A silicon semiconductor wafer is transported into a chamber, and preheating of the semiconductor wafer is started in a nitrogen atmosphere by irradiation with light from halogen lamps. When the temperature of the semiconductor wafer reaches a predetermined switching temperature in the course of the preheating, oxygen gas is supplied into the chamber to change the atmosphere within the chamber from the nitrogen atmosphere to an oxygen atmosphere. Thereafter, a front surface of the semiconductor wafer is heated for an extremely short time period by flash irradiation. Oxidation is suppressed when the temperature of the semiconductor wafer is relatively low below the switching temperature, and is caused after the temperature of the semiconductor wafer becomes relatively high. As a result, a dense, thin oxide film having good properties with fewer defects at an interface with a silicon base layer is formed on the front surface of the semiconductor wafer.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/324 - Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
The substrate processing apparatus includes: a nozzle having a spout and adapted to spout SPM from the spout toward a substrate; a mixing portion communicating with the spout; a sulfuric acid-containing liquid supply device which recovers liquid supplied to and expelled from the substrate held by a substrate holding unit, prepares a sulfuric acid-containing liquid from the recovered liquid, and supplies the prepared sulfuric acid-containing liquid to the mixing portion; and a control device. The control device performs: a sulfuric acid-containing liquid preparing step of recovering SPM supplied to and expelled from the substrate and preparing the sulfuric acid-containing liquid; and an SPM spouting step of supplying the prepared sulfuric acid-containing liquid and hydrogen peroxide water to the mixing portion, mixing the sulfuric acid-containing liquid and hydrogen peroxide water together in the mixing portion to prepare SPM, and spouting the prepared SPM from the spout.
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
3.
SUBSTRATE TREATING METHOD, SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING LIQUID
A substrate treating method according to the present invention is a substrate treating method for treating a pattern-formed surface of a substrate W, the substrate treating method including: a supply process of supplying a substrate treating liquid containing a sublimable substance and a solvent to the pattern-formed surface; a solidification process of evaporating the solvent in a liquid film of the substrate treating liquid supplied to the pattern-formed surface in the supply process, depositing the sublimable substance, and forming a solidified film containing the sublimable substance; and a sublimation process of sublimating the solidified film and removing the solidified film, in which the sublimable substance contains at least one of 2,5-dimethyl-2,5-hexanediol and 3-trifluoromethylbenzoic acid.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A support device supports adjustment of values of parameters of a substrate processing apparatus. The parameters include detection target parameters of which corresponding physical quantities are to be detected. An arithmetic processing section of the support device builds a predictive model through a first machine leaning model performing learning of quality data and detection data pieces relating to the physical quantities. The arithmetic processing section acquires detection data recommended values by executing Bayesian optimization based on the predictive model, an acquisition function, and a search range. The arithmetic processing section causes a second machine learning model to perform learning of the detection data pieces and values of the parameters. The arithmetic processing section outputs parameter recommended values by inputting the detection data recommended values to the second machine learning model having performed the learning.
G05B 13/04 - Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
G05B 13/02 - Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
A technique allows sucking ink adhering to the lower surface of a head and preventing the ink from being sucked out from the inside of nozzles of the head. The printer includes a head that ejects ink and a maintenance unit that performs maintenance of the head. The head has a lower surface that includes a nozzle face provided with a plurality of nozzles and side faces located adjacent to the nozzle face. The maintenance unit includes a cleaning block that sucks the ink from the lower surface of the head. The cleaning block has an upper surface that includes a first region that faces the nozzle face and second regions that face the side faces. The suction force acting on the first region is smaller than the suction force acting on the second regions. This reduces the possibility that the ink is sucked out from the inside of the nozzles of the head.
The cleaning liquid supply mechanism ejects the cleaning liquid to an ejection target that is one of the cleaning roller and the cap. In particular, the cleaning liquid supply mechanism switches the ejection target between the cap and the cleaning roller and ejects the cleaning liquid to the ejection target. Specifically, if the cap is set as the ejection target, the cleaning liquid is ejected from the cleaning liquid supply mechanism directly to the cap as the ejection target. If the cleaning roller is set as the ejection target, the cleaning liquid is ejected from the cleaning liquid supply mechanism directly to the cleaning roller as the ejection target.
There is provided a technology that enables reduction of an amount of data to be processed in testing a printed image printed on a printing medium. A printing apparatus includes a printing unit, a camera, and an image-data output unit. The printing unit is capable of printing plural categories of test patterns on the printing medium. The camera captures an image of a test pattern printed on the printing medium, and outputs acquired image data to the image-data output unit. The image-data output unit reduces an amount of data of the image data output from the camera, in accordance with the category of the test pattern, and outputs acquired image data to a test apparatus.
A substrate cleaning device includes a chamber, a first processing part and a second processing part. The chamber forms a processing space including a first processing position and a second processing position. The first processing part performs a first process on a substrate disposed at the first processing position in the chamber. The second processing part performs a second process on the substrate disposed at the second processing position in the chamber. A main robot loads and unloads the substrate with respect to the substrate cleaning device by moving a hand holding the substrate. In addition, the main robot receives the substrate disposed at the first processing position by causing the hand to enter the processing space, transporting the substrate to the second processing position, and positioning the substrate.
A posture turning unit of a substrate treating apparatus includes two horizontal holders configured to place a plurality of substrates when the substrates are in a horizontal posture, two vertical holders provided below the horizontal holders and configured to hold the substrates in a vertical posture when the substrates are in the vertical posture, an opening and closing portion configured to move the two vertical holders between a holding position and a passing position, a supporting portion configured to support the two horizontal holders and the two vertical holders, a longitudinal rotator configured to rotate the supporting portion around a horizontal axis so as to direct the two vertical holders to the horizontal substrate transport mechanism, and a moving unit configured to move the supporting portion and the longitudinal rotator. When a posture of the substrates is turned to horizontal, the opening and closing portion moves the two vertical holders to into the passing position.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
B08B 3/04 - Cleaning involving contact with liquid
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Disclosed is a substrate treating apparatus. In the substrate treating apparatus, a pusher is provided at a position accessible by a first transport mechanism, and a posture turning unit is provided at a position accessible by a center robot. A second transport mechanism receives substrates in a vertical posture held by the pusher, and delivers the substrates to the posture turning unit. The second transport mechanism includes two horizontal chucks configured to hold the substrates in the vertical posture while radially supporting two side portions of each of the substrates. The posture turning unit includes an upper and lower chucks for radially supporting an upper portion and a lower portion of each of the substrates in the vertical posture held by the two horizontal chucks to receive the substrates in the vertical posture from the two horizontal chucks, and upper and lower chuck rotation unit for rotating the upper and lower chucks around a horizontal axis.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
An encoding step and an image selection step are performed by a computer 20. In the encoding step, a plurality of partial images D2 of an object are input to a learned VAE model M, and the plurality of partial images D2 are encoded to a plurality of latent variables in a multi-dimensional latent space. In the image selection step, one or more partial images D2 that are likely to include an alignment mark are selected on the basis of a distribution of the plurality of latent variables in the latent space. Thus, a partial image that is likely to include an alignment mark is automatically detected by the computer 20 with the use of the VAE model M. This can lighten a burden on an operator who searches for an alignment mark.
This invention relates to a replacement end time determination method in a process of replacing a liquid to be replaced by a processing fluid in a supercritical state and a substrate. In the invention, a density profile is obtained at each of a dry state where the liquid to be replaced is not present in a chamber and a wet state where the liquid to be replaced is present in the chamber by supplying and discharging the processing fluid into and from the chamber in accordance with a predetermined supply/discharge recipe while maintaining the processing fluid in a supercritical state. When both densities become substantially equal to each other after the density at the wet state becomes larger than the density at the dry state, the replacement of the liquid to be replaced by the processing liquid is regarded to be finished.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
There is provided a technique that enables efficient and uniform laser marking. A laser marker includes a laser light source, an illumination optical system, a spatial light modulator, a projection optical system, and a scanning unit. The laser light source emits laser light. The illumination optical system shapes the laser light into a line-shaped parallel beam. The spatial light modulator includes a plurality of modulation components arranged along a long-axis direction, and modulates the parallel beam into a line-shaped modulated beam using the plurality of modulation components. The projection optical system guides the modulated beam to an object. The scanning unit scans the surface of the object with the modulated beam.
In an auxiliary heating part for performing a preheating treatment on a semiconductor wafer, VCSELs are arranged so as to surround LED lamps arranged in a circular region. The LED lamps irradiate the entire surface of the semiconductor wafer with light, and the VCSELs which emit light of relatively high directivity irradiate a peripheral portion of the semiconductor wafer where a temperature decrease is prone to occur with the light. A common power supply circuit is provided for the LED lamps and VCSELs that irradiate the peripheral portion of the semiconductor wafer with light. Increases in size and costs of power supply circuitry are suppressed because the single power supply circuit supplies power to the two different types of light sources to collectively control the two different types of light sources.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
F27B 17/00 - Furnaces of a kind not covered by any of groups
This invention aims to propose a structure excellent in the maintenance operability of a cleaning member in a printing apparatus provided with the cleaning member for cleaning at least one of a wiper and a cap. In a printing apparatus according to the invention, a cleaning member for cleaning a wiper or a cap of a maintenance part is integrated with a printing head in a relative movement between the printing head and the maintenance part and arranged to at least partially overlap a movement path of the object to be cleaned with respect to the printing head and moves to outside the conveyance path integrally with the printing head when the printing head is moved from the inside position to the outside position.
A technique allows satisfactorily cleaning ejection heads with a cleaning liquid while protecting ink meniscus in nozzles. A printer includes an ejection head, a cleaning-liquid block, and a receptacle. The ejection head has an ink ejecting plane that includes nozzles as openings and ejects ink from the nozzles. The cleaning block has a head opposing plane that includes an ejection hole as an opening. The cleaning block ejects a cleaning liquid in an inclination direction inclined relative to the ink ejecting plane. The receptacle is located below the cleaning block and receives the cleaning liquid ejected from the ejection hole.
An object is to provide a technique allowing photographed data acquired by a camera to be converted properly to an image having a resolution necessary for inspection. An imaging device includes a camera, an image data output unit, and an external output signal generator. The camera outputs photographed data obtained by photographing an image on the basis of a camera output signal generated with a constant period. The image is printed on a printing medium transported in a transport direction X. The image data output unit outputs image data based on the photographed data to an inspection device. The external output signal generator generates an external output signal indicating timing of output of the image data by the image data output unit. The image data output unit calculates a weighted average of several pieces of photographed data stored in a buffer while giving respective weights responsive to a time gap between the camera output signal and the external output signal to the several pieces of photographed data.
A substrate processing apparatus includes a processing tank, a substrate holding section, a bubble supply section, and processing liquid supply sections. The substrate holding section immerses a substrate in a processing liquid stored in the processing tank. The bubble supply section supplies bubbles to the processing liquid from below the substrate. The processing tank includes a first side wall and a second side wall. The processing liquid supply sections include one or more first processing liquid supply sections and one or more second processing liquid supply sections. The one or more first processing liquid supply sections are disposed on a side of the first side wall and supply the processing liquid toward the bubbles. The one or more second processing liquid supply sections are disposed on a side of the second side wall and supply the processing liquid toward the bubbles.
A training device includes a data acquirer that acquires training data including a first image of a first type and a second image of a second type that is different from the first type, a first trainer that repeats an epoch for causing the first image and the second image to be learned under a same condition multiple times, and a second trainer that repeats an epoch for training a trained learning model generated by the first trainer with a rate of error back-propagation in regard to the first image and a rate of error back-propagation in regard to the second image being made different from each other.
Disclosed is a substrate treating apparatus provided with a posture turning unit. The posture turning unit includes a first vertical holder having a first rotating member and a first holder body provided so as to protrude from the first rotating member. The posture turning unit also includes a second vertical holder having a second rotating member and a second holder body provided so as to protrude from the second rotating member. A rotation driving unit rotates the two holder bodies around the two rotating members, respectively, whereby the two vertical holders are changed into a holding state or a releasing state. When a posture of substrates is turned to horizontal by a support base rotator, the rotation driving unit changes a state of the two vertical holders into the releasing state, whereby the substrates are released from the two holder bodies.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Disclosed is a substrate treating apparatus provided with a treating block. The treating block includes a wet transportation region adjoining a batch treatment region and a single-wafer transportation region. The wet transportation region contains a second posture turning mechanism provided on an extension line of a line of six batch process tanks and configured to turn a posture of substrates, on which immersion treatment is performed, from vertical to horizontal, a belt conveyor mechanism configured to receive the substrates in a horizontal posture one by one from the second posture turning mechanism and transport the substrates to the single-wafer transportation region, and a liquid supplying unit configured to supply a liquid to wet the substrates, transported by the belt conveyor mechanism, with the liquid.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
22.
ADJUSTING METHOD FOR PRINTING APPARATUS, AND A PRINTING APPARATUS
To provide an adjusting method for a printing apparatus, and the printing apparatus, capable of appropriately adjusting drive voltages of heads even when printing conditions are changed, this invention can appropriately acquire adjusted voltages of the heads even when printing conditions are changed. That is, according to this invention, a construction is configured to change an adjustable range of head drive voltages with a printing mode. This invention acquires the adjustable range corresponding to the printing mode set by referring to a table Ti. Consequently, the adjusted voltages of the heads can be determined within the adjustable range suited to each printing mode.
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
B41J 29/393 - Devices for controlling or analysing the entire machine
The present water electrolyzer has a stack structure with a cell and a separator stacked alternately. The separator includes a metal plate and a flow path member. The metal plate has a distribution hole. The flow path member is located between a base layer of the cell and the metal plate in a stacking direction. The flow path member surrounds the distribution hole in a ring-like shape when viewed in the stacking direction. The flow path member includes a flow path through which a gas diffusion layer of the cell and the distribution hole communicate with each other. As a result, it becomes possible to cause gas or water to flow between the gas diffusion layer and the distribution hole through the flow path formed at the flow path member. This achieves reduction in the number of the metal plates to be used as the separator.
C25B 1/04 - Hydrogen or oxygen by electrolysis of water
C25B 9/23 - Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof with diaphragms comprising ion-exchange membranes in or on which electrode material is embedded
The present separator is used in a stack structure in which a cell and the separator are stacked alternately. The cell has a base layer including an electrolyte membrane. The separator includes a metal plate and a ring-like seal member. The seal member is arranged on a surface of the metal plate. The metal plate includes a regulator. The regulator is provided near the seal member and contacts the base layer. As a result, it becomes possible to reduce a likelihood that the seal member will be compressed excessively in a stacking direction in the stack structure.
C25B 9/23 - Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof with diaphragms comprising ion-exchange membranes in or on which electrode material is embedded
C25B 1/04 - Hydrogen or oxygen by electrolysis of water
C25B 9/77 - Assemblies comprising two or more cells of the filter-press type having diaphragms
The overlapping regions L are formed by overlapping the outer cylinder vent holes and the inner cylinder vent holes. If the suction port of the inner cylinder receives a suction force from the blower, air is sucked toward the suction port from the suction chamber facing the overlapping region L of the inner cylinder vent hole and the outer cylinder vent hole, out of the plurality of suction chambers, via the overlapping region L. The outer cylinder and the inner cylinder are so configured that the overlapping region L becomes narrower in the rotation direction Dr from the center toward the both ends in the axial direction Da.
First, a correction area, which is a part of area where a second ink (typically, white ink) is to be ejected among the area on base material, is determined. Next, density data is corrected so that the second ink is ejected onto the correction area. Thereafter, actual printing on the base material is started. Then, the second ink is ejected onto the correction area, and a first ink (typically, color ink) is ejected onto the second ink that has been ejected onto the base material in the correction area.
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
A substrate cleaning apparatus includes an upper holding device holding an outer peripheral end of a substrate, and a lower surface brush contacting a lower surface of the substrate to clean the lower surface. The lower surface brush moves from a state of being separated from the lower surface to contact a first partial region of the lower surface when cleaning of a lower surface central region of the substrate is started. Then, the lower surface brush moves into contact with the lower surface central region on the lower surface. The lower surface brush moves from a state of being in contact with the lower surface to be separated from a second partial region of the lower surface when cleaning of the lower surface central region is completed. At least one of the first partial region and the second partial region does not overlap the lower surface central region.
Provided is a substrate treating apparatus can be provided that transports substrates reliably and has suppressed manufacturing cost by revising a construction of an apparatus including a batch-type module and a single-wafer-type module.
Provided is a substrate treating apparatus can be provided that transports substrates reliably and has suppressed manufacturing cost by revising a construction of an apparatus including a batch-type module and a single-wafer-type module.
The present invention especially focuses on a process by a substrate treating apparatus for picking up one substrate from substrates aligned in a vertical posture, turning a posture of the substrate to horizontal, and transporting the substrate to a predetermined position in the vicinity of a single-wafer transport region. With the present invention, a process of picking up the substrate and a process of turning the posture of the substrate are performed independently, achieving simplification in construction of a substrate pick-up unit and reduction in positional error generated when the substrate pick-up unit operates.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
29.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
First and second concentration measurement parts (415, 425) are provided in first and second supply liquid lines (412, 422) in which first and second supply liquids flow, respectively. A dissolved concentration of gas in the second supply liquid is lower than that in the first supply liquid. In the first and second supply liquid lines, respective one ends of first and second branch lines (51, 52) are connected to respective positions on the upstream side of the concentration measurement parts. The other ends of the first and second branch lines are connected to a mixing part (57), and by mixing the first and second supply liquids, a processing liquid is generated. Respective flow rate adjustment parts (58) of the first and second branch lines are controlled on the basis of respective measured values of the first and second concentration measurement parts so that the dissolved concentration of the gas in the processing liquid can become a set value. It is thereby possible to prevent the supply liquid containing particles or the like caused by the concentration measurement part from being contained into the processing liquid to be supplied to a substrate and also to adjust the dissolved concentration of the gas in the processing liquid to the set value with high accuracy.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B01F 23/40 - Mixing liquids with liquids; Emulsifying
B01F 23/45 - Mixing liquids with liquids; Emulsifying using flow mixing
B01F 23/454 - Mixing liquids with liquids; Emulsifying using flow mixing by injecting a mixture of liquid and gas
B08B 3/00 - Cleaning by methods involving the use or presence of liquid or steam
30.
HEAD REPLACEMENT METHOD, INKJET PRINTING APPARATUS, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM RECORDING HEAD REPLACEMENT SUPPORT PROGRAM
The head replacement method includes: a pipe connection step of performing, by a user, pipe connection of a new head; an ink circulation start step of starting circulation of ink in a circulation flow path; and a connection state determination step of determined, based on an ink liquid level position representing a height of an ink liquid level in at least one of a collection tank and a supply tank, whether a pipe connection, including a connection between an ink discharge pipe and a collection branch pipe and a connection between an ink inflow pipe and a supply branch pipe, is properly made.
A substrate cleaning apparatus includes an upper holding device holding an outer peripheral end of a substrate, and a lower surface brush contacting a lower surface of the substrate to clean the lower surface. The lower surface brush moves between a contact position where the lower surface brush contacts the lower surface of the substrate held by the upper holding device and a separation position where the lower surface brush is separated from the substrate held by the upper holding device by a certain distance. At the separation position, the lower surface brush rotates at a first rotation speed. At the contact position, the lower surface brush rotates at a second rotation speed higher than the first rotation speed at a time point when the lower surface brush contacts the lower surface and a time point when the lower surface brush is separated from the lower surface.
A46B 13/02 - Brushes with driven brush bodies power-driven
B08B 1/04 - Cleaning by methods involving the use of tools, brushes, or analogous members using rotary operative members
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 5/02 - Cleaning by the force of jets, e.g. blowing-out cavities
B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
32.
LIGHT IRRADIATION TYPE HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS
A reflectance measurement part measures the reflectance of a back surface of a semiconductor wafer. An imaging parameter of a camera is adjusted based on the measured reflectance. The imaging parameter includes exposure time and sensitivity of the camera. The camera with the adjusted imaging parameter images the back surface of the semiconductor wafer to determine the presence or absence of a flaw from the obtained image data. The camera is able to perform appropriate imaging in accordance with the reflectance of the back surface of the semiconductor wafer. Thus, a flaw in the back surface of the semiconductor wafer is detected with reliability even if the reflectance of the back surface is varied due to the deposition of a thin film on the back surface.
A technique allows satisfactory removal of ink droplets adhering to the ejection surface of an ejection head while preventing the occurrence of performance degradation of the ejection surface. A printer performs printing by ejecting ink droplets to an upper surface of a long band-like base material (M). The printer includes an ejection head and a cleaner. The ejection head has an ejection surface in which a plurality of ink ejection outlets for ejecting ink droplets are arranged in a width direction (X). The cleaner cleans the ejection surface. The cleaner includes a gas ejector. The gas ejector ejects gas to the ejection surface from a position away from the ink ejection outlets in the Y direction.
A leak determination method includes: a heating step of heating a semiconductor wafer in a chamber; a transport step of transporting the semiconductor wafer from the chamber after the heating step; a temperature measurement step of measuring an ambient temperature in the chamber; and a leak determination step of performing leak determination processing of the chamber. After the semiconductor wafer is transported from the chamber, waiting is continued until the ambient temperature decreases to a predetermined waiting specified temperature, and the leak determination processing is started when the ambient temperature reaches the waiting specified temperature.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Techniques are provided for adequately cooling a continuous base material while efficiently drying a pre-processing liquid on the continuous base material before printing using second ink. The printer includes first and second printing units and a dryer located downstream of the first printing unit and including a heating roller. The second printing unit is located downstream of the dryer. The heating roller has a first outer peripheral surface around which the continuous base material is wound, and heats the continuous base material with the first outer peripheral surface being in contact with a second surface of the continuous base material on the side opposite to the first surface. The dryer includes a cooling roller located downstream of the heating roller and having a second outer peripheral surface around which the continuous base material is wound. The second outer peripheral surface has a lower temperature than the first outer peripheral surface.
The present invention is a position adjustment method for head units arrayed in a predetermined width direction attachably to and detachably from a base member. A position of a second head unit in the width direction and a rotation direction are respectively adjusted while the second head unit is engaging a tip part of a reference pin. More particularly, a width direction adjuster moves the second head unit in the width direction with a first head unit kept fixed to the base member. In this way, the gap between the first head unit and the second head unit is adjusted. Further, a rotation direction adjuster moves the second head unit in the orthogonal direction at a separation position distant from the reference pin. In this way, a rotation direction position of the second head unit with respect to the tip part of the reference pin is adjusted.
An organ preservation container includes a container body, joints, and tubes. The container body includes a bottom plate and a side wall. The side wall has through holes. Each joint has a through hole. The tubes are connected to the joints from the inner side of the container body. Thus, the tubes are arranged in advance in the container body in an organ transplant operation. This enables a small number of people to speedily conduct the work of placing an organ removed from the donor in the container body and connecting the tubes to blood vessels in the organ.
A substrate processing apparatus includes a cup, an exhaust duct, a mist collecting member and a lid portion. The cup surrounds a substrate being processed with use of a processing liquid. The exhaust duct has an opening in a portion not overlapping with the cup in a plan view and forms an exhaust flow path for exhausting a gas in the cup. The mist collecting member is provided at a position overlapping with the opening and collects mist of the processing liquid in the exhaust duct. The lid portion closes the opening of the exhaust duct.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
A substrate processing apparatus includes a nozzle that supplies a processing liquid to a substrate, a mover that moves the nozzle between a supply position above a substrate and a waiting position outward of the substrate, a nozzle container that is located at the waiting position and contains the nozzle, a first exhaust flow path that guides a gas in a processing space in which a processing liquid is supplied to a substrate to an exhaust device, and a second exhaust flow path that guides a gas in the nozzle container to the first exhaust flow path.
B05B 13/04 - Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during operation
B05B 12/00 - Arrangements for controlling delivery; Arrangements for controlling the spray area
B05D 1/02 - Processes for applying liquids or other fluent materials performed by spraying
40.
IMAGE COMPARISON METHOD, IMAGE COMPARISON DEVICE, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM RECORDING IMAGE COMPARISON PROGRAM
After a difference image between original image and calibration image is generated, a candidate image of an edge region is generated. Thereafter, an edge image is generated based on the original image, the calibration image, and the candidate image. At that time, the processing target pixel (pixel constituting the candidate image) is determined to be a pixel constituting the edge region when a difference between a pixel value of at least one of nine comparison target pixels in the original image and a pixel value of the processing target pixel in the calibration image is less than or equal to a first threshold value, and when a difference between a pixel value of at least one of nine comparison target pixels in the calibration image and a pixel value of the processing target pixel in the original image is less than or equal to the first threshold value.
A substrate processing apparatus includes a nozzle, a pipe, a protective pipe, a nozzle driver, and a leak sensor. The nozzle discharges a processing liquid to a substrate to be processed. The pipe is connected to the nozzle. The protective pipe surrounds an outer periphery of the pipe. The nozzle driver moves the nozzle. The leak sensor detects a leak liquid from the pipe.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
In an substrate processing apparatus according to the present invention, a chamber is configured so as to cover an internal space with a bottom wall, side walls extending from the periphery of the bottom wall, and a ceiling wall covering the upper end of the side walls. A plurality of base support members stand vertically upward from the bottom wall, and the base member is supported by upper end portions of these base support members. A so-called raised floor structure is formed. Then, the substrate processing part is installed on the upper surface of the base member. By adopting such a layout using the raised floor structure, even if leakage of the processing liquid occurs and the processing liquid is pooled on the bottom wall of the chamber, it is possible to reliably prevent the processing liquid from coming into contact with the substrate processing part.
Disclosed is a substrate treating apparatus including a substrate holder configured to hold a treatment substrate group, a second transport mechanism configured to pull out and transport a divided substrate group from the treatment substrate group held by the substrate holder, an underwater posture turning unit configured to turn a posture of the divided substrate group, transported by the second transport mechanism, from vertical to horizontal collectively, a center robot configured to take one substrate from the divided substrate group, whose posture is turned to horizontal, and to transport the one substrate to a single-wafer processing unit, a relative lifting and lowering unit configured to move the substrate holder and the second transport mechanism upward and downward relatively, and an alignment direction relative moving unit configured to move the substrate holder and the second transport mechanism relatively horizontally in an alignment direction where the treatment substrate group is aligned. The second transport mechanism includes one-paired chucks having holding grooves and passing grooves arranged one by one alternately.
A wiring forming method includes a loading step (Si), an etching step (S3), and a reducing step (S6). In the loading step (S1), a substrate having a metal wiring portion formed thereon is loaded into a chamber. In the etching step (S3), an oxidizing gas is supplied to the substrate to etch one part of the metal wiring portion. In the reducing step (S6), a reducing gas is supplied to the substrate to reduce an oxide film of the metal wiring portion formed by the etching step (S3).
H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
In an substrate processing apparatus according to the present invention, a chamber has a a conveyance opening for conveying the substrate along a conveyance path between the outside of the chamber and the substrate holder and a maintenance opening provided on an opposite side of the conveyance opening with the substrate holder. A rotating mechanism has a motor for generating a rotational driving force to rotate the substrate holder and a power transmitter for transmitting the rotational driving force generated by the motor to the substrate holder. The motor and the power transmitter are so arranged on the opposite side of the conveyance opening with respect to the substrate holder, as to face the maintenance opening, to thereby make the rotating mechanism accessible through the maintenance opening from the outside.
B25J 9/04 - Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian co-ordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical co-ordinate type or polar co-ordinate type
In a substrate processing apparatus according to the present invention, a heating mechanism for heating a substrate includes a gas discharge nozzle arranged in an internal space, a heater attached to an outer wall of a chamber, and a pipe feeding to the discharge nozzle. An observing mechanism includes a light source part and an image pickup part which are arranged at a separation position away from an attachment portion in the outer wall of the chamber. Thus, the light source part and the image pickup part become less susceptible to an effect of heat generated by the heater. In other words, it is possible to prevent the reduction in the observation accuracy due to an effect of temperature change.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
47.
VERTICAL BEAM STEERING WITH A MEMS PHASED-ARRAY FOR LIDAR APPLICATIONS
A light detection and ranging (LIDAR) system incorporates a scanning system with random access pointing. The scanning system has a light source that generates a coherent light, a micro-electro-mechanical system (MEMS) phased-array that steers the coherent light in a vertical direction, and a resonant scanner that scans the coherent light in a horizontal direction. The coherent light is projected onto a far field scene. The MEMS phased-array steers the coherent light to point the projected light on selected spots on the far field scene in random access fashion.
An illumination optical system is configured to convert an intensity distribution of incident light in a long axis direction from a Gaussian distribution, to thereby bring an intensity distribution of a shaped beam on a modulation surface of an optical modulator in the long axis direction into a top hat distribution, and to guide the incident light to the optical modulator as parallel light in the long axis direction and as convergent light in the short axis direction. A short axis side light shielding part is disposed at a condensing position on a short axis side of a modulated beam which is emitted from the optical modulator and is convergent light on a short axis side and blocks a non-zero-order diffracted beam on the short axis side of the modulated beam.
In a substrate processing apparatus and a substrate processing method for processing a substrate by a processing fluid in a supercritical state in a processing space in a chamber, a heater for heating inside of the chamber below the substrate is arranged in the chamber, the substrate is carried into the processing space and heating by the heater is performed, the process fluid is supplied into the processing space and discharged from the processing space after the processing space is filled with the processing fluid in the supercritical state. The heating is stopped for a predetermined period from a time of introducing the processing fluid in the supercritical state into the processing space. While keeping inside the chamber a temperature suitable for a super-critical process, a temperature change causing a turbulence can be suppressed and the super-critical process to the substrate can be performed properly.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
50.
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MACHINING TUBULAR GUARD
A substrate processing apparatus includes a rotational holding member that rotates a substrate around a predetermined rotational axis while holding the substrate, a liquid supply member that supplies a liquid to the substrate held by the rotational holding member, and a resin-made tubular guard that surrounds the substrate held by the rotational holding member. The tubular guard has an inner peripheral surface and an uneven portion disposed at the inner peripheral surface. The uneven portion has a plurality of recessed portions and a plurality of protruding portions placed between the recessed portions adjacent to each other. The recessed portion has a width smaller than a diameter of a liquid droplet scattering from the substrate held by the rotational holding member and a depth in which the liquid droplet does not come into contact with a bottom portion of the recessed portion in a state in which the liquid droplet is in contact with the protruding portions. The protruding portion has a width that is smaller than the diameter of the liquid droplet and that is smaller than the width of the recessed portion.
A substrate processing method etches a substrate. The substrate processing method includes an oxide layer forming step of oxidizing a surface layer portion of a major surface of the substrate and forming an oxide layer and an oxide layer removing step of forming a polymer film that contains an acid polymer on the major surface of the substrate and removing the oxide layer by the acid polymer contained in the polymer film. The oxide layer forming step and the oxide layer removing step are alternately repeated.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A substrate cleaning device includes a substrate holder that holds a substrate, a cleaning brush that is provided to be movable between a cleaning position for cleaning the substrate held by the substrate holder and a waiting position outward of the substrate held by the substrate holder, and has a cleaning surface capable of cleaning the substrate held by the substrate holder, a remover that is configured such that liquid is transferrable to the remover, and a driver that moves at least one of the cleaning brush and the remover with respect to another one such that at least part of liquid adhering to the cleaning surface is transferred to the remover when the cleaning surface and the remover come close to each other at a position outward of a position above the substrate held by the substrate holder, before the substrate is cleaned by the cleaning brush.
In a light shielding unit, an introductory reflection surface is positioned in the vicinity of a focus position of a first-order diffracted beam on an optical axis of a first-order diffracted beam and in the vicinity of a zero-order diffracted beam aperture. The introductory reflection surface reflects the first-order diffracted beam in a direction deviating from an incident direction of the first-order diffracted beam and going away from an optical axis of a zero-order diffracted beam. A light guide path has an introduction port to which light from the introductory reflection surface is incident and guides light introduced from the introduction port. A circumference of the light guide path is surrounded by a light shielding member. A light absorbing part absorbs light guided while being diffused by the light guide path.
B23K 26/064 - Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
B23K 26/34 - Laser welding for purposes other than joining
B33Y 30/00 - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - Details thereof or accessories therefor
B29C 64/268 - Arrangements for irradiation using electron beams [EB]
54.
CENTERING DEVICE AND SUBSTRATE PROCESSING APPARATUS
A centering device has three or more contact members each having a contact surface capable of contacting an end face of a substrate supported by a substrate support. These contact members are arranged to surround the substrate support in a horizontal plane with the contact surfaces facing an end face of the substrate. These contact members move toward the substrate in the mutually different directions to sandwich the substrate. Each contact surface is finished such that a contactable region formed to intersect the horizontal plane has a linear shape or a curved shape having a center of curvature located on the substrate side and having the radius of curvature larger than the radius of the substrate and is longer than an arc formed by cutting out the circumference of the substrate by the cut.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A waveform DB for holding a plurality of pieces of waveform data representing respective waveforms of a plurality of drive signals is provided. Each print job is associated with waveform data in a control unit and a waveform number for specifying the waveform data is transmitted from the control unit to a head control unit. The head control unit transfers the waveform number transmitted from the control unit to a head drive board for each print job. The head drive board extracts waveform data corresponding to the waveform number transferred from the head control unit from the waveform DB and gives a drive signal with a waveform corresponding to the extracted waveform data to an inkjet head, for each print job.
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
56.
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method includes an oxidation step of heating a plurality of substrates inside an oxidation space while supplying an oxygen gas or an ozone gas to the plurality of substrates to change surface layers of molybdenum films to molybdenum trioxide, a first transfer step of transferring the plurality of substrates inside the oxidation space to an etching space inside the substrate processing apparatus differing from the oxidation space, and an etching step of supplying an etching liquid to the plurality of substrates inside the etching space to make the surface layers that changed to the molybdenum trioxide dissolve in the etching liquid while leaving, on the substrate, portions other than the surface layers of the molybdenum films.
A substrate processing method includes a first oxidation step of heating a substrate at a first temperature by irradiation of light of a first intensity while supplying an oxygen gas or an ozone gas to the substrate, a first etching step of supplying an etching liquid to the substrate to make a surface layer of a molybdenum film that changed to molybdenum trioxide dissolve in the etching liquid, a second oxidation step of heating the substrate at a second temperature by irradiation of light of a second intensity while supplying the oxygen gas or the ozone gas to the substrate, and a second etching step of supplying the etching liquid to the substrate to make the surface layer of the molybdenum film that changed to the molybdenum trioxide dissolve in the etching liquid.
The invention is directed to a printing apparatus and a printing method for executing so-called back printing. A white image and an non-white image are printed to be superimposed on a transparent sheet-like printing medium. In the invention, at least one of the white ink amount constituting the white image and a non-white ink amount constituting the non-white image is adjusted according to the permeability information relating to the permeability. That is, the printed matter taking the permeability of the printing medium into account is obtained. As a result, an influence by the permeability of the printing medium is suppressed and a high-quality printed matter is obtained in sol-called back printing.
Disclosed is a substrate treating apparatus that performs treatment on a substrate. The apparatus includes a batch-type processing unit configured to perform treatment on a plurality of substrates, a single-wafer-type processing unit configured to perform treatment on one substrate of the substrates, a posture turning unit configured to turn a posture of the substrates, on which the treatment is performed by the batch-type processing unit, while the substrates get wet with deionized water, a first transport unit configured to transport the substrates, on which the treatment is performed by the batch-type processing unit, to the posture turning unit, a second transport unit configured to transport the substrates, turned to horizontal by the posture turning unit, with a hand to the single-wafer-type processing unit, and configured to transport the substrates, on which the treatment is performed by the single-wafer processing unit, with the hand, and a cleaning and drying unit configured to perform cleaning and drying treatment on the hand.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
When a printing interruption cause occurs during printing of an image on a printing medium, printing of a page being printed is completed, and further only a position mark is printed on a printing resumption page. Then, a printing unit is stopped, and a conveyance speed is decelerated to stop conveyance of the printing medium. Next, the printing medium is rewound so that printing is resumed from the printing resumption page. Thereafter, the conveyance speed is accelerated to a predetermined speed, and printing is resumed from the printing resumption page on which the position mark is printed.
Substrates are immersed in a treatment fluid stored in a treatment chamber, and subjected to a surface treatment. A first lid and a second lid cover an upper opening of the treatment chamber. The first lid and the second lid each include sloped surfaces. At least a part of the first lid and the second lid is immersed in the treatment fluid. During the treatment on the substrates, a plurality of bubble supply pipes eject bubbles into the treatment fluid. The sloped surfaces formed on the first lid and the second lid guide the bubbles reaching an interface between the treatment fluid, the first lid, and the second lid diagonally upward. Thus, the bubbles are smoothly released outside the treatment chamber. This can eliminate retention of the bubbles, avoid contacts between the bubbles and the substrates, and suppress a decrease in the treatment uniformity.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/04 - Cleaning involving contact with liquid
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
An upward laminar flow of a treatment fluid is formed inside a treatment chamber. Substrates are immersed in the treatment fluid. Eight bubble supply pipes are disposed inside the treatment chamber, and supply bubbles in the treatment fluid from below the substrates. Two innermost bubble supply pipes out of the eight bubble supply pipes are disposed inside a recess of a punching plate so that the two bubble supply pipes are lower than the other bubble supply pipes. Even when a lifter lowers the substrates to an immersion position, an extremity of a back plate is prevented from hitting the two bubble supply pipes. Furthermore, the eight bubble supply pipes including the two innermost bubble supply pipes can uniformly supply bubbles to the surface of the substrates.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
63.
DATA PROCESSING METHOD, DATA PROCESSING APPARATUS, AND RECORDING MEDIUM WITH DATA PROCESSING PROGRAM RECORDED THEREON
A data processing method includes a step of obtaining evaluated values of the time-series data by comparing the time-series data with reference data, a step of classifying the evaluated values into a plurality of levels, a step of displaying an evaluation result screen including a display area including a first graph showing an occurrence rate of each level of the evaluated values, the evaluation result screen including the display area with respect to each of the two or more processing units. A history screen displaying a history in which the evaluated values have been obtained and a trend screen including graphs showing temporal change in the evaluated values in addition to the evaluation result screen is hierarchically displayed. A mark is attached at a position corresponding to a processing result selected in the history screen in a graph in the trend screen.
The maintenance unit is configured to be movable in the X direction, and moves between the facing position La facing the ejection head and the separation position Lb away from the ejection head in the X direction. Provided is the imaging part configured to image the imaging range Ri provided on the side of the separation position Lb relative to the facing position La in the X direction and the imaging part images at least part of the maintenance unit which overlaps the imaging range Ri to acquire the unit image I2. In other words, the unit image I2 representing the condition of the maintenance unit can be acquired by the imaging part.
Provided is a flash heating part including a plurality of flash lamps on an upper side of a chamber housing a semiconductor wafer, and also provided is an auxiliary heating part including a plurality of VCSELs (vertical cavity surface emitting lasers) on a lower side thereof. After the semiconductor wafer is preheated by light irradiation from the VCSELs, a front surface of the semiconductor wafer is irradiated with a flash of light from the flash lamps to instantaneously increase a temperature of the surface thereof. The VCSELs can emit light having relatively higher intensity than the LEDs. Thus, when light irradiation from the plurality of VCSELs is performed, intensity of light emitted to the substrate can also be increased, and the semiconductor wafer can be efficiently heated.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A substrate processing method includes a substrate holding step of holding a substrate at a holding position surrounded by a cylindrical guard, a processing liquid supplying step of supplying a processed surface of the substrate with a processing liquid with which the processed surface of the substrate is processed while rotating the substrate held at the holding position about a rotation axis passing through a central portion of the substrate, an image acquiring step of acquiring an image of the processed surface of the substrate and an image of an inner wall surface of the guard while supplying the processing liquid to the processed surface of the substrate, and a detecting step of monitoring luminance values of the images obtained in the image acquiring step, and detecting a processing end time point at which processing of the processed surface of the substrate with the processing liquid is ended.
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
67.
SELF-ASSEMBLED MONOLAYER REMOVING LIQUID, AND SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS USING THE SAME
The present invention is a self-assembled monolayer removing liquid for selectively removing a self-assembled monolayer provided on a surface of a substrate, the removing liquid having a Hansen solubility parameter positioned in a first Hansen sphere of a material for forming the self-assembled monolayer and in a second Hansen sphere of the self-assembled monolayer, the first Hansen sphere being defined by a center value (δd1, δp1, δh1) [MPa1/2] and a sphere radius R1 [MPa1/2] in a Hansen solubility parameter space, the second Hansen sphere being defined by a center value (δd2, δp2, δh2) [MPa1/2] and a sphere radius R2 [MPa1/2] in the Hansen solubility parameter space.
Provided is a drawing apparatus capable of drawing with high accuracy on a surface having a shape whose height exceeds a focal depth without complicatedly adjusting focus of an optical system. A substrate can be placed on a stage. A drawing head includes a spatial light modulator that generates modulated light, and a projection optical system that focuses the modulated light on a focus position in a height direction over the stage. A mover relatively moves the stage and the drawing head in the horizontal direction. A controller controls the mover and the drawing head. The controller controls the spatial light modulator based on correction pattern data representing a correction pattern, and the correction pattern data is generated by correcting design pattern data representing a design pattern based on surface profile data representing a surface profile of the substrate.
Disclosed is a substrate treating apparatus that performs treatment on a substrate. The apparatus includes a batch-type processing unit configured to perform treatment on a plurality of substrates, a single-wafer-type processing unit configured to perform treatment on one substrate of the substrates, a posture turning unit configured to turn a posture of the substrates on which the treatment is performed by the batch-type processing unit to horizontal, a first transport unit configured to transport the substrates from the batch-type processing unit to the posture turning unit, a second transport unit configured to transport the substrates, turned to horizontal by the posture turning unit, to the single-wafer-type processing unit, and an immersion tank in which the substrates are immersed in deionized water before the posture is turned by the posture turning unit.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
70.
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
It is an object of the present invention to reduce the amount of data used in an apparatus, a system, and a method for performing a substrate processing. In order to achieve this object, a substrate processing apparatus includes one or more processing units each for performing a processing on a substrate and one or more arithmetic processing parts. One or more arithmetic processing parts generate a flow recipe defining a flow of a series of processings for a substrate by combining two or more processing recipes among a plurality of processing recipes each defining a processing condition relating to a processing to be performed on a substrate in the one or more processing units. The plurality of processing recipes include a plurality of liquid processing recipes each defining a condition of a processing to be performed on a substrate by using a processing liquid.
G05B 19/418 - Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control (DNC), flexible manufacturing systems (FMS), integrated manufacturing systems (IMS), computer integrated manufacturing (CIM)
A threshold determination method includes a region specification step of specifying cell regions corresponding to individual cells in an image obtained by imaging the biological specimen, a determination step of setting temporarily a threshold for staining density quantitatively indicating the degree of staining of the cell region, comparing the staining density and the threshold for each of the cell regions and determining whether a stained state is positive or negative for staining, a receiving step of displaying a determination result of the stained state of each of the cell regions and receiving an operation input of a user to change the determination result for each cell region, and a resetting step of resetting the threshold in accordance with the determination result after change. It is possible to optimize effectively a threshold used in determining a stained state from an image of an immunohistostained specimen while human judgment is made.
The inkjet printing apparatus is configured to be able to execute a batch adjustment process of performing a plurality of times of adjustment processes related to printing in succession based on one instruction from an outside. The conveyance control unit maintains the conveyance speed at a first speed in a period when a chart printing process is performed and a period when a chart imaging process is performed. The conveyance control unit decreases the conveyance speed from the first speed to the second speed after the end of the chart imaging process in an adjustment process except for an adjustment process that is performed last in the batch adjustment process, and increases the conveyance speed from the second speed to the first speed before the start of the chart printing process in an adjustment process that is performed next.
An inspecting apparatus for inspecting print images printed on a transparent printing medium. The apparatus includes a first transport roller for transporting the transparent printing medium; a second transport roller spaced from the first transport roller, and disposed downstream in a transport direction, for transporting the transparent printing medium; a photographing device for photographing the print images located in an inspection area; and a light emitting device for emitting light for photographing the print images located in the inspection area. The first transport roller and second transport roller have outer circumferential surfaces thereof each with a light absorbing member for absorbing the light from the light emitting device.
A substrate processing method includes: a first step of causing, in a state of a substrate holding mechanism not holding a plurality of substrates, a camera to capture an image of the substrate holding mechanism and an image of an interior to generate first image data; a second step of identifying, in a first region indicated by the first image data, a second region being a region in which at least the image of the substrate holding mechanism has been captured; and a third step of comparing a gradient of the first image data distributed in a third region being a region in the first region other than the second region with a threshold for the gradient.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
The present invention includes a head holder configured to collectively holding a plurality of discharge heads and a collective head mover configured to move the head holder between a printing space above the printing medium being conveyed in the conveying direction and a retraction space separated from the printing space. Therefore, is provided a printing technique capable of printing a high-quality image at low cost by discharging inks from a plurality of discharge heads arranged adjacent to each other in a direction parallel to a conveying direction of a printing medium while reciprocally moving the respective discharge heads between a printing space and a retraction space.
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
76.
SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
A substrate treating apparatus includes a process tank for storing a treatment liquid, a chamber for surrounding the process tank, a solvent vapor nozzle for supplying solvent vapor into the chamber, a cleaning liquid nozzle for supplying a cleaning liquid, and a controller. The controller causes immersion treatment, where a substrate is immersed in the treatment liquid stored in the process tank, to be performed for a preset period of time, and causes dry treatment, where the substrate processed with the treatment liquid and taken out of the process tank is dried with the solvent vapor supplied from the solvent vapor nozzle, to be performed. The controller causes the cleaning liquid nozzle to supply the cleaning liquid into the chamber and causes the process tank to be immersed in the cleaning liquid stored in the chamber, whereby the chamber cleaning treatment, where the chamber including an outer wall of the process tank is cleaned, is performed.
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
77.
WIRING DATA GENERATION APPARATUS, DRAWING SYSTEM, AND WIRING DATA GENERATION METHOD
A design wiring data acquisition unit acquires design wiring data indicating design wiring for connecting element electrodes at design positions on a substrate and connection destination electrodes to each other. A partial wiring data generation unit generates partial wiring data indicating partial wiring obtained by deleting peripheral portions of the design positions of the element electrodes in the design wiring. An actual position data acquisition unit acquires actual position data indicating actual positions of the element electrodes on the substrate. A corrected wiring data generation unit generates corrected wiring data indicating corrected wiring that connects the partial wiring and the element electrodes at the actual positions to each other.
In a semantic representation generation method, syntax data is generated by a superficial analysis on text data described in a natural language. A concept tag is provided to each morpheme based on the syntax data with reference to a CT system table in which concept information hierarchically and ambiguously representing a meaning of the morpheme for a part of speech. Provided is a first semantic tag indicating semantic information representing a semantic relation between a first phrase/sequence of phrases and a second phrase/sequence of phrases to a first pair made up of the first phrase/sequence of phrases corresponding to a predicate and the second phrase/sequence of phrases having a modification relation with the predicate based on the syntax data. Semantic representation data is generated based on the concept tag provided to each morpheme and the first semantic tag provided to the first pair.
In an image acquisition apparatus, acquired are picked-up images 71 representing divided regions, respectively, which are obtained by dividing a predetermined region on a target object, and in the picked-up images 71, each image pair 72 representing adjacent divided regions has an overlapping region 73. The amount of relative positional deviation in each image pair 72 is specified by generating a similarity map 74 indicating a distribution of the degree of similarity. Combination positions of the picked-up images 71 are determined on the basis of the amounts of positional deviation in image pairs 72 included in the picked-up images 71 while it is assumed that an image pair 72 whose similarity map 74 has a directivity is a specific image pair 72 and a weight of the specific image pair 72 is set to be lower than those of other image pairs 72.
An edge radiation thermometer performs measurements before a semiconductor wafer is transported into a chamber. The edge radiation thermometer performs the measurements while the semiconductor wafer is supported by lift pins and while the semiconductor wafer is placed on a susceptor, after the semiconductor wafer is transported into the chamber. A controller calculates a reflectivity of the semiconductor wafer based on these measurement values. Then, the controller calculates an intensity of an ambient light receive by the edge radiation thermometer, based on the reflectivity and an intensity of synchrotron radiation radiated from a quartz window. Subsequently, the controller subtracts the intensity of the ambient light from an intensity of light received by of the edge radiation thermometer during heat treatment on the semiconductor wafer to calculate the temperature of the semiconductor wafer.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
An objective lens unit includes an objective lens, a first rotary member, a second rotary member, and a drive section. The objective lens is provided with a correction ring. The first rotary member is mounted on the objective lens. The second rotary member engages with the first rotary member. The first rotary member has a first engagement portion. The second rotary member has a second engagement portion that is to engage with the first engagement portion. The second engagement portion is disposed at a part in the circumferential direction of the second rotary member. The second rotary member rotates to be positioned at an engagement position or a retraction position. The engagement position is a position where the second engagement portion engages with the first engagement portion. The retraction position is a position where the second engagement portion retracts from the first engagement portion.
According to the present invention, a substrate W is provided with a recess 95. The width of the recess 95 is smaller than the depth of the recess 95. An etching target which is at least one of a single crystal of silicon, a polysilicon and an amorphous silicon is exposed in at least a part of the upper part of a lateral surface 95s and in at least a part of the lower part of the lateral surface 95s. The etching target is etched by supplying an alkaline first etching liquid, in which an inert gas is dissolved, to the substrate W. The etching target is etched by supplying an alkaline second etching liquid, in which a dissolution gas is dissolved, and which has a dissolved oxygen concentration higher than that of the first etching liquid, to the substrate W before or after the first etching liquid is supplied to the substrate W.
C09K 13/00 - Etching, surface-brightening or pickling compositions
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
83.
PRINTING APPARATUS AND INK DISCHARGE HEAD MAINTENANCE METHOD
The seal member can be held in close contact with the head unit by being elastically deformed according to the shape of the head unit including the head (seal close contact operation). Accordingly, the drying of the nozzles can be prevented by isolating the nozzles inside the seal members from the atmosphere outside the seal members. Further, the cap can be brought into contact with the head unit while the seal member is separated from the head unit (cap contact operation). In this cap contact operation, the cap in contact with the head unit allow air flows between the outside and inside of the cap. At the time of purging, the cap contact operation is performed, whereby the cap is caused to face the nozzles and the ink flowing out from the nozzles is received by the cap.
In a substrate processing apparatus according to the invention, a light source and an imager are arranged at a position distant from an object to be imaged such as a substrate, whereas a head unit is arranged at an imaging position. Diffused light is generated by diffusing and reflecting illumination light from the light source and illuminated a peripheral edge part of the object to be imaged. Further, reflected light from the peripheral edge part illuminated with the diffused light is guided to the imager, whereby the peripheral edge part is imaged by the imager.
A technique for making the amount of ink to be calculated appropriate in accordance with the amount of ink to be ejected from heads is provided. An inkjet printing apparatus includes a supply tank, a return tank, a first connecting pipe, a second connecting pipe, a head, a pressure-difference producer, an ejection-amount predictor, and a pressure controller. The first connecting pipe transfers ink in the supply tank to the return tank. The second connecting pipe returns ink in the return tank to the supply tank. The head is interposed in the first connecting pipe. The pressure-difference producer sends ink from the supply tank to the return tank through the first connecting pipe. The ejection-amount predictor predicts the amount of ink to be ejected at a time to come after the present time from the head. The pressure controller controls the amount of ink to be supplied from the supply tank to the head, by controlling the pressure-difference producer in accordance with the predicted amount of ink to be ejected.
An imaging device acquires images of a plate-like specimen container having a rectangular shape as seen in top view. The imaging device includes a table, a position reference member, and a holding mechanism. The position reference member includes a first extension and a second extension which intersect at right angles to each other. The holding mechanism includes a rotating plate extending horizontally in plate-like form, and a main body portion for pivoting the rotating plate forwardly in a circumferential direction by means of elastic force of a spring. The rotating plate includes a front wing portion, and a protruding portion protruding forwardly in the circumferential direction from the front wing portion. The specimen container is urged in a second direction to align along the first extension when the rotating plate is pivoted to bring the front wing portion into contact with the specimen container. The specimen container is urged in a first direction to align along the second extension when the protruding portion comes in contact with the specimen container. Thus, the specimen container is aligned and placed in a previously determined position in the imaging device.
G03B 17/48 - APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR - Details of cameras or camera bodies; Accessories therefor adapted for combination with other photographic or optical apparatus
A substrate processing apparatus includes a tower, a plurality of individual exhaust pipes, a collecting exhaust pipe, a switcher, an outside gas introducer, and a controller. The tower includes a plurality of processing parts aligned in a vertical direction. The switcher switches between connection and disconnection between each of the individual exhaust pipes and the collecting exhaust pipe. The outside gas introducer includes a flow passage introducing outside gas from outside to the collecting exhaust pipe. The controller controls the guide area of the outside gas introducer, based on individual guide areas corresponding to the plurality of processing parts and switching states of the switcher. The individual guide areas corresponding to the plurality of processing parts are set according to positions at which the plurality of processing parts are disposed.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
This invention includes a substrate holder provided rotatably about an axis of rotation extending in a vertical direction while sucking and holding a central part of a lower surface of a substrate, a rotating mechanism for outputting a rotational driving force for rotating the substrate holder, a processing mechanism for processing the substrate by supplying a processing liquid to the substrate held by the substrate holder, and a rotating cup provided rotatably about the axis of rotation while surrounding an outer periphery of the rotating substrate and configured to collect liquid droplets of the processing liquid scattered from the substrate. The rotating mechanism includes a power transmitter for transmitting a part of the rotational driving force as a cup driving force to the rotating cup, and simultaneously rotates the substrate holder and the rotating cup by the rotational driving force.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/02 - Cleaning by the force of jets or sprays
89.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The invention includes a gas supplier for discharging a gas into a space sandwiched between a substrate and a shielding plate by supplying the gas to a gas discharge nozzle provided in the shielding plate to form a flow of the gas from a central part toward a radially outer side of the substrate. This gas supplier is controlled such that a flow velocity of the gas into a discharge space at a peripheral edge part of the substrate becomes larger than zero.
B05B 13/02 - Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
B05B 1/00 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
B05B 12/02 - Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery
B05B 14/10 - Arrangements for collecting, re-using or eliminating excess spraying material the excess material being particulate
B05C 1/00 - Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
B05C 11/10 - Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
In the invention, a rotating cup includes a lower cup to be rotated about the axis of rotation by receiving a cup driving force applied from a rotating mechanism and an upper cup for collecting the liquid droplets scattered through the collection space while rotating about the axis of rotation integrally with the lower cup by being coupled to the lower cup. The upper cup includes a first coupling part allowing communication between the collection space and a discharge space by being located above the lower cup and forming a gap between the lower cup and the first coupling part, and an inclined part provided obliquely upward of a peripheral edge part of the substrate from the first coupling part and configured to collect the liquid droplets by an inclined surface facing the collection space.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
91.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus includes a first tank, a path including a first path, a first heater, a hydrogen peroxide supply path, and a controller. The first path allows sulfuric acid to be supplied therethrough from the first tank to a nozzle. The first heater heats a heating region of the first path. The controller controls ejecting sulfuric acid heated by the first heater and a hydrogen peroxide solution from the nozzle onto a substrate, the sulfuric acid and the hydrogen peroxide solution on the substrate having been mixed, and then ejecting sulfuric acid having a temperature lower than a temperature of the sulfuric acid heated by the first heater and the hydrogen peroxide solution from the nozzle onto the substrate, the sulfuric acid and the hydrogen peroxide solution on the substrate having been mixed.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A substrate processing apparatus delivers a gas between a lower surface of a substrate and a base surface of a base part to form an airflow flowing radially outward and to cause a pressure drop in a space between the substrate and the base part by the Bernoulli effect. The base surface includes a second surface sloping upward in a radially outward direction. A third surface slopes downward in a radially outward direction from the outer peripheral edge of the second surface. A fourth surface is an annular surface contiguous to the lower edge of the third surface. The fourth surface expands radially outward outside the outer peripheral edge of the substrate in the radial direction. Accordingly, it is possible to suppress adhesion of a processing liquid to the lower surface of the substrate and to improve the stability of holding the substrate.
A substrate processing apparatus includes a substrate holding unit which holds a substrate horizontally, a processing liquid supplying unit which has a processing liquid nozzle discharging a processing liquid and supplies the processing liquid to an upper surface of the substrate, and a moving unit which moves the processing liquid supplying unit between a process position at which the processing liquid nozzle faces the upper surface of the substrate and a retreat position at which the processing liquid nozzle retreats from positions at which the processing liquid nozzle faces the upper surface of the substrate, wherein the processing liquid supplying unit includes a first flow path which is formed in the processing liquid nozzle, the first flow path having one end part and the other end part that face acentralregion of the substrate and a peripheral region of the substrate, respectively, in a state where the processing liquid supplying unit is positioned at the process position, a second flow path which extends as turning back from the one end part and supplies the processing liquid to the one end part, and a plurality of discharge ports which are formed in the processing liquid nozzle, are arranged along a direction in which the first flow path extends, and discharge the processing liquid in the first flow path to the upper surface of the substrate.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
An abnormality detection device for detecting a treatment abnormality in a semiconductor wafer to be heat-treated in a heat treatment apparatus is provided. The abnormality detection device includes a lower radiation thermometer for measuring a temperature of the semiconductor wafer being heat-treated, a treatment information acquisition part (sensors) for acquiring a plurality of pieces of treatment information having a correlation with the temperature measured by the lower radiation thermometer, and a detection part for dividing heat treatment of the semiconductor wafer into a plurality of phases (heat treatment phases F1 to F7) to detect a treatment abnormality in the semiconductor wafer, based on a plurality of learning models created for the respective phases (heat treatment phases F1 to F7), based on the temperature and the treatment information.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/66 - Testing or measuring during manufacture or treatment
There is provided a technique capable of reducing the weight of a counterweight for a lens unit driven by a voice coil motor. An observation apparatus includes a main frame, the lens unit, an image-forming lens, a driving mechanism, and an urging mechanism. The driving mechanism moves the lens unit by means of the driving force of the voice coil motor. The urging mechanism includes a lever portion, the counterweight, and a wire. The lever portion is supported rotatably about a shaft axis extending in an X direction with respect to the frame. The counterweight applies a force to an effort position in the lever portion, the effort position being spaced apart from a fulcrum position supported by the main frame. The wire connects the lens unit to a load position in the lever portion, the load position being closer to the fulcrum position than the effort position.
A printing system includes a coating device, a printing device, and a controller. The coating device applies a processing liquid to a base material by bringing a coating roller with the processing liquid adhering thereto into contact with the transported base material. The printing device performs printing on a surface of the base material to which the processing liquid has been applied. The controller includes a contact-start-position identifier, an inappropriate-printing-area setter, and a print controller. The contact-start-position identifier identifies a contact start position of the base material in which the coating roller and the base material start to come in contact with each other. The inappropriate-printing-area setter sets, as the inappropriate printing area, an area of the base material that has a predetermined length in a transport direction from the contact start position. The print controller stops the printing device from performing printing on the inappropriate printing area.
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
B41M 5/00 - Duplicating or marking methods; Sheet materials for use therein
97.
Printing method, printing system, and non-transitory computer-readable recording medium recording print control program for scheduling of printing having an automatic switching function for roll paper
After the end of initial processing, such as a setting of a priority mode, a print schedule (a job execution schedule and a roll paper loading schedule) is created in consideration of the type, the remaining amount, and the like of roll paper loaded in each of a plurality of slots constituting an autochanger. Then, a possible loading time is obtained, which is a time at which roll paper can be loaded into a loading target slot that is a slot in which the roll paper is to be loaded during execution of continuous printing.
The anti-drop members 7l and 7r are provided to each of the air turn bars 6u and 6l, and the respective anti-drop peripheral surfaces 711 of the anti-drop members 7l and 7r adjoin the support peripheral surface 611 of each of the air turn bars 6u and 6l. In this configuration, on the occurrence of oblique traveling of the printing medium M, the printing medium M is deviated from the support peripheral surface 611 of each of the air turn bars 6u and 6l to the anti-drop peripheral surface 711 of the anti-drop member 7l or 7r. Specifically, the anti-drop peripheral surface 711 of each of the anti-drop members 7l and 7r allows the printing medium M to be supported while providing the clearance Δ from the front surface M1 of the printing medium M deviated by the oblique traveling.
Closing the replenishing solenoid valve V11 and opening the return solenoid valve V12 prohibits passage of the ink fed using the replenishing pump 951 through the replenishing solenoid valve V11 and allows this ink to pass through the return solenoid valve V12. In this way, the ink is circulated along the circulation path Cc2 (second circulation path) along which the ink is fed from the buffer tank 95a to the branch point J though the replenishing pipe 95b and then fed from the branch point J to the buffer tank 95a through the return pipe 961.
The invention includes an upper sealing member fixed near a ceiling wall of a processing chamber and a lower sealing member provided movably in a vertical direction below the upper sealing member. A sealed space is formed by moving down the lower sealing member to a lower limit position where an upper end part of the lower sealing member is aligned or partially overlapped with a lower end part of the upper sealing member in the vertical direction. On the other hand, a conveyance space for carrying the substrate to and from a substrate holder is formed by moving up the lower sealing member to a retracted position above the lower limit position.
B05B 13/02 - Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
B05B 1/00 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
B05B 1/24 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means incorporating means for heating the liquid or other fluent material, e.g. electrically
B05B 1/28 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for catching drips or collecting surplus liquid or other fluent material
B05B 12/02 - Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery
B05B 12/16 - Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
B05B 14/10 - Arrangements for collecting, re-using or eliminating excess spraying material the excess material being particulate
B05C 1/00 - Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
patents
