ELECTRONIC DEVICE HOUSING LAYERS
| Register | WIPO Patent |
|---|---|
| Application Number | US2021071061 |
| Publication Number | 2023/009165 |
| Status | In Force |
| Filing Date | 2021-07-30 |
| Publication Date | 2023-02-02 |
| Owner | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (USA) |
| Inventor |
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Abstract
In some examples, a housing for an electronic device includes a plurality of layers including an outer layer and an inner layer, where the outer layer and the inner layer are formed of an elastic material. The plurality of layers further include an intermediate layer between the inner layer and the outer layer, where the intermediate layer is formed of a rigid material.