Abstract

A passivation layer solution composition is provided. A passivation layer solution composition according to an exemplary embodiment of the present invention includes an organic siloxane resin represented by Chemical Formula 1 below. In Chemical Formula 1, R is at least one substituent selected from a saturated hydrocarbon or an unsaturated hydrocarbon having from 1 to about 25 carbon atoms, and x and y may each independently be from 1 to about 200, and wherein each wavy line indicates a bond to an H atom or to an x siloxane unit or a y siloxane unit, or a bond to an x siloxane unit or a y siloxane unit of another siloxane chain comprising x siloxane units or y siloxane units or a combination thereof.

IPC Classes  ?

• H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
• G03F 7/075 - Silicon-containing compounds
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• C08L 83/04 - Polysiloxanes
• H01L 29/51 - Insulating materials associated therewith
• G02F 1/1362 - Active matrix addressed cells
• G03F 7/16 - Coating processes; Apparatus therefor
• G03F 7/20 - Exposure; Apparatus therefor
• C08G 77/16 - Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
• C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
• H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
• H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body

Abstract

Disclosed are a thermosetting composition including a liquid crystal oligomer, a bismaleimide-based compound, an epoxy compound, and a fluorinated polymer resin powder. A resin cured product, board, and storage medium each include the thermosetting composition.

IPC Classes  ?

• C09K 19/38 - Polymers, e.g. polyamides
• C09K 19/52 - Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives
• C09K 19/30 - Non-steroidal liquid crystal compounds containing at least two non-condensed rings containing saturated or unsaturated non-aromatic rings, e.g. cyclohexane rings
• C09K 19/32 - Non-steroidal liquid crystal compounds containing condensed ring systems, i.e. fused, bridged or spiro ring systems
• C09K 19/34 - Non-steroidal liquid crystal compounds containing at least one heterocyclic ring
• C09K 19/12 - Non-steroidal liquid crystal compounds containing at least two non-condensed rings containing at least two benzene rings at least two benzene rings directly linked, e.g. biphenyls
• C09K 19/20 - Non-steroidal liquid crystal compounds containing at least two non-condensed rings containing at least two benzene rings linked by a chain containing carbon and oxygen atoms as chain links, e.g. esters
• C09K 19/54 - Additives having no specific mesophase
• H05K 1/00 - Printed circuits
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor