- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
Patent holdings for IPC class H01L 21/288
Total number of patents in this class: 1488
10-year publication summary
|
84
|
123
|
203
|
171
|
156
|
153
|
110
|
87
|
64
|
72
|
| 2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 35480 |
107 |
| Tokyo Electron Limited | 11324 |
80 |
| Lam Research Corporation | 4670 |
80 |
| Applied Materials, Inc. | 16182 |
62 |
| International Business Machines Corporation | 61951 |
39 |
| Ebara Corporation | 1918 |
31 |
| Novellus Systems, Inc. | 584 |
29 |
| Mitsubishi Electric Corporation | 43174 |
28 |
| Alchimer | 54 |
27 |
| FUJIFILM Corporation | 26514 |
26 |
| Atotech Deutschland GmbH | 596 |
26 |
| Texas Instruments Incorporated | 19291 |
23 |
| Infineon Technologies AG | 8373 |
22 |
| Micron Technology, Inc. | 24512 |
21 |
| BASF SE | 19439 |
19 |
| Konica Minolta Holdings, Inc. | 1125 |
18 |
| Semiconductor Components Industries, L.L.C. | 5249 |
18 |
| Samsung Electronics Co., Ltd. | 127539 |
17 |
| MacDermid Enthone Inc. | 236 |
17 |
| Intel Corporation | 45797 |
16 |
| Other owners | 782 |