- All sections
- B - Performing operations; transporting
- B22F - Working metallic powder; manufacture of articles from metallic powder; making metallic powder; apparatus or devices specially adapted for metallic powder
- B22F 1/05 - Metallic powder characterised by the size or surface area of the particles
Patent holdings for IPC class B22F 1/05
Total number of patents in this class: 138
10-year publication summary
0
|
0
|
0
|
2
|
0
|
7
|
13
|
28
|
66
|
18
|
2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Hewlett-Packard Development Company, L.P. | 29751 |
12 |
JFE Steel Corporation | 5470 |
6 |
Dowa Electronics Materials Co., Ltd. | 595 |
5 |
Seiko Epson Corporation | 19240 |
4 |
TDK Corporation | 6156 |
3 |
National Institute of Advanced Industrial Science and Technology | 3750 |
3 |
Betek GmbH & Co. KG | 118 |
3 |
Global Advanced Metals, USA, Inc. | 41 |
3 |
Taniobis GmbH | 70 |
3 |
Mitsubishi Heavy Industries, Ltd. | 7448 |
2 |
Murata Manufacturing Co., Ltd. | 20375 |
2 |
Arizona Board of Regents on behalf of Arizona State University | 1917 |
2 |
Board of Trustees of Michigan State University | 1094 |
2 |
Fukuda Metal Foil & Powder Co., Ltd. | 61 |
2 |
Höganäs AB | 350 |
2 |
JX Nippon Mining & Metals Corporation | 1631 |
2 |
SANYO Special Steel Co., Ltd. | 195 |
2 |
Toho Titanium Co., Ltd. | 240 |
2 |
VBN Components AB | 15 |
2 |
VDM Metals International GmbH | 88 |
2 |
Other owners | 74 |