- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
Patent holdings for IPC class H01L 21/768
Total number of patents in this class: 23446
10-year publication summary
|
1514
|
2140
|
2219
|
2371
|
2536
|
2613
|
2722
|
2377
|
2288
|
2020
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 35480 |
5056 |
| International Business Machines Corporation | 61951 |
1297 |
| Samsung Electronics Co., Ltd. | 127539 |
1183 |
| Intel Corporation | 45797 |
907 |
| Applied Materials, Inc. | 16182 |
812 |
| Micron Technology, Inc. | 24512 |
783 |
| GLOBALFOUNDRIES U.S. Inc. | 6499 |
646 |
| Tokyo Electron Limited | 11324 |
617 |
| United Microelectronics Corp. | 3810 |
397 |
| SK Hynix Inc. | 10714 |
374 |
| Kioxia Corporation | 9619 |
359 |
| Changxin Memory Technologies, Inc. | 4121 |
333 |
| Sandisk Technologies LLC | 5724 |
326 |
| Nanya Technology Corporation | 1810 |
316 |
| Lam Research Corporation | 4670 |
304 |
| Sony Semiconductor Solutions Corporation | 8228 |
291 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1762 |
266 |
| Qualcomm Incorporated | 73546 |
213 |
| Infineon Technologies AG | 8373 |
208 |
| Yangtze Memory Technologies Co., Ltd. | 1839 |
204 |
| Other owners | 8554 |