- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/498 - Leads on insulating substrates
Patent holdings for IPC class H01L 23/498
Total number of patents in this class: 17243
10-year publication summary
1257
|
1503
|
1540
|
1601
|
1660
|
1633
|
1529
|
1569
|
1764
|
2177
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 40384 |
2349 |
Samsung Electronics Co., Ltd. | 137729 |
1364 |
Intel Corporation | 46145 |
1346 |
Advanced Semiconductor Engineering, Inc. | 1591 |
411 |
Qualcomm Incorporated | 80778 |
387 |
Micron Technology, Inc. | 25660 |
308 |
STATS ChipPAC Pte. Lte. | 1527 |
281 |
Infineon Technologies AG | 8119 |
274 |
Shinko Electric Industries Co., Ltd. | 1185 |
260 |
International Business Machines Corporation | 59849 |
244 |
Texas Instruments Incorporated | 19429 |
240 |
Invensas Corporation | 624 |
233 |
Murata Manufacturing Co., Ltd. | 23459 |
212 |
Fuji Electric Co., Ltd. | 4926 |
205 |
Siliconware Precision Industries Co., Ltd. | 535 |
199 |
Mediatek Inc. | 4814 |
198 |
Amkor Technology Singapore Holding Pte. Ltd | 372 |
190 |
Mitsubishi Electric Corporation | 44376 |
184 |
Renesas Electronics Corporation | 6167 |
176 |
Rohm Co., Ltd. | 6243 |
169 |
Other owners | 8013 |