- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 5/06 - Hermetically-sealed casings
Patent holdings for IPC class H05K 5/06
Total number of patents in this class: 2359
10-year publication summary
|
216
|
186
|
208
|
225
|
267
|
255
|
213
|
183
|
193
|
128
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 135388 |
161 |
| Robert Bosch GmbH | 41362 |
74 |
| Nitto Denko Corporation | 7910 |
51 |
| Mitsubishi Electric Corporation | 44614 |
49 |
| Apple Inc. | 51108 |
36 |
| Kyocera Corporation | 13036 |
35 |
| Hitachi Astemo, Ltd. | 5835 |
35 |
| Sumitomo Wiring Systems, Ltd. | 9661 |
27 |
| Yazaki Corporation | 6340 |
23 |
| Siemens AG | 24715 |
22 |
| Medtronic, Inc. | 9934 |
22 |
| Huawei Technologies Co., Ltd. | 104236 |
22 |
| Continental Automotive GmbH | 5548 |
22 |
| Hitachi Automotive Systems, Ltd. | 3962 |
21 |
| TouchTunes Music Company, LLC | 191 |
21 |
| TreeFrog Developments, Inc. | 97 |
20 |
| Eaton Intelligent Power Limited | 6206 |
19 |
| Murata Manufacturing Co., Ltd. | 22976 |
18 |
| Sumitomo Electric Industries, Ltd. | 14484 |
16 |
| Denso Corporation | 23389 |
16 |
| Other owners | 1649 |