|
H05K 1/00
|
Printed circuits |
|
H05K 1/02
|
Printed circuits - Details |
|
H05K 1/03
|
Use of materials for the substrate |
|
H05K 1/05
|
Insulated metal substrate |
|
H05K 1/09
|
Use of materials for the metallic pattern |
|
H05K 1/11
|
Printed elements for providing electric connections to or between printed circuits |
|
H05K 1/14
|
Structural association of two or more printed circuits |
|
H05K 1/16
|
Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor |
|
H05K 1/18
|
Printed circuits structurally associated with non-printed electric components |
|
H05K 3/00
|
Apparatus or processes for manufacturing printed circuits |
|
H05K 3/02
|
Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding |
|
H05K 3/04
|
Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching |
|
H05K 3/06
|
Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process |
|
H05K 3/07
|
Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically |
|
H05K 3/08
|
Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion |
|
H05K 3/10
|
Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern |
|
H05K 3/12
|
Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material |
|
H05K 3/14
|
Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material |
|
H05K 3/16
|
Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering |
|
H05K 3/18
|
Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material |
|
H05K 3/20
|
Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern |
|
H05K 3/22
|
Secondary treatment of printed circuits |
|
H05K 3/24
|
Reinforcing of the conductive pattern |
|
H05K 3/26
|
Cleaning or polishing of the conductive pattern |
|
H05K 3/28
|
Applying non-metallic protective coatings |
|
H05K 3/30
|
Assembling printed circuits with electric components, e.g. with resistor |
|
H05K 3/32
|
Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits |
|
H05K 3/34
|
Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering |
|
H05K 3/36
|
Assembling printed circuits with other printed circuits |
|
H05K 3/38
|
Improvement of the adhesion between the insulating substrate and the metal |
|
H05K 3/40
|
Forming printed elements for providing electric connections to or between printed circuits |
|
H05K 3/42
|
Plated through-holes |
|
H05K 3/44
|
Manufacturing insulated metal core circuits |
|
H05K 3/46
|
Manufacturing multi-layer circuits |
|
H05K 5/00
|
Casings, cabinets or drawers for electric apparatus |
|
H05K 5/02
|
Casings, cabinets or drawers for electric apparatus - Details |
|
H05K 5/03
|
Covers |
|
H05K 5/04
|
Metal casings |
|
H05K 5/06
|
Hermetically-sealed casings |
|
H05K 7/00
|
Constructional details common to different types of electric apparatus |
|
H05K 7/02
|
Arrangements of circuit components or wiring on supporting structure |
|
H05K 7/04
|
Arrangements of circuit components or wiring on supporting structure on conductive chassis |
|
H05K 7/06
|
Arrangements of circuit components or wiring on supporting structure on insulating boards |
|
H05K 7/08
|
Arrangements of circuit components or wiring on supporting structure on insulating boards on perforated boards |
|
H05K 7/10
|
Plug-in assemblages of components |
|
H05K 7/12
|
Resilient or clamping means for holding component to structure |
|
H05K 7/14
|
Mounting supporting structure in casing or on frame or rack |
|
H05K 7/16
|
Mounting supporting structure in casing or on frame or rack on hinges or pivots |
|
H05K 7/18
|
Construction of rack or frame |
|
H05K 7/20
|
Modifications to facilitate cooling, ventilating, or heating |
|
H05K 9/00
|
Screening of apparatus or components against electric or magnetic fields |
|
H05K 10/00
|
Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar stand-by unit |
|
H05K 11/00
|
Combinations of a radio or television receiver with apparatus having a different main function |
|
H05K 11/02
|
Combinations of a radio or television receiver with apparatus having a different main function with vehicles |
|
H05K 13/00
|
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components |
|
H05K 13/02
|
Feeding of components |
|
H05K 13/04
|
Mounting of components |
|
H05K 13/06
|
Wiring by machine |
|
H05K 13/08
|
Monitoring manufacture of assemblages |
