- All sections
- B - Performing operations; transporting
- B33Y - Additive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering
- B33Y 50/00 - Data acquisition or data processing for additive manufacturing
Patent holdings for IPC class B33Y 50/00
Total number of patents in this class: 2337
10-year publication summary
30
|
83
|
143
|
266
|
355
|
356
|
400
|
337
|
398
|
89
|
2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Hewlett-Packard Development Company, L.P. | 29764 |
254 |
General Electric Company | 25471 |
69 |
Align Technology, Inc. | 1584 |
29 |
Autodesk, Inc. | 1459 |
29 |
Technology Research Association for Future Additive Manufacturing | 125 |
28 |
Xerox Corporation | 6818 |
27 |
Siemens AG | 26307 |
25 |
3D Systems, Inc. | 585 |
25 |
Stratasys Ltd. | 354 |
25 |
Stratasys, Inc. | 514 |
22 |
The Boeing Company | 20376 |
21 |
Canon Inc. | 36837 |
21 |
Materialise N.V. | 262 |
20 |
Siemens Industry Software Inc. | 1543 |
20 |
FUJIFILM Business Innovation Corp. | 7548 |
18 |
Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | 2804 |
17 |
Kinpo Electronics, Inc. | 240 |
17 |
Mimaki Engineering Co., Ltd. | 801 |
17 |
XYZprinting, Inc. | 251 |
17 |
Concept Laser GmbH | 182 |
17 |
Other owners | 1619 |