Spatial Arrangements of Objects for Additive Manufacturing

Register USPTO Patent
Application Number 17757788
Status Pending
Filing Date 2020-01-16
First Publication Date 2023-01-26
Publication Date 2023-01-26
Owner Hewlett-Packard Development Company, L.P. (USA)
  • Gonzalez Martin, Serigo
  • Freire Garcia, Manuel
  • Fernandez Aymerich, Ismael


In an example, a method includes obtaining a compensation model characterising a relationship between a location of an object within a fabrication chamber of an additive manufacturing apparatus and a geometrical compensation to be applied to a model of said object, wherein different geometrical compensation values are associated with different locations. In some examples the method further includes determining a magnitude of a dimension parameter of each object of a set of objects to be generated in a build operation. The method may include determining a spatial arrangement of objects to be generated within the build volume, based on the magnitude of the dimension parameters and the geometrical compensation values for an intended location of object generation in the spatial arrangement.

IPC Classes  ?

  • B29C 64/393 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes