperature of the processing liquid; a densitometer that measures a concentration of the processing liquid; and a controller including an inspecting unit that inspects the densitometer. The inspecting unit includes: a temperature setting device that sets a boiling point temperature at which a predetermined concentration is reached as a predetermined temperature; a heating controller that heats the processing liquid by the heater so as to reach a target temperature within a predetermined range; and a determination device that determines whether or not the concentration of the processing liquid is a target concentration within a predetermined range based on the predetermined concentration.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
According to one embodiment, a processing liquid supply device includes a plurality of tanks, a supply path that supplies a processing liquid to a processing device, a heating unit that heats the processing liquid, a dilution unit that dilutes the processing liquid, a new-liquid supply unit that supplies a new liquid, a common flow path through which the processing liquid of the plurality of tanks passes, a switching unit that switches between the plurality of tanks so that at least a tank is selected from which the processing liquid passes to the common flow path, a densitometer provided in the common flow path, and a control device that controls at least one of the heating unit, the dilution unit, and the new-liquid supply unit so that the concentration reaches a target value set in advance.
The substrate processing apparatus includes: a rotating unit that holds and rotates a substrate; a processing liquid supply unit including an ejecting unit that supplies a processing liquid from the ejecting unit to a target surface of the substrate that is being rotated by the rotating unit so as to process the substrate; and the receiving unit 30 including a container having an open top, and relatively movable with respect to the ejecting unit 21 between a block position where the supply of the processing liquid from the ejecting unit 21 is blocked and an allowance position where the supply of the processing liquid from the ejecting unit is allowed.
B05B 12/18 - Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area using fluids, e.g. gas streams
B05B 9/00 - Spraying apparatus for discharge of liquid or other fluent material without essentially mixing with gas or vapour
B05B 16/40 - Construction elements specially adapted therefor, e.g. floors, walls or ceilings
Provided is a maintenance method of a heat treatment apparatus including a chamber having a box shape and provided with a heater and a receiving member that supports a cassette having a box shape including a space in which a workpiece is supported. The maintenance method includes: attaching a loading/unloading jig including a roller on an upper portion and capable of moving the roller upward and downward, to the receiving member; transmitting the cassette supported by the receiving member onto the roller by raising the loading/unloading jig; unloading the cassette to an outside of the chamber by moving the cassette on the roller; loading the cassette into the chamber by moving the cassette on the roller; transmitting the cassette to the receiving member by lowering the loading/unloading jig; and detaching the loading/unloading jig from the receiving member.
B05D 3/04 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
B05D 3/06 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
B05C 13/00 - Means for manipulating or holding work, e.g. for separate articles
According to one embodiment, provided is a supply tank a supply device, and a supply system that stabilizes the liquid temperature of a process liquid to be supplied to a substrate processing device. A supply tank that supplies a process liquid to a substrate processing device includes a container that stores the process liquid, a first dividing plate that divides the container into a first region where the process liquid is introduced, and a second region that supplies the process liquid to the substrate processing device, first piping that feeds, to the second region, the process liquid introduced in the first region, and a first heater which is provided on a path through the first piping, and which heats the process liquid.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A supply device includes a collect tank which collects a process liquid from a substrate processing device and heats the collected liquid, and a supply tank connected to the collect tank and which supplies, to the substrate processing device, the process liquid heated in the collect tank. The collect tank includes a collect container that stores the process liquid, a first dividing plate that divides the collect container into a first region where the process liquid is introduced from the substrate processing device, and a second region that introduces the process liquid to the supply tank, piping that feeds, to the second region, the process liquid introduced in the first region, a first heater provided on a path through the piping and which heats the process liquid, and feed piping that feeds, to the supply tank, the process liquid in the second region and heated by the first heater.
A substrate drying apparatus and a substrate processing apparatus that can reduce the blockade of patterns are provided. The substrate drying apparatus according to one embodiment includes: the drier (substrate drying apparatus) of the present disclosure, includes the heater which heats the substrate, the drying room into which the substrate wherein the liquid film of the processing liquid is formed on the surface to be processed is carried in, the support which receives the substrate carried into the drying room at the standby position distant from the heater, and the driving mechanism which moves the substrate close to the heater and ejects the liquid at which the gas layer is produced between the substrate heated by the heater and the liquid film by centrifugal force due to the rotation of the substrate.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning
According to one embodiment, a film formation apparatus that suppresses effects of pre-processing and enables stable film formation is provided. A film formation apparatus of the present disclosure includes a chamber that can be made vacuum, a transporter that is provided inside the chamber and that circulates and transports a workpiece in a trajectory of a circle, a film formation unit that forms film by sputtering on the workpiece circulated and transported by the transporter, a load-lock room that loads the workpiece into and out of the chamber relative to air space while keeping an interior of the chamber vacuum, and a pre-processing unit that is provided in the chamber at a position adjacent to the load-lock room and that performs pre-processing to the workpiece loaded in from the load-lock room in a state distant from the transporter.
A substrate treatment device includes a placement platform rotating a substrate, a cooling part supplying a cooling gas to a space between the placement platform and the substrate, a liquid supplier supplying a liquid to a surface of the substrate opposite to the placement platform side, a detector that is above the surface of the substrate and detects a freezing start of the liquid, and a controller controlling the substrate rotation, the cooling gas supply, and the liquid supply. The controller controls at least one of the substrate rotation, the cooling gas flow rate, or the liquid supply rate, and causes the liquid on the substrate surface to reach a supercooled state; and when determining based on a signal from the detector that the freezing of the supercooled liquid has started, the controller starts thawing the frozen liquid after a prescribed interval has elapsed from the freezing start of the liquid.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A substrate treatment device according to an embodiment includes a placement part that includes a placement platform on which a substrate is placeable and that is configured to rotate the placed substrate, a cooling nozzle configured to supply a cooling gas to a space between the placement platform and the substrate, a liquid supplier configured to supply a liquid to a surface of the substrate opposite to the placement platform side, and a dispersion plate located at a discharge side of the cooling gas of the cooling nozzle. The dispersion plate includes a first hole extending through the dispersion plate in a thickness direction. The first hole is located at a position overlapping a central axis of the cooling nozzle when viewed along a direction along the central axis of the cooling nozzle.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
According to an embodiment of the present disclosure, a heat treatment device includes: a chamber capable of maintaining an atmosphere that is decompressed from an atmospheric pressure; an exhaust unit capable of exhausting an inside of the chamber through an exhaust port provided in the chamber; a support portion provided inside the chamber and capable of supporting a workpiece; a first heating unit provided inside the chamber and capable of heating the workpiece; an adhesion preventive plate detachably provided on an inner wall of the chamber; and a second heating unit capable of heating the adhesion preventive plate.
A substrate processing apparatus according to an embodiment of the present disclosure includes a stage having a substantially disc-shaped form and including a hole in a center thereof; a roller that contacts a side surface of the stage and rotates the stage; a first liquid nozzle that supplies a first liquid to a first surface of the substrate; a first driver that moves a position of the first liquid nozzle; a second liquid nozzle that supplies a second liquid from the hole of the stage to a second surface of the substrate; a second driver that moves a position of the second liquid nozzle; a cooling nozzle that supplies a cooling gas from the hole of the stage to the second surface; a third driver that moves a position of the cooling nozzle; and a controller that controls the first driver, the second driver, and the third driver.
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
B08B 3/04 - Cleaning involving contact with liquid
B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning
A film deposition apparatus reduces hillock formation while yielding uniform film thickness distribution. A film deposition apparatus of a present embodiment includes: a chamber; a rotary table that circulates and carries a workpiece W along a circumferential transfer path L; multiple targets that contain a film deposition material, and that are provided in positions at different radial distances from a center of rotation of the rotary table; a shield member that forms a film deposition chamber surrounding a region where the film deposition material scatters, and that has an opening on the side facing the circulated and carried workpiece; and a plasma generator that includes a sputter gas introduction unit for introducing a sputter gas into the film deposition chamber, and a power supply unit for applying power to the target, and that generates plasma in the sputter gas G1 in the film deposition chamber.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A substrate carrying apparatus that can reduce attachment of dust to substrates can be provided. The substrate carrying apparatus 1 of the present embodiment includes a carrying arm 2 for carrying a substrate, a column 32 standing up from a base body 31 with fixed angle, an upper link 33 which supports the carrying arm 2 at one end, which is rotatably connected to the column 32, and which moves the carrying arm 2 up and down in accordance with a rotation, a lower link 34 which is connected to be rotatable around an axis in parallel with a rotation axis of the upper link 33 as a center below a portion of the column 32 connected to the upper link 33, a connection link 35 which is rotatably connected to the upper link 33 and the lower link 34 so that the upper link 33 rotates in accordance with a rotation of the lower link 34, and a driving unit 4 which rotates the lower link 34.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B65G 47/90 - Devices for picking-up and depositing articles or materials
23.
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
According to one embodiment, a substrate treatment method of removing an upper end of a protrusion on a substrate is disclosed. An unevenness is formed on a surface of the substrate. The method can supply a first liquid on the surface of the substrate. The unevenness is formed on the surface. The method can form a protective layer. The protective layer covers the surface of the substrate from the first liquid supplied to the surface of the substrate. The method can supply a second liquid onto the protective layer. In addition the method can physically remove the protective layer which is on the upper end of the protrusion, and can bring the second liquid into contact with the upper end of the protrusion. The protective layer is removed from the upper end of the protrusion.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 1/00 - Cleaning by methods involving the use of tools, brushes, or analogous members
B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
According to one embodiment, a cooling device includes a flow path configured to flow a refrigerant, a condenser provided in the flow path, a heat exchanger provided in the flow path, a compressor provided in the flow path between the condenser and the heat exchanger, a cooler cooling the refrigerant flowing from the condenser into the heat exchanger, a gas cooling part supplying a gas to the heat exchanger, and configured to cool the gas by exchanging heat with the refrigerant, a first thermometer configured to detect a temperature of the cooled gas, a second thermometer configured to detect a temperature of the refrigerant flowing into the heat exchanger, and a first controller configured to control the temperature of the cooled refrigerant flowing into the heat exchanger by the cooler. The first controller controls the temperature of the cooled refrigerant by switching a first control and a second control.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/04 - Cleaning involving contact with liquid
F25B 13/00 - Compression machines, plants or systems, with reversible cycle
According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.
B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
B08B 3/04 - Cleaning involving contact with liquid
F25C 1/12 - Producing ice by freezing water on cooled surfaces, e.g. to form slabs
26.
Electromagnetic wave attenuator, electronic device, film formation apparatus, and film formation method
According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
H01L 23/552 - Protection against radiation, e.g. light
H01F 10/26 - Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
H01F 10/30 - Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of intermediate layers
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
According to one embodiment, q substrate treatment device includes a placement stand, a plurality of support portions, a cooling part, a liquid supplier, and at least one protrusion. The placement stand has a plate shape, and is configured to rotate. The support portions are provided on one surface of the placement stand and configured to support a substrate. The cooling part is configured to supply a cooling gas into a space between the placement stand and a back surface of the substrate supported by the support portions. The liquid supplier is configured to supply a liquid onto a surface of the substrate. At least one protrusion is provided on the one surface of the placement stand and extends along a boundary line of a region where the substrate is provided in a plan view.
B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand side, a detector configured to detect a state of the liquid on the surface of the substrate, and a controller controlling at least one of a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, obtains a temperature of the liquid in the supercooled state at a start of freezing, and is configured to calculate a removal ratio of a contamination.
B08B 7/04 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand, and a controller controlling a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, forms a frozen film by freezing the liquid in the super cooled state, and causes crack to generate in the frozen film by decreasing a temperature of the frozen film.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
30.
FILM FORMATION APPARATUS AND MOISTURE REMOVAL METHOD THEREOF
According to one embodiment, a film formation apparatus and a moisture removing method thereof that can facilitate the removement of moisture in the chamber without the complication of the apparatus are provided. The film formation apparatus according to the present embodiment includes the chamber 10 which an interior thereof can be made vacuum, the exhauster 20 that exhausts the interior of the chamber 10, the carrier 30 that circularly carries the workpiece W by a rotation table 31 provided inside the chamber 10, and the plurality of the plasma processor 40 that performs plasma processing on the workpiece W which is circularly carried, in which the plurality of the plasma processor 40 each has the processing spaces 41 and 42 to perform the plasma processing, at least one of the plurality of the plasma processor 40 is the film formation processor 410 that performs film formation processing by sputtering on the workpiece W which is circularly carried, and at least one of the plurality of the plasma processor 40 is the heater 420 that removes moisture in the chamber 10 by producing plasma and heating the interior of the chamber 10 via the rotation table 31 together with exhaustion by the exhauster 20 and rotation by the rotation table 31 in a condition the film formation process by the film formation processor 410 is not performed.
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating
B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
B41J 29/393 - Devices for controlling or analysing the entire machine
According to one embodiment, a substrate processing apparatus and a substrate processing method that can improve the quality of substrates are provided. The substrate processing apparatus according to one embodiment includes: a table 20 configured to support a processing target W including a substrate W1, a ring W2 surrounding a surrounding of the substrate W1, and a dicing tape W3 adhered to a lower surface of the substrate W1 and a lower surface of the ring W2, and a liquid supplier 50 configured to eject a liquid which does not mix with a processing liquid for processing the substrate W1 and which has a specific gravity heavier than the processing liquid to one of an upper surface of the ring W2 of the processing target W supported by the table 20 rotating by the rotation mechanism 30, an outer circumference end portion of the substrate W1 of the processing target W supported by the table 20 rotating by the rotation mechanism 30, and between the substrate W1 and the ring W2 of the processing target W supported by the table 20 rotating by the rotation mechanism in accordance with a rotation number of the table 20 to supply the liquid between the substrate W1 and the ring W2 of the processing target W.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
According to one embodiment, a plasma processing apparatus includes a chamber configured to maintain an atmosphere depressurized below atmospheric pressure, a gas supply part configured to supply a gas into the chamber, a placement part provided inside the chamber, and configured to place a processed product, a depressurization part configured to depressurize inside the chamber, a window provided in the chamber, and facing the placement part, a plasma generator provided outside the chamber and on a surface of the window on an opposite side to the placement part, and configured to generate plasma inside the chamber, an optical path changing part provided inside the window and having a surface tilted to a central axis of the chamber, and a detection part provided on a side surface side of the window, and facing the surface of the optical path changing part.
According to one embodiment, film formation apparatus includes: a carrying unit that includes a rotation table which circulates and carries a workpiece; a film formation process unit which includes a target formed of a silicon material, and a plasma producer that produces plasma of a sputter gas introduced between the target and the rotation table, and which forms a silicon film on the workpiece by sputtering; and a hydrogenation process unit which includes a process gas introducing unit that introduces a process gas containing a hydrogen gas, and a plasma producer that produces plasma of the process gas, and which performs hydrogenation on the silicon film formed on the workpiece. The carrying unit carries the workpiece so as to alternately pass through the film formation process unit and through the hydrogenation process unit.
H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
C23C 16/50 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating using electric discharges
C23C 16/452 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by activating reactive gas streams before introduction into the reaction chamber, e.g. by ionization or by addition of reactive species
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
35.
Substrate treatment device and substrate treatment method
A substrate treatment device according to an embodiment includes a placement portion on which a substrate is placed and rotated, a liquid supply portion which supplies a liquid to a surface on an opposite side to the placement portion of the substrate, a cooling portion which supplies a cooling gas to a surface on a side of the placement portion of the substrate, and a control portion which controls at least one of a rotation speed of the substrate, a supply amount of the liquid, and a flow rate of the cooling gas. The control portion brings the liquid present on a surface of the substrate into a supercooled state and causes at least a part of the liquid brought into the supercooled state to freeze.
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/66 - Testing or measuring during manufacture or treatment
According to one embodiment, an organic film forming apparatus includes a chamber configured to maintain an atmosphere more reduced than an atmospheric pressure, at least one processing room provided inside the chamber and being surrounded by a cover, and an exhaust part configured to exhaust the inside the chamber. The processing room includes an upper heating part including first heaters, a lower heating part including second heaters, and facing the upper heating part, an upper heat equalizing plate provided on the lower heating part side of the upper heating part, a lower heat equalizing plate provided on the upper heating part side of the lower heating part, and workpiece supporters configured to support a workpiece through a gap between the upper and lower heat equalizing plates.
F27B 17/00 - Furnaces of a kind not covered by any of groups
F27D 7/06 - Forming or maintaining special atmospheres or vacuum within heating chambers
F27B 5/04 - Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated adapted for treating the charge in vacuum or special atmosphere
F26B 3/30 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
F26B 9/06 - Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in stationary drums or chambers
C23C 14/56 - Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
37.
Tablet printing apparatus and heat dissipation method thereof
According to one embodiment, a tablet printing apparatus includes: a conveyor configured to convey a tablet while sucking and holding the tablet by the discharge of air; an inkjet head configured to perform printing on the tablet conveyed by the conveyor; an exhaust pipe which the air discharged from the conveyor passes through; an exhaust blower as a heat source that generates heat; a heat conductive member that is in contact with the exhaust pipe and the exhaust blower; and a housing configured to house the conveyor, the inkjet head, the exhaust pipe, the exhaust blower, and the heat conductive member.
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
38.
Electromagnetic wave attenuator and electronic device
According to one embodiment, an electromagnetic wave attenuator includes a multilayer member, and a magnetic member. The multilayer member includes a plurality of magnetic layers and a plurality of nonmagnetic layers. The plurality of nonmagnetic layers is conductive. A direction from one of the plurality of magnetic layers toward an other one of the plurality of magnetic layers is aligned with a first direction from the multilayer member toward the magnetic member. One of the plurality of nonmagnetic layers is between the one of the plurality of magnetic layers and the other one of the plurality of magnetic layers. A thickness along the first direction of the magnetic member is not less than ½ of a thickness along the first direction of the multilayer member.
H01L 23/552 - Protection against radiation, e.g. light
H01L 43/02 - Devices using galvano-magnetic or similar magnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof - Details
39.
Electromagnetic wave attenuator and electronic device
According to one embodiment, an electromagnetic wave attenuator includes a plurality of magnetic layers, and a plurality of nonmagnetic layers. The plurality of nonmagnetic layers is conductive. A direction from one of the plurality of magnetic layers toward an other one of the plurality of magnetic layers is aligned with a first direction. One of the plurality of nonmagnetic layers is between the one of the plurality of magnetic layers and the other one of the plurality of magnetic layers. A first thickness along the first direction of the one of the plurality of magnetic layers is not less than ½ times a second thickness along the first direction of the one of the plurality of nonmagnetic layers.
H01L 23/552 - Protection against radiation, e.g. light
H01F 10/30 - Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of intermediate layers
H01F 10/14 - Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing iron or nickel
H01F 10/16 - Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing cobalt
40.
Reflective mask cleaning apparatus and reflective mask cleaning method
A reflective mask cleaning apparatus according to an embodiment comprises a first supply section configured to supply a first solution containing at least one of an organic solvent and a surfactant to a ruthenium-containing capping layer provided in a reflective mask; and a second supply section configured to supply at least one of a reducing solution and an oxygen-free solution to the capping layer.
A reflective mask cleaning apparatus according to an alternative embodiment comprises a third supply section configured to supply a plasma product produced from a reducing gas to a ruthenium-containing capping layer provided in a reflective mask; and a second supply section configured to supply at least one of a reducing solution and an oxygen-free solution to the capping layer.
According to one embodiment, a film formation apparatus includes a chamber having an interior to be vacuumed, a carrying unit which is provided in the chamber, and which carries a workpiece that has a processing target surface in a solid shape along a circular carrying path, a film formation unit that causes a film formation material to be deposited by sputtering on the workpiece that is being carried by the carrying unit to form a film thereon, and a shielding member which has an opening located at a side where the workpiece passes through, and which forms a film formation chamber where the film formation by the film formation unit is performed. A compensation plate that protrudes in the film formation chamber is provided, and the compensation plate has a solid shape along a shape of the processing target surface of the workpiece, and is provided at a position facing the workpiece.
According to one embodiment, a plasma processing apparatus includes a chamber, a plasma generator, a gas supplier supplying, a placement part, a depressurization part, and a supporting part. The supporting part includes a mounting part positioned below the placement part and provided with the placement part, and a beam extending from a side surface of the chamber toward a center axis of the chamber. One end of the beam is connected to a side surface of the mounting part. The beam includes a space connected to an outside space of the chamber. A following formula is satisfied, t1>t2, when a thickness of a side portion on the placement part side of side portions of the beam is taken as t1, a thickness of a side portion on an opposite side of the placement part side of the beam is taken as t2.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
According to one embodiment, a plasma processing apparatus includes a chamber being possible to maintain an atmosphere more depressurized than atmospheric pressure, a plasma generator generating a plasma inside the chamber, a gas supplier supplying a gas into the chamber, a placement part positioned below a plasma generation region and placing a processed product thereon, a depressurization part depressurizing the chamber, and a power supply electrically connected to an electrode provided on the placement part via a bus bar. The bus bar is formed of an alloy of copper and gold. Gold is more included than copper on a surface side of the bus bar. The bus bar includes a first layer formed of copper and a second layer covering the first layer and formed of an alloy of copper and gold. Gold is more included than copper on a surface side of the second layer.
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
44.
Heater pipe gas leak detecting device and heater pipe gas leak detecting method
A gas leak detecting device of a heater pipe and a gas leak detecting method of a heater pipe, which are able to reliably detect a leak of gas from a heater pipe in which a fine hole is formed. A gas leak detecting device of a heater pipe, which is provided with an inside pipe housing a heater element and an outside pipe sealed surrounding the inside pipe and which is adjusted by a pressure adjustment mechanism in gas pressure in a space between the outside pipe and the inside pipe to a predetermined pressure value. The gas leak detecting device includes a gas flow resistance part, a pressure detection unit, and a leak judging device that judges whether gas is leaking from the heater pipe based on a detected pressure value obtained by the pressure detection unit.
G01M 3/28 - Investigating fluid tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for valves
H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
G01M 3/00 - Investigating fluid tightness of structures
45.
Tablet printing apparatus and tablet printing method
According to one embodiment, a tablet printing apparatus includes a conveyor, an inkjet print head, and a controller. The conveyor is configured to convey a tablet having an outer shape that does not determine the printing direction of a print pattern to be printed thereon. The print head includes a plurality of nozzles each configured to eject a liquid to print the print pattern on the tablet being conveyed. The controller is configured to control the print head to perform printing on the tablet being conveyed such that the printing direction of the print pattern is changed at predetermined intervals at least between a first direction which is parallel to or crosses the conveying direction of the tablet, and a second direction which crosses the conveying direction, and in which more nozzles are used for printing than in the first direction.
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
According to one embodiment, a tablet printing apparatus includes a conveyor configured to convey tablets sequentially supplied while sucking and holding the tablets; a print head arranged to face the conveyor to perform printing on each of the tablets being conveyed; a detector arranged upstream of the print head to detect the posture of each of the tablets; and a print condition tester arranged downstream of the print head to check print condition on each of the tablets. Suction force applied to the tablets is reduced at least in an area from a detection position to a print condition check position than in other area.
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
A61J 3/10 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of compressed tablets
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
B41J 3/60 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for printing on both faces of the printing material
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
A film formation apparatus includes a film formation unit which includes a film formation room having an opening at one end, has a target formed of a film formation material in the film formation room, and deposits the film formation material of the target on a surface of a workpiece facing the opening by plasma produced by a sputter gas in the film formation room, and a carrier that carries the workpiece along a predetermined carrying path so that the workpiece repeatedly pass through a facing region which faces the opening of the film formation room and a non-facing region which does not face the opening of the film formation room. The carrier includes a low-pressure position where the workpiece is placed and which causes an interior of the film formation room to be lower than a plasma ignition lower limit pressure and to be equal to or higher than a plasma electric discharge maintaining lower limit pressure when passing through the facing region, and a high-pressure position where workpiece is not placed and which causes the interior of the film formation room to be equal to or higher than the plasma ignition lower limit pressure when passing through the facing region.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
According to one embodiment, a tablet printing apparatus includes a conveying device, an inkjet printing device, and a control device. The conveying device is configured to convey a tablet. The printing device includes a nozzle array in which a plurality of nozzles are arranged in a direction crossing a conveying path where the tablet is conveyed by the conveying device, and performs printing by ejecting ink from the nozzles to the tablet being conveyed by the conveying device. The control device increases either one of a resolution in the conveying direction of the tablet at the time of performing the printing and a resolution in the array direction of the nozzles at the time of performing the printing higher than the other according to a print density or a print shape on the tablet, and controls the printing device to perform the printing.
B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
According to one embodiment, a tablet printing apparatus includes: a first rotator having an inner space; a duct configured to communicate with the inner space of the first rotator; a suction pipe configured to suck inside the duct; a second rotator arranged to face the first rotator across the duct; a conveyor belt wrapped around the first rotator and the second rotator; and a print head that performs printing on a tablet held on the conveyor belt. The conveyor belt includes a plurality of suction holes which communicate with the inner space of the first rotator and that of the duct, and are arranged in the rotation direction of the first rotator. The first rotator and the duct constitutes a suction chamber that applies a suction force to those of the suction holes of the conveyor belt located around the outer periphery of the first rotator and the duct.
B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
B41F 23/00 - Devices for treating the surfaces of sheets, webs or other articles in connection with printing
B65G 47/14 - Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding
A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
50.
Tablet printing apparatus and tablet printing method
According to one embodiment, a tablet printing apparatus includes: a conveying path where a tablet is conveyed; a drying device configured to dry the tablet in the conveying path; and a print head device located on the downstream side of the drying device in the conveying path. The print head device is configured to perform printing on the tablet dried by the drying device.
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
A film formation apparatus includes a chamber which has an interior capable of being vacuumed, and which includes a lid that is openable and closable on the upper part of the chamber, a rotation table which is provided in the chamber and which and carries a workpiece in the circular trajectory, a film formation unit that deposits film formation materials by sputtering on the workpiece carried by the rotation table to form films, a shielding member which is provided with an opening at the side which the workpiece passes through, and which forms a film formation room where the film formations by the film formation units are performed, and a support which supports the shielding member, and which is independent relative to the chamber and is independent from the lid.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
According to one embodiment, a tablet printing apparatus performs printing by using an inkjet print head device for a tablet conveyed by a conveying device. The conveying device includes a conveyor belt having a suction hole and configured to convey the tablet while sucking the tablet from the suction hole. The tablet printing apparatus further includes a rectifying board arranged at a distance from the conveyor belt so as to face a surface of the conveyor belt. The rectifying board has a gas permeability to let an airflow flowing toward the suction hole pass therethrough.
According to one embodiment, a tablet printing apparatus includes: a conveyor belt configured to convey a tablet; a print head configured to perform printing on the tablet conveyed by the conveyor belt; and a belt-position detector configured to detect the position of the conveyor belt in a direction crossing the conveying direction of the tablet in a horizontal plane. The conveyor belt includes a plurality of holes arranged in a row along the conveying direction of the tablet to hold the tablet. The belt-position detector includes an imaging device configured to capture an image of two or more of the holes; and an image processing device configured to detect the position of the conveyor belt in the crossing direction based on the image captured by the imaging device.
B65H 5/22 - Feeding articles separated from piles; Feeding articles to machines by air-blast or suction device
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
B65H 7/14 - Controlling article feeding, separating, pile-advancing, or associated apparatus, to take account of incorrect feeding, absence of articles, or presence of faulty articles by feelers or detectors by photoelectric feelers or detectors
A tablet printing apparatus and a tablet manufacturing method are provided which are capable of distinguishing and collecting a preceding tablet and a following tablet from each other when two or more tablets in contact with each other are carried. A tablet printing apparatus includes a carrying device 20 carrying tablets Tb, a sensor 30 detecting the tablet Tb being carried by the carrying device 20, a printing unit 50 performing, when the status changes from the status in which the sensor 30 the tablet Tb is not detected to the status in which the tablet Tb is detected, printing on the tablet Tb that has changed the status, and a collecting unit R distinguishing and collecting, when the time length at which the sensor 30 is detecting the tablet Tb is longer than the predetermined setting value because two or more tablets Tb in contact with each other are carried, the preceding tablet Tb and the following tablet Tb following thereto among two or more tablets Tb.
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
According to one embodiment, a tablet printing apparatus includes: a conveyor belt including a suction hole to suck a tablet; and an ink jet print head configured to perform printing on the tablet; wherein the conveyor belt further includes a plurality of protrusions formed around the suction hole and configured to support the tablet in contact with the tablet, and a recess formed between the protrusions and communicated with the suction hole, each of the protrusions has a bottom surface, an upper surface, area of which is smaller than that of the bottom surface, and a side surface having an inclined surface, the protrusions support the tablet such that a gap is formed between a surface of the tablet on conveyor belt side and the suction hole, and a suction force is applied to the gap and space of the recess through the suction hole to suck the tablet.
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
B65G 15/58 - Belts or like endless load-carriers with means for holding or retaining the loads in fixed position, e.g. magnetic
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
56.
Tablet printing apparatus and tablet printing method
According to one embodiment, a tablet printing apparatus includes: a conveyor belt configured to convey a tablet; a first suction path configured to suck the tablet to hold the tablet on the conveyor belt and suck the conveyor belt while allowing the conveyor belt to convey the tablet; a second suction path configured as a different path from the first suction path to suck only the conveyor belt while allowing the conveyor belt to convey the tablet; and a printer configured to perform printing on the tablet conveyed by the conveyor belt.
B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
B41M 1/40 - Printing on bodies of particular shapes
A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
B65G 15/58 - Belts or like endless load-carriers with means for holding or retaining the loads in fixed position, e.g. magnetic
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
A61J 3/10 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of compressed tablets
A plasma processing apparatus includes a vacuum container, a conveyance unit including a rotator and circulating and carrying a workpiece through the conveyance path, a cylindrical member having an opening at one end extended in the direction toward the conveyance path, a window member provided at the cylindrical member, and dividing a gas space from the exterior thereof, a supply unit supplying the process gas in the gas space, and an antenna generating inductive coupling plasma on the workpiece. The supply unit supplies the process gas from plural locations where a passing time at which the surface of the rotator passes through a process region is different, and the plasma processing apparatus further includes an adjusting unit individually adjusting the supply amounts of the process gas from the plural locations of the supply unit per a unit time in accordance with the passing time.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
A plasma processing apparatus includes a conveyance unit that has a rotator in a vacuum container, and circulating carries a workpiece by the rotator along a circular conveyance path, a cylindrical member extended in a direction toward the conveyance path in the vacuum container, a window member that divides a gas space where a process gas is introduced and an exterior, and an antenna causing the process gas to generate inductive coupling plasma for plasma processing when power is applied. The cylindrical member is provided with an opposing part with the opening and faces the rotator, a dividing wall is provided between the opposing part and the rotator so as not to contact the opposing part and the rotator and not to move relative to the vacuum container, and the dividing wall is provided with an adjustment opening that faces the opening, and adjusts a range of the plasma processing.
According to one embodiment, a tablet printing apparatus includes: a conveyor belt that includes a suction hole connected to a suction chamber, and conveys a tablet while sucking the tablet to the suction hole; an ink jet print head that has a nozzle surface where a nozzle is formed, and is located above the conveyor belt such that the nozzle surface faces the conveyor belt, and performs printing on the tablet conveyed by the conveyor belt; and a control plate that is located on the upstream side of the print head in the conveying direction of the tablet between the conveyor belt and the height position of the nozzle surface of the print head, and controls an airflow generated between the conveyor belt and the print head.
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
[Problem to be Solved] To provide a tablet printing apparatus and a tablet printing method that can perform printing with high quality by ejecting ink droplets to a tablet with a various posture from a plurality of nozzles.
[Solution] A tablet printing apparatus includes: inclined posture detector (23, 100) that detects an inclined posture of a conveyed tablet with respect to a conveying surface; a printer including an inkjet head 21 equipped with a plurality of nozzles for ejecting an ink droplet, the printer performing printing on the conveyed tablet by ejecting ink to the conveyed tablet from the plurality of nozzles; and a controller 100 for adjusting preset printing data corresponding to an inclined posture of the tablet detected by the inclined posture detector such that predetermined printing is performed on the tablet, wherein the printer performs printing on the tablet based on printing data adjusted by the printing data adjuster.
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
According to one embodiment, a floating conveyor is configured to convey a substrate while floating the substrate. The floating conveyor includes a lower floating section and an upper floating section with a conveying path of the substrate therebetween. A plurality of floating blocks that constitute at least one of the lower floating section and the upper floating section are arranged to be separated by a space, and a floating block that constitutes the other is arranged to face the space.
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
B65G 9/00 - Apparatus for assisting manual handling having suspended load-carriers movable by hand or gravity
B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
C03C 21/00 - Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals into the surface
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
According to one embodiment, a tablet printing device 1 includes: a conveyer 10 configured to convey a tablet T; a laser displacement meter 30 configured to emit laser beams to the tablet T conveyed by the conveyer 10 and receive the laser beams reflected by the tablet T; a determination unit 81 configured to determine whether there is a split line on the upper surface of the tablet T conveyed by the conveyer 10 based on an output value of the laser displacement meter 30; and a printing unit 50 configured to perform printing on the tablet T conveyed by the conveyer 10 based on a determination result obtained by the determination unit 81.
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
B41F 17/36 - Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on tablets, pills, or like small articles
A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
A film formation apparatus includes a carrying unit circulating and carrying an electronic component in a sputtering chamber, a film formation processing unit including a mount surface and a mount member which is mounted on the mount surface, and on which the electronic component is placed. The mount member includes a holding sheet having an adhesive surface, and a non-adhesive surface, and a sticking sheet having a first sticking surface with adhesiveness sticking to the non-adhesive surface, and a second sticking surface with adhesiveness sticking to the mount surface of the tray. The adhesive surface includes a pasting region for pasting the electronic components. The first sticking surface sticks across an entire region of the non-adhesive surface corresponding to at least the pasting region to provide a file formation apparatus which employs a simple structure that is capable of suppressing heating of electronic components.
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
H01L 23/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor or other solid state devices
H01L 23/552 - Protection against radiation, e.g. light
C23C 14/18 - Metallic material, boron or silicon on other inorganic substrates
C23C 14/54 - Controlling or regulating the coating process
C23C 14/02 - Pretreatment of the material to be coated
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
64.
Tablet printing apparatus and tablet printing method
According to one embodiment, a tablet printing apparatus includes: a conveyor configured to convey tablets sequentially supplied thereto while sucking and holding the tablets by a suction chamber 14; a print head located to face the conveyor and configured to elect ink to the tablet conveyed by the conveyor to perform printing; and partition walls 144, 144 and suction paths 1421, 1422 that serve as a suction force adjusting device configured to reduce a suction force applied to the tablet at a conveyance position facing the print head to be lower than a suction force applied to the tablet at conveyance positions in front of and behind the conveyance position.
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
According to one embodiment, an imprint template manufacturing apparatus includes: a supply head that supplies a liquid-repellent material in liquid form to a template having a convex portion where a concavo-convex pattern is formed on a stage; a moving mechanism that moves the stage and the supply head relatively in a direction along the stage; a controller that controls the supply head and the moving mechanism such that the supply head applies the liquid-repellent material to at least a side surface of the convex portion so as to avoid the concavo-convex pattern; and a cleaning unit that supplies a liquid to the template coated with the liquid-repellent material. The liquid-repellent material contains a liquid-repellent component and a non-liquid-repellent component that react with the surface of the template, and a volatile solvent that dissolves the liquid-repellent component. The liquid is a fluorine-based volatile solvent that dissolves the non-liquid-repellent component.
B29C 33/42 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
B29C 59/02 - Surface shaping, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
B29C 33/38 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the material or the manufacturing process
An electronic component, an electronic component manufacturing apparatus, and an electronic component manufacturing method are provided which enable an electromagnetic wave shielding film formed on a package to achieve an excellent shielding characteristic. An electronic component 10 includes an electromagnetic wave shielding film 13 formed on the top face of a package sealing elements. The thickness of the electromagnetic wave shielding film 13 on the top face of the package 12 is 0.5 to 9 μm, and the relationship between the average height Rc of the roughness curvature factor of the top face of the package 12 and the thickness Te of the electromagnetic wave shielding film 13 is Rc≤2Te.
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 23/552 - Protection against radiation, e.g. light
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
67.
Tablet printing apparatus and tablet printing method
According to one embodiment, a tablet printing apparatus includes: a first conveyor conveying a tablet while holding a other surface of the tablet; a second conveyor conveying the tablet transferred from the first conveyor while holding a one surface of the tablet; a first print head performing printing on the one surface of the tablet; a second print head performing printing on the other surface of the tablet; a first detection mechanism detecting the one surface of the tablet; a second detection mechanism detecting the other surface of the tablet; and a controller sending a printing instruction to the first and the second print heads based on information related to the state of a split line included in detection information on the one surface of the tablet or detection information on the other surface of the tablet.
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
According to one embodiment, a substrate processing apparatus includes a processing chamber, a support part, a heater, and an optical member. In the processing chamber, air flows from the top to the bottom. The support part is located in the processing chamber to support a substrate having a surface to be treated. The heater is arranged so as not to be above the support part and emits light for heating. The optical member is arranged in the processing chamber so as not to be above the support part to guide the light emitted by the heater and having passed above the support part to the surface to be treated of the substrate supported by the support part.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
B08B 5/02 - Cleaning by the force of jets, e.g. blowing-out cavities
F26B 3/30 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
69.
Tablet printing apparatus and tablet printing method
[Problem to be Solved]
To provide a tablet printing apparatus that can prevent drying of ink on the tip end of each nozzle of an inkjet printing mechanism, when a tablet does not arrive at a print position.
[Solution]
a that holds a tablet on the surface of the conveyor belt in a predetermined area including at least the print position by sucking in air; determination means (S15) that determines whether a tablet arrives at the print position; and head retreat means (32, S21) that retreats an inkjet head 31 such that a tip end part of each of the nozzles of the inkjet printing mechanism goes away from the surface of the conveyor belt, when it is determined that a tablet does not arrive at the print position.
B41J 29/38 - Drives, motors, controls, or automatic cut-off devices for the entire printing mechanism
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
B41J 25/304 - Bodily-movable mechanisms for print heads or carriages movable towards or from paper surface
B41J 3/407 - Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
B41J 2/165 - Prevention of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
70.
Substrate treatment device and substrate treatment method
A substrate treatment device according to an embodiment includes a placement portion on which a substrate is placed and rotated, a liquid supply portion which supplies a liquid to a surface on an opposite side to the placement portion of the substrate, a cooling portion which supplies a cooling gas to a surface on a side of the placement portion of the substrate, and a control portion which controls at least one of a rotation speed of the substrate, a supply amount of the liquid, and a flow rate of the cooling gas. The control portion brings the liquid present on a surface of the substrate into a supercooled state and causes at least a part of the liquid brought into the supercooled state to freeze.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
G03F 7/40 - Treatment after imagewise removal, e.g. baking
According to one embodiment, a processing liquid generator capable of improving the reliability of the concentration of generated processing liquid is provided.
b, which opens and closes the second processing liquid path P2.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
72.
Tablet printing apparatus and tablet printing method
According to one embodiment, a tablet printing apparatus includes: a conveyor; an inkjet head configured to eject ink from a nozzle to a tablet conveyed by the conveyor to perform printing; an ink tank configured to contain the ink to be supplied to the inkjet head; a moving device configured to change the height of the ink tank; and a control unit configured to control the moving device. The control unit controls the moving device to change the height of the ink tank based on a use amount of the ink figured out in advance to maintain a head difference between the height of the liquid level of the ink in the ink tank and the height of a nozzle forming surface, where the nozzle is formed in the inkjet head, at a predetermined value.
A61J 3/00 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
A61J 3/06 - Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of pills, lozenges or dragees
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
According to one embodiment, an imprint template manufacturing apparatus includes a stage, a supply head, a moving mechanism, and a controller. The stage supports a template that includes a base having a main surface, and a convex portion provided on the main surface and having an end surface on a side opposite to the main surface. A concavo-convex pattern to be pressed against a liquid material to be transferred is formed on the end surface. The supply head supplies a liquid-repellent material in a liquid form to the template on the stage. The moving mechanism moves the stage and the supply head relative to each other in a direction along the stage. The controller controls the supply head and the moving mechanism such that the supply head applies the liquid-repellent material to at least the side surface of the convex portion so as to avoid the concavo-convex pattern.
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
B29C 33/38 - SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING - Details thereof or accessories therefor characterised by the material or the manufacturing process
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
B29C 59/02 - Surface shaping, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
74.
Substrate processing apparatus and substrate processing method
According to one embodiment, a substrate processing apparatus includes a tank that stores a treatment liquid; a liquid level pipe connected to the tank such that the treatment liquid stored in the tank flows therein, and configured such that the liquid level of the treatment liquid therein moves according to increase and decrease of the treatment liquid in the tank; a liquid level sensor that detects the liquid level in the liquid level pipe; an air supply pipe for supplying a gas to a piping space above the liquid level in the liquid level pipe; and a controller that determines whether there is erroneous detection of the liquid level sensor based on a detection result obtained by the liquid level sensor in response to the movement of the liquid level in the liquid level pipe caused by supply of the gas to the piping space from the air supply pipe.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
75.
Substrate transfer apparatus, substrate processing apparatus, and substrate processing method
According to one embodiment, a substrate transfer apparatus includes: a first gripping plate; a first claw that is supported by the first gripping plate, and has an abutment surface abutting on the outer peripheral surface of a substrate located above and below a surface of the first gripping plate; a second gripping plate arranged as overlapping with the first gripping plate; a second claw that is supported by the second gripping plate, and has an abutment surface abutting on the outer peripheral surface of the substrate located above and below the surface of the first gripping plate; and a gripping part configured to move the first gripping plate and the second gripping plate relative to each other such that the first claw and the second claw move close to and away from each other in a direction intersecting the outer peripheral surface of the substrate.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
a) located at the bottom of the recess (30) of a nozzle head (32), and configured to discharge the liquid droplets as a target to be removed out of the recess (30); and a controller configured to control the discharge state of a gas discharge nozzle (33) such that there is a period in which a gas is discharged from the gas discharge nozzle (33) at a flow rate, at which the gas discharged does not reach a surface to be processed of s substrate W, in a period from the end of the rinsing process using a treatment liquid to the start of the drying process using the gas.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
77.
Film formation apparatus and film formation method
A film formation apparatus includes a chamber that is a sealed container in which a target formed of a film formation material is placed, and into which the workpiece is carried, a gas discharging unit discharging a gas in the sealed container for a predetermined time period after the workpiece is carried into the chamber to obtain a base pressure, and a sputter gas introducing unit introducing a sputter gas containing oxygen to the interior of the chamber having undergone the discharging and becoming the base pressure. The sputter gas introducing unit decreases an oxygen partial pressure in the sputter gas to be introduced in the chamber in accordance with an increase in the base pressure due to an increase of the film formation material sticking to the interior of the chamber.
A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate W, the water removing unit 110 supplies a water removing agent to the surface of the substrate W to promote replacement of the cleaning water on the surface of the substrate W with the volatile solvent.
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/02 - Cleaning by the force of jets or sprays
79.
Device and method for treating a substrate with hydrofluoric and nitric acid
According to the embodiment, a substrate treating device 10 for treating a semiconductor wafer W using an etchant L containing hydrofluoric acid and nitric acid includes a storage tank 210 that stores the etchant L; a concentration sensor 256 that measures a concentration of nitrous acid in the etchant L; an alcohol feeding line 280 that feeds IPA to the etchant L and maintains the concentration of nitrous acid to a predetermined value or more; and a substrate treating unit 100 that feeds the etchant L in the storage tank 210 to the semiconductor wafer W. The substrate treating device can improve the etching efficiency by efficiently generating nitrous acid, and thereby producing an etchant having a nitrous acid concentration suitable for etching.
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
80.
Substrate treatment apparatus, substrate treatment method, and method for manufacturing substrate
According to an embodiment, a substrate treatment apparatus includes, a substrate support unit supporting a substrate, a rotary unit rotating the substrate, a treatment liquid supply unit supplying treatment liquid to a surface of the substrate, and a controller performing liquid discharge treatment to change liquid discharge velocity at which the treatment liquid is discharged from the substrate, at preset predetermined timing, during substrate treatment in which the treatment liquid is supplied while the substrate is rotated, with the treatment continued.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
81.
Film formation apparatus and film-formed workpiece manufacturing method
A film formation apparatus and a film-formed workpiece manufacturing method which are capable of forming a film with a uniform thickness on a workpiece like a three-dimensional object that includes a plurality of surfaces by a simple structure are provided. A film formation apparatus includes a target 21 that is a film formation material including a plane SU3, a power supply unit 3 applying power to the target 21, a rotating unit 4 rotating a workpiece W that is a film formation object around a rotation axis AX1, and a revolving unit 5 revolving the rotating unit 4 around a revolution axis AX2 separate from the rotation axis AX1 to repeatedly make the workpiece W to come close to and move apart from the target 21.
The substrate processing unit 1 comprises the rotating table 31 configured to hold substrate W, the processing chamber 37 which accommodates the rotating table 31, a lamp 61 is provided above the processing chamber 37 and configured to heat the surface of substrate W, the lamp chamber 60 which accommodates that lamp 61, a transmission window 62 disposed below the lamp chamber 60, and a plurality of nozzle 64 which supply cooling fluid G to the transmission window 62. Then the substrate processing unit 1 can suppress generating of a water mark or pattern collapse, and can perform good substrate processing.
F26B 3/30 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
83.
Substrate processing apparatus and substrate processing method
According to one embodiment, a substrate processing apparatus (1) includes: a support (4) configured to support a substrate (W); a rotation mechanism (5) configured to rotate the support (4) about an axis that crosses the substrate (W) supported by the support (4) as a rotation axis; a nozzle (6) configured to supply a treatment liquid to a surface of the substrate (W) on the support (4) being rotated by the rotation mechanism (5); a heater (8) configured to heat the substrate (W) supported by the support (4) at a distance from the substrate (W); and a movement mechanism (9) configured to move the heater (8) in directions toward and away from the substrate (W) supported by the support (4).
B08B 3/04 - Cleaning involving contact with liquid
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
B08B 3/00 - Cleaning by methods involving the use or presence of liquid or steam
84.
Suction stage, lamination device, and method for manufacturing laminated substrate
A suction stage may include a mounting section configured to mount a first substrate, and an evacuation section configured to evacuate air between the first substrate and the mounting section. The mounting section includes a ring-shaped first wall part, and a ring-shaped second wall part inside the first wall part. The evacuation section includes a first control valve between the evacuation section and a first region between the first and second wall parts, a second control valve between the evacuation section and a second region inside the second wall part, and a control section configured to control the valves. The control section is configured to control the valves so that suction and non-suction of the first substrate are alternately performed in at least one of the regions. Thus, suction of the first substrate may be deactivated in one of the regions, while the suction is active in the other region.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B32B 37/14 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
85.
Substrate processing apparatus and substrate processing method
According to one embodiment, a substrate processing apparatus includes a first liquid supplier, a second liquid supplier, and a controller. The first liquid supplier supplies a substrate with a sulfuric acid solution having a first temperature equal to or higher than the boiling point of hydrogen peroxide water. The second liquid supplier supplies a surface to be treated of the substrate with a mixture of sulfuric acid solution and hydrogen peroxide water having a second temperature lower than the first temperature. The controller controls the first liquid supplier to supply the sulfuric acid solution so as to heat the substrate to the boiling point of hydrogen peroxide water or higher. When the temperature of the substrate becomes equal to or higher than the second temperature, the controller controls the first liquid supplier to stop supplying the sulfuric acid solution and controls the second liquid supplier to supply the mixture.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
c), which are aligned from the center toward the periphery of the substrate (W) supported by the support (4), configured to eject a treatment liquid to the surface of the substrate (W) on the support (4) being rotated by the rotation mechanism (5), and a controller (9) configured to control the nozzles to eject the treatment liquid at different ejection timings according to the thickness of a film of the treatment liquid formed on the surface of the substrate (W) on the support (4) being rotated by the rotation mechanism (5).
B05D 1/00 - Processes for applying liquids or other fluent materials
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
87.
Liquid feeding device and substrate treating device
A liquid feeding device that feeds a treatment liquid to a treating device and also recovers the treatment liquid for re-feeding, include feeding tanks having an exhaust passage and an overflow line, and can be switched to one of a feeding mode in which the treatment liquid is fed and a standby mode in which the feeding tank is on standby while accommodating the treatment liquid; a feeding mechanism that feeds the treatment liquid to the treating device from the feeding tank in the feeding mode among the plurality of feeding tanks; a recovery mechanism that recovers and returns the treatment liquid excessive in the treatment device to the feeding tank in the feeding mode; and an on-off mechanism provided in each of the plurality of feeding tanks to block the exhaust passage and the overflow line is provided.
G05D 11/13 - Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
B05B 12/00 - Arrangements for controlling delivery; Arrangements for controlling the spray area
G05D 9/12 - Level control, e.g. controlling quantity of material stored in vessel characterised by the use of electric means
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B05B 13/02 - Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
88.
Substrate processing apparatus and substrate processing method
According to one embodiment, a substrate processing apparatus (1) includes a table (4) configured to support a substrate W, a solvent supply unit (8) configured to supply a volatile solvent to a surface of the substrate W on the table (4), and an irradiator (10) configured to emit light to the substrate W, which has been supplied with the volatile solvent, and function as a heater that heats the substrate W such that a gas layer is formed on the surface of the substrate W to make the volatile solvent into a liquid ball. Thus, it is possible to dry the substrate successfully as well as to suppress pattern collapse.
F26B 3/30 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
F26B 7/00 - Drying solid materials or objects by processes using a combination of processes not covered by a single one of groups or
F26B 11/18 - Machines or apparatus for drying solid materials or objects with movement which is non-progressive on or in moving dishes, trays, pans, or other mainly-open receptacles
F26B 3/28 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
F26B 5/00 - Drying solid materials or objects by processes not involving the application of heat
89.
Bonding apparatus and method for manufacturing bonded substrate
A bonding apparatus includes a substrate holder holding the second substrate; a pusher pushing a back surface of the second substrate; a substrate support unit including a support talon supporting a circumferential edge portion of the first substrate to oppose the second substrate with a prescribed spacing between the second substrate and the circumferential edge portion of the first substrate; and a controller controlling a lifting/lowering operation of the pusher. The pusher pushes one prescribed point of the back surface of the second substrate, the one prescribed point corresponding to a position where a distance between a bonding surface of the first substrate and a bonding surface of the second substrate is shorter than a distance from the circumferential edge portion of the bonding surface of the first substrate to the bonding surface of the second substrate.
B32B 41/00 - Arrangements for controlling or monitoring lamination processes; Safety arrangements
B23K 20/02 - Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press
B23K 20/233 - Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
B32B 37/00 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
90.
Substrate treatment apparatus and substrate treatment method
A substrate treatment apparatus according to the embodiment includes: a nozzle which ejects a treatment liquid onto a treatment target surface of a substrate; a trajectory deflector including a trajectory deflecting surface, which is an annular inclined surface that deflects a traveling direction of the treatment liquid ejected from the nozzle and makes the treatment liquid incident on the treatment target surface, the trajectory deflecting surface having an inclination angle varying in a direction of annular extension of the trajectory deflecting surface; and a position changer which moves an incident position of the treatment liquid on the trajectory deflecting surface in the direction of annular extension of the trajectory deflecting surface.
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
B05B 1/26 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with means for mechanically breaking-up or deflecting the jet after discharge, e.g. with fixed deflectors; Breaking-up the discharged liquid or other fluent material by impinging jets
B05B 3/10 - Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements discharging over substantially the whole periphery of the rotating member
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B05B 3/04 - Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements driven by the liquid or other fluent material discharged, e.g. the liquid actuating a motor before passing to the outlet
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
B05B 13/02 - Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
91.
Substrate processing apparatus and substrate processing method
A substrate processing apparatus according to an embodiment includes: a liquid supplier configured to supply a processing liquid to a surface of a substrate; a temperature detector configured to detect a surface temperature of the substrate supplied with the processing liquid by the liquid supplier; a temperature monitor configured to determine whether or not the surface temperature detected by the temperature detector has reached a predetermined temperature; and a controller configured to cause the liquid supplier to stop supplying the processing liquid when the temperature monitor determines that the surface temperature has reached the predetermined temperature.
B08B 7/04 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
92.
Method for manufacturing reflective mask and apparatus for manufacturing reflective mask
According to one embodiment, a method for manufacturing a reflective mask includes: forming a reflection layer on a major surface of a substrate; forming a capping layer containing ruthenium on the reflection layer; forming an absorption layer on the capping layer; forming a pattern region in the absorption layer; removing a first resist mask used in forming the pattern region; and forming a light blocking region surrounding the pattern region in the absorption layer, the capping layer, and the reflection layer. The removing the first resist mask used in forming the pattern region includes: performing dry ashing processing using a mixed gas of ammonia gas and nitrogen gas or only ammonia gas.
A substrate treatment apparatus which can more efficiently regenerate phosphoric acid which is able to be returned to etching treatment along with such etching treatment as much as possible without using a large facility, that is, a substrate treatment apparatus which treats a silicon substrate W on which a nitride film is formed by a liquid etchant which contains phosphoric acid, which comprises an etching treatment unit (the spin treatment unit 30) which gives a suitable quantity of liquid etchant to each substrate which is fed one at a time so as to etch the substrate and remove the nitride film, a phosphoric acid regenerating unit (the spin treatment unit 30) which mixes liquid etchant used for treatment of one substrate and a suitable quantity of liquid hydrofluoric acid for the amount of the used liquid etchant under a predetermined temperature environment to regenerate the phosphoric acid, and a phosphoric acid recovery unit (the pump 38, phosphoric acid recovery tank 50, and pump 52) which returns the phosphoric acid which was obtained by the phosphoric acid regenerating unit to the liquid etchant to be used at the etching treatment unit.
B05C 3/02 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
94.
Etching amount measurement apparatus for dry etching apparatus
According to one embodiment, an etching amount measurement pattern is provided in a surface of a substrate. The pattern comprises a plurality of components two-dimensionally disposed and causing light incident on the pattern to be diffracted,
A configuration of the component has 4-fold rotational symmetry.
The plurality of components is arranged in a disposition having 4-fold rotational symmetry.
C09K 13/00 - Etching, surface-brightening or pickling compositions
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A spin treatment apparatus includes an annular liquid receiver, an annular cup body and an annular partitioning member. The annular liquid receiver surrounds a rotating substrate at a distance from an outer periphery of the substrate and is configured to receive liquid flying from the rotating substrate and accommodate the liquid. The annular cup body surrounds the liquid receiver at a distance from an outer periphery of the liquid receiver and forms an annular outer exhaust flow channel for generating an airflow along an upper surface to an outer peripheral surface of the liquid receiver. The annular partitioning member is provided inside the annular liquid receiver and forms an annular inner exhaust flow channel for generating an airflow along an inner peripheral surface to a lower surface of the liquid receiver.
B05C 13/00 - Means for manipulating or holding work, e.g. for separate articles
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A rotary table; a drive motor M configured to rotate the rotary table; a pin base supported by the rotary table; a pin fixing member configured to move closer to or away from C1 upon the pin base revolving; first chuck pins and second chuck pins provided on the pin fixing member and configured to be into contact with an outer edge of the substrate W; a substrate gripping force generation mechanism including a spring member; a chuck pin switching mechanism including an inertia member configured to be rotated coaxially with the rotary table and a protruded member provided on an outer peripheral part of the inertia member; and a cam member provided on the pin fixing member and configured to engage with protruded member.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
97.
Substrate processing device and substrate processing method
A substrate processing device 100 includes a cleaning liquid supply unit 114 supplying a cleaning liquid to a surface of a substrate W, a solvent supply unit 115 supplying a volatile solvent to the surface of the substrate W supplied with the cleaning liquid to replace the cleaning liquid on the surface of the substrate W with the volatile solvent, a heating unit 117 heating the substrate W supplied with the volatile solvent, and a drying unit 118 drying the surface of the substrate W by removing a droplet of the volatile solvent produced on the surface of the substrate W by a heating operation of the heating unit 117, and the heating unit 117 and the drying unit 118 are arranged in a course of transportation of the substrate W transported from the solvent supply unit 115.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
98.
Substrate processing device and substrate processing method
In a substrate processing device 10 having a heating and drying unit 103 for drying a surface of a substrate W, the heating and drying unit 103 heats upward a vertically downward surface of the substrate W to dry the surface of the substrate by dropping and removing, by gravity, the droplets of the volatile solvent formed on the surface of the substrate W by the heating operation.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
99.
Substrate processing device and substrate processing method
A substrate processing device includes a suction drying section drying a surface of a substrate by absorbing and removing a liquid droplet of volatile solvent formed on the surface of the substrate by a heating operation of a heating section.
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
According to one embodiment, a bonding apparatus for processing a retained substrate includes a main body unit, a nozzle, a gas supply unit, and a substrate support unit. The nozzle opens on a face of the main body unit on a side that a first substrate is retained. The gas supply unit is configured to supply gas to the nozzle, to apply suction to the first substrate and to separate the substrate from the face of the main body unit. The substrate support unit is configured to support a peripheral edge portion of a second substrate provided in opposition to the first substrate with a predetermined gap.
B29C 65/48 - Joining of preformed parts; Apparatus therefor using adhesives
B29C 65/78 - Means for handling the parts to be joined, e.g. for making containers or hollow articles
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B32B 39/00 - Layout of apparatus or plants, e.g. modular laminating systems
B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
C08J 5/12 - Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
B23K 37/04 - Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the other main groups of this subclass for holding or positioning work
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
patents
