- All sections
- B - Performing operations; transporting
- B33Y - Additive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering
- B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
Patent holdings for IPC class B33Y 50/02
Total number of patents in this class: 6630
10-year publication summary
17
|
204
|
519
|
1040
|
1164
|
1124
|
1105
|
1126
|
911
|
179
|
2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Hewlett-Packard Development Company, L.P. | 29764 |
854 |
General Electric Company | 25471 |
277 |
Xerox Corporation | 6818 |
145 |
Seiko Epson Corporation | 19227 |
116 |
Continuous Composites Inc. | 209 |
99 |
The Boeing Company | 20376 |
93 |
EOS GmbH Electro Optical Systems | 376 |
88 |
Stratasys, Inc. | 514 |
85 |
Carbon, Inc. | 383 |
80 |
Concept Laser GmbH | 182 |
80 |
Applied Materials, Inc. | 15320 |
76 |
3D Systems, Inc. | 585 |
76 |
Stratasys Ltd. | 354 |
76 |
Desktop Metal, Inc. | 275 |
68 |
Arcam AB | 209 |
67 |
Kinpo Electronics, Inc. | 240 |
65 |
XYZprinting, Inc. | 251 |
65 |
Mimaki Engineering Co., Ltd. | 801 |
61 |
Velo3D, Inc. | 100 |
59 |
Siemens AG | 26307 |
58 |
Other owners | 4042 |