- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
Patent holdings for IPC class H01L 23/36
Total number of patents in this class: 3181
10-year publication summary
|
237
|
259
|
305
|
241
|
300
|
335
|
291
|
240
|
246
|
43
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 41315 |
197 |
| Mitsubishi Materials Corporation | 2415 |
112 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 32800 |
100 |
| Fuji Electric Co., Ltd. | 4467 |
86 |
| Intel Corporation | 45850 |
78 |
| Kyocera Corporation | 12037 |
66 |
| Dexerials Corporation | 1703 |
65 |
| Rohm Co., Ltd. | 5074 |
61 |
| Samsung Electronics Co., Ltd. | 120977 |
59 |
| Denka Company Limited | 1799 |
54 |
| Denso Corporation | 23107 |
50 |
| Murata Manufacturing Co., Ltd. | 20312 |
48 |
| Hitachi Astemo, Ltd. | 4992 |
47 |
| International Business Machines Corporation | 63200 |
46 |
| Panasonic Intellectual Property Management Co., Ltd. | 26394 |
44 |
| Sumitomo Electric Industries, Ltd. | 13414 |
39 |
| Sumitomo Bakelite Co., Ltd. | 1384 |
34 |
| Hitachi Automotive Systems, Ltd. | 4003 |
33 |
| Shin-Etsu Chemical Co., Ltd. | 4826 |
32 |
| Micron Technology, Inc. | 24150 |
31 |
| Other owners | 1899 |