- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/24 - Contacts for co-operating by abutting resiliently mounted
Patent holdings for IPC class H01R 13/24
Total number of patents in this class: 2788
10-year publication summary
|
163
|
200
|
202
|
259
|
324
|
337
|
311
|
276
|
222
|
63
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Foxconn Interconnect Technology Limited | 988 |
82 |
| Lotes Co., Ltd. | 355 |
82 |
| Sumitomo Wiring Systems, Ltd. | 8623 |
64 |
| Japan Aviation Electronics Industry, Limited | 1519 |
59 |
| Molex, LLC | 1721 |
57 |
| Samsung Electronics Co., Ltd. | 121351 |
56 |
| Omron Corporation | 6702 |
50 |
| Sumitomo Electric Industries, Ltd. | 13428 |
46 |
| Apple Inc. | 46044 |
45 |
| AutoNetworks Technologies, Ltd. | 5285 |
45 |
| Rosenberger Hochfrequenztechnik GmbH & Co. KG | 670 |
45 |
| TE Connectivity Solutions GmbH | 2418 |
41 |
| Intel Corporation | 46058 |
36 |
| Molex Incorporated | 774 |
36 |
| Yazaki Corporation | 6239 |
35 |
| Foxconn (Kunshan) Computer Connector Co., Ltd. | 244 |
31 |
| Tyco Electronics (shanghai) Co. Ltd. | 656 |
28 |
| Enplas Corporation | 945 |
28 |
| NHK Spring Co., Ltd. | 1578 |
27 |
| Yokowo Co., Ltd. | 392 |
27 |
| Other owners | 1868 |