- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 5/06 - Hermetically-sealed casings
Patent holdings for IPC class H05K 5/06
Total number of patents in this class: 2197
10-year publication summary
|
182
|
216
|
186
|
207
|
225
|
266
|
257
|
206
|
176
|
52
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 121351 |
104 |
| Robert Bosch GmbH | 40155 |
72 |
| Mitsubishi Electric Corporation | 41350 |
53 |
| Nitto Denko Corporation | 7593 |
48 |
| Kyocera Corporation | 12050 |
38 |
| Apple Inc. | 46044 |
35 |
| Sumitomo Wiring Systems, Ltd. | 8623 |
27 |
| Hitachi Astemo, Ltd. | 5008 |
24 |
| Siemens AG | 26304 |
22 |
| Continental Automotive GmbH | 5868 |
22 |
| Hitachi Automotive Systems, Ltd. | 4003 |
21 |
| Medtronic, Inc. | 10282 |
20 |
| Yazaki Corporation | 6239 |
20 |
| TreeFrog Developments, Inc. | 104 |
20 |
| Murata Manufacturing Co., Ltd. | 20375 |
19 |
| Eaton Intelligent Power Limited | 5818 |
19 |
| Huawei Technologies Co., Ltd. | 89984 |
18 |
| Sumitomo Electric Industries, Ltd. | 13428 |
17 |
| Denso Corporation | 23131 |
17 |
| TouchTunes Music Company, LLC | 177 |
17 |
| Other owners | 1564 |